JP2007294632A - Inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely and stably obtain contact between an inspection terminal of an inspection substrate and an inspection electrode of a semiconductor wafer without increasing contact resistance between them, even when the arrangement number of inspection electrodes is increased in an inspection apparatus for collectively executing inspections at a wafer level. <P>SOLUTION: A wafer tray 11 is provided with a first passage 11b for allowing a fluid to flow into a recess 11a and a first valve 16 capable of opening/closing the first passage 11b. Air is allowed to flow into a closed space 40 comprising the recess 11a and a flexible sheet 12 on the wafer tray 11 through the first valve 16 and the first passage 11b, and the closed space 40 is turned to a pressurized state with pressure higher than atmospheric pressure, so that respective inspection electrodes of a plurality of semiconductor integrated circuit elements in a semiconductor wafer 50 are electrically connected to respective inspection terminals of the inspection substrate 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection apparatus that collectively inspects a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer in a wafer state.

  In recent years, electronic devices equipped with semiconductor integrated circuit devices (hereinafter referred to as “semiconductor devices”) have made remarkable progress in downsizing and cost reduction. Accordingly, there is a demand for downsizing and cost reduction of semiconductor devices. It is getting stronger.

  Usually, in a semiconductor device, a chip (semiconductor chip) on which a semiconductor element is formed and a lead frame are electrically connected by a bonding wire, and the connected semiconductor chip and the lead frame are sealed with resin or ceramics. Then, it is mounted on a printed circuit board. However, in recent years, due to the demand for downsizing of electronic devices, a method of directly mounting a semiconductor chip that has been cut out from a semiconductor wafer, a so-called bare chip, on a circuit board has been developed, and this new mounting method is supported. Therefore, it is desired to supply bare chips with guaranteed quality at a low price.

  In order to guarantee the quality of the bare chip, it is necessary to inspect a plurality of semiconductor elements formed on the semiconductor wafer such as burn-in at the wafer level. However, since it takes a lot of time to inspect a plurality of semiconductor elements formed on a semiconductor wafer one by one or several times many times, it is realistic in terms of time and cost. is not. Therefore, it is required to perform an inspection such as burn-in on all the semiconductor elements on the semiconductor wafer at the wafer level.

  In order to perform a batch inspection on a plurality of semiconductor elements at the wafer level of a semiconductor wafer, a power supply voltage and a signal are simultaneously applied to a plurality of inspection electrodes provided on the plurality of semiconductor elements formed on the semiconductor wafer. Thus, it is necessary to operate these semiconductor elements simultaneously. Therefore, it is necessary to prepare a very large number of inspection substrates having usually several thousand or more inspection terminals, and the conventional inspection substrate having a needle-type probe has a low price in terms of the number of pins. It is not possible to cope with this point.

  In view of this, an inspection substrate for use in a wafer batch inspection apparatus has been proposed in which a plurality of inspection terminals formed of bumps can be simultaneously contacted with a plurality of inspection electrodes provided on a plurality of semiconductor elements on a semiconductor wafer. . As an example, a conventional wafer cassette capable of performing burn-in simultaneously in a wafer state will be described with reference to the drawings (for example, see Patent Document 1 and Non-Patent Document 1).

  Hereinafter, a conventional inspection substrate will be described with reference to a cross-sectional view of FIG. FIG. 6 shows a cross-sectional structure of a wafer batch inspection apparatus using a conventional inspection substrate.

  As shown in FIG. 6, a semiconductor wafer 112 in which a plurality of semiconductor elements are formed for each chip formation region is held on a wafer tray 111, and each main surface (upper surface) of the semiconductor wafer 112 is placed on each main surface (upper surface). A plurality of inspection electrodes (not shown) electrically connected to the semiconductor element are formed.

  An annular seal member 114 made of an elastic body having a lip cross section is provided at the peripheral edge of the upper surface of the wafer tray 111 so as to surround the wafer holding region. An annular decompression concave groove 115 is formed between the seal member 114 and the wafer holding region in the wafer tray 111. On one side of the wafer tray 111, a flow path opening / closing valve 116 for opening and closing the flow path with the pressure reducing concave groove 115 is provided. The flow path opening / closing valve 116 includes a pressure reducing means such as a vacuum pump (not shown). Is connected.

  The inspection substrate 120 is arranged to face the wafer tray 111 so as to sandwich the semiconductor wafer 112 held on the wafer tray 111. A plurality of inspection terminals (not shown) formed on the surface of the inspection substrate 120 facing the semiconductor wafer 112 are pressure-bonded to the corresponding inspection electrodes of the semiconductor wafer 112 to electrically connect each semiconductor element. The characteristics can be inspected collectively.

  Next, a method for crimping the inspection terminal of the inspection substrate 120 to the inspection electrode of the semiconductor wafer 112 will be described.

  First, the wafer tray 111 and the inspection substrate are held in the state where the element forming surface of the semiconductor wafer 112 is held on the wafer tray 111 and each inspection terminal of the inspection substrate 120 is opposed to each inspection electrode of the semiconductor wafer 112. 120 are brought close to each other to form a sealed space 117 including the wafer tray 111, the annular seal member 114, the inspection substrate 120, and the pressure-reducing concave groove 115.

Next, decompression means such as a vacuum pump connected to the flow path opening / closing valve 116 is driven to bring the sealed space 117 into a decompressed state. By reducing the pressure in the sealed space 117, a pressure difference is generated between the front surface side and the back surface side of the inspection substrate 120, and a force (atmospheric pressure) that presses the inspection substrate 120 against the wafer tray 111 is applied. Due to this pressing force, the cross-sectional shape of the annular seal member 114 is elastically deformed into an arcuate shape, so that the inspection substrate 120 and the wafer tray 111 come closer to each other, and the inspection terminal of the inspection substrate 120 and the semiconductor wafer 112 Contact with the inspection electrode.
Japanese Patent Laid-Open No. 7-231019 Nikkei Microdevice (July 1997, page 129)

  However, since the conventional inspection apparatus uses a depressurization method that uses atmospheric pressure as a force for pressing the semiconductor wafer 112 of the inspection substrate 120, the force for pressing above the atmospheric pressure (1 atm) is increased. Can not do it. For this reason, as the number of inspection electrodes arranged on the semiconductor wafer 112 increases, the force per one of the inspection terminals on the inspection substrate 120 that is crimped to the inspection electrode of the semiconductor wafer 112 decreases. As a result, there is a problem that the contact resistance between the inspection terminal of the inspection substrate 120 and the inspection electrode 113 of the semiconductor wafer 112 increases, and a stable contact cannot be obtained with both.

  The present invention solves the above-described conventional problems, and in an inspection apparatus that performs inspection at a wafer level, even if the number of inspection electrodes increases, the inspection terminals of the inspection substrate and the inspection electrodes of the semiconductor wafer An object is to obtain a reliable and stable contact without increasing the contact resistance.

  In order to achieve the above-described object, the present invention can generate a pressing force of 1 atm or more by using an inspection apparatus with a positive pressure in a sealed space formed below the wafer holding region in the wafer tray. The configuration is as follows.

  Specifically, an inspection apparatus according to the present invention is formed on a main surface of a semiconductor wafer and applies a voltage to each electrode of a plurality of semiconductor integrated circuit elements each having an electrode, thereby A wafer holding sheet made of a stretchable sheet material for holding a surface opposite to the main surface of a semiconductor wafer, and a wafer holding sheet, intended for an inspection apparatus for collectively inspecting the electrical characteristics of a semiconductor wafer at a wafer level A wafer tray having a recess formed on the lower side of the holding area of the semiconductor wafer in the wafer holding sheet and a main surface of the semiconductor wafer held on the wafer holding sheet, and a plurality of semiconductor integrated An inspection substrate having bump terminals at positions corresponding to the respective electrodes of the circuit element, a rigid substrate that holds a surface of the inspection substrate opposite to the bump terminals, and a wafer A crimping means for crimping the main surface of the semiconductor wafer and the substrate for inspection by crimping the lay and the rigid substrate is provided, and the wafer tray has a first flow path for circulating fluid in the recess, and the first And a first valve that can open and close the first flow path, and fluid is passed through the first valve and the first flow path into the first sealed space formed by the recess of the wafer tray and the wafer holding sheet. By flowing in, the first sealed space is brought into a pressurized state higher than atmospheric pressure, so that each electrode of a plurality of semiconductor integrated circuit elements in the semiconductor wafer and each bump terminal of the inspection substrate are electrically connected. It is characterized by being.

  According to the inspection apparatus of the present invention, there is provided a wafer holding sheet having elasticity, and a wafer tray that holds the wafer holding sheet at a peripheral portion and has a recess formed below the holding area of the semiconductor wafer. Therefore, by setting the first sealed space composed of the concave portion and the wafer holding sheet to a positive pressure, each electrode of the plurality of semiconductor integrated circuit elements and each bump terminal of the inspection substrate in the semiconductor wafer are set to 1 atm or more. Can be crimped with force. As a result, even if the number of inspection electrodes provided on the semiconductor wafer increases, the contact resistance between the electrodes of the semiconductor wafer and the bump terminals of the inspection substrate does not increase, and a stable contact can be obtained. It is possible to realize an inspection device with high performance.

  In the inspection apparatus according to the present invention, it is preferable that the crimping means is a holding fitting for holding both side portions of the wafer tray and the rigid substrate.

  The inspection apparatus according to the present invention includes a first seal ring between the wafer tray and the rigid substrate, surrounding the concave portion of the wafer tray, and a second seal ring surrounding the first seal ring with a space therebetween. A seal ring, the wafer tray having a second flow path for allowing fluid to flow through the second sealed space including the wafer tray, the rigid substrate, the first seal ring, and the second seal ring; And a second valve that can open and close the flow path, and the pressure-bonding means is in a reduced pressure state in which the fluid is discharged from the second sealed space through the second flow path and the second valve. A certain second sealed space is preferable.

  In this case, the product of the area of the region sandwiched between the annular first seal ring and the second seal ring and the absolute value of the reduced pressure value is the product of the opening area of the recess of the wafer tray and the positive pressure value. Is also preferably large.

  In this way, the second sealed space in a decompressed state functions reliably as a pressure bonding means between the semiconductor wafer and the inspection substrate.

  The inspection apparatus of the present invention further includes a seal member disposed between the wafer tray and the rigid substrate and around the recess of the wafer tray. The rigid substrate includes a wafer holding sheet, an inspection substrate, and a seal. A third flow path for allowing a fluid to flow through a third sealed space made of a member and a third valve that can open and close the third flow path are provided. It is preferable that the semiconductor wafer and the inspection substrate are pressed by discharging the fluid through the first flow path and the third valve and reducing the pressure in the third sealed space.

  As described above, since the third sealed space including the wafer holding sheet, the inspection substrate, and the sealing member is in a reduced pressure state, the semiconductor wafer and the inspection substrate are further pressed by the negative pressure (atmospheric pressure). A more stable contact can be obtained with respect to the electrode of the semiconductor wafer and the bump terminal of the inspection substrate.

  The inspection apparatus of the present invention further includes an annular rigid member that holds the wafer holding sheet, and the seal member is preferably provided on the rigid member.

  According to the inspection apparatus of the present invention, a positive pressure is applied to the sealed space formed below the wafer holding area in the wafer tray, so that the plurality of bump terminals (inspection terminals) of the inspection substrate and the semiconductor wafer are formed. In addition, since a plurality of electrodes can be pressure-bonded with a pressing force of 1 atm or more, a highly reliable inspection apparatus can be realized.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1A and FIG. 1B show a cross-sectional structure of an inspection apparatus according to the first embodiment of the present invention. As shown in FIGS. 1A and 1B, the inspection apparatus according to the first embodiment is made of, for example, a metal (alloy) and includes a wafer tray 11 having a recess 11a below the wafer holding region. A flexible sheet 12 that is a stretchable wafer holding sheet that is pasted on the upper surface of the wafer tray 11 so as to cover the recess 11a; and the upper side of the recess 11a of the wafer tray 11 in the flexible sheet 12; The inspection substrate 20 is pressure-bonded to face the element formation surface, and a rigid substrate 21 that holds the surface of the inspection substrate 20 opposite to the wafer tray 11.

  As shown in FIG. 1A, the wafer tray 11 is formed with a first flow path 11b leading from the recess 11a to the side surface, and the first flow path 11b has an opening at the first flow path 11b. A first valve 16 that opens and closes the flow path 11b is provided. In addition, holding metal grooves 11 c and 21 a are formed in the respective sides of the wafer tray 11 and the rigid substrate 21. As shown in FIG. 1B, when the inspection substrate 20 and the semiconductor wafer 50 are pressure-bonded, the holding metal fitting groove 11c is interposed with the sealing member 15 disposed on the peripheral edge of the wafer tray 11 interposed. 21a, the protrusion of the holding metal fitting 31 is fitted.

  FIG. 2 is an enlarged cross-sectional view of region A in FIG. 1B, and details of each component will be described with reference to FIG. As shown in FIG. 2, a plurality of inspection electrodes 51 electrically connected to the semiconductor elements are formed on the main surface (element forming surface) of the semiconductor wafer 50 held on the flexible sheet 12. .

  The inspection substrate 20 includes a wiring substrate 121, an anisotropic conductive elastic sheet 131, and a bumped sheet 141.

  The bumped sheet 141 is formed at a position where the peripheral portion is made of polyimide having a rigid portion held by a rigid ring (not shown) and facing each inspection electrode 51 of the semiconductor wafer 50 in the insulating film 142. A plurality of hemispherical bump terminals 144 connected to each inspection terminal 143 on the surface of the insulating film 142 facing the semiconductor wafer 50 and the bump terminals in the insulating film 142 A plurality of connection terminals 145 are formed on the surface opposite to 144 to be in contact with each inspection terminal 143 and electrically connected to each bump terminal 144.

  The wiring substrate 121 includes a substrate body 128 and substrate electrodes and wirings formed on the main surface of the substrate body 128. Specifically, on the main surface of the substrate body 128, a plurality of substrate electrodes 126 serving as the bases of the respective inspection terminals 143 are provided at positions corresponding to the respective connection terminals 145 formed on the bumped sheet 141. ing. Each substrate electrode 126 is electrically connected to a multilayer wiring composed of the upper layer wiring 124 and the lower layer wiring 122. A lower insulating film 123 is formed between the lower wiring 122 and the upper wiring 124, and an upper insulating film 125 is formed on the upper wiring 124.

  The anisotropic conductive elastic sheet 131 is made of an elastic member 132 such as silicon rubber, and is disposed between the wiring board 121 and the bumped sheet 141. A conductor 133 made of a plurality of conductive particles connected in a chain shape in the thickness direction of the anisotropic conductive elastic sheet 131 is embedded in a portion of the anisotropic conductive elastic sheet 131 facing the connection terminal 145 of the bumped sheet 141. The board electrode 126 of the wiring board 121 and the connection terminal 145 of the bumped sheet 141 are electrically connected by the conductor 133.

  Further, the anisotropic conductive elastic sheet 131 is formed with a protruding portion at a portion where the connection terminal 145 of the bumped sheet 141 is opposed to the bumped sheet 141, and a pressure is applied when the wiring board 121 and the bumped sheet 141 are brought close to each other. The bump terminal 144 of the bumped sheet 141 is pressed against the inspection electrode 51 of the semiconductor wafer 50 by the elastic force of the protruding portion. For this reason, even if a step portion exists on the upper surface of the semiconductor wafer 50 or warpage occurs, the inspection terminal 143 and the inspection electrode 51 can be reliably brought into contact over the entire upper surface of the semiconductor wafer 50. it can.

  In this manner, the inspection substrate 20 is bonded to the inspection electrode 51 of the corresponding semiconductor wafer 50 by the plurality of inspection terminals 143 formed on the surface facing the semiconductor wafer 50, whereby each of the semiconductor elements. The characteristics can be inspected collectively.

  Hereinafter, a method for crimping the inspection terminal 143 of the inspection substrate 20 to the inspection electrode 51 of the semiconductor wafer 50 will be described.

  First, as shown in FIG. 1A, a semiconductor wafer 50 to be inspected is held on a flexible sheet 12 having elasticity that is affixed to the upper surface of the wafer tray 11, and each inspection terminal of the inspection substrate 20 is retained. Positioning is performed so that 143 faces each inspection electrode 51 of the semiconductor wafer 50. Thereafter, the wafer tray 11 and the inspection substrate 20 are sandwiched between the sealing members 15, and then the wafer tray 11 and the rigid substrate 21 are pressure-bonded to each other by the holding metal fitting 31.

  Next, as shown in FIG. 1B, for example, compressed air flows into the recess 11a provided below the wafer holding portion in the wafer tray 11 through the first valve 16 and the first flow path 11b. Thus, the sealed space 40 composed of the recess 11a of the wafer tray 11 and the flexible sheet 12 is set to a positive pressure (pressurized state). As a result, a force that is pressed against the inspection substrate 20 via the flexible sheet 12 is applied to the semiconductor wafer 50.

  Thereby, even if the number of inspection electrodes 51 provided on the semiconductor wafer 50 is increased, the semiconductor wafer 50 and the inspection substrate 20 can be pressure-bonded by a positive pressure of 1 atm or more. The plurality of inspection terminals 143 and the plurality of inspection electrodes 51 of the semiconductor wafer 50 can be reliably brought into contact with each other.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

  FIG. 3A and FIG. 3B show a cross-sectional structure of an inspection apparatus according to the second embodiment of the present invention. In FIG. 2, the same components as those shown in FIG.

  In the first embodiment, mechanical means using the seal member 15 and the holding metal fitting 31 are used as means for pressure-bonding the wafer tray 11 and the rigid substrate 21 held by the inspection substrate 20 to each other. In the embodiment, the atmospheric pressure (negative pressure) is used.

  As shown in FIG. 3A, the wafer tray 11 and the rigid substrate 21 according to the second embodiment have a large diameter, and the first seal is attached to the seal member disposed on the periphery of each other. A ring 15A and a second seal ring 15B disposed at a distance from the outside of the first seal ring 15A are used.

  The wafer tray 11 is provided with a second flow path 11d that circulates between the area between the first seal ring 15A and the second seal ring 15B on the upper surface thereof and the side surface of the wafer tray 11. A second valve 17 that opens and closes the second flow path 11d is provided at an opening outside the flow path 11d.

  In the second embodiment, since the holding fitting 31 is not used, the holding fitting grooves 11 c and 21 a are not provided on the side surfaces of the wafer tray 11 and the rigid substrate 21.

  Hereinafter, a method of crimping the inspection terminal of the inspection substrate 20 to the inspection electrode of the semiconductor wafer 50 will be described.

  First, as shown in FIG. 3A, a semiconductor wafer 50 to be inspected is held on a flexible sheet 12 having elasticity that is affixed to the upper surface of the wafer tray 11, and each inspection terminal of the inspection substrate 20 is retained. Are aligned so as to face each inspection electrode of the semiconductor wafer 50. Thereafter, the wafer tray 11 and the inspection substrate 20 are in a state of sandwiching the first seal ring 15A and the second seal ring.

  Next, the sealed space 41 including the wafer tray 11, the first seal ring 15A, the second seal ring 15B, and the rigid substrate 21 is exhausted through the second flow path 11d and the second valve 17, and the sealed space 41 is exhausted. Is brought into a reduced pressure state, whereby the wafer tray 11 and the rigid substrate 21 are pressure-bonded to each other.

  Thereafter, as shown in FIG. 3B, the first valve 16 and the first flow path are provided in the recess 11a provided on the lower side of the wafer holding portion in the wafer tray 11, as in the first embodiment. For example, by introducing compressed air through 11b, the sealed space 40 composed of the recess 11a of the wafer tray 11 and the flexible sheet 12 is set to a positive pressure (pressurized state). As a result, a force that is pressed against the inspection substrate 20 via the flexible sheet 12 is applied to the semiconductor wafer 50.

  Thereby, even if the number of inspection electrodes provided on the semiconductor wafer 50 is increased, the semiconductor wafer 50 and the inspection substrate 20 are pressure-bonded by a positive pressure of 1 atm or more, and a plurality of inspection substrates 20 are inspected. The terminal and the plurality of inspection electrodes of the semiconductor wafer 50 can be reliably brought into contact with each other.

  In the second embodiment, since the wafer tray 11 and the rigid substrate 21 are pressure-bonded by the atmospheric pressure, the wafer tray 11 and the rigid substrate 21 are separated by the positive pressure of the concave portion 11a provided in the wafer tray 11. It is necessary not to.

  Accordingly, the area S1 and the reduced pressure P1 (absolute value) of the region between the first seal ring 15A and the second seal ring 15B arranged at the peripheral edge of the wafer tray 11 are the opening of the recess 11a provided in the wafer tray 11. It is determined by the area S2 and the positive pressure P2, and needs to satisfy S1 × P1> S2 × P2. Thereby, the wafer tray 11 and the rigid substrate 21 can be reliably crimped | bonded.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

  4 (a) and 4 (b) show a cross-sectional structure of an inspection apparatus according to the third embodiment of the present invention. In FIG. 4, the same components as those shown in FIG.

  The inspection apparatus according to the third embodiment uses not only the positive pressure of the internal pressure of the recess 11a provided in the wafer tray 11 for the pressing force when the semiconductor wafer 50 is pressure-bonded to the inspection substrate 20, but also the semiconductor The negative pressure (atmospheric pressure) in the sealed space between the flexible sheet 12 holding the wafer 50 and the inspection substrate 20 is also used.

  As shown in FIG. 4A, the inspection substrate 20 and the rigid substrate 21 according to the third embodiment are composed of at least one tubular member that penetrates the inspection substrate 20 and the rigid substrate 21 in the front and back direction. A third flow path 21b is formed. A third valve 18 that opens and closes the third flow path 21b is provided in the opening on the upper surface of the third flow path 21b.

  The flexible sheet 12 is not directly fixed to the wafer tray 11 but is fixed inside a rigid ring 32 made of, for example, metal. A positive pressure portion seal member 15C is fixed to the lower surface of the rigid ring 32, and a pressure reducing portion seal member 15D is fixed to the upper surface thereof.

  A rigid ring support groove 11e having a depth enough to fill the positive pressure seal member 15C is formed in a portion of the wafer tray 11 facing the rigid ring 32.

  Hereinafter, a method of crimping the inspection terminal of the inspection substrate 20 to the inspection electrode of the semiconductor wafer 50 will be described.

  First, as shown in FIG. 4A, a semiconductor wafer 50 to be inspected is held on a flexible sheet 12 having elasticity that is held by a rigid ring 32, and each inspection terminal of the inspection substrate 20 is inspected. Positioning is performed so as to face each inspection electrode of the semiconductor wafer 50. Thereafter, the flexible sheet 12 and the inspection substrate 20 are brought into contact with each other, thereby forming a sealed space 42 including the decompression portion seal member 15D, the inspection substrate 20 and the flexible sheet 12.

  Next, the sealed space 42 is exhausted through the third flow path 21b and the third valve 41, and the sealed space 42 is brought into a decompressed state, whereby the flexible sheet 12 and the inspection substrate 20 are pressure-bonded to each other. As a result, the state shown in FIG.

  Next, alignment is performed so that the position of the semiconductor wafer 50 held on the flexible sheet 12 coincides with the concave portion 11a of the wafer tray 11, and then the wafer tray 11 and the flexible sheet 12 are brought into contact with each other to obtain rigidity. The ring 32 is fitted into the rigid ring support groove 11 e of the wafer tray 11. Thereafter, the wafer tray 11 and the rigid ring 32 and the side surfaces thereof are fixed by the holding metal 31. As a result, the wafer tray 11 provided with the concave portion 11 a on the lower side of the semiconductor wafer 50 held by the compliant sheet 12 is fixed to the flexible sheet 12 and the inspection substrate 20. Thereby, the sealed space 40 is formed between the concave portion 11a of the wafer tray 11 and the flexible sheet 12 by the positive pressure portion sealing member 15C.

  Thereafter, as shown in FIG. 5, for example, compressed air flows into the recess 11a provided in the wafer tray 11 through the first valve 16 and the first flow path 11b, as in the first embodiment. Thus, the sealed space 40 composed of the recess 11a of the wafer tray 11, the flexible sheet 12, and the positive pressure portion seal member 15C is set to a positive pressure (pressurized state). Thereby, a force that is pressed against the inspection substrate 20 via the flexible sheet 12 is further applied to the semiconductor wafer 50.

  As described above, in the third embodiment, the force for pressing the inspection substrate 20 and the semiconductor wafer 50 to each other is not only the force due to the positive pressure from the lower side of the flexible sheet 12 holding the semiconductor wafer 50. This is increased by making the sealed space 42 above the flexible sheet 12 a negative pressure.

  As a result, even if the number of inspection electrodes provided on the semiconductor wafer 50 increases, the semiconductor wafer 50 and the inspection substrate 20 are pressure-bonded by a positive pressure and a negative pressure of 1 atm or more, and the inspection substrate 20 The plurality of inspection terminals and the plurality of inspection electrodes of the semiconductor wafer 50 can be reliably brought into contact with each other.

  Accordingly, since stable electrical contact can be obtained without increasing the contact resistance between the inspection terminal of the inspection substrate 20 and the inspection electrode of the semiconductor wafer 50, a highly reliable inspection apparatus can be realized.

  In the third embodiment as well, atmospheric pressure may be used as a means for pressure bonding the wafer tray 11 and the rigid substrate 21, as in the second embodiment, instead of the holding metal fitting 31.

  The inspection apparatus according to the present invention has high reliability because it can press-bond a plurality of bump terminals (inspection terminals) of the inspection substrate and a plurality of electrodes formed on the semiconductor wafer with a pressing force of 1 atm or more. An inspection apparatus can be realized, and is useful for an inspection apparatus that collectively inspects a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer in a wafer state.

(A) And (b) shows the apparatus for an inspection which concerns on the 1st Embodiment of this invention, (a) is sectional drawing which shows the state before the crimping | bonding of a semiconductor wafer and a board | substrate for an inspection, (b) These are sectional drawings which show the state after crimping | compression-bonding. It is sectional drawing to which the area | region A of FIG.1 (b) was expanded. (A) And (b) shows the inspection apparatus which concerns on the 2nd Embodiment of this invention, (a) is sectional drawing which shows the state before the crimping | bonding of a semiconductor wafer and a board | substrate for an inspection, (b) These are sectional drawings which show the state after crimping | compression-bonding. (A) And (b) shows the apparatus for an inspection which concerns on the 3rd Embodiment of this invention, (a) is sectional drawing which shows the state before the crimping | bonding of a semiconductor wafer and a board | substrate for an inspection, (b) These are sectional drawings which show the state after crimping | compression-bonding. FIG. 9 is a cross-sectional view showing a state after pressure bonding between a rigid substrate (inspection substrate) and a wafer tray, which is an inspection device according to a third embodiment of the present invention. It is sectional drawing which shows the apparatus for an inspection which concerns on a prior art example.

Explanation of symbols

11 Wafer tray 11a Recess 11b 1st flow path 11c Holding metal groove 11d 2nd flow path 11e Rigid ring support groove 12 Flexible sheet (wafer holding sheet)
15 Seal member 15A First seal member 15B Second seal member 15C Positive pressure portion seal portion 15D Pressure reduction portion seal member 16 First valve 17 Second valve 18 Third valve 20 Inspection substrate 21 Rigid substrate 21a For holding bracket Groove 31 Holding bracket 32 Rigid ring (rigid member)
40 Sealed space 41 Sealed space 42 Sealed space 50 Semiconductor wafer 121 Wiring board 122 Lower layer wiring 123 Lower layer insulating film 124 Upper layer wiring 125 Upper layer insulating film 126 Substrate electrode 128 Substrate body 131 Anisotropic conductive elastic sheet 132 Elastic member 133 Conductor 141 With bump Sheet 142 Insulating film 143 Inspection terminal 144 Bump terminal 145 Connection terminal

Claims (6)

A voltage is applied to each electrode of a plurality of semiconductor integrated circuit elements formed on the main surface of the semiconductor wafer and each having an electrode, and the electrical characteristics of the plurality of semiconductor integrated circuit elements are collectively inspected at the wafer level. An inspection device for
A wafer holding sheet made of a sheet material having elasticity to hold the surface opposite to the main surface of the semiconductor wafer;
A wafer tray that holds the wafer holding sheet at a peripheral portion, and has a recess formed below the holding area of the semiconductor wafer in the wafer holding sheet;
An inspection substrate having a bump terminal at a position facing the main surface of the semiconductor wafer held on the wafer holding sheet and corresponding to the electrodes of the plurality of semiconductor integrated circuit elements;
A rigid substrate that holds a surface opposite to the bump terminal in the inspection substrate;
A crimping means for crimping the main surface of the semiconductor wafer and the substrate for inspection by crimping the wafer tray and the rigid substrate;
The wafer tray is provided with a first flow path for allowing a fluid to flow through the recess, and a first valve capable of opening and closing the first flow path,
A fluid flows into the first sealed space composed of the concave portion of the wafer tray and the wafer holding sheet via the first valve and the first flow path, and the first sealed space is lower than the atmospheric pressure. An inspection apparatus characterized in that the electrodes of the plurality of semiconductor integrated circuit elements on the semiconductor wafer and the bump terminals of the inspection substrate are electrically connected to each other by being in a high pressure state.   The inspection apparatus according to claim 1, wherein the pressure-bonding means is a holding bracket that holds both side portions of the wafer tray and the rigid substrate. A first seal ring between the wafer tray and the rigid substrate and surrounding the concave portion of the wafer tray; and a second seal ring surrounding the first seal ring with a space therebetween. ,
The wafer tray can be opened and closed with a second flow path for flowing a fluid through a second sealed space comprising the wafer tray, a rigid substrate, a first seal ring, and a second seal ring. And a second valve
The pressure-bonding means is the second sealed space in a reduced pressure state in which a fluid is discharged from the second sealed space through the second flow path and the second valve. The inspection apparatus according to 1.   The product of the area of the region sandwiched between the annular first seal ring and the second seal ring and the absolute value of the reduced pressure value is the product of the opening area of the recess of the wafer tray and the positive pressure value. The inspection apparatus according to claim 3, wherein A seal member disposed between the wafer tray and the rigid substrate and disposed around the concave portion of the wafer tray;
The rigid substrate includes a third flow path for allowing a fluid to flow through a third sealed space including the wafer holding sheet, the inspection substrate, and a seal member, and a third flow path capable of opening and closing the third flow path. And a valve,
The fluid is discharged from the third sealed space through the third flow path and the third valve, and the third sealed space is brought into a reduced pressure state, whereby the semiconductor wafer and the inspection substrate The inspection apparatus according to claim 1, wherein the inspection device is pressed. An annular rigid member for holding the wafer holding sheet;
The inspection apparatus according to claim 5, wherein the seal member is provided on the rigid member.

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