JP2007173131A - 微粒子分散液、およびそれを用いた導電パターン形成装置 - Google Patents
微粒子分散液、およびそれを用いた導電パターン形成装置 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
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- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/01—Tools for processing; Objects used during processing
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- H—ELECTRICITY
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- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】本発明では、上記目的を達成するために、導電性微粒子分散液中の導電性微粒子成分を大粒子径成分と小粒子径成分の2つの粒子径の異なる微粒子を用い、大粒子粒径(微粒子凝集体)R,小粒子粒径(微粒子)r,大粒子数N,小粒子数nとした時、R>rおよびn>3.84×(R/r)3×Nの関係式を満たすような二つの粒度分布ピークをもたせることを特徴とする。
【選択図】図1
Description
更に、大粒径成分1の粒子数をN、小粒径成分2の粒子数をnとした時、形成されるパターンの空隙が最小になる条件として関係式(数2)を満たす。
関係式(2)は、粒子成分をすべて球形と仮定した場合、大粒径成分1が最密充填される時に生じる空隙24%を、小粒径成分2が充填し、更に最密になるために必要となる時の小粒径成分2の粒子数nの条件を表すものである。
nm以下である。更に、200度以下の加熱により融着するためには、更に10nm以下であることが好ましい。更に、100nm以下の線幅の導電パターン形成を実現するには、5nm以下であることが好ましい。
10…帯電手段、12…露光手段、13…誘電性薄膜体、14…静電潜像、15…現像手段、16…基板、17…転写手段、18…導電粒子パターン、19…加熱手段、20…導電パターン、21…残留電荷消去手段、22…クリーニング手段。
Claims (8)
- 径の異なる微粒子を分散した微粒子分散液において、
粒度分布において大粒子径と小粒子径の2つのピークを有し、大粒子径をR、小粒子径をr、大粒子数をN、小粒子数をnとしたときに、R>r、及びn>3.84×(R/r)3×N の関係式を満たす微粒子混合物が液体中に分散していることを特徴とする微粒子分散液。 - 請求項1に記載の微粒子分散液において、該大粒子成分が該小粒子成分の凝集体である、または該大粒子成分の表面に該小粒子成分が付着することで層を成していることを特徴とする微粒子分散液。
- 請求項1および2記載の微粒子分散液において、該大粒子成分および小粒子成分が導電性を有する成分より成ることを特徴とする微粒子分散液。
- 請求項1から3に記載の微粒子分散液において、前記小粒子成分の粒系が100nm以下であることを特徴とする微粒子分散液。
- 請求項1および2記載の微粒子分散液において、前記小粒子成分は表面に分散剤層が形成されている構成であることを特徴とする微粒子分散液。
- 請求項1記載の微粒子分散液において、前記分散溶液が無極性の溶媒であることを特徴とする微粒子分散液。
- 誘電性薄膜体表面に静電パターンを形成する静電潜像形成手段と、前記静電潜像形成手段で形成した静電潜像を現像する現像手段と、前記誘電体薄膜上に現像された像を基板上に転写する転写手段と、基板上に転写された像を基板に定着する定着手段とを備えた導電パターン形成装置において、前記現像手段は現像液として大粒子径と小粒子径の2つのピークを有する導電性粒子を分散させた微粒子分散液を用いて現像することを特徴とする導電パターン形成装置。
- 請求項7記載の導電パターン形成装置において、前記現像手段が微粒子分散液中に超音波を照射する超音波照射手段を具備していることを特徴とする導電パターン形成装置。
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US11/529,263 US7608205B2 (en) | 2005-12-26 | 2006-09-29 | Decentralized solution of microscopic particles and circuit formation device |
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JP2013143216A (ja) * | 2012-01-10 | 2013-07-22 | Napura:Kk | 機能性材料、電子デバイス、電磁波吸収/遮蔽デバイス及びそれらの製造方法 |
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CN106841355B (zh) * | 2017-03-29 | 2023-09-01 | 贵州大学 | 一种用于检测多巴胺的PtNi纳米合金电化学传感器 |
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