JP2007123414A - 固体撮像素子 - Google Patents
固体撮像素子 Download PDFInfo
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- JP2007123414A JP2007123414A JP2005311358A JP2005311358A JP2007123414A JP 2007123414 A JP2007123414 A JP 2007123414A JP 2005311358 A JP2005311358 A JP 2005311358A JP 2005311358 A JP2005311358 A JP 2005311358A JP 2007123414 A JP2007123414 A JP 2007123414A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
- H04N25/671—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
- H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
- H04N25/69—SSIS comprising testing or correcting structures for circuits other than pixel cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
- H10F39/1532—Frame-interline transfer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
【解決手段】本発明の固体撮像素子は、フォトダイオード30を含む画素部を多数有する固体撮像素子であって、多数の画素部の一部が黒レベル検出用の画素部であり、黒レベル検出用の画素部は、多数の画素部が配置される領域内で点在するように配置されている。
【選択図】図2
Description
図1は、本発明の実施形態を説明するための固体撮像素子の平面模式図である。図2は、図1のA−A線断面模式図である。
図1,2に示す固体撮像素子は、n型のシリコン基板1表面部に光電変換素子であるフォトダイオード30が多数形成され、各フォトダイオード30で発生した信号電荷を列方向(図1中のY方向)に転送するための電荷転送部(図示せず)が、列方向に配設された複数のフォトダイオード30からなる複数のフォトダイオード列の間を蛇行して形成される。
2 pウェル層
3 電荷転送電極
5 開口部
6 遮光膜
7 絶縁膜
8 層内レンズ
9 平坦化層
10B,10G カラーフィルタ
11 マイクロレンズ
30 フォトダイオード
Claims (6)
- 光電変換素子を含む画素部を多数有する固体撮像素子であって、
前記多数の画素部の一部が黒レベル検出用の画素部であり、
前記黒レベル検出用の画素部は、前記多数の画素部が配置される領域内で点在するように配置されている固体撮像素子。 - 請求項1記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に入射する光を制限する開口部を含み、
前記黒レベル検出用の画素部は、前記開口部を塞いだものである固体撮像素子。 - 請求項2記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に光を集光するマイクロレンズを含み、
前記黒レベル検出用の画素部は、前記マイクロレンズを省略したものである固体撮像素子。 - 請求項2又は3記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に光を集光する層内レンズを含み、
前記黒レベル検出用の画素部は、前記層内レンズを省略したものである固体撮像素子。 - 請求項2〜4のいずれか記載の固体撮像素子であって、
前記黒レベル検出用の画素部は、前記塞がれた開口部の上方に周辺回路を構成する材料の膜を残したものである固体撮像素子。 - 請求項1〜5のいずれか記載の固体撮像素子であって、
前記黒レベル検出用の画素部は、前記光電変換素子から読み出されて転送された電荷に応じた信号を出力する出力アンプの近傍に相対的に多く配置される固体撮像素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005311358A JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
US11/585,822 US20070097227A1 (en) | 2005-10-26 | 2006-10-25 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005311358A JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007123414A true JP2007123414A (ja) | 2007-05-17 |
Family
ID=37995743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005311358A Abandoned JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070097227A1 (ja) |
JP (1) | JP2007123414A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009089219A (ja) * | 2007-10-02 | 2009-04-23 | Olympus Corp | 固体撮像素子及びそれを用いた固体撮像システム |
JP2009177402A (ja) * | 2008-01-23 | 2009-08-06 | Fujifilm Corp | 撮像装置及びその撮像画像信号補正方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7910961B2 (en) * | 2008-10-08 | 2011-03-22 | Omnivision Technologies, Inc. | Image sensor with low crosstalk and high red sensitivity |
JP6216713B2 (ja) | 2011-05-17 | 2017-10-18 | ピクシー・ライティング・インコーポレイテッド | フラットパネル照明システムおよび駆動回路 |
US9500328B2 (en) | 2013-04-17 | 2016-11-22 | Pixi Lighting, Inc. | Lighting assembly |
US9546781B2 (en) | 2013-04-17 | 2017-01-17 | Ever Venture Solutions, Inc. | Field-serviceable flat panel lighting device |
US9476552B2 (en) | 2013-04-17 | 2016-10-25 | Pixi Lighting, Inc. | LED light fixture and assembly method therefor |
US9557022B2 (en) | 2015-04-30 | 2017-01-31 | Ever Venture Solutions, Inc. | Non-round retrofit recessed LED lighting fixture |
KR102593949B1 (ko) | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434977A (ja) * | 1990-05-31 | 1992-02-05 | Sony Corp | 固体撮像素子 |
JPH06151802A (ja) * | 1992-11-13 | 1994-05-31 | Sony Corp | 固体撮像装置のアルミニウム系金属パターンの形成方法 |
JPH0787284A (ja) * | 1993-09-17 | 1995-03-31 | Fuji Xerox Co Ltd | 2次元イメ−ジセンサ及び画素信号の補間方法 |
JPH11126894A (ja) * | 1997-08-12 | 1999-05-11 | Hewlett Packard Co <Hp> | Cmosイメージセンサの暗電流補正方法 |
JP2004015712A (ja) * | 2002-06-11 | 2004-01-15 | Sony Corp | 固体撮像装置及びその固定パターン雑音除去方法 |
JP2004120723A (ja) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | イメージセンサ |
JP2004153677A (ja) * | 2002-10-31 | 2004-05-27 | Canon Inc | 撮像装置 |
JP2004222021A (ja) * | 2003-01-16 | 2004-08-05 | Nikon Corp | 撮像装置 |
JP2005012189A (ja) * | 2003-05-28 | 2005-01-13 | Canon Inc | 光電変換装置およびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6525769B1 (en) * | 1998-12-30 | 2003-02-25 | Intel Corporation | Method and apparatus to compensate for dark current in an imaging device |
US6888568B1 (en) * | 1999-08-19 | 2005-05-03 | Dialog Semiconductor Gmbh | Method and apparatus for controlling pixel sensor elements |
JP2002250860A (ja) * | 2001-02-26 | 2002-09-06 | Canon Inc | 撮像素子、撮像装置及び情報処理装置 |
JP4123415B2 (ja) * | 2002-05-20 | 2008-07-23 | ソニー株式会社 | 固体撮像装置 |
JP4018456B2 (ja) * | 2002-06-03 | 2007-12-05 | 富士フイルム株式会社 | 撮像装置 |
JP4782989B2 (ja) * | 2004-05-10 | 2011-09-28 | パナソニック株式会社 | 固体撮像装置 |
-
2005
- 2005-10-26 JP JP2005311358A patent/JP2007123414A/ja not_active Abandoned
-
2006
- 2006-10-25 US US11/585,822 patent/US20070097227A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434977A (ja) * | 1990-05-31 | 1992-02-05 | Sony Corp | 固体撮像素子 |
JPH06151802A (ja) * | 1992-11-13 | 1994-05-31 | Sony Corp | 固体撮像装置のアルミニウム系金属パターンの形成方法 |
JPH0787284A (ja) * | 1993-09-17 | 1995-03-31 | Fuji Xerox Co Ltd | 2次元イメ−ジセンサ及び画素信号の補間方法 |
JPH11126894A (ja) * | 1997-08-12 | 1999-05-11 | Hewlett Packard Co <Hp> | Cmosイメージセンサの暗電流補正方法 |
JP2004015712A (ja) * | 2002-06-11 | 2004-01-15 | Sony Corp | 固体撮像装置及びその固定パターン雑音除去方法 |
JP2004120723A (ja) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | イメージセンサ |
JP2004153677A (ja) * | 2002-10-31 | 2004-05-27 | Canon Inc | 撮像装置 |
JP2004222021A (ja) * | 2003-01-16 | 2004-08-05 | Nikon Corp | 撮像装置 |
JP2005012189A (ja) * | 2003-05-28 | 2005-01-13 | Canon Inc | 光電変換装置およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009089219A (ja) * | 2007-10-02 | 2009-04-23 | Olympus Corp | 固体撮像素子及びそれを用いた固体撮像システム |
US8610802B2 (en) | 2007-10-02 | 2013-12-17 | Olympus Corporation | Solid-state imaging device with noise extracing pixels in the effective pixel region and solid-state imaging system using the same |
JP2009177402A (ja) * | 2008-01-23 | 2009-08-06 | Fujifilm Corp | 撮像装置及びその撮像画像信号補正方法 |
US8269871B2 (en) | 2008-01-23 | 2012-09-18 | Fujifilm Corporation | Image pickup apparatus and method of correcting a picked-up image signal of the same |
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US20070097227A1 (en) | 2007-05-03 |
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