JP2007106002A - Method for molding minute shape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for molding a minute shape which can surely make the film thickness of a curable material constituting an under clad uniform. <P>SOLUTION: First, a plurality of positioning parts 2a having a prescribed height are set on a substrate 1. Next, a layer of the thermosetting material 4 is arranged on the substrate 1 to be thicker than the height of the positioning parts 2a. Next, a mold 5 in which the minute shape is formed in the undersurface is pushed from above to the thermosetting material 4 to contact the positioning parts 2a. In this state, the thermosetting material 4 is cured. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for forming a fine shape when manufacturing an optical waveguide substrate.

  The optical waveguide substrate is configured by forming a core having a refractive index higher than that of the clad in the clad. As a method of manufacturing this optical waveguide substrate, for example, the following method is known.

  First, a photo-curable material is applied on a substrate (for example, a silicon substrate) with a uniform thickness by spin coating or the like, and a die having a core shape (fine shape) is pressed thereon. By curing the curable material with heat or photocuring, an underclad having a concave portion having a core shape is formed. Next, the core is formed by filling the concave portion with a core material by spin coating or the like, and then the core is formed, and further, the photocurable material used for forming the under clad thereon is applied with a uniform thickness by spin coating or the like. Overclad is formed by curing.

  However, in the method of forming the underclad by pressing the mold as described above, the underclad film thickness cannot be made uniform unless the parallelism between the substrate and the mold is obtained. In order to make the film thickness uniform, it is necessary to manufacture a mold and a press machine with high accuracy and to position the mold with high accuracy, resulting in a high cost. Even if it is actually done so, it has been difficult to suppress the parallelism between the substrate and the mold to several μm or less due to the accumulated error of each part.

  The underclad formed in this way has poor thickness accuracy. For example, when an optical waveguide substrate is manufactured using a thinned underclad, light is absorbed by the silicon substrate as the substrate. , Propagation loss and polarization dependence are worsened. In addition, when using an underclad whose upper surface is inclined with respect to the lower surface, when connecting the optical waveguide substrate to the optical fiber, the core position on the in side and the out side will be different if the lower surface of the substrate is used as a reference. The core position detection takes time and becomes inefficient. For this reason, it is important to make the thickness of the under clad having the concave portion that becomes the core shape uniform.

Therefore, in Patent Document 1, by using a mold configured to be rotatable around an axis extending in parallel with the substrate, the pressure applied to the clad material (photocurable material) at the time of pressing is used. A method is described in which the parallelism of the mold with respect to is obtained, whereby the thickness of the underclad is made uniform.
JP 2005-178236 A

  However, in the above method, if the mold does not rotate for some reason, there is a possibility that the parallelism between the substrate and the mold may not be obtained. Therefore, an underclad having a uniform thickness is more reliably formed. It is hoped that.

  In view of such circumstances, an object of the present invention is to provide a method for forming a fine shape that can ensure uniform film thickness of a curable material constituting an underclad.

  In order to solve the above-mentioned problems, the fine shape molding method of the present invention is a fine shape molding method for manufacturing an optical waveguide substrate, and includes positioning with a plurality of positioning portions having a predetermined height on the substrate. A part generating step, a curable material arranging step of arranging a layer of a curable material on the substrate thicker than a height of the positioning part, and a mold having a fine shape on the lower surface, the curable material A mold abutting step for pressing against the positioning portion, and a curable material curing step for curing the curable material in a state where the mold is in contact with the positioning portion. It is characterized by.

  In order to easily form a positioning portion having a uniform height, in the positioning portion generation step, a photocurable material layer is arranged on the substrate with a uniform thickness, and then photolithography is performed to photocurve a predetermined portion. Preferably, the positioning portion is formed by curing the curable material and removing the other portion of the photocurable material.

  In order to further stabilize the film thickness accuracy of the curable material, it is preferable to perform spin coating to arrange the photocurable material layer on the substrate with a uniform thickness.

  In order to effectively suppress the tilting of the mold, a substantially circular substrate is used as the substrate, and in the positioning unit generation step, the positioning unit is at least 3 at a position concentrically arranged on the concentric circle with the substrate. It is preferable to provide a location.

  In order to ensure the smoothness of the upper surface of the positioning part, in the positioning part generating step, it is preferable that the positioning part is generated so as to have a hollow structure having a hollow center part in plan view.

  In order to align the mold with respect to the substrate with high accuracy, the mold is provided with a fitting portion that fits with the positioning portion. It is preferable that the mold is brought into contact with the positioning portion in a state where the fitting portion and the positioning portion are fitted.

  According to the present invention, since the plurality of positioning portions are provided on the substrate and the mold is brought into contact with the positioning portions, the parallelism between the substrate and the mold is maintained by the height of the positioning portion. The film thickness of the curable material can be made uniform uniformly.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  The fine shape molding method according to an embodiment of the present invention includes a positioning portion generation step, a curable material placement step, a mold contact step, and a curable material curing step. Hereinafter, these steps will be described in order.

1) Positioning Part Generation Step First, as shown in FIGS. 1A and 1B, a photocurable material 2 is applied to a substrate 1 and a layer of the photocurable material 2 is uniformly formed on the substrate 1 by spin coating. It arranges with the thickness of. Specifically, for example, 1500 μL of the photocurable material 2 is applied on the substrate 1, the substrate 1 is rotated at 800 rpm for 30 seconds by a spin coating method, and then heated at 100 ° C. for 3 minutes to obtain a uniform thickness (25 μm ) Layer. The thickness of this layer, the number of rotations during spin coating, and the heating conditions can be changed as appropriate.

  As shown in FIG. 2, the substrate 1 has a substantially circular shape in which an orientation flat is formed in a part of a circular shape, and is made of silicon, glass, quartz, metal, or the like. The photocurable material 2 is, for example, blended with a photocurable transparent resin having a methacryloxy group so that the photopolymerization initiator is 1 mass percent and propylene glycol monomethyl acetate is 20 mass percent as a solvent.

  As the photocurable transparent resin, in addition to those having a methacryloxy group, a photocurable resin having an unsaturated double bond such as a vinyl group or a styryl group, a photocurable resin having an epoxy group, or the like can be used. It is. However, in order to reduce these material shrinkage, it is preferable to use a resin having as little reactive group as possible. Further, as the photopolymerization initiator, for example, α-aminoalkylphenone-based one (IRGUACURE 369: manufactured by Ciba Specialty Chemicals) can be adopted, and is arbitrarily selected according to the material type and curing conditions. Is possible.

  Next, as shown in FIGS. 1C and 1D, photolithography is performed using a mask 3 to cure a predetermined portion of the photocurable material 2 and other portions of the photocurable material 2. A plurality of positioning portions 2a are formed by removing.

  Specifically, the mask 3 is a coating 3b provided with a base portion 3a made of a light-transmitting material and a light transmission portion 3c that covers the lower surface of the base portion 3a and transmits light at a predetermined position. It is made up of. Three light transmissive portions 3c are provided at positions arranged at equal intervals (120 ° intervals) on a circle slightly smaller than the outer periphery of the substrate 1, and each light transmissive portion 3c has an outer diameter of, for example, 10 mm. The ring has an inner diameter of 6 mm. When a 4-inch silicon substrate is used as the substrate 1 and the layer of the photocurable material 2 is disposed on the substrate 1 by spin coating, an area about 2 mm from the outer periphery of the substrate 1 depending on the material type and conditions. Since the thickness tends to be non-uniform, the diameter of the circumference is preferably set so that the positioning portion 2a is located in an area 5 mm or more inside from the outer circumference of the substrate 1. The thickness distribution of the photocurable material 2 in a region 5 mm or more from the outer periphery of the substrate 1 was within 0.2 μm as a result of measurement with a contact-type thickness measuring device.

Then, with the mask 3 and the substrate 1 aligned so that the center of the circumference coincides with the center of the substrate 1, the mask 3 is placed on the layer of the photocurable material 2 or a distance of several μm. The photocurable material 2 in a portion corresponding to the light transmitting portion 3c is cured by irradiating with ultraviolet rays having an intensity of 20 mW / cm ² for 1 minute. Thereafter, the uncured photocurable material 2 is removed with a developer such as methyl isobutyl ketone, and the remaining developer is volatilized by heating at 100 ° C. for 3 minutes. As a result, as shown in FIGS. 1D and 3, the three positioning portions having a hollow structure with a hollow center portion in a plan view at positions equidistantly arranged on the substrate 1 concentrically with the substrate 1. 2a can be provided. And the height of these positioning parts 2a is 25 micrometers, and is uniform.

  When the positioning portion 2a is formed of the photocurable material 2, the upper surface may not be flat due to concave deformation caused by material shrinkage during curing that appears prominently when the height or size of the positioning portion 2a is large. Since the positioning portion 2a has a hollow structure as described above, for example, the thickness of the positioning portion 2a can be reduced even if the appearance shape of the positioning portion 2a is large. The smoothness of the upper surface of can be ensured.

  Here, in order to further increase the curability of the positioning portion 2a, for example, a heating process such as heating at 200 ° C. for about 1 hour may be provided. Further, in order to improve the adhesion between the substrate 1 and the positioning portion 2a, a surface treatment with a silane coupling agent may be performed.

2) Curable Material Arrangement Step After that, as shown in FIGS. 4A and 4B, the thermosetting material 4 is applied to the substrate 1, and the layer of the thermosetting material 4 is formed on the substrate 1 by spin coating. In this case, it is arranged with a uniform thickness that is thicker than the height of the positioning portion 2a. Specifically, for example, 1500 μL of the thermosetting material 4 is applied on the substrate 1, and the substrate 1 is placed for 30 seconds at 600 rpm, which is lower than the rotation speed when the above-described layer of the photocurable material 2 is formed by spin coating. After rotating, heat at 100 ° C. for 3 minutes. By doing in this way, the layer of the uniform thickness thicker than the height of the positioning part 2a can be formed.

  The thermosetting material 4 is obtained, for example, by blending 1% by mass of a thermal polymerization initiator and 20% by mass of propylene glycol monomethyl acetate as a solvent in a photocurable transparent resin having a methacryloxy group.

  Here, although what changed the photoinitiator of the photocurable materials 2 into the thermopolymerization initiator among the photocurable materials 2 is used as the thermosetting material 4, you may use another material. In that case, it is necessary to grasp the relationship between the spin coating conditions and the thickness of the formed coating film in advance. Further, as the thermal polymerization initiator, for example, an organic peroxide (Perhexa TMH: manufactured by NOF Corporation) can be adopted, and can be arbitrarily selected according to the material type and curing conditions.

3) Mold contact process In the mold contact process, the mold 5 having a fine shape on the lower surface is thermally cured using a molding machine 6 as shown in FIGS. 5 (a) and 5 (b). It presses against the property material 4 from upper direction, and is made to contact | abut to the positioning part 2a. The molding machine 6 includes an upper die plate 6A and a lower die plate 6B, and the die 5 is held by a die holding block 61 that is connected to the upper die plate 6A.

  The mold 5 is a thin plate having a thickness of 300 μm, and the thickness accuracy is ± 1 μm. On the lower surface of the mold 5, a plurality of protrusions 5 a having a trapezoidal cross section (for example, an upper side of 6 μm, a lower side of 4.5 μm, and a height of 5 μm) are formed as fine shapes. The upper surface of the mold 5 is a smooth surface, and the mold fixing block 62 is joined to the upper surface.

  The mold fixing block 62 has a sufficient thickness (for example, about 10 mm). The lower surface of the mold fixing block 62 is a smooth surface having a flatness of 10 μm or less, and is joined to the upper surface of the mold 5 by magnetic force or vacuum suction. The mold fixing block 62 is connected to the mold 5. It is united.

  In this way, the lower surface of the mold 5 integrated with the mold fixing block 62 and having the protruding portion 5a is a smooth surface free from warpage and undulation, and therefore the thermosetting property after the mold 5 is pressed. The upper surface of the material 4 is also a smooth surface without warping or undulation. The integrated body of the mold 5 and the mold fixing block 62 is only supported by the mold holding block 61 from below at the periphery, and an elastic body is provided between the mold fixing block 62 and the upper die plate 6A. 63 is arranged.

  In order to bring the mold 5 into contact with the positioning portion 2a using the molding machine 6, first, the substrate 1 on which the layer of the thermosetting material 4 is disposed is placed on the lower die plate 6B. Next, when the upper die plate 6 </ b> A is lowered, first, the lower surface of the protrusion 5 a comes into contact with the upper surface of the thermosetting material 4. When the upper die plate 6 </ b> A is further lowered, the elastic body 63 compresses and deforms and presses the mold 5, so that the protrusion 5 a is moved to the thermosetting material 4 while the mold 5 is separated from the mold holding block 61. Pushed in. Further, by lowering the upper die plate 6A, the mold 5 is further pressed against the thermosetting material 4 and lowered until it comes into contact with all the positioning portions 2a, and the mold 5 is pressed by the amount of heat curing. The conductive material 4 protrudes from the outer periphery of the substrate 1.

  In this process, since air may be mixed between the mold 5 and the thermosetting material 4, a molding machine 6 is installed in the vacuum chamber, and the vacuum chamber is evacuated by a vacuum pump. If pressing is started in this state, air can be eliminated. In this case, the degree of vacuum may be about 0.1 mbar.

  As the elastic body 63, one that is displaced by 20 μm or more when a force of 10 N is applied is used. By using such an elastic body 63, since the force when the metal mold | die 5 contact | abuts to the positioning part 2a can be absorbed with the elastic body 63, the force which acts on both can be reduced.

  Further, even if the elastic body 63 is not provided, if the mass of the integrated body of the mold 5 and the mold fixing block 62 is increased, the mold 5 is pressed against the thermosetting material 4 by its own weight to the positioning portion 2a. It can be made to contact.

4) Curing material curing step With the heater 7 provided on each of the upper die plate 6A and the lower die plate 6B, with the die 5 kept in contact with the positioning portion 2a in the die contact step, for example, The die plates 6A and 6B are heated to 120 ° C., and the temperature is maintained for 10 minutes to cure the thermosetting material 4. Thereafter, by releasing the mold, as shown in FIG. 6, a molded product having a uniform film thickness of 25 μm and a flatness of 1 μm in which the fine shape has been transferred and the recesses 4a are formed can be obtained.

  Here, it is also possible to remove the mold 5 from the molding machine 6 together with the substrate 1 while the mold 5 is in contact with the positioning portion 2a, and to heat and cure it in another furnace.

  In FIG. 6, the recess 4 a has a straight shape, but the shape of the recess 4 a can be appropriately changed depending on the shape of the protrusion 5 a, for example, a branch that branches from one to eight The shape which comprises a path | route may be sufficient.

  As described above, in the fine shape molding method of the present embodiment, a plurality of positioning portions 2a having a uniform height are provided on the substrate 1, and the mold 5 is brought into contact with the positioning portions 2a. Since the parallelism between the substrate 1 and the mold 5 is maintained by the height of the positioning portion 2a, the film thickness of the thermosetting material 4 can be made uniform.

  For example, as shown in FIG. 7A, the film thickness of the thermosetting material 4 can be made uniform even when the parallelism between the substrate 1 and the mold 5 is not obtained. When the upper die plate 6A is lowered from the state shown in FIG. 7 (a), as shown in FIG. 7 (b), the portion located below the mold 5 first comes into contact with the positioning portion 2a. When the upper die plate 6A is further lowered, while the elastic body 63 is compressed and deformed, the mold 5 is rotated about the portion where the mold 5 is in contact with the positioning portion 2a, and comes into contact with all the positioning portions 2a. Thereby, the film thickness of the thermosetting material 4 can be made uniform.

  In addition, it is conceivable to provide a positioning part for regulating the height in the lower die plate 6B or the mold 5. However, in this case, wear and damage of the positioning part may occur due to repeated use. However, as in this embodiment, by providing the positioning portion 2a for each substrate 1, the positioning portion 2a is not worn or damaged by repeated use, and the reliability can be improved.

  In the present embodiment, since photolithography is performed on the layer of the photocurable material 2 arranged with a uniform thickness, the positioning portion 2a having a uniform height can be easily formed. Moreover, it can suppress that the metal mold | die 5 is damaged when the metal mold | die 5 contact | abuts by forming the positioning part 2a with an organic material.

  Furthermore, since the positioning part 2a with high accuracy can be formed by making the thickness of the layer of the photocurable material 2 uniform by spin coating, the accuracy of the film thickness of the thermosetting material 4 is further improved. It can be stabilized.

  Moreover, since the three positioning parts 2a are provided in the position concentric with the board | substrate 1 at equal intervals, it can suppress effectively that the metal mold | die 5 inclines by these positioning parts 2a. In this embodiment, three positioning portions 2a are provided at positions that are concentrically arranged on the substrate 1 at equal intervals. However, at least three positioning portions 2a may be provided, and four or more positioning portions 2a are provided. Also good.

  In the embodiment, the mold 5 having a flat portion in contact with the positioning portion 2a is used. For example, as shown in FIG. 8A, the positioning portion 2a is placed at a position corresponding to the positioning portion 2a. You may use metal mold | die 5 'provided with the fitting part 5b to fit. This fitting part 5b utilizes the hollow structure of the positioning part 2a, and is comprised by the convex part of the circular cross section which can be fitted in the said positioning part 2a. The outer diameter of the convex portion is set to be several μm smaller than the inner diameter of the positioning portion 2a, so that a slight positional deviation between the substrate 1 and the mold 5 'can be absorbed.

  The mold 5 ′ is provided with, for example, a cross-shaped alignment mark (not shown). When the mold 5 ′ is used, the mold 5 of the substrate 1 is used as shown in FIG. An alignment mark 2b is provided at a position corresponding to the 'alignment mark. This alignment mark 2b uses a mask 3 in which alignment mark light transmitting portions (not shown) are arranged in two matrixes at two predetermined positions on the coating 3b in the positioning portion generating step. In this case, it can be formed simultaneously with the positioning portion 2a.

  Then, after placing the substrate 1 on the lower die plate 6B and performing alignment with a CCD camera, the mold 5 ′ is lowered according to the mold contact step, and the fitting portion 5b is fitted into the positioning portion 2a. In this state, the mold 5 ′ comes into contact with the positioning portion 2a.

  In this way, since the mold 5 ′ can be aligned with respect to the substrate 1 with high accuracy, it is possible to ensure the positional accuracy of the recess 4a while ensuring the thickness accuracy of the thermosetting material 4. it can.

  In addition, the positioning part 2a does not need to have a hollow structure, and may have a solid structure when the size is small. In this case, as shown in FIG. 8 (b), the mold 5 'may be provided with a fitting portion 5c constituted by a concave portion that can be fitted to the positioning portion 2a.

  Moreover, in the said embodiment, although the positioning part 2a is provided in the board | substrate 1, you may provide the several positioning part 5d of predetermined height in the metal mold | die 5 as shown to Fig.10 (a). Even if it does in this way, as shown in FIG.10 (b) and (c), even if it is a case where the parallelism of the board | substrate 1 and the metal mold | die 5 has not come out, heat is reliably ensured by the height of the positioning part 5d. The film thickness of the curable material 4 can be made uniform. However, as described above, it is preferable to provide the positioning portion 2a on the substrate 1 from the viewpoint of wear and damage of the positioning portion 5d.

  In order to manufacture an optical waveguide substrate as shown in FIG. 11 using a molded product formed by the above-described fine shape forming method, the following may be performed.

The thermosetting material 4 cured in the curable material curing step is an underclad. A core material is applied on the under clad 4, and the substrate 1 is rotated at 4500 rpm for 30 seconds by a spin coating method, thereby filling the core material into the recess 4a. This core material is a mixture of 1% by mass of a photopolymerization initiator and 70% by mass of propylene glycol monomethyl acetate as a solvent in a photocurable transparent resin having a methacryloxy group different from the resin used for the underclad 4. is there. Next, using a hot plate, the solvent is removed by heating at 100 ° C. for 3 minutes, and the core material is cured by irradiating with ultraviolet rays having an intensity of 20 mW / cm ² for 5 minutes in a nitrogen atmosphere. Form.

Thereafter, an over clad material is applied on the under clad 4 and the core 8, and the substrate 1 is rotated at 900 rpm for 30 seconds by a spin coat method to form a layer of the over clad material. This overclad material is a mixture of 1% by mass of a photopolymerization initiator and 20% by mass of propylene glycol monomethyl acetate as a solvent in a photocurable transparent resin having the same methacryloxy group as the resin used for the underclad 4. is there. Next, using a hot plate, the solvent is removed by heating at 100 ° C. for 3 minutes, and the over clad material is cured by irradiating with an ultraviolet ray having an intensity of 20 mW / cm ² in a nitrogen atmosphere for 5 minutes to overcladding. 9 is formed.

  Here, surface treatment such as plasma treatment before applying the core material and before applying the over clad material improves the wettability of the material and improves the adhesion of each layer. It is preferable to carry out.

  As the core material and overcladding material, a photocurable material containing a photopolymerization initiator is used, but a thermosetting material containing a thermal polymerization initiator may be used, or photocuring may be used. Instead of the curable resin, a thermosetting resin may be used.

  Further, when manufacturing an optical waveguide substrate having a multilayer core, a positioning portion 2a is further provided on the over clad 9, and the under clad 4 and the core 8 are formed on the over clad 9 in the same manner as in the above embodiment. The over clad 9 may be laminated. Thus, by providing the positioning portion 2a every time the under clad 4 is formed, a highly accurate molded product can be obtained even if it is a multilayer product.

  And the optical waveguide manufactured by such a method eliminates the problem that the propagation loss and polarization dependency caused by the light absorption by the silicon substrate are deteriorated. Moreover, the connection work time with the optical fiber is shortened, and the productivity is improved.

  Note that the method for forming a fine shape of the present invention can be used for forming a microlens 10 on a substrate 1 that requires high accuracy as shown in FIG. The microlens 10 is made of a thermosetting resin or a photocurable resin, and has a plurality of protrusions 10a to be lens portions. If the micro-shaped molding method of the present invention is used, these protrusions The height of the part 10a can be made highly accurate and uniform. Furthermore, it can be effectively used for a substrate into which another optical component is incorporated, a composite component thereof, or the like.

It is a front view of the board | substrate used with the shaping | molding method of the fine shape which concerns on one Embodiment of this invention. It is explanatory drawing explaining the positioning part production | generation process. It is a top view of the board | substrate after a positioning part production | generation process. It is explanatory drawing explaining a thermosetting material arrangement | positioning process. It is explanatory drawing explaining a metal mold | die contact process. It is a top view of the board | substrate after a metal mold | die contact process. It is explanatory drawing explaining a metal mold | die contact process when a metal mold | die inclines with respect to a board | substrate. (A) (b) is sectional drawing of the board | substrate and metal mold | die of a modification. It is a top view of the board | substrate after the positioning part production | generation process of a modification. It is explanatory drawing explaining the method to shape | mold a fine shape using the metal mold | die which provided the positioning part. It is sectional drawing of an optical waveguide board | substrate. It is sectional drawing of a micro lens.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Photocurable material 2a Positioning part 3 Mask 4 Thermosetting material 5,5 'Mold 5a Projection part (micro shape)
5b, 5c Fitting part 6 Molding machine 6A Upper die plate 6B Lower die plate 7 Heater 8 Core 9 Clad

Claims (6)

A method of forming a fine shape when manufacturing an optical waveguide substrate,
A positioning part generating step of providing a plurality of positioning parts having a predetermined height on the substrate;
On the substrate, a curable material arrangement step of arranging a layer of curable material thicker than the height of the positioning portion;
A mold contact step of pressing a mold having a fine shape on the lower surface against the curable material from above and contacting the positioning portion;
And a curable material curing step of curing the curable material in a state where the mold is brought into contact with the positioning portion.   In the positioning portion generating step, after a photocurable material layer is arranged on the substrate with a uniform thickness, photolithography is performed to cure a predetermined portion of the photocurable material and other portions of the photocurable material. The method for forming a fine shape according to claim 1, wherein the positioning portion is formed by removing a material.   The method for forming a fine shape according to claim 2, wherein the photocurable material layer is disposed on the substrate with a uniform thickness by spin coating.   4. The method according to claim 1, wherein a substantially circular shape is used as the substrate, and at least three positioning portions are arranged at equal intervals on a concentric circle with the substrate in the positioning portion generation step. 2. A method for forming a fine shape according to item 1.   5. The method for forming a fine shape according to claim 1, wherein, in the positioning portion generation step, the positioning portion is generated so as to have a hollow structure having a hollow center portion in plan view.   As the mold, a mold provided with a fitting part that fits with the positioning part is used. In the mold contact step, the mold is fitted in a state where the fitting part of the mold and the positioning part are fitted. 6. The method for forming a fine shape according to claim 1, wherein the mold is brought into contact with the positioning portion.

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