JP2007067173A - Electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which can realize adherence and improvement in the reliability of conduction, by making the arrangement of position of electrode terminals for element connection and electrode terminals for substrate connection into a configuration in which strain by thermal stress does not concentrate in a specific portion. <P>SOLUTION: In the electronic component, the electrode terminal for substrate connection and the electrode terminal for element connection are formed so that a plurality of the electrode terminal for substrate connection and the electrode terminal for element connection are formed with a configuration opposing each other, at least on one periphery or along periphery centered on the center of connection side principal plane of the integrated element and the center of the loading side of an insulating substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component used in an electronic device, and more particularly to an electronic component having an integrated circuit element as a constituent element.

  2. Description of the Related Art Conventionally, various electronic components are used in electronic devices such as portable communication devices, and in particular, electronic components such as piezoelectric oscillators in which integrated circuit elements are mounted in the components are used.

  FIG. 5 is an external exploded perspective view illustrating a piezoelectric oscillator, which is one of electronic components, as an example. The conventional piezoelectric oscillator 50 controls the oscillation output of the piezoelectric vibrator 53 in which a piezoelectric vibration element (not shown) is accommodated in the cavity portion 55 based on the vibration of the piezoelectric vibration element. It is known that the piezoelectric oscillator 50 is mounted on an insulating substrate 51 in which an electronic element such as an integrated circuit element 56 or a capacitor (not shown) containing the electronic circuit network is housed. It is placed on an external wiring board such as a motherboard of an electronic device (not shown), and the external connection electrode terminal 58 provided on the back surface, that is, the mounting surface of the insulating substrate 51 is soldered to the wiring of the external wiring board. Is mounted on the external wiring board (see, for example, Patent Document 1).

  The package structure material of the piezoelectric vibrator 53 and the insulating substrate 51 is usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by.

  In addition to the oscillation circuit, the integrated circuit element 56 includes a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator 50 based on temperature compensation data created according to the temperature characteristics of the piezoelectric vibrator 53. (Not shown) is provided, and after the piezoelectric oscillator 50 is assembled, the temperature compensation data is stored on the back surface or the outer surface of the insulating substrate 51 in order to store the temperature compensation data in the memory of the integrated circuit element 56. A write control terminal 57 for writing was provided. The temperature compensation data is written in the memory of the integrated circuit element 56 by applying the probe needle of the temperature compensation data writing device to the write control terminal 57 and inputting the temperature compensation data into the memory in the integrated circuit element 56. It is.

  The electronic parts such as the piezoelectric oscillator as described above are disclosed in the following prior art documents.

JP 2000-349555 A JP 2001-177346 A JP-A-10-284500

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  FIG. 6 is a plan view illustrating the insulating substrate 51 in FIG. 5 from the opening side of the cavity portion 55 in a form before the integrated circuit element 56 is mounted. The device connection electrode terminal 59 formed on the bottom surface of the cavity portion 55 of the insulation substrate 51 is formed by connecting the plurality of device connection electrode terminals 59 in a generally rectangular shape. The cavity portion 55 is formed on the bottom surface.

  However, the integrated circuit element 56 is disposed on the element connection electrode terminal 59 having such a configuration, and the element connection electrode terminal 59 and the corresponding substrate connection electrode terminal of the integrated circuit element 56 are electrically connected. When heat is applied from the outside to an electronic component (for example, a piezoelectric oscillator) having a structure mechanically and electrically connected with a material, the expansion or contraction rate due to the heat of the integrated circuit element 56 and the insulating substrate 51 is different. Distortion due to thermal stress on the conductive connecting material for bonding the element connecting electrode terminal and the substrate connecting electrode terminal formed on the diagonal line of the inner bottom surface of the cavity 55 that is relatively far from the center of the integrated circuit element 56 In the worst case, the conductive bonding material at the portion where the strain is concentrated is destroyed, and the integrated circuit element 56 is peeled off from the bottom surface inside the cavity portion 25 of the insulating substrate 51, and the bonding is performed. Between the terminals there was a problem arises in that the insulation.

  The present invention has been conceived in view of the above-mentioned problems, and its purpose is to form the arrangement positions of the element connection electrode terminals and the substrate connection electrode terminals so that distortion due to thermal stress does not concentrate on a specific portion. Thus, it is an object to provide an electronic component that can improve the reliability of fixation and conduction.

The present invention solves the above problems, and a plurality of element connection electrode terminals are formed on a mounting surface in a region where an integrated circuit element prepared on an insulating substrate is mounted. In an electronic component in which an insulating substrate to which an integrated circuit element is connected by electrically connecting and fixing the electrode terminal for connecting the substrate of the integrated circuit element to the electrode terminal with a conductive bonding material is used as a constituent member.
A plurality of the electrode terminals for substrate connection and the electrode terminals for element connection are provided on at least one circumference around the center of the connection-side main surface of the integrated circuit element and the center of the mounting surface of the insulating substrate. Each of the substrate connecting electrode terminals and the element connecting electrode terminals is formed in an opposing manner, and is an electronic component.

  The electronic component according to the present invention is also the above-described electronic component in which the substrate connecting electrode terminal and the element connecting electrode terminal are formed at equal intervals in the above configuration.

  In the electronic component of the present invention, the electrode terminal for connecting the substrate and the electrode terminal for connecting the element are on at least one circumference around the center of the connection-side main surface of the integrated circuit element and the center of the mounting surface of the insulating substrate. In addition, since each of the substrate connection electrode terminals and the element connection electrode terminals are formed to face each other, when the integrated circuit element is mounted on the insulating substrate, the integrated circuit element and the insulating substrate are The conductively fixed portions are arranged in a circle around the center of the connection-side main surface of the integrated circuit element and the center of the mounting surface of the insulating substrate, and each substrate connection electrode terminal and the element connection electrode Distortion due to thermal stress applied to the conductive bonding material that joins the terminals is not concentrated at a specific location and can be made uniform, and peeling insulation due to destruction of the conductive bonding material can be suppressed.

  Further, according to the electronic component of the present invention, since the substrate connecting electrode terminals and the element connecting electrode terminals are formed at equal intervals, various stresses applied to each conductive bonding material can be further distributed in a balanced manner. Further, the connection reliability of the conductive bonding material can be further improved.

  Therefore, the present invention has an effect of providing an electronic component with extremely high reliability.

  Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. In addition, the same code | symbol in each figure shall show the same object.

  FIG. 1 is an external exploded perspective view showing an electronic component according to the present invention as an example of a piezoelectric oscillator which is one of the electronic components. 2 is a cross-sectional view of the piezoelectric oscillator illustrated in FIG. 1 after being assembled and then cut along a virtual cutting line A1-A2 illustrated in FIG. FIG. 3 is an external plan view illustrating an embodiment of the insulating substrate 10 illustrated in FIG. 1 from the opening side of the cavity 15 with the integrated circuit element 7 not mounted. FIG. 4 is an external plan view showing an embodiment of the insulating substrate 10 shown in FIG. 1 from the opening side of the cavity 15 with the integrated circuit element 7 not mounted. In each figure, for clarity of explanation, a part of the structure is not shown, and some dimensions are exaggerated. In particular, the thickness dimension of each part is exaggerated.

  As shown in FIG. 1, a piezoelectric oscillator that is one of the electronic components according to the present invention includes a cavity portion 15 that houses an integrated circuit element 7, and an integrated circuit element 7 mounted on the bottom surface of the cavity portion 15. Inside the insulating substrate 10 in which the element connection electrode terminals 12 are formed, the integrated circuit element 7 in which the substrate connection electrode terminals 16 are formed on the mounting surface side, and the cavity portion 15 are disposed so as to cover the cavity portion 15. It is mainly composed of a piezoelectric vibrator 1 that houses a piezoelectric vibration element 5.

  An external connection electrode terminal 19 is provided on the back side of the bottom surface of the insulating substrate 10, that is, the surface facing the mother board (mounting substrate) of an external electronic device (not shown). Also, a frame wall 13 serving as a side surface surrounding the cavity portion 15, and a plurality of write control terminals 11 are formed on the outer surface of the frame wall 13. Furthermore, on the upper surface of the frame wall 13 on the opening side of the cavity portion 15, a vibrator connection electrode pad 18 for mechanically and electrically connecting to the piezoelectric vibrator 1 is formed. In the electronic component of the present invention, an opening 9 (see FIG. 1) is formed in a part of the frame wall 13. This open portion 9 confirms the formation state of the circuit protection material 14 for protecting the conductive bonding material 8 on the circuit formation surface (lower surface) of the integrated circuit element 7 when it is disposed in the cavity portion 15 of the insulating substrate 10. Used as a confirmation port for

  As shown in FIGS. 1 and 2, the characteristic part of the piezoelectric oscillator according to the present embodiment is that the integrated circuit element 7 is mounted and fixed to the insulating substrate 10 via the conductive bonding material 8 such as solder, conductive adhesive or bump. In this case, as shown in FIGS. 3 and 4, the arrangement of the element connection electrode terminals 12 formed on the insulating substrate 10 side corresponding to the position of the substrate connection electrode terminals 16 provided in the integrated circuit element 7 is integrated circuit. It is in the point arrange | positioned on the same periphery centering on the center of the connection side main surface of the element 7, and the center of this mounting surface of an insulated substrate. Thereby, in the heating environment, the stress due to heat applied to each conductive bonding material 8 between the substrate connecting electrode terminal 6 and the element connecting electrode terminal 12 can be made uniform, and the conductive bonding due to the influence of the thermal stress. The breakage of the material 8 can be suppressed, and the reliability of fixation and conduction can be improved.

  Here, the piezoelectric vibrator 1 shown in FIG. 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, and side walls 3 and 42 made of a ceramic material similar to the substrate 2, 42 alloy, Kovar, phosphor bronze. The piezoelectric vibrator 1 is configured by attaching the side wall 3 to the upper surface of the substrate 2 and mounting and fixing the lid 4 on the upper surface of the substrate 2. A piezoelectric vibration element 5 is mounted on the upper surface of the substrate 2 located inside.

  The piezoelectric vibrator 1 is hermetically sealed by accommodating the piezoelectric vibration element 5 in the space surrounded by the upper surface of the substrate 2, the inner surface of the side wall 3, and the lower surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the piezoelectric vibration element 5 are provided on the upper surface of the substrate 2, and a plurality of pieces connected to a frame wall 13 on the insulating substrate 10 described later are provided on the lower surface of the substrate 2. Substrate connection electrode pads 17 are provided, and these pads and terminals are electrically connected to each other through wiring patterns on the surface of the substrate 2 and via holes embedded in the substrate 2. ing.

  Further, the piezoelectric vibrating element 5 housed in the piezoelectric vibrator 1 is a rectangular quartz crystal that is cut out from a quartz crystal at a predetermined cut angle and is subjected to outer shape processing, for example, when quartz is used as the piezoelectric material. A base plate is formed, and a pair of vibration electrodes is attached and formed on both main surfaces of the crystal base plate. When a fluctuation voltage from the outside is applied to the piezoelectric piece via a pair of vibration electrodes, the piezoelectric vibration element 5 outputs a signal to the outside by causing a thickness shear vibration at a predetermined frequency.

  Here, the lid 4 of the piezoelectric vibrator 1 is connected to an external connection electrode terminal 19 for a ground terminal, which will be described later, via the substrate connection electrode pad 17 of the piezoelectric vibrator 1 and the vibrator connection electrode pad 18 of the insulating substrate 10. If it is allowed to be used, the lid 4 made of metal is connected to the reference potential to provide a shielding function at the time of use, so that the piezoelectric vibration element 5 and the integrated circuit element 7 are electrically connected to the outside from unnecessary electric power. Good protection from the action. Therefore, the lid 4 of the piezoelectric vibrator 1 is connected to the ground terminal of the external connection electrode terminals 19 via the substrate connection electrode pad 17 of the piezoelectric vibrator 1 and the vibrator connection electrode pad 18 of the insulating substrate 10. It is preferable to keep it.

  The insulating substrate 10 having the cavity portion 15 that accommodates the integrated circuit element 7 to which the piezoelectric vibrator 1 is attached has a substantially rectangular shape in its main surface outer shape. It is formed so as to have a flat plate shape by a resin material such as polycarbonate, epoxy resin, polyimide resin or the like, or a ceramic material such as glass-ceramic or alumina ceramic.

  The four external connection electrode terminals 19 provided on the back surface, that is, the mounting surface of the insulating substrate 10 function as terminals for connecting the piezoelectric oscillator to an external wiring board such as a mother board. When mounted on a wiring board, it is electrically connected to the circuit wiring of the external wiring board via a conductive bonding material such as solder.

  Further, the frame wall 13 provided on the upper surface of the insulating substrate 10 is necessary for disposing the integrated circuit element 7 between the insulating substrate 10 having the cavity portion 15 that houses the integrated circuit element 7 and the piezoelectric vibrator 1. This is for connecting the vibrator connection electrode pad 18 of the insulating substrate 10 having the cavity 15 for accommodating the integrated circuit element 7 to the connection terminal 17 of the piezoelectric vibrator 1 while ensuring a predetermined interval. .

  Furthermore, in the central region of the insulating substrate 10 having the cavity portion 15 that accommodates the integrated circuit element 7 described above, a plurality of element connection electrode terminals 12 have the same circumference around the center of the bottom surface of the cavity portion 15. The electrode terminal 12 for connecting the substrate of the integrated circuit element 7 (formed in a form corresponding to the formation form of the electrode terminal 12 for element connection) is provided on the electrode terminal 12 for element connection. The integrated circuit element 7 is attached to a predetermined position on the insulating substrate 10 having the cavity portion 15 by being electrically and mechanically connected through the bonding material 8.

  Further, the integrated circuit element 7 has, on its circuit formation surface (lower surface), a temperature sensing element for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 5, and a temperature in the memory. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibration element 5 in accordance with the temperature change based on the compensation data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal.

  A circuit protective material made of an insulating material such as polyimide is interposed on the surface of the integrated circuit element 7 described above, and the surface of the integrated circuit element 7 is protected by this circuit protective material. An electrical short circuit with the conductive bonding material 8 is prevented.

  Thus, conventionally, an underfill resin is provided between the integrated circuit element 7 and the insulating substrate 10 in order to prevent the circuit forming surface formed on the surface of the integrated circuit element 7 from being corroded by moisture in the atmosphere. However, instead of this, a circuit protective material for protecting the integrated circuit element 7 can be substituted for the underfill resin function. As a result, it is possible to eliminate the need for an underfill resin between the integrated circuit element 7 and the insulating substrate 10.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in this embodiment, as an embodiment of the present invention, a piezoelectric oscillator which is one of electronic components has been described as an example. However, the present invention is an invention in the case where an integrated circuit element is mounted in an electronic component. Therefore, the present invention can also be applied to other electronic parts having a form similar to that of the embodiment (an electronic part in which an integrated circuit element is mounted and modularized).

  Further, in the present embodiment shown in FIG. 3, the element connection electrode terminals 12 formed on the insulating substrate 10 are formed on one circumference. Instead, as shown in FIG. 4, the element connection electrode terminals are formed. Even when 12 is formed on a plurality of concentric circumferences, the same effects as in the embodiment can be obtained. In addition to the integrated circuit element 7, another electronic element such as a capacitor may be mounted in the cavity portion 15.

FIG. 1 is an external exploded perspective view showing an electronic component according to the present invention as an example of a piezoelectric oscillator which is one of the electronic components. 2 is a cross-sectional view of the piezoelectric oscillator illustrated in FIG. 1 after being assembled and then cut along a virtual cutting line A1-A2 illustrated in FIG. FIG. 3 is an external plan view illustrating an embodiment of the insulating substrate 10 illustrated in FIG. 1 from the opening side of the cavity 15 with the integrated circuit element 7 not mounted. FIG. 4 is an external plan view showing another form of the insulating substrate 10 shown in FIG. FIG. 5 is an exploded perspective view of a conventional electronic component, taking a piezoelectric oscillator as one of the electronic components as an example. FIG. 6 is an external plan view illustrating the form of the insulating substrate 51 shown in FIG. 5 from the opening side of the cavity 55 in a state where the integrated circuit element 56 is not mounted.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator 2 ... Board | substrate 3 ... Side wall 4 ... Cover body 5 ... Piezoelectric vibration element 7 ... Integrated circuit element 8 ... Conductive bonding material 9 ... Opening Part 10 ·· Insulating substrate 11 · · Write control terminal 12 · · Electrode connection electrode terminal 13 · · Frame wall 15 · · Cavity part 16 · · Electrode terminal for substrate connection 17 · · Electrode pad 18 for vibrator connection ·・ Electrode pad for substrate connection 19 ・ ・ External connection electrode terminal

Claims (2)

A plurality of element connection electrode terminals are formed on a mounting surface in a region where an integrated circuit element prepared on an insulating substrate is mounted, and the substrate connection electrode of the integrated circuit element is formed on the element connection electrode terminal. In an electronic component in which the insulating substrate to which the integrated circuit element is connected by conductively fixing a terminal with a conductive bonding material is used as one constituent member,
The electrode terminal for substrate connection and the electrode terminal for element connection are on at least one circumference around the connection-side main surface center of the integrated circuit element and the mounting surface of the insulating substrate, or along the circumference. A plurality of the substrate connecting electrode terminals and the element connecting electrode terminals are formed so as to face each other.   2. The electronic component according to claim 1, wherein the substrate connecting electrode terminals and the element connecting electrode terminals are formed at equal intervals.

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