JP2007053827A - Power supply - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power supply in which solder is prevented from adhering to the contact surface of an electrode. <P>SOLUTION: The power supply comprises a substrate 1, filmlike interconnect lines 21a and 21b arranged on the surface of the substrate 1, and planar contact plates 11a and 11b arranged on the surface of the substrate 1. The contact plates 11a and 11b include joints 12a and 12b with the interconenct lines 21a and 21b. The joints 12a and 12b have legs formed to stand from the surface of the substrate 1. The legs of the joints 12a and 12b are connected with the interconnect lines 21a and 21b by solders 14a and 14b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a power supply device.

  As an electrical device, there is an electrical device that converts alternating current electricity into direct current from an outlet and uses direct current electricity as a drive source. Such an electric device includes an AC / DC conversion unit for converting AC to DC. The AC / DC conversion unit is arranged inside the device main body, which is the main body of the electric device, or is connected in the middle of the power cable from the outlet to the device main body. Alternatively, there is an electric device in which the AC / DC conversion unit is inserted into the device main body (for example, JP-A-2002-137490).

  FIG. 5 is a perspective view of a power supply device for inserting the AC / DC conversion unit into the device main body. This power supply device includes an AC / DC conversion unit 4. The AC / DC conversion unit 4 is formed in a box shape. The AC / DC conversion unit 4 has the insertion port 2 for inserting the insertion part 5 in one end surface. The plug-in part 5 is connected to the power cord 6. The power cord 6 is connected to an outlet.

  The AC electricity taken from the insertion port 2 is converted from AC to DC in the AC / DC conversion unit 4 and transmitted to the contact plates 11 a and 11 b of the AC / DC conversion unit 4. The contact plates 11a and 11b formed on the AC / DC conversion unit 4 are exposed to the outside.

  The AC / DC conversion unit 4 is inserted into the attachment portion 39 of the device main body 7 as indicated by an arrow 43. Inside the attachment part 39, the apparatus side electrodes 8a and 8b are arrange | positioned so as to correspond to the position of the contact plates 11a and 11b. By inserting the AC / DC conversion unit 4 into the attachment portion 39, the contact plates 11a and 11b come into contact with the device-side electrodes 8a and 8b, respectively. The device side electrodes 8 a and 8 b are connected to electrical components inside the device body 7.

  FIG. 6 shows an enlarged schematic perspective view of a portion of the contact plate arranged on the substrate inside the AC / DC conversion unit. The AC / DC conversion unit 4 includes a substrate 1 therein. Electrical components are arranged on the surface of the substrate 1 (not shown).

  The contact plate 31 is disposed on the surface of the substrate 1. The contact plate 31 is formed in a plate shape. A wiring 35 is disposed on the side of the contact plate 31. The wiring 35 is formed on the surface of the substrate 1. The wiring 35 is electrically connected to a rod-shaped electrode 36 of an electrical component fixed to the substrate 1.

Contact plate 31 includes a connection portion 32. The connection part 32 is formed in a strip shape. The connection portion 32 is electrically connected to the wiring 35 by the solder 34.
JP 2002-137490 A

  FIG. 7 is a perspective view of a process when the contact plate 31 is attached to the substrate 1. After the wiring 35 is formed on the surface of the substrate 1, a connection hole 38 is formed in a region where the wiring 35 is formed.

  Next, the contact plate 31 is disposed on the substrate 1. The connection portion 32 of the contact plate 31 is partially bent, and the bent portion is disposed inside the connection hole 38. In this state, the connection portion 32 and the wiring 35 are fixed by disposing the connection hole 38 solder.

  Referring to FIG. 6, in order to firmly fix the wiring 35 and the connecting portion 32 in the step of arranging the solder, it is preferable to connect using a lot of solder. However, when the molten solder 34 is disposed on the surface of the connection portion 32, the solder may flow toward the main body portion of the contact plate 31 as indicated by an arrow 41.

  When the solder 34 flows in the direction indicated by the arrow 41, the solder adheres to the surface of the main body portion of the contact plate 31, and there is a problem in that the contact with the device side electrode formed on the device main body is adversely affected. That is, the contact plate is formed such that the main body portion is a contact surface and is in surface contact or line contact with the device side electrode. However, when the solder 34 flows into the main body of the contact plate 31, there is a problem that the contact plate 31 makes point contact with the device side electrode. Alternatively, there is a problem that the appearance of the contact plate 31 is poor.

  An object of this invention is to provide the power supply device which prevented the solder from adhering to the contact surface of an electrode.

  A power supply device according to the present invention includes a substrate, a film-like wiring disposed on the surface of the substrate, and a plate-like electrode disposed on the surface of the substrate. The substrate has a connection hole formed in a region where the wiring is disposed. The electrode is disposed at an end of the substrate. The electrode includes a connection portion with the wiring. The connection portion has a substantially U-shaped side surface. The connecting portion has two legs formed so as to stand from the surface of the substrate. In the connection part, one of the two leg parts is inserted into the connection hole. In the connection portion, the one leg portion is connected to the wiring by solder.

  A power supply device according to the present invention includes a substrate, a film-like wiring disposed on the surface of the substrate, and a plate-like electrode disposed on the surface of the substrate. The electrode includes a connection portion with the wiring. The connection portion has a leg portion formed so as to stand from the surface of the substrate. The connecting portion has the leg portion connected to the wiring by solder.

  Preferably, in the above invention, the connecting portion is formed so that the shape of the side surface is substantially U-shaped. The connecting portion has the two leg portions. In the connection part, one of the two leg parts is connected to the wiring.

  Preferably, in the above invention, the substrate has a connection hole formed in a region where the wiring is arranged. In the connection part, the one leg part of the two leg parts is inserted into the connection hole.

  ADVANTAGE OF THE INVENTION According to this invention, the power supply device which prevented that solder adheres to the contact surface of an electrode can be provided.

  A power supply apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  Referring to FIG. 5, the power supply device according to the present invention includes an AC / DC conversion unit 4. The AC / DC conversion unit 4 is formed so as to convert AC electricity into DC. The AC / DC conversion unit 4 is formed in a box shape. The AC / DC conversion unit 4 includes a housing, and electrical components are arranged inside the housing.

  The apparatus main body 7 has an attachment portion 39 for inserting the AC / DC conversion unit 4. The attachment part 39 is formed along the shape of the AC / DC conversion unit. As shown by an arrow 43, the AC / DC conversion unit 4 is formed so as to be insertable into the attachment portion 39.

  The AC / DC conversion unit 4 includes contact plates 11a and 11b for supplying electricity to the device body. The contact plates 11a and 11b are arranged away from each other. The contact plates 11a and 11b are formed so as to be exposed from openings formed in the housing. The contact plates 11 a and 11 b are arranged at the end of the AC / DC conversion unit 4.

  The AC / DC conversion unit 4 has an insertion port 2 for inserting the insertion portion 5. Two rod-shaped electrodes are arranged inside the insertion port 2. The plug-in part 5 is connected to the power cord 6. The insertion part 5 is formed to be insertable into the insertion port 2 as indicated by an arrow 42. The power cord 6 is connected to an outlet. Contact plates 11a and 11b in the present embodiment are arranged on the side opposite to the side on which insertion port 2 is formed.

  In the attachment portion 39, device-side electrodes 8a and 8b are arranged on one surface. The device side electrodes 8a and 8b are formed in a plate shape. The device side electrodes 8a and 8b are formed in a band shape. The device-side electrodes 8 a and 8 b in the present embodiment are curved so as to protrude from the inner surface of the attachment portion 39. The device side electrodes 8a and 8b are arranged so that the contact plates 11a and 11b come into contact with each other when the AC / DC conversion unit 4 is inserted into the mounting portion 39. In the present embodiment, the device side electrodes 8a and 8b are formed so as to be in line contact with the contact plates 11a and 11b. In the example shown in FIG. 5, the contact plate 11a is disposed so as to contact the device side electrode 8a, and the contact plate 11b is disposed so as to contact the device side electrode 8b.

  FIG. 1 shows a schematic perspective view when the casing of the AC / DC conversion unit in the present embodiment is removed. The AC / DC conversion unit includes a substrate 1. On the front surface of the substrate 1, electrical components 3a to 3c are arranged. On the front surface of the substrate 1, the insertion port 2 is arranged so as to protrude from the substrate 1 toward the side.

  FIG. 2 shows a schematic perspective view when the casing of the AC / DC conversion unit is removed and the substrate is viewed from the back side. On the back surface of the substrate 1, contact plates 11a and 11b are arranged as electrodes in the present embodiment. Openings for exposing the contact plates 11a and 11b are formed in the casing of the AC / DC conversion unit (not shown). The contact plates 11a and 11b are arranged so as to be exposed from the opening.

  The contact plates 11 a and 11 b are arranged at the end of the substrate 1. In the present embodiment, contact plates 11a and 11b are arranged at the end opposite to the side where the insertion port 2 is arranged.

  Wirings 21 a to 21 c are formed on the back surface of the substrate 1. The wirings 21 a to 21 c are formed in a film shape on the back surface of the substrate 1. The electrical components attached to the substrate 1 are electrically connected to each other by wires such as the wires 21a to 21c. The electrical component fixed to the substrate 1 has electrodes 22a to 22c. The electrodes 22 a to 22 c are formed in a rod shape and are disposed so as to penetrate the substrate 1. The electrodes 22 a to 22 c are electrically connected to the wirings 21 a to 21 c on the back surface of the substrate 1.

  FIG. 3 shows an enlarged perspective view of a contact plate portion in the present embodiment. Each of the contact plates 11a and 11b is formed in a plate shape. The contact plate 11a has a main body portion 13a. The main body 13a is formed in a flat plate shape. The main surface of the main body 13a is a contact surface with the device-side electrode. The contact plate 11b has a main body portion 13b similar to the main body portion 13a.

  The contact plate 11a has a clamping part 16a. The sandwiching portion 16 a is formed so that the contact plate 11 a is fixed to the substrate 1 by sandwiching the substrate 1. The sandwiching portion 16 a is formed by bending the contact plate 11 a along the shape of the end portion of the substrate 1. The clamping part 16a has elasticity in the direction in which the substrate 1 is tightened.

  When the AC / DC conversion unit is inserted into the apparatus main body, a force toward the inside of the substrate 1 is applied to the contact plate 11a. However, since the sandwiching portion 16 a is formed along the shape of the end portion of the substrate 1, the contact plate 11 a can be prevented from moving toward the inside of the substrate 1. That is, the position of the contact plate 11a can be prevented from shifting. The contact plate 11b has a holding part 16b similar to the holding part 16a.

  The contact plate 11a has a connection portion 12a for electrical connection with the wiring 21a. The connecting portion 12a is a portion extending in a band shape from the main body portion 13a of the contact plate 11a toward the side. The connecting portion 12a is formed integrally with the main body portion 13a. The connecting portion 12a is fixed and electrically connected to the wiring 21a by the solder 14a.

  The contact plate 11b has a connection portion 12b similar to the connection portion 12a. The connecting portion 12b is fixed to the wiring 21b and electrically connected by the solder 14b.

  FIG. 4 is a schematic perspective view before placing solder in the step of connecting the connection portion of the contact plate to the wiring. The connection portion 12a has a substantially U-shaped side surface when viewed from the side. The connecting portion 12a has a leg portion 17a formed so as to stand from the surface of the substrate 1. In the present embodiment, two leg portions 17a are formed. Leg portion 17 a is formed to extend in a direction substantially perpendicular to the main surface of substrate 1. Thus, the connection part 12a is formed so that a part is arrange | positioned in the air away from the surface of the board | substrate 1. FIG.

  A connection hole 15a is formed in a portion to which the leg portion 17a is connected in the region where the wiring 21a is formed. Of the two leg portions 17a of the connection portion 12a, one leg portion 17a is inserted into the connection hole 15a. The connection hole 15a may be formed so as to penetrate the substrate 1, or may be formed so as to have a bottom surface.

  Similar to the connection portion 12a, the connection portion 12b of the contact plate 11b has two leg portions 17b. The leg portion 17b is formed so as to stand from the surface of the substrate 1, and one leg portion 17b is inserted into a connection hole 15b formed in the region of the wiring 21b.

  In the connection between the connection portions 12a and 12b and the wirings 21a and 21b, solder is disposed in the vicinity of the connection holes 15a and 15b and the connection holes 15a and 15b. At this time, since the leg portions 17a and 17b are formed in the respective connection portions 12a and 12b, it is possible to prevent the solder from flowing toward the main body portions 13a and 13b of the contact plates 11a and 11b. As a result, it is possible to prevent solder from adhering to the surfaces of the main body portions 13a and 13b of the contact plates 11a and 11b. That is, it is possible to prevent solder from adhering to the contact portion with the device-side electrode formed on the device main body on the surfaces of the main body portions 13a and 13b of the contact plate, thereby preventing contact failure. Or, appearance defects can be prevented.

  In the prior art, work was performed while taking care not to allow the solder to flow on the surface of the main body of the contact plate, and thus there was a problem that productivity was poor. However, in this embodiment, since the flow of solder stops at the legs, soldering can be performed easily. As a result, productivity is improved.

  Further, in the present embodiment, the side surface of the connection portion is formed so as to be substantially U-shaped, and one of the two legs is fixed to the wiring with solder. By adopting this configuration, it is possible to easily form a connection portion standing from the surface of the substrate.

  In this way, the connection part and the wiring are soldered in a state where a band-like connection part is formed on the electrode and bent so that a part of the connection part is disposed in the air away from the surface of the substrate. Thus, it is possible to prevent the solder from flowing toward the surface of the main body portion of the electrode.

  In the present embodiment, the connection portion is formed in a band shape, but is not particularly limited to this configuration, and it is only necessary to include a leg portion formed so that a part of the connection portion is separated from the substrate. In the present embodiment, two contact plates are formed as electrodes. However, the present invention is not limited to this, and the number of electrodes may be arbitrary.

  Further, in the present embodiment, the connection between the connection portion of the contact plate of the power supply device and the wiring of the substrate has been described. However, the present invention is not limited to this embodiment, and soldering is required in an arbitrary electric device. The present invention can be applied to the connecting portion.

  In each drawing according to the above embodiment, the same or corresponding parts are denoted by the same reference numerals.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

It is a schematic perspective view when the housing | casing of the AC / DC conversion unit in embodiment is removed. It is a schematic perspective view when the housing | casing of an AC / DC conversion unit is removed and a board | substrate is seen from the back side. It is an expansion perspective view of the part of the contact plate arrange | positioned at the back side of a board | substrate. FIG. 5 is an enlarged perspective view of a portion of the contact plate before soldering between the contact plate connecting portion and the wiring. It is a schematic perspective view when inserting a power supply device in an apparatus main body. It is an expansion perspective view of the part of the contact plate in a prior art. It is an expansion perspective view of the part of a contact plate before performing the soldering of the connection part and wiring of a contact plate in a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Socket, 3a, 3b Electrical component, 4 AC / DC conversion unit, 5 Plug part, 6 Power supply cord, 7 Apparatus main body, 8a, 8b Apparatus side electrode, 11a, 11b Contact plate, 12a, 12b Connection part , 13a, 13b body, 14a, 14b solder, 15a, 15b connection hole, 16a, 16b clamping part, 17a, 17b leg, 21a-21c wiring, 22a-22c electrode, 31 contact plate, 32 connection part, 34 solder , 35 wiring, 36 electrodes, 38 connection holes, 39 mounting part, 41 to 43 arrows.

Claims (4)

A substrate,
A film-like wiring arranged on the surface of the substrate;
A plate-like electrode disposed on the surface of the substrate,
The substrate has a connection hole formed in a region where the wiring is disposed,
The electrode is disposed at an end of the substrate;
The electrode includes a connection portion with the wiring,
The connection part is formed in a substantially U-shaped side surface,
The connecting portion has two legs formed so as to stand from the surface of the substrate,
In the connection part, one of the two leg parts is inserted into the connection hole,
The connection portion is a power supply device in which the one leg portion is connected to the wiring by solder. A substrate,
A film-like wiring arranged on the surface of the substrate;
A plate-like electrode disposed on the surface of the substrate,
The electrode includes a connection portion with the wiring,
The connecting portion has a leg portion formed so as to stand from the surface of the substrate,
The connection portion is a power supply device in which the leg portion is connected to the wiring by solder. The connecting portion is formed so that the shape of the side surface is substantially U-shaped,
The connecting portion has two legs.
The power supply apparatus according to claim 2, wherein one of the two legs is connected to the wiring. The substrate has a connection hole formed in a region where the wiring is disposed,
4. The power supply device according to claim 3, wherein the connection portion includes the one leg portion of the two leg portions inserted into the connection hole.

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