JP2006266883A - Probe unit and continuity test method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe unit for increasing the contact pressure with the electrode of a specimen and accurately aligning the electrode of a specimen to the contact section of a conductor. <P>SOLUTION: The probe unit aligned to the specimen by using an imaging optical system comprises a substrate; a plurality of conductors formed on the substrate; a contact section that is formed on each conductor, is positioned on the substrate, and comes into contact with the electrode of the specimen; and the edge of the substrate, where the distance from the contact section is shorter than that between the centers of mutually adjacent contact sections, the tip is positioned on a virtual straight line vertical to the arrangement direction of the plurality of contact sections, and the thickness of the tip is within the depth of field of the imaging optical system. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe unit and a continuity inspection method for inspecting electrical characteristics of electronic devices such as semiconductor integrated circuits and liquid crystal panels.

  Conventionally, a method for inspecting the continuity of an electronic device with a probe unit having a contact portion protruding from a substrate is known. There is also known a method of forming fine conductive wires on a substrate by plating. When the conductive wire is made of a thin film formed by plating, the contact pressure between the electrode and the contact portion cannot be increased if the contact portion of the conductive wire that contacts the electrode of the electronic device protrudes from the substrate. Further, if the width of the conducting wire is reduced in order to narrow the pitch of the contact portion of the conducting wire in accordance with the pitch of the electrode of the electronic device, the contact pressure between the contacting portion of the conducting wire and the electrode is further reduced. Therefore, in such a probe unit, when the electrode of the electronic device is made of an amorphous transparent electrode material or aluminum, the contact pressure for breaking through the surface layer of the electrode and making the conductive wire and the electrode conductive is ensured. Can't get.

  Patent Document 1 discloses a probe unit in which a contact portion does not protrude from an end portion of a substrate. In the step of aligning the contact portion of the probe unit and the electrode of the electronic device, it is difficult to accurately align the electronic device electrode and the contact portion of the probe unit while observing with a microscope or the like. This is because, if the conductive wire provided on the surface of the substrate on the electronic device side is observed from the electronic device side of the substrate, the board on which the electronic device is placed becomes an obstacle, and the conductive wire is on the side opposite to the electronic device. This is because the substrate gets in the way when observing from above.

  Patent Document 2 discloses a method of aligning a contact portion of a probe unit and an electrode of an electronic device while observing a mark formed on the electronic device. However, in this method, it is necessary to previously form a mark used for alignment on an electronic device, and a double-focus camera is required to obtain a clear image of the mark used for alignment.

Korean Published Patent Publication No. 2003-0023662 Japanese Patent Laid-Open No. 9-326426

  The present invention was created to solve the above-described problems, and can increase the contact pressure between the specimen electrode and the specimen electrode and the contact portion of the lead wire that contacts the electrode. It is an object of the present invention to provide a probe unit that can be aligned with each other.

  In order to achieve the above object, a probe unit according to the present invention is a probe unit that is aligned with a specimen using an imaging optical system, and includes a substrate, a plurality of conductive wires formed on the substrate, An arrangement direction of the plurality of contact portions, which is formed on each of the conductive wires, is located on the substrate and contacts the electrode of the specimen, and the distance from the contact portion is shorter than the distance between the centers of the contact portions adjacent to each other. And an edge portion of the substrate having a thickness within the depth of field of the imaging optical system. By forming a contact portion in contact with the electrode of the specimen on the substrate, the contact pressure with the electrode of the specimen can be increased. When the tip of the edge of the substrate is located on a virtual straight line that is close to the contact portion and perpendicular to the arrangement direction of the plurality of contact portions, the specimen electrode and the tip of the edge of the substrate are observed with a microscope or the like. By adjusting the position, the electrode of the specimen and the contact portion of the probe unit can be indirectly accurately aligned. Therefore, by forming the substrate such that the tip of the edge of the substrate is positioned on a virtual straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions. The contact portion of the conducting wire and the electrode of the specimen can be accurately aligned. In addition, the thinner the tip of the edge of the substrate observed at the same time as the electrode of the specimen with a microscope or the like, the clearer the enlarged image of the electrode of the specimen and the tip of the edge of the board with the imaging optical system such as a microscope. Can be obtained.

  In order to achieve the above object, a probe unit according to the present invention includes a substrate, a plurality of conductive wires formed on the substrate, and a contact formed on each of the conductive wires and in contact with an electrode of a specimen. The tip is located on a virtual straight line that is shorter than the distance between the centers of the contact portions and the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions, and becomes thinner toward the tips. And an edge portion of the substrate on which the surface on the conductive wire side is inclined. When the tip of the edge of the substrate is located on a virtual straight line that is close to the contact portion and perpendicular to the arrangement direction of the plurality of contact portions, the specimen electrode and the tip of the edge of the substrate are observed with a microscope or the like. By adjusting the position, the electrode of the specimen and the contact portion of the probe unit can be indirectly accurately aligned. Therefore, by forming the substrate such that the tip of the edge of the substrate is positioned on a virtual straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions. The contact portion of the conducting wire and the electrode of the specimen can be accurately aligned. In addition, the thinner the tip of the edge of the substrate observed at the same time as the specimen electrode in the microscope or the like within the depth of field of the imaging optical system, the more the specimen electrode and substrate in the imaging optical system such as a microscope. It is possible to obtain a clear magnified image with the front end of the edge portion. Therefore, by inclining the surface opposite to the conductive wire at the edge of the substrate observed simultaneously with the electrode of the specimen so that the substrate becomes thinner toward the tip, the electrode of the specimen and the tip of the edge of the substrate are A clear enlarged image can be obtained.

  In order to achieve the above object, a probe unit according to the present invention includes a substrate, a plurality of conductive wires formed on the substrate, and a contact formed on each of the conductive wires and in contact with an electrode of a specimen. And a step where the tip is located on a virtual straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions, and the tip side becomes thinner. And an edge portion of the substrate formed on a surface opposite to the conductor. When the tip of the edge of the substrate is located on a virtual straight line that is close to the contact portion and perpendicular to the arrangement direction of the plurality of contact portions, the specimen electrode and the tip of the edge of the substrate are observed with a microscope or the like. By adjusting the position, the electrode of the specimen and the contact portion of the probe unit can be indirectly accurately aligned. Therefore, by forming the substrate such that the tip of the edge of the substrate is positioned on a virtual straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions. The contact portion of the conducting wire and the electrode of the specimen can be accurately aligned. In addition, the thinner the tip of the edge of the substrate observed at the same time as the electrode of the specimen with a microscope or the like, the clearer the enlarged image of the electrode of the specimen and the tip of the edge of the board with the imaging optical system such as a microscope. Can be obtained. Therefore, a clear enlarged image of the electrode of the specimen and the tip of the edge of the substrate is formed on the surface opposite to the conductor at the edge of the board, which is observed at the same time as the electrode of the specimen, so that the substrate side becomes thin. Can be obtained.

  In order to achieve the above object, a continuity test method according to the present invention is a continuity test method for testing continuity of a specimen with a probe unit having a substrate and a conductor, and includes a tip of an edge of the substrate, an electrode of the specimen, Aligning the conductor and the electrode by aligning while observing. By aligning the probe unit directly with the electrode of the sample, it is not necessary to form a mark for alignment on the sample.

  Further, according to the continuity inspection method of the present invention, the tip of the edge of the substrate and the electrode are simultaneously accommodated within the depth of field in the field of view of the imaging optical system, and the tip of the edge of the substrate and the specimen Observe the electrodes. By observing the tip of the edge of the substrate and the electrode simultaneously within the depth of field in the field of view of the imaging optical system, the electrode of the specimen is based on a sharp enlarged image of the tip of the edge of the substrate and the electrode. And the contact portion of the probe unit can be accurately aligned.

Hereinafter, embodiments of the present invention will be described in the order of the configuration of the probe unit, the continuity test method using the probe unit, and the method of manufacturing the probe unit.
1. Configuration of probe unit (first embodiment)
FIG. 1 is a diagram showing a first embodiment of a probe unit according to the present invention. FIG. 2 is a diagram showing a continuity test method using the probe unit according to the first embodiment of the present invention.

  As shown in FIGS. 1 and 2, the probe unit 1 according to the first embodiment of the present invention has a substrate 10 and a pitch of electrodes 60 of a specimen 6 such as an LCD (Liquid Crystal Display) panel on the surface of the substrate 10. And a plurality of conductors 12 formed in parallel at a narrow pitch. The substrate 10 is made of, for example, an insulating opaque material. The conducting wire 12 is made of a thin film having a certain thickness, has a certain width, and is formed on the substrate 10 so as not to protrude from the substrate 10. Accordingly, the distal end portion 16 serving as a contact portion that contacts the electrode 60 of the specimen 6 of each conductive wire 12 is formed on the substrate 10. The tip 18 of the edge portion 14 of the substrate observed when the probe unit 1 and the specimen 6 are aligned is a plane perpendicular to the surface of the substrate 10 on which the conducting wire 12 is formed, and the contact portion 16 of the substrate 10. Extending in the direction perpendicular to the arrangement direction, that is, the longitudinal direction of the conducting wires 12.

When the tip 18 of the edge 14 of the substrate is located on a virtual straight line that is at a short distance from the contact portion 16 of the conducting wire 12 and perpendicular to the arrangement direction of the contact portion 16, the electrode 60 and the tip 18 of the specimen 6 are placed under a microscope or the like. By adjusting the position while simultaneously observing with the imaging optical system, the electrode 60 of the specimen 6 and the contact portion 16 of the probe unit 1 can be accurately aligned indirectly. Therefore, in order to simultaneously observe the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 within the field of view of a microscope or the like, the distances a and b to the nearest contact portion 16 are adjacent to each other of the conductors 12 adjacent to each other. The tip 18 of the edge 14 is formed on virtual straight lines x ₁ and x ₂ that are shorter than the distance d between the centers of the contact portions 16 and perpendicular to the arrangement direction of the contact portions 16. Considering the workability of observation, it is preferable to set the distances a and b between the virtual straight lines x ₁ and x ₂ and the contact part 16 to ½ or less of the distance d between the centers of the contact parts 16, and 0 μm or more and 5 μm or less. More preferably, it is set to.

  Further, the thinner the tip 18 of the edge 14 of the substrate is, the clearer the enlarged image of the tip 18 and the electrode 60 of the specimen 6 is obtained in the imaging optical system. Therefore, in order to simultaneously fit the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 within the depth of field within the field of view of the imaging optical system, and simultaneously observe a clear image, the edge of the substrate The thickness of the tip 18 of 14 is made into 200 micrometers or less, for example. Desirably, the sum of the thickness of the tip 18 of the edge 14 of the substrate and the thickness of the conductor 12 is within 350 μm.

According to the present embodiment, the contact pressure between the contact portion 16 and the electrode 60 can be increased by forming the contact portion 16 in contact with the electrode 60 of the specimen 6 on the substrate 10.
Further, according to the present embodiment, the distances a and b from the contact portion 16 of the conducting wire 12 are shorter than the center-to-center distance d of the adjacent contact portions 16 and are on the imaginary straight lines x ₁ and x ₂ perpendicular to the arrangement direction of the contact portions 16. By forming the edge portion 14 of the substrate so that the tip 18 is positioned, the tip 18 and the electrode 60 of the specimen 6 are simultaneously placed in the field of view of the imaging optical system, and the position of the specimen 6 is adjusted while observing. 60 and the contact part 16 of the probe unit 1 can be indirectly accurately aligned. Further, by reducing the thickness of the tip 18 of the edge portion 14 of the substrate to within 200 μm, the electrode 60 of the specimen 6 and the tip 18 of the edge portion 14 of the substrate are simultaneously placed within the depth of field of the imaging optical system. A clear image can be observed. In addition, since the tip 18 of the substrate and the electrode 60 of the specimen 6 can be aligned at both ends of the substrate 10, the probe unit 1 is arranged so that the arrangement direction of the conducting wires 12 and the arrangement direction of the electrodes 60 are parallel to each other. The inclination with respect to the specimen 6 can be corrected.

  Furthermore, according to the present embodiment, the electrode 60 and the contact portion 16 of the probe unit 1 can be accurately and easily aligned by simultaneously observing the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6. Therefore, there is no need to mark the specimen 6 for alignment. Further, by setting the thickness of the tip 18 so that the tip 18 of the edge 14 of the substrate and the electrode 60 are within the depth of field of the imaging optical system, the tip 18 and the electrode of the edge 14 of the substrate are set. Therefore, it is not necessary to perform image processing or use a double focus camera in order to obtain a clear image. Therefore, the sample manufacturing system can be simplified and the manufacturing cost can be reduced.

(Second to fifth embodiments)
3 to 6 are views showing second to fifth embodiments of the probe unit according to the present invention.
In the second embodiment of the present invention, as shown in FIG. 3, two corners on the contact portion 16 side of the substrate 10 are removed, and a second end face 22 extending in a direction inclined with respect to the longitudinal direction of the conducting wire 12 is formed. It is formed on the edge 14 of the substrate. A portion 18 where the second end surface 22 and the end surface 21 on the contact portion 16 side of the conductive wire 12 of the substrate 10 intersect is a portion that is observed together with the electrode of the specimen, and corresponds to the tip of the edge portion recited in the claims.

  In the third embodiment of the present invention, as shown in FIG. 4, a semi-elliptical cutout portion 24 is formed in the vicinity of the contact portion 16 of the edge portion 14 of the substrate. The portion 18 of each notch 24 that is closest to the conducting wire 12 is a portion that is observed together with the electrode of the specimen, and corresponds to the tip of the edge portion recited in the claims. The portion of each notch 24 that is closest to the conducting wire 12 is arranged in the arrangement direction of the contact portions 16.

  In the fourth embodiment of the present invention, as shown in FIG. 5, the V-shaped cutout portion 26 has a contact portion 16a of the lead wire 12a on the outermost side of the substrate 10 and a contact portion of the lead wire 12b adjacent to the lead wire 12a. It is formed in the edge part 14 of a board | substrate so that it may be located between 16b. The innermost portion 18 of the notch 26 is a portion that is observed together with the electrode of the specimen in the imaging optical system, and corresponds to the tip of the edge portion recited in the claims.

  In the fifth embodiment of the present invention, as shown in FIG. 6, two through holes 28 penetrating the substrate 10 are formed in the vicinity of the contact portion 16 of the substrate 10 in the arrangement direction of the contact portion 16. The part 18 located on the innermost side of the edge of the substrate 10 surrounding the through hole 28 is a part observed together with the electrode of the specimen in the imaging optical system, and corresponds to the tip of the edge described in the claims.

  In order to form the tip of the edge portion 14 of the substrate observed together with the electrode of the specimen so as to be positioned on a virtual straight line at a short distance from the contact portion 16 of the conducting wire 12 and perpendicular to the arrangement direction of the contact portion 16, It is necessary to process a part at a close distance from the conductive wire 12 of the substrate 10. This processing step involves a risk of destroying the lead wire 12 because a part at a close distance from the lead wire 12 is processed. According to the second to fifth embodiments of the present invention, the local portion 18 at a close distance from the conductive wire 12 of the edge portion 14 of the substrate is set as a portion to be observed together with the electrode of the specimen, Thus, the substrate 10 may be processed only in the vicinity corresponding to the local portion of the edge 14 of the substrate, and the portion at a close distance from the conductive wire 12 of the substrate 10 may be processed locally. Accordingly, the conductor 12 is not easily broken in the process of processing the edge of the substrate 10, and the yield of the probe unit 1 is improved.

(Sixth embodiment)
FIG. 7 is a view showing a fifth embodiment of the probe unit according to the present invention.
As shown in FIG. 7, the probe unit 1 according to the fifth embodiment of the present invention includes a substrate 10 and a plurality of conductive wires 12 formed on the substrate 10 as in the first embodiment. Each conducting wire 12 is formed on the substrate 10 so as not to protrude from the substrate 10. The distal end portion 16 of each conducting wire 12 serves as a contact portion that comes into contact with the electrode of the specimen.

In this embodiment, an inclined surface 30 that is inclined so that the substrate 10 becomes thinner toward the tip side is opposite to the surface of the substrate 10 on which the conductor 12 is formed, in the vicinity of the side extending in the longitudinal direction of the conductor 12 of the substrate 10. Formed on the side. A portion 18 where the inclined surface 30 and the surface on which the conductive wire 12 of the substrate 10 is formed is a portion that is observed when the probe unit 1 and the specimen 6 are aligned, and corresponds to the tip of the edge portion according to claim. To do. Further, since the tip 18 of the edge 14 of the substrate and the electrode of the specimen are simultaneously accommodated in the field of view of the imaging optical system, the distances a and b to the nearest contact portion 16 are the centers of the contact portions 16 adjacent to each other. The tip 18 of the edge of the substrate 10 is formed on virtual straight lines x ₁ and x ₂ that are shorter than the distance d and perpendicular to the arrangement direction of the contact portions 16. The inclined surface 30 can be formed, for example, by removing the corners of the substrate using a grindstone manufactured according to the shape of the inclined surface 30.

According to the present embodiment, the distances a and b from the contact portion 16 of the conducting wire 12 are shorter than the center-to-center distance d between the contact portions 16 adjacent to each other, and on the virtual straight lines x ₁ and x ₂ perpendicular to the arrangement direction of the contact portions 16. By forming the edge portion 14 of the substrate so that the tip 18 is positioned, the tip 18 and the specimen electrode are simultaneously placed in the field of view of the imaging optical system, and the position is adjusted while observing. The contact portion 16 of the unit 1 can be accurately aligned indirectly. Further, even when the substrate 10 is thick, the front end of the substrate edge 14 is inclined by inclining the surface of the substrate edge 14 opposite to the conductor 12 so that the edge 14 of the substrate becomes thinner toward the tip 18. 18 and the electrode of the specimen can be simultaneously accommodated within the depth of field within the field of view of the imaging optical system, and a clear image can be observed at the same time.

(Seventh and eighth examples)
FIG. 8 is a front view showing seventh and eighth embodiments of the probe unit according to the present invention.
In the seventh embodiment of the present invention, as shown in FIG. 8A, in the vicinity of the side extending in the longitudinal direction of the conducting wire 12 of the substrate 10, a concave surface 32 that makes the substrate 10 thinner toward the tip side is formed. It is formed on the side opposite to the surface on which the conducting wire 12 is formed. A portion where the concave surface 32 and the surface on which the conductive wire 12 of the substrate 10 is formed is a portion that is observed when the probe unit 1 and the specimen 6 are aligned, and corresponds to the tip of the edge portion recited in the claims.

  In the eighth embodiment of the present invention, as shown in FIG. 8B, in the vicinity of the side extending in the longitudinal direction of the conductive wire 12 of the substrate 10, the inclined surface 30 is inclined so that the substrate 10 becomes thinner toward the tip side. Is formed on the opposite side of the surface of the substrate 10 on which the conducting wire 12 is formed. An end face 18 that is in contact with the inclined surface 30 and the surface on which the conductive wire 12 of the substrate 10 is formed, is perpendicular to the surface on which the conductive wire 12 of the substrate 10 is formed, and extends in the longitudinal direction of the conductive wire 12 of the substrate 10. Is a portion observed when the probe unit 1 and the specimen 6 are aligned, and corresponds to the tip of the edge portion recited in the claims.

(Ninth Example)
FIG. 9 is a view showing a ninth embodiment of the probe unit according to the present invention.
As shown in FIG. 9, the probe unit 1 according to the ninth embodiment of the present invention includes a substrate 10 and a plurality of conductive wires 12 formed on the substrate 10 as in the first embodiment. Each conducting wire 12 is formed on the substrate 10 so as not to protrude from the substrate 10. The distal end portion 16 of each conducting wire 12 serves as a contact portion that comes into contact with the electrode of the specimen.

In the present embodiment, a stepped surface 34 in which the substrate 10 becomes thinner toward the tip side is formed on the opposite side of the surface of the substrate 10 on which the conducting wire 12 is formed, in the vicinity of the side extending in the longitudinal direction of the conducting wire 12 of the substrate 10. ing. An end face 18 that is in contact with the inclined surface 30 and the surface on which the conductive wire 12 of the substrate 10 is formed, is perpendicular to the surface on which the conductive wire 12 of the substrate 10 is formed, and extends in the longitudinal direction of the conductive wire 12 of the substrate 10. Is a portion observed when the probe unit 1 and the specimen 6 are aligned, and corresponds to the tip of the edge portion recited in the claims. Further, in order to simultaneously observe the tip 18 of the edge 14 of the substrate and the electrode of the specimen within the visual field of the imaging optical system, the distances a and b to the nearest contact portion 16 are adjacent to each other. The tip 18 of the edge of the substrate 10 is formed on virtual straight lines x ₁ and x ₂ that are shorter than the center distance d and perpendicular to the arrangement direction of the contact portions 16.

According to the present embodiment, the distances a and b from the contact portion 16 of the conducting wire 12 are shorter than the center-to-center distance d between the contact portions 16 adjacent to each other, and on the virtual straight lines x ₁ and x ₂ perpendicular to the arrangement direction of the contact portions 16. By forming the edge portion 14 of the substrate so that the tip 18 is located, the tip 18 and the electrode of the specimen are simultaneously placed in the field of view of the imaging optical system, and the position is adjusted while observing. One contact portion 16 can be accurately aligned indirectly. Further, even when the substrate 10 is thick, the tip 18 and the electrode of the specimen are formed in a stepped manner on the side opposite to the conductive wire 12 of the edge 14 of the substrate so that the edge 14 of the substrate becomes thinner toward the tip 18 side. At the same time within the depth of field within the field of view of the imaging optical system, and at the same time, a clear image can be observed.

2. Continuity test method (first example)
A first embodiment of the continuity test method according to the present invention will be described with reference to FIGS.

  As shown in FIG. 2, when the probe unit 1 is used for the continuity test of the specimen 6, the probe unit 1 is fixed to the probe base 4 by attaching the substrate 10 to the probe base 4, thereby configuring the probe head 5. On the other hand, as shown in FIG. 10, the specimen 6 is placed on a table 7 that is movable in the arrangement direction and the longitudinal direction of the electrodes 60 in order to align the specimen 6 and the probe unit 1. On the opposite side of the probe unit 1 from the sample 6, the camera 8 is arranged at a position where the tip 18 of the edge 14 of the substrate and the electrode 60 of the sample 6 can be observed from a direction perpendicular to the upper surface of the sample 6. The camera 8 is connected to a monitor 9 and an image taken by the camera 8 is displayed on the monitor 9. Note that the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 may be observed with a microscope or the like instead of the camera 8. The probe head 5 is attached to a continuity test apparatus main body (not shown) having a lifting function in such a posture that the probe unit 1 contacts the sample 6 at a predetermined angle during the continuity test. The flexible printed circuit board 3 connected to the continuity testing device main body is joined to one end of each conductive wire 12 opposite to the contact portion 16.

  In the inspection, first, the probe head 5 is lowered with respect to the specimen 6 so that the conducting wire 12 of the probe unit 1 corresponds to the electrode 60 of the specimen 6 on a one-to-one basis. Next, the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 are photographed by the camera 8 from the opposite side of the specimen 6 of the probe unit 1, and the photographed image is displayed on the monitor 9 and observed. At this time, the tip 18 of the edge 14 of the substrate is located on a virtual straight line that is short from the contact portion 16 and perpendicular to the arrangement direction of the contact portion 16, and the thickness of the tip 18 is within the field of view of the camera 8. Since it is formed thin enough to be within the depth of field, the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 are simultaneously placed within the depth of field within the field of view of the camera 8 so that both are clear. Can be obtained. Next, by observing the monitor 9, the table 7 is moved and adjusted so that the distance between the tip 18 of the edge 14 on both sides of the substrate 10 and the electrode 60 of the specimen 6 becomes a predetermined length. The electrode 60 and the contact part 16 of the conducting wire 12 are indirectly aligned. Specifically, for example, when the distance between the tip 18 of the edge of the substrate 10 and the outermost conductive wire 12 is set to one half of the distance between the centers of the conductive wires 12, the edge of the substrate 10 The position of the specimen 6 and the probe unit 1 is adjusted so that the tip 18 is positioned between the adjacent electrodes 60. The position can be adjusted with higher accuracy by adjusting the position while measuring the distance between the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 using a micrometer. After the alignment between the contact portion 16 and the electrode 60, the probe unit 1 is overdriven with respect to the specimen 6, and a test signal is input to the probe unit 1 via the flexible printed circuit board 3 to perform a continuity test of the specimen 6.

  According to the present embodiment, the position of the front end 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 are adjusted while observing them simultaneously, so that the contact portion 16 of the lead 12 and the electrode 60 of the specimen 6 are indirectly accurate. Therefore, it is not necessary to mark the specimen 6 for alignment. In addition, since the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 can be simultaneously accommodated within the depth of field within the field of view of the camera 8 and a clear image of both can be obtained, the edge of the substrate can be obtained. The contact portion 16 of the probe unit 1 and the electrode 60 of the specimen 6 can be accurately aligned based on a clear image of the tip 18 of the portion 14 and the electrode 60. Since a clear image of the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6 can be obtained, there is no need to perform image processing or use a double focus camera in order to obtain a clear image.

(Second embodiment)
The second embodiment of the continuity test method according to the present invention is a continuity test method for examining a specimen having a protruding block-like electrode. FIG. 11 is a diagram showing a second embodiment of the continuity test method according to the present invention.

  As shown in FIG. 11, in this embodiment, the electrode 60 of the specimen 6 that contacts the contact portion 16 of the probe unit 1 protrudes from the wiring 62 of the specimen 6, and is not linear but is a block whose width is narrower than that of the wiring 62. Is. In the final alignment between the electrode 60 and the contact portion 16, first, while simultaneously observing the tip 18 of the edge 14 of the substrate 14 and the electrode 60 of the specimen 6 from the substrate 10 side of the probe unit 1, 60 is aligned in the electrode arrangement direction (X1, X2 direction in the figure). At the same time, the probe unit 1 or the contact unit side end 36 of the substrate 10 and the sample 6 are observed from the substrate 10 side of the probe unit 1 so that the contact unit side end 36 of the substrate 10 is positioned on the electrode 60. The specimen 6 is moved in the longitudinal direction of the wiring 62 (Y1, Y2 direction in the figure), and the contact portion 16 of the conducting wire 12 and the electrode 60 are aligned with the longitudinal direction of the wiring 62.

  According to the present embodiment, even if the electrode 60 of the specimen 6 is in a block shape, by observing the tip 18 of the edge 14 of the substrate and the electrode 60 of the specimen 6, the conductor 12 and the specimen 6 are arranged in the electrode arrangement direction. Simultaneously with the alignment of the electrode 60, the contact portion 16 of the lead wire 12 and the electrode 60 can be aligned in the longitudinal direction of the wiring 62 by aligning the contact portion side end 36 of the substrate 10 and the specimen 6. The part 16 and the electrode 60 can be easily and accurately aligned.

(Third embodiment)
The third embodiment of the continuity test method according to the present invention is a continuity test method for examining a specimen having a smaller block-like electrode. FIG. 12 is a diagram showing a third embodiment of the continuity test method according to the present invention.

  As shown in FIG. 12, in this embodiment, the electrode 60 of the specimen 6 protrudes from the wiring 62 of the specimen 6 and has a block shape in which the length of the wiring 62 in the longitudinal direction is further smaller than that of the second embodiment. In the final alignment between the electrode 60 and the contact portion 16 of the conducting wire 12, first, the probe unit 1 or the sample 6 is moved while observing the tip 18 of the edge 14 of the substrate and the wiring 62 of the sample 6, and the tip 18 and the wiring 62 are aligned in the arrangement direction of the electrodes. Next, while simultaneously observing the contact portion side end portion 36 of the substrate 10 and the sample 6, the probe unit 1 or the sample 6 is placed in the longitudinal direction of the wiring 62 so that the contact portion side end portion 36 of the substrate 10 corresponds to the electrode 60. The contact portion 16 of the conductive wire 12 and the electrode 60 are aligned in the longitudinal direction of the wiring 62.

3. Probe unit manufacturing method (first embodiment)
The first embodiment of the method for manufacturing the probe unit according to the present invention is a method for manufacturing the first embodiment of the probe unit according to the present invention.

FIGS. 13 to 18 are views showing a first embodiment of a method for manufacturing a probe unit according to the present invention.
First, as shown in FIG. 13, in order to produce six probe units from one substrate 10, a plurality of conductive wires 12 that respectively constitute the six probe units are formed on the surface of the substrate 10. For example, a square substrate having a width of 76.2 mm, a length of 76.2 mm, and a thickness of 1.25 mm to 2 mm is used as the substrate 10, and a glass plate, a synthetic resin plate, a ceramic plate, a silicon plate, a metal plate, or the like is used. Among these, it is preferable to use an insulating substrate such as a glass plate and a ceramic plate made of zirconia, alumina or the like. When a conductive substrate such as a metal plate is used, the substrate 10 having an insulating layer formed on the surface of the conductive substrate main body on which the conductive wires 12 are formed is used.

  For example, a specific method of forming the conductive wire 12 is to form a plating base layer on the entire surface of the substrate 10 first. Next, the plating base layer is exposed only at a portion corresponding to the conductive wire 12 to be formed, and the other portions are covered with a resist, and the exposed plating base layer is subjected to metal plating. Finally, unnecessary plating underlayers and resist other than the conductive wire portion are removed. In addition, metal plating may be performed after the plating base layer is formed in the pattern of the conductive wire 12 in advance by using a known patterning method such as patterning by photoetching or printing of conductive paste on the substrate. In order to make the conducting wire 12 have appropriate hardness and elasticity, a nickel alloy such as Ni, Ni-W, NiFe or a metallic glass is used as a metal material to be plated. Note that the conductive wire 12 may be formed on the substrate 10 after the substrate 10 is attached and fixed to a base plate for reinforcing the substrate 10.

  Next, as shown in FIG. 14, a protective film 44 is formed so as to cover the entire surface of the substrate 10 including the conductive wire 12. For example, epoxy resin, urethane resin, metal, glass or the like is used for the protective film 44, and the conductive wire 12 is protected when the substrate 10 is removed from the surface opposite to the conductive wire 12, and the protective film 44 is removed from the conductive wire 12. In this case, a material that does not damage the conductive wire 12 is used. Note that the protective film 44 is not necessarily formed.

  Next, as shown in FIG. 15, the substrate 10 is removed from the surface opposite to the conductor 12 by polishing or the like, and a sharp image of the tip of the edge of the substrate and the electrode of the specimen can be obtained by the imaging optical system. The substrate 10 is processed to a predetermined thickness. Examples of the method for removing the substrate 10 include sand blasting, cutting, grinding, chemical etching, dry etching, honing, and laser processing. In addition, if the conducting wire 12 is directly formed on the substrate 10 having a predetermined thickness in advance, this step can be omitted.

  Next, as shown in FIG. 16, the protective film 44 is removed. When the protective film 44 is a metal, it is removed by etching. When the protective film 44 is a resin, the protective film 44 is removed by dissolution with warmed N-methylpyrrolidone or the like, ashing, dry etching, or the like. When the protective film 44 is an inorganic substance such as calcium carbonate, it is removed by dissolution with nitric acid.

  Next, as shown in FIG. 17, the substrate 10 is divided at a position (dashed line shown in the figure) for forming a finished contour of the substrate, and the substrate 10 is divided into a portion corresponding to the probe unit and other unnecessary portions. As shown in FIG. 18, six probe units 1 can be manufactured from one substrate 10. Completion of the substrate including the edge portion 14 of the substrate where the tip 18 is located on a virtual straight line whose distance from the contact portion 16 of the conducting wire 12 is shorter than the distance between the centers of the adjacent contact portions 16 and perpendicular to the arrangement direction of the contact portions 16. The division position of the substrate 10 is set so as to form a contour of the shape.

  As a specific method for dividing the substrate 10, first, the surface of the substrate 10 opposite to the conductive wire 12 is attached to a glass substrate with UV tape or the like. Next, the glass substrate on which the substrate 10 is bonded is set in a cutting device, and the substrate 10 and the cutting device are aligned based on the plurality of conductive wires 12 constituting the six probe units 1. Next, from the conductive wire 12 side of the substrate 10 to the UV tape is cut according to the broken line shown in FIG. After cutting, the substrate 10 is peeled from the UV tape, and the substrate 10 is separated into a portion corresponding to the probe unit 1 and other unnecessary portions. Other division methods include, for example, sandblasting, cutting, grinding, chemical etching, dry etching, honing, and laser processing. Note that the substrate 10 may be divided before the protective film 44 is removed. In addition, after forming the conductive wire 12 on the substrate 10, the substrate 10 is cut from the conductive wire 12 side according to the position for forming the finished contour of the substrate, and the substrate 10 is polished from the opposite side to the conductive wire 12 until it is cut. Then, the substrate 10 may be divided into a part corresponding to the probe unit 1 and an unnecessary part by thinly processing.

  As shown in FIG. 2, the flexible substrate 3 is joined to the completed probe unit 1 at one end opposite to the contact portion 16 of the conducting wire 12 through an anisotropic conductive film (ACF) or the like.

(Second embodiment)
The second embodiment of the method for manufacturing a probe unit according to the present invention is a method for manufacturing any one of the second to fifth embodiments of the probe unit according to the present invention.
19 to 24 are views showing a second embodiment of the method of manufacturing the probe unit according to the present invention.

  First, as shown in FIG. 19, recesses 40 for forming the six completed contours of the substrate 10 are formed on one surface of the substrate 10 deeper than the final thickness of the substrate 10. Examples of the method for forming the recess 40 include mechanical processing such as milling, dry etching processing using a resist pattern, sand blast processing, and ion milling. The contour of the completed shape of the substrate 10 includes the contour of the notch or the through hole formed at the edge of the substrate. Since the concave portion 40 can be formed into an arbitrary shape by adjusting the resist pattern shape or the like, the concave portion 40 for forming the contour of the notch portion or the concave portion 40 for forming the contour of the through hole as necessary. Can be formed. The figure shows the outline of a second embodiment of the probe unit according to the present invention. The concave portion 40 may be formed in a shape for forming at least a part of the contour of the completed shape of the substrate 10, or may be formed so as to cross the surface of the substrate 10.

  The configuration of the substrate 10 on which the recess 40 is formed conforms to the first embodiment. When a ceramic plate is used for the substrate 10, the recess 40 may be processed before the substrate 10 is fired. When a metal plate is used for the substrate 10, a mold for molding the substrate 10 in which the recess 40 is formed in advance may be produced, and the recess 40 may be formed by casting using the mold. When a silicon plate is used for the substrate 10, the recess 40 may be formed by anisotropic etching.

  Next, as shown in FIG. 20, a plurality of conductive wires 12 are formed on portions corresponding to the six completed forms of the substrate 10. A specific method of forming the conducting wire 12 is the same as that of the first embodiment. Note that the recess 40 may be formed in the substrate 10 after the conductor 12 is formed before the recess 40 is formed in the substrate 10.

Next, as shown in FIG. 21, according to the first embodiment, a protective film 44 is formed so as to cover the entire surface of the substrate 10 including the conductive wire 12. At this time, the recess 40 is filled with the protective film 44.
Next, as shown in FIG. 22, the substrate 10 is removed from the surface opposite to the conductor 12 by polishing or the like, and the substrate 10 is processed to a predetermined thickness until reaching the protective film 44. By this processing, the recess 40 becomes a penetrating portion that penetrates the substrate 10. By forming the through portion, the substrate 10 is divided into six parts 11 corresponding to the completed form and other unnecessary parts 13, and the part 11 corresponding to the completed form and the unnecessary part 13 are connected by the protective film 44. And will not be separated. The specific method for removing the substrate 10 is in accordance with the first embodiment.

  Next, as shown in FIG. 23, the protective film 44 is removed according to the first embodiment. In this embodiment, when the protective film 44 is removed from the substrate 10, the portions 11 corresponding to the six completed shapes are separated from the unnecessary portion 13 of the substrate 10. When the portions 11 corresponding to the six completed shapes are separated from the unnecessary portion 13 of the substrate 10, as shown in FIG. 24, the plurality of conductive wires 12 are formed on the substrate 10 in which the notches 24 are formed in the edge portion 14 of the substrate. The probe unit 1 in which is arranged is completed.

  In addition, after performing the manufacturing method by the above-mentioned 1st Example, if a notch part or a through-hole is formed in the edge part of a board | substrate, the probe unit similar to the probe unit 1 manufactured by a present Example will be manufactured. be able to.

(Third embodiment)
The third embodiment of the probe unit manufacturing method according to the present invention is a method for manufacturing the sixth to ninth embodiments of the probe unit according to the present invention.
FIG. 25 is a front view showing a third embodiment of the probe unit manufacturing method according to the present invention.

First, a plurality of probe units are produced from one substrate 10 according to the manufacturing method of the first embodiment.
Next, as shown in FIG. 25, a part of the edge 14 of the substrate is removed from the opposite side of the edge 14 of the substrate from the conductive wire 12 by using a grindstone 38, and the edge 14 of the substrate is processed into a predetermined shape. . Specifically, first, the conducting wire 12 side of the probe unit 1 is attached to a glass substrate with UV tape, the glass substrate is set in a cutting device, and a part of the edge 14 of the substrate opposite to the conducting wire 12 is cut off. It removes with the grindstone 38 provided in. At this time, as shown in FIGS. 25A and 25C, if a grindstone 38 that is inclined so as to become thinner toward the tip is used, an inclined surface that is inclined so that the substrate 10 becomes thinner toward the tip 18 is formed. Formed on the edge 14 of the. As shown in FIG. 25B, when a grindstone 38 having a convex surface at the tip is used, a concave surface 32 that is inclined so that the substrate 10 becomes thinner toward the tip 18 is formed on the edge 14 of the substrate. As shown in FIG. 25C, when a prismatic grindstone 38 is used, a stepped surface 34 that thins the tip 18 side is formed on the edge 14 of the substrate.

  Note that a notch or a through hole may be further formed in the probe unit 1 obtained in this embodiment.

(A) is a top view which shows the 1st Example of the probe unit by this invention, (B) is the front view. (A) is a top view which shows the continuity test method using the probe unit by 1st Example of this invention, (B) is the side view. (A) is a top view which shows the 2nd Example of the probe unit by this invention, (B) is the front view. (A) is a top view which shows the 3rd Example of the probe unit by this invention, (B) is the front view. (A) is a top view which shows the 4th Example of the probe unit by this invention, (B) is the front view. (A) is a top view which shows the 5th Example of the probe unit by this invention, (B) is the front view. (A) is a top view which shows the 6th Example of the probe unit by this invention, (B) is the front view. It is a front view which shows the 7th and 8th Example of the probe unit by this invention. (A) is a top view which shows the 9th Example of the probe unit by this invention, (B) is the front view. It is a schematic diagram which shows the 1st Example of the continuity test method by this invention. (A) is a top view which shows the 2nd Example of the continuity test method by this invention, (B) is the side view. It is a side view which shows the 3rd Example of the continuity test method by this invention. (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 1st Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). (A) is a top view which shows the 2nd Example of the manufacturing method of the probe unit by this invention, (B) is the cc sectional view taken on the line of (A). It is a front view which shows the 3rd Example of the manufacturing method of the probe unit by this invention.

Explanation of symbols

  1 probe unit, 6 specimens, 10 substrate, 12 conductor, 14 substrate edge, 16 contact portion, 18 tip, 60 electrodes, a distance from contact portion to tip of substrate edge, b contact portion to substrate edge The distance to the tip of the part, d The distance between the centers of the contact parts

Claims (5)

A probe unit that is aligned with a specimen using an imaging optical system,
A substrate,
A plurality of conductive wires formed on the substrate;
A contact portion formed on each of the conductive wires and positioned on the substrate and in contact with the electrode of the specimen;
The tip is located on an imaginary straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions, and the thickness of the tip is the imaging optical system The edge of the substrate within a depth of field of
A probe unit comprising: A substrate,
A plurality of conductive wires formed on the substrate;
A contact portion formed on each of the conductive wires and positioned on the substrate and in contact with the electrode of the specimen;
The lead wire is arranged such that the tip is located on a virtual straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions, and becomes thinner toward the tip. An edge of the substrate having an inclined surface opposite to the substrate;
A probe unit comprising: A substrate,
A plurality of conductive wires formed on the substrate;
A contact portion formed on each of the conductive wires and positioned on the substrate and in contact with the electrode of the specimen;
The tip is located on an imaginary straight line that is shorter than the distance between the centers of the contact portions adjacent to each other and is perpendicular to the arrangement direction of the plurality of contact portions, and the step where the tip side is thinner is opposite to the conductor. An edge of the substrate formed on the side surface;
A probe unit comprising: A continuity test method for testing continuity of a specimen with a probe unit having a substrate and a conductor,
A continuity testing method comprising the step of aligning the conductive wire and the electrode by aligning the tip of the edge of the substrate and the electrode of the specimen while observing them. The tip of the edge of the substrate and the electrode are simultaneously accommodated within the depth of field within the field of view of the imaging optical system, and the tip of the edge of the substrate and the electrode of the specimen are observed. The continuity inspection method according to claim 4.

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