JP2006227142A - ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the strength of a region where a sealing material is formed and to keep a cell gap in the vicinity of the region at a constant thickness.
A liquid crystal display device includes an element substrate and a color filter substrate. The element substrate further includes a plurality of elements, that is, a frame-shaped seal portion, an injection port, a plurality of columnar spacers, and a plurality of convex portions formed simultaneously by etching a part of the element substrate. The element substrate and the color filter substrate are bonded to each other through a frame-shaped seal portion that is an element of the element substrate, and liquid crystal is sealed therein. Here, an adhesive is applied to an appropriate position on the frame-shaped seal portion. Thereby, according to this liquid crystal display device, since the frame-shaped seal portion is formed of glass or the like, it is possible to improve the strength of the periphery of the frame-shaped seal portion, that is, the outer periphery of the liquid crystal display device. In addition, the cell gap around the periphery can be kept constant.
[Selection] Figure 5

Description

  The present invention relates to an electro-optical device suitable for use in displaying various information.

  Conventionally, various electro-optical devices such as a liquid crystal display device, an organic electroluminescence display device, a plasma display device, and a field emission display device are known.

  A liquid crystal display device as an example of an electro-optical device includes a pair of substrates, and both the substrates are bonded together via a frame-shaped sealing material made of, for example, a photo-curing material, and the liquid crystal is interposed between the substrates. Is enclosed. Here, the liquid crystal is sealed between the two substrates through an opening provided at an appropriate position of the sealing material in the manufacturing process. In such a liquid crystal display device, a spacer is often provided at an appropriate position between the two substrates in order to keep the distance between the two substrates constant. An example of a liquid crystal display device having such a configuration is described in Patent Documents 1 and 2.

  Here, the liquid crystal display device according to Patent Document 1 has a plurality of columnar spacers formed integrally with a substrate made of glass or the like. In this method of manufacturing a liquid crystal display device, a columnar spacer is removed from one side of a substrate by etching (removing) a region other than a region where a plurality of columnar spacers are to be formed on a substrate made of glass or the like by a predetermined thickness. It is decided to form on the surface side. Thereby, since the substrate and the columnar spacer are integrally formed, there is an advantage that the columnar spacer is hardly peeled off from the substrate.

  Further, in the liquid crystal display device according to Patent Document 2, a conductive region for electrically connecting the wiring of the first substrate and the counter electrode of the second substrate is provided at an appropriate position of the sealing material. A first dummy pattern is provided at the position of the sealing material facing the conduction region. Thus, the distance between the first substrate and the second substrate, that is, the cell gap can be maintained uniformly over the entire surface of the liquid crystal panel.

JP 2001-296530 A JP 2003-84292 A

  However, in the above-described liquid crystal display device, since no spacer is provided in the region corresponding to the seal material, the region does not have sufficient strength against external force, and it is difficult to maintain a constant cell gap in that region. There is a problem such as.

  The present invention has been made in view of the above points, and is an electro-optical device capable of improving the strength of a region where a sealing material is formed and maintaining a constant cell gap in the vicinity of the region. It is an object to provide an apparatus, a manufacturing method thereof, and an electronic apparatus.

  In one aspect of the present invention, the electro-optical device includes a pair of substrates, and one of the pair of substrates is formed by a part of the one substrate and one surface of the one substrate. And an electro-optic material is disposed in a region defined by the pair of substrates and the frame-shaped seal portion.

  The electro-optical device includes a pair of opposing substrates. And one board | substrate among a pair of board | substrates has the frame-shaped seal | sticker part which is formed in a part of the said one board | substrate, and protrudes from one surface of the said one board | substrate. Here, it is preferable that at least one of the substrates is formed of a material such as glass or quartz. An electro-optical material is disposed in a region defined by the pair of substrates and the frame-shaped seal portion. For this reason, the frame-shaped seal portion has a function of holding the electro-optical material together with the pair of substrates. Accordingly, it is possible to improve the strength around the frame-shaped seal portion, that is, near the outer periphery of the electro-optical device. Here, if a frame-shaped seal portion formed of glass, quartz, or the like is applied to an electro-optical device, a frame-shaped seal material formed of a photocurable material or the like is applied to the electro-optical device. In comparison, the strength around the outer periphery of the electro-optical device is dramatically improved.

  In one aspect of the electro-optical device, the electro-optical material is a liquid crystal, the frame-shaped seal portion has a recess, and the recess is an opening for injecting the liquid crystal.

  According to this aspect, the electro-optic material can be a liquid crystal. Further, the frame-shaped seal portion has a recess formed by etching an appropriate position of the frame-shaped seal portion. The concave portion is an opening for injecting liquid crystal, that is, an injection port. As described above, since the injection port is formed at an appropriate position, the liquid crystal can be easily injected into the electro-optical device through the injection port.

  In another aspect of the electro-optical device, the one substrate includes a plurality of spacers formed in a part of the one substrate and having a columnar shape inside the frame-shaped seal portion. ing. As a result, not only the periphery of the frame-shaped seal portion but also the strength inside the frame-shaped seal portion can be improved, and the cell gap inside the frame-shaped seal portion can be stably maintained at a constant thickness. Can be held.

  In another aspect of the electro-optical device, the one substrate has a plurality of convex portions formed by a part of the one substrate, and the plurality of convex portions are the one substrate. The upper drive circuit is formed in a region to be mounted and at a position corresponding to the electrode portion of the drive circuit.

  According to this aspect, one substrate has a plurality of convex portions formed by a part of the one substrate. The plurality of convex portions correspond to the electrode portions (bumps) on the input side and the output side of the drive circuit (driver IC) in the region where the drive circuit (driver IC) on the one substrate is to be mounted. Formed in position. Therefore, wiring (for example, output wiring of a printed circuit board connected to an electronic device, data line, and routing wiring connected to a scanning line, etc.) is electrically connected to a driving circuit on a plurality of convex portions. , The same applies hereinafter), the electrode portions (bumps) on the input side and output side of the drive circuit (driver IC) and the corresponding wirings are electrically connected with high accuracy on each convex portion. Can be connected to each other, and the adjacent bumps can be prevented from being short-circuited.

  In another aspect of the electro-optical device, the other substrate of the pair of substrates has an electrode, and the driving circuit and the wiring connected to the driving circuit are formed on the one substrate. One end of the wiring is located on the frame-shaped seal portion and is in contact with one end of the electrode.

  According to this aspect, the other of the pair of substrates has electrodes (for example, a liquid crystal panel having a TFD element or the like corresponds to a scanning line, and a liquid crystal panel having a TFT element or the like corresponds to a silver point). Yes. On one of the substrates, a drive circuit (driver IC) and a wiring electrically connected to the drive circuit (driver IC) are formed, and one end of the wiring is on the frame-shaped seal portion. And is in contact with one end of the electrode. Thereby, wiring and an electrode can be electrically connected accurately and with high precision. Therefore, it is possible to effectively prevent the adjacent wirings from being short-circuited.

  In another aspect of the electro-optical device, the other substrate has flatness, a colored layer formed over the entire surface of the other substrate, and an entire surface on the colored layer. A protective layer formed, and an electrode formed on the protective layer, and an alignment film is formed on at least the plurality of spacers in the one substrate, and the thickness of the wiring and the frame The thickness of the frame-shaped seal portion and the thickness of the alignment layer and the total thickness of the spacers, and the thickness of the frame-shaped seal portion and the thickness of each spacer Each thickness is set to a different value.

  In this aspect, the other substrate has flatness, a colored layer formed over the entire surface of the other substrate, a protective layer formed over the entire surface on the colored layer, And an electrode formed on the protective layer. Further, in one substrate, an alignment film is formed on at least a plurality of spacers, and the total value of the thickness of the wiring and the frame-shaped seal portion, the thickness of the alignment film, and the thickness of each spacer. The thickness of the frame-shaped seal portion and the thickness of each spacer are set to different values so that the total value of the thicknesses matches. Thereby, the cell gap can be maintained at a constant thickness over the entire electro-optical device.

  In another aspect of the electro-optical device, the other substrate includes a colored layer formed on the other substrate corresponding to an inner side of the frame-shaped seal portion, and a protective layer formed on the colored layer. And an electrode formed on the part of the other substrate on which the colored layer is not formed and the protective layer, and one end of the electrode on the one substrate is formed on the frame-shaped seal portion. The wiring is located on the corresponding portion of the other substrate, and an alignment film is formed on at least the plurality of spacers, and the wiring is located on one end of the electrode and the frame-shaped seal portion. A gap is formed between one end of the electrode, and one end of the electrode and one end of the wiring are dispersedly arranged at a position corresponding to the gap with a diameter corresponding to the size of the gap. Up and down through the adhesive It is.

  In this aspect, the other substrate includes a colored layer formed on the other substrate corresponding to the inside of the frame-shaped seal portion, a protective layer formed on the colored layer, and the other on which the colored layer is not formed. And an electrode formed on the protective layer. In one substrate, one end of the electrode is located on a portion of the other substrate corresponding to the frame-shaped seal portion, and an alignment film is formed on at least a plurality of spacers. In addition, a gap is formed between one end of the electrode and one end of the wiring located on the frame-shaped seal portion, and one end of the electrode and one end of the wiring are positioned corresponding to the gap. In FIG. 2, the metal particles having a diameter corresponding to the size of the gap are vertically connected via an adhesive. Accordingly, one end of the electrode and one end of the wiring can be stably conducted in the vertical direction, and the cell gap can be kept constant over the entire electro-optical device.

  In a preferred example, the other substrate is made of glass and has a recess, a colored layer formed in the recess on the other substrate, and in the recess and on the colored layer. The formed protective layer, and the electrode formed on the part of the other substrate on which the concave portion is not formed and the protective layer can be provided.

  In addition, an electronic apparatus including the electro-optical device as a display unit can be configured.

  In another aspect of the present invention, a method for manufacturing an electro-optical device includes: etching a glass substrate; forming a frame-shaped seal portion on one surface of the glass substrate; and a driving circuit in the glass substrate. And an element forming step of simultaneously forming a plurality of convex portions in a region where the electrode portion of the drive circuit is located.

  In the above electro-optical device manufacturing method, the glass substrate is etched in the element forming step, so that a plurality of elements, that is, a frame-shaped seal portion, and the glass substrate are formed on one surface of the glass substrate. , A plurality of convex portions are simultaneously formed in a region where the drive circuit (driver IC) is to be mounted and in a region where the input side and output side electrode portions (bumps) of the drive circuit are located. Thereby, a man-hour reduction can be aimed at compared with the case where said several element is formed independently, respectively.

  In another aspect of the present invention, a method for manufacturing an electro-optical device includes a frame-shaped seal portion, an injection port for injecting liquid crystal, on one surface of the glass substrate by etching the glass substrate, An element forming step of simultaneously forming a plurality of columnar spacers and a plurality of convex portions, wherein the element forming step protrudes from one surface of the glass substrate in a region that does not contribute to display in the glass substrate; A frame-shaped seal portion is formed on the glass substrate, a plurality of columnar spacers are formed at appropriate positions at positions corresponding to the inside of the frame-shaped seal portion, and a driving circuit is to be mounted on the glass substrate. A plurality of convex portions are formed in the region and the region where the electrode portion of the driving circuit is located.

  In the above-described electro-optical device manufacturing method, the glass substrate is etched in the element forming step, thereby injecting a plurality of elements, that is, a frame-shaped seal portion and liquid crystal, onto one surface of the glass substrate. , A plurality of columnar spacers, and a plurality of convex portions are formed simultaneously. Thereby, a man-hour reduction can be aimed at compared with the case where said several element is formed independently, respectively. Further, in this manufacturing method, the frame-shaped seal portion is formed in the region that does not contribute to the display in the glass substrate so as to protrude from one surface of the glass substrate by the element forming step. The plurality of columnar spacers are formed at appropriate intervals at positions corresponding to the inside of the frame-shaped seal portion. Further, the plurality of convex portions are provided in a region where the drive circuit (driver IC) is to be mounted on the glass substrate and in a region where the input side and output side electrode portions (bumps) of the drive circuit (driver IC) are located. It is formed.

  The best mode for carrying out the present invention will be described below with reference to the drawings. In the following embodiments, the present invention is applied to a liquid crystal display device as an example of an electro-optical device. In the liquid crystal display device of each embodiment, a part of the lower substrate made of glass or the like is etched to form a frame-shaped seal portion or the like protruding from one surface of the lower substrate. Thereby, mainly, the strength around the outer periphery of the liquid crystal display device is improved, and the cell gap in the vicinity is stably held at a constant thickness.

[First embodiment]
(Configuration of liquid crystal display device)
First, the planar configuration of the liquid crystal display device according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view schematically showing a schematic configuration of the liquid crystal display device 100 of the first embodiment. FIG. 2 is a plan view schematically showing a schematic configuration of the element substrate 91 of the first embodiment. FIG. 3 is a plan view schematically showing a schematic configuration of the color filter substrate 92 of the first embodiment. In FIG. 1 and FIG. 2, a plurality of columnar spacers are formed inside the frame-shaped seal portion 1c, but the illustration thereof is omitted for the sake of space. In FIG. 3, a region E <b> 2 indicates a region of the frame-shaped seal portion 1 c formed on the element substrate 91 side.

  In FIG. 1, the liquid crystal display device 100 includes an element substrate 91 disposed on the back side of the paper and a color filter substrate 92 disposed on the front side of the paper in a part of the lower substrate 1 that is an element of the element substrate 91. A liquid crystal layer 4 is formed by sealing liquid crystal inside through a frame-shaped seal portion 1c (a portion surrounded by a broken line) formed. Here, the liquid crystal display device 100 is an active matrix driving method using a TFD (Thin Film Diode) element, and is a transmissive liquid crystal display device.

  In FIG. 1, a region where the pixel electrode 10 formed on the element substrate 91 side intersects with the scanning line 8 formed on the color filter substrate 92 side constitutes a sub-pixel region SG which is a minimum unit of display. . A region in which a plurality of sub-pixel regions SG are arranged in a matrix in the vertical direction and the horizontal direction in the drawing is an effective display region V (region surrounded by a two-dot chain line) that contributes to display. In the effective display area V, images such as letters, numbers, and figures are displayed. Further, a region defined by the outer periphery of the liquid crystal display device 100 and the effective display region V is a frame region 38 that does not contribute to display. Further, one side of the element substrate 91 is formed so as to protrude outward from one side of the color filter substrate 92. The overhang area 36 formed so as to overhang is an area where various driver ICs and the like are mounted.

  First, the planar configuration of the element substrate 91 will be described with reference to FIG. Here, in FIG. 2, a direction from one side 91 a of the element substrate 91 on the projecting region 36 side to the one side 91 c on the opposite side is a Y direction, and a direction from one side 91 d to one side 91 b on the opposite side is an X direction.

  The element substrate 91 includes a lower substrate 1, a plurality of data lines 32, a plurality of TFD elements 21, a plurality of pixel electrodes 10, a plurality of routing wirings 31, a plurality of external connection wirings 35, a plurality of Y driver ICs 33, and X A driver IC 34 is provided.

  The lower substrate 1 is made of a material such as glass or quartz. The lower substrate 1 has a plurality of convex portions 1a, a frame-shaped seal portion 1c, an injection port 1ca for injecting liquid crystal, and a plurality of columnar spacers 1d (see FIGS. 4 and 5). Yes. Each of these elements is simultaneously formed by etching a part of the lower substrate 1. Each of these elements is formed on one surface of the lower substrate 1, that is, the surface facing the color filter substrate 92.

  The plurality of convex portions 1a are formed at positions where the X and Y driver ICs are mounted in the overhang region 36 and protrude from one surface of the lower substrate 1 (see also FIG. 7). Specifically, each convex portion 1a has a position corresponding to each bump (electrode) 33a on the output side of each Y driver IC 33 and each bump 33b on the input side in the overhang region 36, and the output side of the X driver IC 34. Are formed at positions corresponding to the bumps (electrodes) 34a and the bumps 34b on the input side.

  The frame-shaped seal portion 1c has a frame-shaped planar shape. The frame-shaped seal portion 1c is formed outside the effective display region V, that is, in the frame region 38, and protrudes from one surface of the lower substrate 1 (see also FIGS. 5 and 6). The upper surface of the frame-shaped seal portion 1c has flatness.

  The injection port 1ca is used as an injection port for injecting liquid crystal into the liquid crystal display device 100 during the manufacturing process. The injection port 1ca is formed by removing (etching) a part of the seal portion 1c. That is, the injection port 1ca is formed by forming a recess in a part of the seal portion 1c. The injection port 1ca is formed at a substantially central position of the seal portion 1c corresponding to the side opposite to the overhang region 36 in the element substrate 91 (on one side 91c side of the element substrate 91). In addition, the position where the injection port 1ca is formed is not limited to the above position, and can be formed at an appropriate position of the seal portion 1c according to various specifications.

  The columnar spacer 1d protrudes from one surface of the lower substrate 1 and has a columnar shape (see FIG. 5). The upper surface of the columnar spacer 1d has flatness. The columnar spacer 1d has a function of maintaining the distance between the element substrate 91 and the color filter substrate 92, that is, the cell gap at a constant thickness. The planar position of the columnar spacer 1d will be described later.

  The plurality of data lines 32 are linear wirings extending in the Y direction, and are formed on the lower substrate 1 so as to extend from the extended region 36 to the effective display region V. One end of each data line 32 is located on each convex portion 1 a provided at a position corresponding to the bump 34 a on the output side of the X driver IC 34. Each data line 32 is formed at an appropriate interval and is electrically connected to each TFD element 21 provided corresponding to each pixel electrode 10. Each TFD element 21 is electrically connected to each pixel electrode 10 made of a transparent conductive material such as ITO (Indium-Tin Oxide). That is, each data line 32 is electrically connected to each pixel electrode 10 via each TFD element 21.

  The plurality of routing wirings 31 are formed on the lower substrate 1 corresponding to the frame region 38, and the main line portion 31a, the bent portion 31b that bends substantially at right angles to the main line portion 31a, and the end portion of the bent portion 31b. And the electrode portion 31c formed on the substrate.

  Each main line portion 31 a is formed so as to extend in the Y direction from the overhanging region 36 in the frame region 38. One end of each main line portion 31 a is located on each convex portion 1 a provided at a position corresponding to the bump 33 a on the output side of each Y driver IC 33. Each main line portion 31a is formed substantially parallel to each data line 32 and at an appropriate interval. Each bent portion 31 b extends in the frame region 38 to the seal portion 1 c located in the X direction and on the left and right. Each electrode portion 31c is formed on a flat seal portion 1c.

  The plurality of external connection wirings 35 are linear wirings and are formed on the lower substrate 1 corresponding to the overhanging region 36. Specifically, the plurality of external connection wirings 35 are provided at positions corresponding to the bumps 34b on the input side of the X driver IC 34 or the bumps 33b on the input side of the Y driver ICs 33 from one side 91a of the element substrate 91a. Further, it extends to above each convex part 1a. One end of each external connection wiring 35 is electrically connected to each bump 34 b on the input side of the X driver IC 34 and each bump 33 b on the input side of each Y driver IC 33. On the other hand, the other end side of the plurality of external connection wires 35 is electrically connected to one end side of an FPC (Flexible Printed Circuit) (not shown) that is electrically connected to an electronic device such as a mobile phone or an information terminal. ing.

  The plurality of Y driver ICs 33 include a plurality of conductive bumps 33 b on the input side and a plurality of conductive bumps 33 a on the output side, and are mounted on the overhang region 36 on the lower substrate 1. Has been. Each bump 33b on the input side of each Y driver IC 33 is electrically connected to one end side of the external connection wiring 35 formed on each convex portion 1a, while on the output side of each Y driver IC 33. Each bump 33a is electrically connected to one end of a main line portion 31a located on each convex portion 1a. Therefore, each Y driver IC 33 can output a scanning signal to each routing wiring 31.

  The X driver IC 34 includes a plurality of conductive bumps 34 b on the input side and a plurality of conductive bumps 34 a on the output side, and is mounted on the overhang region 36 on the lower substrate 1. Yes. Each bump 34b on the input side of the X driver IC 34 is electrically connected to one end side of each external connection wiring 35 formed on each convex portion 1a, while each bump on the output side of the X driver IC 34. The bump 34a is electrically connected to one end side of each data line 32 located on each convex portion 1a. Therefore, the X driver IC 34 can output a data signal to each data line 32.

  Next, the planar configuration of the color filter substrate 92 will be briefly described with reference to FIG. Here, on the color filter substrate 92, various elements, that is, the upper substrate 2 made of glass or the like, the plurality of colored layers 6, the black light shielding layer BM, the overcoat layer 18, the plurality of scanning lines 8, and the like are formed. However, in FIG. 3, only the scanning line 8 is illustrated for convenience. The configuration of elements other than the scanning line 8 will be described later.

  The plurality of scanning lines 8 are striped electrodes formed of a transparent conductive material, for example, ITO, and extending in the X direction. The length of each scanning line 8 in the X direction is the same as the horizontal width (length in the X direction) of the color filter substrate 92. Further, the vicinity of the left end portion or the vicinity of the right end portion of each scanning line 8 is disposed at a position corresponding to the seal portion 1c as shown in FIGS.

  FIG. 1 shows a state in which the element substrate 91 and the color filter substrate 92 having the above-described configuration are bonded together via a seal portion 1c formed on the element substrate 91 side. In the figure, the portion of the color filter substrate 92 near the left end or the right end of the scanning line 8 and the electrode portion 31c of the routing wiring 31 of the element substrate 91 are between the left side and the right side as shown. And both of them are in contact with each other on the sealing material 1c. That is, the vertical conduction between the portion of the color filter substrate 92 near the left end portion or the right end portion of each scanning line 8 and the electrode portion 31c of each routing wiring 31 of the element substrate 91 is as shown in the figure. And are realized alternately. As a result, each scanning line 8 of the color filter substrate 92 is electrically connected to each Y driver IC 33 located on the left and right sides of the drawing via the respective routing wirings 31 of the element substrate 91.

  Next, with reference to FIG. 4, a planar positional relationship between the plurality of columnar spacers 1d, the plurality of pixel electrodes 10, the plurality of TFD elements 21, the plurality of data lines 32, and the like will be described. FIG. 4 is a partially enlarged plan view showing a layout of the pixel electrode 10 and the like corresponding to two pixels. In FIG. 4, the minimum necessary elements of the color filter substrate 92 are also shown in order to grasp the relative positional relationship between the elements of the element substrate 91 and the elements of the color filter substrate 92. In FIG. 4, a region surrounded by a rectangular dot-and-dash line indicates one subpixel region SG.

  On the lower substrate 1, a pixel electrode 10 is formed for each sub-pixel region SG. Each pixel electrode group forming a column in the X direction is opposed to the colored layers 6R, 6G, 6B and one scanning line 8 (corresponding to a region surrounded by a two-dot chain line) formed on the color filter substrate 92 side. is doing. A TFD element 21 is formed on the lower substrate 1 and in the vicinity of the corner position of each pixel electrode 10. Each pixel electrode 10 is electrically connected to each corresponding TFD element 21. Data lines 32 are formed to extend in the Y direction between the pixel electrodes 10 on the lower substrate 1 and adjacent to each other in the X direction. Each data line 32 is electrically connected to each TFD element 21 located on the left side of the data line 32 in the drawing.

  A plurality of columnar spacers 1 d formed in a part of the lower substrate 1 are formed at positions that do not overlap the pixel electrode 10, the TFD element 21, and the data line 32 in a plane. Specifically, each columnar spacer 1d is formed between one data line 32 and a pixel electrode adjacent to the one data line 32 and not electrically connected. Furthermore, in other words, each columnar spacer 1 d is formed near the corner position of the pixel electrode 10. Therefore, each columnar spacer 1d is formed at a position facing the black light-shielding layer BM (region surrounded by the alternate long and short dash line) formed on the color filter substrate 92 side. Each columnar spacer 1d is formed to have a circular planar shape. Here, the size (diameter) of each columnar spacer 1d can be set to about 13 μm, for example. In the present invention, the planar shape of each columnar spacer 1d is not limited to a circular shape as described above, and may be various known shapes such as an ellipse and a polygon.

  Next, a cross-sectional configuration of the liquid crystal display device 100 will be described with reference to FIGS. FIG. 5 is a cross-sectional view taken along the cutting line A-A ′ of the liquid crystal display device 100 in FIG. 1. FIG. 6 is a cross-sectional view taken along the cutting line BB ′ of the liquid crystal display device 100 in FIG. 1, and in particular, the electrode portion 31c of the lead-out wiring 31 and the scanning line 8 are arranged on the frame-shaped seal portion 1d. It shows a state of conducting vertically.

  On the inner surface of the lower substrate 1, a frame-shaped seal portion 1c, a plurality of columnar spacers 1d, a bent portion 31b of the routing wiring 31, an electrode portion 31c of the routing wiring 31, a plurality of data lines 32, a plurality of TFD elements 21 and a plurality of pixel electrodes are respectively formed. The frame-shaped seal portion 1c and the plurality of columnar spacers 1d are formed by etching a part of the lower substrate 1 as described above.

  The frame-shaped seal portion 1c is formed at a position corresponding to the frame region 38, and protrudes toward the color filter substrate 92 as a counter substrate. The thickness D5 of the frame-shaped seal portion 1c can be set to about 1 to 15 μm, for example. Further, as shown in FIG. 5, the bent portion 31 b of the routing wiring 31 extends from the vicinity of the effective display region V to the top of the seal portion 1 c in the frame region 38. For this reason, the terminal part of the bent part 31c, that is, the electrode part 31c is located on the seal part 1c having flatness as shown in FIGS.

  Each pixel electrode 10 is formed for each sub-pixel region SG. Each TFD element 21 and each data line 32 are formed between adjacent pixel electrodes 10, respectively. Each pixel electrode 10 is electrically connected to each data line 32 via a corresponding TFD element 21. Each columnar spacer 1d is formed between adjacent pixel electrodes 10 and protrudes toward the color filter substrate 92 in the same manner as the frame-shaped seal portion 1c.

  An alignment film (not shown) is formed on the inner surfaces of the lower substrate 1, the columnar spacer 1 d, the pixel electrode 10, the TFD element 21, the data line 32, and the like.

  Further, as described above, the X driver IC 34 and the plurality of Y driver ICs 33 are mounted on the inner surface of the lower substrate 1 corresponding to the overhang region 36. Here, with reference to FIG. 7A, the electrical configuration of the input-side bump 34b of the X driver IC 33 and the external connection wiring 35 will be described. FIG. 7A is a cross-sectional view taken along the cutting line C-C ′ of the liquid crystal display device 100 in FIG. 1.

  On the lower substrate 1 corresponding to the overhanging region 36, a plurality of protruding convex portions 1a are formed. Each convex portion 1 a is formed at a position corresponding to each bump 34 b on the input side of the X driver IC 34. For this reason, the recessed part 1b is formed between the adjacent convex parts 1a. The upper surface of each convex part 1a has flatness. The plurality of convex portions 1 a and concave portions 1 b are formed by etching a part of the lower substrate 1. The width D3 of each protrusion 1a and the width D4 of each recess 1b are determined by the size of each bump 34b of the X driver IC 34 applied to the liquid crystal display device 100 and the pitch between adjacent bumps 34a. The width D3 of each convex part 1a and the width D4 of each concave part 1b can be about 10 μm, for example. Moreover, the thickness D2 of each convex part can be about 1-15 micrometers, for example.

  An external connection wiring 35 is formed on each convex portion 1 a, and each bump 34 b on the input side of the X driver IC 34 is in contact with the corresponding external connection wiring 35. In other words, each bump 34b on the input side of the X driver IC 34 and the corresponding external connection wiring 35 are electrically connected. The X driver IC 34 is mounted on the overhang region 36 through an adhesive 70 applied in the plurality of recesses 1b and the like.

  In the present invention, when the X driver IC 34 for high definition is mounted (that is, when the X driver IC 34 having a structure in which the pitch between adjacent bumps 34b is extremely narrow is mounted), the X driver IC 34 is As shown in FIG. 7B, it may be mounted on the overhang region 36 via an adhesive 70 having a plurality of metal particles 7. Thereby, each bump 34b on the input side of the X driver IC 34 and the corresponding external connection wiring 35 can be accurately electrically connected. Further, in this case, the plurality of metal particles 7 positioned in the recess 1b fall into the recess 1b because the density thereof is higher than the adhesive 70, and the adjacent bumps 34b are short-circuited through the plurality of metal particles 7. There is no such thing.

  Note that the electrical configuration of the bumps 34a on the output side of the X driver IC 34 and the data line 32 is the same as that described above, and therefore illustration and description thereof are omitted. Also, the electrical configuration of the bumps 33b on the input side of the Y driver IC 33 and the external connection wiring 35, and the electrical configuration of the bumps 33a on the output side of the Y driver IC 33 and the routing wiring 31 are also provided. Since it is the same as that of the above-mentioned composition, illustration and explanation are omitted.

  On the other hand, on the inner surface of the upper substrate 2, colored layers 6R, 6G, and 6B made of any of the three colors R (red), G (green), and B (blue) are formed for each sub-pixel region SG. ing. A color filter is constituted by the colored layers 6R, 6G, and 6B. A pixel region G indicates a region for one color pixel composed of R, G, and B sub-pixels. Each thickness of the colored layers 6R, 6G, and 6B can be set to about 0.8 μm, for example. In the following description, when referring to a colored layer regardless of color, it is simply referred to as “colored layer 6”, and when referring to a colored layer by distinguishing colors, it is referred to as “colored layer 6R” or the like.

  A black light shielding layer BM is formed at a position on the inner surface of the upper substrate 2 and for partitioning each colored layer 6 in order to prevent light from entering from one subpixel to the other subpixel. The black light shielding layer BM can be made of a black resin material, for example, a black pigment dispersed in a resin. In the present invention, instead of this, an overlapping light shielding layer (not shown) formed by overlapping R, G, and B colored layers may be used.

  An overcoat layer 18 made of a transparent resin or the like is formed on the colored layer 6 and the black light shielding layer BM. The thickness of the overcoat layer 18 can be, for example, about 2.6 μm. The overcoat layer 18 has a function of protecting the colored layer 6 from corrosion and contamination caused by chemicals used during the manufacturing process of the color filter substrate 92. Striped scanning lines 8 are formed on the inner surface of the overcoat layer 18.

  As shown in FIGS. 5 and 6, the portion in the vicinity of one end side of the scanning line 8 is in contact with the electrode portion 31 c of the routing wiring 31 on the frame-shaped seal portion 1 c, and both of them are electrically connected. It is connected. That is, the portion in the vicinity of one end side of the scanning line 8 and the electrode portion 31c of the lead wiring 31 are vertically connected on the seal portion 1c. In the example of FIG. 5, the frame-shaped seal portion 1 c is formed so as to stand in a substantially vertical direction with respect to the inner surface of the lower substrate 1. The seal portion 1c may be formed in a tapered shape so that the portion is enlarged in the region E1. By doing so, the routing wiring 31 can be easily and accurately formed on the frame-shaped seal portion 1c, and the yield can be improved. An alignment film (not shown) is formed on the inner surface of the overcoat layer 18 and the scanning line 8.

  The element substrate 91 and the color filter substrate 92 are bonded together via a frame-shaped seal portion 1c as shown in FIGS. In the frame-shaped seal portion 1c, an adhesive 70 is applied or printed on a portion where the electrode portion 31c is not formed.

  A polarizing plate 14 is disposed on the outer surface of the lower substrate 2, and a polarizing plate 12 is disposed on the outer surface of the upper substrate 2. In addition, an illumination device, that is, a backlight 15 is disposed below the polarizing plate 14. The backlight 15 is preferably a point light source such as an LED (Light Emitting Diode) or a combination of a linear light source such as a cold cathode fluorescent tube and a light guide plate.

  In particular, in the liquid crystal display device 100, the total thickness of the electrode portion 31c and the frame-shaped seal portion 1c matches that of the frame-shaped seal portion 1c so that the total thickness of the alignment film (not shown) and the columnar spacer 1d matches. The thickness and the thickness of each columnar spacer 1d are adjusted to be different. For this reason, the cell gap has a constant thickness over the entire liquid crystal display device 100. As the method, when forming the frame-shaped seal portion 1c and the plurality of columnar spacers 1d, the frame-shaped seal portion 1c is etched more times than the plurality of columnar spacers 1d. Can be realized.

  Now, when transmissive display is performed in the liquid crystal display device 100 of the present embodiment, the illumination light emitted from the backlight 15 travels along the path T shown in FIG. 5, and the pixel electrodes 10, the scanning lines 8, and the coloring. It passes through the layer 6 etc. and reaches an observer. In this case, the illumination light has a predetermined hue and brightness by passing through the colored layer 6. Thus, a desired color display image is visually recognized by the observer.

  Next, functions and effects of the liquid crystal display device 100 according to the first embodiment will be described.

  The liquid crystal display device 100 of the first embodiment has a frame-shaped seal portion 1c formed by etching a part of the lower substrate 1 made of glass or the like. The frame-shaped seal portion 1 c is formed at a position corresponding to the frame region 38 near the outer periphery of the liquid crystal display device 100 and is formed so as to protrude toward the color filter substrate 92. Thereby, the strength of the periphery of the frame-shaped seal portion 1c, that is, the vicinity of the outer periphery of the liquid crystal display device 100 can be improved. That is, if the frame-shaped seal portion 1c of the first embodiment is applied to a liquid crystal display device, compared to a case where a frame-shaped seal material formed of a photocurable material or the like is applied to a liquid crystal display device, The strength around the periphery of the liquid crystal display device is dramatically improved.

  In addition, in the liquid crystal display device 100, the frame-shaped seal portion 1c is formed by removing unnecessary portions of the lower substrate 1 made of glass or the like having flatness. The upper surface of the part 1c has flatness. Thereby, the cell gap around the frame-shaped seal portion 1c, that is, near the outer periphery of the liquid crystal display device 100, can be maintained at a constant thickness. Therefore, for example, even when an external force is applied near the outer periphery of the liquid crystal display device 100, the cell gap near the outer periphery of the liquid crystal display device 100 can be stably held at a constant thickness.

  Moreover, in 1st Embodiment, the injection port 1ca is formed in the position by etching the appropriate position of the frame-shaped seal part 1c. Thereby, the liquid crystal can be easily injected into the liquid crystal display device 100 through the injection port 1ca.

  In the first embodiment, on the frame-shaped seal portion 1c that protrudes toward the color filter substrate 92, the electrode portion 31c of the routing wiring 31 formed on the element substrate 91 side and the color filter substrate 92 side are formed. The scanning line 8 is brought into contact with each other so that they are electrically connected. Thereby, the electrode part 31c of the routing wiring 31 and the scanning line 8 can be electrically connected accurately and with high accuracy. Therefore, it is possible to effectively prevent the adjacent electrode portions 31c from being short-circuited.

  In the liquid crystal display device 100 of the first embodiment, a part of the lower substrate 1 made of glass or the like is etched at a position corresponding to each bump of the X driver IC 34 and the Y driver IC 33 in the overhang region 36 in the element substrate 91. A plurality of convex portions 1a formed by doing so are provided. In the first embodiment, the bumps 34b on the output side of the X driver IC 34 and the external connection wiring 35 are electrically connected to the projections 1a, and the inputs of the X driver IC 34 are input. The respective bumps 34a on the side and the data lines 32 are electrically connected. The bumps 1 b on the output side of the Y driver IC 33 and the external connection wiring 35 are electrically connected to the bumps 1 a on the input side of the Y driver IC 33 and routed to the bumps 33 a on the input side of the Y driver IC 33. The wiring 31 is electrically connected. Thus, each bump of the X driver IC 34 and the external connection wiring 35 or the data line 32 can be electrically connected accurately and with high precision, and it is possible to prevent adjacent bumps from being short-circuited. it can. Further, each bump of the Y driver IC 33 and the external connection wiring 35 or the routing wiring 31 can be electrically connected accurately and with high precision, and the adjacent bumps can be prevented from being short-circuited. .

  Further, the liquid crystal display device 100 of the first embodiment is formed at a predetermined position inside the frame-shaped seal portion 1c at a part of the lower substrate 1, protrudes toward the color filter substrate 92, and has an upper surface. A plurality of columnar spacers 1d having flatness are provided. Thereby, the cell gap inside the frame-shaped seal | sticker part 1c can be hold | maintained to fixed thickness. Therefore, in the liquid crystal display device 100, the cell gap can be maintained at a constant thickness over the entire liquid crystal display device 100 by the frame-shaped seal portion 1c and the plurality of columnar spacers 1d. In the first embodiment, each columnar spacer 1d is formed at a position that does not overlap the pixel electrode 10 and the like and at a position corresponding to the black light shielding layer BM. Thereby, it is possible to prevent light leakage from occurring near the columnar spacer 1d.

[Second Embodiment]
Next, a liquid crystal display device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view schematically showing a schematic configuration of the liquid crystal display device 200 according to the second embodiment, and is a cross-sectional view corresponding to FIG. 5 of the first embodiment.

  Comparing the second embodiment and the first embodiment, they are mainly different in the configuration of the color filter substrate. For this reason, below, the same code | symbol is attached | subjected about the element same as 1st Embodiment, and the description is abbreviate | omitted or simplified.

  In FIG. 8, the configuration of the element substrate 91 is the same as that of the first embodiment, and therefore the description thereof is omitted. Next, the configuration and the like of the color filter substrate 94 of the second embodiment will be described in comparison with the color filter substrate 92 of the first embodiment.

  In the first embodiment, the colored layer 6 and the black light shielding layer BM are formed over the entire inner surface of the upper substrate 2 and at appropriate positions. An overcoat layer 18 is formed over the entire inner surface of the colored layer 6 and the black light shielding layer BM. Further, stripe-like scanning lines 8 are formed on the inner surface of the overcoat layer 18 and at least overlapping with the row of pixel electrodes 10, and the length of each scanning line 8 (the cut in FIG. 5). The length in the direction) matches the lateral width of the upper substrate 2 (the length in the cutting direction in FIG. 5). That is, each scanning line 8 extends from a position corresponding to the left end of the color filter substrate 92 to a position corresponding to the right end of the color filter substrate 92 in FIG. In the first embodiment, the alignment film is formed on the inner surface of the scanning line 8 or the like.

  On the other hand, in the second embodiment, the colored layer 6 and the black light shielding layer BM are formed on the inner surface of the upper substrate 2 corresponding to the inside of the frame-shaped seal portion 1c. An overcoat layer 18 is formed on a part of the inner surface of the upper substrate 2 corresponding to the inside of the frame-shaped seal portion 1c and on the inner surfaces of the colored layer 6 and the black light shielding layer BM.

  Further, stripe-like scanning lines 8 are formed on the inner surfaces of the upper substrate 2 and the overcoat layer 18 and at least overlapping the pixel electrodes 10 in the respective rows, and the lengths ( The length in the cutting direction in FIG. 8 is smaller than the lateral width of the upper substrate 2 (length in the cutting direction in FIG. 8). That is, in the example of FIG. 8, one scanning line 8 is formed from a position corresponding to the frame-shaped seal portion 1c located on the left side of the paper to a position corresponding to the vicinity of the columnar spacer 1d located on the right side of the paper. Yes. That is, the right end portion of one scanning line 8 is not formed up to a position corresponding to the frame-shaped seal portion 1c existing on the right side of the sheet. The other scanning lines 8 adjacent to one scanning line 8 have a configuration in which the cross-sectional configuration of the one scanning line 8 is reversed left and right. That is, the right end portion side of the other scanning line 8 is formed up to a position corresponding to the frame-shaped seal portion 1c that is present on the right side of the paper, although not shown, and the left end portion of the other scanning line 8 The side is formed up to a position corresponding to the vicinity of the columnar spacer 1d existing on the left side of the drawing. For this reason, in the second embodiment, the left end portions or the right end portions of the plurality of scanning lines 8 are alternately formed up to positions corresponding to the frame-shaped seal portions 1c. In the second embodiment, an alignment film is formed on the inner surface of the scanning line 8 or the like.

  The element substrate 91 and the color filter substrate 94 are bonded together via a frame-shaped seal portion 1c that is an element of the element substrate 91, and the liquid crystal layer 4 is sealed between the two substrates. Here, an adhesive 70 (conductive backing agent) formed by dispersing and arranging a plurality of metal particles 7 is applied or printed on the frame-shaped seal portion 1c. Therefore, in the second embodiment, one end of the scanning line 8 that exists at a position corresponding to the frame-shaped seal portion 1c on the left side of the paper is a plurality of parts included in the adhesive 70 on the frame-shaped seal portion 1c. Via the metal particles 7, the electrode part 31 c of the routing wiring 31 formed on the element substrate 91 side is vertically connected.

  On the other hand, in the first embodiment, on the frame-shaped seal portion 1c, the electrode portion 31c of the routing wiring 31 formed on the element substrate 91 side and the scanning line 8 formed on the color filter substrate 92 side are The contact is made without passing through the plurality of metal particles 7. As described above, the vertical conduction method between the electrode portion 31c of the routing wiring 31 and the scanning line 8 is different between the second embodiment and the first embodiment as follows.

  First, in the first embodiment, at least the distance from the inner surface of the upper substrate 2 to the upper surface of the columnar spacer 1d on which a thin alignment film is formed, and the inner surface of the upper substrate 2 are frame-shaped. The distance to the upper surface of the electrode part 31c formed on the seal part 1c is a fixed length D6. Moreover, the upper surface of the electrode portion 31c and the upper surface of the columnar spacer 1d are set on the same plane. For this reason, even when the element substrate 91 and the color filter substrate 92 are bonded together, there is no gap between the electrode portion 31c and the scanning line 8 at a position corresponding to the frame-shaped seal portion 1c. Therefore, in the first embodiment, there is no problem even if a plurality of metal particles 7 are not interposed between the electrode portion 31c and the scanning line 8 and both are brought into contact with each other to establish vertical conduction.

  On the other hand, in the second embodiment, the distance from at least the inner surface of the upper substrate 2 to the upper surface of the columnar spacer 1d having a thin alignment film formed on the surface is a constant length D6 as in the first embodiment. It has become. However, when the element substrate 91 and the color filter substrate 94 are bonded to each other in the second embodiment, the colored layer 6 or the color layer 6 or Since the overcoat layer 18 and the like are not formed, a gap having a certain distance D7 (<D6) is formed at that position. The upper surface of the electrode portion 31c and the upper surface of the columnar spacer 1d having a thin alignment film formed on the surface are on the same plane as in the first embodiment. Therefore, in the second embodiment, metal particles 7 having a diameter D7 corresponding to the size of the gap are mixed in the adhesive 70, and the adhesive 70 is applied or printed on the frame-shaped seal portion 1c. Thus, the electrode part 31 c and the scanning line 8 are vertically connected through the metal particles 7 contained in the adhesive 70. It should be noted that in the portion on the frame-shaped seal portion 1 c that does not require vertical conduction, the portion on the frame-shaped seal portion 1 c and the inner surface of the upper substrate 2 are bonded to the adhesive 70 having a plurality of metal particles 7. Are pasted together.

  Thus, in the present invention, the color filter substrate 94 having the configuration as in the second embodiment is also applicable. In addition, the other effect of this invention based on 2nd Embodiment is the same as that of 1st Embodiment.

[Third embodiment]
Next, with reference to FIG. 9 etc., the liquid crystal display device of 3rd Embodiment which concerns on this invention is demonstrated. FIG. 9 is a cross-sectional view schematically showing a schematic configuration of the liquid crystal display device 300 according to the third embodiment, and is a cross-sectional view corresponding to FIG. 5 of the first embodiment.

  As in the second embodiment, the third embodiment is different from the first embodiment in the configuration of the color filter substrate. Therefore, below, the same code | symbol is attached | subjected about the element same as 1st Embodiment, and the description is abbreviate | omitted or simplified.

  In FIG. 9, the configuration of the element substrate 91 is the same as that of the first embodiment, and thus the description thereof is omitted. Next, the configuration of the color filter substrate 96 according to the third embodiment will be described.

  In the color filter substrate 96 of the third embodiment, the concave portion 2a is formed in the upper substrate 2 at a position where the colored layer 6, the black light shielding layer BM, and the overcoat layer 18 are formed. The recess 2a is formed by etching a part of the upper substrate 2 made of glass or the like. A colored layer 6 and a black light shielding layer BM are formed on the inner surface of the upper substrate 2 corresponding to the recess 2a, and an overcoat layer 18 is formed on the inner surfaces of the colored layer 6 and the black light shielding layer BM. Is formed. The inner surface of the upper substrate 2 where the recess 2a is not formed and the inner surface of the overcoat layer 18 formed at a position corresponding to the recess 2a are on the same plane. In addition, scanning lines 8 are formed on the inner surface of the upper substrate 2 where the recesses 2a are not formed and on the inner surface of the overcoat layer 18 formed at positions corresponding to the recesses 2a. An alignment film (not shown) is formed on the inner surface of the line 8 or the like.

  The element substrate 91 and the color filter substrate 96 are bonded together via a frame-shaped seal portion 1c that is an element of the element substrate 91, and the liquid crystal layer 4 is sealed between the two substrates. Here, the adhesive 70 is applied or printed on the frame-shaped seal portion 1c excluding the portion where the electrode portion 31c is formed. Also, one end of the scanning line 8 located at a position corresponding to the frame-shaped seal portion 1c is connected to the electrode portion 31c of the routing wiring 31 formed on the frame-shaped seal portion 1c, as in the first embodiment. Contact, that is, vertical conduction.

  By the way, in the third embodiment, at least a columnar spacer in which a thin alignment film is formed on the surface from the inner surface of the scanning line 8 corresponding to the position of the recess 2a and having a thin alignment film formed on the surface. The distance to the upper surface of 1d and the distance from the inner surface of the upper substrate 2 corresponding to the position where the recess 2a is not formed to the upper surface of the electrode portion 31c formed on the frame-shaped seal portion 1c are constant. The length is D9. Here, the fixed length D9 corresponds to the thickness of the scanning line 8 having a thin alignment film formed on the surface. In addition, the upper surface of the electrode portion 31c and the upper surface of the columnar spacer 1d having a thin alignment film formed on the surface are on the same plane. For this reason, even when the element substrate 91 and the color filter substrate 96 are bonded together, similarly to the first embodiment, scanning is performed with the electrode portion 31c at the vertical conduction position, that is, at the position corresponding to the frame-shaped seal portion 1c. There is no gap between the line 8.

  Thus, in the present invention, the color filter substrate 96 having the configuration as in the third embodiment is also applicable. In addition, the other effect of this invention based on 3rd Embodiment is the same as that of 1st Embodiment.

[Method of manufacturing liquid crystal display device]
Next, a method for manufacturing a liquid crystal display device according to the present invention will be described with reference to FIGS. FIG. 10 is a flowchart of a method for manufacturing a liquid crystal display device according to the present invention. FIG. 11 is a flowchart corresponding to step S1 of FIG. 10, and shows a method for manufacturing an element substrate. 12 to 16 are a plan view and a cross-sectional view showing a manufacturing process of the element substrate. In FIG. 12, an area surrounded by a two-dot chain line indicates an effective display area V that contributes to display. 14 to 16, the illustration of the plurality of columnar spacers 1d is omitted for convenience.

  First, an element substrate common to the first to third embodiments described above is manufactured (step S1). Specifically, a glass substrate (not shown) made of a glass material or the like is prepared, and then the glass substrate is etched by a well-known method, as shown in FIG. A lower substrate 1 is manufactured by simultaneously forming a frame-shaped seal portion 1c made of a part of the material, an injection port 1ca, a plurality of columnar spacers 1d, and a plurality of convex portions 1a (step P1). Thus, the manufacturing method of the present invention is characterized in that a part of the glass substrate is used and etched to form the plurality of elements at the same time. Thereby, a man-hour reduction can be aimed at compared with the case where said several element is formed independently, respectively.

  In FIG. 12, a frame-shaped seal portion 1c, a plurality of columnar spacers 1d, and a plurality of convex portions 1a are formed so as to protrude toward the front side of the sheet. The frame-shaped seal portion 1c is formed in the frame region 38 so as to have a frame-shaped planar shape. The injection port 1ca is formed by forming a recess at a substantially central portion of the frame-shaped seal portion 1c located on the opposite side to the overhang region 36. The plurality of columnar spacers 1d are formed inside the frame-shaped seal portion 1c. In particular, the plurality of columnar spacers 1d formed in the effective display region V have positions corresponding to the vicinity of the corner positions of each pixel electrode 10 when the pixel electrode 10 is formed in the effective display region V. Formed. The plurality of convex portions 1a are formed in the region 34x where the X driver IC 34 in the overhang region 36 is to be mounted, in the regions 34ax and 34bx where the bumps 34a and 34b of the X driver IC 34 are to be formed, and in the Y of the overhang region 36. In the region 33x where the driver IC 33 is to be mounted, the bumps 33a and 33b of the Y driver IC 33 are formed in the regions 33ax and 33bx where the driver IC 33 is to be formed, respectively.

  Here, with reference to FIG. 13, an example of a method for etching a portion of the glass substrate corresponding to the cross-sectional view along the cutting line D-D ′ in FIG. 12 will be described. In addition, other elements formed by using a part of the lower substrate 1, that is, the injection port 1ca, the plurality of columnar spacers 1d, and the plurality of protrusions 1a can also be formed by this method.

  First, as shown to Fig.13 (a), the glass base material 1x is prepared. The raw material which comprises the glass base material 1x is not restrict | limited in particular, Soda lime glass, borosilicate glass, an alkali free glass etc. can be used.

  Next, as shown in FIG. 13B, a resist material 80 is applied onto the glass substrate 1x by spin coating or spraying. As the resist material 80, either a negative resist material or a positive resist material can be used. Next, as shown in FIG. 13C, the glass substrate 1x is exposed through a mask 85 disposed in a region where the frame-shaped seal portion 1c is not formed, for example, the overhang region 36, and then the glass. The substrate 1x is developed. Thereby, as shown in FIG. 13D, a mask pattern 81 is formed at a position corresponding to the region 1cx where the frame-shaped seal portion 1c is to be formed.

Next, as shown in FIG.13 (e), the surface of the glass base material 1x in which the mask pattern 81 is not formed is etched. Such an etching method can be preferably carried out by either a dry etching method or a wet etching method. When etching is performed by a dry etching method, an etching gas in which fluorine or oxygen such as O ₂ , CF ₄ , or SF ₆ is mixed can be used. On the other hand, examples of the etching treatment liquid used when performing the etching process by the wet etching method include a hydrofluoric acid liquid, a sulfuric acid fluoride liquid, a hydrogen silicofluoride liquid, ammonium fluoride, and hydrofluoric acid. Also, use an aqueous solution containing them, for example, a mixed aqueous solution of hydrofluoric acid and nitric acid, a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, an aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride and nitric acid, etc. You can also. Furthermore, strong alkaline chemicals such as caustic soda (NaOH) and potassium hydroxide (KOH) can also be used.

  Next, as shown in FIG. 13F, the mask pattern 81 is removed from the glass substrate 1x. Here, examples of the method for removing the resist include a method of dissolving the resist using a predetermined chemical solution. Thus, the lower substrate 1 having the frame-shaped seal portion 1c is produced at a position corresponding to the region 1cx where the frame-shaped seal portion 1c is to be formed.

  Returning to FIG. 11, next, a plurality of routing wirings 31, a plurality of data lines 32, a plurality of TFD elements 21, a plurality of pixel electrodes 10, and a plurality of external connection wirings 35 are formed on the lower substrate 1. (Process P2).

  Specifically, as shown in FIG. 14, when forming the plurality of routing wires 31, a plurality of main line portions 31a are formed so as to extend in the Y direction from a predetermined position of the overhang region 36 to the frame region 38. The plurality of bent portions 31b are formed so as to extend in the X direction from one end of the plurality of main line portions 31a to the frame-shaped seal portion 1c, and further, the plurality of bends are positioned on the frame-shaped seal portion 1c. A plurality of electrode portions 31c are formed at the end portion of the portion 31b. Here, the predetermined position corresponds to a region 33ax where the bumps 33a on the output side of the Y driver IC 33 on the plurality of convex portions 1a are to be formed. The formation of the plurality of main line portions 31a, the bent portions 31b, and the electrode portions 31c is performed simultaneously. Note that the plurality of routing wires 31 are preferably formed of a material such as chromium.

  As shown in FIG. 14, each data line 32 is formed so as to extend in the Y direction from a predetermined position of the overhang region 36 to the effective display region V and at an appropriate interval. Here, the predetermined position corresponds to a region 34ax where the bumps 34a on the output side of the X driver IC 34 on the plurality of convex portions 1a are to be formed. Each data line 32 is preferably formed of a material such as chromium, like the lead wiring 31.

  Each external connection wiring 35 is formed in the overhang region 36 as shown in FIG. In particular, one end of each external connection wiring 35 has a region 34bx in which each bump 34b on the input side of the X driver IC 34 on the plurality of protrusions 1a is to be formed, and the Y driver IC 33 on the plurality of protrusions 1a. The bumps 33b on the input side are formed so as to be located in the region 33bx to be formed. Each external connection wiring 35 is preferably formed of a material such as chromium, like the routing wiring 31 and the data line 32.

  As shown in FIG. 14, each TFD element 21 is formed at a position corresponding to the vicinity of the corner position of the pixel electrode 10 when the pixel electrode 10 is formed in the effective display region V.

  Each pixel electrode 10 is formed in a matrix in the effective display area V as shown in FIG. Each pixel electrode 10 is preferably formed of a transparent conductive material, for example, a material such as ITO. Accordingly, each data line 32 is electrically connected to each pixel electrode 10 via each TFD element 21.

  Next, X and Y driver ICs and other elements are mounted (process P3). Specifically, in FIG. 14, each bump 33b on the input side of the Y driver IC 33 comes into contact with one end of each external connection wiring 35 formed at a position corresponding to the region 33bx on the plurality of convex portions 1a. In addition, the Y driver IC 33 is arranged so that the bumps 33a on the output side of the Y driver IC 33 are in contact with one end of each lead wiring 31 formed at a position corresponding to the region 33ax on the plurality of convex portions 1a. The Y driver IC 33 in the overhang region 36 is mounted on the region 33x where the overhang region 36 is to be formed via an adhesive. In a similar manner, the X driver IC 34 is mounted on the region 34x where the X driver IC 34 is to be formed via an adhesive. Thus, each Y driver IC 33 is electrically connected to the plurality of routing wirings 31 and the external connection wiring 35, and the X driver IC 34 is electrically connected to the plurality of data lines 32 and the external connection wiring 35. Connected. FIG. 15 shows a state in which the X driver IC 34 and the Y driver ICs 33 are mounted in the overhang area 36 as described above. Further, other elements such as a polarizing plate 14 and a backlight 15 are attached. Thus, as shown in FIG. 15, the element substrate 91 is manufactured.

  Returning to FIG. 10, the color filter substrate according to the first, second, or third embodiment is manufactured by a known method (step S2). When the upper substrate 2 of the color filter substrate 96 according to the third embodiment is manufactured, the colored layer is formed on the upper substrate 2 made of a glass material or the like by the method described in the element substrate manufacturing method. Etching is applied to the portion where 6 and the like are to be formed. Thereby, a recessed part can be formed in the part of the upper side substrate 2 in which the colored layer 6 etc. should be formed.

  Next, the color filter substrate 92, 94, or 96 of the first, second, or third embodiment manufactured as described above and the element substrate 91 are provided with a frame-shaped seal portion 1c whose surface is coated with an adhesive. (Step S3). At this time, in the case of the first and third embodiments, no adhesive is applied to the electrode portion 31c on the frame-shaped seal portion 1c. In addition, when the color filter substrate 94 and the element substrate 91 of the second embodiment are bonded together, the vertical conductive portion, that is, the electrode portion 31c formed on the frame-shaped seal portion 1c and the scanning line 8 is used. In order to eliminate the generated gap, it is preferable to use an adhesive formed by dispersing and arranging a plurality of metal particles having a diameter corresponding to the size of the gap.

  Next, as shown in FIG. 16, liquid crystal is injected into the frame-shaped seal portion 1c from the direction of the arrow Y1 through the injection port 1ca, and sealing processing (not shown) of the injection port 1ca is performed (step S4). ). Next, by attaching other elements as necessary (step S5), as shown in FIGS. 1 to 9, the liquid crystal display device 100, 200, or 300 of the first, second, or third embodiment is provided. Manufactured.

[Electronics]
Next, an embodiment in which the liquid crystal display device 100, 200 or 300 according to the present invention is used as a display device of an electronic device will be described.

  FIG. 17 is a schematic configuration diagram showing the overall configuration of the present embodiment. The electronic apparatus shown here includes the liquid crystal display device 100, 200, or 300, and a control unit 410 that controls the liquid crystal display device. Here, the liquid crystal display device 100, 200 or 300 is conceptually divided into a panel structure 403 and a drive circuit 402 formed of a semiconductor IC or the like. Further, the control means 410 includes a display information output source 411, a display information processing circuit 412, a power supply circuit 413, and a timing generator 414.

  The display information output source 411 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display information processing circuit 412 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 414.

  The display information processing circuit 412 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to obtain image information. Are supplied to the drive circuit 402 together with the clock signal CLK. The driving circuit 402 includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 413 supplies a predetermined voltage to each of the above-described components.

  Next, specific examples of electronic devices to which the liquid crystal display device 100, 200, or 300 according to the present invention can be applied will be described with reference to FIG.

  First, an example in which the liquid crystal display device 100, 200, or 300 according to the present invention is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 18A is a perspective view showing the configuration of this personal computer. As shown in the figure, the personal computer 710 includes a main body 712 having a keyboard 711 and a display 713 to which the liquid crystal display panel according to the present invention is applied.

  Next, an example in which the liquid crystal display device 100, 200 or 300 according to the present invention is applied to a display unit of a mobile phone will be described. FIG. 18B is a perspective view showing the configuration of this mobile phone. As shown in the figure, the cellular phone 720 includes a plurality of operation buttons 721, a reception port 722, a transmission port 723, and a display unit 724 to which the liquid crystal display device 100 according to the present invention is applied.

  Electronic devices to which the liquid crystal display device 100, 200, or 300 according to the present invention can be applied include liquid crystal in addition to the personal computer shown in FIG. 18A and the mobile phone shown in FIG. TV, viewfinder type / monitor direct view type video tape recorder, car navigation device, pager, electronic notebook, calculator, word processor, workstation, videophone, POS terminal, digital still camera, etc.

  Further, the present invention is not limited to a liquid crystal display device, but also an electroluminescence device, an organic electroluminescence device, a plasma display device, an electrophoretic display device, and a device using an electron-emitting device (Field Emission Display and Surface-Conduction Electron-Emitter Display). The present invention can be similarly applied to various electro-optical devices such as the above.

[Modification]
In the above embodiment, the frame-shaped seal portion 1c is formed by etching a part of the lower substrate 1 of the element substrate 91. However, the present invention is not limited to this, and in the present invention, the upper side of the color filter substrate 92 is formed. A frame-like seal portion 1c may be formed on the substrate 2 by etching a part thereof.

  In the above embodiment, by etching a part of the lower substrate 1 made of glass or the like, a plurality of elements, that is, a frame-shaped seal portion 1c, a plurality of columnar spacers 1d, a plurality of convex portions 1a, and an injection port 1 ca was formed at the same time. Instead, in the present invention, after laminating a laminate film or photoresist or the like on the lower substrate 1 to a predetermined thickness, the laminate film or photoresist or the like is etched by a known method. Thus, the plurality of elements may be formed at the same time.

  In the above embodiment, the present invention is applied to a transmissive liquid crystal display device. However, the present invention is not limited to this, and the present invention can also be applied to a reflective or transflective liquid crystal display device. In the above embodiment, the element substrate having the TFD element 21 (two-terminal element) is applied to the present invention. Instead, in the present invention, the element having a switching element such as a TFT (Thin Film Transistor) is used. A substrate can also be applied. Furthermore, in the above embodiment, the present invention is applied to an active matrix liquid crystal display device, but the present invention is not limited to this, and the present invention can also be applied to a simple matrix liquid crystal display device. In addition, various modifications can be made without departing from the spirit of the present invention.

1 is a plan view showing a planar configuration of a liquid crystal display device according to a first embodiment of the present invention. FIG. 3 is a plan view showing a planar configuration of the element substrate according to the first embodiment. FIG. 3 is a plan view showing a planar configuration of the color filter substrate according to the first embodiment. The partial top view which expanded the plane structure of the element substrate which concerns on 1st Embodiment. FIG. 2 is a cross-sectional view taken along a cutting line A-A ′ in FIG. 1. FIG. 3 is a cross-sectional view taken along a cutting line B-B ′ in FIG. 1. FIG. 2 is a cross-sectional view taken along a cutting line C-C ′ in FIG. 1. Sectional drawing of the liquid crystal display device which concerns on 2nd Embodiment corresponding to sectional drawing of FIG. Sectional drawing of the liquid crystal display device which concerns on 3rd Embodiment corresponding to sectional drawing of FIG. 6 is a flowchart showing a method for manufacturing the liquid crystal display device of the first to third embodiments. The flowchart which shows the manufacturing method of an element substrate. The top view which shows the manufacturing process of an element substrate. The fragmentary sectional view which shows the manufacturing process of an element substrate. The top view which shows the manufacturing process of an element substrate. The top view which shows the manufacturing process of an element substrate. The top view which shows the manufacturing process of the liquid crystal display device of 1st thru | or 3rd embodiment. 1 is a circuit block diagram of an electronic apparatus to which a liquid crystal display device of the present invention is applied. 6 shows examples of electronic devices to which the liquid crystal display device of the present invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Lower substrate, 1a Convex part, 1c Frame-shaped seal part, 1ca Inlet, 1d Columnar spacer, 2 Upper substrate, 6 Colored layer, 7 Metal particle, 8 Scan line, 10 Pixel electrode, 21 TFD element, 31 Lead wiring, 31c electrode section, 32 data lines, 33 Y driver IC, 34 X driver IC, 33a, 33b, 34a, 34b bump, 35 wiring for external connection, 91 element substrate, 92, 94, 96 color filter substrate, 100 , 200, 300 Liquid crystal display device

Claims (11)

A pair of substrates,
One of the pair of substrates has a frame-shaped seal portion that is formed by a part of the one substrate and protrudes from one surface of the one substrate, and the pair of substrates. An electro-optical device is characterized in that an electro-optical material is disposed in a region defined by the frame-shaped seal portion. The electro-optic material is a liquid crystal;
The electro-optical device according to claim 1, wherein the frame-shaped seal portion has a recess, and the recess is an opening for injecting the liquid crystal.   The said one board | substrate has the some spacer which is formed in a part of said one board | substrate inside the said frame-shaped seal | sticker part, and has a columnar shape. The electro-optical device described. The one substrate has a plurality of convex portions formed by a part of the one substrate,
2. The electricity according to claim 1, wherein the plurality of convex portions are formed in a region where the drive circuit on the one substrate is to be mounted and at a position corresponding to an electrode portion of the drive circuit. Optical device. The other substrate of the pair of substrates has an electrode,
A wiring connected to the driving circuit and the driving circuit is formed on the one substrate,
The electro-optical device according to claim 4, wherein one end of the wiring is located on the frame-shaped seal portion and is in contact with one end of the electrode. The other substrate has flatness, a colored layer formed over the entire surface of the other substrate, a protective layer formed over the entire surface of the colored layer, and the protective layer And an electrode formed on
In the one substrate, an alignment film is formed on at least the plurality of spacers, and the total value of the thickness of the wiring and the thickness of the frame-shaped seal portion, the thickness of the alignment film, 6. The thickness of the frame-shaped seal part and the thickness of each spacer are set to different values so that the total thickness of the spacers matches. The electro-optical device described. The other substrate is a colored layer formed on the other substrate corresponding to the inside of the frame-shaped seal portion, a protective layer formed on the colored layer, and the colored layer is not formed An electrode formed on a portion of the other substrate and the protective layer,
In the one substrate, one end of the electrode is located on a portion of the other substrate corresponding to the frame-shaped seal portion, and an alignment film is formed on at least the plurality of spacers. And
A gap is formed between one end of the electrode and one end of the wiring located on the frame-shaped seal portion, and one end of the electrode and one end of the wiring are at a position corresponding to the gap. 6. The electro-optical device according to claim 5, wherein the electro-optical device is vertically connected through an adhesive formed by dispersing and arranging metal particles having a diameter corresponding to the size of the gap.   The other substrate is made of glass and has another recess, a colored layer formed in the recess on the other substrate, and a protective layer formed in the recess and on the colored layer. The electro-optical device according to claim 5, further comprising: an electrode formed on the part of the other substrate on which the concave portion is not formed and the protective layer.   An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit.   By etching the glass substrate, a frame-shaped seal portion on one surface of the glass substrate, and an electrode portion of the drive circuit are located in a region where the drive circuit is to be mounted on the glass substrate. An electro-optical device manufacturing method comprising an element forming step of simultaneously forming a plurality of convex portions in a region to be performed. Element formation that simultaneously forms a frame-shaped seal portion, an injection port for injecting liquid crystal, a plurality of columnar spacers, and a plurality of convex portions on one surface of the glass substrate by etching the glass substrate With a process,
The element forming step includes
Forming a frame-shaped seal portion so as to protrude from one surface of the glass substrate in a region that does not contribute to display in the glass substrate;
A plurality of columnar spacers are formed at appropriate intervals at positions corresponding to the inside of the frame-shaped seal portion,
A method of manufacturing an electro-optical device, comprising: forming a plurality of convex portions in a region where a driving circuit is to be mounted on the glass substrate and in a region where an electrode portion of the driving circuit is located.

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