JP2006202981A - Electronic device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device and its manufacturing method, which reduce resin consumption, manufacturing processes of the electronic device, and cost of the electronic device. <P>SOLUTION: The electronic device comprises a circuit wiring board 11, and electronic parts 12 and 13 attached to the mounting area set as a predetermined part of circuit wiring board 11. The circuit wiring board 11 is provided with base material, a conductive layer, an insulating layer, and a circuit pattern. In the position close to the mounting area, a dam 14 is formed so as to project upward by using the same material as either an insulating layer or a wiring pattern. In this case, resin moves from the clearance between the electronic part 12 and the circuit wiring board 11 through the upper part of the circuit wiring board 11, and reaches the edge of the dam 14. The resin migration beyond the dam is prevented by the dam 14 so that it should not spread beyond the dam 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic device and a method for manufacturing the same.

  Conventionally, in an electronic device, when various electronic components such as an integrated circuit chip are mounted on a circuit wiring board on which a predetermined wiring pattern is formed, a mounting area for mounting the electronic component on the circuit wiring board, that is, mounting An area is set, and an electrode pad on the circuit wiring board side in the mounting area is connected to an electrode terminal on the electronic component side. Then, in order to reinforce the connection portion, a liquid resin is filled as an underfill material between gaps between predetermined electronic components and the circuit wiring board.

  By the way, when another mounting area (hereinafter referred to as “adjacent mounting area”) is set in the vicinity of the mounting area, the filled underfill material spreads outward from the mounting area, and the electronic components in the adjacent mounting area May enter the gap between the circuit board and the circuit wiring board.

  FIG. 2 is a plan view showing a state in which electronic components are mounted on a conventional circuit wiring board.

  In the figure, 11 is a circuit wiring board, and 12 and 13 are electronic components. A mounting area is set immediately below the electronic component 12 and an adjacent mounting area is set immediately below the electronic component 13 in the circuit wiring board 11. In this case, if the underfill material f is filled in the gap between the electronic component 12 and the circuit wiring board 11, the underfill material f spreads outside the mounting area. Further, when the adjacent mounting area is set in the vicinity of the mounting area, the underfill material f enters the gap between the electronic component 13 and the circuit wiring board 11. Therefore, the consumption of the underfill material f increases, and not only the cost of the electronic device increases, but also the quality of the electronic component 13 decreases.

Therefore, a groove, a dam, or the like (not shown) is formed in the vicinity of the mounting area on the circuit wiring board 11 so as to block the underfill material f at a predetermined portion (see, for example, Patent Documents 1 and 2). .
JP 2004-179576 A JP 2004-179578 A

  However, in the conventional electronic device, since it is necessary to form a groove, a dam portion, or the like in the circuit wiring board 11, the manufacturing process of the electronic device increases, and the cost of the electronic device increases.

  The present invention solves the problems of the conventional electronic device, can reduce the consumption of resin, can reduce the manufacturing process of the electronic device, and can reduce the cost of the electronic device. An object is to provide an electronic device and a method for manufacturing the same.

  For this purpose, the electronic device according to the present invention includes a circuit wiring board and an electronic component attached to an attachment region set at a predetermined location of the circuit wiring board.

  The circuit wiring board includes a base material, a conductive layer formed above the base material, an insulating layer formed above the conductive layer, and a wiring formed by being electrically connected to the conductive layer. Provide a pattern. Further, a damming portion is formed to protrude upward at a position close to the attachment region, using the same material as one of the insulating layer and the wiring pattern.

  In another electronic device of the present invention, the damming portion further includes a base layer made of a conductive material, and a surface layer made of a conductive material coated on the base layer.

  In still another electronic device of the present invention, the damming portion is formed by plating.

  In still another electronic device of the present invention, the damming portion is formed by laminating highly insulating materials.

  In the method for manufacturing an electronic device of the present invention, a conductive layer is formed above the base material, an insulating layer is formed above the conductive layer, and a wiring pattern is formed by being electrically connected to the conductive layer. The circuit wiring board is formed by the same material as one of the insulating layer and the wiring pattern at a position close to the attachment region set at a predetermined position of the circuit wiring board, and the blocking portion is directed upward. An electronic component is attached to the attachment region, and a resin is filled in a gap between the electronic component and the circuit wiring board.

  According to the present invention, an electronic device includes a circuit wiring board and an electronic component attached to an attachment region set at a predetermined location on the circuit wiring board.

  The circuit wiring board includes a base material, a conductive layer formed above the base material, an insulating layer formed above the conductive layer, and a wiring formed by being electrically connected to the conductive layer. Provide a pattern. Further, a damming portion is formed to protrude upward at a position close to the attachment region, using the same material as one of the insulating layer and the wiring pattern.

  In this case, when the resin moves on the circuit wiring board from the gap between the electronic component and the circuit wiring board and reaches the edge of the blocking part, further movement is blocked by the blocking part. It does not spread beyond. As a result, since the resin does not enter the gap between the other electronic components and the circuit wiring board, not only can the consumption of the resin be reduced, but also the deterioration of the quality of the other electronic components can be prevented. be able to. Moreover, since the time for filling the resin can be shortened, the working efficiency can be improved.

  In addition, since the damming portion is formed of the same material as one of the insulating layer and the wiring pattern, the manufacturing process of the electronic device can be reduced, the work can be simplified, Cost can be lowered.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing an electronic device according to the first embodiment of the present invention, and FIG. 3 is a sectional view of a circuit wiring board according to the first embodiment of the present invention.

  In the figure, 11 is a circuit wiring board, 12 and 13 are electronic components such as an integrated circuit chip, a semiconductor package, a chip transistor, a chip diode, a chip resistor, a chip capacitor, and a chip coil. A mounting area as an attachment area for attaching the electronic component 12 is set immediately below 12, and an adjacent mounting area as an attachment area for attaching the electronic component 13 immediately below the electronic component 13 is set. In this case, a plurality of electrode terminals 37 are formed on the back surfaces of the two edge portions 21 and 22 facing each other of the electronic component 12. The electronic component 13 is also provided with electrode terminals in the same manner as the electronic component 12. Further, electrode pads 39 are formed at locations corresponding to the electrode terminals 37 and the electrode terminals of the electronic component 13 in the mounting area. Further, the electronic components 12 and 13 can be constituted by elements having solder bumps formed as electrode terminals on the back surface of a CSP (Chip on Package) or the like.

  In FIG. 3, the electrode terminals 37 in the electronic component 12 are formed so as to be opposed to the circuit wiring board 11 on the back surfaces of the edge portions 21 and 22. , 22 is formed so as to slightly protrude from the side surface to the side.

  In mounting the electronic components 12 and 13 on the circuit wiring board 11, solder or flux is used for the electrode pads 39 on the circuit wiring board 11 side to bring the electrode terminals 37 and electrode terminals on the electronic component 12 and 13 side into contact with each other. Then, the electronic components 12 and 13 are placed on the circuit wiring board 11, and in this state, the circuit wiring board 11 and the electronic components 12 and 13 are sent to a reflow furnace and are connected by melting each solder.

  And in order to reinforce the connection part by the solder of the electrode terminal 37 and the electrode terminal of the electronic component 13, in this Embodiment, it is liquid in the clearance gap between the electronic component 12 and the circuit wiring board 11 in this Embodiment. Resin, in the present embodiment, is filled with an underfill material f. In this case, since the mounting area and the adjacent mounting area are set close to each other, the underfill material f filled in the gap between the electronic component 12 and the circuit wiring board 11 spreads, and further, the electronic component 13 and the circuit If it enters into the gap with the wiring board 11, the consumption of the underfill material f increases and not only the cost of the electronic device increases, but also the quality of the electronic component 13 decreases.

  Therefore, in the present embodiment, in order to block the filled underfill material f at a predetermined location, in the vicinity of the edge portion 21 in the circuit wiring board 11 and between the other electronic components 13. The damming portion 14 having a predetermined shape is formed so as to protrude upward. The damming portion 14 is sized, shaped, etc., corresponding to the position of the electronic components 12, 13. In the present embodiment, the damming portion 14 has a strip shape and is linear along the edge 21. And the sub-extension portions 16 and 17 extending toward the edge portion 22 in a predetermined direction from the end of the main extension portion 15 in a predetermined direction, in the present embodiment, at a right angle. Is provided.

By the way, as shown in FIG. 3, the circuit wiring board 11 is made of predetermined ceramics, in this embodiment, alumina ceramics as a base material formed with alumina (Al ₂ O ₃ ) with a predetermined thickness. Substrate 31 above the alumina ceramic substrate 31, in this embodiment, formed on the alumina ceramic substrate 31 and made of a highly conductive material, in this embodiment, tungsten, to a predetermined thickness, for example, The conductive layer 32 having a thickness of about 15 [μm] and constituting a predetermined wiring pattern, electrically connected to the conductive layer 32 at a predetermined position of the circuit wiring board 11, and the conductive layer 32 Further upward, in the present embodiment, the conductive layer 3 is formed on the electrode pad 39 formed on the conductive layer 32 and a predetermined portion of the circuit wiring board 11. And in the present embodiment, the damming portion 14 formed on the conductive layer 32, and the electrode pad 39 and the damming portion 14 on the conductive layer 32. In this embodiment, an alumina coating layer 33 as an insulating layer formed of a highly insulating material, in the present embodiment, with a predetermined thickness, for example, 2 to 4 [μm], is provided.

  The alumina coat layer 33 is formed by applying a paste-like alumina on the conductive layer 32 to form an original substrate made of the alumina ceramic substrate 31, the conductive layer 32 and alumina, and firing the original substrate. . In the present embodiment, the electrode pad 39 and the damming portion 14 are covered with a conductive material coated on the conductive layer 32, for example, a base layer 34 made of nickel (Ni), and the base layer 34. In the present embodiment, the conductive material formed has a gold flash layer 35 as a surface layer made of gold (Au). The undercoat layer 34 is formed by irradiating a predetermined portion of the alumina coat layer 33 with a laser or the like to remove the alumina coat layer 33 in a predetermined pattern to expose the conductive layer 32. Subsequently, the alumina coat layer 33 Using the layer 33 as a mask, a two-layer structure is formed by plating and has a predetermined thickness of 10 to 12 [μm] in the present embodiment. Similarly, the gold flash layer 35 is also formed by plating with a predetermined thickness, in the present embodiment, 0.04 [μm], using the alumina coat layer 33 as a mask.

  In this way, the damming portion 14 is formed in the vicinity of the edge 21 of the electronic component 12, and a step of 6 to 10 [μm] is formed by the portion where the damming portion 14 is formed and the portion where the damming portion 14 is not formed. . Therefore, when the underfill material f moves on the circuit wiring board 11 from the gap between the electronic component 12 and the circuit wiring board 11 and reaches the edge of the damming portion 14, further movement is blocked by the damming portion 14. Therefore, it does not spread beyond the damming portion 14. As a result, since the underfill material f does not enter the gap between the electronic component 13 and the circuit wiring board 11, not only can the consumption of the underfill material f be reduced, but the quality of the electronic component 13 is reduced. Can be prevented. Moreover, since the time for filling the underfill material f can be shortened, the working efficiency can be improved.

  Further, since the damming portion 14 is formed of the same material and the same structure as the electrode pad 39 and in the same process, the manufacturing process of the electronic device can be reduced, and the operation can be simplified. In addition, the cost of the electronic device can be reduced.

  Further, the alumina coat layer 33 is made of alumina and the gold flash layer 35 is made of gold. The materials are different from each other, and the wettability of each material, that is, the compatibility with the underfill material f is different. Therefore, since the contact angle of the underfill material f at the boundary between the alumina coat layer 33 and the gold flash layer 35 is increased, the underfill material f is stopped at the boundary.

  Next, a second embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st Embodiment, the description is abbreviate | omitted by providing the same code | symbol, and the effect of the same embodiment is used about the effect of the invention by having the same structure. .

  FIG. 4 is a sectional view of a circuit wiring board according to the second embodiment of the present invention.

  In the figure, 33 is an alumina coating as an insulating layer formed on the conductive layer 32 with a highly insulating material, in the present embodiment, with an alumina having a predetermined thickness, for example, 2 to 4 [μm]. Is a layer. 38 is laminated on the alumina coat layer 33 so that it is in the vicinity of the edges 21 and 22 of the electronic component 12 in the circuit wiring board 11 (FIG. 1) and between the other electronic components 13. In the present embodiment, it is a damming portion formed in a band shape, and the damming portion 38 is formed with a predetermined thickness, for example, 6 to 10 [μm] by laminating the alumina. Is done.

  In this case, since the damming portion 38 is formed of the same material and the same structure as the alumina coat layer 33 and in the same process, the manufacturing process of the electronic device can be reduced and the operation can be simplified. In addition, the cost of the electronic device can be reduced.

  In addition, this invention is not limited to the said embodiment, It can change variously based on the meaning of this invention, and does not exclude them from the scope of the present invention.

It is a top view which shows the electronic device in the 1st Embodiment of this invention. It is a top view which shows the mounting state of the electronic component on the conventional circuit wiring board. It is sectional drawing of the circuit wiring board in the 1st Embodiment of this invention. It is sectional drawing of the circuit wiring board in the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Circuit wiring board 12, 13 Electronic component 14 Damping part 31 Alumina ceramic substrate 32 Conductive layer 33 Alumina coat layer 34 Underlayer 35 Gold flash layer f Underfill material

Claims (5)

  A circuit wiring board; and an electronic component attached to an attachment region set at a predetermined position of the circuit wiring board. The circuit wiring board includes a base material and a conductive layer formed above the base material. An insulating layer formed above the conductive layer, and a wiring pattern formed to be electrically connected to the conductive layer, wherein the insulating layer and the wiring pattern are positioned at positions close to the attachment region. An electronic device comprising the same material as the one and having a damming portion protruding upward.   The electronic device according to claim 1, wherein the damming portion includes a base layer made of a conductive material and a surface layer made of a conductive material coated on the base layer.   The electronic device according to claim 2, wherein the damming portion is formed by plating.   The electronic device according to claim 1, wherein the damming portion is formed by laminating highly insulating materials. A conductive layer is formed above the base material, an insulating layer is formed above the conductive layer, and a circuit pattern is formed by electrically connecting to the conductive layer to form a circuit wiring board. Formed with the same material as one of the insulating layer and the wiring pattern at the position close to the mounting region set at a predetermined location on the substrate, with the dammed portion protruding upward, and in the mounting region An electronic device manufacturing method, comprising: mounting an electronic component; and filling a gap between the electronic component and the circuit wiring board with a resin.

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