JP2006179503A - High frequency relay - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency relay with simple electrical connection between a base and a grounding conductive part of a circuit board. <P>SOLUTION: A shielding case 11 surrounds a contact device driven to be opened/closed by a driving device. Terminal pins 12a-12c electrically connected with the shielding case 11 and constituting the contact device are inserted in the base 10. A grounding terminal 14 is formed in a shape with a leg part 14a and a head part 14b. The base 10 has a through hole 18 in which the grounding terminal 14 is inserted, and an inner brim locking the head part 14a of the grounding terminal 14 is formed in the through hole 18. Since solder 16 is filled between the leg part 14a and the inner brim of the grounding terminal 14, a part of solder 16 fixing the grounding terminal 14 to the base 10 is melted when the high frequency relay is mounted on the circuit board 20 with solder so that the grounding terminal 14 and the grounding conductive part 21 of the circuit board 20 are soldered. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high frequency relay.

  Conventionally, there has been provided a high-frequency relay in which a contact device is housed in a shield case and the shield case is electrically connected to a ground pattern of a circuit board (see, for example, Patent Document 1). As this type of high frequency relay, there is one in which a shield case 11 is provided on a metal base 10 as shown in FIG. As shown in FIG. 12, the contact device includes, for example, a pair of movable contact plates that move between three terminal pins 12a to 12c and a position where each pair of terminal pins 12a to 12c is short-circuited and opened. 13a and 13b. The movable contact plates 13a and 13b are held by a driving device made of an electromagnet device, and are moved in the vertical direction in FIG. 12 by the driving device. Normally, the left end terminal pin 12a and the center terminal pin 12b are short-circuited by the movable contact plate 13a, and the movable contact plate 13b is separated from the center terminal pin 12b and the right end terminal pin 12c. When the movable contact plates 13a and 13b are moved by the driving device, the movable contact plate 13a is separated from the left end terminal pin 12a and the central terminal pin 12b, and the central terminal pin 12b and the right end terminal pin 12c are movable contact plates. Shorted by 13b. That is, a normally closed contact is formed by the movable contact plate 13a and the terminal pin 12a, and a normally open contact is formed by the movable contact plate 13b and the terminal pin 12c. The terminal pin 12b serves as a common contact.

  By the way, the terminal pins 12 a to 12 c penetrate the base 10 and are connected to the circuit board 20, and the ground terminal 14 (see FIG. 13) electrically connected to the shield case 11 is also connected to the circuit board 20. As shown in FIG. 13, the ground terminal 14 includes a head portion 14 b having a larger diameter than the leg portion 14 a at one end of the leg portion 14 a, and the head portion 14 b is inserted into a recess 10 a formed in the base 10. The head 14b is fixed to the base 10 using a silver solder.

When mounting on the circuit board 20, a double-sided printed circuit board is used as the circuit board 20, and the terminal pins 12 a to 12 c are inserted into the circuit board 20 and connected to the circuit pattern provided on the lower surface side of FIGS. To do. Similarly to the terminal pins 12 a to 12 c, the ground terminal 14 is also inserted into the circuit board 20 and connected to the grounding conductive portion by the solder 16. Here, on the upper surface side of the circuit board 20 in FIGS. 10 and 13, as shown in FIG. 11, a grounding conductive portion (shaded portion) is formed over almost the entire surface, and the grounding conductive portion is formed on the base 10. It comes to oppose. That is, since the base 10 and the ground terminal 14 are simply fixed by fixing the head 14b of the ground terminal 14 to the inner bottom surface of the recess 10a of the base 10 with silver solder, the contact area between the base 10 and the ground terminal 14 is small. Since it is relatively small and sufficient conductivity cannot be obtained, and the distance from the fixed portion of the circuit board 20 and the ground terminal 14 by the solder 16 to the connection portion of the ground terminal 14 and the base 10 is relatively long, An impedance component is generated here. This causes a potential difference between the ground potential of the circuit board and the potential of the base 10. If there is such a potential difference, a noise component tends to be applied to the base 10 and the shield case 11, the function of the electromagnetic shield of the base 10 and the shield case 11 is deteriorated, and the base 10 and the shield case 11 have a reference potential. As a result, the high frequency characteristics (transmission loss, etc.) become unstable. Therefore, as described above, it is necessary to form a grounding conductive portion on the upper surface side of the circuit board 20 and to join the opposing portion of the base 10 and the grounding conductive portion with solder.
Japanese Patent Laid-Open No. 9-251831

  As described above, the circuit board 20 needs to be provided with a grounding conductive portion on the surface facing the base 10 and joined to the base 10 by soldering. However, the grounding conductive portion of the circuit board 20 and the base 10 are opposed to each other. The surface has a large opposing area, and the work of joining them with solder is troublesome.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a high-frequency relay that facilitates electrical connection between a base and a grounding conductive portion of a circuit board.

  According to the first aspect of the present invention, there is provided a shield case surrounding a contact device that is opened and closed by a drive device comprising an electromagnet device, and a metal base that is inserted into a terminal pin constituting the contact device and electrically connected to the shield case. And an earth terminal joined to the base by solder, the earth terminal being formed in a shape having a head having a diameter larger than that of the leg at one end of the leg, and the earth terminal is inserted into the base There are through-holes penetrating through the front and back, and an inner collar for locking the head of the ground terminal is formed at a portion near the circuit board on which the terminal pin is mounted in the through-hole, and at least the outer peripheral surface of the leg portion of the ground terminal And the solder is filled between the inner peripheral surface of the inner casing and the inner casing.

  According to a second aspect of the present invention, there is provided a shield case surrounding a contact device that is driven to be opened and closed by a drive device comprising an electromagnet device, and a metal base through which a terminal pin constituting the contact device is inserted and electrically connected to the shield case. And a ground terminal joined to the base by solder, and the solder for joining the ground terminal to the base is provided at a position where the terminal pin can be melted when the terminal pin is mounted on the circuit board.

  According to the first aspect of the invention, when the terminal pins are mounted on the circuit board, a part of the solder joining the ground terminal to the base melts and the ground terminal is connected to the circuit board. The electrical connection relationship between the ground terminal and the circuit board becomes good, and as a result, the ground potential is stable and good high-frequency characteristics that are hardly affected by noise can be obtained. Moreover, since the ground terminal is inserted into the through-hole, the assembly work is easy, the head of the ground terminal is disposed at a position close to the circuit board, and the solder for joining the ground terminal to the base is also disposed at a position near the circuit board. be able to. As a result, the solder is likely to melt when the terminal pins are mounted.

  According to the second aspect of the invention, when the terminal pin is mounted on the circuit board, a part of the solder joining the ground terminal to the base melts and the ground terminal is connected to the circuit board. The electrical connection relationship between the ground terminal and the circuit board becomes good, and as a result, the ground potential is stable and good high-frequency characteristics that are hardly affected by noise can be obtained.

(Basic configuration)
In this example, an example in which the technical idea of the present invention is applied to the high-frequency relay having the configuration shown in FIG. 6 is shown, but the technical idea of the present invention can also be applied to a high-frequency relay having another configuration. The high frequency relay shown in FIG. 6 has a drive device 2 and a contact device 3 made of an electromagnet device mounted on a main base 1, and the drive device 2 and the contact device 3 are stored in a space surrounded by the main base 1 and the case 4. It is a thing.

  The drive device 2 includes an iron core 33 inserted through a cylindrical coil bobbin 32 around which a coil 31 is wound. One end of the yoke 34 is coupled to one end of the iron core 33. The yoke 34 has a first yoke piece 34a that passes the front side of the coil 31 in FIG. 6 and a second yoke piece 34b that passes the lower side of the coil 31 in FIG. 6, and the first yoke piece 34a and the second yoke piece. The other end of 34b is extended to a position facing the other end of the iron core 33 while being spaced apart. That is, the other end portions of the first yoke piece 34a and the second yoke piece 34b face each other, and the other end portion of the iron core 33 is located between the opposed portions. Both ends of the coil 31 are connected to the coil terminal 35.

  The drive device 2 includes a movable base 40 attached to the main base 1 via a balance spring 41. The movable base 40 holds a permanent magnet 42 and a pair of armatures 43 coupled to the magnetic poles of the permanent magnet 42. Each armature 43 is inserted between the other end of the iron core 33 and the other end of the first yoke piece 34a or the second yoke piece 34b. That is, according to the excitation polarity of the coil 31, both armatures 43 are attracted to the iron core 33 and the first yoke piece 34a, and both armatures 43 are attracted to the iron core 33 and the second yoke piece 34b. State occurs.

  The balance spring 41 is fixed to the balance spring holding plate 44, and the balance spring holding plate 44 is fixed to the main base 1 by being partly press-fitted into the holding hole 5 provided in the main base 1. The balance spring 41 is a plate spring formed in a square shape, and is formed so as to be flexible in the lower right-upper left direction in FIG. 6, and can swing the movable base 40 with respect to the main base 1. Hold on. In a state where the balance spring 41 is not bent, the two armatures 43 are positioned between the iron core 33, the first yoke piece 34a, and the second yoke piece 34b, respectively.

  If the coil 31 is excited, the armature 43 is attracted to the iron core 33 and the first yoke piece 34a or the second yoke piece 34b according to the excitation polarity as described above. The movable base 40 moves in the direction to be moved. In this operation, once the coil 31 is excited and the armature 43 is once attracted to the first yoke piece 34a or the second yoke piece 34b, the movable base 40 does not move until the coil 31 is next excited with a reverse polarity. To bistable operation. However, in this example, a non-magnetic decision plate 36 is fixed to the surface of the iron core 33 facing the first yoke piece 34a, and the permanent magnet 42 when the armature 43 is attracted to the second yoke piece 34b. The suction force is weakened so that the suction force is weaker than the return force by the balance spring 41, and the monostable operation is performed. That is, in order to attract the armature 43 to the second yoke piece 34b, the coil 31 must be excited. However, if the excitation of the coil 31 is stopped, the armature 43 is moved by the spring force of the balance spring 41 to the second yoke piece 34b. The armature 43 is attracted to the first yoke piece 34 a by the attraction force of the permanent magnet 42. As a result, the movable base 40 can be reciprocated depending on whether or not the coil 31 is energized without switching the direction of current flow through the coil 31.

  A pair of movable contact plates 13 a and 13 b is held on one side of the movable base 40 via a holding member 45 made of an insulating material. Each of the movable contact plates 13 a and 13 b is made of a metal plate having good conductivity, and the intermediate portion in the longitudinal direction is held by the holding member 45. Both movable contact plates 13a and 13b are spaced apart from each other in the swinging direction of the movable base 40, and one end portions of both movable contact plates 13a and 13b face each other.

  The contact device 3 is substantially the same as the conventional configuration, and includes three terminal pins 12a to 12c having an intermediate portion penetrated by a cylindrical insulating member 15. The insulating member 15 is held by the metal base 10, and the terminal pins 12 a to 12 c are inserted through the base 10. In addition, a shield case 11 is disposed on the base 10 so as to surround the terminal pins 12 a to 12 c together with the base 10. The shield case 11 is formed by combining two metal plates having good conductivity. Further, four ground terminals 14 are fixed to the base 10. The base 10 is fixed to a side portion of the main base 1 so that the lower surface is substantially flush with the lower surface of the main base 1.

  As shown in FIG. 5, the terminal pins 12 a to 12 c are arranged in a straight line, and open between a state in which the central terminal pin 12 b and the other terminal pins 12 a and 12 c are short-circuited by the movable contact plates 13 a and 13 b. The contact device 3 is configured by making the state selectable. In the illustrated example, the movable contact plate 13a short-circuits between the terminal pins 12a and 12b while the coil 31 is not excited, and the movable contact plate 13b opens between the terminal pins 12b and 12c. That is, the terminal pins 12a and 12b and the movable contact plate 13a constitute a normally closed contact, and the terminal pins 12b and 12c and the movable contact plate 13b constitute a normally open contact.

  By the way, as shown in FIG. 3, the notch part 17 is formed in the lower surface of the base 10, the site | part through which each terminal pin 12a-12c is penetrated, and its circumference | surroundings. That is, the base 10 is in contact with the circuit board 20 at the site where the ground terminal 14 is provided, but the base 10 is located away from the circuit board 20 at the site where the notch 17 is formed. The notches 17 corresponding to the terminal pins 12a and 12c are opened to the respective end faces in the longitudinal direction of the base 10 (direction in which the terminal pins 12a to 12c are arranged), and the notches 17 corresponding to the terminal pins 12b are arranged in the width direction of the base 10. Opened to the end face (in a direction perpendicular to the longitudinal direction). Each cutout 17 is preferably formed over the entire length of the base 10 in the width direction. That is, the notches 17 are formed over the entire length in the width direction at each of the three ends of the base 10 in the longitudinal direction and the intermediate portion.

  With such a configuration, on the surface of the circuit board 20 facing the base 10, as shown in FIG. 4, not only the grounding conductive portion 21 but also the circuit pattern 22 electrically connected to the terminal pins 12 a to 12 c is provided. Can be formed. If the circuit pattern 22 is formed within the range of the notch 17, the circuit pattern 22 does not contact the base 10. If such a circuit pattern 22 is formed, the transmission path is reduced by the thickness of the circuit board 20 as compared with the case where the circuit pattern 20 is formed on the other surface side of the circuit board 20, and the loss caused in the conventional configuration Will be reduced. In other words, in the conventional configuration, the impedance mismatch within the thickness dimension of the circuit board 20 affects the impedance matching of the entire high-frequency relay, but there is no need to consider the impedance mismatch in this portion. . As a result, it is possible to improve the high frequency characteristics (particularly with respect to loss) compared to the conventional configuration.

  In the above example, the configuration using the terminal pins 12a to 12c inserted through the circuit board 20 has been described, but the terminal pins 12a to 12c having a shape suitable for surface mounting may be used. That is, as shown in FIG. 7, the terminal pins 12 a to 12 c are bent into an approximately L shape, and if the terminal pins 12 a to 12 c having such a shape are employed, a through hole is not formed in the circuit board 20. A high frequency relay can be mounted on the circuit board 20. In addition, when surface mounting is performed, there is no surplus portion that occurs when the terminal pins 12a to 12c are inserted into the circuit board 20, so that the high frequency characteristics may be further improved. FIG. 8 shows an example of the circuit pattern 22 when a surface-mounting high-frequency relay is used.

  The surface mounting terminal pins 12a to 12c are not only those that have been bent as described above, but the tip portions of the terminal pins 12a to 12c are crushed to have a larger diameter than the other parts as shown in FIG. You may use what gave the header process to form.

(Embodiment)
In the present embodiment, the ground terminal 14 is fixed to the base 10 with the structure shown in FIGS. The ground terminal 14 is the same as that of the conventional configuration, and is formed in a shape in which a head 14b having a larger diameter than the leg 14a is provided at one end of the leg 14a. In the base 10, a through hole 18 penetrating vertically is formed at a portion where the ground terminal 14 is mounted, and an inner flange 18 a having a smaller diameter than other portions is formed at the lower end portion of the through hole 18. The dimensional relationship is set so that the head portion 14b of the ground terminal 14 is locked on the upper surface of the inner flange 18a. In this state, the portion indicated by the hatched portion in FIG. It is fixed. That is, the solder 16 is filled between the inner peripheral surface of the through hole 18 and the outer peripheral surface of the head portion 14b of the ground terminal 14, and between the inner peripheral surface of the inner flange 18a and the outer peripheral surface of the leg portion 14a.

  If such a structure is adopted, since the ground terminal 14 is supported by the base 10 by placing the head 14b of the ground terminal 14 on the inner flange 18a, the head 14b of the ground terminal 14 is configured conventionally. Even if it is held at a position closer to the circuit board 20, the fixing strength of the ground terminal 14 to the base 10 can be maintained. Further, since the ground terminal 14 is fixed to the base 10 with the solder 16 and the fixing position of the head 14b is close to the circuit board 20, the solder 16 is also located near the circuit board 20, and the high frequency relay is connected to the circuit board. When soldering is performed on the base plate 20, a part of the solder 16 that fixes the ground terminal 14 to the base 10 is melted to solder-connect the ground terminal 14 and the ground conductive portion 21 of the circuit board 20. . Further, since the ground terminal 14 and the base 10 are also connected by the solder 16, compared with the case where silver solder is used as in the conventional configuration, the conductivity between the base 10, the ground terminal 14, and the grounding conductive portion 21 is reduced. These potentials are almost equal. That is, since the reference potential of the base 10 and the shield case 11 is stabilized, the high frequency characteristics are stabilized. In the illustrated example, the notch portion 17 as in the basic configuration is not provided, but in this embodiment, the notch portion 17 can be provided as in the basic configuration. Other configurations and operations are the same as the basic configuration.

It is a principal part front view which shows embodiment. It is principal part sectional drawing same as the above. It is a principal part front view which shows a basic composition. It is a principal part top view of the circuit board used for the same as the above. It is a top view which shows a contact apparatus same as the above. It is an exploded perspective view same as the above. The other example of a structure same as the above is shown, (a) is a principal part front view, (b) is a principal part side view. It is a principal part top view of the circuit board used for the high frequency relay shown in FIG. It is a principal part front view which shows the shape of the other terminal pin used for the same as the above. It is a principal part front view which shows a prior art example. It is a principal part top view of the circuit board used for the same as the above. It is a top view which shows a contact apparatus same as the above. It is principal part sectional drawing same as the above.

Explanation of symbols

2 Driving device 3 Contact device 10 Base 11 Shield case 12a to 12c Terminal pin 14 Ground terminal 14a Leg portion 14b Head portion 16 Solder 18 Through hole 18a Inner collar
20 Circuit board

Claims (2)

  A shield case surrounding a contact device that is opened and closed by a drive device comprising an electromagnet device, a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case, and the base joined by soldering The ground terminal is formed in a shape having a head having a diameter larger than that of the leg at one end of the leg, and the base has a through-hole penetrating the front and back through which the ground terminal is inserted. An inner flange for locking the head of the ground terminal is formed in a portion near the circuit board on which the terminal pin is mounted in the through hole, and at least the outer peripheral surface of the leg portion of the ground terminal and the inner periphery of the inner flange A high-frequency relay characterized in that the solder is filled between the surfaces.   A shield case surrounding a contact device that is opened and closed by a drive device comprising an electromagnet device, a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case, and the base joined by soldering And a solder for joining the ground terminal to the base at a position where the solder can be melted when the terminal pin is mounted on the circuit board.

Images