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JP2006154084A - Optical transmission apparatus - Google Patents

Optical transmission apparatus Download PDF

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Publication number
JP2006154084A
JP2006154084A JP2004342274A JP2004342274A JP2006154084A JP 2006154084 A JP2006154084 A JP 2006154084A JP 2004342274 A JP2004342274 A JP 2004342274A JP 2004342274 A JP2004342274 A JP 2004342274A JP 2006154084 A JP2006154084 A JP 2006154084A
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Japan
Prior art keywords
optical
optical transmission
sleeve
translucent resin
optical element
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Japanese (ja)
Inventor
Hideaki Saito
秀哲 斉藤
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Toshiba Corp
Toshiba Development and Engineering Corp
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Toshiba Corp
Toshiba Electronic Engineering Co Ltd
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Priority to JP2004342274A priority Critical patent/JP2006154084A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

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  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical transmission apparatus in which optical coupling efficiency is stable and high between an optical element and an optical fiber with a small core diameter. <P>SOLUTION: The apparatus is equipped with a lead frame 11, an optical element 15 mounted on the surface of the lead frame 11, a translucent resin 21 for sealing the optical element 15 and a part of the lead frame 11, and a sleeve 31 which is fixed at one end in the translucent resin 21 portion oppositely facing the optical element 15 and which is for internally installing an optical fiber 42 attachably and detachably. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、光ファイバ等を介して光伝送を行う樹脂成型の光伝送装置に関する。   The present invention relates to a resin-molded optical transmission apparatus that performs optical transmission via an optical fiber or the like.

光通信の中で、中短距離、中低速の光ファイバ伝送を担う光伝送装置は、通信情報の増大に伴い用途が拡大している。この用途の拡大に相俟って、光伝送装置には、低電力化や伝送の長距離化が求められている。低電力化や長距離化のためには、光伝送装置は、発光素子からの光を効率よく光ファイバに導入、または光ファイバから送られて来た光を効率よく受光する必要がある。   In optical communication, the use of optical transmission devices responsible for medium-to-short-distance and medium-low-speed optical fiber transmission is expanding as communication information increases. Along with this expansion of applications, optical transmission devices are required to have low power and long transmission distances. In order to reduce power consumption and increase the distance, an optical transmission device needs to efficiently introduce light from a light emitting element into an optical fiber or efficiently receive light transmitted from the optical fiber.

従来、光伝送装置は、例えば、発光素子または受光素子(以下、木の発光素子及び受光素子を総称して光素子という)がリードフレームに搭載されて、透明樹脂により封止されている。この光伝送装置は、光信号を伝送する光ファイバの端部を挿入する挿入口(スリーブ)を有するレセプタクル(外囲器)に収納されて光伝送デバイス(光伝送モジュール)を構成している(例えば、特許文献1参照。)。   Conventionally, in an optical transmission device, for example, a light emitting element or a light receiving element (hereinafter, a light emitting element and a light receiving element of a tree are collectively referred to as an optical element) is mounted on a lead frame and sealed with a transparent resin. This optical transmission device is housed in a receptacle (envelope) having an insertion port (sleeve) for inserting an end portion of an optical fiber for transmitting an optical signal to constitute an optical transmission device (optical transmission module) ( For example, see Patent Document 1.)

光伝送モジュールにおいては、光ファイバの端部に光信号を効率よく入射させるために、光素子と光ファイバの端部を内設するスリーブとの位置合わせが重要となる。光ファイバの端部の中心、すなわち、スリーブの中心軸と光素子の中心が一致する程、光信号の結合効率が高くなる。逆に、これらの軸がずれると、発光素子で発光した送信光は光ファイバに十分導入できない状態、あるいは、受光素子の場合は光ファイバから十分受光できない状態となる。   In an optical transmission module, in order to make an optical signal efficiently enter the end portion of the optical fiber, it is important to align the optical element with the sleeve in which the end portion of the optical fiber is provided. The optical signal coupling efficiency increases as the center of the end of the optical fiber, that is, the center axis of the sleeve and the center of the optical element coincide. Conversely, if these axes are shifted, the transmitted light emitted by the light emitting element cannot be sufficiently introduced into the optical fiber, or in the case of the light receiving element, it cannot be sufficiently received from the optical fiber.

しかしながら、上記した従来技術では、光素子を収納する光伝送装置とスリーブが固定された外囲器が別部品として作製され、これらを組み合わせて光伝送モジュールとしているために、光伝送装置を外囲器に挿入して、固定する場合、光素子の中心とスリーブの中心軸とのずれが大きくなる原因となる。すなわち、光伝送装置を外囲器の収納部に収納するには、スムーズに挿入できるようにクリアランスが必要となり、このクリアランスによって、例えば、接着剤で固定する時に、光伝送装置が外囲器に対して傾きや位置ずれを生ずる。   However, in the above-described prior art, since the optical transmission device that houses the optical element and the envelope to which the sleeve is fixed are produced as separate parts and combined to form an optical transmission module, the optical transmission device is When it is inserted into the container and fixed, it causes a large deviation between the center of the optical element and the central axis of the sleeve. That is, in order to store the optical transmission device in the storage unit of the envelope, a clearance is required so that the optical transmission device can be smoothly inserted. With this clearance, for example, when the optical transmission device is fixed with an adhesive, the optical transmission device is attached to the envelope. On the other hand, tilt and misalignment occur.

また、光伝送装置の透光性樹脂の周囲に残されたバリ等のために、外形寸法が大きくなり、外囲器の収納部の接触面に押し付けて位置合わせをしても、光伝送装置は設計位置からずれる場合がある。この結果、光素子の中心とスリーブの中心軸とにずれが生じ、特に、光伝送装置をコア径の小さな光ファイバに光結合しようとすると、光結合効率がばらつき、不良率が増加するという問題があった。   In addition, due to burrs or the like left around the translucent resin of the optical transmission device, the outer dimensions become large, and the optical transmission device can be aligned even if pressed against the contact surface of the housing housing portion. May deviate from the design position. As a result, there is a deviation between the center of the optical element and the central axis of the sleeve. In particular, when the optical transmission device is optically coupled to an optical fiber having a small core diameter, the optical coupling efficiency varies and the defect rate increases. was there.

近年、高速伝送の要求に対して、例えば、光ファイバのコア径がより小さな50μm径の石英ガラスファイバが使用される場合があり、光結合効率の確保がますます重要になっている。
特開2002−344024号公報(第5頁、図5)
In recent years, for example, a silica glass fiber having a smaller optical fiber core diameter of 50 μm may be used in response to the demand for high-speed transmission, and ensuring optical coupling efficiency is becoming increasingly important.
JP 2002-344024 A (page 5, FIG. 5)

本発明は、光素子とコア径の小さな光ファイバとの光結合効率が安定して高い光伝送装置を提供する。   The present invention provides an optical transmission apparatus in which the optical coupling efficiency between an optical element and an optical fiber having a small core diameter is stable and high.

本発明の一態様の光伝送装置は、基板と、前記基板の表面に搭載された光素子と、前記光素子及び前記基板の一部を封止する透光性樹脂と、前記光素子と対向する前記透光性樹脂部分に一端部が埋設されて固定され、光ファイバを着脱可能に内設するためのスリーブとを具備したことを特徴とする。   An optical transmission device according to one embodiment of the present invention includes a substrate, an optical element mounted on a surface of the substrate, a translucent resin that seals the optical element and a part of the substrate, and the optical element. One end portion is embedded and fixed in the translucent resin portion, and a sleeve for detachably placing an optical fiber is provided.

本発明によれば、光素子とコア径の小さな光ファイバとの光結合効率が安定して高い光伝送装置を提供することができる。   According to the present invention, it is possible to provide an optical transmission device in which the optical coupling efficiency between an optical element and an optical fiber having a small core diameter is stable.

以下、本発明の実施例について、図面を参照しながら説明する。以下に示す図では、同一の構成要素には同一の符号を付す。   Embodiments of the present invention will be described below with reference to the drawings. In the figure shown below, the same code | symbol is attached | subjected to the same component.

本発明の実施例1に係る光伝送装置について、図1を参照しながら説明する。図1は光伝送装置の構造を模式的に示すもので、図1(a)は平面図、図1(b)は図1(a)のA−A線に沿った断面図である。   An optical transmission apparatus according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 schematically shows the structure of an optical transmission device. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG.

図1に示すように、光伝送装置1は、基板であるリードフレーム11、このリードフレーム11の表面に搭載された発光素子である光素子15、光素子15を駆動する光伝送IC16、リードフレーム11の一部及び光素子15を封止する透光性樹脂21、光素子15と対向する透光性樹脂21の部分に一端部が固定され、光ファイバを着脱可能に内設するためのスリーブ31を備えている。   As shown in FIG. 1, an optical transmission apparatus 1 includes a lead frame 11 as a substrate, an optical element 15 as a light emitting element mounted on the surface of the lead frame 11, an optical transmission IC 16 for driving the optical element 15, and a lead frame. 11 and a translucent resin 21 that seals the optical element 15, and one end of the translucent resin 21 that opposes the optical element 15, and a sleeve for detachably placing an optical fiber 31 is provided.

リードフレーム11は、ダイパッド部12、透光性樹脂21内に配設されるインナリード部13及び透光性樹脂21外に導出される外部端子14を有し、CuあるいはFeNi合金等の材料からなり、必要に応じてメッキが施されている。   The lead frame 11 has a die pad portion 12, an inner lead portion 13 disposed in the translucent resin 21, and an external terminal 14 led out of the translucent resin 21, and is made of a material such as Cu or FeNi alloy. It is plated as necessary.

光素子15は、所望の波長の送信光を発する発光ダイオードあるいは面発光型レーザダイオード(LD)等からなり、リードフレーム11の基準点(図示略)に対して、一定の距離だけ離れたリードフレーム11のダイパッド部12上の所定位置に導電性材料で固着されている。   The optical element 15 includes a light emitting diode or a surface emitting laser diode (LD) that emits transmission light having a desired wavelength, and is a lead frame that is separated from a reference point (not shown) of the lead frame 11 by a certain distance. 11 is fixed to a predetermined position on the die pad portion 12 with a conductive material.

また、光素子15を駆動する光伝送IC16は、光素子15に隣接してリードフレーム11のダイパッド部12上に固着されている。   The optical transmission IC 16 that drives the optical element 15 is fixed on the die pad portion 12 of the lead frame 11 adjacent to the optical element 15.

そして、光素子15及び光伝送IC16は、例えば、Auのワイヤ18でリードフレーム11のインナリード部13にそれぞれ電気的に接続され、ワイヤ18及びリードフレーム11を介して互いに電気的に接続されている。また、光素子15及び光伝送IC16は、透光性樹脂21外に導出されたリードフレーム11の外部端子14を介して外部回路と電気的に接続されるようになっている。   The optical element 15 and the optical transmission IC 16 are electrically connected to the inner lead portion 13 of the lead frame 11 by, for example, an Au wire 18, and are electrically connected to each other via the wire 18 and the lead frame 11. Yes. The optical element 15 and the optical transmission IC 16 are electrically connected to an external circuit via the external terminal 14 of the lead frame 11 led out of the translucent resin 21.

透光性樹脂21は、例えば、エポキシ系の透光性の樹脂からなり、リードフレーム11の外部端子14を除いて、光素子15、光伝送IC16、リードフレーム11のダイパッド部12、及びインナリード部13を封止している。また、透光性樹脂21の光素子15と対向する部分には、スリーブ31の一端部、すなわち底部形状に合わせた形状を有する凹部22が形成されている。この凹部22はその中心軸が光素子15の発光中心と一致するように形成されている。   The translucent resin 21 is made of, for example, an epoxy-based translucent resin, except for the external terminal 14 of the lead frame 11, the optical element 15, the optical transmission IC 16, the die pad portion 12 of the lead frame 11, and the inner lead. The portion 13 is sealed. In addition, a concave portion 22 having a shape corresponding to one end of the sleeve 31, that is, the bottom shape, is formed in a portion of the translucent resin 21 facing the optical element 15. The recess 22 is formed so that its central axis coincides with the light emission center of the optical element 15.

スリーブ31は、例えば、アクリル系あるいはポリカーボネート系等の透光性樹脂からなり、破線で示すような、フェルール41で保護され、中心にコアを有する光ファイバ42が挿入できるようになっている。本実施例では、スリーブ31は、頂部が切り落とされた截頭円錐形で、且つ底を有する有底筒状構造に形成されている。また、スリーブ31の底面の中央部には、頂面方向に突出する凸形レンズ32がスリーブ31と一体に形成されており、レンズ32の光軸とスリーブ31の中心軸及び光ファイバ42の中心軸とは一致している。つまり、光素子15の発光中心と光ファイバ42の中心軸とが一致する。そして、スリーブ31は、その底部が透光性樹脂21の凹部22に嵌合されて固定されている。すなわち、スリーブ31は、透光性樹脂21にその一端部が埋設されて固定されている。   The sleeve 31 is made of a translucent resin such as acrylic or polycarbonate, and is protected by a ferrule 41 as shown by a broken line so that an optical fiber 42 having a core at the center can be inserted. In the present embodiment, the sleeve 31 has a truncated cone shape with a top portion cut off, and has a bottomed cylindrical structure having a bottom. A convex lens 32 protruding in the top surface direction is formed integrally with the sleeve 31 at the center of the bottom surface of the sleeve 31, and the optical axis of the lens 32, the central axis of the sleeve 31, and the center of the optical fiber 42 are formed. It coincides with the axis. That is, the light emission center of the optical element 15 coincides with the central axis of the optical fiber 42. The bottom of the sleeve 31 is fixed by being fitted into the recess 22 of the translucent resin 21. That is, one end of the sleeve 31 is fixed in the translucent resin 21 and fixed.

なお、透光性樹脂21の凹部22からスリーブ31を抜け難くするために、凹部22とスリーブ31の底部側面の一方に凸部を設け、他方に凹部を設けて、その凹凸を係合させるようにしても差し支えない。   In order to make it difficult to remove the sleeve 31 from the concave portion 22 of the translucent resin 21, a convex portion is provided on one of the concave portion 22 and the bottom side surface of the sleeve 31, and a concave portion is provided on the other side so that the concave and convex portions are engaged. But it doesn't matter.

上記構造の光伝送装置は、次のように作製される。まず、リードフレーム11のダイパッド部12の所定位置に導電性材料により光素子15及び光伝送IC16を固着し、且つ光素子15及び光伝送IC16とリードフレーム11のインナリード部13とをAuワイヤ18でそれぞれ電気的に接続する。   The optical transmission device having the above structure is manufactured as follows. First, the optical element 15 and the optical transmission IC 16 are fixed to a predetermined position of the die pad part 12 of the lead frame 11 with a conductive material, and the optical element 15 and the optical transmission IC 16 and the inner lead part 13 of the lead frame 11 are connected to the Au wire 18. To make electrical connections.

次に、上型及び下型に分割された金型を用いて透光性樹脂21でリードフレーム11の外部端子14を除いて、光素子15、光伝送IC16、リードフレーム11のダイパッド部12、及びインナリード部13を封止すると共に、透光性樹脂21にスリーブ31をその一端部を埋設することにより固定する。例えば、下型の基準位置にリードフレーム11の基準位置を合わせて、下型にリードフレーム11を固定し、同様に、スリーブ31を上型の差込穴に固定し、上型及び下型を合わせた後、金型内に未硬化状態のエポキシ系の透光性樹脂を注入する。その後、透光性樹脂の半硬化状態で金型から取出して、加熱処理して透光性樹脂を固化させることにより、図1に示すように、スリーブ31が透光性樹脂21に埋設されて固定された光伝送装置1が完成される。   Next, the optical element 15, the optical transmission IC 16, the die pad portion 12 of the lead frame 11, except for the external terminal 14 of the lead frame 11 with a translucent resin 21 using a mold divided into an upper mold and a lower mold, The inner lead portion 13 is sealed, and the sleeve 31 is fixed to the translucent resin 21 by embedding one end portion thereof. For example, by aligning the reference position of the lead frame 11 with the reference position of the lower mold, the lead frame 11 is fixed to the lower mold, and similarly, the sleeve 31 is fixed to the insertion hole of the upper mold, and the upper mold and the lower mold are mounted. After the matching, an uncured epoxy-based translucent resin is injected into the mold. Thereafter, the sleeve 31 is embedded in the translucent resin 21 as shown in FIG. 1 by taking it out from the mold in a semi-cured state of the translucent resin and solidifying the translucent resin by heat treatment. The fixed optical transmission device 1 is completed.

図2は、本実施例の光伝送装置を用いた光伝送モジュール及び光コネクタの断面図である。   FIG. 2 is a cross-sectional view of an optical transmission module and an optical connector using the optical transmission apparatus of this embodiment.

図2に示すように、光伝送モジュール100は、図1に示す光伝送装置1と、光伝送装置1を収納する外囲器101とで構成され、光伝送装置1に対して光信号を送受信する光コネクタ40が取着される。   As illustrated in FIG. 2, the optical transmission module 100 includes the optical transmission device 1 illustrated in FIG. 1 and an envelope 101 that houses the optical transmission device 1, and transmits and receives optical signals to and from the optical transmission device 1. An optical connector 40 is attached.

外囲器101は、例えば、送信光に対して、遮光性を有する樹脂で形成され、収納部102aを有する第1のレセプタクル102と、収納部102aの蓋となる第2のレセプタクル103とからなる。この第1のレセプタクル102の収納部102a内に光伝送装置1が、スリーブ31の頂部及び外部端子14を外部に突出させた状態で収納される。そして、第2のレセプタクル103で蓋をして、光伝送装置1、第1のレセプタクル102、及び第2のレセプタクル103のそれぞれの隙間が遮光性の接着剤104で固着される。   The envelope 101 is made of, for example, a resin having a light shielding property against transmission light, and includes a first receptacle 102 having a storage portion 102a and a second receptacle 103 serving as a lid of the storage portion 102a. . The optical transmission device 1 is housed in the housing portion 102a of the first receptacle 102 with the top of the sleeve 31 and the external terminal 14 protruding outward. Then, the lid is covered with the second receptacle 103, and the respective gaps of the optical transmission device 1, the first receptacle 102, and the second receptacle 103 are fixed with the light-shielding adhesive 104.

光コネクタ40は、中心部に石英ガラス製の50μm径のコアと、その周りを覆うように配置されたクラッド層からなる光ファイバ42と、光ファイバ42を保護ずる金属製のフェルール41と、光ファイバ42等の保護及びスリーブ31への着脱を容易にするための遮光性樹脂製のプラグケース43とを有する。そして、この光コネクタ40の光ファイバ42をスリーブ31に差し込むと、プラグケース43はスリーブ31の外側面に接触して、光ファイバ42をスリーブ31に強固に固定する。光ファイバ42をスリーブ31に差し込むことにより、光ファイバ42の中心軸と伝送装置1の光素子15の発光中心とが一致する。   The optical connector 40 includes a 50 μm-diameter core made of quartz glass at the center, an optical fiber 42 composed of a cladding layer disposed so as to cover the periphery thereof, a metal ferrule 41 that protects the optical fiber 42, A plug case 43 made of a light-shielding resin for facilitating protection of the fiber 42 and the like and easy attachment to and removal from the sleeve 31 is provided. When the optical fiber 42 of the optical connector 40 is inserted into the sleeve 31, the plug case 43 comes into contact with the outer surface of the sleeve 31 and firmly fixes the optical fiber 42 to the sleeve 31. By inserting the optical fiber 42 into the sleeve 31, the central axis of the optical fiber 42 coincides with the emission center of the optical element 15 of the transmission device 1.

なお、スリーブ31またはプラグケース43に留め具(図示略)等を設けて、互いの結合をより強固にするようにしても良い。また、フェルール41は、金属製以外のセラミックあるいはプラスチック製であっても差し支えない。   Note that a fastener (not shown) or the like may be provided on the sleeve 31 or the plug case 43 so as to further strengthen the mutual coupling. Further, the ferrule 41 may be made of ceramic or plastic other than metal.

そして、光伝送モジュール100は、光伝送装置1の外部端子14から電源及び送信信号を供給することにより、光伝送IC16に制御された光素子15の光信号を光ファイバ42により送信することができる。   The optical transmission module 100 can transmit the optical signal of the optical element 15 controlled by the optical transmission IC 16 through the optical fiber 42 by supplying power and a transmission signal from the external terminal 14 of the optical transmission device 1. .

なお、光伝送モジュール100において、光伝送装置1は、遮光性の外囲器101で覆われ、また、透光性のスリーブ31の外囲器101から突出している部分は、遮光性のプラグケース43で覆われるので、光素子15の光信号は外部光により影響を受けることはない。   In the light transmission module 100, the light transmission device 1 is covered with a light-shielding envelope 101, and a portion of the light-transmitting sleeve 31 protruding from the envelope 101 is a light-shielding plug case. 43, the optical signal of the optical element 15 is not affected by external light.

以上のように構成された本実施例の光伝送装置によれば、透光性樹脂21の光素子15と対向する部分に、中心軸が光素子15の発光中心と一致するように凹部22を設けて、この凹部22にスリーブ31を嵌合することにより、スリーブ31の中心軸と光素子15の発光中心とが一致され、スリーブ31は透光性樹脂21に固定されている。従って、外囲器101と光伝送装置1とのクリアランス、光伝送装置1の透光性樹脂21のバリ等に関係なく、スリーブ31の中心軸と光素子15の発光中心とを一致させることができる。そのため、光素子15からの光信号が光ファイバ42に導入される割合を示す光結合効率を測定した結果、不良率1%以下で、光素子とコア径の小さな光ファイバとの光結合効率が安定する。   According to the optical transmission apparatus of the present embodiment configured as described above, the concave portion 22 is formed in the portion of the translucent resin 21 facing the optical element 15 so that the central axis coincides with the light emission center of the optical element 15. By providing and fitting the sleeve 31 into the recess 22, the central axis of the sleeve 31 and the light emission center of the optical element 15 are aligned, and the sleeve 31 is fixed to the translucent resin 21. Therefore, the central axis of the sleeve 31 and the light emission center of the optical element 15 can be matched regardless of the clearance between the envelope 101 and the optical transmission device 1, the burr of the translucent resin 21 of the optical transmission device 1, and the like. it can. Therefore, as a result of measuring the optical coupling efficiency indicating the rate at which the optical signal from the optical element 15 is introduced into the optical fiber 42, the optical coupling efficiency between the optical element and the optical fiber having a small core diameter is 1% or less. Stabilize.

また、凹部22に光ファイバ42を挿入することで、光素子15と光ファイバ42との距離を接近させることができ、光結合効率の向上を図れる。   Further, by inserting the optical fiber 42 into the recess 22, the distance between the optical element 15 and the optical fiber 42 can be made closer, and the optical coupling efficiency can be improved.

更に、スリーブ22の底面の中央部に凸形レンズ32を設け、光素子15からの光信号を光ファイバ42に効率よく伝送するようにしているので、光結合効率の向上を図れる。   Furthermore, since the convex lens 32 is provided at the center of the bottom surface of the sleeve 22 so that the optical signal from the optical element 15 is efficiently transmitted to the optical fiber 42, the optical coupling efficiency can be improved.

本発明の実施例2に係る光伝送装置について、図3を参照しながら説明する。図3は光伝送装置の構造を模式的に示す断面図である。本実施例は、上記実施例1の光素子を受光素子に、また光伝送ICを受信信号処理用の光伝送ICに置き換えた点で異なる。以下、上記実施例1と同一構成部分には同一の符号を付して、その説明は省略し、異なる構成部分について説明する。   An optical transmission apparatus according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing the structure of the optical transmission apparatus. This embodiment is different in that the optical element of the first embodiment is replaced with a light receiving element, and the optical transmission IC is replaced with an optical transmission IC for receiving signal processing. Hereinafter, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted, and different components will be described.

図3に示すように、光伝送装置2では、リードフレーム11のダイパッド部12に光素子として受光素子55が設けられ、この受光素子55に近接して受信信号処理用の光伝送IC56が設けられている。そして、上記実施例1とは逆に、信号光は、光ファイバ42から出射され、且つ凸形レンズ32で屈折されて、透光性樹脂21を介して受光素子55に導かれる。   As shown in FIG. 3, in the optical transmission device 2, a light receiving element 55 is provided as an optical element in the die pad portion 12 of the lead frame 11, and an optical transmission IC 56 for processing received signals is provided in the vicinity of the light receiving element 55. ing. Contrary to the first embodiment, the signal light is emitted from the optical fiber 42, refracted by the convex lens 32, and guided to the light receiving element 55 through the translucent resin 21.

上記構造の本実施例の光伝送装置によれば、上記実施例1と同様に、光結合効率の測定結果は、不良率0.4%以下で、受光素子と光ファイバとの光結合効率は、安定しており、また光結合効率の向上が図れる。   According to the optical transmission apparatus of the present embodiment having the above structure, the measurement result of the optical coupling efficiency is 0.4% or less, and the optical coupling efficiency between the light receiving element and the optical fiber is the same as in the first embodiment. It is stable and the optical coupling efficiency can be improved.

本発明の実施例3に係る光伝送装置について、図4を参照しながら説明する。図4は光伝送装置の構造を模式的に示す断面図である。本実施例は、上記実施例1とは、スリーブが、一端から他端まで貫通した構造を有し、またレンズが透光性樹脂の部分に形成されている点で異なる。以下、上記実施例1と同一構成部分には同一の符号を付して、その説明は省略し、異なる構成部分について説明する。   An optical transmission apparatus according to Embodiment 3 of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view schematically showing the structure of the optical transmission apparatus. The present embodiment is different from the first embodiment in that the sleeve has a structure penetrating from one end to the other end, and the lens is formed in the translucent resin portion. Hereinafter, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted, and different components will be described.

図4に示すように、本実施例の光伝送装置3では、スリーブ61は、一端から他端まで貫通した構造を有している。また、スリーブ61の一端の貫通孔内における透光性樹脂71の部分には、スリーブ61の他端側に透光性樹脂を突出させて形成した凸形レンズ62が形成されている。この凸形レンズ62の中心軸はスリーブ61及び光素子15の発光中心と一致している。   As shown in FIG. 4, in the optical transmission device 3 of the present embodiment, the sleeve 61 has a structure that penetrates from one end to the other end. Further, a convex lens 62 formed by projecting the translucent resin on the other end side of the sleeve 61 is formed in the portion of the translucent resin 71 in the through hole at one end of the sleeve 61. The central axis of the convex lens 62 coincides with the light emission center of the sleeve 61 and the optical element 15.

なお、本実施例では、レンズ62を透光性樹脂71に設けているので、スリーブ61は、必ずしも透光性材料で形成する必要はなく、透光性でない、金属、セラミクス、カーボン、樹脂、ガラスあるいはこれらの複合材料等で形成しても良い。   In the present embodiment, since the lens 62 is provided on the translucent resin 71, the sleeve 61 is not necessarily formed of a translucent material, and is not translucent, such as metal, ceramics, carbon, resin, You may form with glass or these composite materials.

上記構造の本実施例の光伝送装置によれば、上記実施例1と同様な効果が得られる他に、スリーブ61の形成材料の選択幅が広がるので、コスト低減が可能となる。また、スリーブ61を透光性以外の材料で形成した場合には、光素子の光信号が外部光の影響を受けることが少なく、伝送特性の向上が図れる。   According to the optical transmission apparatus of the present embodiment having the above structure, the same effects as those of the first embodiment can be obtained, and the selection range of the forming material of the sleeve 61 is widened, so that the cost can be reduced. In addition, when the sleeve 61 is formed of a material other than the light transmitting material, the optical signal of the optical element is hardly affected by the external light, and transmission characteristics can be improved.

また、上記実施例2と同様に、光素子15を受光素子に、また光伝送IC16を受信信号処理用の光伝送ICに置き換えても良いことは勿論である。   As in the second embodiment, the optical element 15 may be replaced with a light receiving element, and the optical transmission IC 16 may be replaced with an optical transmission IC for processing received signals.

本発明の実施例4に係る光伝送装置について、図5を参照しながら説明する。図5は光伝送装置の構造を模式的に示す断面図である。本実施例は、上記実施例1とは、レンズを更に追加し、2群からなるレンズ系を構成している点で異なる。以下、上記実施例1と同一構成部分には同一の符号を付して、その説明は省略し、異なる構成部分について説明する。   An optical transmission apparatus according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing the structure of the optical transmission apparatus. This embodiment is different from the first embodiment in that a lens is further added to form a two-group lens system. Hereinafter, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted, and different components will be described.

図5に示すように、本実施例の光伝送装置4は、スリーブ81内にレンズ32に近接して凸形レンズ83を設けている。このレンズ83は、両面凸形状を有し、光ファイバ42の挿入に影響しないように、レンズ32に近接させて設け、且つスリーブ81内壁に設けた突起87に、例えば、接着剤(図示略)で固定されている。また、レンズ83の光軸はスリーブ81の中心軸及び光素子15の発光中心に一致している。   As shown in FIG. 5, the optical transmission device 4 of the present embodiment is provided with a convex lens 83 in the sleeve 81 in the vicinity of the lens 32. This lens 83 has a double-sided convex shape, and is provided close to the lens 32 so as not to affect the insertion of the optical fiber 42 and is provided on a protrusion 87 provided on the inner wall of the sleeve 81, for example, an adhesive (not shown). It is fixed with. The optical axis of the lens 83 coincides with the central axis of the sleeve 81 and the light emission center of the optical element 15.

この光伝送装置4では、光伝送IC16に制御された光素子15の光信号は、透光性樹脂21を通過し、レンズ32及びレンズ83で屈折して、光ファイバ42に導入され、伝送される。   In this optical transmission device 4, the optical signal of the optical element 15 controlled by the optical transmission IC 16 passes through the translucent resin 21, is refracted by the lens 32 and the lens 83, is introduced into the optical fiber 42, and is transmitted. The

上記構造の本実施例の光伝送装置によれば、上記実施例1と同様な効果が得られる他に、2群のレンズ32、83により屈折されるので、光素子15からの光信号を的確に光ファイバ42の端面に集光することが可能となり、光素子15と光ファイバ42との光結合効率をより向上させることが可能となる。   According to the optical transmission device of the present embodiment having the above structure, the same effect as that of the first embodiment can be obtained, and since the light is refracted by the two groups of lenses 32 and 83, the optical signal from the optical element 15 is accurately obtained. In addition, the light can be condensed on the end face of the optical fiber 42, and the optical coupling efficiency between the optical element 15 and the optical fiber 42 can be further improved.

なお、上記実施例2と同様に、光素子15を受光素子に、また光伝送IC16を受信信号処理用の光伝送ICに置き換えても良いことは勿論である。   As in the second embodiment, the optical element 15 may be replaced with a light receiving element, and the optical transmission IC 16 may be replaced with an optical transmission IC for processing received signals.

本発明の実施例5に係る光伝送装置について、図6を参照しながら説明する。図6は光伝送装置の構造を模式的に示す断面図である。上記実施例1とは、リードフレームに位置合わせのための合わせ孔及びスリーブ部品に突起が追加されている点が異なる。以下、上記実施例1と同一構成部分には同一の符号を付して、その説明は省略し、異なる構成部分について説明する。   An optical transmission apparatus according to Embodiment 5 of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing the structure of the optical transmission apparatus. This embodiment differs from the first embodiment in that protrusions are added to alignment holes and sleeve parts for positioning in the lead frame. Hereinafter, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted, and different components will be described.

図6に示すように、本実施例の光伝送装置5では、リードフレーム11のダイパッド部12に位置合わせ孔19が形成されている。また、スリーブ91の一端部の底面には、先端部が細くなった突起97が形成され、その突起97の先端部がリードフレーム11の位置合せ孔19に挿入されている。   As shown in FIG. 6, in the optical transmission device 5 of the present embodiment, an alignment hole 19 is formed in the die pad portion 12 of the lead frame 11. Further, a protrusion 97 having a thin tip is formed on the bottom surface of one end of the sleeve 91, and the tip of the protrusion 97 is inserted into the alignment hole 19 of the lead frame 11.

リードフレーム11の位置合わせ孔19とスリーブ91の突起97は、光素子15の発光中心とスリーブ91の中心軸とが一致するような関係に設けられ、位置合わせ孔19に突起97の先端部を挿入し、且つ透光性樹脂21で固定することにより、リードフレーム11とスリーブ91の互いの位置が動かないように、突起97の先端を位置合わせ孔19に挿入して透光性樹脂21で固定されている。   The alignment hole 19 of the lead frame 11 and the protrusion 97 of the sleeve 91 are provided so that the light emission center of the optical element 15 coincides with the central axis of the sleeve 91, and the tip of the protrusion 97 is inserted into the alignment hole 19. By inserting and fixing with the translucent resin 21, the tip of the protrusion 97 is inserted into the alignment hole 19 so that the mutual positions of the lead frame 11 and the sleeve 91 do not move. It is fixed.

上記構造の光伝送装置5は、次のように作製される。まず、上記実施例1と同様に、リードフレーム11のダイパッド部12の所定位置に導電性材料により光素子15及び光伝送IC16を固着し、且つ光素子15及び光伝送IC16とリードフレーム11のインナリード部13とをAuワイヤ18でそれぞれ電気的に接続する。   The optical transmission device 5 having the above structure is manufactured as follows. First, similarly to the first embodiment, the optical element 15 and the optical transmission IC 16 are fixed to a predetermined position of the die pad portion 12 of the lead frame 11 with a conductive material, and the optical element 15, the optical transmission IC 16 and the inner portion of the lead frame 11 are fixed. The lead part 13 is electrically connected to each other by an Au wire 18.

次に、下型の基準位置にリードフレーム11の基準位置を合わせて、下型にリードフレーム11を固定し、スリーブ91の突起97の先端部をリードフレーム11の位置合わせ孔19に差し込み、上型と下型とを組み合わせる。その後、上記実施例1と同様に、金型内に未硬化状態のエポキシ系の透光性樹脂を注入し、透光性樹脂の半硬化状態で金型から取出して、加熱処理して透光性樹脂を固化させることにより、図6に示すような光伝送装置5が完成する。   Next, the reference position of the lead frame 11 is aligned with the reference position of the lower mold, the lead frame 11 is fixed to the lower mold, the tip of the projection 97 of the sleeve 91 is inserted into the alignment hole 19 of the lead frame 11, and the upper Combine the mold and the lower mold. Thereafter, as in Example 1 above, an uncured epoxy-based translucent resin is injected into the mold, and the translucent resin is taken out of the mold in a semi-cured state, and heat-treated to transmit the light. The optical transmission device 5 as shown in FIG. 6 is completed by solidifying the conductive resin.

上記構造の本実施例の光伝送装置によれば、上記実施例1による効果の他に、スリーブ91の突起97をリードフレーム11の位置合わせ孔19に差し込むことにより、スリーブ91をリードフレーム11に固定している。従って、スリーブ91を透光性樹脂21に固定する際、透光性樹脂の流れによる応力あるいは固化時の応力等による光素子15とスリーブ91との相対的な位置ずれを低減することが可能となる。そのため、光素子15の発光中心とスリーブ91の中心軸との位置合せをより正確に行え、光結合効率のばらつきをより小さくすることができる。   According to the optical transmission device of the present embodiment having the above structure, in addition to the effects of the first embodiment, the sleeve 91 is attached to the lead frame 11 by inserting the protrusion 97 of the sleeve 91 into the alignment hole 19 of the lead frame 11. It is fixed. Therefore, when the sleeve 91 is fixed to the translucent resin 21, it is possible to reduce relative displacement between the optical element 15 and the sleeve 91 due to stress due to the flow of the translucent resin or stress during solidification. Become. Therefore, alignment between the light emission center of the optical element 15 and the central axis of the sleeve 91 can be performed more accurately, and variation in optical coupling efficiency can be further reduced.

なお、スリーブ91の突起97は、その先端部の細い部分がリードフレーム11の位置合わせ孔19を貫通し、透光性樹脂21の外側面まで延びるようにしても差し支えない。また、スリーブ91とリードフレーム11の間隔を一定にする目的であれば、例えば、スリーブ91の突起97は、先端部を細くする必要はなく、リードフレーム11に当接させる構成としても差し支えない。   It should be noted that the protrusion 97 of the sleeve 91 may be such that a thin portion at the tip thereof passes through the alignment hole 19 of the lead frame 11 and extends to the outer surface of the translucent resin 21. For the purpose of making the interval between the sleeve 91 and the lead frame 11 constant, for example, the protrusion 97 of the sleeve 91 does not need to have a thin tip, and may be configured to contact the lead frame 11.

また、上記実施例2と同様に、光素子15を受光素子に、また光伝送IC16を受信信号処理用の光伝送ICに置き換えても良いことは勿論である。   As in the second embodiment, the optical element 15 may be replaced with a light receiving element, and the optical transmission IC 16 may be replaced with an optical transmission IC for processing received signals.

本発明は、上述した実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲内で、種々、変形して実施することができる。   The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

例えば、上記実施例5の突起は、上記実施例2乃至実施例4の光伝送装置に適用しても良い。   For example, the protrusion of the fifth embodiment may be applied to the optical transmission devices of the second to fourth embodiments.

また、上記実施例3において、スリーブの一端部内に外付レンズを配設することは差し支えない。その場合、透光性樹脂部分にレンズを必ずしも設ける必要ない。上記実施例4において、外付レンズを高性能なレンズとした場合には、スリーブの一端部内に設けたレンズは、凸部のない平板としても差し支えない。   In the third embodiment, an external lens may be disposed in one end of the sleeve. In that case, it is not always necessary to provide a lens in the translucent resin portion. In Example 4 described above, when the external lens is a high-performance lens, the lens provided in one end of the sleeve may be a flat plate without a convex portion.

また、スリーブは截頭円錐形の外形構造の例を示したが、透光性樹脂から突出している部分が円柱形構造であっても差し支えない。その場合、光コネクタのプラグケースの形状はスリーブの外形に合わせて変更されることは言うまでもない。   Moreover, although the sleeve showed the example of the frusto-conical external structure, even if the part which protrudes from translucent resin is a cylindrical structure, it does not interfere. In that case, needless to say, the shape of the plug case of the optical connector is changed according to the outer shape of the sleeve.

また、透光性樹脂を遮光性の外囲器に収納する例を示したが、送信光あるいは受信光の伝送に係らないスリーブの一部及び透光性樹脂の周囲を、遮光性の材料で覆うことは差し支えない。   In addition, although an example in which the translucent resin is stored in a light-shielding envelope has been shown, a part of the sleeve that is not involved in transmission of transmission light or reception light and the periphery of the translucent resin are made of a light-shielding material. It is okay to cover.

本発明の実施例1に係る光伝送装置の構造を模式的に示すもので、図1(a)は平面図、図1(b)は図1(a)のA−A線に沿った断面図。BRIEF DESCRIPTION OF THE DRAWINGS It shows typically the structure of the optical transmission apparatus which concerns on Example 1 of this invention, Fig.1 (a) is a top view, FIG.1 (b) is the cross section along the AA of Fig.1 (a). Figure. 本発明の実施例1に係る光伝送装置を用いた光伝送モジュール及び光コネクタの模式的な断面図。1 is a schematic cross-sectional view of an optical transmission module and an optical connector that use an optical transmission device according to Embodiment 1 of the present invention. 本発明の実施例2係る光伝送装置の構造を模式的に示す断面図。Sectional drawing which shows typically the structure of the optical transmission apparatus which concerns on Example 2 of this invention. 本発明の実施例3係る光伝送装置の構造を模式的に示す断面図。Sectional drawing which shows typically the structure of the optical transmission apparatus which concerns on Example 3 of this invention. 本発明の実施例4係る光伝送装置の構造を模式的に示す断面図。Sectional drawing which shows typically the structure of the optical transmission apparatus which concerns on Example 4 of this invention. 本発明の実施例5係る光伝送装置の構造を模式的に示す断面図。Sectional drawing which shows typically the structure of the optical transmission apparatus which concerns on Example 5 of this invention.

符号の説明Explanation of symbols

1、2、3、4、5 光伝送装置
11 リードフレーム
12 ダイパッド部
13 インナリード部
14 外部端子
15、55 光素子
16、56 光伝送IC
18 ワイヤ
19 位置合わせ孔
21、71 透光性樹脂
22 凹部
31、61、81、91 スリーブ
32、62、83 レンズ
40 光コネクタ
41 フェルール
42 光ファイバ
43 プラグケース
87、97 突起
100 光伝送モジュール
101 外囲器
102 第1のレセプタクル
102a 収納部
103 第2のレセプタクル
104 接着剤
1, 2, 3, 4, 5 Optical transmission device 11 Lead frame 12 Die pad part 13 Inner lead part 14 External terminal 15, 55 Optical element 16, 56 Optical transmission IC
18 Wire 19 Alignment hole 21, 71 Translucent resin 22 Recess 31, 61, 81, 91 Sleeve 32, 62, 83 Lens 40 Optical connector 41 Ferrule 42 Optical fiber 43 Plug case 87, 97 Protrusion 100 Optical transmission module 101 Outside Enclosure 102 First receptacle 102a Storage portion 103 Second receptacle 104 Adhesive

Claims (5)

基板と、
前記基板の表面に搭載された光素子と、
前記光素子及び前記基板の一部を封止する透光性樹脂と、
前記光素子と対向する前記透光性樹脂部分に一端部が埋設されて固着され、光ファイバを着脱可能に内設するためのスリーブと
を具備したことを特徴とする光伝送装置。
A substrate,
An optical element mounted on the surface of the substrate;
A translucent resin that seals part of the optical element and the substrate;
An optical transmission device comprising: a sleeve for embedding and fixing an optical fiber in an end portion embedded in and fixed to the translucent resin portion facing the optical element.
前記スリーブの一端内部にレンズを有することを特徴とする請求項1に記載の光伝送装置。   The optical transmission device according to claim 1, further comprising a lens inside one end of the sleeve. 前記光素子と対向する前記透光性樹脂部分に、前記透光性樹脂と一体形成されたレンズを有することを特徴とする請求項1に記載の光伝送装置。   The optical transmission device according to claim 1, further comprising: a lens integrally formed with the translucent resin in the translucent resin portion facing the optical element. 前記光素子と対向する前記透光性樹脂部分に凹部が設けられ、前記凹部に前記スリーブの一端部が嵌合されていることを特徴とする請求項1乃至3のいずれか1項に記載の光伝送装置。   The recessed part is provided in the said translucent resin part facing the said optical element, The one end part of the said sleeve is fitted by the said recessed part, The Claim 1 characterized by the above-mentioned. Optical transmission device. 前記スリーブの前記一端部に、前記基板に接触する突起を有することを特徴とする請求項1乃至4のいずれか1項に記載の光伝送装置。   5. The optical transmission device according to claim 1, wherein a projection that contacts the substrate is provided at the one end of the sleeve.
JP2004342274A 2004-11-26 2004-11-26 Optical transmission apparatus Pending JP2006154084A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066511A (en) * 2006-09-07 2008-03-21 Fuji Xerox Co Ltd Optical transmission module, method of manufacturing optical transmission module, and optical transmission apparatus
JP2008090097A (en) * 2006-10-04 2008-04-17 Yazaki Corp Optical element module
JP2011529205A (en) * 2008-07-22 2011-12-01 ナショナル セミコンダクタ コーポレイション Mold optical package with fiber coupling
JP2012208146A (en) * 2011-03-29 2012-10-25 Sumitomo Electric Ind Ltd Method of manufacturing optical module
JP2022112057A (en) * 2021-01-21 2022-08-02 矢崎総業株式会社 Optical transceiver module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066511A (en) * 2006-09-07 2008-03-21 Fuji Xerox Co Ltd Optical transmission module, method of manufacturing optical transmission module, and optical transmission apparatus
JP2008090097A (en) * 2006-10-04 2008-04-17 Yazaki Corp Optical element module
JP2011529205A (en) * 2008-07-22 2011-12-01 ナショナル セミコンダクタ コーポレイション Mold optical package with fiber coupling
TWI459062B (en) * 2008-07-22 2014-11-01 Nat Semiconductor Corp Integrated circuit package and optical concentrator for integrated circuit package
JP2012208146A (en) * 2011-03-29 2012-10-25 Sumitomo Electric Ind Ltd Method of manufacturing optical module
JP2022112057A (en) * 2021-01-21 2022-08-02 矢崎総業株式会社 Optical transceiver module
JP7593814B2 (en) 2021-01-21 2024-12-03 矢崎総業株式会社 Optical Transmitter/Receiver Module

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