JP2006123308A - Laminated structure of thin plate parts and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a layered structure of sheet-shape parts in which holes with small openings can be penetration worked even when a thickness of the sheet-shape part is large, and which have no risk of causing defects such as liquid leakage at the time of lamination. <P>SOLUTION: In the layered structure in which a plurality of the sheet-shape parts including the sheet-shape parts with through holes formed are laminated, and a passage for a fluid is formed by the through holes, a connection hole 37 as the through hole has both a recess 50 preliminarily formed by half etching at least in one face of a base plate 16 as the sheet-shape part, and the opening 51 formed penetrating by press working in a bottom face of the recess 50. The through hole of a small opening diameter to the thickness of the sheet-shape part can thus be bored, and at the same time a flash 53 of the opening 51 can be prevented from causing a lamination defect. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a structure for fixing a plurality of thin plate-like components in a laminated form and a manufacturing method thereof, and is applied to a laminated body such as an ink jet head.

  As a laminated structure of thin plate components, for example, a cavity unit of an ink jet head as described in Patent Document 1 is known. The cavity unit has a piezoelectric actuator joined to the back surface thereof, and drives the piezoelectric actuator to selectively eject ink from nozzles provided in the cavity unit to record an image on a recording medium.

This cavity unit has a nozzle plate in which nozzles are formed in a row, a cavity plate having a pressure chamber for each nozzle, and distributes ink to the pressure chambers between these plates to supply the nozzles with the ink. And a plurality of plates on which ink flow paths are formed, and these are laminated and formed via an adhesive. As the ink flow path, each plate is formed with large and small through holes in the thickness direction.
Japanese Patent Application Laid-Open No. 2004-223880 (see FIGS. 3, 4 and 5)

  However, when the through hole is processed by wet etching, the opening diameter of the hole that can be penetrated is limited by the plate thickness dimension of the plate, and in general, about 1.5 times the plate thickness dimension is opened. It is the lower limit of the caliber. Therefore, when trying to make a through hole with a small opening diameter, it is necessary to reduce the thickness of the plate, and it is necessary to secure the rigidity of the plate or to increase the volume of the ink flow path formed in the plate. It was a problem.

  In addition, as another method for forming a through-hole having a small opening diameter, press working may be mentioned. In press working, a sag (deformation) or a burr (projection) is generated around the opening due to shearing. When laminating a plate with through-holes formed by pressing on another plate, the burrs hinder the adhesion between the plates, which causes a problem of poor adhesion and fluid leakage.

  The present invention solves the above-mentioned problem, and even if the thickness of the thin plate-like component is thick, the thin plate-like component can be processed by penetrating a small opening and there is no fear of causing problems such as fluid leakage during lamination. The object is to provide a structure and a manufacturing method thereof.

  In order to achieve the above object, in the laminated structure of thin plate parts according to the first aspect of the present invention, a plurality of thin plate parts including a thin plate part in which a through hole is formed are stacked, and the fluid is passed through the through hole. In the laminated structure in which the flow path is configured, the through-hole includes a recess formed in advance by half-etching on at least one surface of the thin plate-shaped component, and an opening formed by pressing in the bottom surface of the recess. It is characterized by having.

  According to a second aspect of the present invention, in the laminated structure of the thin plate-like component according to the first aspect, the opening is a thin plate-like component having an opening smaller than the diameter of the concave portion on the bottom surface of the half-etched concave portion. It is processed in the plate thickness direction.

  According to a third aspect of the present invention, in the laminated structure of thin plate-like parts according to the first or second aspect, the through holes are half-etched previously formed at corresponding positions on both sides of the thin-film part. And the opening formed so as to allow the two concave portions to communicate with each other at the bottom surface of the two concave portions.

  According to a fourth aspect of the present invention, in the laminated structure of the thin plate part according to the first or second aspect, the through hole includes a half-etched recess formed in advance on one surface of the thin plate part, An opening formed by pressing from the other surface side of the thin plate-like component is provided on the bottom surface of the concave portion.

  According to a fifth aspect of the present invention, in the laminated structure of the thin plate-like component according to the first or second aspect, the through hole includes a half-etched depression formed in advance on one surface of the thin plate-like component, The thin plate-like component that is formed on the bottom surface of the concave portion with an opening made by pressing from the one surface side and is laminated on the other surface side of the thin plate-like component has a position corresponding to the through hole. A flow path pattern larger than the opening of the through hole is arranged.

  The invention according to claim 6 is the laminated structure of thin plate parts according to any one of claims 1 to 5, wherein the thin plate part is a plate for an inkjet head including a plurality of nozzles, The flow path is an ink flow path for supplying ink from an ink supply source to each nozzle.

  According to a seventh aspect of the present invention, there is provided a method for manufacturing a laminated structure of thin plate-like components, wherein a plurality of thin plate-like components including a thin plate-like component having a through hole are laminated, and a fluid flow path is constituted by the through hole. In the method for manufacturing a laminated structure, a recess is formed in advance on at least one surface of a thin plate-shaped part by half etching, and an opening is formed through the bottom surface of the recess by pressing, and the through hole is formed by the recess and the opening. It is characterized by comprising.

  The invention according to claim 8 is the method for manufacturing a laminated structure of thin plate-like parts according to claim 7, wherein the opening is an opening smaller than the diameter of the recessed portion on the bottom surface of the recessed portion of the half etching. The thin plate-like component is processed in the plate thickness direction.

  The invention according to claim 9 is the method for manufacturing a laminated structure of thin plate parts according to claim 7 or 8, wherein the recesses are formed by half etching at corresponding positions on both surfaces of the thin plate parts. In addition, the openings are formed in the bottom surfaces of the two concave portions so as to allow the two concave portions to communicate with each other.

  The invention according to claim 10 is the method for manufacturing a laminated structure of thin plate parts according to claim 7 or 8, wherein the recess is formed on one surface of the thin plate part by the half etching, The opening is formed at a position corresponding to the bottom surface of the concave portion from the other surface side of the thin plate-like component.

  The invention according to claim 11 is the method for producing a laminated structure of thin plate parts according to claim 7 or 8, wherein the recess is formed on one surface of the thin plate part by the half etching, An opening is formed in the bottom surface of the recess from the one surface side, and a flow path pattern larger than the opening of the through hole is formed on the other surface side of the thin plate-like component at a position corresponding to the through hole. A thin plate-like component is laminated.

  According to the first aspect of the present invention, since the through hole is constituted by the concave portion formed in advance by half etching on the thin plate-like component and the opening formed through the bottom surface of the concave portion by press working, the plate thickness is increased. On the other hand, it is possible to form through holes with a small diameter, which is difficult by etching alone, and the thickness of the portion where the opening is formed by pressing becomes thinner than the thickness of the thin plate-like part, so that a through hole with a small diameter is formed. It can be formed easily.

  According to the second aspect of the present invention, the opening having a small diameter is formed in the bottom surface of the recess having the thin plate thickness. In other words, since it is not necessary to reduce the thickness of the entire thin plate-like component in order to drill an opening having a small diameter, there is an effect that the rigidity of the thin plate-like component does not decrease.

  According to the third aspect of the present invention, since the half-etched recesses are formed on both surfaces of the thin plate-like component, even if the opening is pressed from any recess side, the burrs are always formed on the opposite recesses. Since it is located on the inner side, it is possible to prevent poor lamination adhesion and flow path connection leakage due to the occurrence of burrs on the laminated surface of the thin plate-like parts.

  According to the invention described in claim 4, since the burrs of the pressed openings are always located inside the recesses of the half etching, the adhesion failure of the lamination due to the occurrence of burrs on the lamination surface of the thin plate-like component and Connection leakage of the flow path can be prevented.

  According to the fifth aspect of the present invention, the burr of the pressed opening is generated on the laminated surface of the thin plate component, but the flow path pattern of the other thin plate component in which the burr is laminated on the thin plate component. Therefore, it is possible to prevent the adhesion failure of the lamination and the connection leakage of the flow path due to the generation of the burr on the lamination surface of the thin plate-like component.

  According to the invention described in claim 6, in the ink jet head, it is possible to prevent poor adhesion of lamination of the plates and ink leakage at the connection of the flow paths.

  According to the seventh aspect of the present invention, since the concave portion is previously formed in the thin plate-like component by half etching, and the opening is formed in the bottom surface of the concave portion to form the through hole, it is difficult only by etching with respect to the plate thickness. Through holes with a small diameter can be formed, and the thickness of the part where the opening is formed by pressing is thinner than the thickness of the original thin plate part, making it easy to form a through hole with a small diameter. Can be formed.

  According to the eighth aspect of the present invention, an opening having a small diameter is formed in the bottom surface of the recess having a reduced plate thickness. In other words, since it is not necessary to reduce the thickness of the entire thin plate-like component in order to drill an opening having a small diameter, there is an effect that the rigidity of the thin plate-like component does not decrease.

  According to the ninth aspect of the present invention, since the half-etched concave portions are formed on both surfaces of the thin plate-like component, the burr is always formed on the opposite concave portion even if the opening is pressed from any concave portion side. Since it is located on the inner side, it is possible to prevent poor lamination adhesion and flow path connection leakage due to the occurrence of burrs on the laminated surface of the thin plate-like parts.

  According to the invention described in claim 10, since the burr of the pressed opening is always located inside the half-etched concave portion, the adhesion failure of the lamination due to the occurrence of the burr on the lamination surface of the thin plate-like component and Connection leakage of the flow path can be prevented.

  According to the eleventh aspect of the present invention, the burrs of the pressed openings are generated on the laminated surface of the thin plate-like component, and the burrs are flow paths of other thin plate-like components laminated on the thin plate-like component. Since it is always located inside the pattern, it is possible to prevent poor lamination adhesion and flow path connection leakage due to the occurrence of burrs on the laminated surface of the thin plate-like parts.

  Hereinafter, a basic embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an inkjet head to which the present invention is applied, FIG. 2 is an exploded perspective view of the inkjet head, FIG. 3 is an enlarged exploded perspective view of a cavity unit, and FIG. 4 is an enlarged sectional view taken along line IV-IV in FIG. FIG. 5A is a cross-sectional view showing a state in which concave portions are formed on both surfaces of a plate in forming a through hole having a small opening diameter, and FIG. 5B is a cross-sectional view showing a state in which openings are formed in the concave portions. 6 (a) is a cross-sectional view showing a state in which a concave portion is formed on one surface of a plate in forming a through hole having a small opening diameter, FIG. 6 (b) is a cross-sectional view showing a state in which an opening is formed in the concave portion, and FIG. ) Is a cross-sectional view showing a state in which a concave portion is formed on one surface of a plate in forming a through hole having a small opening diameter, and FIG. 7B is a cross-sectional view showing a state in which an opening is formed in the concave portion and another plate is laminated. is there.

  FIG. 1 is a perspective view of a cavity unit 1 and a piezoelectric actuator 2 in a piezoelectric inkjet head 100 to which the present invention is applied as an embodiment. The cavity unit 1 having a plurality of plates made of a metal plate has a plate type. A piezoelectric actuator 2 is joined, and a flexible flat cable 3 for connection to an external device is laminated and joined to the upper surface of the plate-type piezoelectric actuator 2. Then, it is assumed that ink is ejected downward from the nozzle 4 opened on the lower surface side of the cavity unit 1 (see FIG. 4).

  As shown in FIG. 2, the cavity unit 1 includes a total of eight plates including a nozzle plate 11, a spacer plate 12, a damper plate 13, two manifold plates 14a and 14b, a supply plate 15, a base plate 16, and a cavity plate 17. It has a structure in which thin plates are joined together with adhesive.

  In the embodiment, each of the plates 11 to 17 has a thickness of about 50 to 150 μm, the nozzle plate 11 is made of synthetic resin such as polyimide, and the other plates 12 to 17 are made of 42% nickel alloy steel plate. The nozzle plate 11 is provided with a large number of ink ejection nozzles 4 having a minute diameter (in the embodiment, about 25 μm) at minute intervals. The nozzles 4 are arranged in five rows in a staggered manner along the long side direction (X direction) of the nozzle plate 11.

  In the cavity plate 17, as shown in FIG. 3, a plurality of pressure chambers 36 are arranged in five rows in a staggered arrangement along the long side (the X direction) of the cavity plate 17. In the embodiment, each of the pressure chambers 36 is formed in an elongated shape in plan view, and the longitudinal direction thereof is formed along the short side direction (Y direction) of the cavity plate 17, and one end portion 36 a in the longitudinal direction is formed. The other end 36b communicates with a common ink chamber 7 described later.

  The distal end portion 36a in each pressure chamber 36 has a small diameter that is drilled in a staggered arrangement in the base plate 16, the supply plate 15, the two manifold plates 14b and 14a, the damper plate 13, and the spacer plate 12. The nozzles 11 communicate with the nozzles 4 through the communication holes 37.

  In the base plate 16 adjacent to the lower surface of the cavity plate 17, a connection hole 38 connected to the other end 36 b of each pressure chamber 36 is formed.

  The supply plate 15 adjacent to the lower surface of the base plate 16 is provided with a connection flow path 40 for supplying ink from the common ink chamber 7 described later to each pressure chamber 36. Each connection channel 40 has an inlet hole 40a into which ink enters from the common ink chamber 7, an outlet hole 40b opened to the pressure chamber 36 (connection hole 38) side, and an inlet hole 40a and an outlet hole 40b. And a constricted portion formed with a reduced cross-sectional area so as to provide the largest flow path resistance in the connection flow path 40.

  The two manifold plates 14a and 14b are formed with five common ink chambers 7 extending through the plate thickness so as to extend along each row of the nozzles 4 along the long side direction (X direction). ing. That is, as shown in FIGS. 2 and 4, two manifold plates 14a and 14b are stacked, and the upper surface thereof is covered with the supply plate 15, and the lower surface is covered with the damper plate 13, so that a total of five common plates are used. An ink chamber (manifold chamber) 7 is formed in a sealed state. Each of the common ink chambers 7 extends in the row direction of the pressure chambers 36 (the row direction of the nozzles 4) so as to overlap with a part of the pressure chamber 36 when viewed in plan from the stacking direction of the plates.

  As shown in FIGS. 3 and 4, a damper chamber 45 isolated from the common ink chamber 7 is formed as a recess on the lower surface side of the damper plate 13 adjacent to the lower surface of the manifold plate 14a. The positions and shapes of the damper chambers 45 are matched with the common ink chambers 7, as shown in FIG. Since the damper plate 13 is a metal material that can be elastically deformed as appropriate, the thin plate-like ceiling portion above the damper chamber 45 can freely vibrate both on the common ink chamber 7 side and on the damper chamber 45 side. it can. Even when the pressure fluctuation generated in the pressure chamber 36 propagates to the common ink chamber 7 during ink ejection, the ceiling portion elastically deforms and vibrates, thereby producing a damper effect that absorbs and attenuates the pressure fluctuation. It is possible to prevent the crosstalk that the fluctuation propagates to the other pressure chambers 36.

  In addition, as shown in FIG. 2, four ink supply ports 47 are formed in the end portions on one short side of the cavity plate 17, the base plate 16, and the supply plate 15 so as to correspond to the upper and lower positions. Has been. Ink from the ink supply source communicates with the one end portion of the common ink chamber 7 from these ink supply ports 47. The four ink supply ports 47 are individually labeled 47a, 47b, 47c, and 47d in order from the left side of FIG.

  In the ink flow path from the ink supply port 47 to the nozzle 4, the ink is supplied from the ink supply port 47 to the common ink chamber 7 serving as an ink supply channel, and then connected to the supply plate 15 as shown in FIG. 3. Distribution is supplied to each pressure chamber 36 through the passage 40 and the connection hole 38 of the base plate 16. Then, by driving the piezoelectric actuator 2, the ink passes from the inside of each pressure chamber 36 through the communication hole 37 and reaches the nozzle 4 corresponding to the pressure chamber 36.

  In this embodiment, as shown in FIG. 2, four ink supply ports 47 are provided, whereas five common ink chambers 7 are provided, and only two ink supply ports 47a are common. The ink chambers 7 and 7 are connected. The ink supply port 47a is set so that black ink is supplied, and it is considered that black ink is used more frequently than other color inks. The other ink supply ports 47b, 47c, and 47d are supplied with yellow, magenta, and cyan inks, respectively. A filter body 20 having a filtration portion 20a corresponding to each opening is attached to the ink supply ports 47a, 47b, 47c, and 47d with an adhesive or the like (see FIG. 1).

  On the other hand, the piezoelectric actuator 2 has a structure in which a plurality of piezoelectric sheets are laminated, although not shown, like the known one disclosed in Japanese Patent Laid-Open No. 4-341833 etc., and the thickness of one sheet is about 30 μm. On the top surface (wide surface) of the even-numbered piezoelectric sheet from the bottom among the piezoelectric sheets, narrow individual electrodes are provided in the long side direction (X direction) at locations corresponding to the pressure chambers 36 in the cavity unit 1. Are formed in rows. A common electrode common to the plurality of pressure chambers 36 is formed on the upper surface (wide surface) of the odd-numbered piezoelectric sheet from the bottom, and a surface electrode 48 is formed on the upper surface of the uppermost sheet. A surface electrode electrically connected to each of the individual electrodes and a surface electrode electrically connected to the common electrode are provided.

  An adhesive sheet (not shown) made of an ink non-permeable synthetic resin material as an adhesive is formed on the entire lower surface (the wide surface facing the pressure chamber 36) of the plate-type piezoelectric actuator 2 having such a configuration. Next, the piezoelectric actuator 2 is bonded and fixed to the cavity unit 1 with the individual electrodes corresponding to the pressure chambers 36 in the cavity unit 1. Also, the flexible flat cable 3 (see FIG. 4) is pressed against the upper surface of the piezoelectric actuator 2 so that various wiring patterns (not shown) in the flexible flat cable 3 are It is electrically joined to the surface electrode 48.

  Next, the manufacturing method of the plate which comprises the cavity unit 1 mentioned above is demonstrated. Nozzle 4 is formed in the nozzle plate 11 made of polyimide by laser processing, and the ink supply port 47, the common ink chamber 7, the communication hole 37, the connection hole 38, the connection flow are formed in each of the metal plates 12 to 17. Recesses such as the passages 40 and the damper chambers 45 and through holes are appropriately formed by etching, electric discharge machining, plasma machining, laser machining, or the like. Of the through holes drilled in the metal plates 12 to 17, processing when the opening diameter is particularly small will be described in detail with reference to the base plate 16.

  As described above, the base plate 16 is provided with a communication hole 37 in the thickness direction as a through hole (see FIG. 3). In forming the communication holes 37, first, as shown in FIG. 5A, concave portions 50 are formed by half-etching at corresponding positions on both surfaces of the base plate 16, respectively (in FIGS. 2, 3, and 4). The recess 50 is not shown). Half etching is performed by wet etching with an etchant of the base plate 16 which is a metal plate. Depending on the material of the plate forming the through hole, the recess can be formed by plasma processing, laser processing, or the like.

  Next, as shown in FIG. 5 (b), an opening 51 smaller than the diameter of the recess 50 is formed by pressing so that both recesses communicate with the bottom surface of the recess 50. In the opening 51, a sag 52 is generated on the end surface on the pressing side, and a burr 53 is generated on the end surface on the opposite side. However, since these sagging 52 and burrs 53 are generated inside the recess 50, they do not occur on the upper and lower laminated surfaces of the base plate 16. If the burr 53 is at the interface between the base plate 16 and the cavity plate 17 or between the base plate 16 and the supply plate 15, leakage of connection in the ink flow path and poor adhesion of the laminated surface are caused. By being positioned in the position, there is no fear of impairing the adhesion between the plates. These sagging 52 and burrs 53 are inside the concave portion 50 that is an ink flow path, but the influence on the ink flow is extremely small.

  When trying to process the communication hole 37 in the metal base plate 16 by wet etching, generally, only an opening having a diameter of 1.5 L0 or more can be formed with respect to the plate thickness dimension L0 of the base plate 16. However, in the present invention, as described above, by eliminating the adverse effect of the burr 53, it is possible to employ press working for drilling the opening. Compared with the case where the opening is formed by wet etching, the pressing process has less restrictions on the opening diameter due to the thickness of the plate, so that it is easy to form an opening having a small diameter. Of course, the dimension between the bottom surfaces of both concave portions 50, that is, the plate thickness dimension L1 of the portion where the opening 51 is formed is thinner than the plate thickness dimension L0 of the base plate 16 (L1 <L0). The ease of processing is improved.

  Further, according to this manufacturing method, when the opening 51 having the same diameter is drilled, the thickness of the base plate 16 can be increased, so that the rigidity of the entire plate can be increased.

  Next, a first application example in the above-described method for manufacturing a through hole having a small opening diameter will be described using the communication hole 37 of the base plate 16 as an example. In this first application example, as shown in FIG. 6A, a recess 50 is formed by half-etching on one surface (upper surface in the drawing) of the base plate 16 at a position where the communication hole 37 is to be formed. . Next, as shown in FIG. 6B, an opening 51 is formed by pressing at a position corresponding to the bottom surface of the recess 50 from the other surface (lower surface in the drawing) side of the base plate 16. Also in this case, since the plate thickness dimension L2 in which the opening 51 is formed is thinner than the plate thickness dimension L0 of the base plate 16 (L2 <L0), it is easy to form the aperture diameter small. Further, since the burr 53 of the opening 51 is always generated inside the recess 50, the burr 53 does not hinder the close contact between the base plate 16 and the plates stacked above and below it.

  Next, a second application example in the above-described method for manufacturing a through hole having a small opening diameter will be described. In the second application example, a case where the second application example is applied to the connection hole 38 formed in the base plate 16 will be described. As shown in FIG. 7A, a recess 50 is formed by half-etching on the surface of the base plate 16 on the cavity plate 17 side (upper surface in the drawing) at a position where the connection hole 38 is to be formed. Then, as shown in FIG. 7B, an opening 51 is formed in the bottom surface of the recess 50 by pressing from the cavity plate 17 side (the upper side in the figure). Therefore, in this case, the burr 53 of the opening 51 is generated by protruding on the laminated surface of the base plate 16 on the supply plate 15 side (lower side in the drawing).

  As described above, the connection plate 40 is formed in the supply plate 15 so as to communicate with the connection hole 38. The opening diameter D2 of the outlet hole 40b of the connection channel 40 is set to the opening diameter of the connection hole 38. It is set to be larger than D1 (D2> D1). Thereby, when the base plate 16 is stacked on the upper surface of the supply plate 15, the burr 53 is positioned inside the outlet hole 40 b, so that the close contact between the base plate 16 and the supply plate 15 is not hindered by the burr 53.

  In the description of the manufacturing method of the through hole having a small opening diameter, the communication hole 37 and the connection hole 38 of the base plate 16 are exemplified, but it goes without saying that the method may be applied to the through holes of other plates. For example, when the above manufacturing method is applied to the communication hole 37 of the manifold plate 14a (14b), the plate thickness dimension of the manifold plate 14a (14b) can be made larger than the opening diameter of the communication hole 37. The capacity of the common ink chamber (14b) can be increased.

  Further, when the second application example is applied from the base plate 16 to each communication hole 37 of the manifold plate 14b, the burr 53 protruding outward is located in the recess 50 of the other adjacent plate, Contact between the plates is not hindered by the burr 53.

  Further, the present invention can be applied not only to an ink jet head but also to other minute laminates.

1 is a perspective view of an inkjet head to which the present invention is applied. It is a disassembled perspective view of an inkjet head. It is an expansion disassembled perspective view of a cavity unit. FIG. 4 is an enlarged sectional view taken along line IV-IV in FIG. 1. (A) is sectional drawing which shows the state which formed the recessed part in both surfaces of a plate in formation of a through-hole with a small opening diameter, (b) is sectional drawing which shows the state which formed the opening in the recessed part. (A) is sectional drawing which shows the state which formed the recessed part in the single side | surface of a plate in formation of a through-hole with a small opening diameter, (b) is sectional drawing which shows the state which formed the opening in the recessed part. (A) is sectional drawing which shows the state which formed the recessed part in the single side | surface of a plate in formation of a through-hole with a small opening diameter, (b) is sectional drawing which shows the state which forms an opening in a recessed part and laminates | stacks another plate is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cavity unit 2 Piezoelectric actuator 3 Flexible flat cable 4 Nozzle 11 Nozzle plate 12 Spacer plate 13 Damper plates 14a and 14b Manifold plate 15 Supply plate 16 Base plate 17 Cavity plate 36 Pressure chamber 37 Communication hole 38 Connection hole 40 Connection flow path 50 Recess 51 Opening 52 Sag 53 Bali 100 Inkjet head

Claims (11)

In a laminated structure in which a plurality of thin plate-like components including a thin plate-like component in which a through hole is formed are laminated, and a fluid flow path is configured by the through hole,
The through hole has a recess formed in advance by half-etching on at least one surface of the thin plate-like component, and an opening formed through the bottom surface of the recess by press working. Construction.   The laminated structure of a thin plate component according to claim 1, wherein the opening is processed in the thickness direction of the thin plate component at the bottom surface of the concave portion of the half etching with an opening smaller than the diameter of the concave portion. .   The through-hole has a half-etched recess formed in advance at corresponding positions on both surfaces of the thin-film component, and an opening drilled so as to allow the recesses to communicate with the bottom surface of both recesses. A laminated structure of thin plate-like parts according to claim 1 or 2.   The through-hole has a half-etched recess formed in advance on one surface of the thin plate-shaped component, and an opening formed by pressing from the other surface side of the thin plate-shaped component on the bottom surface of the recess. The laminated structure of thin plate-like parts according to claim 1 or 2.   The through hole comprises a half-etched recess formed in advance on one side of the thin plate-like part and an opening formed by pressing from the one side on the bottom surface of the concave part. 3. The flow path pattern larger than the opening of the through hole is arranged at a position corresponding to the through hole in the thin plate-like component laminated on the other surface side. Laminated structure of thin plate parts.   The thin plate-like component is a plate for an inkjet head having a plurality of nozzles, and the flow path is an ink flow path for supplying ink from an ink supply source to each nozzle. A laminated structure of thin plate-like components according to any one of 1 to 5. In a manufacturing method of a laminated structure in which a plurality of thin plate-like components including a thin plate-like component having a through hole are laminated, and a fluid flow path is configured by the through hole
A thin plate characterized in that a recess is formed in advance on at least one surface of a thin plate-like component by half-etching, an opening is formed through the bottom surface of the recess by press working, and the through hole is configured by the recess and the opening. For manufacturing a laminated structure of shaped parts.   8. The laminated structure of thin plate parts according to claim 7, wherein the opening is processed in a thickness direction of the thin plate part at an opening smaller than a diameter of the recessed part on a bottom surface of the half etching recessed part. Production method.   8. The concave portion is formed by half-etching at a corresponding position on both surfaces of the thin plate-like component, and the opening is formed on the bottom surface of both concave portions so as to communicate both concave portions. Or a method for producing a laminated structure of thin plate-like components according to 8.   The concave portion is formed on one surface of the thin plate-like component by the half etching, and the opening is formed at a position corresponding to the bottom surface of the concave portion from the other surface side of the thin plate-like component. The manufacturing method of the laminated structure of the thin plate-shaped components of Claim 7 or 8. The concave portion is formed on the one surface of the thin plate part by the half etching, and the opening is formed on the bottom surface of the concave portion from the one surface side,
The thin plate-like component in which a flow path pattern larger than the opening of the through hole is formed at a position corresponding to the through hole is laminated on the other surface side of the thin plate-like component. The manufacturing method of the laminated structure of the thin plate-shaped components of description.

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