JP2006093205A - Mounting tool and mounting method for flat member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting tool and mounting method for a flat member for precision alignment and sufficient bonding strength. <P>SOLUTION: A placement stage constituting the mounting tool is provided with two recesses. A first recess comprises an opening for holding a mounting substrate consisting of a case or the like that acts as a heat sink, and a second recess comprises an opening surface and depth for placing an adhesive member of brazing material and flat member having a ceramic substrate or the like at a prescribed position in the first recess. The mounting substrate is placed on the mounting tool for heating, and the bonding member melts so that the flat member is bonded to the mounting substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting jig and a mounting method for mounting a flat member such as a ceramic substrate on a mounting base material such as a housing by using an adhesive member such as a brazing material.

  When bonding (mounting) a ceramic substrate (flat plate member) on which various semiconductor devices are mounted on a housing (base material for mounting) serving as a heat sink using a brazing material (adhesive member), a mounting jig Is generally used. A conventional mounting method will be described with reference to an example in which a ceramic substrate is mounted on a housing. FIG. 4 is an explanatory diagram of a conventional method for mounting a flat plate member. The mounting table 31 constituting the mounting jig is formed with a recess 32 for mounting the housing 4 and a positioning pin 33 for positioning and fixing the fixing frame 34. First, the housing 4 is placed in a face-up position in the recess 32 (FIG. 4A). The positioning pin 33 is fitted into the pin hole 35 so that the opening 36 is disposed at a predetermined position where the ceramic substrate 2 is mounted, and the fixed frame 34 is placed on the mounting base 31 (FIG. 4B). Next, the sheet-like brazing material 3 such as AuSn and the ceramic substrate 2 to be mounted are placed on top of each other in the opening 36 of the fixed frame 34, and a load 37 is placed (FIG. 4C). When heated in this state, the brazing material 3 is melted and the ceramic substrate 2 is bonded onto the housing 4.

Thus, when the conventional mounting jig is used, the mounting position of the ceramic substrate 2 is determined by the fixed frame 34 and the mounting table 31 that are positioned and fixed by the positioning pins 33. In addition, various methods have been disclosed as methods for improving the accuracy of the mounting position. For example, Patent Document 1 discloses a technique for attaching and detaching and positioning a component using thermal expansion and thermal contraction of a constituent material because there is a difference between a temperature when the component is set on a jig and a temperature when reflowing. Patent Document 2 discloses a positioning structure that guides the mounting of components by a mounting cover formed on a printed circuit board when a BGA (ball grid array) device is mounted on the printed circuit board.
JP-A-10-294340 JP 2004-98131 A

  When a flat plate member is mounted on a mounting substrate using a mounting jig composed of a mounting base 31 and a fixed frame 34, the following problems are raised. First, the fixed frame 34 has a flat plate-like member placed in the opening, and therefore the depth of the opening 36 cannot be made too deep. Usually, when the ceramic substrate is bonded, it becomes about 1 mm and warps when heated. And floating will occur. As a result, there is a problem that the position of the opening 36 of the fixed frame 34 is relatively displaced, and the mounting position of the flat plate member is displaced. In addition, there is a problem that the sheet-like adhesive member placed in the opening portion 36 is displaced, resulting in poor adhesion of the flat plate member. Second, since the adhesive strength cannot be obtained only by the weight of the flat plate member, the load 37 is necessary. However, if the load is too heavy or the force is not applied evenly, the adhesive member melted at the time of heating will be around the periphery. There was a problem that the battery flowed out and a short circuit failure occurred. Thirdly, since the mounting position is determined by the positioning pin 33 on the mounting table 31 and the pin hole 35 of the fixed frame 34, a play for fitting the positioning pin 33 and the pin hole 35 is required, and a flat plate shape is required. There is a problem that it is necessary to allow a predetermined shift in the mounting position of the member. The present invention is a problem that occurs due to a mounting jig that performs positioning by combining these two jigs, and a mounting method in which a flat plate member having a smaller area is placed on a mounting substrate and heated. An object of the present invention is to provide a mounting jig and a mounting method for a flat plate member that eliminates the point, can be aligned with high accuracy, and obtain sufficient adhesive strength.

  In order to achieve the above object, the invention according to claim 1 of the present application is a mounting jig for a flat plate member for bonding a flat plate member on a mounting substrate, wherein the mounting jig is the flat plate. The first recess has an opening for mounting the mounting substrate in a face-down position, and opens at the bottom of the first recess. The second recess has an opening for positioning and mounting the flat plate-like member in a face-down posture and an adhesive member placed on the flat plate-like member at the bonding position of the mounting substrate. It has a depth deeper than the thickness by the thickness of the adhesive member at the time of mounting.

  The invention according to claim 2 of the present application is a flat plate member mounting method for bonding a flat plate member onto a mounting substrate, and includes two recesses for mounting the flat plate member and the mounting substrate. The first recess has an opening for placing the mounting substrate in a face-down posture, and the second recess opened at the bottom of the first recess has the flat plate member and the flat member in the face-down posture. A flat plate having a depth that is deeper by the thickness of the bonding member at the time of mounting than an opening for positioning and mounting the adhesive member placed on the mounting position of the mounting base material and the thickness of the flat plate member A step of preparing a jig for mounting the plate-like member, a step of placing the flat plate-like member in a face-down posture in the second recess, and a step of placing the adhesive member on the flat plate-like member, the first Placing the mounting substrate in the recess, the mounting substrate and the mounting And heating the mounting jig on which the plate-like member is placed to melt the adhesive member and bonding the flat plate-like member to the mounting base material. .

  The invention according to claim 3 of the present application is the invention according to claim 2, wherein a step of preparing the flat plate member provided with a plurality of protrusions on the mounting surface of the adhesive member of the flat plate member, and the flat plate member Preparing a sheet-like adhesive member having holes at positions corresponding to the plurality of protrusions when placed on the plate, and fitting the protrusions with the holes to form the flat plate The method includes a step of placing the member and the adhesive member in the second recess.

  The invention according to claim 4 of the present application is the invention according to claim 2, wherein a spacer member is sandwiched between the flat plate member and the mounting base material, and the mounting base material and the flat plate member are placed. Heating the mounting jig to melt the adhesive member, and bonding the flat plate member to the mounting substrate with the joining member having a thickness substantially equal to the thickness of the spacer member. It is characterized by including.

  When mounting a flat plate member using the mounting jig of the present invention, since there is no conventionally used fixing frame, it is possible to eliminate mounting position shift corresponding to play for positioning the fixing frame. . Further, since the weight of the mounting base material plays the role of a load, it is not necessary to put a load. Furthermore, since the mounting substrate is supported at the bottom of the first recess, the melted adhesive member is not washed away by the weight of the mounting substrate.

  Further, according to the mounting method of the present invention, by providing a plurality of protrusions on the flat plate-like member and fitting and aligning the sheet-like adhesive member with the plurality of protrusions, the adhesive member can be placed on the flat plate member without misalignment. It can be mounted on. If the protrusion is formed of a material that does not deform when heated, the mounting substrate can be supported by the protrusion, and the melted adhesive member is not swept away by the weight of the mounting substrate. Even if a spacer made of a material that does not adhere to the adhesive member is used instead of the protrusion, the mounting base material is similarly supported by the spacer, so that the fused adhesive member is not pushed away by the weight of the mounting base material. .

  Thus, since sufficient adhesive members remain between the mounting substrate and the flat plate member, the mounting substrate and the flat plate member can be bonded with sufficient strength.

  The flat member mounting jig of the present invention has two concave portions (a first concave portion and a second concave portion opened on the bottom surface of the first concave portion), and the flat member and the adhesive member are disposed in the second concave portion. The mounting substrate is placed in the first recess. In addition, an adhesive member is prepared in which a plurality of protrusions are formed on the flat plate member, and a mounting hole is provided at a position corresponding to the protrusion, and the hole is fitted to the protrusion so that the adhesive member does not shift. Mount. This protrusion also functions as a stopper that prevents the mounting member from being melted and the mounting base material from flowing away the bonding member. The same applies when a spacer is used instead of the protrusion. Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

  First, the first embodiment will be described in detail by taking as an example a case where a ceramic substrate (flat plate member) is mounted on a casing (mounting base material) using a brazing material (joining member). The mounting jig of the present invention is composed of only the mounting table 1. The mounting table 1 has two recesses, and the first recess 5 has an opening for mounting the housing 4 and has at least a depth for mounting the housing 4 at a predetermined position. ing. The second recess 6 opens to a predetermined position (bonding position of the ceramic substrate 2) on the bottom surface of the first recess 5. When the ceramic substrate 2 is bonded with the sheet-like brazing material 3, It is set so that the brazing material 3 having a necessary thickness remains on the joint surface. Specifically, the depth of the second recess 6 is preferably set to a depth obtained by adding the thickness of the ceramic substrate 2 and the thickness of the brazing material 3 at the time of mounting.

  In order to increase the alignment accuracy between the ceramic substrate 2 and the housing 4, as shown in FIG. 1, the sizes of the bottom portions of the first recess 5 and the second recess 6 are respectively set to the housing 4 and the ceramic substrate 2. It is preferable that the size is approximately equal to the size of. In order to improve workability when placing the housing 4 or the like, it is preferable that the side surfaces of the first recess 5 and the second recess 6 are inclined so that the opening width on the upper surface side is widened.

  Next, a method for mounting the ceramic substrate 2 on the housing 4 using the mounting jig of the present invention will be described. First, the ceramic substrate 2 is placed in the second recess 6 with the bonding surface with the housing 4 facing upward (in a face-down posture). A sheet-like brazing material 3 is placed on the bonding surface of the ceramic substrate 2 (FIG. 1A). Then, the housing | casing 4 is mounted in the 1st recessed part 5 (FIG. 1B). In this state, it is heated to a temperature at which the brazing material 3 melts. The mounting state taken out from the mounting jig and with the surface of the ceramic substrate 2 facing the upper surface is as shown in FIG. 1C. Thus, in this embodiment, the mounting method is very simple and the productivity is excellent. Moreover, since there is no fixed frame demonstrated in the prior art example, the weight of the housing 4 is a substitute for the load, so no load is required.

  Next, another method for placing the brazing material 3 on the ceramic substrate 2 will be described. In order to place the brazing material 3 on the ceramic substrate 2 without displacement, projections 7 are formed on the side of the ceramic substrate 2 where the brazing material 4 is bonded to the housing 4 (FIG. 2B). The protrusion 7 can be formed in accordance with, for example, a bump electrode formed by plating or a stud bump forming method. On the other hand, holes 8 are formed in the brazing material 3 so as to correspond to the protrusions 7 (FIG. 2A).

  When the ceramic substrate 2 is mounted on the housing 4 using the mounting jig described in the first embodiment, the operation is as follows. First, the hole 8 of the brazing material 3 is fitted into the protrusion 7 of the ceramic substrate 2 to prepare the ceramic substrate 2 on which the brazing material 3 is placed. The ceramic substrate 2 is placed in the second recess 6 (corresponding to FIG. 1A). Then, the housing | casing 4 is mounted in the 1st recessed part 5 (FIG. 2C). In this state, the ceramic substrate 2 can be bonded to the housing 4 by heating at a temperature at which the brazing material 3 melts.

  By adopting a configuration in which the protrusion 7 of the ceramic substrate 2 and the hole 8 of the brazing material 3 are fitted in this way, the positional displacement between the ceramic substrate 2 and the brazing material 3 does not occur, and the brazing material 3 is the first before heating. It does not fall into the two recesses 6. In addition, by controlling the height of the protrusion 7 to a desired height, the protrusion 7 supports the weight of the housing 4 and can prevent the brazing material 3 from flowing out between the protrusions 7. For example, when the thickness of the ceramic substrate 2 varies more than a predetermined thickness, the ceramic substrate 2 and the brazing material 3 protrude beyond the depth of the second recess 6 toward the first recess 5 by an amount corresponding to the thickness. Become. When heated in such a protruding state, the brazing material 3 flows out by an amount corresponding to the thickness, and the thickness of the brazing material 3 becomes thin. On the other hand, by providing the protrusions 7, the protrusions 7 function as stoppers that support the weight of the housing 4, the flow-out of the brazing material 3 can be prevented, and the occurrence of poor adhesion can be eliminated.

  The protrusion 7 can be formed of a material that is deformed (melted) when the brazing material 3 is heated. In this case, the protrusion 7 only exhibits a function of preventing the displacement of the brazing material 3.

  Next, another method for mounting the ceramic substrate 2 on the housing 4 using the mounting jig of the present invention will be described. In order to prevent the brazing material 3 from flowing out during melting, a spacer 9 can be used instead of the protrusion 7.

  First, the ceramic substrate 2 is placed in the second recess 6 with the bonding surface with the housing 4 facing upward (in a face-down posture). A sheet-like brazing material 3 is placed on the bonding surface of the ceramic substrate 2. Further, a spacer 9 is placed on the brazing material 3 (FIG. 3A). Then, the housing | casing 4 is mounted in the 1st recessed part 5 (FIG. 3B). In this state, the ceramic substrate 2 can be bonded to the housing 4 by heating to a temperature at which the brazing material 3 melts.

  In particular, if the spacer 9 is made of a material that does not adhere to the brazing material 3, the brazing material 3 can be left between the ceramic substrate 2 and the housing 4 by the thickness of the spacer 9. Specifically, when the spacer 9 made of ceramic is placed on the sheet-like brazing material 3 made of AuSn and heat-treated, the spacer 9 repels the brazing material, and the spacer 9 is interposed between the spacer 9 and the ceramic substrate 2. The brazing material 3 does not enter between the casing 4 and the casing 4, and the brazing material 3 can be left between the ceramic substrate 2 and the casing 4 by the thickness of the spacer 9.

  Thus, the spacer 9 exhibits the same function as the protrusion 7 described in the second embodiment, and the process of forming the protrusion 7 on the ceramic substrate 2 as described in the second embodiment can be omitted. It is a simple method. The spacer 9 is not limited to being placed on the brazing material 3, and it goes without saying that the brazing material 3 can be placed on the spacer 9. Further, the shape of the spacer 9 is not limited to the ring shape as shown in FIG.

  The present invention has been described above by taking the case where the ceramic substrate is bonded (mounted) to the housing as an example, but it goes without saying that the present invention is not limited to these bonding. For example, the mounting jig and the mounting method of the present invention can be used also when a flat member such as a semiconductor device or a package component is bonded to a mounting substrate such as a metal plate or a ceramic plate.

It is a figure explaining Example 1 of the present invention. It is a figure explaining Example 2 of this invention. It is a figure explaining Example 3 of this invention. It is a figure explaining the mounting method of the flat member of a prior art example.

Explanation of symbols

1; mounting table, 2; ceramic substrate, 3; brazing material, 4; housing, 5; first recess, 6; second recess, 7;

Claims (4)

In the jig for mounting the flat plate member for bonding the flat plate member on the mounting substrate,
The mounting jig includes two recesses for mounting the flat plate member and the mounting substrate, respectively, and the first recess has an opening for mounting the mounting substrate in a face-down posture. The second recess opening at the bottom of the first recess positions and places the flat plate member in a face-down posture and the adhesive member placed on the flat plate member at the bonding position of the mounting substrate. A mounting jig for a flat plate member having a depth deeper by the thickness of the adhesive member at the time of mounting than the opening to be placed and the thickness of the flat plate member. In the mounting method of the flat plate member for bonding the flat plate member on the mounting substrate,
The plate-shaped member and two recesses for mounting the mounting substrate are provided, and the first recess has an opening for mounting the mounting substrate in a face-down posture, and is open at the bottom of the first recess. The second concave portion includes an opening for positioning and mounting the flat plate-like member in a face-down posture and an adhesive member placed on the flat plate-like member at the bonding position of the mounting substrate and the flat plate member Preparing a mounting jig for a flat plate member having a depth deeper than the thickness of the joining member at the time of mounting;
Placing the flat plate-like member in a face-down posture on the second recess, and placing the adhesive member on the flat plate member;
Placing the mounting substrate in the first recess;
Heating the mounting jig on which the mounting base material and the flat plate member are placed, thereby melting the adhesive member and bonding the flat plate member to the mounting base material. A mounting method of a flat member characterized by the above. Preparing the flat plate member having a plurality of protrusions on the mounting surface of the adhesive member of the flat plate member;
Preparing a sheet-like adhesive member having holes at positions corresponding to the plurality of protrusions when placed on the flat plate member,
The mounting method of the flat plate member according to claim 2, further comprising a step of fitting the protrusion and the hole portion and placing the flat plate member and the adhesive member in the second recess. . A spacer member is sandwiched between the flat plate member and the mounting base material, and the mounting jig on which the mounting base material and the flat plate member are placed is heated to melt the adhesive member. 3. The method for mounting a flat plate member according to claim 2, further comprising a step of bonding the flat plate member to the mounting base material with the joining member having a thickness substantially equal to the thickness of the spacer member. .

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