JP2005347220A - Connector, electronic device, and mounting method of connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket capable of restraining warpage generated when mounting on a base board. <P>SOLUTION: The IC socket comprises a cover housing 22 on which a terminal insertion holes 22a for inserting terminals 15a of an IC package 15 are perforated; contacts 20 having a terminal insertion hole 21a into which, the terminal 15a is inserted while passing through the terminal insertion hole 22a; a base housing 21 slidably holding the cover housing 22; an operation lever 23 making the cover housing 22 slide interlocked with rotating operation between pressure contact locking positions locking the terminal 15a on the inner wall face of the terminal insertion hole 21 in pressure contact state and the pressure contact releasing position releasing the pressure contact state, and a pad mounting part 22b on which a suction pad 25 is mounted having a lever holding part 25a fixing and holding the operation lever 23 in an intermediate slanted posture between toppled attitude and standing attitude, and a suction part 25c sucked by a suction device. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connector for electrically and mechanically connecting circuits or devices to each other, an electronic device on which the connector is mounted, and a method for mounting the connector.

  Conventionally, as a connector for interconnecting a printed circuit board and an IC package, a housing member having a plurality of contacts each having a solder ball connected to an end thereof and a plurality of through holes corresponding to each contact are provided on the housing member. There is known an IC socket provided with a slide member provided so as to be slidable (see, for example, Patent Document 1).

  Among such IC sockets, there is a type in which an operation lever is used to connect an IC package terminal and a contact, that is, to slide a slide member. In the case of this type of IC socket, the terminal is pressed against the contact by tumbling the operation lever so that it lies along the surface of the board to be mounted, while the contact lever is raised by raising the operation lever against the board. The pressure contact state is released. Therefore, this type of IC socket is generally provided with a lock mechanism that restrains the movement of the operation lever in a fallen position so that the connection state in which the terminal of the IC package is pressed against the contact can be maintained.

Further, as disclosed in the exemplified patent document, a suction pad is attached to an IC socket when mounted on a substrate, and the suction pad is sucked by a mounter while the IC socket is transported and positioned on the substrate. The mounting method etc. which perform are also used.
JP 2002-343517 A

By the way, such an IC socket has the following problems when mounted on a substrate.
That is, when the IC socket is mounted in a state where the operation lever is locked to the lock mechanism, the IC socket main body may be warped due to the stress inside the socket due to the restraining force of the operation lever. Here, when the target IC package is a heat-generating component such as a CPU and has a structure in which a heat sink or the like is disposed on the top of the CPU, the adhesion to the heat sink is reduced due to the influence of the warp or the like. . Accordingly, the cooling effect of the heat sink is reduced, and the CPU has a problem in terms of the stability of its operation.

  Further, as described above, the IC socket may be warped, so that there is a possibility that a connection portion between the solder ball and the substrate is short-circuited. Therefore, in order to avoid such a situation, the operation lever is not locked to the above-mentioned lock mechanism, and the IC socket is placed in a posture in which the operation lever is raised with respect to the substrate so that the contact pressure state of the contact is released. It is also possible to implement the above. However, in this case, there is a concern that the raised operating lever and the apparatus main body portion for mounting the IC socket on the substrate may come into contact with each other in the height direction.

  Accordingly, the present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a connector capable of improving the connection reliability with a substrate, an electronic device in which the connector is mounted, and a method for mounting the connector. And

  In order to achieve the above object, a connector according to the present invention includes a cover member having a terminal through-hole penetrating a terminal of an electronic component to be interconnected with a wiring board, and the electronic device while penetrating the terminal through-hole. A contact having an insertion hole into which a terminal of the component is inserted, and between a press-contact locking position that holds the terminal in a press-contact state on an inner wall surface of the terminal insertion hole and a press-contact release position that releases the press-contact state; A base member that slidably holds the cover member, an operation lever that moves between the press-contact lock position and the press-contact release position in conjunction with a rotation operation of the cover member, the press-contact lock position, and the press-contact release position And a mounting portion to which a lever holding member for fixing and holding the operation lever is detachably mounted at a rotation position corresponding to an intermediate position.

  The connector of the present invention includes a cover member in which a terminal through hole for penetrating a terminal of an electronic component to be interconnected to a wiring board is provided, and a terminal of the electronic component while penetrating the terminal through hole of the cover member. A contact having a terminal insertion hole to be inserted is provided, and between a pressure contact locking position where the lock is performed in a state where the terminal is pressed against the inner wall surface of the terminal insertion hole and a pressure contact opening position where the pressure contact state is opened, A base member having a slide holding portion that slidably holds the cover member, and a lever that slides the cover member in conjunction with a turning operation, and falls in a direction along the surface of the wiring board. In the posture, the cover member is localized in the press-contact lock position, and the cover member is localized in the press-contact release position in a standing posture that stands up with respect to the mounting board. A suction pad including an operating lever to be moved, a lever holding portion for fixing and holding the operating lever in an inclined posture intermediate between the falling posture and the standing posture, and a sucked portion to be sucked by a predetermined suction device And a pad mounting portion that is freely mounted.

  That is, in the present invention, the connector can be mounted on the wiring board while holding the operation lever in an intermediate posture between the falling posture and the standing posture, for example, in which the restraining force of the operation lever is relaxed. It is possible to reduce the influence of stress that may occur inside the connector due to the above. Thereby, according to this invention, it can suppress that the curvature etc. arise in a connector main body. Further, in the present invention, when the operation lever is rotated in the direction of taking the falling posture, for example, it is useful for a mechanism that presses the cover member with the pressing portion of the lever body and slides it to the pressure lock position side. is there.

  Therefore, according to the present invention, as described above, the occurrence of connector warpage or the like during mounting can be suppressed, so that it is possible to suppress, for example, short-circuiting of a connection portion with a substrate such as a solder ball. Further, in the present invention, even when the electronic component is a heat-generating component such as a CPU and a heat sink for removing operating heat is fixed on the surface of the component, the connector is warped as described above. Therefore, thermal connectivity (adhesion) between the electronic component and the heat sink can be ensured. Accordingly, it is possible to efficiently conduct heat conduction from the electronic component to the heat sink, and the operation of the electronic component can be stabilized. Furthermore, in the electronic device in which the connector of the present invention is mounted, the performance of the electronic component connected to the connector can be stabilized and the connection reliability of the mounting portion to the board can be improved. The reliability of the operation can be improved.

  Further, the connector mounting method of the present invention includes the step of mounting the suction pad on the pad mounting portion of the connector described above, and the inclined posture with respect to the lever holding portion of the mounted suction pad. A step of fixing and holding the operation lever, and a step of mounting the connector by transporting the connector onto the wiring board while being sucked by the suction device through the suctioned portion of the attached suction pad. It is characterized by.

  As described above, according to the present invention, it is possible to provide a connector capable of improving the connection reliability with the substrate, an electronic device in which the connector is mounted, and a method for mounting the connector.

The best mode for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing an external configuration of a personal computer (hereinafter referred to as “PC”) according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an internal structure thereof, and FIG. It is sectional drawing which shows in detail the structure of the mounting part of mounted IC (Integrated Circuit) socket.
As shown in FIG. 1, a PC 1 as an electronic device includes a PC main body 2 and a display unit 4 that constitute a main part thereof. The housing portion of the PC main body 2 is composed of an upper case 2a and a lower case 2b. Examples of the constituent material of the upper case 2a and the lower case 2b include various resin materials and metal materials such as magnesium. A keyboard 8 is mounted on the upper surface of the PC main body 2. On the front side of the keyboard 8 on the upper surface of the PC main body 2, a palm rest 7 is formed for the user to put a palm when inputting data from the keyboard 8.

  The display unit 4 is attached to the rear portion of the PC main body 2 via a pair of hinge portions 5a and 5b. Specifically, the display unit 4 is rotatable with respect to the PC main body 2 between an open position where the display unit 4 is opened and a closed position where the display unit 4 is closed. It is attached to become. In addition, the display unit 4 incorporates an LCD (Liquid Crystal Display) 6 for visually displaying data. Further, an optical disk drive 9 is built in the side portion of the PC main body 2.

  Further, as shown in FIG. 2, a printed circuit board 11 is accommodated in the PC main body 2. In addition to various chip components 13, an IC socket (CPU socket) 3 that is a connector for mounting an IC package 15 such as a CPU (Central Processing Unit) that controls the computer main body is mounted on the printed circuit board 11. Has been. Here, since the IC package 15 of the present embodiment generates a larger amount of heat than other electronic components mounted on the printed circuit board 11, a heat sink 16 as a cooling module is provided so that the operating heat is dissipated. It is attached to the surface (upper part) of the IC package 15. More specifically, the heat sink 16 and the IC package 15 are thermally bonded to each other via silicon grease or a thermal sheet applied to the surface of the IC package 15 to enhance the heat conduction effect.

  The structure around the IC socket 3 described above will be described in detail. As shown in FIG. 3, the printed circuit board 11, the IC socket 3, the IC package 15, and the heat sink 16 are provided with a spacer between the plate 28 and the backup plate 29. It is fastened integrally by screws 31 in the form of being sandwiched through 30.

Next, the structure of the IC socket 3 according to the present embodiment will be described in detail with reference to FIGS.
4 is a plan view showing a state in which the suction pad 25 used for mounting is attached to the IC socket 3. FIG. 5 is a side view of the IC socket 3 of FIG. A), FIG. 6 is a sectional view showing a state where the IC package 15 is mounted on the IC socket 3 of FIG. 4, and FIG. 7 is a perspective view showing a state where the suction pad 25 is mounted on the IC socket 3. 8 (a) is a plan view of the cover housing 22 of the IC socket 3, and FIG. 8 (b) is a side view of the cover housing 22 of FIG. 8 (a) seen from the direction of arrow B (arrow view B). .
9A is a plan view of the base housing 21 of the IC socket 3 (in a state where the operation lever 23 is in a fallen posture), and FIG. 9B is a base housing of FIG. 9A. FIG. 10A is a plan view of the base housing 21 (when the operating lever 23 is in a standing posture), FIG. 10B. FIG. 10A is a side view of the base housing 21 in FIG. 10A viewed from the direction of arrow D (arrow D), and FIG. 11 is a side view of the base housing 21 (in a state where the operation lever 23 is in an inclined posture). FIG. 12 and FIG. 12 are cross-sectional views showing a state where the suction pad 25 is attached to the IC socket 3.

As shown in FIGS. 4 and 5, the IC socket 3 is detachably attachable to a cover housing 22 having a substantially U-shaped cross section, a base housing 21, an operation lever 23 provided on the base housing 21, and a suction pad 25. 8 (a) and the pad mounting portion 22b shown in FIG.
As shown in FIG. 6, the cover housing 22 is provided with terminal through holes 22 a through which the terminals 15 a of the IC package 15 interconnected with the printed circuit board 11 pass.

  As shown in FIG. 6, the base housing 21 includes a contact 20 having a terminal insertion hole 21 a into which the terminal 15 a of the IC package 15 is inserted while passing through the terminal through hole 22 a of the cover housing 22. The contacts 20 are provided with solder balls 24 for mounting the IC socket 3 body on the printed circuit board 11 (see FIG. 3). The base housing 21 has a press-contact lock position in which the terminal 15a is pressed against the inner wall surface of the terminal insertion hole 21a (in FIGS. 8A, 8B, and 12), the cover housing 22 slides in the X1 direction. The position where the cover housing 22 is slid and restrained in the X2 direction in FIGS. 8A, 8B and 12). In addition, a slide holding portion 21b (see FIGS. 9B, 10B, and 11) that holds the cover housing 22 in a slidable manner is provided. Here, as shown in FIG. 9B, FIG. 10B, and FIG. 11, the slide holding portion 21b is provided as a rectangular convex portion on the side surface of the base housing 21, and FIG. As shown in FIG. 3, the cover housing 22 is slidably engaged with a rectangular long hole 22d drilled in the side surface of the cover housing 22. As a result, the cover housing 22 is slidably held by the base housing 21 as shown in FIG.

  As shown in FIG. 10 (b), the operating lever 23 moves the cover housing 22 to X1- as shown in FIGS. 8 (a), 8 (b) and 12 in conjunction with the turning operation in the S1-S2 direction. A lever that slides in the X2 direction. That is, as shown in FIGS. 9A and 9B, the operation lever 23 presses the cover housing 22 in the above-described pressure contact state in a fall posture that falls in a direction along the surface of the printed circuit board 11 (see FIG. 3). Move to the locked position. Further, as shown in FIGS. 10A and 10B, the operation lever 23 positions the cover housing 22 to the press-contact opening position in a standing posture standing up with respect to the printed circuit board 11. That is, as shown in FIGS. 9A and 9B, when the operation lever 23 is rotated in a direction to take a falling posture, the pressed portion of the cover housing 22 (formed in the cover housing) is formed. There is provided a pressing portion 23a for pressing the wall portion) 22c portion (see FIG. 8) to slide the cover housing 22 in the direction of the pressure contact lock position X1. Here, the operation lever 23 is bent in an L shape, and one arm portion is slidably supported by the cover housing 22. The pressing portion 23a is configured by a portion in which the one arm portion is bulged on the crank in the bending radial direction. Further, as shown in FIGS. 4, 5, and 7, a locking portion 26 that fixes and holds the operation lever 23 at the press-contact lock position is provided on the side portion of the base housing 21. When the operation lever 23 is locked to the locking portion 26, the pressing portion 23a (see FIG. 9A) presses the pressed portion 22c (see FIGS. 8A and 8B). As a result, a repulsive force acts on the operation lever 23, and as a result, a reaction force (see FIG. 5) acts on the locking portion 26 in the direction of arrow F.

  As shown in FIGS. 8A and 12, the pad mounting portion 22 b is formed at the edge of the rectangular hole 22 e drilled in the center of the cover housing 22 (and the edge on the side facing the base housing 21). Is provided. Further, as shown in FIGS. 4, 7, 11, and 12, the pad mounting portion 22 b includes a lever holding portion 25 a that fixes and holds the operation lever 23 in an inclined posture intermediate between the falling posture and the standing posture. The suction pad 25 having a suctioned portion 25c (see FIGS. 4, 7, and 12) to be sucked by a mounter (suction device) is detachably mounted via a mounting claw 25b (see FIG. 12). .

That is, a mounting method for mounting the IC socket 3 on the printed circuit board 11 using the suction pad 25 is performed as follows.
First, as shown in FIG. 12, the suction pad 25 is mounted on the pad mounting portion 22b of the IC socket 3, and the operation lever is tilted with respect to the lever holding portion 25a of the suction pad 25 as shown in FIG. 23 is fixedly held. Next, the IC socket 3 is conveyed onto the printed circuit board 11 while being adsorbed by the mounter through the adsorbed portion 25c (see FIGS. 4, 7, and 12) of the attached adsorbing pad 25, and the IC socket 3 is illustrated. Substrate mounting is performed via solder balls 24 shown in FIG.

  Therefore, in this embodiment, the IC socket 3 can be mounted on the printed circuit board 11 while holding the operation lever 23 in an inclined posture intermediate between the falling posture and the standing posture where the restraining force of the operation lever 23 is relaxed. The influence of stress that can be generated inside the socket due to the restraining force of the operation lever 23 can be reduced. As a result, it is possible to prevent the IC socket 3 body from being warped. Therefore, according to the present embodiment, as described above, the occurrence of warping or the like of the IC socket 3 at the time of mounting can be suppressed, so that the solder ball 24 shown in FIG. 3 is short-circuited to the connection portion with the printed circuit board 11. It is possible to suppress connection failures such as the occurrence of a failure.

  Furthermore, according to the present embodiment, the heat sink 16 shown in FIGS. 2 and 3 that removes the operating heat of the IC package 15 is hardly affected by the warp or the like. Thermal connectivity (adhesion) can be sufficiently secured. Thereby, heat conduction from the IC package 15 to the heat sink 16 can be performed efficiently, and the operation of the IC package 15 can be stabilized.

  Although the present invention has been specifically described above by the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. That is, in the above-described embodiment, the lever holding portion that holds the operation lever 23 in an intermediate inclined posture is provided in the suction pad 25. Instead, the cover housing or the base housing 21 of the IC socket 3 is provided. The lever holding portion may be provided.

The perspective view which shows the external appearance structure of the personal computer by which the connector which concerns on embodiment of this invention is mounted. Sectional drawing which shows the internal structure of the personal computer of FIG. Sectional drawing which shows the structure of the mounting part of IC socket of FIG. 1 in detail. The top view which shows the state with which the suction pad was mounted | worn with IC socket. The side view which shows the state of FIG. Sectional drawing which shows the state in which the IC package is mounted | worn with the IC socket of FIG. The perspective view which shows the state with which the suction pad was mounted | worn with IC socket. The figure which shows the cover housing of IC socket. The figure which shows the state which the operation lever of the base housing of IC socket has taken the fall posture. The figure which shows the state which the operating lever of the base housing of FIG. 9 has taken the standing posture. FIG. 10 is a diagram illustrating a state in which an operation lever of the base housing in FIG. 9 is in an inclined posture. Sectional drawing which shows a state in case a suction pad is mounted | worn with the IC socket of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Personal computer (PC), 3 ... IC socket, 11 ... Printed circuit board, 15 ... IC package, 15a ... Terminal, 16 ... Heat sink, 20 ... Contact, 21 ... Base housing, 21a ... Terminal insertion hole, 21b ... Slide Holding part, 22 ... cover housing, 22a ... terminal through hole, 22b ... pad mounting part, 22c ... pressed part, 22d ... long hole, 22e ... rectangular hole, 23 ... operating lever, 23a ... pressing part, 24 ... solder ball , 25 ... suction pad, 25a ... lever holding part, 25b ... mounting claw, 25c ... attracted part, 26 ... locking part, 28 ... plate, 29 ... backup plate, 30 ... spacer, 31 ... screw.

Claims (10)

A cover member having a terminal through hole drilled through a terminal of an electronic component to be interconnected with the wiring board;
A contact having a terminal insertion hole into which the terminal of the electronic component is inserted while penetrating the terminal through hole of the cover member, and a pressure contact lock position for holding the terminal in a pressure contact state on an inner wall surface of the terminal insertion hole; A base member that slidably holds the cover member between a pressure release position that releases the pressure contact state;
An operation lever that moves between the press-contact lock position and the press-contact release position in conjunction with the rotation operation of the cover member;
And a mounting portion on which a member for fixing and holding the operation lever is detachably mounted at a rotation position corresponding to an intermediate position between the press-contact lock position and the press-contact release position. . A cover member having a terminal through hole drilled through a terminal of an electronic component to be interconnected with the wiring board;
A contact having a terminal insertion hole into which the terminal of the electronic component is inserted while penetrating the terminal through hole of the cover member, and being locked in a state where the terminal is pressed against the inner wall surface of the terminal insertion hole A base member having a slide holding portion that slidably holds the cover member between a locked position and a pressure release position that releases the pressure contact state;
A lever that slides the cover member in conjunction with a turning operation, and in a fall posture that falls in a direction along the surface of the wiring board, the cover member is localized at the pressure contact lock position, and the mounting An operation lever that positions the cover member at the press-contact opening position in a standing posture standing up with respect to the substrate;
A suction pad including a lever holding portion that holds and holds the operation lever in an inclined posture intermediate between the falling posture and the standing posture and a sucked portion that is sucked by a predetermined suction device is detachably mounted. And a pad mounting portion.   2. The connector according to claim 1, wherein the operation lever includes a pressing portion that presses the cover member and slides the cover member toward the press-contact lock position when the operation lever is rotated in the direction of taking the falling posture.   3. The connector according to claim 2, wherein the operation lever includes a pressing portion that presses the cover member and slides the cover member toward the press-contact lock position when the operation lever is rotated in the direction of taking the falling posture.   The connector according to claim 3, wherein the surface of the electronic component is a portion to which a heat sink is fixed.   The connector according to claim 4, wherein the surface of the electronic component is a portion to which a heat sink is fixed.   The connector according to claim 5, wherein the base member includes a solder ball as a lead portion connected to the contact.   The connector according to claim 6, wherein the base member includes a solder ball as a lead portion connected to the contact.   An electronic device comprising the connector according to any one of claims 1 to 8. Attaching the suction pad to the pad mounting portion of the connector according to any one of claims 2, 4, 6 or 8;
Fixing and holding the operation lever in the inclined posture with respect to the lever holding portion of the attached suction pad;
And mounting the connector by transporting the connector onto the wiring board while being sucked by the suction device through the suctioned portion of the attached suction pad.

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