JP2005300279A - Anisotropic conductive connector device, manufacturing method thereof, and circuit device inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a good electrical connection state even when a connection target electrode does not need to be aligned and the pitch of electrodes to be connected is small and is used repeatedly over a long period of time or in a high temperature environment. Provided are an anisotropic conductive connector device in which a favorable electrical connection state is stably maintained even when used, and a circuit device inspection device including the anisotropic conductive connector device.
An anisotropic conductive connector device according to the present invention has an anisotropic structure in which a plurality of power supply conductive portions and a voltage measurement conductive portion extending in a thickness direction are arranged in a state of being insulated from each other by an insulating portion. A conductive film and a sheet-like connector in which a plurality of electrode structures extending in the thickness direction are arranged on an insulating sheet made of mesh or non-woven fabric, and each of the electrode structures is formed by the sheet-like connector. The anisotropic conductive film is integrally provided on the anisotropic conductive film in a state of being positioned on each conductive path forming portion.
[Selection] Figure 2

Description

  The present invention relates to an anisotropic conductive connector device that can be suitably used for inspection of a circuit device such as a semiconductor integrated circuit, and an inspection for measuring the electric resistance of a circuit device including the anisotropic conductive connector device. Relates to the device.

  An anisotropic conductive sheet has conductivity only in the thickness direction, or has a pressure conductive area that shows conductivity only in the thickness direction when pressed in the thickness direction. Because it has features such as being able to achieve a compact electrical connection without using means such as mechanical fitting, and being able to make a soft connection by absorbing mechanical shocks and strains. By utilizing such features, for example, in the fields of electronic computers, electronic digital watches, electronic cameras, computer keyboards, etc., electrical connections between circuit devices, such as printed circuit boards, leadless chip carriers, liquid crystal panels, etc. It is widely used as an anisotropic conductive connector for achieving electrical connection.

  In electrical inspection of circuit devices such as printed circuit boards and semiconductor integrated circuits, for example, electrodes to be inspected formed on one surface of the circuit device to be inspected and connection electrodes formed on the surface of the circuit substrate for inspection In order to achieve an electrical connection, an anisotropic conductive sheet is interposed as a connector between the electrode region of the circuit device and the connection electrode region of the circuit board for inspection.

  Conventionally, such an anisotropic conductive sheet is obtained by uniformly dispersing metal particles in an elastomer (see, for example, Patent Document 1), by dispersing a conductive magnetic metal in an elastomer nonuniformly. A plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other (see, for example, Patent Document 2), a step between the surface of the conductive path forming portion and the insulating portion There are various types of structures such as those formed with (for example, see Patent Document 3).

In these anisotropic conductive sheets, the conductive elastic particles are contained in an insulating elastic polymer substance so that the conductive particles are aligned in the thickness direction, and a conductive path is formed by a chain of a large number of conductive particles. ing.
Such an anisotropic conductive sheet, for example, injects a molding material containing conductive particles having magnetism into a polymer substance-forming material that is cured to become an elastic polymer substance into the molding space of the mold. Thus, a molding material layer can be formed, and a magnetic field can be applied to the molding material layer for curing treatment.

However, in the electrical inspection of a circuit device having a protruding electrode made of, for example, a solder alloy, there are the following problems when a conventional anisotropic conductive sheet is used as a connector.
That is, by repeating the operation of pressing the protruding electrode, which is the electrode to be inspected of the circuit device to be inspected, against the surface of the anisotropic conductive sheet, the surface of the anisotropic conductive sheet has Since permanent deformation due to pressure contact and deformation due to wear occur, the electrical resistance value of the conductive path forming portion in the anisotropic conductive sheet increases, and the electric resistance value of each conductive path forming portion varies, and the subsequent There is a problem that it becomes difficult to inspect the circuit device.
In addition, as the conductive particles for constituting the conductive path forming portion, in order to obtain good conductivity, those usually formed with a coating layer made of gold are used. By conducting the electrical inspection continuously, the electrode material (solder alloy) constituting the electrode to be inspected in the circuit device moves to the coating layer of the conductive particles in the anisotropic conductive sheet. As a result of the alteration of the layer, there is a problem that the conductivity of the conductive path forming portion is lowered.

Further, in the electrical inspection of a circuit device having a pad electrode made of, for example, aluminum, there are the following problems when a conventional anisotropic conductive sheet is used as a connector.
That is, in a circuit device having a pad electrode, a resist film having a thickness larger than that of the pad electrode is usually formed on the surface of the circuit device. Thus, in order to reliably connect to the pad electrode of the circuit device on which such a resist film is formed, a conductive path forming portion protruding from the surface of the insulating portion is provided as an anisotropic conductive sheet. What is formed is used. However, in such an anisotropic conductive sheet, repeated use of the anisotropic conductive sheet causes permanent compressive deformation in the conductive path forming portion, which increases the electrical resistance value of the conductive path forming portion in the anisotropic conductive sheet. Alternatively, the stable electrical connection of the conductive path forming portion to the pad electrode is not achieved, and as a result, the electric resistance value between the pad electrode as the electrode to be inspected and the connection electrode in the circuit board for inspection varies. This makes it difficult to inspect subsequent circuit devices.

  In order to solve these problems, in the inspection of circuit devices, an anisotropic conductive sheet and a flexible insulating sheet made of a resin material are arranged with a plurality of electrode structures extending in the thickness direction. A connector device is constituted by a sheet-like connector, and an electrical connection with a circuit device to be inspected is achieved by bringing the electrode to be inspected into contact with and pressing the electrode structure of the sheet-like connector in the connector device. (For example, refer to Patent Document 4).

However, in the above connector device, when the pitch of the electrodes to be inspected of the circuit device to be inspected is small, that is, the pitch of the electrode structure of the sheet-like connector and the conductive path forming portion of the anisotropic conductive sheet is small. Has the following problems.
That is, for the alignment of the anisotropic conductive sheet and the sheet-like connector, positioning holes are formed in the respective peripheral portions, or the respective peripheral portions are fixed to a frame-shaped support having positioning holes, respectively. This is done by inserting a common guide pin through the positioning hole. However, according to such means, it becomes difficult to reliably align the positions of the electrode structure of the sheet-like connector and the conductive path forming portion of the anisotropic conductive sheet as the pitch decreases.
In addition, once the desired alignment has been realized, the conductive path forming part and the electrode structure may be misaligned as the connector device is used, or used for tests in high-temperature environments such as burn-in tests. In such a case, the displacement between the conductive path forming portion and the electrode structure may occur due to the difference in thermal expansion between the material forming the anisotropic conductive sheet and the material forming the insulating sheet of the sheet-like connector. As a result, there is a problem that a good electrical connection state cannot be stably maintained.

In order to solve this problem, for example, as shown in Patent Document 5, a sheet-like connector having a connecting through-hole is disposed in a mold, and an anisotropic conductive connector is integrally formed to form a sheet-like connector. A technique has been proposed in which a connecting portion is provided in a connecting through hole of a connector to strengthen the connection between the sheet-like connector and the anisotropic conductive sheet.
However, according to this method, in the manufacture of the sheet-like connector, it is necessary to perform operations for forming through holes in the insulating sheet corresponding to the number of electrode structures and connecting portions. Although it is performed by drilling, if the number of through holes to be formed increases and the number of processing increases, the processing steps become longer, resulting in a problem of reduced productivity and increased production cost.

In electrical inspection of a circuit board that requires high accuracy of inspection accuracy, the electric resistance between the electrodes in the circuit board to be inspected (hereinafter also referred to as “circuit board to be inspected”) is supplied with current. Measuring is done.
For example, as shown in FIG. 24, for each of two inspection target electrodes (hereinafter also referred to as “inspected electrodes”) 91 and 92 electrically connected to each other on the circuit board 90 to be inspected, The probes PA and PD and the voltage measurement probes PB and PC are pressed and brought into contact with each other, and in this state, current is supplied from the power supply device 93 between the current supply probes PA and PD. At this time, the voltage measurement probe PB A means for obtaining the magnitude of the electric resistance between the electrodes 91 and 92 to be inspected by processing the voltage signal detected by the PC in the electric signal processing device 94 is employed.

  However, in the above method, it is necessary to bring the current supply probes PA and PD and the voltage measurement probes PB and PC into contact with the electrodes 91 and 92 to be inspected with a considerably large pressing force. Is made of metal and has a pointed tip, so that when the probe is pressed, the surfaces of the electrodes 91 and 92 to be inspected are damaged, and the circuit board cannot be used. It becomes a thing. Under such circumstances, the measurement of electrical resistance cannot be performed for all circuit boards that are products, and it must be a so-called sampling inspection, so that the yield of products cannot be increased after all.

In order to solve such a problem, an inspection apparatus in which a connecting member that contacts an electrode to be inspected is configured by an anisotropic conductive sheet has been proposed (for example, see Patent Documents 6 to 8).
According to such an inspection apparatus, electrical connection is achieved by contacting the current supply electrode and the voltage measurement electrode to the electrode to be inspected of the circuit board to be inspected via the anisotropic conductive sheet. Therefore, the electrical resistance can be measured without damaging the electrode to be inspected.

  In recent years, the need for high-precision inspection for measuring voltage while supplying current to such a circuit board is increasing not only for circuit boards but also for circuit devices such as semiconductor integrated circuits. In particular, it has been required to apply the inspection to circuit devices having protruding electrodes made of a solder alloy.

JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 7-231019 Japanese Patent Application No. 2003-167818 JP-A-9-26446 JP 2000-74965 A JP 2000-241485 A

The present invention has been made based on the circumstances as described above. The first object of the present invention is that the positioning operation of the sheet-like connector is unnecessary, and the pitch of the electrodes to be connected is small. Provides an anisotropically conductive connector device that can obtain a good electrical connection state, and can maintain a stable electrical connection state even when used repeatedly over a long period of time or in a high-temperature environment. There is to do.
A twenty-third object of the present invention is that even if the electrodes to be inspected of the circuit device to be inspected have a small pitch, a good electrical connection state can be obtained, and when the electrode is used repeatedly over a long period of time or at a high temperature An object of the present invention is to provide an inspection device for a circuit device in which a good electrical connection state is stably maintained even when used in an environment.
A third object of the present invention is to perform a highly reliable electrical inspection by measuring an electrical resistance while supplying a current even if an inspected electrode of a circuit device to be inspected is a solder bump electrode. An object is to provide an anisotropic conductive connector device.
A fourth object of the present invention is to provide a method for efficiently and inexpensively producing an anisotropic conductive connector having the first to third features.

  The anisotropic conductive connector device of the present invention has a plurality of connection electrode pairs each consisting of two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. A plurality of conductive path forming portions extending in the thickness direction connected to each connection electrode of the circuit board for inspection, provided with a support body that supports the peripheral portion, and the formed circuit board for inspection are mutually connected by an insulating portion. And an anisotropic conductive film arranged in an insulated state.

In the anisotropic conductive connector device according to the present invention, a sheet-like connector in which a plurality of electrode structures extending in the thickness direction is arranged on an insulating sheet, each electrode structure is a conductive film of each anisotropic conductive film. It is preferable to be provided integrally on the anisotropic conductive film in a state of being positioned on the path forming portion. The anisotropic conductive connector device according to claim 1.

In the anisotropic conductive connector device of the present invention, a sheet-like connector in which a plurality of electrode structures extending in the thickness direction are arranged on an insulating sheet is provided on each circuit board for inspection. In the state where the two conductive path forming portions of the anisotropic conductive film corresponding to the connection electrode pair composed of the two connection electrodes for current supply and voltage measurement are simultaneously in contact with the anisotropic conductive film. Is preferably provided.

In the anisotropic conductive connector device of the present invention, the anisotropic conductive material is formed by aligning a large number of conductive particles exhibiting magnetism in the elastic polymer substance so that they are aligned in the thickness direction and dispersed in the plane direction. It is preferable that the sheet is detachably disposed on the sheet-like connector.

In the anisotropic conductive connector device of the present invention, the insulating sheet of the sheet-like connector is preferably a mesh or a non-woven fabric.
A circuit device inspection apparatus according to the present invention comprises the above-described anisotropic conductive connector device.

  According to the anisotropic conductive connector device having the above configuration, since the sheet-like connector is integrally provided on the anisotropic conductive film, the alignment work of the sheet-like connector is unnecessary, and the pitch of the connection target electrodes Even if it is small, good electrical connection can be obtained, and even when used repeatedly over a long period of time or in a high temperature environment, the position of the conductive path forming portion and the electrode structure is not displaced. Does not occur, and therefore a good electrical connection is stably maintained.

  According to the anisotropic conductive connector device having the above-described configuration, for supplying current to the circuit board for inspection through the conductive path forming portion having a different anisotropic conductive film to the inspection target electrode of the circuit device that is the inspection target. Since the voltage is measured while the two connection electrodes for voltage measurement are electrically connected and the current is supplied from the current supply electrode, the voltage is measured with high accuracy for the circuit in the circuit device as the object to be inspected. Therefore, the inspection accuracy of the circuit device is improved.

According to the anisotropic conductive connector device described above, since the sheet-like connector is made of an insulating sheet made of mesh or non-woven fabric, it is not necessary to form a through-hole in the production of the sheet-like connector. The anisotropic conductive connector device can be manufactured efficiently and inexpensively.

According to the anisotropic conductive connector device of the above configuration, since the sheet-like connector is made of an insulating sheet made of mesh or nonwoven fabric, when integrating the sheet-like connector with the anisotropic conductive film of the anisotropic conductive connector, By placing a sheet-like connector on the molding material layer in the mold and curing the molding material layer, the elastic polymer substance constituting the molding material layer is cured while penetrating the mesh or the nonwoven fabric. Therefore, the sheet-like connector can be securely and firmly integrated with the anisotropic conductive connector.
The anisotropic conductive connector device in which the sheet-like connector is integrated in this way causes a displacement between the conductive path forming portion and the electrode structure even when used repeatedly over a long period of time or in a high temperature environment. Therefore, a good electrical connection state is stably maintained.

  According to the inspection apparatus for a circuit device having the above-described configuration, since the anisotropic conductive connector is provided, even when used repeatedly over a long period of time or in a high temperature environment, the conductive path forming portion and the electrode structure There is no positional deviation from the body, and thus a good electrical connection is stably maintained.

According to the inspection apparatus for a circuit device having the above configuration, a sheet-like connector made of an insulating sheet made of mesh or non-woven fabric exists between the anisotropic conductive film of the anisotropic conductive connector and the inspection object electrode of the inspection object. Therefore, it is possible to reliably suppress damage during inspection of the inspection object due to separation of the conductive particles from the anisotropic conductive film.

According to the anisotropic conductive connector device having the above configuration, since the sheet-like connector is manufactured using the insulating sheet made of mesh or non-woven fabric, the through-hole of the insulating sheet is not used. An electrode structure having a flat electrode surface and no through holes can be easily obtained.
According to the inspection apparatus for a circuit device having the above-described configuration, which includes a sheet-like connector having an electrode structure in which the electrode surface is flat and does not have a through-hole, the inspection target electrode of the inspection object is solder with low hardness Even in the case of the protruding electrode, the solder protruding electrode of the object to be inspected is not damaged by the pressure contact with the through-hole portion of the electrode structure of the sheet-like connector at the time of inspection.

  According to the anisotropic conductive connector device having the above-described structure, the anisotropic conductive connector device includes the anisotropic conductive sheet that can be attached to and detached from the inspected circuit component side. In the case of deterioration, only the inexpensive anisotropic conductive sheet is replaced, and the expensive anisotropic conductive connector device can be continuously used, so that the inspection cost can be reduced.

Hereinafter, embodiments of the present invention will be described in detail.
1 to 3 are explanatory views showing an anisotropic conductive connector device of a first example according to the present invention, FIG. 1 is a plan view of the anisotropic conductive connector device, and FIG. FIG. 3 is a partially enlarged explanatory view of the anisotropic conductive connector device shown in FIG. 1 together with the inspection object circuit device and the inspection circuit board. is there.
The anisotropic conductive connector device 10 includes a rectangular anisotropic conductive film 10A, a sheet-like connector 20 provided integrally on one surface of the anisotropic conductive film 10A, and a rectangular supporting the anisotropic conductive film 10A. And a plate-like support 30.

The anisotropic conductive film 10A in the anisotropic conductive connector device 10 includes a plurality of columnar conductive path forming portions 11 that extend in the thickness direction, and an insulating portion 14 that insulates the conductive path forming portions 11 from each other. It is configured.
In this example, the conductive path forming portions 11 are arranged at a constant pitch according to the lattice point positions.
Further, the anisotropic conductive film 10A is entirely formed of an insulating elastic polymer material, and the conductive path forming portion 11 contains the conductive particles P exhibiting magnetism aligned in the thickness direction. ing. On the other hand, the insulating part 14 contains no or almost no conductive particles.

In the illustrated example, one surface of the central portion of the anisotropic conductive film 10A is formed so as to protrude from the peripheral portion, and is formed in the central portion of the anisotropic conductive film 10A among the plurality of conductive path forming portions 11. The effective conductive path forming portion 12 is electrically connected to the connection target electrode, for example, the electrode to be inspected in the circuit device to be inspected, and the one formed in the peripheral portion of the anisotropic conductive portion 10A is The invalid conductive path forming unit 13 is not electrically connected to the connection target electrode, and the effective conductive path forming unit 12 is arranged according to a pattern corresponding to the pattern of the connection target electrode.
The effective conductive path forming section 12 includes a current supply conductive path forming section 12A connected to the circuit board current supply connecting electrode 41A and a voltage measuring conductive path connected to the circuit board voltage measuring connection electrode 41B. It is comprised by the formation part 12B.
On the other hand, the insulating portions 14 are integrally formed so as to surround the individual conductive path forming portions 11, whereby all the conductive path forming portions 11 are insulated from each other by the insulating portions 14. Has been.
Further, on the other surface of the anisotropic conductive film 10 </ b> A, a protruding portion 11 </ b> A in which the surface of the conductive path forming portion 11 protrudes from the surface of the insulating portion 14 is formed.

The thickness of the effective conductive path forming portion 12 is, for example, 0.1 to 2 mm, and preferably 0.2 to 1 mm.
Moreover, although the diameter of the effective conductive path formation part 12 is suitably set according to the pitch etc. of a connection object electrode, it is 50-1000 micrometers, for example, Preferably it is 200-800 micrometers.
The protruding height of the protruding portion 11A is, for example, 10 to 100 μm, and preferably 20 to 60 μm.

The sheet-like connector 20 has an insulating sheet 21 made of mesh or non-woven fabric. A plurality of electrode structures 22 made of metal extending in the thickness direction of the insulating sheet 21 are connected to the insulating sheet 21. According to the pattern corresponding to the pattern of the electrodes, the insulating sheet 21 is disposed away from each other in the surface direction.
Each of the electrode structures 22 extends in the thickness direction of the insulating sheet 21 and is integrally connected to the insulating sheet.
Each of the electrode structures 22 of the sheet-like connector 20 is located on the effective conductive path forming portion 12 of the anisotropic conductive film 10A, and is integrally provided on the anisotropic conductive film 10A.

The insulating sheet 21 made of mesh or non-woven fabric has a thickness of, for example, 0.005 to 1 mm, preferably 0.01 to 0.5 mm, and more preferably 0.015 to 0.3 mm.
Moreover, although the diameter of the electrode structure 22 is suitably set according to the pitch etc. of a connection object electrode, it is 50-1000 micrometers, for example, Preferably it is 200-800 micrometers.
Moreover, the protrusion height from the insulating sheet of the electrode structure 22 is 10-300 micrometers, for example, Preferably it is 50-200 micrometers.

As shown in FIGS. 4 and 5, the support 30 is formed with a rectangular opening 31 having a size smaller than the anisotropic conductive film 10 </ b> A at the center position, and at each of the four corner positions of the support 30. The positioning hole 32 is formed.
The anisotropic conductive film 10 </ b> A is disposed in the opening 31 of the support 30, and the peripheral portion of the anisotropic conductive film 10 </ b> A is fixed to the support 30, thereby being supported by the support 30.
The thickness of the support 30 is, for example, 0.01 to 1 mm, preferably 0.05 to 0.8 mm.

The elastic polymer material forming the anisotropic conductive film 10A preferably has a durometer hardness of 15 to 70, more preferably 25 to 65. When the durometer hardness is too small, high repetition durability may not be obtained.
On the other hand, if the durometer hardness is excessive, a conductive path forming part having high conductivity may not be obtained.

As the elastic polymer material forming the anisotropic conductive film 10A, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. Blocks such as conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubber, and styrene-isoprene block copolymer Examples thereof include copolymer rubber and hydrogenated products thereof, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber.
In the above, when weather resistance is required for the anisotropically conductive connector 10 to be obtained, it is preferable to use one other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, silicone rubber is preferably used. It is preferable to use it.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is acquired in the obtained conductive path formation part 11, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

As the conductive particles contained in the conductive path forming part 11 in the anisotropic conductive film 10A, conductive particles exhibiting magnetism are used because the particles can be easily oriented by a method described later. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

When using conductive particles whose core particles are coated with a conductive metal, good conductivity can be obtained, so that the conductive metal coverage on the particle surface (relative to the surface area of the core particles). The ratio of the conductive metal coating area) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the particle diameter of electroconductive particle is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers.
Moreover, it is preferable that the particle diameter distribution (Dw / Dn) of electroconductive particle is 1-10, More preferably, it is 1.01-7, More preferably, it is 1.05-5, Most preferably, it is 1.1- 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming portion 11 is easily deformed under pressure, and sufficient electric power is provided between the conductive particles in the conductive path forming portion 11. Contact is obtained.
The shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or secondary in which they are aggregated in that they can be easily dispersed in the polymer material-forming material. Particles are preferred.
In addition, a conductive particle whose surface is treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropically conductive connector is improved.

  Such conductive particles are preferably used at a volume ratio of 5 to 60%, preferably 7 to 50%, based on the polymer substance-forming material. When this ratio is less than 5%, the conductive path forming portion 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive path forming part 11 tends to be fragile, and the elasticity required for the conductive path forming part 11 may not be obtained.

As the mesh or non-woven fabric constituting the insulating sheet 21, one formed of organic fibers can be suitably used. Examples of such organic fibers include fluorine resin fibers such as polytetrafluoroethylene fibers, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, and polyester fibers.
Moreover, as an organic fiber, the linear thermal expansion coefficient is equal to or close to the linear thermal expansion coefficient of the material forming the connection object, specifically, the linear thermal expansion coefficient is 30 × 10 ⁻⁶ to ⁻⁵ ×. Since the thermal expansion of the anisotropic conductive film is suppressed by using 10 ⁻⁶ / K, particularly 10 × 10 ⁻⁶ to −3 × 10 ⁻⁶ / K, the thermal history due to temperature change is received. Even in this case, it is possible to stably maintain a favorable electrical connection state with respect to the connection object.
Moreover, as an organic fiber, it is preferable to use the thing whose diameter is 10-200 micrometers.

The material constituting the support 30 is preferably a material having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, more preferably 2 × 10 ⁻⁵ to 1 × 10 ⁻⁶ / K, particularly preferably. Is 6 × 10 ⁻⁶ to 1 × 10 ⁻⁶ / K.
As a specific material, a metal material or a non-metal material is used.
As the metal material, gold, silver, copper, iron, nickel, cobalt, or an alloy thereof can be used.
Non-metallic materials include polyimide resin, polyester resin, polyaramid resin, polyamide resin and other high mechanical strength materials, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, etc. Composite resin materials such as resin materials, epoxy resins, etc. mixed with inorganic materials such as silica, alumina, boron nitride as fillers can be used, but polyimide resin, glass fiber reinforced type in terms of low linear thermal expansion coefficient A composite resin material such as an epoxy resin or a composite resin material such as an epoxy resin mixed with boron nitride as a filler is preferable.

According to the anisotropic conductive connector device 10, since the sheet-like connector 20 is integrally provided on the anisotropic conductive film 10A, it is not necessary to align the sheet-like connector 20 with respect to the anisotropic conductive film 10A. Even when the pitch of the target electrode is small, a good electrical connection state can be obtained, and even when used repeatedly over a long period of time or in a high temperature environment, the conductive path forming portion 11 and the electrode structure Therefore, the positional deviation from the position 22 does not occur, and therefore, a good electrical connection state can be stably maintained.
Moreover, since the insulating sheet 21 in the sheet-like connector 20 is made of a mesh or a non-woven fabric, it is possible to more reliably prevent the displacement between the conductive path forming portion 11 and the electrode structure 22.
In addition, since the electrode structure 22 in the sheet-like connector 20 is a projection, electrical connection can be reliably achieved even for a circuit device in which a resist film having a thickness larger than the connection target electrode is formed. .

Such an anisotropically conductive connector device 10 can be manufactured as follows, for example.
FIG. 6 is a cross-sectional view illustrating the configuration of an example of a mold used for manufacturing the anisotropic conductive connector device of the present invention. This mold is configured such that an upper mold 50 and a lower mold 55 paired with the upper mold 50 are arranged so as to face each other, and a molding surface (lower surface in FIG. 6) of the upper mold 50 and a molding surface of the lower mold 55 (FIG. 6, a molding space 59 is formed between the upper surface and the upper surface.
In the upper mold 50, the ferromagnetic layer 52 is formed on the surface (lower surface in FIG. 6) of the ferromagnetic substrate 51 according to the arrangement pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. A non-magnetic layer 53 is formed at a place other than the ferromagnetic layer 52, and a molding surface is formed by the ferromagnetic layer 52 and the non-magnetic layer 53. Further, the upper mold 50 is formed with a step on the molding surface to form a recess 60.

  On the other hand, in the lower die 55, the ferromagnetic layer 57 is formed on the surface of the ferromagnetic substrate 56 (upper surface in FIG. 6) according to a pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. And a nonmagnetic layer 58 having a thickness larger than the thickness of the ferromagnetic layer 57 is formed at locations other than the ferromagnetic layer 57. The nonmagnetic layer 58 and the ferromagnetic layer Since a step is formed between the lower mold 55 and the lower mold 55, a recess 59 for forming the protruding portion 11A of the anisotropic conductive film 20A is formed on the molding surface.

  Ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt can be used as materials constituting the ferromagnetic substrates 51 and 56 in each of the upper mold 50 and the lower mold 55. The ferromagnetic substrates 51 and 56 preferably have a thickness of 0.1 to 50 mm, have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

  In addition, as a material constituting the ferromagnetic layers 52 and 57 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt is used. it can. The ferromagnetic layers 52 and 57 preferably have a thickness of 10 μm or more. When this thickness is less than 10 μm, it becomes difficult to cause a magnetic field having a sufficient strength distribution to act on the molding material layer formed in the mold, and as a result, a conductive path in the molding material layer. Since it becomes difficult to gather the conductive particles at a high density in the portion to be the formation portion 11, a good anisotropic conductive connector may not be obtained.

In addition, as the material constituting the nonmagnetic layers 53 and 58 in each of the upper mold 50 and the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. It is preferable to use a polymer material cured by radiation in that the nonmagnetic layers 53 and 58 can be easily formed by the above method. Examples of the material include acrylic dry film resists and epoxy-based materials. A photoresist such as a liquid resist or a polyimide liquid resist can be used.
Further, the thickness of the nonmagnetic layer 58 in the lower die 55 is set according to the protruding height of the protruding portion 11A to be formed and the thickness of the ferromagnetic layer 57.

Using the above mold, for example, the anisotropic conductive connector device 10 is manufactured as follows.
First, the sheet-like connector 20 having the configuration shown in FIGS. 1 to 3 is manufactured. If it demonstrates concretely, as shown in FIG. 7, the insulating sheet 21 consisting of a mesh or a nonwoven fabric will be prepared.
As shown in FIG. 8, a resist layer 70 is formed on the insulating sheet 21 with, for example, a dry film resist.
A plurality of pattern holes 75 are formed in the resist layer 70 in accordance with a pattern corresponding to the pattern of the electrode structure 22 to be formed on the insulating sheet 21 on which the resist layer is formed, as shown in FIG.
Next, by plating the laminated material, as shown in FIG. 10, the electrode structure 22 connected to the insulating sheet 21 made of mesh or nonwoven fabric is formed in the pattern hole 75 of the resist layer 70. Form.
Thereafter, by removing the resist layer from the laminated material layer, a sheet-like connector 20 is obtained as shown in FIG.

  In the above, as a plating method for forming the electrode structure 22, an electrolytic plating method or an electroless plating method can be used.

Next, as shown in FIG. 12, two frame-shaped spacers 60 and 61 and a support 30 are prepared, and this support 30 is connected to the lower die 55 via the spacer 61 as shown in FIG. The spacer 60 is disposed on the support 30 in a fixed manner.
On the other hand, a molding material for forming an anisotropic conductive film is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material forming material which is cured to become an elastic polymer material.
Next, as shown in FIG. 13, a protective film 62 is disposed in the recess 54 on the molding surface of the upper mold 50, and the sheet-like connector 20 is placed on each of the electrode structures 22 on the protective film 62. The electrode structure 22 is disposed so as to be in contact with the protective film 62 in a state of being aligned on the ferromagnetic layer 52a. And as shown in FIG. 14, the molding material which the electroconductive particle which shows magnetism in the polymer substance formation material is contained in the said recessed part 54 by filling the recessed part 54 of the upper mold | type 50 with the molding material. By forming the layer 10B and filling the space formed by the lower mold 55, the spacers 60 and 61 and the support 30 with a molding material, the polymer material is electrically conductive in the space. The molding material layer 10B containing the particles is formed, and the upper mold 50 is positioned and positioned on the spacer 60, whereby the final molding material layer is formed in the mold as shown in FIG. 10B is formed. In this state, the molding material layer 10B is formed on the molding surface of the lower mold 55 in the mold, and the sheet-like connector 20 is disposed on the molding material layer 10B. A protective film 62 is disposed between the molding surface of the upper mold 50.
Further, in the molding material layer 10B, as shown in FIG. 16, the conductive particles P are dispersed in the molding material layer 10B.

  Next, by operating electromagnets (not shown) disposed on the upper surface of the ferromagnetic substrate 51 in the upper mold 50 and the lower surface of the ferromagnetic substrate 56 in the lower mold 55, a parallel magnetic field having an intensity distribution, that is, the upper A parallel magnetic field having a large strength is applied in the thickness direction of the molding material layer 10B between the ferromagnetic layers 52a and 52b of the mold 50 and the corresponding ferromagnetic layer 57 of the lower mold 55. As a result, in the molding material layer 10B, the conductive particles dispersed in the molding material layer 10B correspond to the ferromagnetic layers 52a and 52b of the upper die 50 as shown in FIG. The conductive layer forming part 11 is located between the lower die 55 and the ferromagnetic layer 57 and is aligned so as to be aligned in the thickness direction of the molding material layer 10B.

  In this state, by curing the molding material layer 10B, the conductive path forming portion 11 that is densely packed in a state where the conductive particles are aligned in the thickness direction in the elastic polymer substance, and these An anisotropic conductive film 10A having an insulating portion 14 made of an insulating elastic polymer material formed so as to surround the periphery of the conductive path forming portion 11 and having no or almost no conductive particles is provided on one side of the sheet. The connector 20 is formed in a state in which the connector 20 is integrally bonded and the peripheral portion thereof is fixed to and supported by the support 30, so that the anisotropic conductivity of the configuration shown in FIGS. The connector 10 is manufactured.

In the above, as a material for forming the protective film 62, a resin material such as a resist material, a fluororesin, or a polyimide resin can be used.
The curing treatment of the molding material layer 10B can be performed while the parallel magnetic field is applied, but can also be performed after the parallel magnetic field is stopped.
The intensity of the parallel magnetic field applied to each molding material layer is preferably such that the average is 20,000 to 1,000,000 μT.
Further, as a means for applying a parallel magnetic field to each molding material layer, a permanent magnet can be used instead of an electromagnet. The permanent magnet is preferably made of alnico (Fe—Al—Ni—Co alloy), ferrite, or the like in that a parallel magnetic field strength in the above range can be obtained.
The curing treatment of the molding material layer 10B is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer material forming material constituting the molding material layer, the time required for the movement of the conductive particles, and the like.

According to such a manufacturing method, in order to cure the molding material layer 10B in a state where the sheet-like connector 20 is disposed on the molding material layer 10B for forming the anisotropic conductive film 10A, the anisotropic conductive film The anisotropic conductive connector device 10 in which the sheet-like connector 20 is integrally provided on 10A can be advantageously and reliably manufactured.
Further, by disposing the protective film 62 between the molding surface of the upper mold 50 and the sheet-like connector 20, the molding surface of the upper mold 50 and the electrode structure 22 of the sheet-like connector 20 are prevented from being damaged. In addition, the molding material can be prevented from entering the surface of the sheet-like connector 20 (the surface on the upper mold 50 side).

FIG. 18 is an explanatory diagram showing an outline of the configuration of the first example of the circuit device inspection device according to the present invention. FIG. 19 shows the circuit device inspection device according to the present invention together with the current supply device and the voltage measurement device. It is explanatory drawing which shows the outline of the structure.
This circuit device inspection apparatus is provided with an inspection circuit board 40 having guide pins 42.
A connection electrode 41 is formed on the surface (upper surface in FIG. 1) of the circuit board for inspection 40 according to a pattern corresponding to the pattern of the electrode 2 to be inspected of the circuit device 1 to be inspected. Here, the inspected electrode 2 of the circuit device 1 is a solder bump electrode.
On the surface of the circuit board for inspection 40, the anisotropic conductive connector device 10 is disposed. Specifically, by inserting guide pins 42 into positioning holes 32 (see FIGS. 1 and 3) formed in the support 30 in the anisotropic conductive connector device 10, the effective conductivity in the anisotropic conductive film 10A. The voltage measuring conductive path forming portion 12B and the test circuit board 40 are connected to the current supplying connection electrode 41A of the power supplying conductive path forming portion 12A and the inspection circuit board 40. The anisotropic conductive connector device 10 is fixed on the surface of the circuit board 40 for inspection in a state of being positioned on the connection electrode 41B for voltage measurement of the circuit board 40.

  In such a circuit device inspection device, the circuit device 1 is arranged on the anisotropic conductive connector device 10 so that the electrode 2 to be inspected is positioned on the electrode structure 22 in the sheet-like connector 20. Thus, for example, by pressing the circuit device 1 in a direction approaching the circuit board 5 for inspection, each of the effective conductive path forming portions 12 in the anisotropic conductive connector device 10 is connected to the electrode structures 22 in the sheet-like connector 20. As a result, electrical connection between each of the electrodes 2 to be inspected of the circuit device 1 and each of the connection electrodes 41 of the circuit board for inspection 40 is achieved. The test temperature is adjusted in the constant temperature layer 7, a predetermined current is supplied from the power supply device 93, the voltage is measured in the electric signal processing device 94, and the electric power of the circuit 3 in the circuit device 1 is measured. Inspection is carried out.

According to the inspection apparatus for a circuit device described above, since the anisotropic conductive connector device 10 of the first example described above is provided, even when used repeatedly over a long period of time or in a high temperature environment, good electrical characteristics can be obtained. A connection state can be maintained stably.
Further, since the electrode structure 22 in the sheet-like connector 20 is a projection, the circuit device 1 to be inspected is formed by forming a resist film having a thickness larger than the thickness of the electrode 2 to be inspected. In addition, the electrical connection to the circuit device 1 can be reliably achieved.

FIG. 20 is an explanatory diagram showing an outline of the configuration of the second example of the circuit device inspection apparatus according to the present invention.
In this circuit device inspection device, an anisotropic conductive sheet 8 is arranged between the anisotropic conductive connector device 10 in the circuit device inspection device of the first example and the circuit device 1 to be inspected, so that anisotropic conductivity is achieved. The electrode structure 22 in the conductive connector device 10 is electrically connected to the inspected electrode 2 of the circuit device 1 to be inspected via the anisotropic conductive sheet 8.
In this example, the anisotropic conductive sheet is an anisotropic conductive sheet containing elastic particles arranged in the thickness direction and dispersed in the plane direction in an insulating polymer material having elasticity (hereinafter referred to as “dispersion type”). An anisotropic conductive sheet) and a conductive path forming portion containing conductive particles oriented in the thickness direction in an insulating polymer material having elasticity and arranged in a state separated from the insulating portion. Any one of the directionally conductive sheets (hereinafter referred to as “the uneven distribution type anisotropically conductive sheet”) may be used.

In this example, when using an unevenly distributed anisotropic conductive sheet, for example, as shown in FIG. 21, one of the conductive path forming portions 11 of the unevenly distributed anisotropic conductive sheet is a circuit device 1 that is an object to be inspected. Forming a current supply conductive path connected to the circuit board current supply connection electrode 41A in the effective conductive path forming portion 12 of the anisotropic conductive connector device 10 while being electrically connected to one of the electrodes 2 to be inspected It is preferable that the portion 12A and the voltage measurement conductive path forming portion 12B connected to the voltage measurement connection electrode 41B of the circuit board are arranged so as to be simultaneously connected.
In this way, when the anisotropic conductive connector device 10 is brought into contact with the inspection electrode 2 of the circuit device 1 which is the object to be inspected via the anisotropic conductive sheet 8, the repeated anisotropic measurement is performed. By exchanging only the conductive sheet 8, it becomes possible to continue the inspection and use of the anisotropic conductive connector device 10, and the effect of reducing the inspection cost is achieved.

In the present invention, it is possible to add various changes without being limited to the above embodiment.
(1) It is not essential to provide a support in the anisotropic conductive connector device 10.
(2) When the anisotropic conductive connector 10 of the present invention is used for electrical inspection of a circuit device, the anisotropic conductive film may be integrally bonded to the inspection circuit board. According to such a configuration, it is possible to reliably prevent the positional deviation between the anisotropic conductive film and the inspection circuit board.
Such an anisotropic conductive connector device uses, as a mold for manufacturing the anisotropic conductive connector device, one having a board placement space area in which a circuit board for inspection can be placed in a molding space. The circuit board for inspection is placed in the space area for board placement in the molding space of the mold, and in this state, for example, the molding material can be injected into the molding space and hardened.
(3) The anisotropic conductive film may be formed of a laminate of a plurality of different types of layers. Specifically, a structure composed of a laminate of a plurality of layers formed of elastic polymer materials each having a different hardness, and a plurality of layers each containing different types of conductive particles in a portion that becomes a conductive path forming portion. Constitution consisting of a laminate, constitution comprising a laminate of a plurality of layers in which conductive particles having different particle diameters are contained in the respective portions serving as conductive path forming portions, and inclusion of conductive particles in each portion serving as a conductive path forming portion By adopting a configuration composed of a laminate of a plurality of layers having different ratios, a conductive path forming portion in which the degree of elasticity and conductivity is controlled can be formed.
Such an anisotropic conductive film can be manufactured by the method described in Japanese Patent Application No. 2003-10075, for example.

(4) In the anisotropic conductive connector device of the present invention, the conductive path forming portions are arranged at a constant pitch regardless of the pattern of the electrode to be inspected, and a part of the conductive path forming portions is formed. The effective conductive path forming portion that is electrically connected to the electrode to be inspected may be used, and the ineffective conductive path forming portion that is not electrically connected to the electrode to be inspected may be other conductive path forming portions.
For example, there is a configuration in which the electrode 2 to be inspected is arranged only at a part of the lattice point positions with a constant pitch, such as CSP (Chip Scale Package) and TSOP (Thin Small Outline Package). In the anisotropic conductive connector device 10 for inspecting such a circuit device 1, the conductive path forming portion 11 is arranged in accordance with the lattice point positions having substantially the same pitch as the electrode 2 to be inspected. The conductive path forming part 11 in the corresponding position can be used as the effective conductive path forming part 12, and the other conductive path forming part 11 can be used as the ineffective conductive path forming part 13.
According to the anisotropic conductive connector device 10 having such a configuration, in the manufacture of the anisotropic conductive connector device 10, the ferromagnetic layer of the mold is arranged at a constant pitch, so that the molding material layer is formed. When a magnetic field is applied, the conductive particles can be efficiently assembled and oriented at a predetermined position, whereby the density of the conductive particles is uniform in each of the obtained conductive path forming portions. Therefore, an anisotropic conductive connector device having a small difference in resistance value between the respective conductive path forming portions can be obtained.

(5) In the anisotropic conductive connector device of the present invention, for example, as shown in FIG. 22, the electrode structure 22 of the sheet-like connector 20 is a connection electrode for supplying current to the circuit board in the effective conductive path forming portion 12. The current supply conductive path forming portion 12A connected to 41A and the voltage measuring conductive path forming portion 12B connected to the voltage measuring connection electrode 41B of the circuit board may be connected simultaneously.
According to such a configuration, the number of electrode structures 22 in the sheet-like connector 20 can be half of the number of effective conductive path forming portions 12 in the anisotropic conductive film 10A. This is preferable because the manufacturing of this is easy in terms of cost and the like.
(6) In the anisotropically conductive connector device of the present invention, the sheet-like connector is not essential, and for example, as shown in the figure (scheme 4), by the anisotropically conductive film 10A having no sheet-like connector. As the anisotropic conductive connector device 10, an inspection device for a circuit device may be configured. According to such a configuration, the manufacturing cost of the anisotropic conductive connector device 10 is reduced.

(7) In the method for manufacturing the anisotropic conductive connector device, the anisotropic conductive connector and the sheet-like connector are separately manufactured, and then the anisotropic conductive connector and the sheet-like connector are integrated using an adhesive or the like. An anisotropic conductive connector device may be manufactured.
The sheet-like connector in the present invention, as shown in FIG. 24, because the insulating sheet is made of mesh or non-woven fabric, when fixing the sheet-like connector to the anisotropic conductive film of the anisotropic conductive connector using an adhesive or the like, Even without forming a through-hole for the adhesive, the adhesive penetrates into the mesh or the nonwoven fabric, and the sheet-like connector can be firmly bonded and fixed, which is preferable.

  According to the anisotropic conductive connector device of the present invention, since the sheet-like connector is integrally provided on the anisotropic conductive film, the alignment work of the sheet-like connector is unnecessary, and the pitch of the connection target electrodes is reduced. Even if it is small, good electrical connection can be obtained, and even when used repeatedly over a long period of time or in a high temperature environment, the position of the conductive path forming portion and the electrode structure is displaced. Therefore, a good electrical connection state can be stably maintained.

According to the anisotropic conductive connector device of the present invention, since the sheet-like connector is made of an insulating sheet made of a mesh or a non-woven fabric, the production of the sheet-like connector is not necessary because the operation of forming a through hole is not necessary in the production of the sheet-like connector. It can be performed efficiently and inexpensively, and the anisotropic conductive connector device can be manufactured efficiently and inexpensively.
According to the anisotropic conductive connector device of the present invention, since the sheet-like connector is made of an insulating sheet made of mesh or nonwoven fabric, the sheet-like connector is integrated with the anisotropic conductive film of the anisotropic conductive connector. By placing a sheet-like connector on the molding material layer in the mold and curing the molding material layer, the elastic polymer substance constituting the molding material layer is cured in a state of penetrating the mesh or the nonwoven fabric. Therefore, the sheet-like connector can be securely and firmly integrated with the anisotropic conductive connector.
The anisotropic conductive connector device in which the sheet-like connector of the present invention is integrated may cause misalignment between the conductive path forming portion and the electrode structure even when used repeatedly over a long period of time or in a high temperature environment. Therefore, a good electrical connection state can be stably maintained.

  According to the anisotropic conductive connector device of the present invention, for the current supply of the circuit board for inspection to the inspection target electrode of the circuit device which is the inspection object, through the conductive path forming portion having a different anisotropic conductive film. Since the voltage is measured while the two connection electrodes for voltage measurement are electrically connected and the current is supplied from the current supply electrode, the voltage is measured with high accuracy for the circuit in the circuit device as the object to be inspected. Therefore, the inspection accuracy of the circuit device is improved.

  According to the circuit device inspection apparatus of the present invention, since the anisotropic conductive connector is provided, the conductive path forming portion and the electrode structure can be used even when used repeatedly over a long period of time or in a high temperature environment. Therefore, a good electrical connection state can be stably maintained.

According to the inspection apparatus for a circuit device of the present invention, a sheet-like connector made of an insulating sheet made of mesh or non-woven fabric exists between the anisotropic conductive film of the anisotropic conductive connector and the inspection object electrode of the inspection object. Therefore, it is possible to reliably suppress damage during inspection of the inspection object due to separation of the conductive particles from the anisotropic conductive film.
According to the circuit device inspection apparatus of the present invention, since the surface of the electrode structure of the sheet-like connector is flat, even when the inspected electrode of the object to be inspected is a solder protrusion electrode having low hardness, the inspected during inspection The solder bump electrode of the object is not damaged by the pressure contact.

It is a top view which shows the anisotropic conductive connector apparatus of the 1st example which concerns on this invention. It is explanatory drawing which shows the XX cross section of the anisotropically conductive connector apparatus shown in FIG. FIG. 2 is a partially enlarged explanatory view showing a circuit device to be inspected and an inspection circuit board of the anisotropic conductive connector device shown in FIG. 1. It is a top view of the support body in the anisotropically conductive connector apparatus shown in FIG. It is XX sectional drawing of the support body shown in FIG. It is sectional drawing for description which shows the structure in an example of the metal mold | die for anisotropic conductive film shaping | molding. It is sectional drawing for description which shows the structure of the laminated material for obtaining a sheet-like connector. It is sectional drawing for description which shows the state by which the through-hole was formed in the insulating sheet in a laminated material. It is sectional drawing for description which shows the state by which the short circuit part and the surface electrode part were formed in the insulating sheet. It is sectional drawing for description which shows the state by which the back surface electrode part was formed in the back surface of an insulating sheet. It is sectional drawing for description which shows the state by which the through-hole for connection was formed in the insulating sheet. It is sectional drawing for description which shows the state by which the spacer and the support body are arrange | positioned on the molding surface of a lower mold | type. It is sectional drawing for description which shows the state by which the sheet-like connector is arrange | positioned through the protective film on the molding surface of the upper mold | type. It is sectional drawing for description which shows the state in which the molding material layer was formed in each of an upper mold | type and a metal mold | die. It is sectional drawing for description which shows the state by which the molding material layer of the target form was formed in the metal mold | die. It is sectional drawing for description which expands and shows a part of molding material layer. It is sectional drawing for description which shows the state by which the magnetic field was acted on the molding material layer. It is explanatory drawing which shows the structure in the 1st example of the inspection apparatus of the circuit apparatus which concerns on this invention with a circuit apparatus. It is explanatory drawing which shows the structure in the 1st example of the inspection apparatus of the circuit apparatus which concerns on this invention with a circuit apparatus, a power supply device, and a voltage measuring device. It is explanatory drawing which shows the structure in the 2nd example of the inspection apparatus of the circuit apparatus which concerns on this invention with another circuit apparatus. It is explanatory drawing which partially expands and shows the structure in the 2nd example of the inspection apparatus of the circuit apparatus which concerns on this invention with another circuit apparatus. It is explanatory drawing which shows the structure in the other example of the inspection apparatus of the circuit apparatus which concerns on this invention with another circuit apparatus. It is explanatory drawing which shows the structure in the other example of the inspection apparatus of the circuit apparatus which concerns on this invention with another circuit apparatus. It is a schematic diagram of the apparatus which measures the electrical resistance between the electrodes in a circuit board with the probe for power supply, and the probe for voltage measurement.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit apparatus 2 Electrode to be inspected 3 Circuit 7 Constant temperature layer 8 Anisotropic conductive sheet 10 Anisotropic conductive connector apparatus 10A Anisotropic conductive film 11 Conductive path formation part 11A Protrusion part 12 Effective conductive path formation part 12A Current supply conductive path Forming part 12B Conductive path forming part for voltage measurement 13 Invalid conductive path forming part 14 Insulating part 20 Sheet-like connector 21 Insulating sheet 22 Electrode structure 30 Supporting body 31 Opening part 32 Positioning hole 40 Circuit board for inspection 41 Connecting electrode 41A Current Supply connection electrode 41B Voltage measurement connection electrode 42 Guide pin 50 Upper die 51 Ferromagnetic substrate 52 Ferromagnetic layer 53 Nonmagnetic layer 54 Recess 55 Lower die 56 Ferromagnetic substrate 57 Ferromagnetic layer 58 Non Magnetic layer 59 Recess 60, 61 Spacer 62 Protective film 70 Resist layer 75 Pattern hole 90 Circuit board 91, 92 Target electrode 93 Power supply device 94 Electric signal processing device

Claims (6)

  An inspection circuit board on which a plurality of connection electrodes each including two connection electrodes for current supply and voltage measurement are formed in accordance with a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface; Anisotropic conduction in which a plurality of conductive path forming portions extending in the thickness direction connected to each connection electrode of the circuit board for inspection provided with a supporting body are arranged in a state of being insulated from each other by an insulating portion An anisotropic conductive connector device comprising a membrane. A sheet-like connector in which a plurality of electrode structures extending in the thickness direction is arranged on an insulating sheet, and each electrode structure is positioned on each conductive path forming portion of the anisotropic conductive film, 2. The anisotropic conductive connector device according to claim 1, wherein the anisotropic conductive connector device is integrally provided on the anisotropic conductive film. A sheet-like connector in which a plurality of electrode structures extending in the thickness direction are arranged on an insulating sheet has two electrode structures, one for supplying current and one for measuring voltage, each of which is provided on a circuit board for inspection. 2. The conductive film according to claim 1, wherein the anisotropic conductive film is integrally provided on the anisotropic conductive film so as to be in contact with two conductive path forming portions of the anisotropic conductive film corresponding to the connection electrode. Anisotropic conductive connector device. An anisotropic conductive sheet that is aligned in the thickness direction and is dispersed in the surface direction is detachably placed on the sheet-like connector. The anisotropic conductive connector device according to claim 2 or 3, wherein the anisotropic conductive connector device is formed. 5. The anisotropic conductive connector device according to claim 2, wherein the insulating sheet of the sheet-like connector is a mesh or a non-woven fabric. A circuit device inspection apparatus comprising the anisotropic conductive connector device according to claim 1.

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