JPH10197591A - Circuit board inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably inspect it at one time even on a high density printed circuit board or the like by arranging a conductive passage of an anisotropic conductive sheet arranged according to a pattern corresponding to terminal electrodes of an inspection object circuit board and an end surface of a conductive wire rod of an adapter so as to be brought into in close contact with each other. SOLUTION: An anisotropic conductive sheet 20 where conductive passage forming parts 21 are arranged according to a pattern corresponding to terminal electrodes 11 of a printed circuit board 10 to be inspected and an adapter 30 where conductive wire rods 32 such as a pin and a fine line are arranged in an insulating base material 31 according to a pattern corresponding to the terminal electrodes 11 of an inspection object circuit board 10, are integrally adhered together, and a base board inspection device is constituted. According to this constitution, the anisotropic conductive sheet 20 can be integrally brought into contact with the conductive wire rods 32 of the adapter 30 in a condition where the respective conductive passage forming parts 21 are positioned on the corresponding respective terminal electrodes 11. Since wiring may be performed by changing a relative position of an upper surface end part and a lower surface end part of the conductive wire rods 32, an electric inspection can be reliably performed even on a high density circuit board 10 where the terminal electrodes 11 are arranged in a lattice shape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection apparatus used for inspecting a circuit board apparatus, and more particularly to an MCM.
The present invention relates to a circuit board inspection device used for inspecting a circuit board device classified as (Multi Chip Module).

[0002]

2. Description of the Related Art In recent years, the terminal electrode density of a printed circuit board has increased. Especially MCM (MultiChip Mod)
The printed circuit board classified as “ule” has a plurality of integrated elements mounted directly, and terminal electrodes of the integrated elements are arranged in a grid pattern at minute intervals. , The number of terminal electrodes is increasing, and the density is increasing.

[0003] In the electrical inspection of such a circuit board device, conventionally, an inspection circuit device in which a thin spring pin called a fine probe corresponding to a terminal electrode of a circuit board device to be inspected is arranged, or an anisotropic conductive material. An inspection circuit device in which a sheet and an inspection circuit board are integrated is used for inspection.

An inspection circuit device called a fine probe has problems such as low inspection reliability, flaws in terminal electrodes of a circuit board device to be inspected, easy operation failure, and high cost. There is. On the other hand, a circuit board device for inspection in which an anisotropic conductive sheet and a circuit board for inspection according to Japanese Patent Application Laid-Open No. 04-151564 are integrated has been used as an inspection method in which the above problem is improved. Japanese Patent Application Laid-Open No. 06-086531 has been proposed for increasing the density of a circuit board device to be inspected.

However, when a circuit board device to be inspected is a high-density printed circuit board having a high-density pattern and having minute terminal electrodes arranged in a grid like an MCM (Multi Chip Module), the minute terminal It becomes difficult to create an inspection circuit board having connection electrodes corresponding to the electrodes. In such a case, the pattern of the minute terminal electrodes is usually divided for one circuit board device to be inspected, and a plurality of circuit boards for inspection having corresponding connection electrodes are formed, and a plurality of circuit boards for inspection are formed. It is used as an apparatus for inspection. However, a plurality of circuit board devices to be inspected are inspected a plurality of times using a plurality of circuit board devices for inspection, so that the inspection time becomes longer and the inspection efficiency becomes lower. In addition, as the number of circuit board devices to be inspected increases, the inspection time further increases, and as a result, the inspection cost increases.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made based on the above circumstances, and its object is to provide:
To provide an inspection circuit device that can be surely inspected in a single inspection in an electrical inspection when a circuit board device to be inspected is a high-density printed circuit board in which terminal electrodes are arranged in a grid pattern. It is in.

[0007]

That is, the present invention provides an anisotropic conductive sheet in which conductive paths are arranged in accordance with a pattern corresponding to a terminal electrode of a circuit board device to be inspected, and a conductive wire on an insulating base material. And an adapter arranged in accordance with a pattern corresponding to a terminal electrode of the circuit board device to be inspected.

In the circuit board inspection apparatus of the present invention, an anisotropic conductive sheet having conductive paths arranged in accordance with a pattern corresponding to a terminal electrode of the circuit board apparatus to be inspected, and the specific adapter described above are combined. The conductive path of the one conductive sheet and the end surface of the conductive material of the adapter are aligned and arranged.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a circuit device for inspection according to the present invention will be described in detail. FIG. 1 is an explanatory cross-sectional view showing an example of a circuit device for inspection according to the present invention and a configuration of a circuit board device to be inspected. In this drawing, reference numeral 10 denotes a printed circuit board to be inspected, and a plurality of terminal electrodes 11 to be inspected are arranged on the surface of the printed circuit board.
FIG. 14 is a plan view showing an example of a circuit board device to be inspected. The terminal electrodes 11, which are the electrodes to be inspected, are arranged in a lattice, and exist as a plurality of sets.

Reference numeral 30 in FIG. 1 denotes an adapter in which a conductive wire 32 is disposed on an insulating base material 31. Conductive wire 32
A pin or a thin wire is preferably used, and one end of the pin or the thin wire is arranged at a position corresponding to a terminal electrode of a circuit board device to be inspected. The conductive wire 32 may be wired in the insulating base material 31 by changing the relative positions of the upper end and the lower end, or the positions of the upper and lower terminals may be different. They may be arranged to correspond. Further, the conductive wire is preferably wired perpendicularly to the terminals on the upper surface and the lower surface.

As the insulating base material 31, a material which has strength enough to withstand the pressing pressure at the time of inspection and is easily processed is used. Usually, as an organic material, bakelite, epoxy resin, glass epoxy plate, acrylic plate and the like are used.
In addition, as a metal material, aluminum or the like may be used after surface insulating treatment. The surface in contact with the anisotropic conductive sheet is uniformly processed in a plane so that the pressing pressure at the time of inspection becomes uniform.
Preferably, the surface smoothness has a dispersion within 20 μm.

As the thickness of the conductive wire 32, one having a pin diameter or a fine wire diameter of 400 μm or less is suitably used, and is selected according to the interval between terminal electrodes of a circuit device to be inspected. For example, when the terminal electrode interval is 225 μm, a diameter of about 150 μm is selected. If the diameter is too large, it becomes difficult to drill holes in the insulating base material. Therefore, the difference between the terminal electrode spacing and the diameter of the conductive wire 32 (pin or fine wire) is 70 μm or more. Alternatively, a thin line or the like is selected.

When a pin is used as the conductive wire 32, for example, the pin 32 is formed from a conductive metal material to form a pin, or a conductive metal pipe-shaped material having both ends sealed with a metal material. For example, a material obtained by plating a conductive metal on the surface of an insulating resin is used. These materials are selected from those which are not deformed by repeated presses at the time of inspection and those which are easy to process. As the metal material, a copper alloy, an aluminum alloy or the like is used. For example, brass, beryllium copper, rinsei copper and the like are used. Pin 32
One of the end faces contacts the anisotropic conductive sheet. For stable contact, the end face of the pin 32 is preferably polished smoothly, or the one protruding toward the anisotropic conductive sheet side can be preferably used. Further, in order to reduce the conduction resistance, the pins preferably have a gold-plated surface. Also,
You may use the pin which carried out metal plating on the surface of resin. The end face on the side opposite to the anisotropic conductive sheet is connected to a metal conductor by Hunter-Junction or the like, and is finally connected to a measuring unit of the inspection device.

The conductive pins 32 are press-fitted into working holes of the insulating base material 31 and fixed. In this case, the pin 32
Is protruded from the surface of the insulating base material 31 in the range of 0 to 100 μm in order to make stable contact with the anisotropic conductive sheet.
If the protrusion amount exceeds 100 μm,
There is a risk of damaging the anisotropic conductive sheet.

In addition, a conductive thin wire 32 can be used instead of the pin as the conductive wire. As the thin wire, a thin metal wire is usually used, but a thin metal wire having an insulating coating on the surface can be used as long as the conductivity of the end face is ensured. What is called a magnet wire can be used as the thin metal wire. One of the end faces of the thin metal wires 32 is in contact with the anisotropic conductive sheet. The end face is polished smoothly for stable contact. Further, the end face of the thin metal wire is preferably plated with gold in order to reduce the conduction resistance. The other end face is connected to the measuring unit of the inspection device.

The conductive fine wire 32 penetrates a hole formed in the insulating base material 31 and is fixed to the insulating base material 31 physically or chemically by an adhesive or the like. The end face of the thin metal wire 32 protrudes from the surface of the insulating base material 31 in a range of 0 to 100 μm in order to make stable contact with the anisotropic conductive sheet.
If the protrusion amount exceeds 100 μm,
Damages the anisotropic conductive sheet. This protrusion is
The protrusion amount of the thin line may be used, or the protrusion may be formed by plating.

As shown in FIG. 1, the anisotropic conductive sheet 20 is composed of conductive magnetic particles G in an insulating elastic polymer substance E.
Have a large number of conductive path forming portions 21 densely filled. The adjacent conductive path forming portions 21 are mutually insulated by an insulating portion 22 made of a polymer material, and are arranged at positions corresponding to terminal electrodes of a circuit board to be inspected. In the illustrated example, each of the conductive path forming portions 21 is formed so as to protrude from the surface of the insulating portion 22 by a height h.

In each conductive path forming portion 21 of such an anisotropic conductive sheet 20, conductive magnetic particles G are oriented in a state of being arranged in the thickness direction, and the conductive path is formed in the thickness direction. Is done. The conductive path may be a conductive path at all times, or may have a pressurized conductive path forming portion in which the conductive path is formed by reducing the resistance value when compressed in the thickness direction and compressed. . On the other hand, the insulating portion 22 does not form a conductive path in the thickness direction even when pressed.

The protruding height h of the conductive path forming portion 21 is set so as to be in contact with the terminal electrode of the circuit board to be inspected, and is at least 5% of the total thickness t of the anisotropic conductive sheet 20. Preferably, it is more preferably 7 to 30%, particularly preferably 8 to 20%. In addition, the anisotropic conductive sheet 20
Is preferably 300% or less of the electrode interval (pitch p). By satisfying such conditions, even when the pressing force applied to the anisotropic conductive sheet 20 changes, the change in conductivity of the conductive path forming portion 21 due to the change is controlled to be sufficiently small. .

As the insulating elastic polymer constituting the conductive path forming portion 21, a polymer having a crosslinked structure is preferable.
Curable polymer materials that can be used to obtain such crosslinked polymer materials include, for example, silicone rubber,
Polybutadiene rubber, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, soft liquid epoxy rubber And the like.

Among these, a polymer substance which is liquid before the curing treatment, and which keeps a close contact state or adhesion state with the adapter 30 after the curing treatment and is integrated with the adapter 30 is preferable. From such a viewpoint, liquid silicone rubber, liquid urethane rubber, soft liquid epoxy rubber, and the like are preferably used. Adapter 3
Additives such as a silane coupling agent and a titanium coupling agent can be added to improve the adhesiveness to zero.

The conductive magnetic particles G of the conductive path forming portion 21 include, for example, particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or gold, silver, palladium, or the like. Examples thereof include those obtained by plating a noble metal such as rhodium and the like, and those obtained by plating inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads with a conductive magnetic material such as nickel or cobalt. In particular, it is preferable to use gold-plated metal particles in terms of electrical characteristics such as low contact resistance. Further, particles composed of a conductive superparamagnetic material can be preferably used because they do not show magnetic hysteresis.

In addition, as long as the conductivity is not impaired, conductive magnetic particles whose surfaces are treated with a coupling agent such as a silane coupling agent or a titanium coupling agent can be used as appropriate. By treating the surfaces of the conductive magnetic particles with the coupling agent, the adhesive force between the conductive magnetic particles and the curable polymer material used for the conductive path forming portion material increases, As a result, the obtained inspection circuit device has high durability in repeated use.

The particle size of the conductive particles G is 1 to 100.
0 μm, more preferably 2 to
It is preferably 300 μm, particularly preferably 3 to 100 μm. The particle size distribution (Dw / Dn) of the conductive particles is 1 to
It is preferably 10 and more preferably 1.01 to
7, more preferably 1.05 to 5, particularly preferably 1.1 to 4. The shape of the conductive particles is not particularly limited, but may be spherical, star-shaped, or agglomerated aggregates of the above-mentioned components (a) and (b) because of the ease of dispersion in the component or a mixture thereof. preferable. As a result, the formed conductive path forming portion 21 is easily deformed under pressure, and a sufficient electrical contact between the conductive magnetic particles in the conductive path forming portion 21 is obtained.

The content ratio of the conductive magnetic particles G in the conductive path forming portion 21 is preferably at least 5% by volume, more preferably 7 to 80%, particularly preferably 10 to 70%. . When the conductive path forming portion 21 to be formed is a pressurized conductive path forming portion, when the ratio of the conductive particles is large, the intended electrical connection can be reliably achieved even when the pressure is small. .

Examples of the polymer constituting the insulating portion 22 include the same polymers as those exemplified as the polymer material constituting the conductive path forming portion 21, and are the same as those used for the conductive path forming portion 21. Or different ones can be used.

In the circuit device for inspection described above, the anisotropic conductive sheet 20 has the conductive path forming portions 21 positioned on the corresponding terminal electrodes 11 and the conductive material 32 of the adapter 30. It is necessary to be provided in a state of being integrally adhered or adhered to, but in order to manufacture such a circuit device for inspection, the following first method or second method is preferably used. I can do it.

(1) First Method This method uses a specific anisotropic conductive sheet manufacturing mold having a ferromagnetic metal portion and a non-magnetic material portion, and uses a mold or a thin wire 32 of the adapter 30 on the pin or the fine wire 32. This is a method for forming the one side conductive sheet 20. Hereinafter, this first method will be specifically described.

FIG. 3 is an explanatory cross-sectional view showing the structure of a main part of an example of an anisotropic conductive sheet manufacturing mold used to obtain the anisotropic conductive sheet 20. The manufacturing mold includes one mold (hereinafter, referred to as “upper mold”) 51, the other mold (hereinafter, referred to as “lower mold”) 56, and a cavity C therebetween. And a spacer 55 for forming the

In the upper die 51, a ferromagnetic material portion 53 is formed on the lower surface of the magnetic metal plate 52 in accordance with a specific pattern of the pins or fine wires 32 of the adapter 30 and a pattern opposite to the ferromagnetic material portion 53. The lower surface of the non-magnetic portion 54 projects downward from the lower surface of the magnetic portion 53 by a height h.

On the other hand, in the lower mold 56, the ferromagnetic portion 5 having the same pattern as the specific pattern of the pins or the thin wires 32 of the adapter 30 is formed on the magnetic metal substrate 57.
8 are formed, and in this example, the upper surface of the ferromagnetic portion 58 and the upper surface of the non-magnetic portion 59 are in the same plane.

In the above description, the magnetic metal substrate 52 and the magnetic metal substrate 57 are made of, for example, iron, an iron-nickel alloy,
It is made of a ferromagnetic metal such as a cobalt alloy, nickel, and cobalt.

As a ferromagnetic material for forming the ferromagnetic portion 53 and the ferromagnetic portion 58, iron, an iron-nickel alloy, an iron-cobalt alloy, nickel, and cobalt can be used.

The non-magnetic material for forming the non-magnetic portion 54 and the non-magnetic portion 59 is a non-magnetic metal such as copper, a heat-resistant resin such as polyimide, or a high-molecular material which is cured by radiation. A material such as a photoresist such as an acrylic dry film resist, an epoxy liquid resist, or a polyimide liquid resist can be used. These are suitably used depending on the application, and it is preferable to use a photoresist or the like by a photolithography technique to easily form a non-magnetic material portion when the mold is quickly and simply formed. On the other hand, when the mold is used repeatedly many times, a nonmagnetic metal such as copper or a heat-resistant resin such as polyimide is preferable.

In the first method, conductive magnetic particles are dispersed in a polymer material which becomes an insulating elastic polymer material by curing treatment, and the conductive magnetic particles are formed of a fluid mixture. A material is prepared, and the material layer is used to form a conductive path forming portion material layer in the conductive path forming portion D between the ferromagnetic portion 53 of the upper die 51 and the lower die 58 in the mold cavity C. Form.

More specifically, as shown in FIG. 4, a material for the conductive path forming portion is applied to the lower surface of the ferromagnetic portion 53 of the upper die 51 to raise the coating layer 6 on the lower surface side.
After the formation of No. 1, as shown in FIG.
By disposing the coating layer 61 on the lower surface of the lower mold 56 via the spacer 55, the spacer 55
To form a conductive path forming portion material layer 60 in a state where the coating layer 61 is in contact with the ferromagnetic portion 58 of the lower mold 56.

As a method for forming the coating layer 61 of the material for the conductive path forming portion, a screen printing mask having an opening of the same pattern as a specific pattern in the conductive wire 32 such as a pin or a thin wire of the adapter 30 is used. It is preferable to use a method of manufacturing and forming a conductive path forming portion material by screen printing using this mask.

By applying a magnetic field to the conductive path forming portion material layer 60 formed in the conductive path forming portion cavity portion D (see FIG. 3) in the mold cavity C in this manner, the conductive property is increased. The magnetic particles are oriented in the thickness direction of the conductive path forming portion material layer 60.

Specifically, as shown in FIG.
The electromagnets 62 and 63 are arranged on the upper surface of the lower mold 56 and the lower mold 56, and the electromagnets 62 and 63 are operated.
A parallel magnetic field acts in a direction toward the ferromagnetic portion 58 of
As a result, the conductive magnetic particles dispersed in the conductive path forming portion material layer 60 are oriented so as to be arranged in the thickness direction.

In this state, as shown in FIG. 7, for example, the conductive path forming portion 21 is formed by heating and curing the material layer for the conductive path forming portion, and thereafter, the conductive path forming portion 21 is formed. The conductive path forming portion 21 is disposed on the ferromagnetic portion 53 of the upper die 51 by releasing the lower die 56 while holding the ferromagnetic portion 53 of the upper die 51 to expose the lower surface. The resulting anisotropic conductive sheet forming intermediate body 65 is formed.

The hardening treatment of the conductive path forming portion material layer 60 is performed as follows.
It is preferable to perform the operation while the parallel magnetic field is being applied, but it is also possible to perform the operation after the operation of the parallel magnetic field is stopped. The strength of the parallel magnetic field applied to the conductive path forming portion material layer 60 is preferably 200 to 10000 gauss on average for each conductive path forming portion cavity portion of the mold.
The curing treatment is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material of the conductive path forming portion material layer 60, the time required for the movement of the conductive magnetic particles, and the like. For example, when the polymer material is a room temperature-curable silicone rubber, the curing process is as follows.
About 24 hours at room temperature, about 2 hours at 40 ° C, 3 hours at 80 ° C
This is performed in about 0 minutes.

In order to release the conductive path forming portion 21 from the lower die 56 while holding the ferromagnetic portion 53 of the upper die 51, the releasability of the lower die 56 is made larger than that of the upper die 51. For example, a release agent having a higher release effect than the release agent applied to the lower surface of the upper mold 51 may be applied to the upper surface of the lower mold 56.

On the other hand, as shown in FIG. 8, on the pins or thin wires 32 of the adapter 30 for inspection, an insulating portion material layer 66 made of a polymer material which becomes an insulating elastic polymer material by curing treatment is provided. As shown in FIG. 9, as shown in FIG. 9, an intermediate body 65 for forming an anisotropic conductive sheet is superimposed on the pins or thin wires 32 of the adapter 30 on which the insulating layer material layer 66 is formed. The conductive path forming portion 21 of the intermediate body 65 for forming an anisotropic conductive sheet is in contact with the pin or the thin wire 32 of FIG.
At this time, the insulating portion material layer on the pin or the fine wire 32 is removed from the area by the conductive path forming portion 21.

Then, in this state, the insulating portion material layer 66 is cured to form the insulating portion 22.
By releasing the upper mold 51, the circuit device for inspection is formed in a state where each of the conductive path forming portions 21 is positioned on the corresponding pin or the fine wire 32 and is integrally adhered or adhered to the adapter 30. It is formed. Insulating material layer 6
The curing treatment of No. 6 can be performed under the same conditions as those shown in the curing treatment of the conductive path forming portion material layer 60.
Thus, the inspection circuit device having the configuration shown in FIG. 1 is manufactured.

In the above method, the conductive path forming portion material layer 6 is formed in the conductive path forming portion cavity D between the ferromagnetic portion 53 of the upper die 51 and the ferromagnetic portion 58 of the lower die 56.
By forming 0 and applying a magnetic field in the vertical direction,
In the conductive path forming portion cavity portion D, the direction of the magnetic force lines is constrained by the ferromagnetic portion 53 and the ferromagnetic portion 58 facing each other, so that it is strictly in the thickness direction of the conductive path forming material layer 60. Only the magnetic field is applied, and as a result, the conductive magnetic particles can be reliably oriented in the thickness direction of the conductive path forming portion material layer 60.

The intermediate 65 for forming an anisotropic conductive sheet, in which the conductive path forming portion 21 is formed on the ferromagnetic portion 53 of the upper die 51, is connected to the adapter 30 on which the insulating material layer 66 is formed. Pin or thin wire 32 and conductive path forming portion 21
And the insulating material layer 66
The insulating portion 22 is formed by curing the
The conductive path forming portion 21 can be formed integrally with the pin or the fine wire 32 in a state where the conductive path forming portion 21 is securely in contact therewith.

In the above description, for example, when the lower mold 56 is made of only a ferromagnetic material, the direction of the lines of magnetic force is the direction extending from the upper mold 51 toward the lower mold 56.
It becomes difficult to strictly control the formation region of the conductive path forming portion 21.

(2) Second Method In this method, an anisotropic conductive composite sheet comprising a support film having positioning holes and an anisotropic conductive sheet 20 integrally bonded to the support film is produced. This is a method of arranging the anisotropic conductive composite sheet on the pins or thin wires 32 of the adapter 30 for inspection.

FIG. 10 is an explanatory sectional view showing the structure of an example of the anisotropic conductive composite sheet used in the second method. The anisotropic conductive composite sheet (hereinafter, simply referred to as composite sheet) 40 is formed by integrally bonding the anisotropic conductive sheet 20 to the support film 41. In the support film 41, a plurality of positioning holes 42 are formed in the side edges thereof in the thickness direction of the film, and the conductive path forming portion 20 of the anisotropic conductive sheet 20 is disposed, for example, in the center. A connection portion opening 43 having an area covering a region to be formed is formed to penetrate in the thickness direction. The anisotropic conductive sheet 20 is integrally connected to the support film 41 such that the conductive path forming portion 21 is located in the connection portion opening 43 of the support film 41.

The thickness of the support film 41 is preferably 20% or more of the anisotropic conductive sheet 20, more preferably 20 to 200%. This thickness is equal to 20 of the anisotropic conductive sheet 20.
When the amount is less than%, deformation such as bending is likely to occur in the obtained composite sheet 40 due to stress due to curing shrinkage or heat shrinkage during formation of the anisotropic conductive sheet 20.

As the support film 41, polyimide,
Use a resin film of epoxy resin, polyester, polyamide, etc., a composite film of these resins and glass fiber or glass cloth, or a composite film of glass and heat-resistant resin, or a composite adhesive film having an adhesive layer on these films I can do it. The support film 41 preferably has a coefficient of linear expansion of 5 × 10 ⁻⁵ or less. If the coefficient of linear expansion of the support film 41 is excessive, dimensional variations occur when the anisotropic conductive sheet 20 is formed, and the resulting composite sheet 40 has low connection reliability with respect to temperature changes. .

Such a composite sheet 40 can be manufactured, for example, as follows. That is, conductive magnetic particles are dispersed in the above-described polymer material to prepare an anisotropic conductive sheet forming material, and this anisotropic conductive sheet forming material is connected to the connection opening 43 of the support film 41. Is applied or filled in a region including a to form an anisotropic conductive sheet forming material layer, and the thickness direction corresponding to the pattern of the conductive path forming portion 21 to be formed on the anisotropic conductive sheet forming material layer. By applying a magnetic field, the conductive magnetic particles are gathered in a state where they are oriented in the thickness direction at a portion where the magnetic field is applied, and the anisotropic conductive sheet forming material layer is cured.

Specifically, as shown in FIG. 11, the process of applying a magnetic field to the anisotropic conductive sheet forming material layer 45 and the curing process of the anisotropic conductive sheet forming material layer 45 are performed by the adapter 30 for inspection. An upper mold 70 having a pin or thin wire arrangement pattern, a ferromagnetic portion 71 of a target pattern, and a non-magnetic portion 72 protruding from the ferromagnetic portion 71, and an inspection adapter 30 A mold including a ferromagnetic portion 74 having the same pattern as the pin or thin wire arrangement pattern and a lower mold 73 in which a nonmagnetic portion 75 is formed in the other region is used.
Then, guide pins 76 and 77 provided on the lower mold 73 are provided.
Is inserted into the positioning holes 42 of the support film 41 so that the anisotropic conductive sheet forming material layer 45 is positioned in the mold cavity in a positioned state. By operating the electromagnets 78 and 79 disposed on the upper surface and the lower surface of the lower die 73, the upper die 7 is moved.
A parallel magnetic field acts in a direction from the ferromagnetic portion 71 of the lower mold 73 to the ferromagnetic portion 74 of the lower mold 73 corresponding thereto, and as a result, the conductive material dispersed in the anisotropic conductive sheet forming material layer 45 is reduced. The ferromagnetic part 71 of the upper die 70
And the ferromagnetic portion 74 of the lower mold 73 are aligned in the thickness direction.

The composite sheet 40 thus manufactured
2 is fixed to a guide hole 33 provided on the insulating base material of the adapter 30 by using a positioning hole 42 of the support film 41 as shown in FIG. Conductive path forming part 2 on top
1 is positioned and fixed. Moreover, the adhesive or the adhesive applied on the insulating base material of the adapter 30 or the tape applied to both sides thereof can be fixed by the optical positioning means. Thus, the test circuit device shown in FIG. 2 is manufactured.

In the second method described above, the anisotropic conductive sheet 20 has the support film 4 having the positioning holes 42.
Since the composite sheet 40 formed integrally with the sheet 1 is used, the composite sheet 40 can be easily attached to and detached from the adapter, and the anisotropic conductive sheet that has been pressed and worn by repeated inspection can be easily replaced.

Although the embodiments of the inspection circuit device according to the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made. For example, as shown in FIG. 12, pins or fine wires 32 in a certain area of the adapter 30 can be arranged at certain intervals. In this way, even in the inspection of a plurality of circuit boards to be inspected having different pattern arrangements, an adapter having pins or fine wires arranged at a fixed interval in common by exchanging the anisotropic conductive sheet can be used. Can be.

Further, for example, as shown in FIG. 13, the anisotropic conductive sheet 20A protrudes from the surface of the other portion by the height h1 from the surface of the other portion to the peripheral portion of each conductive path forming portion 21A in the insulating portion 22A. It is possible to use one formed with a protruding insulating portion 23 that is lower by a height h2 than the forming portion 21A.

The projecting insulating portion 63 is connected to the insulating portion 22.
When the conductive path forming portion A is formed, the width d1 of the protruding insulating portion 23 is preferably 120% or more of the width d of the conductive path forming portion 21A. Further, the protruding insulating portion 23 of the conductive path forming portion 21A
Is set at a height corresponding to the difference between the height of the insulating layer and the height of the terminal electrode on the circuit board to be inspected, and the height h1 of the protruding insulating portion 23 is usually set to the conductive height. It is preferable that the height is at least 100% of the height h2 of the protruding portion 23A from the surface of the protruding insulating portion 23.

By forming the insulating portion 22A having such a protruding insulating portion 23, when the conductive path forming portion 21A is pressed, the conductive path forming portion 21A is deformed and the protruding insulating portion 23 is also deformed. In addition, the force applied to the conductive path forming portion 21A is reduced, and the durability of the conductive path forming portion 21A can be improved. Further, in the inspection circuit device including the anisotropic conductive sheet 20A on which the protruding insulating portion 23 is formed, a circuit board having a very small surface area of the terminal electrode, or a small surface area of the terminal electrode is used. In addition, stable electrical connection can be achieved even with a circuit board having an insulating layer made of, for example, a resist cured material protruding higher than the terminal electrode around the terminal electrode.

[0060]

According to the present invention, an anisotropic conductive sheet in which conductive paths are arranged in accordance with a pattern corresponding to a terminal electrode of a circuit board device to be inspected, and a conductive material such as a pin or a thin wire formed on an insulating base material. A circuit board inspection device comprising an adapter arranged in accordance with a pattern corresponding to a terminal electrode of a circuit board device to be inspected, and the terminal electrodes of the circuit board device to be inspected are arranged in a grid. Even with a high-density circuit board, an electrical inspection can be reliably performed.

Further, by forming the anisotropic conductive sheet as a composite sheet with a supporting film, attachment / detachment from the adapter becomes easy, and when inspecting a large number of circuit board devices to be inspected, the anisotropic conductive sheet during maintenance is required. The replacement of the conductive sheet becomes easy.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view illustrating a configuration of an example of a test circuit device according to the present invention.

FIG. 2 is an explanatory cross-sectional view showing a configuration of an example of the inspection circuit device of the present invention.

FIG. 3 is an explanatory sectional view showing a configuration of a main part of an example of a mold used for manufacturing the inspection circuit device of the present invention.

FIG. 4 is an explanatory diagram showing a state in which a coating layer is formed on a ferromagnetic portion of an upper mold of a mold.

FIG. 5 is an explanatory view showing a state in which a conductive path forming portion material layer is formed in a conductive portion cavity portion of a mold.

FIG. 6 is an explanatory diagram showing a state in which a parallel magnetic field is applied to the conductive path forming portion material layer.

FIG. 7 is an explanatory view showing a step of forming a conductive path forming portion and forming an intermediate for an anisotropic conductive sheet.

FIG. 8 is an explanatory view showing a state in which a material layer for an insulating portion is formed on an adapter.

FIG. 9 is an explanatory view showing a state in which an intermediate for an anisotropic conductive sheet is arranged on an adapter.

FIG. 10 is an explanatory cross-sectional view showing a configuration of an anisotropic conductive composite sheet used in the inspection circuit device of the present invention.

FIG. 11 is an explanatory cross-sectional view illustrating a configuration of an example of a mold used for manufacturing an anisotropic conductive composite sheet.

FIG. 12 is an explanatory cross-sectional view showing the configuration of another example of the test circuit device of the present invention.

FIG. 13 is an explanatory sectional view showing a configuration of still another example of the inspection circuit device of the present invention.

FIG. 14 is an explanatory diagram illustrating an arrangement of an example of a circuit device including a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Printed circuit board 11 Terminal electrode 20 Anisotropic conductive sheet 21 Conductive path forming part 22 Insulating part 23 Projection insulating part 30 Adapter 31 Insulating base material 32 Conductive wire (pin or thin wire) 33 Guide hole 34 Guide pin 40 Anisotropic Conductive composite sheet 41 Support film 42 Positioning hole 43 Connection opening 51 One mold (upper mold) 52 Magnetic metal substrate 53 Ferromagnetic material part 54 Nonmagnetic material part 55 Spacer 56 The other mold (lower mold) 57 Magnetic Metal substrate 58 Ferromagnetic part 59 Nonmagnetic part 60 Conductive part material layer 61 Coating layer 62, 63 Electromagnet 65 Anisotropic conductive sheet intermediate 66 Insulating part material layer 70 Upper die 71 Ferromagnetic part 72 Non Magnetic part 73 Lower mold 74 Ferromagnetic part 75 Non-magnetic part 76,77 Guide pin 78,79 Electromagnet 90 Circuit device Position 92 Terminal electrode D Conductive path forming part Cavity part E Elastic polymer material G Conductive magnetic particles

Claims (1)

[Claims] 1. An anisotropic conductive sheet having conductive paths arranged in accordance with a pattern corresponding to a terminal electrode of a circuit board device to be inspected, and a terminal of the circuit board device to be inspected for a conductive wire on an insulating base material. A circuit board inspection apparatus comprising: an adapter arranged according to a pattern corresponding to an electrode.