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JP2005086042A - Electronic component mounting module - Google Patents

Electronic component mounting module Download PDF

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Publication number
JP2005086042A
JP2005086042A JP2003317460A JP2003317460A JP2005086042A JP 2005086042 A JP2005086042 A JP 2005086042A JP 2003317460 A JP2003317460 A JP 2003317460A JP 2003317460 A JP2003317460 A JP 2003317460A JP 2005086042 A JP2005086042 A JP 2005086042A
Authority
JP
Japan
Prior art keywords
electronic component
solder resist
mounting module
conductive film
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003317460A
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Japanese (ja)
Inventor
Misao Konishi
美佐夫 小西
Junji Shinozaki
潤二 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Priority to JP2003317460A priority Critical patent/JP2005086042A/en
Priority to CNA2004800259805A priority patent/CN1849855A/en
Priority to PCT/JP2004/006668 priority patent/WO2005027603A1/en
Priority to TW093114561A priority patent/TW200511916A/en
Publication of JP2005086042A publication Critical patent/JP2005086042A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
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    • H05K3/3452—Solder masks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To enhance reliability without complicating the mounting. <P>SOLUTION: The electronic component mounting module mounting an electronic component 3 on a printed circuit board, e.g. a flexible board 1, comprises a plurality of wiring patterns 2 provided on the flexible board 1 in correspondence with the terminals 4 of the electronic component 3, solder resist 6 having an opening corresponding to a region for mounting the electronic component 3 and covering the wiring patterns 2 to expose the joints with the electronic component 3, and an adhesive sheet (e.g. an anisotropic conductive film 5) having overall dimensions overlapping the inner circumferential edge part of the solder resist 6 when being laminated onto the flexible board 1 in the region for mounting the electronic component 3 and connecting the electronic component 3 electrically with the wiring patterns 2 when the electronic component 3 is compressed wherein at least part 6a of the opening in the solder resist 6 extends up to a region where the anisotropic conductive film 5 does not overlap the solder resist 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、フレキシブル基板等のプリント基板上に電子部品が実装された電子部品実装モジュールに関する。   The present invention relates to an electronic component mounting module in which an electronic component is mounted on a printed circuit board such as a flexible substrate.

一般的なＣＯＦ(Chip on film)実装方式は、図３（ａ）に示すように、電子部品の端子に対応する配線パターン１１と電子部品の実装領域を囲んで配線パターン１１を被覆するように形成されたソルダーレジスト１２とが形成されたフレキシブル基板１３上に、異方性導電膜１４を貼り付けるとともに、図３（ｂ）に示すように異方性導電膜１４上に、バンプ１５を有する電子部品１６を位置決めして配置し、熱圧着することによって行われる。これにより、図３（ｃ）に示すような電子部品実装モジュールが得られる。   In a general COF (Chip on film) mounting method, as shown in FIG. 3A, the wiring pattern 11 corresponding to the terminals of the electronic component and the mounting region of the electronic component are surrounded to cover the wiring pattern 11. An anisotropic conductive film 14 is affixed on the flexible substrate 13 on which the formed solder resist 12 is formed, and bumps 15 are provided on the anisotropic conductive film 14 as shown in FIG. This is done by positioning and arranging the electronic component 16 and thermocompression bonding. Thereby, an electronic component mounting module as shown in FIG. 3C is obtained.

ところで、このようなＣＯＦ実装においては、図３（ｂ）に示すように、配線パターン１１やソルダーレジスト１２等の凹凸に起因して、異方性導電膜１４とフレキシブル基板１３との間に空気が残留することがある。この状態で電子部品１６が実装されると、実装時に加わる熱及び圧力によって、異方性導電膜１４とフレキシブル基板１３との間に閉じこめられた空気が膨張してボイド１７を発生させたり、最悪の場合、ボイドが破裂することによって異方性導電膜１４を破壊して配線パターンの露出１８が生じる等の不都合を生じることがある。このようなボイド１７や配線パターンの露出１８は、電子部品実装モジュールの信頼性を低下させる原因となる。   By the way, in such COF mounting, as shown in FIG. 3B, air is formed between the anisotropic conductive film 14 and the flexible substrate 13 due to irregularities such as the wiring pattern 11 and the solder resist 12. May remain. When the electronic component 16 is mounted in this state, the air confined between the anisotropic conductive film 14 and the flexible substrate 13 is expanded by the heat and pressure applied during the mounting, and the void 17 is generated. In such a case, the voids may burst, thereby destroying the anisotropic conductive film 14 and causing the wiring pattern exposure 18. Such voids 17 and wiring pattern exposure 18 cause a decrease in the reliability of the electronic component mounting module.

そこで、このような不都合を防止するために、フレキシブル基板の厚み方向に孔を設けることによって、閉じこめられた空気を外部へ放散させる技術が提案されている（例えば、特許文献１参照。）。特許文献１によれば、非可撓性回路基板と可撓性回路基板とを異方性導電膜を介し、接着・一体化するに当たり、可撓性回路基板の被接続部領域に厚さ方向への通気可能な孔を穿設する。これによって、特許文献１の接続方法では、例えば加熱によって非可撓性回路基板と可撓性回路基板との対接面に残存していた気泡（空気）が膨張等した場合であっても、その領域に気泡が残存せずに、可撓性回路基板の被接続部領域の通気可能な孔を介して、気泡が容易に放散・離脱されるとしている。
特開平５−３４３８４４号公報 Therefore, in order to prevent such inconvenience, a technique for dissipating the trapped air to the outside by providing a hole in the thickness direction of the flexible substrate has been proposed (for example, see Patent Document 1). According to Patent Document 1, in bonding and integrating a non-flexible circuit board and a flexible circuit board via an anisotropic conductive film, a thickness direction is provided in a connected portion region of the flexible circuit board. Make a hole that allows ventilation. Thereby, in the connection method of Patent Document 1, for example, even when air bubbles (air) remaining on the contact surface between the inflexible circuit board and the flexible circuit board are expanded by heating, It is assumed that bubbles do not remain in the region, and the bubbles are easily diffused / detached through a ventable hole in the connected portion region of the flexible circuit board.
JP-A-5-343844

しかしながら、上述した特許文献１の方法では、フレキシブル基板に予め孔を穿設又は加工するという余分な工程が必要となり、実装作業が煩雑となるという問題がある。このため、特許文献１記載の方法とは別の手段にて、上述の問題を解決する技術の開発が望まれている。   However, the method of Patent Document 1 described above has a problem that an extra step of drilling or processing a hole in advance in the flexible substrate is required, and the mounting operation becomes complicated. For this reason, development of the technique which solves the above-mentioned problem by means different from the method described in Patent Document 1 is desired.

そこで、本発明はこのような従来の実情に鑑みて提案されたものであり、実装作業を煩雑にすることなく信頼性の向上を図ることができる電子部品実装モジュールを提供することを目的とする。   Therefore, the present invention has been proposed in view of such a conventional situation, and an object thereof is to provide an electronic component mounting module capable of improving the reliability without complicating the mounting work. .

上述の目的を達成するために、本発明に係る電子部品実装モジュールは、プリント基板上に電子部品が実装された電子部品実装モジュールであって、上記電子部品の端子に対応して、上記プリント基板上に複数設けられた配線パターンと、上記電子部品が実装される領域に対応して開口部を有し、上記電子部品との接続部分が露出するように上記配線パターンを被覆するソルダーレジストと、上記電子部品が実装される領域の上記プリント基板上に貼り付けられたときに、上記ソルダーレジストの内周縁部と重なるような外形寸法とされ、上記電子部品が圧着されることにより上記電子部品と上記配線パターンとを電気的に接続する接着シートとを有し、上記ソルダーレジストの開口部の少なくとも一部は、上記ソルダーレジストと上記接着シートとが重ならない領域まで延在されていることを特徴とする。   In order to achieve the above object, an electronic component mounting module according to the present invention is an electronic component mounting module in which an electronic component is mounted on a printed circuit board, and the printed circuit board corresponds to a terminal of the electronic component. A plurality of wiring patterns provided above, a solder resist that covers the wiring pattern so as to expose the connection portion with the electronic component, having an opening corresponding to a region where the electronic component is mounted, When the electronic component is mounted on the printed circuit board in a region where the electronic component is mounted, the outer dimension is such that it overlaps the inner peripheral edge of the solder resist, and the electronic component is crimped to the electronic component. An adhesive sheet for electrically connecting the wiring pattern, and at least a part of the opening of the solder resist is bonded to the solder resist. Characterized in that it extends to the area where the over preparative not overlap.

以上のような電子部品実装モジュールにおいては、ソルダーレジストの開口部の一部が、ソルダーレジスト上に重ねられた接着シートより外側へ延びる構成とされているので、例えば接着シートの貼り付け工程で接着シートとプリント基板との間に閉じこめられた空気は、この部分を介して外部へ効率的に排除される。このため、閉じこめられた空気が例えば電子部品の圧着時に加熱されて膨張し、ボイドを発生させたり配線パターンを露出させたりするような不都合を回避できる。   In the electronic component mounting module as described above, a part of the opening of the solder resist extends outward from the adhesive sheet stacked on the solder resist. The air trapped between the sheet and the printed board is efficiently discharged to the outside through this portion. For this reason, it is possible to avoid the inconvenience that the trapped air is heated and expanded when the electronic component is pressed, for example, and voids are generated or the wiring pattern is exposed.

以上詳細に説明したように、本発明によれば、接着シートとプリント基板との間に閉じこめられた空気を容易に除去することができるので、ボイドの発生や配線パターンの露出等が回避され、高い信頼性を示す電子部品実装モジュールを提供することができる。   As described above in detail, according to the present invention, air trapped between the adhesive sheet and the printed circuit board can be easily removed, so that generation of voids and exposure of the wiring pattern are avoided. An electronic component mounting module exhibiting high reliability can be provided.

以下、本発明に係る電子部品実装モジュールについて、図面を参照しながら説明する。
本発明を適用した電子部品実装モジュールは、図１に示すように、プリント基板である例えばフレキシブル基板１上の複数の配線パターン２と電子部品３のバンプ４とが、異方性導電膜５を介して圧接接合されることにより、フレキシブル基板１上に電子部品３が実装される、いわゆるＣＯＦ(Chip on film)実装方式により構成される。 Hereinafter, an electronic component mounting module according to the present invention will be described with reference to the drawings.
As shown in FIG. 1, the electronic component mounting module to which the present invention is applied includes a plurality of wiring patterns 2 on a printed circuit board, for example, a flexible substrate 1, and bumps 4 of the electronic component 3. The electronic component 3 is mounted on the flexible substrate 1 by press-contacting via the so-called COF (Chip on film) mounting method.

フレキシブル基板１上には、配線パターン２の相互の絶縁性を保つとともに配線パターン２を保護するためのソルダーレジスト６が、電子部品３との接続部分の配線パターン２を露出させるように、配線パターン２を被覆する。また、ソルダーレジスト６は、電子部品３が実装される領域を囲むような開口部を有する。   On the flexible substrate 1, the wiring pattern 2 is maintained so that the solder resist 6 for protecting the wiring pattern 2 and protecting the wiring pattern 2 exposes the wiring pattern 2 at the connection portion with the electronic component 3. 2 is coated. Further, the solder resist 6 has an opening that surrounds a region where the electronic component 3 is mounted.

異方性導電膜５は、導電性粒子が分散された接着剤がフィルム状に形成された例えば異方性導電フィルムであり、電子部品３とフレキシブル基板１とを圧接することによりこれらの電気的接続を確保する。異方性導電膜５は、ソルダーレジスト６の内周縁部と重なるような外形寸法とされ、電子部品３の実装領域を被覆するようにソルダーレジスト６上に貼り付けられる。なお、接着シートは、前記異方性導電膜５に限られず、導電性粒子が含まれない単なる接着剤のシート等であってもよい。   The anisotropic conductive film 5 is, for example, an anisotropic conductive film in which an adhesive in which conductive particles are dispersed is formed in a film shape, and these electronic components 3 and the flexible substrate 1 are brought into pressure contact with each other. Secure the connection. The anisotropic conductive film 5 has an outer dimension that overlaps with the inner peripheral edge of the solder resist 6, and is affixed on the solder resist 6 so as to cover the mounting region of the electronic component 3. The adhesive sheet is not limited to the anisotropic conductive film 5, and may be a simple adhesive sheet that does not contain conductive particles.

本発明においては、図１（ａ）に示すように、電子部品３の実装領域を囲むソルダーレジスト６の開口部の一部６ａが、異方性導電膜５と重ならない領域まで延在され、ソルダーレジスト６を幅方向に分断する形状とされている。このとき、ソルダーレジスト６の開口部の一部６ａは、配線パターン２が形成されていない領域に設けられることが好ましい。   In the present invention, as shown in FIG. 1A, a part 6a of the opening of the solder resist 6 surrounding the mounting region of the electronic component 3 is extended to a region that does not overlap the anisotropic conductive film 5, The solder resist 6 is divided in the width direction. At this time, the part 6a of the opening of the solder resist 6 is preferably provided in a region where the wiring pattern 2 is not formed.

このような構成の電子部品実装モジュールにおいては、フレキシブル基板１上に異方性導電膜５を貼り付けたときにこれらの間に空気が閉じこめられた場合、このソルダーレジスト６の開口部の一部６ａは、閉じこめられた空気を外部へ放散させる経路として働く。このため、異方性導電膜５を介して電子部品３を実装する工程において、フレキシブル基板１と異方性導電膜５とソルダーレジスト６とで囲まれる空間に閉じこめられた空気は、ソルダーレジスト６の開口部の一部６ａを通って外部へ容易に除去される。したがって、このような構成の電子部品実装モジュールは、閉じこめられた空気が膨張することに起因するボイドの発生が抑制されて、配線パターン２が露出する等の不都合がなくなり、品質信頼性の向上を図ることができる。また、ソルダーレジスト６を所定の形状とするだけで、閉じこめられた空気を除去することができるので、フレキシブル基板１に通気用の孔を穿設する等の余分な工程が不要であり、極めて容易に信頼性を高めることができる。   In the electronic component mounting module having such a configuration, when air is trapped between the anisotropic conductive film 5 and the anisotropic conductive film 5 on the flexible substrate 1, a part of the opening of the solder resist 6 is formed. 6a serves as a path for dissipating the trapped air to the outside. For this reason, in the process of mounting the electronic component 3 through the anisotropic conductive film 5, the air confined in the space surrounded by the flexible substrate 1, the anisotropic conductive film 5 and the solder resist 6 It is easily removed to the outside through a part 6a of the opening. Therefore, in the electronic component mounting module having such a configuration, generation of voids due to expansion of the trapped air is suppressed, and there is no inconvenience such as exposure of the wiring pattern 2, thereby improving quality reliability. Can be planned. Further, since the trapped air can be removed simply by making the solder resist 6 into a predetermined shape, an extra step such as making a hole for ventilation in the flexible substrate 1 is unnecessary, and it is very easy. Reliability can be increased.

なお、ソルダーレジスト６の形状は、図１に示すように、開口部の一部６ａがソルダーレジスト６を幅方向に分断するような形状とする必要はなく、例えば、図２に示すように、ソルダーレジスト６の開口部の一部６ａが、ソルダーレジスト６と異方性導電膜５とが重ならない領域よりも外側まで延びていればよい。この場合、図２に示すように、開口部の一部６ａは、ソルダーレジスト６の中途位置まで形成されていてもよいし、ソルダーレジスト６を貫通するように形成されていてもよい。また、ソルダーレジスト６の開口部が延在される部分は、図１及び図２に示すように２箇所に限らず、１箇所又は３箇所以上設けられてもよい。   The shape of the solder resist 6 does not have to be a shape in which the part 6a of the opening divides the solder resist 6 in the width direction as shown in FIG. 1, for example, as shown in FIG. The part 6a of the opening part of the solder resist 6 should just extend outside the area | region where the solder resist 6 and the anisotropic conductive film 5 do not overlap. In this case, as shown in FIG. 2, part of the opening 6 a may be formed up to the middle position of the solder resist 6 or may be formed so as to penetrate the solder resist 6. Moreover, as shown in FIG.1 and FIG.2, the part where the opening part of the soldering resist 6 is extended is not restricted to two places, You may provide one place or three places or more.

以上のような電子部品実装モジュールを構成する部品としては、この種の電子部品実装モジュールに用いられるものをいずれも用いることができる。   As the components constituting the electronic component mounting module as described above, any of those used in this type of electronic component mounting module can be used.

フレキシブル基板１としては、例えばポリイミド等の可撓性を有する絶縁基板等を用いることができる。フレキシブル基板１上の配線パターン２は、例えば銅等の導体からなり、電子部品３のバンプ４に対応して複数形成されている。なお、プリント基板としては、前記フレキシブル基板１に限られず、いわゆるリジッド基板等、配線基板全般に適用可能である。   As the flexible substrate 1, for example, a flexible insulating substrate such as polyimide can be used. The wiring pattern 2 on the flexible substrate 1 is made of a conductor such as copper, and a plurality of wiring patterns 2 are formed corresponding to the bumps 4 of the electronic component 3. The printed board is not limited to the flexible board 1 and can be applied to all wiring boards such as a so-called rigid board.

電子部品３は、例えば半導体ベアチップ等のＩＣチップであり、表面に端子としての金等からなるバンプ４を有する。   The electronic component 3 is an IC chip such as a semiconductor bare chip, for example, and has bumps 4 made of gold or the like as terminals on the surface.

異方性導電膜５を構成する接着剤としては、各種の熱硬化性樹脂、熱可塑性の樹脂、ゴム等を用いることができる。中でも、接続後の信頼性の点から熱硬化性の樹脂を用いることが好ましい。熱硬化性樹脂としては、エポキシ樹脂、メラミン樹脂、フェノール樹脂、ジアリルフタレート樹脂、ビスマレイミドトリアジン樹脂、ポリエステル樹脂、ポリウレタン樹脂、フェノキシ樹脂、ポリアミド樹脂又はポリイミド樹脂等の合成樹脂；ヒドロキシル基、カルボキシル基、ビニル基、アミノ基又はエポキシ基等の官能基を含むゴムやエラストマ等を用いることができる。これらの中でも特に、エポキシ樹脂を各種特性の点で好ましく使用できる。エポキシ樹脂としては、ビスフェノール型エポキシ樹脂、エポキシノボラック樹脂又は分子内に２個以上のオキシラン基を有するエポキシ化合物等を使用できる。これらのエポキシ樹脂は、不純物イオン、特に塩素イオンが５０ｐｐｍ以下の高純度品を用いることが好ましい。   As the adhesive constituting the anisotropic conductive film 5, various thermosetting resins, thermoplastic resins, rubbers, and the like can be used. Among these, it is preferable to use a thermosetting resin from the viewpoint of reliability after connection. Examples of thermosetting resins include epoxy resins, melamine resins, phenol resins, diallyl phthalate resins, bismaleimide triazine resins, polyester resins, polyurethane resins, phenoxy resins, polyamide resins or polyimide resins; hydroxyl groups, carboxyl groups, A rubber or elastomer containing a functional group such as vinyl group, amino group or epoxy group can be used. Among these, an epoxy resin can be preferably used in terms of various characteristics. As the epoxy resin, a bisphenol type epoxy resin, an epoxy novolac resin, an epoxy compound having two or more oxirane groups in the molecule, and the like can be used. These epoxy resins are preferably high-purity products having impurity ions, particularly chlorine ions, of 50 ppm or less.

また、異方性導電膜５に用いられる導電性粒子としては、例えば、Ｎｉ、Ａｇ、Ｃｕ又はこれらの合金等からなる金属粉、球状樹脂粒子の表面を導電材で被覆した導電被覆粒子に金属メッキを施したもの、これら電気的良導体からなる粒子の表面に絶縁性樹脂被膜を設けたもの等、従来より異方性導電性接着剤に用いられている種々の導電性粒子を使用することができる。導電性粒子の粒径は、０．２μｍ〜２０μｍとすることが好ましい。   The conductive particles used for the anisotropic conductive film 5 are, for example, metal powder made of Ni, Ag, Cu or alloys thereof, or conductive coated particles in which the surface of spherical resin particles is coated with a conductive material. It is possible to use various conductive particles conventionally used for anisotropic conductive adhesives, such as those plated and those with an insulating resin coating on the surface of particles made of an electrical good conductor. it can. The particle size of the conductive particles is preferably 0.2 μm to 20 μm.

また、ソルダーレジスト６としては、絶縁性のレジスト材料等、この種の電子部品実装モジュールに用いられる通常のソルダーレジストであればいずれも使用可能である。   Further, as the solder resist 6, any of ordinary solder resists used for this type of electronic component mounting module, such as an insulating resist material, can be used.

以下、本発明の電子部品実装モジュールを製造するための電子部品の実装方法について説明する。   Hereinafter, an electronic component mounting method for producing the electronic component mounting module of the present invention will be described.

先ず、例えば全面に銅箔が貼り付けられたフレキシブル基板をエッチングすることにより、搭載される電子部品３のバンプ４に対応した複数の配線パターン２を有するフレキシブル基板１を用意する。   First, for example, a flexible substrate 1 having a plurality of wiring patterns 2 corresponding to the bumps 4 of the electronic component 3 to be mounted is prepared by etching a flexible substrate having a copper foil attached to the entire surface.

次に、電子部品３のバンプ４と電気的に接続する配線パターン２の一端が露出するような開口部を有するように、電子部品３の実装領域を囲んでソルダーレジスト６を形成する。このとき、ソルダーレジスト６の開口部の一部６ａが、後の工程で貼り付けられる異方性導電膜５と重ならない領域まで延びるように、ソルダーレジスト６の形状を決定する。   Next, a solder resist 6 is formed surrounding the mounting region of the electronic component 3 so as to have an opening that exposes one end of the wiring pattern 2 that is electrically connected to the bump 4 of the electronic component 3. At this time, the shape of the solder resist 6 is determined so that a part 6a of the opening of the solder resist 6 extends to a region that does not overlap with the anisotropic conductive film 5 attached in a later step.

次に、電子部品３のバンプ４が形成された面が異方性導電膜５側となるように、所定の位置に電子部品３を配置するとともに、配置された電子部品３を加熱しながら圧着する。これにより、異方性導電膜５中の導電性粒子を介して電子部品３のバンプ４と配線パターン２とが電気的に接続され、電子部品実装モジュールが完成する。   Next, the electronic component 3 is disposed at a predetermined position so that the surface of the electronic component 3 on which the bumps 4 are formed is on the anisotropic conductive film 5 side, and the electronic component 3 is pressure-bonded while being heated. To do. As a result, the bumps 4 of the electronic component 3 and the wiring pattern 2 are electrically connected via the conductive particles in the anisotropic conductive film 5 to complete the electronic component mounting module.

このときに、異方性導電膜５より外側へ延びるソルダーレジスト６の開口部の一部６ａを介して、フレキシブル基板１と異方性導電膜５との間に閉じこめられた空気が外部へ効率よく除去される。したがって、製造される電子部品実装モジュールは、閉じこめられた空気に起因するボイドの発生や配線露出等の不都合を回避し、高い信頼性を示す。   At this time, the air trapped between the flexible substrate 1 and the anisotropic conductive film 5 is efficiently transmitted to the outside through a part 6a of the opening of the solder resist 6 extending outward from the anisotropic conductive film 5. Well removed. Therefore, the manufactured electronic component mounting module avoids inconveniences such as generation of voids and wiring exposure caused by the trapped air, and exhibits high reliability.

次に、本発明を適用した具体的な実施例について、実験結果に基づいて説明する。
＜実施例＞
実施例では、異方性導電膜として相対的に高粘度のもの（ＡＣＦ−１）、又は低粘度のもの（ＡＣＦ−２）を用いるとともに、ソルダーレジストを図１に示すような開口部の一部が延びた形状として、電子部品実装モジュールを作製した。 Next, specific examples to which the present invention is applied will be described based on experimental results.
<Example>
In the examples, a relatively high viscosity (ACF-1) or a low viscosity (ACF-2) is used as the anisotropic conductive film, and the solder resist has a single opening as shown in FIG. An electronic component mounting module was produced in a shape with an extended portion.

先ず、配線パターンが設けられたフレキシブル基板を用意し、ＩＣチップの実装領域を囲む開口部を有するように、ソルダーレジストを形成した。ソルダーレジストは、図１に示すように、対角２角において分断された形状とした。次に、ソルダーレジストの開口部を被覆するように異方性導電膜を貼り付けた。ここで用いた異方性導電膜は、ハーケ社製のレオメータＲＳ１５０で測定した溶融粘度（１００℃）が１．０×１０７ｍＰａ・ｓであるＡＣＦ−１を用いた。次に、異方性導電膜上の所定の位置にＩＣチップをアラインメントし、加熱及び加圧することによって、ＩＣチップをフレキシブル基板上に実装し、電子部品実装モジュールを得た。 First, a flexible substrate provided with a wiring pattern was prepared, and a solder resist was formed so as to have an opening surrounding the IC chip mounting region. As shown in FIG. 1, the solder resist was divided into two diagonal corners. Next, an anisotropic conductive film was attached so as to cover the opening of the solder resist. As the anisotropic conductive film used here, ACF-1 having a melt viscosity (100 ° C.) of 1.0 × 10 7 mPa · s measured with a rheometer RS150 manufactured by Harke was used. Next, the IC chip was aligned on a predetermined position on the anisotropic conductive film, and heated and pressed to mount the IC chip on the flexible substrate, thereby obtaining an electronic component mounting module.

また、異方性導電膜として、ハーケ社製のレオメータＲＳ１５０で測定した溶融粘度（１００℃）が、４．０×１０６ｍＰａ・ｓであるＡＣＦ−２を用いたこと以外は、上述と同様にして電子部品実装モジュールを作製した。 Moreover, as an anisotropic conductive film, it was the same as that of the above except having used ACF-2 whose melt viscosity (100 degreeC) measured with the rheometer RS150 made from Hake was 4.0 * 10 < 6 > mPa * s. Thus, an electronic component mounting module was produced.

＜比較例＞
比較例では、異方性導電膜として相対的に高粘度のもの（ＡＣＦ−１）、又は低粘度のもの（ＡＣＦ−２）を用いるとともに、ソルダーレジストを、図３に示すようなＩＣチップの実装領域を完全に取り囲む形状としたこと以外は、上述の実施例と同様にして電子部品実装モジュールを作製した。 <Comparative example>
In the comparative example, an anisotropic conductive film having a relatively high viscosity (ACF-1) or a low viscosity (ACF-2) is used, and a solder resist is used for an IC chip as shown in FIG. An electronic component mounting module was fabricated in the same manner as in the above example except that the mounting area was completely surrounded.

以上のように作製した電子部品実装モジュールについて、異方性導電膜が破裂して内部の配線パターンが露出した箇所を、顕微鏡を用いてカウントした。結果を表１に示す。   About the electronic component mounting module produced as mentioned above, the location where the anisotropic conductive film burst and the internal wiring pattern was exposed was counted using the microscope. The results are shown in Table 1.

Figure 2005086042
Figure 2005086042

表１のように、高粘度の異方性導電膜を用いた場合には、ソルダーレジストの開口部の一部を異方性導電膜と重ならない領域まで延在させることによって、配線パターンの露出を完全に防止することができた。また、低粘度の異方性導電膜を用いた場合も、配線パターンの露出を、比較例の２０箇所から、２箇所へと大幅に抑制することができた。以上の結果から、異方性導電膜の粘度にかかわらず、ソルダーレジストの形状を調整することによって、異方性導電膜とフレキシブル基板との間に閉じこめられた空気を効率よく除去できることが明らかとなった。   As shown in Table 1, when a highly viscous anisotropic conductive film is used, the wiring pattern is exposed by extending a part of the opening of the solder resist to a region not overlapping the anisotropic conductive film. Could be completely prevented. Moreover, also when the low-viscosity anisotropic conductive film was used, the exposure of the wiring pattern could be significantly suppressed from 20 places in the comparative example to 2 places. From the above results, it is clear that the air trapped between the anisotropic conductive film and the flexible substrate can be efficiently removed by adjusting the shape of the solder resist regardless of the viscosity of the anisotropic conductive film. became.

（ａ）は、本発明の電子部品実装モジュールの一例を示す概略平面図であり、（ｂ）は、図１（ａ）中のＡ−Ａ'線に沿った概略断面図である。(A) is a schematic plan view which shows an example of the electronic component mounting module of this invention, (b) is a schematic sectional drawing in alignment with the AA 'line in Fig.1 (a). 本発明の電子部品実装モジュールの他の例を示す概略平面図である。It is a schematic plan view which shows the other example of the electronic component mounting module of this invention. 従来の電子部品実装方法を示すものであり、（ａ）は異方性導電膜の貼り付け工程を示す断面図、（ｂ）は電子部品の実装工程を示す断面図、（ｃ）は電子部品実装モジュールの概略平面図である。1A and 1B show a conventional electronic component mounting method, in which FIG. 1A is a cross-sectional view showing a process for attaching an anisotropic conductive film, FIG. 1B is a cross-sectional view showing a process for mounting an electronic component, and FIG. It is a schematic plan view of a mounting module.

符号の説明Explanation of symbols

１ フレキシブル基板、２ 配線パターン、３ 電子部品、４ バンプ、５ 異方性導電膜、６ ソルダーレジスト 1 Flexible substrate, 2 Wiring pattern, 3 Electronic component, 4 Bump, 5 Anisotropic conductive film, 6 Solder resist

Claims (4)

プリント基板上に電子部品が実装された電子部品実装モジュールであって、
上記電子部品の端子に対応して、上記プリント基板上に複数設けられた配線パターンと、
上記電子部品が実装される領域に対応して開口部を有し、上記配線パターンの電子部品との接続部分が露出するように上記配線パターンを被覆するソルダーレジストと、
上記電子部品が実装される領域の上記プリント基板上に貼り付けられ、上記ソルダーレジストの内周縁部と重なるような外形寸法を有するとともに、上記電子部品が圧着されることにより上記電子部品と上記配線パターンとを電気的に接続する接着シートとを有し、
上記ソルダーレジストの開口部は、上記ソルダーレジストと上記接着シートとが重ならない領域まで延在される延在部を有することを特徴とする電子部品実装モジュール。 An electronic component mounting module in which electronic components are mounted on a printed circuit board,
Corresponding to the terminals of the electronic component, a plurality of wiring patterns provided on the printed circuit board,
A solder resist that has an opening corresponding to the area where the electronic component is mounted, and covers the wiring pattern so that the connection portion of the wiring pattern with the electronic component is exposed;
The electronic component is attached to the printed circuit board in a region where the electronic component is mounted and has an outer dimension that overlaps with the inner peripheral edge of the solder resist. An adhesive sheet for electrically connecting the pattern,
The opening part of the said soldering resist has an extension part extended to the area | region where the said soldering resist and the said adhesive sheet do not overlap, The electronic component mounting module characterized by the above-mentioned. 上記ソルダーレジストの開口部の延在部は、上記プリント基板の配線パターンが形成されていない領域に形成されていることを特徴とする請求項１記載の電子部品実装モジュール。   2. The electronic component mounting module according to claim 1, wherein the extended portion of the opening of the solder resist is formed in a region where the wiring pattern of the printed board is not formed. 上記接着シートが異方性導電膜であることを特徴とする請求項１または２記載の電子部品実装モジュール。   The electronic component mounting module according to claim 1, wherein the adhesive sheet is an anisotropic conductive film. 上記プリント基板がフレキシブル基板であることを特徴とする請求項１または２記載の電子部品実装モジュール。   The electronic component mounting module according to claim 1, wherein the printed circuit board is a flexible circuit board.
JP2003317460A 2003-09-09 2003-09-09 Electronic component mounting module Pending JP2005086042A (en)

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PCT/JP2004/006668 WO2005027603A1 (en) 2003-09-09 2004-05-12 Electronic component mounting module
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EP4036965A4 (en) * 2019-09-25 2023-11-01 Kyocera Corporation MOUNTING BASE FOR ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE
KR102761479B1 (en) * 2019-12-02 2025-02-04 엘지이노텍 주식회사 Fingerprint sensing module and ectronic device comprising the same

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