JP2004327381A - IC socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket capable of obtaining a reliable contact between an IC package and a contact during inspection of the IC package. <P>SOLUTION: The IC socket comprises at least a cover, a latch which rotates when the cover is pressed downward and a contact for mounting an IC package. The IC package is held by the latch and the contact. For rotating the latch by pressing-down operation of the cover, a guiding cam is provided on the cover, a pressure receiving part is formed on the latch, and a latch fixing mechanism for suppressing the rotation of the latch is provided. The latch fixing mechanism comprises a fixed step part formed on the cover, and an engaging step part formed on the latch. The guiding cam and the pressure receiving part are arranged with a space between them. The space is larger than the height of the fixing step part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an open-top type IC socket, and more particularly, to an IC socket having a fixing mechanism of a pressure receiving latch for pressurizing an IC package to contact a contact of the socket.
[0002]
[Prior art]
2. Description of the Related Art Sockets that use a pressure-receiving latch to press a carrier-type IC package represented by a PGA type, a gull wing type, a KGD type, or a BGA type to contact a socket contact have been widely known. .
[0003]
The structure of such a conventional socket will be briefly described with reference to FIG. FIG. 4A shows a socket-free state in which the IC package 111 is not mounted. In the figure, a socket 100 is roughly composed of a cover 101, a latch 103, a pressing body 107, a contact 108, and the like.
[0004]
The cover 101 has a function of rotating the latch 103 in the opening direction via a cam 102 formed on the cover 101 by a downward pressing drive, and simultaneously pressing down the contact 108 (see FIG. 4B). Have.
[0005]
The latch 103 is for pressing and fixing the IC package 111 in cooperation with the contact 108, and is rotatable around a shaft 105 provided on the socket body. 103 is constantly biased in the closing direction. The latch 103 further has a pressure receiving portion 104 for engaging with the cam 102 of the cover 101 and rotating the latch 103 in the opening direction when the cover 101 is pressed and driven.
[0006]
The contact 108 is for contacting a leadless terminal 112 (for example, a pad) of the IC package 111 and communicating with the inspection circuit via the terminal 110. When the IC package 111 is mounted, the contact 108 An elastic force is applied so as to urge the contact portion 109 of the IC package 111 that contacts the pad 112 upward. The pressing body 107 interlocks with the cover 101 and, when the cover 101 is pressed and driven, appropriately presses down the contact 108.
[0007]
In order to mount the IC package 111 on the socket 100, as shown in FIG. 4B, the cover 101 is pressed by a full stroke, the latch 103 is opened via the cam 102 and the pressure receiving portion 104, and at the same time, the pressing body 107 is pressed. The contact 108 is pushed down through the contact. That is, the socket is in the full stroke state.
[0008]
In the full stroke state of the socket, the IC package 111 is guided in the socket 100 and mounted on the contact 108 such that the pad 112 of the IC package 111 is positioned on the contact 108 (FIG. 4C). reference).
[0009]
Next, when the pressing of the cover 101 is released, the IC package 111 moves up together with the contact 108, and the upper side of the IC package 111 is regulated by the latch 103 which is closed at the same time. It is mounted in a stable contact state where a great pressure is applied (see FIG. 4D).
[0010]
After the inspection of the IC package 111 is completed, the IC package 111 is detached from the socket 100 by an operation reverse to the above operation.
[0011]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 7-240262
[Problems to be solved by the invention]
As described above, the socket 100 is attached to the inspection board (not shown) including the inspection circuit in the state of FIG. 4D, and the IC package is inspected. If any impact is received, a situation occurs in which the latch 103 rotates as shown in FIG.
[0013]
As a result, the position of the IC package 111 is loosened by the latch 103 or the latch 103 comes off, and the urging force of the contact 108 raises the IC package 111, causing the contact between the contact 108 and the pad 112 of the IC package 111. Becomes unstable and interferes with the inspection.
[0014]
The present invention relates to an IC package inspection socket in an IC package production line, and an object of the present invention is to provide an IC socket capable of obtaining reliable contact between an IC package and a contact during an IC package inspection.
[0015]
[Means for Solving the Problems]
An IC socket according to the present invention includes an IC socket having at least a cover, a latch that rotates by being pressed downwardly of the cover, and a contact on which an IC package is mounted, and the latch and the contact holding the IC package. And a latch fixing mechanism for suppressing rotation of the latch.
[0016]
In the IC socket of the present invention, a guide cam is formed on the cover and a pressure receiving portion is formed on the latch so that the latch is rotated by pressing the cover downward. Comprises a fixed step formed on the cover, and an engagement step formed on the latch. Further, the guide cam and the pressure receiving section have an interval, and the interval is at least the fixed step. It is characterized by being larger than the height of the part.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
1A and 1B show a socket of the present invention. (A) is a top view of the IC socket for inspection, (b) is a side view. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1A. The left side with respect to the center line shows a socket free state, and the left side shows a socket full stroke state.
[0018]
The IC socket 1 of the present invention includes a cover 10, a latch 20, a contact 30, a pressing body 19, a substrate 40, and the like.
[0019]
The cover 10 rotates the latch 20 in the opening direction through a guide cam 13 formed below the cam body 12 of the cover 10 by a downward pressing drive, and simultaneously pushes down the contact 30 (FIG. 2). (See socket full stroke state) The vertical movement of the cover 10 is achieved by the protrusions 14 provided on the cover 10 being guided vertically by the guide grooves 43 provided on the substrate 40. The pressing stroke S is regulated by the distance between the cover 10 and the substrate 40 (see FIG. 1B).
[0020]
The cover 10 is further provided on the upper side of the cam body 12 so as to suppress the rotation of the latch, that is, when the latch 20 is closed (ie, in a socket free state), the latch 20 is A fixed step portion 11 having a height t as a latch fixing mechanism having a predetermined shape is formed so as to be opened by the pressing drive of, but not easily opened by an impact or the like.
[0021]
The latch 20 is for pressing and fixing the IC package 50 (see FIG. 3) in cooperation with the contact 30, and is rotatable around a shaft 41 provided on the socket substrate 40. By means of 42, the latch 20 is constantly biased in the closing direction.
[0022]
As described above, the latch 20 is engaged with the guide cam 13 of the cover 10, and when the cover 10 is pressed downward, the pressure receiving portion 21 for rotating the latch 20 in the opening direction is provided. Having. An interval between an upper end of the pressure receiving portion 21 and a position where the upper end of the pressure receiving portion 21 of the guide cam 13 first contacts is formed to be at least greater than or equal to the height t of the fixed step portion 11 formed on the cover 10. Have been.
[0023]
The latch 20 further suppresses the rotation of the latch, that is, engages with the fixed step portion 11 of the cover 10, and the latch 20 is opened by pressing the cover 10. An engaging step 22 having a predetermined shape is formed so as not to be easily opened by the above method. The height of the engaging step 22 is substantially the same as the height t of the fixed step 11 of the cover 10.
[0024]
The contact 30 is for contacting a leadless terminal 51 (for example, a pad) of the IC package 50 and communicating with the inspection circuit via the terminal 51. When the IC package 50 is mounted, the IC is mounted. An elastic force is applied so as to urge the contact portion 31 of the package 50 that contacts the pad 51 upward.
[0025]
The contact 30 further has a terminal 32 that penetrates through the substrate 40 and is connected to the inspection circuit.
[0026]
When the cover 10 is pressed and driven in conjunction with the cover 10, the pressing body 19 appropriately presses down the contact 30.
[0027]
An operation diagram for mounting the IC package 50 in the socket 1 is shown in FIG. In the socket free state shown in FIG. 3A (that is, a state in which the IC package 50 is not mounted), the cover 10 is mechanically or manually pressed downward as shown by an arrow A.
[0028]
At this time, the interval between the upper end of the pressure receiving portion 21 and the position where the guide cam 13 first contacts the upper end of the pressure receiving portion 21 is at least equal to or greater than the height t of the fixed step portion 11 formed on the cover 10. Since the guide cam 13 and the pressure receiving portion 21 are engaged with each other, only the cover 10 is pushed down by the height t or more. That is, after the engagement between the engaging step 22 of the latch 20 and the fixed step 11 of the cover 10 is released, the engagement between the guide cam 13 and the pressure receiving section 21 starts, and the latch 20 rotates in the opening direction. Move.
[0029]
Further, when the cover 10 is pushed down to the full stroke S that can be pushed down (see FIG. 3B or the right half of FIG. 2), the IC package 50 can be inserted.
[0030]
In this state, the IC package 50 is guided on the inside of the IC socket 1 and mounted on the contact portion 31 of the contact 30 so that the pad 51 of the IC package 50 is positioned on the contact portion 31 of the contact 30 ( FIG. 3 (c)). Thereafter, the pressing of the cover 10 is released.
[0031]
At this time, the IC package 50 rises due to the restoring force of the contact 30, and at the same time, the rise is suppressed by the latch 20, which is closed, and the position of the upper side of the package 50 is regulated. At this time, since the operation of rotating the latch 20 in the closing direction is the reverse of the operation of rotating the latch 20 in the opening direction, the description is omitted here.
[0032]
As a result, the package 50 is held under pressure between the latch 20 and the contact portion 31 of the contact 30. Finally, the engaging step 22 of the latch 20 engages with the engaging cam 11 of the cover 10 to prevent the latch 20 from rotating, thereby ensuring the holding of the IC package 50.
[0033]
In the present embodiment, the latch fixing mechanism is formed integrally with the guide cam 13 on the cam body 12 of the cover 10, but the present invention is not necessarily limited to this configuration. For example, it may be configured as a cam body different from the cam body 12, may prevent the rotation of the latch 20 on the base body 40 side, or may provide a stopper or the like on the shaft 41 to indirectly The rotation of the latch 20 may be prevented.
[0034]
In the present embodiment, the leadless IC package has been described, but the present invention is also applicable to a lead type and a carrier type (for example, KGD, BGA).
[0035]
【The invention's effect】
With the IC socket of the present invention configured as described above, the IC package is securely held by the latch and the contact in the socket during the inspection of the IC package, so that the contact is also stable, Inconveniences such as leading an incorrect inspection result at the time can be prevented.
[Brief description of the drawings]
FIG. 1 is a schematic view of an IC socket of the present invention, in which (a) is a plan view and (b) is a side view.
FIG. 2 is a sectional view taken along line AA of FIG.
3A and 3B are diagrams showing an outline of mounting an IC package in an IC socket of the present invention, wherein FIG. 3A shows a socket free state, FIG. 3B shows a socket full stroke state, and FIG. FIG. 9D is a diagram illustrating a package inserted state, and FIG. 9D is a diagram illustrating an IC package fixed state.
4A and 4B are diagrams showing a conventional operation of mounting an IC socket and an IC package, wherein FIG. 4A shows a socket free state, FIG. 4B shows a socket full stroke state, and FIG. (D) is a diagram showing an IC package fixed state.
FIG. 5 is a diagram for explaining a problem in the conventional IC socket of FIG. 4;
[Explanation of symbols]
1, 100 IC socket 10, 101 Cover 11 Fixed step 12 Cam body 13, 102 Guide cam 14 Projection 19, 107 Pressed body 20, 103 Latch 21, 104 Pressure receiving section 22 Engaging step 30, 108 Contact 31, 109 Contact Part 32, 110 Terminal 40 Board 41, 105 Shaft 42, 106 Coil spring 43 Guide groove 50, 111 IC package 51, 112 Pad

Claims (4)

An IC socket having at least a cover, a latch on which an IC package is mounted and a latch that is rotated by a downward pressing drive, and holding the IC package with the latch and the contact.
An IC socket comprising a latch fixing mechanism for suppressing rotation of the latch. 2. The IC socket according to claim 1, wherein a guide cam is formed on the cover, and a pressure receiving portion is formed on the latch so that the latch is rotated by a downward driving of the cover. 3. The IC socket according to claim 2, wherein the latch fixing mechanism includes a fixing step formed on the cover and an engaging step formed on the latch. The IC socket according to claim 3, wherein the guide cam and the pressure receiving portion have an interval, and the interval is at least larger than a height of the fixed step portion.

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