JP2004268179A - Polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device for adjusting a pressing-down state of a polishing tape to a polishing object material. <P>SOLUTION: This polishing device polishes a plane part of the plate-like polishing object material W arranged on a polishing table 6 by the polishing tape T installed in a polishing device body. The polishing device body includes: a rotatably driving cylindrical rotary drum 3; a tape reel 41 wound with the polishing tape arranged together in the rotary drum; a winding reel 42 for winding the polishing tape delivered from the tape reel; and the polishing tape. The rotary drum has an outer peripheral surface having the shaft directional length not less than the length for crossing a surface of the polishing object material, has a filament part 100 composed of an elastic body on the outer peripheral surface, and has a slit 32 extending in the shaft direction. The polishing tape from the tape reel is extracted after passing through the slit, and is wound on the winding reel by passing through the slit again so as to cover a filament part surface. The polishing table includes a slide mechanism 7 for sliding the polishing table to the rotary drum. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
[Field of the Invention]
The present invention relates to a polishing apparatus for polishing a flat portion of a plate-like material to be polished placed on a polishing table with a polishing tape mounted on a polishing apparatus main body.
[0002]
[Prior art]
Today, a large number of silicon wafers for forming semiconductor chips, liquid crystal displays for use in word processors, personal computers, televisions, and the like, and a large number of printed boards for mounting electronic elements such as semiconductor chips are used.
[0003]
Silicon wafers need to be polished to mirror-finish the surface. For liquid crystal displays, the glass surface is polished to remove foreign substances adhering to the glass surface during the manufacturing process. In order to form wiring on the substrate, it is necessary to finish the front and back surfaces of the substrate.
[0004]
Conventionally, when polishing the surface of a plate-shaped member such as a silicon wafer, there is a method of polishing with a donut-shaped grindstone, or a method of polishing with an electrodeposition grindstone in which diamond grindstone particles are electrodeposited on a cylindrical surface.
[0005]
However, in the case of polishing with a donut-shaped grindstone, although the desired polishing precision is obtained, there is a problem that once the workpiece is ground, the precision and sharpness of the grindstone decrease. In order to maintain the accuracy of the whetstone, it is necessary to perform processing (dressing) to periodically scrape the whetstone surface and expose a new surface, and this dressing generates dust on the whetstone and deteriorates the working environment. Causes the problem of causing
[0006]
In addition, when polishing using an electrodeposited grindstone, the electrodeposited grindstone has the advantage of extremely high polishing accuracy because diamond grindstone grains are electrodeposited on the surface of a stainless steel cylindrical body. However, there is also a problem in that the accuracy and working ability of the grindstone are reduced due to the removal of abrasive grains on the surface during the polishing process.
[0007]
Furthermore, since the electrodeposited grindstone cannot be dressed like a donut-shaped grindstone, in order to maintain the polishing accuracy of the electrodeposited grindstone, the grindstone is once peeled off from the cylindrical body and a new grindstone is added. Has to be re-electrodeposited, resulting in a very high running cost.
[0008]
Therefore, a polishing apparatus using a long polishing tape has been proposed in order to prevent the working environment from deteriorating due to the generation of dust on the grindstone and increasing the running cost (for example, Patent Document 1).
[0009]
[Patent Document 1]
Japanese Patent Application Laid-Open No. H11-19859
The polishing apparatus using a polishing tape has a polishing head body rotatably supported by a tape reel on which the polishing tape is wound and a take-up reel for winding the polishing tape drawn from the tape reel. The main body is provided with a pressing portion on which the polishing tape is hung from the tape reel to the take-up reel, and presses the pressing portion on which the polishing tape is hung on the material to be polished set on the polishing table. Thus, the material to be polished is polished.
[0011]
A polishing apparatus A using such a conventional polishing tape is shown in FIGS. 10 and 11, and a polishing head main body C on which a polishing tape B is mounted, and a support member D for supporting the polishing head main body C. And a polishing table (not shown) which is provided below the polishing head body C and on which a material to be polished is mounted.
[0012]
The conventional polishing apparatus A rotates the polishing head body C with respect to the support member D about a line perpendicular to the surface of the polishing table while rotating the polishing tape B attached to the polishing head body C on the polishing table. It is configured to be polished by being brought into contact with the surface of the material to be polished placed in the polisher.
[0013]
Further, the polishing head main body C is configured to polish the material to be polished while running the polishing tape B with a plurality of running rollers E. The polishing head B has a tape on which the polishing tape B is wound. A reel F and a take-up reel G for winding up the polishing tape B drawn from the tape reel F are provided. The polishing tape B is drawn out from the tape reel F at a predetermined traveling speed and provided at the lower end of the polishing head main body C. After passing through the pressing roller E1, it is wound on a take-up reel G.
[0014]
In the polishing apparatus A using this polishing tape, the polishing tape B is kept in contact with the material to be polished placed on the polishing table by the pressing roller E1 (pressing portion), and the polishing tape B is moved while the polishing tape B is running. By rotating the head body C, the surface of the material to be polished is automatically polished.
[0015]
By the way, since the polishing apparatus A shown in FIGS. 10 and 11 is configured to perform polishing while winding the polishing tape from the tape reel to the take-up reel, it is possible to perform polishing while always supplying a new polishing tape surface. It has the advantage of being able to be polished under the same conditions at all times, and eliminates the need for complicated work such as dressing and re-electrodeposition on the surface of the grindstone as with a grindstone or an electrodeposited grindstone. There is also an advantage that the state can be maintained.
[0016]
[Problems to be solved by the invention]
On the other hand, in the polishing with the polishing tape, the polishing is performed while pressing the polishing tape against the material to be polished by the pressing roller E1, which is a pressing portion, and the polishing is performed while rotating the polishing head body C. For this reason, a special pressing roller E1 having a narrow center is used so that wrinkling or twisting does not occur in the polishing tape applied to the pressing roller E1.
[0017]
For this reason, there are portions where the entire polishing tape does not contact the workpiece and does not substantially contribute to polishing.
[0018]
In addition, since the polishing head body C itself is polished while rotating about an axis perpendicular to the mounting surface of the polishing table, the tape width of the polishing tape must be reduced in order to reduce the load on the polishing tape due to the rotation. There is a limit. Therefore, the polishing area that can be polished during one rotation of the polishing tape is small, and a polishing target having a larger area than the polishing area during one rotation of the polishing tape may cause uneven polishing during polishing.
[0019]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing apparatus for constantly and uniformly polishing a material to be polished with a new polishing tape without performing complicated processing of the abrasive such as dressing of a grindstone.
[0020]
Another object of the present invention is to provide a polishing apparatus in which the entire polishing tape contributes to polishing.
[0021]
Still another object of the present invention is to provide a polishing apparatus which does not limit the width of the polishing tape.
[0022]
Still another object of the present invention is to provide a polishing apparatus capable of polishing a workpiece having a large polishing area.
[0023]
Still another object of the present invention is to provide a polishing apparatus capable of adjusting a pressing state of a polishing tape against a material to be polished.
[0024]
[Means for Solving the Problems]
A polishing apparatus according to the present invention for achieving the above object is an apparatus for polishing a flat portion of a plate-like material to be polished installed on a polishing table with a polishing tape mounted on a polishing apparatus main body. The polishing apparatus body has an axially extending slit, a cylindrical rotary drum driven to rotate, a tape reel wound with a polishing tape disposed in the rotary drum, and a polishing tape unreeled from the tape reel. And a polishing tape. The rotating drum has an outer peripheral surface having an axial length that is equal to or greater than the length traversing the surface of the material to be polished, and further comprises an elastic body extending on the outer peripheral surface from one end of the drum to the other end. It has at least one striated portion.
[0025]
Here, the polishing tape fed from the tape reel is pulled out of the rotary drum through the slit, wound around the rotary drum one round so as to cover the striated portion along the outer peripheral surface, and then slit again. Through the rotating drum and wound on a take-up reel.
[0026]
The polishing table includes a slide mechanism that slides the polishing table relative to the rotary drum in a direction transverse to the axial direction of the rotary drum. When the polishing table slides by the slide mechanism, the polishing table has a flat surface portion of the workpiece held by the polishing table. The material to be polished is polished by contact with the polishing tape wound on the outer peripheral surface of the rotating drum.
[0027]
The striated portion may extend in the axial direction or may extend so as to wind around the outer peripheral surface of the rotating drum.
[0028]
The striated portion may be made to protrude in the radial direction by means of a telescopic means provided on the drum. The striated portion may be supported by elastic means instead of the elastic means.
[0029]
Further, the upper surface of the striated portion may be flat or uneven.
[0030]
The striated portion may be a striated projection formed on a planar elastic body and attached to the outer peripheral surface of the drum.
[0031]
Another polishing apparatus of the present invention is also a polishing apparatus for polishing a flat portion of a plate-like material to be polished placed on a polishing table with a polishing tape mounted on the main body of the polishing apparatus. In contrast to the above, at least one set of a cylindrical rotary drum having an axially extending slit and driven to rotate, a tape reel and a tape wound with an abrasive tape and arranged in the rotary drum as a set A rotary drum having an outer peripheral surface having an axial length greater than or equal to a length traversing the surface of the material to be polished, including a take-up reel for winding the polishing tape unwound from the reel; A line portion formed of an elastic body and extending in the axial direction between a pair of slits on the outer peripheral surface. The polishing tape unwound from the tape reel is pulled out of the rotating drum through one of the paired slits on both sides of the striated portion, and the other of the paired slits is covered so as to cover the striated portion. , Is inserted into a rotating drum, and is taken up on a take-up reel.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
The polishing apparatus of the present invention has common parts with the polishing apparatus jointly filed by the present applicant on September 10, 2001 (Japanese Patent Application No. 2001-273500), and the common parts will be described in the same manner.
[0033]
FIGS. 1 and 2 show the overall configuration of a polishing apparatus according to the present invention. The polishing apparatus includes a flat lower support plate 11, four support frames 12 attached to upper four corners of the lower support plate 11, and an upper support plate 13 supported at the upper positions of the four support frames 12. Having a supporting member 1.
[0034]
On an upper surface of an upper support plate 13 of the support member 1, a polishing apparatus main body 2 having a rotary drum 3 on which a polishing tape T can be mounted and a polishing table 6 are installed. Is provided with a drum rotation motor 5 for rotating the rotation drum 3.
[0035]
As shown in FIG. 3, the polishing apparatus main body 2 includes a cylindrical rotary drum 3, a polishing tape T wound around the polishing tape T disposed in the rotary drum 3, and a polishing tape T unwound from the tape reel 41. , A reel rotation motor 43 for rotating the take-up reel 42, and a long polishing tape T.
[0036]
As shown in FIG. 4, the tape reel 41 and the take-up reel 42 are provided inside the rotary drum 3 such that the shaft 41 a of the tape reel 41 and the shaft 42 a of the take-up reel 42 are parallel to the rotation axis a of the rotary drum 3. It is rotatably supported by the support walls 31 and 31.
[0037]
Further, the axial length of the outer peripheral surface is formed so as to be equal to or greater than the length traversing the surface of the workpiece W and equal to or greater than the tape width of the polishing tape T.
[0038]
As shown in FIG. 1, the polishing tape T has a length traversing the surface of the workpiece W, for example, a diameter for a silicon wafer and a tape width (L) longer than one side for a printed circuit board. Use things.
[0039]
As shown in FIGS. 3, 5 to 7, an axially extending slit 32 through which the polishing tape T can be inserted is formed on the outer peripheral surface of the rotary drum 3, and the axial length of the slit 32 is The polishing tape T is formed to be longer than the tape width.
[0040]
Further, as shown in FIGS. 1 to 3, a linear portion 100 made of an elastic body extending in the axial direction is provided on the outer peripheral surface of the rotary drum 3. In the figure, the striated portions are exaggerated to illustrate. The thickness of the striated portion is about 1 mm to 10 mm (for a diameter of the rotating drum of about 20 cm), and the width is about 10% or less of the circumference of the drum. The material is not particularly limited, but preferably has a Shore A hardness of 40 or more (preferably 60 or more). In the illustrated example, the striated portion is formed by sticking a rod-shaped elastic body on the outer peripheral surface of the rotating drum 3.
[0041]
In the present embodiment, the polishing tape T fed out from the tape reel 41 is pulled out through the slit 32 of the rotary drum 3, and wound while being wound along the outer peripheral surface of the rotary drum 3 and covering the linear portion 100. After making one round, it is wound around the take-up reel 42 again through the slit 32. The polishing tape T wound on the outer peripheral surface of the rotary drum 3 is always in close contact with the outer peripheral surface by the tension of the tape reel 41 and the take-up reel 42 so as not to be loosened.
[0042]
Further, the polishing apparatus main body 2 is provided with bearings 44, 44 for rotatably supporting the rotating drum 3 via rotating shafts 33, 33 provided on both ends in the axial direction of the rotating drum 3. A first pulley 45 is provided at the shaft end of one of the rotation shafts 33 (the left side in FIGS. 1 and 2) so as to be connected to be exposed from the bearing 44.
[0043]
A first endless belt 52 is stretched over the first pulley 45 and a second pulley 51 provided at the drive shaft end of the drum rotation motor 5 provided on the lower support plate 11, and The rotary drum 3 is rotated by the rotation drive of the rotation motor 5 via the second pulley 51, the first endless belt 52, and the first pulley 45.
[0044]
A reel rotation motor 43 for running the polishing tape T is provided in the rotary drum 3, but is provided at an axial end of the rotary drum 3 so as not to hinder the rotation of the rotary drum 3. A rotary shaft 33 (right side in FIG. 4) provided is formed in a cylindrical shape, and a lead wire (not shown) for driving a reel rotation motor 43 is inserted into the cylindrical portion of the rotary shaft 33 to rotate the rotary drum. 3 outside.
[0045]
As shown in FIGS. 1 and 2, the polishing table 6 has a moving table 62 having a mounting surface 61 for mounting a workpiece W such as a silicon wafer, and a lower surface of the moving table 62. A slide mechanism 7 for sliding the table 62 with respect to the rotating drum 3 in a direction orthogonal to the axial direction of the rotating drum 3.
[0046]
Although not shown, an adhesive sheet for preventing a positional deviation of the workpiece W is fixed to the installation surface 61. The contact sheet uses a resin coating on the surface to increase frictional resistance.
[0047]
The slide mechanism 7 provided on the polishing table 6 includes two moving rail members 71 fixed to the upper supporting plate 13 and a supporting plate 72 fixed to the lower end of a supporting rod 63 fixed to the lower surface of the moving table 62. A fitting member 73 fixed to the lower surface and slidably fitted to the moving rail member 71, a ball screw 74 having a screw shaft 74a extending in parallel with the moving rail member 71, and rotating the screw shaft 74a. And a screw drive motor 75 for driving the ball screw.
[0048]
The ball screw 74 has a nut portion 74b fitted to the screw shaft 74a, and the nut portion 74b is fixed to a support plate.
[0049]
A first slide pulley 76 is attached to one end of the screw shaft 74a, and a second slide pulley 77 is attached to the shaft end of the ball screw drive motor 75. These first slide pulley 76 A second endless belt 78 is stretched over the second slide pulley 77.
[0050]
Then, the screw shaft 74a of the ball screw 74 is rotated by the rotation drive of the ball screw drive motor 75, and the nut portion 74b is moved in the axial direction by this rotation, so that the support plate 72 to which the nut portion 74b is fixed is moved to the rail member for movement. It is configured to slide in the axial direction of the screw shaft 74a along 71.
[0051]
In the space formed between the lower surface of the moving table 62 and the support plate 72 depending on the length of the support bar 63, the moving table 62 is moved in a direction parallel to the rotation axis of the rotary drum 3 with respect to the supporting plate 72. Is provided with a position adjusting mechanism 64 for moving the lens.
[0052]
The position adjusting mechanism 64 is for adjusting the position of the workpiece W installed on the movable table 62 with respect to the outer peripheral surface of the rotating drum 3.
[0053]
In the present embodiment, the polishing tape T wound on the outer peripheral surface of the rotary drum 3 of the polishing apparatus main body 2 is brought into contact with the surface of the workpiece W set on the setting surface 61 of the polishing table 6. Thus, the height of the installation surface 61 of the polishing table 6 and the height of the lower part of the outer peripheral surface of the rotary drum 3 are set, and the polishing table 6 is slid while rotating the rotary drum 3 to remove the workpiece W. It is designed to be polished.
[0054]
Specifically, the polishing or cleaning of the material to be polished by the polishing apparatus of the present embodiment is performed as follows as shown in FIGS.
[0055]
5 to 7, for simplicity of description, the polishing table 6 is a simplified one in which the fitting member 73 is directly fixed to the lower surface of the moving table 62, unlike the polishing table shown in FIGS. Is shown.
[0056]
First, as shown in FIG. 5, the moving table 62 of the polishing table 6 is slid to a position where the installation surface 61 completely appears before the rotating drum 3, and a flat workpiece such as a silicon wafer is polished. 6 is arranged on the installation surface 61, and the rotating drum 3 is driven to rotate.
[0057]
Then, while rotating the rotating drum 3 in order from the state of FIG. 5 to the state of FIG. 6 and then to the state of FIG. 7, the moving table 62 is slid so as to pass below the rotating drum 3.
[0058]
Here, the portion of the polishing tape T on the striated portion 10 is more prominent than other portions, and thus becomes a portion that contributes to substantial polishing. In the present embodiment, since one linear portion 100 is used, each time the rotary drum is rotated once, the portion of the polishing tape T on the linear portion 100 substantially becomes the material W to be polished. And is polished.
[0059]
Since the striated portion 100 is made of an elastic material, it is compressed during polishing (that is, when the rotating drum rotates and the striated portion 100 comes to the polished material W side), and the polishing tape T is repelled by the repulsive force. Is pressed against the workpiece W, and effective polishing is achieved.
[0060]
Further, since the axial length of the outer peripheral surface of the rotary drum 3 that supports the polishing tape T is equal to or greater than the length that traverses the workpiece W, the tape width of the polishing tape T also traverses the workpiece W. It can be longer than the length. As a result, the sliding movement of the movable table 62 in one direction causes the surface of the workpiece W on the movable table 62 to continuously extend from the front end to the rear end in the direction of advance to the rotary drum 3, and the entire surface of the workpiece W is polished. Can be polished at once, and uniform polishing can be performed.
[0061]
Here, the moving direction of the moving table 32 only needs to be able to perform a relative movement with respect to the rotating drum 3, and therefore does not have to be orthogonal to the axial direction of the rotating drum 3.
[0062]
Further, simultaneously with the rotation of the rotary drum 3, the reel rotation motor 43 is driven to rotate the take-up reel 42. The rotation of the take-up reel 42 draws a new polishing tape T from the tape reel 41. Then, while passing over the linear portion 100 and running along the outer peripheral surface of the rotary drum 3, the unused polishing tape T is wound up on the take-up reel 42, and the unused polishing tape T is removed from the tape reel 41. Drawn to. In this manner, the polishing or cleaning of the workpiece W is completed by the constantly supplied new polishing tape T, so that polishing unevenness can be further reduced.
[0063]
In the above-described embodiment, one linear portion extends in the axial direction. However, as shown in FIG. 8A, even if it extends so as to wind around the outer peripheral surface of the rotating drum, The number of lines is not limited to one, and several lines may be provided if necessary. Further, as shown in FIG. Therefore, it may extend along the outer peripheral surface of the rotating drum. Such a non-axially extending linear portion always allows the polishing tape to be pressed against the material to be polished at any portion of the linear portion, thereby enabling a smooth polishing operation.
[0064]
In the embodiment shown in FIG. 8, the linear portions are directly adhered to the outer peripheral surface of the rotating drum. However, for example, when there are two or more linear portions, or when the shape of the linear portions is special, the rotary portion is rotated. A plate-like elastic body having substantially the same area as the outer peripheral surface of the drum and having linear projections on its surface may be attached to the entire outer peripheral surface of the rotating drum. A slit needs to be formed at a position corresponding to the slit where the tape enters and exits.)
[0065]
FIG. 8C is a partially enlarged cross-sectional view of the rotary drum in which an air cylinder for extending the linear portion 100 in the radial direction of the rotary drum and allowing the linear portion to be pulled back is incorporated. The striated portion 100c is not directly attached to the outer peripheral surface of the rotating drum, but is attached to a base plate 101 having substantially the same shape as the striated portion 100, and extends through the hole 3 'provided in the rotating drum 3 to the base plate 101. The rod 103 of the air cylinder 102 is attached. By the activation of the air cylinder 102, the rod 103 expands and contracts, so that the linear portion 100c can press the polishing tape against the material to be polished at a required pressure. For example, when a polishing force is required, the rod 103 is extended to extend the linear portion 100c, and conversely, for polishing such as mirror polishing, the rod 103 is contracted so that the outer peripheral surface of the rotary drum can be removed. The linear portion 103c is further drawn in so as to reduce the step.
[0066]
In the example shown in FIG. 8C, an air cylinder is used, but a spring or a cam mechanism can also be used.
[0067]
FIG. 9 shows an enlarged partial cross-sectional view of a main body of a polishing apparatus according to another embodiment. In the polishing apparatus main body 2 'of this embodiment, the polishing tape does not cover the entire outer peripheral surface of the rotating drum, but only covers the linear portion.
[0068]
In the rotary drum 3 'shown in FIG. 9, a tape reel 41 on which an abrasive tape is wound, a take-up reel 42 for winding the abrasive tape, and a mechanism for rotating the rotary drum are the same as the rotary drum shown in FIGS. The same is true, and these mechanisms are omitted for simplicity.
[0069]
As in the case of the rotary drum 3 shown in FIG. 3, a linear portion 100 extending in the axial direction is provided on the outer peripheral surface. A pair of slits 110a and 110b extending in the axial direction through which the polishing tape T can be inserted are formed along both sides of the linear portion 100. The length of the slits in the axial direction is determined by the tape width of the polishing tape T. Longer than.
[0070]
In the rotating drum 3 ', the polishing tape T from the tape reel 41 provided in the same manner as the tape reel of FIG. 3 is pulled out through one slit 110a via the roller 111a, and passes over the linear portion 100. It is inserted into the rotating drum 3 'so as to cover it and passes through the other slit 110b, and is further wound on a tape reel 41 provided in the same manner as the winding reel in FIG.
[0071]
FIG. 9 shows an example in which a single linear portion is used, on which a polishing tape from a tape reel passes and is wound up by a take-up reel. It is also possible to provide a linear portion, and provide a tape reel and a take-up reel together with a pair of slits on both sides of each linear portion. By providing a plurality of linear portions in this way, different polishing tapes (polishing tapes of different numbers) can be provided for each linear portion. Also, the striated portion can have elasticity corresponding to the purpose of polishing and the polishing tape.
[0072]
【The invention's effect】
In the polishing apparatus according to the present invention, the polishing tape wound on the rotating drum has a width not less than the length traversing the plane of the material to be polished, and comes into contact with the material to be polished while rotating with the rotation of the rotating drum. Furthermore, since the grinding table slides relative to the rotating drum because it travels on the rotating drum, the working environment does not deteriorate as in the case of conventional grinding wheels, and processing like an electrodeposited grinding wheel is performed. The entire surface of the material to be polished can be efficiently polished while preventing a decrease in performance and an increase in running cost.
[0073]
Furthermore, during polishing, since a linear portion made of an elastic body is interposed between the polishing tape and the rotating drum, the polishing tape and the material to be polished are in elastic contact with each other, and the polishing is performed according to the elasticity of the elastic body. Condition can be adjusted.
[0074]
Furthermore, by using a plurality of striated portions and arranging the polishing tape so as to cover each striated portion, polishing tapes having different characteristics can be used, and various types of polishing can be performed.
[0075]
Further, since the axial length of the rotary drum of the present apparatus corresponds to the polishing tape, the rotary drum does not limit the width of the polishing tape.
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic overall configuration of a polishing apparatus according to the present invention.
FIG. 2 is a top view showing a schematic overall configuration of the polishing apparatus shown in FIG. 1;
FIG. 3 is an enlarged vertical sectional view of a rotating drum portion according to the embodiment of the present invention.
FIG. 4 is a sectional view taken along line AA of FIG. 3;
FIG. 5 is an explanatory diagram showing operations of a rotary drum and a polishing table.
FIG. 6 is an explanatory diagram showing the operation of a rotating drum and a polishing table.
FIG. 7 is an explanatory diagram showing the operation of a rotating drum and a polishing table.
FIG. 8 (a) is a plan view of a rotary drum provided on an outer peripheral surface with a plurality of linear portions being non-axial,
FIG. 8B is a plan view of a rotary drum provided with one V-shaped axis on the outer peripheral surface,
FIG. 8C is a partially enlarged cross-sectional view of a rotary drum in which the striated portion can be freely extended by an air cylinder provided therein.
FIG. 9 is an enlarged partial cross-sectional view of a polishing apparatus main body according to another embodiment.
FIG. 10 is a schematic sectional view of a conventional polishing apparatus.
11 is a cross-sectional view of the conventional polishing apparatus of FIG. 10 as viewed from a side.
[Explanation of symbols]
T Polishing tape W Material to be polished 2 Polishing device main body 3 Rotary drum 32 Slit 41 Tape reel 42 Take-up reel 6 Polishing table 7 Slide mechanism 100 Linear part

Claims (8)

A polishing apparatus for polishing a flat portion of a plate-like material to be polished set on a polishing table with a polishing tape mounted on a polishing apparatus main body,
The polishing apparatus main body has a slit that extends in the axial direction, a cylindrical rotary drum that is driven to rotate, a tape reel around which a polishing tape is wound, and a polishing reel that is unwound from the tape reel. Including a take-up reel for winding the tape and a polishing tape,
The rotary drum has an outer peripheral surface having an axial length greater than or equal to the length traversing the surface of the workpiece, and further includes an elastic body extending from one end of the drum to the other end on the outer peripheral surface. Has at least one striated part,
The polishing tape unwound from the tape reel is drawn out of the rotary drum through the slit, and is wound around the rotary drum one round so as to cover the linear portion along the outer peripheral surface of the rotary drum. After that, it is inserted again into the rotating drum through the slit, and is taken up by the take-up reel,
The polishing table includes a slide mechanism that slides the polishing table relative to the rotating drum in a direction transverse to the axial direction of the rotating drum,
When the polishing table is slid by the slide mechanism, the polishing material is polished by contact between the flat portion of the polishing material held on the polishing table and the polishing tape wound on the outer peripheral surface of the rotary drum. Done,
A polishing apparatus characterized in that: The polishing apparatus according to claim 1, wherein the linear portion extends along an axial direction. The polishing apparatus according to claim 1, wherein the striated portion is provided so as to wind around the outer peripheral surface. A polishing apparatus for polishing a flat portion of a plate-like material to be polished set on a polishing table with a polishing tape mounted on a polishing apparatus main body,
The polishing apparatus main body has at least one set of axially extending slits, a cylindrical rotary drum that is driven to rotate, and a tape on which a polishing tape is wound, which is arranged in the rotary drum as a set. A reel and a take-up reel for winding the polishing tape fed from the tape reel; and a polishing tape,
The rotary drum has an outer peripheral surface having an axial length greater than or equal to the length traversing the surface of the workpiece, and further extends axially between the set of slits on the outer peripheral surface. It has a linear part made of an elastic body,
The polishing tape unwound from the tape reel passes through one of the paired slits on both sides of the striated portion, is pulled out from the rotating drum, and covers the striated portion. It is inserted into the rotating drum through the other of the paired slits and wound on the take-up reel,
The polishing table includes a slide mechanism that slides the polishing table relative to the rotating drum in a direction transverse to the axial direction of the rotating drum,
When the polishing table is slid by the slide mechanism, the flat material of the workpiece held by the polishing table and the rotating polishing tape wound on the outer peripheral surface of the rotary drum come into contact with each other, whereby the workpiece is polished. ,
A polishing apparatus characterized in that: The polishing apparatus according to claim 1, wherein the striated portion can be extended in a radial direction by an expansion / contraction means provided on the drum. The polishing apparatus according to claim 1, wherein the linear portion is supported by elastic means provided on the drum. The polishing apparatus according to claim 1, wherein an upper surface of the linear portion has a flat shape or an uneven shape. 5. The polishing layer according to claim 1, wherein the striated portion is a striated projection formed on a planar elastic body and adhered to the outer peripheral surface of the drum. 6.

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