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JP2004207369A - 表面実装型白色ｌｅｄ - Google Patents

表面実装型白色ｌｅｄ Download PDF

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Publication number
JP2004207369A
JP2004207369A JP2002372471A JP2002372471A JP2004207369A JP 2004207369 A JP2004207369 A JP 2004207369A JP 2002372471 A JP2002372471 A JP 2002372471A JP 2002372471 A JP2002372471 A JP 2002372471A JP 2004207369 A JP2004207369 A JP 2004207369A
Authority
JP
Japan
Prior art keywords
chip
blue led
adhesive layer
light
chip substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002372471A
Other languages
English (en)
Japanese (ja)
Inventor
Maki Kuriyama
真樹 栗山
Hiroyuki Takayama
弘幸 高山
Naohito Hamada
直仁 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2002372471A priority Critical patent/JP2004207369A/ja
Priority to CNA2003101207364A priority patent/CN1510766A/zh
Publication of JP2004207369A publication Critical patent/JP2004207369A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Led Device Packages (AREA)
JP2002372471A 2002-12-24 2002-12-24 表面実装型白色ｌｅｄ Pending JP2004207369A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002372471A JP2004207369A (ja) 2002-12-24 2002-12-24 表面実装型白色ｌｅｄ
CNA2003101207364A CN1510766A (zh) 2002-12-24 2003-12-03 表面安装型白色发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002372471A JP2004207369A (ja) 2002-12-24 2002-12-24 表面実装型白色ｌｅｄ

Publications (1)

Publication Number Publication Date
JP2004207369A true JP2004207369A (ja) 2004-07-22

Family

ID=32811067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002372471A Pending JP2004207369A (ja) 2002-12-24 2002-12-24 表面実装型白色ｌｅｄ

Country Status (2)

Country Link
JP (1) JP2004207369A (zh)
CN (1) CN1510766A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339651A (ja) * 2005-06-01 2006-12-14 Samsung Electro-Mechanics Co Ltd 側面発光型ｌｅｄパッケージおよびその製造方法
JP2008544537A (ja) * 2005-06-24 2008-12-04 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び発光素子パッケージの製造方法
JP2013179148A (ja) * 2012-02-28 2013-09-09 Unistar Opto Corp 発光ダイオードエリアライトモジュールおよびそのパッケージ方法
US9232573B2 (en) 2013-10-25 2016-01-05 Citizen Electronics Co., Ltd. Lighting device and method of manufacturing the same
US10043954B2 (en) 2013-11-08 2018-08-07 Citizen Electronics Co., Ltd. Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4922555B2 (ja) 2004-09-24 2012-04-25 スタンレー電気株式会社 Ｌｅｄ装置
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
CN102020851B (zh) 2009-09-16 2013-10-16 大连路明发光科技股份有限公司 一种光转换柔性高分子材料及其用途
WO2011143792A1 (zh) 2010-05-20 2011-11-24 大连路明发光科技股份有限公司 可剥离型光转换发光膜
CN101866998B (zh) * 2010-05-31 2011-09-14 冯子良 大功率led透镜装配机
JP5899508B2 (ja) * 2011-04-28 2016-04-06 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
CN102856475A (zh) * 2012-09-05 2013-01-02 苏州金科信汇光电科技有限公司 全角度发光led芯片封装结构
CN104300075B (zh) * 2013-07-18 2017-03-22 深圳市斯迈得半导体有限公司 一种白光led光源器件及制作方法
CN104091875A (zh) * 2014-07-04 2014-10-08 厦门市三安光电科技有限公司 一种led封装结构
CN106025038A (zh) * 2016-06-02 2016-10-12 深圳朝伟达科技有限公司 一种led封装基板的制备方法
CN110571160A (zh) * 2018-07-20 2019-12-13 安徽博辰电力科技有限公司 一种半导体封装芯片粘结工艺

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339651A (ja) * 2005-06-01 2006-12-14 Samsung Electro-Mechanics Co Ltd 側面発光型ｌｅｄパッケージおよびその製造方法
JP2008544537A (ja) * 2005-06-24 2008-12-04 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び発光素子パッケージの製造方法
US8178894B2 (en) 2005-06-24 2012-05-15 Lg Innotek Co., Ltd. Light emitting device package and method of fabricating the same
US8395178B2 (en) 2005-06-24 2013-03-12 Lg Innotek Co., Ltd. Light emitting device package and method of fabricating the same
US9564567B2 (en) 2005-06-24 2017-02-07 Lg Innotek Co., Ltd. Light emitting device package and method of fabricating the same
JP2013179148A (ja) * 2012-02-28 2013-09-09 Unistar Opto Corp 発光ダイオードエリアライトモジュールおよびそのパッケージ方法
US9232573B2 (en) 2013-10-25 2016-01-05 Citizen Electronics Co., Ltd. Lighting device and method of manufacturing the same
US10043954B2 (en) 2013-11-08 2018-08-07 Citizen Electronics Co., Ltd. Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer

Also Published As

Publication number Publication date
CN1510766A (zh) 2004-07-07

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