JP2004186584A - Electronic component cutting method and cutting device - Google Patents

Abstract

Provided is a method of cutting an electronic component and a cutting device therefor, which enable cutting without requiring a cleaning liquid.
A first cutting apparatus (17, 18) for cutting a resin-sealed wiring board (3) conveyed from a conveying section (11) and positioned and fixed is provided in a processing section (12). 18 is provided with an air supply device 31 for injecting compressed air through the injection port body 30 through the injection port body 30, and the cutting section of the first cutting apparatus 17, 18 is provided with a dry ice powder body 30 b through the injection port body 30. And a cutting device provided with a dry ice supply device 32 for spraying the electronic component 1, wherein the plate-shaped wiring board 3 is cut without using a cleaning liquid, and the cut electronic component 1 is cleaned by a cleaning device 40. , In the product storage box 45.
[Selection] Fig. 10

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for cutting an electronic component such as an IC package and a cutting device therefor. More particularly, the present invention relates to a method and an apparatus for cutting an electronic component for cutting a wiring board such as an IC package molded with resin for each electronic component as a product.
[0002]
[Prior art]
2. Description of the Related Art As semiconductors become more highly integrated, a semiconductor device is manufactured by cutting a wiring board package, such as a BGA (ball grid array), on which a semiconductor such as an IC chip is mounted and molded with a resin protection, that is, sealing of a resin. Various methods for individually cutting out the stopped IC packages have been proposed.
[0003]
As an example of a method of separating a chip region on which a semiconductor element is formed, a method of cutting by a diamond saw or the like using a diamond blade is one of the examples. Before dicing the semiconductor substrate, a treatment such as coating the back surface of the semiconductor substrate with a polyamide resin and adhering to a dicing tape may be performed.
[0004]
Further, as a separation method, it is also known to change the direction of a table on which a semiconductor substrate is mounted, thereby cutting substrates in different directions with a grindstone rotating at high speed. In such a cutting process, a plurality of parts are multi-rowed in advance before cutting and taped, and after cutting, a cleaning liquid is used to remove chips from the product. It is the current situation.
[0005]
[Problems to be solved by the invention]
However, the conventional manufacturing method has individual problems such as environmental aspects and cutting efficiency, and has not always improved efficiency. In other words, regarding the point of tape application, in addition to requiring tape application before cutting, when cutting in the state of tape application, the grindstone during cutting becomes clogged, making it impossible to work or making the product defective. There was a problem. For this reason, the cutting efficiency is poor and a processing time is required.
[0006]
In addition, since washing after cutting was done with washing water, heavy metals may be dissolved.Therefore, due to environmental issues, special treatment of drainage was carried out to clear washing water, resulting in a special burden and high cost. Had become. In particular, a large amount of water is generally used for washing after cutting the IC package, and if it is allowed to flow into a drainage channel as it is, there is a possibility that heavy metals such as copper may cause pollution. Also, the use of water for cleaning has a risk that water may penetrate into a peeled portion or a fine crack portion of the laminated portion, corrode the laminated portion, or leak, resulting in a defective product.
[0007]
In many cases, the cutting itself is done by using the same grindstone to index the table on which the wiring board etc. are placed and changing the direction, and again cutting in the different direction with the same grindstone. In comparison, the cutting time is longer. In addition, in the case of mass production, the process is performed by constructing a line and performing the assembly work.However, since the line is generally fixed as a dedicated line, it lacks flexibility and requires high cost for equipment. The space for it was also large.
[0008]
In particular, when there is a change in a different wiring board or the like, expensive jigs and tools have to be changed, the skill of machining is required, and time for replacement is required. When the completed product is collected and stored, the case has been stored again with the solder ball portion facing downward after reversing the state after cutting. For this reason, storage took time. As described above, the conventional method of cutting a wiring board such as an IC package by mainly using a cleaning liquid has been a problem since it is associated with environmental pollution. For this reason, there has been a demand for a cutting method that enhances cutting efficiency and does not cause environmental pollution.
[0009]
The present invention has been made under the above-mentioned technical background and social background, and achieves the following objects.
An object of the present invention is to use an air jet that sublimates with compressed air to increase the cooling effect so that a wiring board can be cut. An object of the present invention is to provide a cutting method and a cutting device.
Another object of the present invention is to provide an electronic component cutting method and an apparatus for cutting electronic components, in which a sublimating injection member is jetted onto a cutting grindstone to prevent clogging of the cutting grindstone, thereby increasing the production efficiency of electronic components. .
Still another object of the present invention is to provide an electronic component cutting method and a cutting device for easily removing dust adhering by jetting a sublimating jet to a cutting section.
Still another object of the present invention is to provide a method for cutting an electronic component and a cutting device therefor, which reduce the total cost related to cutting by not using water.
Still another object of the present invention is to provide a cutting method of an electronic component in which the quality of the electronic component is improved by collecting dust in a cutting step and cleaning the electronic component to protect the electronic component during cutting. It is in providing the cutting device.
[0010]
[Means for Solving the Problems]
The present invention employs the following means to achieve the above object.
The cutting method of the electronic component of the present invention, a resin-sealed plate-shaped electronic component is conveyed, a positioning and fixing step of positioning and fixing, and a cutting step of cutting the electronic component with a cutting tool in the positioning and fixing step, The method includes a compressed air blowing step of blowing compressed air to a cutting portion while cutting the electronic component, and a coolant spraying step of spraying sublimating coolant to the cut electronic component.
[0011]
In the method for cutting an electronic component according to the present invention, the coolant may be a dry ice powder. Liquid carbon dioxide, which is a source of dry ice, is a low-pressure refrigerant and is easily available. Further, it is preferable that the compressed air blowing step applies ultrasonic vibration to the compressed air. Further, the coolant spraying step is more effective when the coolant is vibrated and sprayed with ultrasonic waves. By applying the ultrasonic vibration, the attached dust can be easily removed.
[0012]
Further, the compressed air blowing step and the coolant spraying step may be used simultaneously. This combination can effectively spray the coolant to the cutting section with the force of air, enhance the cooling effect, harden the cutting section by cooling, improve cutting efficiency by brittle fracture, and cut by cutting It is possible to smoothly remove swarf that has been generated.
[0013]
An electronic component cutting device according to the present invention includes a positioning and fixing device that positions and fixes a plate-shaped electronic component that is conveyed by a carrier and sealed with a resin, and for cutting the electronic component that is positioned and fixed by the positioning and fixing device. And a compressed air supply device provided near the cutting device and having a compressed air injection port for blowing compressed air at a cutting portion of the electronic component, and provided near the cutting device. And a coolant supply device having a coolant ejection port for injecting a coolant sublimated to the cut portion of the electronic component.
[0014]
In the electronic component cutting device of the present invention, it is preferable that the coolant supply device is a device that supplies liquid carbon dioxide gas to the coolant ejection port to eject a dry ice powder body. Liquid carbon dioxide, which is a source of dry ice, is a low-pressure refrigerant and is easily available. Furthermore, the compressed air injection port and the coolant injection port are preferably integrated parts. This combination can effectively spray the coolant to the cutting section with the force of air, enhance the cooling effect, harden the cutting section by cooling, improve cutting efficiency by brittle fracture, and cut by cutting It is possible to smoothly remove swarf that has been generated.
[0015]
Further, an ultrasonic generator is provided in a path supplied from the compressed air supply device to the compressed air ejection port body and / or in a path supplied from the coolant supply apparatus to the coolant ejection port body. Is good. By applying the ultrasonic vibration, the attached dust can be easily removed.
[0016]
Further, it is preferable that the cutting section of the cutting apparatus is provided with a dust collecting device for collecting dust generated during cutting. Further, it is preferable to provide a cleaning device for cleaning the cut electronic component. Further, it is preferable to provide a storage device for storing the cut electronic component. Further, it is preferable that the coolant ejection port or the compressed air ejection port is provided in a cleaning section of the cleaning device.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an example of an electronic component 1 to be cut by the apparatus of the present invention, which is a product to be commercialized by final cutting. FIG. 2 is an overall shape diagram showing a plate-shaped wiring board 3 of the electronic component before being cut. FIG. 3 is an enlarged cross-sectional view of the portion of FIG. 2, and FIG. 4 is an enlarged cross-sectional view of the portion of FIG. The details will be described below.
[0018]
An electronic component 1 shown in FIG. 1 is a component cut by the apparatus of the present invention, and is generally called an IC package and is an electronic component in which an IC chip 2 is incorporated. The wiring board 3 is a wiring board such as a plate-shaped printed board before the electronic component 1 is cut. The wiring board 3 is an assembly in which a plurality of IC chips 2 are arranged as one of electronic-related components, and the whole is protected by a protective mold 8 made of synthetic resin. Thus, the wiring board 3 forms an assembly of IC packages.
[0019]
In recent years, in the IC package, the degree of integration of elements has been increased, and accordingly, the increase in the capacity of the IC package has been accelerated. However, the outer shape has become smaller, and the technology of the IC package itself has been greatly developed. As an example, there is a BGA (ball grid array) applied to a mobile phone or the like. The BGA is made smaller by reducing the pitch of the electrodes, and has leads arranged in an area array on the lower surface of the IC package.
[0020]
The present invention is applicable to the above-mentioned BGA, and relates to a technique of cutting this IC package from a plate-shaped wiring board 3 and cutting it as a single product, that is, an electronic component 1. Next, this IC package will be described. The wiring board 3 is formed by laminating and laminating a plurality of thin films 6 of a thermosetting resin such as an epoxy resin. A metal lead wire 10 of copper or the like is wired between the thin films 6 so as not to cross, and a connection is made so as to sew between the upper and lower films 6, 6a, 6b. A plurality of IC chips 2 are adhered on the film 6 in a multi-row pattern in a grid pattern.
[0021]
Terminals of solder balls 7 connected to the IC chip 2 are provided on the lower surface of the IC package on which the IC chip 2 is mounted. This solder ball 7 is effective in facilitating mounting. Further, the upper surface of the IC chip 2 is covered with a protection mold 8 including a bonding wire 9 for protecting the IC chip 2. This protective mold 8 is made of a thin thermosetting synthetic resin. The bonding wire 9 is a connection from the IC chip 2.
[0022]
The wiring board 3 is an assembly of this IC package. The space between the IC chips 2 of the IC package is in the form of a concave or covered with a protective mold 8 and is flush with each other. It is similar and is a single plate. The cutting portion is a concave portion between the IC chips 2, and cutting position marks 4, 5 for recognizing the cutting position by an optical recognition device are engraved or printed on the wiring board 3. Next, the cutting device of the present invention will be described in detail.
[0023]
(Overall configuration of cutting device S)
FIG. 5 is an external view showing the entire configuration of the cutting apparatus S of the present invention. The cutting device S includes a transport unit 11 that transports the wiring board 3, a fixing device that recognizes a cutting position of the wiring board 3 to be cut, positions and fixes the wiring board 3, and a cutting device that cuts the wiring board 3. A dust collecting device that collects dust generated by cutting, a cleaning device for a product (electronic component 1) that is a cut IC package, and a cooling device that cools and cleans a processing and cutting portion that is a main part of the present invention. And a storage unit 13 for storing the electronic component 1 after cutting.
[0024]
In FIG. 5, the wiring board 3 is transported from the left side facing the cutting device S via the transport unit 11. The central part in FIG. 5 is a processing part 12, which has two first cutting processing devices 17, a second cutting processing device 18 and related devices. In addition, each of the attached devices involved in the cutting process includes, as devices related to the first cutting device 17, a CCD camera 15 which is a recognition device, a mounting table 19 on which the wiring board 3 is mounted, and a pressing member. 20, a first cutting device 17, a dust collecting device 23, a rotating brush 41, and the like. FIG. 5 shows a second cutting device 18 and a CCD camera 16 attached to the second cutting device 18.
[0025]
Since the first cutting device 17 has two dedicated processing portions in the present embodiment, each of the attached devices described above is attached to each cutting device. Further, a control device 14 for controlling the operation of each device is provided above the processing unit 12. A storage unit 13 is arranged on the right side as viewed in FIG. 5, and includes a product unloading device, a product storage box, and the like. Further, the processing unit 12 described above is provided with a dust collector for collecting dust after cutting, which will be described later, a cooling device for cooling and cleaning the cutting unit, a cleaning device, and the like.
[0026]
Further, the overall configuration will be briefly described. A transfer device is provided in the transfer unit 11 disposed on the left side in FIG. 5, and the transfer unit 11 holds the wiring board 3 and is transferred to the processing unit 12. A CCD camera 15 as a recognition device is provided near the transport end to recognize the cutting position mark 4 imprinted on the wiring board 3. A first cutting device 17 is disposed at a position on the left side of the processing portion 12, and the first cutting device 17 is a device that cuts only one direction of the wiring board 3. The cut wiring board 3 is shifted after being cut into strip-shaped wiring boards 3, and is conveyed to the second cutting device 18 by the conveying device. At this time, the CCD camera 16 as the second recognition device recognizes the second cutting position mark 5.
[0027]
The second cutting device 18 is installed adjacent to the first cutting device 17 while being turned 90 degrees with respect to the first cutting device 17. The wiring board 3 is transferred from the first cutting device 17 to the second cutting device 18 two by two by the transfer device as it is. As described above, the cutting position mark 5 is recognized on the wiring board 3 by the CCD camera 16 as described above, and the wiring board 3 is positioned and fixed based on the position where the cutting position mark 5 is recognized.
[0028]
After the wiring board 3 is positioned and fixed, the wiring board 3 is positioned at a position changed by 90 degrees with respect to the first cutting direction, and then cut by the second cutting device 18. An injection port body 30, which will be described later, is provided at a cutting portion of each of the first and second cutting devices 17, 18, and performs cooling and cleaning.
[0029]
The wiring board 3 cut by the second cutting device 18 serves as a prototype of the electronic component 1. The wiring board 3 conveyed after being cut from the second cutting device 18 enters a cleaning step and is brushed by the rotating brush 41. When the brushing is completed in the cleaning process, the wiring board 3 is inverted as a product of the electronic component 1 and is stored in the product storage box 45. In the present invention, a series of operations are systematically fully automated and integrated as described above, and the respective devices are integrated into a cutting device S. Although the overall configuration is as described above, individual devices will be further described.
[0030]
(Conveying unit 11 of cutting device S)
The wiring board 3 conveyed from outside the cutting device S via the conveyance unit 11 is positioned at a predetermined position with the solder ball surface facing upward by a loader unit of the conveyance device, and is conveyed. The transport unit 11 also serves as a storage, and stores a plurality of wiring boards 3. The wiring boards 3 are conveyed one by one to the cutting device 17 by the loader unit one by one.
[0031]
(Processing unit 12 of cutting device S)
The processing unit 12 includes a pressing member 20 as a positioning and fixing device for the conveyed wiring board 3, a CCD camera 15 as a recognition device for positioning, a first cutting and processing device 17 for the fixed wiring board 3, and A second cutting device 18, a transfer device for transferring the wiring board 3 from the first cutting device 17 to the second cutting device 18, a positioning fixing device (not shown) for positioning and fixing the transferred wiring board 3, positioning The CCD camera 16 for fixing, the first cutting device 17, and the dust collecting device 23 that collects dust generated by the second cutting device 18, and the wiring board 3 cut by the second cutting device 18 are cleaned. Cleaning device 40 and the like.
[0032]
FIG. 6 is a three-dimensional view showing the pressing member 20 which is a positioning and fixing device corresponding to the first cutting device 17. The conveyed wiring board 3 is mounted on the mounting table 19. The mounting table 19 has a vertically long shape, and a cut groove 19a is provided at a central portion and penetrates vertically. The cut groove 19a is a groove for allowing the rotary cutting tool 27 to pass during cutting. A dust collecting port 22 for collecting dust generated at the time of cutting is connected below the cut groove 19a. The dust from the dust collecting port 22 is guided to a dust collecting device 23.
[0033]
Therefore, at the time of cutting, dust-like chips generated at the lower portion of the mounting table 19 are sucked and collected by the dust collecting device 23 through the dust collecting port 22. A plurality of small holes 19b are provided around the cut groove 19a of the mounting table 19 along the groove. This is for sucking and holding the wiring board 3 on the mounting table 19, and the wiring board 3 is sucked on the mounting table 19 by the suction force of the dust collecting device 23 through the small holes 19 b. At this time, since the dust generated due to the cutting is simultaneously sucked, the suction force to the mounting table 19 is not so strong and is used supplementarily.
[0034]
In order to provide a function of stably fixing, a dedicated suction and fixing device independent of the dust collecting device 23 may be provided to perform suction. This method of holding with suction force is not necessary if the wiring board 3 is relatively large and heavy. However, if the wiring board 3 is small and light, the necessity arises. The wiring board 3 passes below the recognition device, that is, the CCD camera 15 before being mounted on the mounting table 19.
[0035]
The CCD camera 15 recognizes the position of the solder ball 7 on the wiring board 3 by graphic or recognizes the cutting position mark 4 provided on the wiring board 3 in advance, and specifies the position. Since the positional relationship between the CCD camera 15 and the mounting table 19 is determined, when the wiring board 3 is mounted on the mounting table 19, accurate positioning with the rotary cutting tool 27 is performed by arithmetic processing. Next, the correctly placed wiring board 3 is fixed by the pressing member 20 waiting above the wiring board 3.
[0036]
The pressing member 20 has a configuration similar to the mounting table 19, and sandwiches the wiring board 3 with the mounting table 19. That is, the pressing member 20 is lowered toward the wiring board 3 placed on the mounting table 19 and sandwiches the wiring board 3. Like the mounting table 19, the pressing member 20 also has a cut groove 21 so that the rotary cutting tool 27 can pass therethrough. Although not shown in the drawing, a protrusion made of a resilient synthetic resin, rubber, or the like is provided at a lower portion of the pressing member 20 for preventing electricity from being supplied or charged. The projections prevent the wiring board 3 from being distorted when being fixed, and prevent dust-like chips from scattering around.
[0037]
After the wiring board 3 is clamped and fixed by the mounting table 19 and the pressing member 20 as described above, the wiring board 3 is cut by the first cutting device 17. The first cutting device 17 will be described with reference to FIG. A base 24 of the first cutting device 17 is fixed to an end portion of a transfer device (not shown), and an upper portion of the base 24 forms a guide, and a saddle 25 of the first cutting device 17 can move forward and backward. You will be guided across.
[0038]
The head 26 is fixed to the guide. There is a movement axis other than the saddle for the movement of the head 26, and the head 26 moves in two axial directions. However, if the wiring board 3 side is configured to move, the head 26 may be moved only in one axial direction. The wiring boards 3 are conveyed line by line. The cutting position mark 4 is recognized by the CCD camera 15 as a recognition device, and the position of the wiring board 3 is specified. After the wiring board 3 is fixed on the mounting table 19, the wiring board 3 is moved by the head 26. Disconnect. Further, although not shown, a driving device for guiding these is a servomotor or the like, and the driving mechanism is performed via a ball screw (not shown).
[0039]
FIG. 8 is a configuration diagram of the head 26 when the rotary cutting tool 27 is disassembled, and FIG. 9 is a configuration diagram of the head 26 to which the rotary cutting tool 27 is attached. The configuration of the head 26 will be described with reference to FIG. A rotary cutting tool 27 is rotatably attached to the head 26. This rotary cutting tool 27 is usually a disk-shaped thin diamond grindstone, and is supported by a spindle 26a. The spindle 26a is supported by the head 26 and rotates at high speed. The outer shape of the head 26 is square in this embodiment. Unlike the example shown in FIG. 8, the thickness of the diamond grindstone is thin, so that only the cutting edges involved in actual cutting are projected from the holder.
[0040]
Vent holes 26b penetrating the four corners of the head 26 are provided (see FIG. 8). Through this ventilation hole 26b, dust generated by cutting is sucked to the rear of the head 26. The sucked dust is collected by the dust collecting device 23 via the dust collecting hose 23b. Although the outer shape of the head 26 is square, if the head 26 is cylindrical, a pipe corresponding to the ventilation hole 26b may be used. When this pipe is used, a rectangular partition cover may be provided at the front of the head 26 to support it. In this way, the same effect as in the case where the head 26 is square can be obtained. However, the square shape allows easy cooling, and other devices can be attached to the head 26.
[0041]
On the other hand, the rotary cutting tool 27 is bolted to a spindle 26a by a bolt 29 via a flange 28. Further, the head 26 is provided with a tool cover 27a so as to cover a cutting range around the rotary cutting tool 27. The dust sealed by the tool cover 27a is collected by the dust collecting device 23 through the ventilation hole 26b.
[0042]
Further, by placing the wiring board 3 below the rotary cutting tool 27 and rotating the wiring board 3 so that the rotation direction is downward, the chips are guided to the lower side, and the cutting chips are not used upward. Ingenuity is also made. The processing unit 12 is provided with a second cutting device 18 for changing the direction of the wiring board 3 and cutting again. However, since the configuration is substantially the same and has the same function, the following description will refer to the first cutting process. The device 17 is centered.
[0043]
FIG. 10 shows the injection port body 30 which is a part of the cooling device in a state where the dry ice powder 30b (sublimating coolant) is sprayed on the cut portion of the first cutting device 17. The three orifices 30 are provided, and a dry ice powder 30b is injected from each of the orifices 30a toward the rotary cutting tool 27 of the first cutting device 17 which is cutting the wiring board 3. The three injection ports 30a are arranged on the front and back of the rotary cutting tool 27 so that the dry ice powder 30b can be uniformly injected. Although not shown, a dust collecting device (not shown) is provided below the cutting portion, and sucks and collects dust including powder-like cuttings generated along with the cutting and dry ice powder.
[0044]
The dry ice powder 30b is injected together with the compressed air. This injection device includes a compressed air supply device 31 (cooling device) and a coolant supply device, that is, a dry ice supply device, as shown in FIGS. And a device (cooling device) 32. FIG. 11 shows the tanks of the compressed air supply device 31 and the dry ice supply device 32, that is, the compressed air tank 31a and the compressed and stored liquid carbon dioxide gas tank 32a. A flow controller 34 with a check valve is provided, and a gauge 35 and a flow controller 36 with a check valve are also provided at the supply port of the dry ice supply device 32.
[0045]
FIG. 12 shows a configuration of a supply system for supplying compressed air and liquid carbon dioxide as a source of dry ice to a cutting section by a device containing the compressed air tanks 31a and 32a. The compressed air from the compressed air supply device 31 is guided to the injection port body 30 via the flow rate controller 37. An ultrasonic generator 38 is provided in this supply path, and ultrasonic vibration is applied to the compressed air by passing compressed air through the ultrasonic generator 38. This ultrasonic vibration is not always necessary, but it is effective if attached. Further, in the present embodiment, the ultrasonic device is provided in the supply path of the compressed air, but the same effect can be obtained by providing the ultrasonic apparatus in the supply path of the liquid carbon dioxide gas.
[0046]
Liquid carbon dioxide, which is a source of dry ice powder, is also guided from the dry ice supply device 32 to the injection orifice 30 via the flow rate controller 39. The liquid carbon dioxide gas guided to the injection port body 30 sublimates when it is jetted and released from the injection port 30a. At this time, the dry ice powder 30b is instantaneously discharged to the cutting part by the injection of compressed air. It becomes a mist and is injected from the injection port 30a. This jet cools and cleans the cut section. The size of the injection port 30a is obtained by changing the hole area according to cutting conditions such as a cutting target.
[0047]
In order to obtain the optimum injection force that meets the cutting conditions, the injection pressure and the like are selected, and the flow controller and the like are adjusted. These adjustments are performed by the operation panel of the control device 14. Although details are not shown, conditions are displayed on a liquid crystal display screen, and necessary setting conditions are input to perform setting work. When the powdered dry ice is opened to the outside and injected into the cut portion, it sublimates and removes the surrounding heat, thereby providing a cooling effect for the cut portion. At this time, since the ultrasonic vibration is given to the compressed air, the wiring board 3 which is the cut part which is jetted is given the ultrasonic vibration, and it is possible to remove the firmly attached dust which is difficult to remove by ordinary cleaning. it can.
[0048]
Further, high-temperature cutting heat generated at the time of cutting is deprived, and the sublimation heat of the dry ice powder leads to cooling, and fine dry ice is jetted to the cutting portion to forcibly remove attached dust and the like. This has the effect of dry honing (also called dry shot), as seen in the example of removing and cleaning by spraying fine mineral powder. In addition, it is possible to prevent the grindstone from being clogged by spraying the grindstone as the rotary cutting tool 27 for cutting. This is because even if the grinding stone is clogged during cutting, the clogging is instantaneously removed by the shot effect.
[0049]
The three injection ports 30a described above are arranged so as to inject not only the cutting portion of the cutting portion but also the grindstone to be cut. By applying the present invention in this manner, it is possible to perform cooling cleaning without the need for water-cooling cleaning, etc., and also to improve the degree of cutting of the grinding wheel with the effect of preventing clogging and extend the life of the grinding wheel. It became a thing. Since no harmful substances were generated other than the chips, as a result, the operation rate of the cutting device was improved, and the productivity of electronic components was improved. Next, it is necessary to remove fine burrs and the like generated at the cut portion after cutting, and the device must be removed. The apparatus will be described below.
[0050]
FIG. 13 shows the cleaning device 40. The cleaning device 40 includes a rotating brush 41, a dust collection hose 42, a scrubber 43, and a cover 44. The rotating brush 41 is an arrangement of fine brushes in a cylindrical shape, and the object is the wiring board 3. Therefore, the rotating brush 41 is made of a soft material. Burrs are removed. The scrubber 43 has a comb shape and contacts the rotating brush 41 via a ground wire to remove the charging of the rotating brush 41.
[0051]
A cover 44 is provided so as to cover the rotating brush 41 and the scrubber 43, and a dust collection hose 42 is attached to one end of the cover 44. The dust collection hose 42 collects dust after brushing into a dust collector. It is for. A jet body 30 is attached to this cleaning device. Although the injection port body 30 is not always necessary, the same effect as described above can be obtained if the injection port body 30 is installed to more reliably wash the brushed electronic components. Further, although not shown, it is more effective to apply ultrasonic vibration.
[0052]
(Product storage box 45 of cutting device S)
The product storage box 45 is a device for storing the cleaned electronic component 1 as a product. Although not shown, the electronic component 1 held by the holding member is opened, and is stored in the product storage box 45 in an organized state by the storage transport device. Although this storage mode is not shown, it is performed in a three-dimensional operation by a robot of the storage and transport device. A plurality of product storage boxes 45 are prepared, and when one product storage box 45 has been stored, the product storage box 45 is carried out to the outside, the next product storage box 45 is continuously arranged at a predetermined position, and the same operation is continued.
[0053]
The present invention is configured as described above. Next, the operation will be described. The wiring board 3 conveyed with the solder ball surface facing upward is positioned on the mounting table 19 by recognizing the cutting position mark 4 by the CCD camera 15. Subsequently, the pressing member 20 waiting at the top is lowered to fix the wiring board 3. This fixation is provided by a projection at the lower part of the pressing member 20.
[0054]
After being fixed, the first cutting device 17 cuts the wiring board 3 with the rotary cutting tool 27 after passing through the mounting table 19 and the cut groove 20a of the pressing member 20, and cuts out the elongated strip-shaped wiring board 3. At this time, the sublimated dry ice powder 30b is ejected from the ejection port body 30 provided in the cutting section, and the cutting section and the rotary cutting tool 27 are cooled. At the same time, dust such as cutting chips is sucked by the dust collecting device 23 to collect the dust. The cut-out wiring board 3 is positioned on the mounting table of the second cutting apparatus by the CCD camera 16 by recognizing the cutting position mark 5 without changing its direction.
[0055]
Subsequently, as in the case of the first cutting device 17, the pressing member 20 is lowered to fix the wiring board 3. After the fixing, the plate is cut by the second cutting device 17, and the plate-shaped wiring board 3 becomes an electronic component. This cutting is performed simultaneously by sending two rows simultaneously. The finally cut wiring board 3 is pinched by a bar-shaped pinching member as the electronic component 1 and passed through a cleaning device. In this transport process, the electronic component 1 is turned upside down. The cleaned electronic component 1 with the solder ball face down is stored as a product in a product storage box 45 by a robot.
[0056]
If the thickness of the grindstone of the rotary cutting tool 27 in the cutting device is large, heat is likely to be generated with cutting, and if the grindstone is thin, the strength is limited and cracks easily occur. The selection of this thickness is optimized according to the conditions of the wiring board to be cut. The coolant injection conditions are set by the operation panel as described above.
[0057]
【The invention's effect】
The method for cutting an electronic component and the cutting device of the present invention do not use a method using water such as cooling water, washing water, or the like in the cutting section of the cutting device, but use a subliming coolant, for example, a powder of dry ice. The circuit board was cut. For this reason, it is possible to prevent the adhesion of metals that are easily melted even at low temperatures such as aluminum and copper, and to provide a large cooling effect and dry cleaning, so that the risk of pollution caused by cleaning water and the like has been eliminated. . In addition, since the clogging of the cutting whetstone was prevented, the life of the whetstone was extended and the productivity of electronic components was improved.
[0058]
Further, the attached dust can be easily removed by spraying a fine powder of dry ice to produce a shot effect. Further, since no washing water is used, no apparatus for treating washing water is required, so that the total cost associated with cutting is reduced. As a result, a stable cutting operation can be performed for a long time, and a product of constant quality can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a product cut by a cutting device of the present invention.
FIG. 2 is an overall view of a wiring board to be cut by the cutting device of the present invention.
FIG. 3 is a sectional view showing a partially enlarged view of FIG. 2;
FIG. 4 is a sectional view showing a partially enlarged view of FIG. 3;
FIG. 5 is an external view showing the entire cutting device of the present invention.
FIG. 6 is an external view illustrating a configuration of a fixing device.
FIG. 7 is an external view of a head showing a moving configuration.
FIG. 8 is an external view of a head with a cover attached, showing a state in which the rotary cutting tool is disassembled.
FIG. 9 is an external view of a head showing a state where a rotary cutting tool is assembled.
FIG. 10 is a plan view in which a cooling device is provided in a cutting section.
FIG. 11 is a side view showing a compressed air tank of the air supply device and a liquid carbon dioxide gas tank of the dry ice supply device.
FIG. 12 is an explanatory diagram showing a system configuration for injecting a coolant.
FIG. 13 is an external view showing a cleaning device.
[Explanation of symbols]
1. Electronic components
2. IC chip
3. Wiring board
4, 5 ... cutting position mark
7 ... Solder ball
8 ... Protective mold
11: transport unit
12 Processing part
13 ... storage section
14 ... Control device
15, 16 ... CCD camera
17, 18 ... cutting device
19 ... Placement table
20 ... pressing member
23 ... Dust collector
27 ... Rotary cutting tool
30 ... Injector body
31 ... Compressed air supply device
32 ... Dry ice supply device
38 ... Ultrasonic generator
40 ... Cleaning device
45… Product storage box

Claims (13)

A positioning and fixing step of conveying and positioning and fixing the resin-sealed plate-shaped electronic component,
A cutting step of cutting the electronic component with a cutting tool in the positioning and fixing step,
A compressed air blowing step of blowing compressed air to the cutting portion while cutting the electronic component,
A coolant injection step of injecting a sublimating coolant to the electronic component being cut. The method for cutting an electronic component according to claim 1,
The method for cutting an electronic component, wherein the coolant is a powder of dry ice. The method for cutting an electronic component according to claim 1 or 2,
The method of cutting an electronic component, wherein the compressed air blowing step applies ultrasonic vibration to the compressed air. The method for cutting an electronic component according to claim 1 or 2,
The method of cutting an electronic component according to claim 1, wherein the coolant is injected by applying ultrasonic vibration to the coolant. The method for cutting an electronic component according to claim 1 or 2,
The method of cutting an electronic component, wherein the compressed air blowing step and the coolant injection step are performed simultaneously. A positioning and fixing device that positions and fixes a plate-shaped electronic component that is conveyed by a carrier and sealed with resin,
A cutting device for cutting the electronic component positioned and fixed by the positioning and fixing device,
A compressed air supply device provided in the vicinity of the cutting device and having a compressed air injection port for blowing compressed air at a cutting portion of the electronic component;
A coolant supply device provided near the cutting device and having a coolant injection port for injecting a sublimating coolant to a cut portion of the electronic component. The cutting device for an electronic component according to claim 6,
The said coolant supply apparatus is an apparatus which supplies a liquid carbon dioxide gas to the said coolant injection opening body, and is a device which ejects a dry ice powder body, The cutting device of the electronic component characterized by the above-mentioned. The cutting device for an electronic component according to claim 6 or 7,
The cutting device for an electronic component, wherein the compressed air injection port body and the coolant injection port body are integrated parts. The cutting device for an electronic component according to claim 6 or 7,
An ultrasonic generator is provided in a path supplied from the compressed air supply device to the compressed air ejection port body and / or in a path supplied from the coolant supply apparatus to the coolant ejection port body. An electronic component cutting device characterized by the above-mentioned. The cutting device for an electronic component according to claim 6 or 7,
A cutting device for an electronic component, wherein a dust collecting device for collecting dust generated during cutting is provided in a cutting section of the cutting device. The cutting device for an electronic component according to claim 6 or 7,
A cutting device for an electronic component, further comprising a cleaning device for cleaning the cut electronic component. The cutting device for an electronic component according to claim 6 or 7,
An electronic component cutting device, further comprising a storage device for storing the cut electronic component. The cutting device for an electronic component according to claim 11,
The cutting device for an electronic component, wherein the coolant ejection port or the compressed air ejection port is provided in a cleaning unit of the cleaning device.

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