JP2004179460A - Vacuum injection molding device and vacuum injection molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide vacuum injection molding device capable of enhancing productivity by enhancing the gap filling performance of liquid resin for collectively sealing the chip areas of a work mounting a semiconductor chip on a substrate. <P>SOLUTION: While scanning a movable table 10 mounting a work 4 in a vacuum chamber 8 in the X-Y direction, the chip areas are coated with liquid resin 13 ejected from a dispenser 11. Subsequently, vacuum of the vacuum chamber 8 is broken and the work 4 is taken outdoors and carried into a press 18 where the work is hot pressed and shaped flat while accelerating curing of the liquid resin 13. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
FIELD OF THE INVENTION
The present invention relates to a vacuum discharge molding apparatus and a vacuum discharge molding method for shaping a liquid resin discharged to a work housed in a vacuum chamber by heating and pressurizing the resin in a vacuum-ruptured state.
[0002]
[Prior art]
2. Description of the Related Art In recent years, semiconductor devices have been reduced in size and thickness, and the package portion to be sealed with resin has also been reduced in thickness. As a work to be sealed with a resin, a flip chip type in which a semiconductor chip is flip-chip connected to a circuit board, a wire bonding type in which a semiconductor chip is wire-bonded to a circuit board, and the like are used. In many cases, these semiconductor chips are arranged on a substrate in a matrix and are collectively sealed with resin. In addition, a potting device or a printing device is used as the sealing resin, and when the work is a flip-chip type, underfill molding is performed in which a liquid resin is discharged onto a substrate and is filled in a gap between the substrate and the chip. Overmolding is performed over the surface. When the work is a wire bonding type, overmolding is performed to cover the chip surface. Then, the package portion that is collectively sealed is cut into individual semiconductor devices by a dicing device or the like to be singulated.
[0003]
As a method of efficiently underfill molding a flip-chip type package, after discharging a liquid resin around a chip-substrate gap around a chip that is flip-chip connected to a substrate, degassing of the liquid resin under reduced pressure A method has been proposed in which the gap is evacuated to a vacuum state, the pressure is released, and the pressure is returned to the atmospheric pressure. And Patent Document 1).
[0004]
In addition, as a manufacturing method of mass-producing electronic components of a wire bonding mounting type or a flip chip mounting type at low cost, a liquid resin is applied by stencil printing so as to collectively cover semiconductor chips mounted in a matrix on a substrate, After defoaming in a vacuum atmosphere and semi-curing under the first curing condition (curing temperature: 80 ° C., curing time: 30 to 120 minutes), the resin surface is flattened by pressing the resin surface with a flat plate. Next, a method has been proposed in which the flattened resin is cured under the second curing condition (curing temperature: 120 ° C., curing time: 1 hour) and then cut into individual electronic components by a cutting machine such as a dicer ( For example, see Patent Document 2).
[0005]
[Patent Document 1]
Japanese Patent No. 3220739 [Patent Document 2]
JP-A-2002-57175
[Problems to be solved by the invention]
However, as disclosed in Patent Document 1, even if the underfill molding is performed only by the pressure difference between the chip-substrate surrounded by the liquid resin and the surrounding air pressure, the viscosity of the liquid resin is increased. However, it is difficult to maintain the airtightness of the gap between the chip and the substrate due to the flow of the applied liquid resin over time due to the characteristics of the liquid resin such as the type of the liquid resin. For this reason, even if vacuum breaking is performed, it is difficult for the resin to fill the gap due to only the pressure difference.
[0007]
Further, in the resin sealing method disclosed in Patent Document 2, since the liquid resin applied on the substrate is semi-cured and then flattened by pressing, the liquid resin semi-cured when the flattening is performed. When rolling is performed, a load acting on an electrical connection portion with a chip or a substrate such as a bonding wire or a bump is large, and connection reliability is reduced.
In the resin sealing method using stencil printing, semiconductor chips mounted by wire bonding can be sealed at once, but when underfill molding is performed in the gap between chip substrates of semiconductor chips mounted by flip chip, Even if the liquid resin is unfilled or filled, voids are likely to occur.
[0008]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, improve the gap filling property of a liquid resin that collectively seals a chip area of a work on which a semiconductor chip is mounted on a substrate, and improve productivity by vacuum discharge. An object of the present invention is to provide a molding apparatus and a vacuum discharge molding method.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following configuration.
That is, in a vacuum discharge molding apparatus, a work on which a semiconductor chip is mounted on a substrate is carried in, and a liquid resin is discharged while scanning the work in a vacuum chamber in which a vacuum state is formed and a vacuum chamber in which a vacuum state is formed. A movable table on which a work is mounted in the vacuum chamber, comprising: a vacuum discharge unit having a discharge unit; and a pressure shaping unit configured to heat and pressurize the liquid resin discharged to the work to shape the liquid resin. After the liquid resin is discharged from the nozzle of the discharge unit fixedly arranged while scanning in the direction and applied to the chip area of the work, the vacuum chamber is vacuum-ruptured, the work is taken out of the room, and carried into the pressure shaping unit. Then, the liquid resin is heated and pressurized to promote curing of the liquid resin and is shaped flat.
Specifically, the discharge section is characterized in that the discharge section main body is disposed outside the vacuum chamber and discharges the liquid resin from a discharge nozzle disposed above a movable table in the vacuum chamber. Further, a transfer hand capable of holding the work and moving between the vacuum discharge unit and the pressure shaping unit is provided.
Further, the pressure shaping unit includes a flat plate that can be heated and pressed by being superimposed on the liquid resin.
Alternatively, the pressure shaping section includes a press die having a built-in heater. In this case, the press die may have a matte-textured uneven surface formed on the die surface that presses against the liquid resin discharged onto the work.
Further, the work is a circuit board on which a plurality of semiconductor chips are flip-chip mounted in a matrix. In this case, it is desirable to discharge the liquid resin from the discharge unit while heating the work mounted on the movable table.
[0010]
In the vacuum discharge molding method, a step of carrying a work on which a semiconductor chip is mounted on a substrate into a vacuum chamber to form a vacuum state, and a step of discharging a liquid resin to a chip area of the work while scanning the work under a vacuum state And vacuum-breaking the vacuum chamber to take out the work outside the chamber, carrying the work into the pressurizing and shaping unit, heating and pressurizing, and flattening the liquid resin while promoting curing thereof. .
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the resin sealing device according to the present invention will be described in detail with reference to the accompanying drawings.
1 is an explanatory plan view showing a schematic configuration of a vacuum discharge molding apparatus, FIGS. 2 to 4 are explanatory views showing a pressure shaping unit, and FIG. 5 is a process diagram showing a vacuum discharge molding method according to another example.
[0012]
First, a schematic configuration of a vacuum discharge molding apparatus will be described with reference to FIG.
In FIG. 1, a vacuum discharge unit 2 and a pressure shaping unit 3 are provided on a base 1. A transfer hand 5 that can hold a work 4 on which a semiconductor chip is mounted on a substrate and can move between the vacuum discharge unit 2 and the pressure shaping unit 3 between the vacuum discharge unit 2 and the pressure shaping unit 3. Is provided.
[0013]
A vacuum chamber 8 is formed in the vacuum discharge unit 2 by a vacuum container (vacuum bell jar) 7 which is opened and closed by the opening and closing arm 6 with respect to the base 1, for example. The vacuum bell jar 7 is connected to a vacuum pump 9 through a hollow opening / closing arm 6, and the vacuum pump 9 is operated to form a vacuum chamber 8. Further, a movable table 10 on which the work 4 is placed is provided in the vacuum chamber 8. The movable table 10 is provided so as to be able to scan in the XY directions in the vacuum chamber 8. As the table moving mechanism, for example, a known driving mechanism having a connection between a servomotor and a ball screw in the X and Y directions is used. A heater (not shown) capable of heating the work 4 on the movable table 10 is provided in the vacuum chamber 8. This heater is designed to increase the fluidity by heating the liquid resin when underfill molding a work, for example, flip-chip mounted as the work 4.
[0014]
A dispenser 11 serving as a discharge unit discharges the liquid resin 13 from a discharge nozzle (dispense nozzle) 12 to the work 4 carried into the vacuum bell jar 7. The dispenser 11 has a discharge portion main body (syringe portion) 14 for storing the liquid resin 13 disposed outside the vacuum bell jar 7, and only the nozzle tube 15 is introduced into the vacuum bell jar 7 through the seal portion 16. I have. The nozzle tube 15 is connected to a dispense nozzle 12 that is disposed above the movable table 10 in the vacuum bell jar 7 so as to be movable in the vertical direction. Further, the discharge amount of the liquid resin 13 discharged from the dispense nozzle 12 is controlled by an electromagnetic valve 17 provided in the middle of the nozzle tube 15.
[0015]
As described above, since only the dispense nozzle 12 and the nozzle tube 15 are provided in the vacuum bell jar 7 and the syringe portion 14 is provided outside the vacuum bell jar 7, the size of the vacuum chamber 8 can be reduced. In addition, the movable range of the movable table 10 in the vacuum chamber 8 can be reduced, so that the sealing property in the vacuum chamber 8 can be maintained well. Further, the movable table 10 on which the work 4 is placed scans in the XY directions, so that the liquid resin 13 can be applied to a wide range of the work 4 of various sizes, and the flow amount of the liquid resin 13 can be increased. Can be made as small as possible. When the work 4 is one in which semiconductor chips are arranged in a matrix on a substrate, in addition to applying the liquid resin 13 over a wide area in a chip area of the work 4 as described above, As will be described later, there is also a method of applying the liquid resin 13 to the central portion of each semiconductor chip in a scattered manner (see FIGS. 5A to 5H).
[0016]
FIG. 2 illustrates a press device 18 as a pressure shaping unit. 2, the press device 18 includes a lower mold 19 and an upper mold 20. The lower mold 19 and the upper mold 20 have heaters 21 and 22 built therein. Further, the press device 18 closes the upper die 20 while holding the flat pressure plate 23 on the liquid resin 13 of the work 4 placed on the lower die 19, clamps the work 4, and heats and presses the work 4. It has become. Thus, the semi-cured liquid resin 13 applied to the chip area of the work 4 in the vacuum chamber 8 is heated and pressurized to be cured, and the upper surface of the liquid resin 13 is shaped flat. The pressing plate 23 is not limited to a metal plate, and various plate materials such as a glass plate and a ceramic plate are used. Alternatively, the pressure plate 23 may be a heat radiating plate that is integrally attached to the liquid resin 13.
[0017]
The work 4 is carried onto the movable table 10 by the transfer hand 5 with the vacuum bell jar 7 opened. When the work 4 is carried in, the vacuum bell jar 7 is closed and the vacuum pump 9 is operated to create a vacuum state in the vacuum chamber 8. The liquid resin 13 is discharged from the dispenser 11 while scanning the movable table 10 on which the work 4 is placed in the XY directions (while heating the movable table 10 as necessary). When the liquid resin 13 is dropped onto the work 4 from the dispense nozzle 12, the liquid resin 13 is defoamed in the vacuum chamber 8 (when the work 4 is heated, the viscosity is reduced). (In the case of a flip chip, the gap between the chip and the substrate is underfill molded by a capillary phenomenon). When the ejection of the liquid resin 13 is completed, the scanning of the movable table 10 is stopped. At this time, the chip area on the work 4 is covered with the liquid resin 13.
[0018]
Next, the operation of the vacuum pump 9 is stopped, and the vacuum bell jar 7 is opened to vacuum-break the vacuum chamber 8. At this time, the gap filling of the liquid resin 13 is promoted by the pressure difference between the vacuum chamber 8 and the outside. Then, the work 4 is once taken out of the room from the movable table 10 by the transfer hand 5, and is carried into the press device 18. Next, the pressure plate 23 is superimposed on the liquid resin 13 applied to the work 4, and the press device 18 is closed by heating and pressurizing to accelerate the curing of the liquid resin 13, and the resin sealing portion (package portion) ) Is shaped so that the top surface is flat. After the package portion is formed, the semiconductor device is diced and diced into individual pieces. Therefore, flattening is performed to maintain uniform molding quality of the package portion (see FIG. 2).
[0019]
Further, the work 4 may be a circuit board on which a plurality of semiconductor chips are arranged in a matrix and flip-chip mounted, a circuit board on which semiconductor chips are arranged in a matrix and wire-bonded, May be any of laminated substrates.
[0020]
As shown in FIG. 3, the upper die 20 of the press device 18 having the built-in heater 22 has an uneven surface 24 having a matt-like pressing surface for pressing against the liquid resin 13 discharged onto the work 4. May be. When the semiconductor chip is sealed with the liquid resin 13 as shown in FIG. 2, a phenomenon occurs in which the outline indicating the outer shape of the semiconductor chip appears in the resin sealing portion. This occurs because the thickness of the resin on the surface of the semiconductor chip is small and the shrink is small, while the other portion is large and the boundary with the resin portion is inclined. A step of about 15 μm due to this inclination is amplified by refraction of light, and the outer periphery of the semiconductor chip appears to be raised, which may be regarded as poor appearance. By forming the upper mold 20 on the uneven surface 24 as shown in FIG. 3 for such an appearance defect, the occurrence of the step is eliminated, and the appearance defect can be prevented. In addition, the releasability of the liquid resin 13 having high viscosity is improved, and the quality of the molded product can be improved.
[0021]
Further, in FIG. 4, a release film 25 may be stretched on a die surface (upper die surface) of the press device 18 which presses against the liquid resin 13 discharged onto the work 4. When the release film 25 is used, the mold can be cured by applying heat and pressure while maintaining good mold releasability and keeping the mold surface clean.
The release film 25 covers a portion of the upper mold 20 that comes into contact with the liquid resin 13, and in this embodiment, is sucked and stretched on the clamp surface of the upper mold 20. The work 4 is positioned on positioning pins 26 erected on the lower mold 19. The release film 25 has heat resistance enough to withstand the heating temperature of the press die, is easily peeled off from the upper mold surface, and has flexibility and extensibility. For example, PTFE, ETFE, PET, FEP, fluorine impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. As the release film 25, a long film may be transported between reels, or a strip of film may be stretched one by one on the upper die surface. Further, the film surface may be plain, but a satin-like pattern may be formed.
[0022]
Next, a molding method using the above-described vacuum discharge molding apparatus will be described with reference to FIG. The work 4 on which the semiconductor chip is mounted on the substrate is carried into the open vacuum bell jar 7 while being held by the transfer hand 5. When the transfer hand 5 places the work 4 on the movable table 10 and returns to the standby position, the vacuum bell jar 7 is closed and the vacuum pump 9 is operated to form a vacuum state in the vacuum chamber 8. Then, the liquid resin 13 is discharged from the dispense nozzle 12 to the chip area while scanning in the XY direction while the work 4 is placed on the movable table 10 under a vacuum state. The liquid resin 13 is preferably applied so as to increase the center of the work in consideration of being pressed later although it depends on the viscosity.
[0023]
When the application of the liquid resin 13 is completed, the scanning of the movable table 10 is stopped. Next, the operation of the vacuum pump 9 is stopped, the vacuum bell jar 7 is opened, and the vacuum chamber 8 is broken in vacuum. Then, the transfer hand 5 holds the work 4 from the movable table 10, transfers the work 4 to the press device 18, and carries the work 4 into the lower mold 19. When the pressure plate 23 is used, it is superposed on the liquid resin 13 of the work 4.
Next, the press device 18 is closed, and the work 4 is heated and pressurized by the upper mold 20 and the lower mold 19 to form the liquid resin 13 flat while promoting the hardening of the liquid resin 13. The shaped work 4 is taken out by the transfer hand 5 from the opened press device 18 and then diced to produce individualized semiconductor devices.
[0024]
Next, another embodiment of the vacuum discharge molding method according to the present invention will be described with reference to FIGS. 1 and 5A to 5H. The work 4 on which the semiconductor chips 4 a are mounted on the substrate in a matrix is carried into the open vacuum bell jar 7 while being held by the transfer hand 5. When the transfer hand 5 places the work 4 on the movable table 10 and returns to the standby position, the vacuum bell jar 7 is closed and the vacuum pump 9 is operated to form a vacuum state in the vacuum chamber 8 (see FIG. 1).
[0025]
Next, the workpiece 4 is scanned in the XY direction while being placed on the movable table 10 under a vacuum state, and the dispensing nozzle 12 is moved so as to be located directly above the semiconductor chip 4a. Is applied to the center of each semiconductor chip 4a. It is preferable to apply the liquid resin 13 so that the center of the work is raised in consideration of the fact that the liquid resin 13 is pressed later although it depends on the viscosity (see FIGS. 5A and 5B).
[0026]
When the application of the liquid resin 13 is completed, the scanning of the movable table 10 is stopped. Next, the operation of the vacuum pump 9 is stopped, the vacuum bell jar 7 is opened, and the vacuum chamber 8 is broken in vacuum. Then, the transfer hand 5 holds the work 4 from the movable table 10, transfers the work 4 to the press device 18, and carries the work 4 into the lower mold 19. When the pressure plate 23 is used (see FIG. 2), the work 4 is superimposed on the liquid resin 13.
[0027]
Next, the press device 18 is closed, and the work 4 is heated and pressurized by the upper mold 20 and the lower mold 19 so as to promote curing of the liquid resin 13 and to flatten the liquid resin 13 (see FIGS. 5C and 5D). As shown in FIGS. 5E and 5F, the molded workpiece 4 is provided with a resin sealing portion (package portion) for each semiconductor chip. Next, after being taken out by the transfer hand 5 from the opened press device 18, it is carried into the dicing device, and is cut along the cutting line 28 shown in FIG. 5G by the dicing blade 27 shown in FIG. Thus, the semiconductor device 29 is diced in the XY direction and singulated.
[0028]
According to the molding method shown in FIGS. 5A to 5H, when the liquid resin 13 is applied in a scattered manner to the center of a wire bonding type semiconductor chip and heated and pressed, the moving amount of the liquid resin 13 is reduced. Very small and very small wire sweep.
Further, in the method of applying the liquid resin 13 to all the chip areas mounted on the substrate in a matrix in a lump, a defective portion of the semiconductor chip (not mounted on the substrate) may occur. In addition, since the liquid resin 13 is required, the total amount of resin is insufficient as compared with the case where there is no defective portion. For this reason, the height of the entire resin sealing portion is reduced, and as a result, the surface of the wire or the chip is exposed or the like, resulting in a defective product in which the resin sealing is incomplete. On the other hand, according to the molding methods shown in FIGS. 5A to 5H, the molding method is the same as the method of forming the individual cavities. Since the liquid resin 13 is unnecessary, the amount of resin required for one sealing can be reduced.
[0029]
The transfer hand 5 may be configured to be linked to a work supply unit such as a loader, or may be configured to be linked to a shaped work collection unit such as an unloader. By doing so, the vacuum forming apparatus can be inlined, and the productivity can be improved.
[0030]
According to the vacuum discharge molding apparatus and method, the liquid resin 13 is discharged from the dispenser 11 and applied while scanning the movable table 10 on which the work 4 is mounted in the vacuum chamber 8 in the X and Y directions. The liquid resin 13 can be efficiently applied to the chip area. In addition, since the liquid resin 13 is defoamed in the vacuum chamber 8 and heated and applied as needed, the chip areas of the various types of works 4 can be filled without gaps. In addition, by vacuum-breaking the vacuum chamber 8 and taking out the work 4 coated with the liquid resin 13 to the outside of the chamber, the gap filling property of the liquid resin 13 is promoted due to the pressure difference between the vacuum chamber 8 and the outside. Further, since the liquid resin 13 is carried into the press device 18 and heated and pressurized to form a flat while promoting the curing of the liquid resin 13, the flow of the liquid resin 13 can be suppressed by minimizing the flow, and the load applied to the semiconductor chip is small. The package part maintaining the flatness suitable for dicing can be shaped.
Further, since only the dispense nozzle 12 and the nozzle tube 15 are provided in the vacuum chamber 8 and the syringe portion 14 is provided outside the chamber, the size of the vacuum chamber 8 can be reduced. In addition, the movable range of the movable table 10 in the vacuum chamber 8 can be reduced, so that the sealing property in the vacuum chamber 8 can be maintained well.
Further, by providing the transfer hand 5 which can move between the vacuum chamber 8 and the press device 18 with the work 4 mounted thereon, the vacuum forming operation can be automated and in-lined, and the productivity can be increased. .
In addition, when the release film 25 is stretched on the mold surface of the press device 18 pressed against the liquid resin 13 or when the matte surface 24 is formed on the mold surface of the press device 18 pressed against the liquid resin, the appearance is poor. Can be prevented, and the releasability from the high-viscosity liquid resin 13 can be improved, so that the quality of the molded product can be improved.
[0031]
As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and is not particularly limited to a substrate mounting type of a semiconductor chip used as a work. Needless to say, many modifications can be made without departing from the spirit of the law, such as a multi-nozzle.
[0032]
【The invention's effect】
When the vacuum discharge molding apparatus and method according to the present invention are used, a movable table on which a work is mounted is scanned in the X-Y direction while the liquid resin is discharged and applied from the discharge unit in the vacuum chamber, so that the chip area of the work is obtained. The liquid resin can be efficiently applied to the substrate. In addition, since the liquid resin is defoamed in the vacuum chamber and is applied while being heated as needed, the chip areas of various types of works can be filled without gaps. Further, by vacuum-breaking the vacuum chamber and taking out the work coated with the liquid resin outside the chamber, the gap filling property of the liquid resin is promoted by the pressure difference between the vacuum chamber and the outside. Furthermore, it is carried into the pressure molding unit and heated and pressed to flatten it while promoting the curing of the liquid resin, so that it can be shaped by minimizing the flow of the liquid resin, the load applied to the semiconductor chip is small, and dicing is performed. The package can be shaped while maintaining the flatness suitable for the application.
In addition, since the discharge unit has a discharge unit body disposed outside the vacuum chamber and discharges liquid resin from a discharge nozzle fixedly disposed on a movable table in the vacuum chamber, the vacuum chamber can be downsized. In addition, the movable range of the movable table in the vacuum chamber can be reduced, so that good sealing performance in the vacuum chamber can be maintained.
Further, by providing a transfer hand capable of holding the work and moving between the vacuum discharge unit and the pressure shaping unit, the vacuum forming operation can be automated and inlined, and productivity can be increased. .
In addition, when a release film is stretched on the mold surface of the pressing and shaping unit that presses against the liquid resin, or when a matte surface is formed on the mold surface of pressing the liquid resin, the appearance becomes poor. In addition, the releasability from the high-viscosity liquid resin can be improved and the quality of the molded product can be improved.
[Brief description of the drawings]
FIG. 1 is an explanatory plan view showing a schematic configuration of a vacuum discharge molding apparatus.
FIG. 2 is an explanatory diagram showing a pressure shaping unit.
FIG. 3 is an explanatory diagram showing a pressure shaping unit.
FIG. 4 is an explanatory diagram showing a pressure shaping unit.
FIG. 5 is a process chart showing a vacuum discharge molding method according to another example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 2 Vacuum discharge part 3 Pressure molding part 4 Work 4a Semiconductor chip 5 Transfer hand 6 Opening / closing arm 7 Vacuum bell jar 8 Vacuum chamber 9 Vacuum pump 10 Movable table 11 Dispenser 12 Dispense nozzle 13 Liquid resin 14 Syringe part 15 Nozzle tube 16 Sealing part 17 Electromagnetic actuated valve 18 Pressing device 19 Lower die 20 Upper die 21, 22 Heater 23 Pressurizing plate 24 Uneven surface 25 Release film 26 Positioning pin 27 Dicing blade 28 Cutting line 29 Semiconductor device

Claims (9)

A vacuum discharge unit including a vacuum chamber in which a work on which a semiconductor chip is mounted is mounted and a vacuum state is formed, and a discharge unit that discharges a liquid resin while scanning the work in the vacuum chamber in which the vacuum state is formed. When,
And a pressure shaping unit for shaping by heating and pressurizing the liquid resin discharged to the work,
While scanning the movable table on which the work is mounted in the XY direction in the vacuum chamber, the liquid resin is discharged from the nozzle of the fixedly disposed discharge unit and applied to the chip area of the work, and then the vacuum chamber is broken in vacuum. A vacuum discharge molding apparatus wherein the work is taken out of the room, carried into the pressure shaping section, and heated and pressurized to form a flat while promoting curing of the liquid resin. 2. The vacuum discharge molding apparatus according to claim 1, wherein the discharge unit has a discharge unit main body disposed outside the vacuum chamber and discharges liquid resin from a discharge nozzle disposed above a movable table in the vacuum chamber. 3. 3. The vacuum discharge molding apparatus according to claim 1, further comprising a transfer hand that can hold the work and move between the vacuum discharge unit and the pressure shaping unit. 2. The vacuum discharge molding apparatus according to claim 1, wherein the pressure shaping unit includes a flat plate that can be heated and pressurized by being superposed on the liquid resin. 2. The vacuum discharge molding apparatus according to claim 1, wherein the pressure shaping unit includes a press die having a built-in heater. 6. The vacuum discharge molding apparatus according to claim 5, wherein the press die has a matt-like uneven surface formed on a die surface for pressing against a liquid resin discharged to a work. 2. The vacuum discharge molding apparatus according to claim 1, wherein the work is a circuit board on which a plurality of semiconductor chips are flip-chip mounted in a matrix. The vacuum discharge molding apparatus according to claim 7, wherein the liquid resin is discharged from a discharge unit while heating the work mounted on the movable table. A step of carrying a work in which the semiconductor chip is mounted on a substrate into a vacuum chamber to form a vacuum state,
Discharging the liquid resin to the chip area of the work while scanning the work under vacuum,
Vacuum discharge of the vacuum chamber, taking out the work outside the chamber, carrying the work into the pressure shaping section, and heating and pressurizing to promote curing of the liquid resin to flatten and shape the liquid resin. Molding method.

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