JP2004153045A - Method and metallic mold for molding sealing with resin for electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a metallic mold for molding sealing with resin for an electronic part by which the productivity of products is efficiently improved by efficiently preventing resin burr, wire deformation, etc. caused by curving of a substrate and efficiently solving problems on resin molding. <P>SOLUTION: In the mold clamping process of metallic molds 1, 2 and 3, the upper mold 1 is covered with a mold release film 4, and an electronic part (a semiconductor chip 7) and a wire 8 are fitted into a cavity space 28 formed by a cavity 19 extending through a middle plate 3 and an upper mold metallic mold surface 11 covered with the film 4. In the state of setting at least the space 28 to a prescribed vacuum degree by a vacuuming mechanism, melt resin 31 is injected into the cavity space 28 through a resin path 30 provided in linkage with the inside of the cavity space 28 and without contact with the substrate 6, to mold and seal the electronic part and the wire 8 with the resin. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing molding method for an electronic component and a mold improvement in which a substrate on which a semiconductor chip (electronic component) such as an IC is mounted is collectively resin molded by a resin molding die. Things.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a plurality of semiconductor chips mounted on a substrate are collectively subjected to resin encapsulation molding (batch single-side molding) using a resin encapsulation molding die for electronic components.
[0003]
For example, as shown in FIG. 5, a conventional resin sealing mold (two-piece mold) includes a fixed upper mold 101 and a movable lower mold 102.
A plurality of semiconductor chips 104 (electronic components) are mounted on a substrate 103 which is molded by resin molding with the molds 101 and 102, and the substrate 103 side and the chips 104 are connected by wires 105. It is configured to be electrically connected.
In addition, a resin passage 107 for injecting a resin material heated and melted by transfer molding is provided on the mold surface (upper mold surface 106) of the upper mold 101, and the chip 104 and the wire 105 are communicated with the resin passage 107. And a cavity 108 for encapsulating the whole with resin.
A setting recess 110 is provided on the mold surface (lower mold surface 109) of the lower mold 101 so that the substrate 103 on which the chip 104 and the wire 105 are mounted can be set at a predetermined position on the lower mold surface 109. In addition, when the substrate 103 is supplied and set in the setting recess 109, the supply is set with the chip 104 and the wire 105 mounted side facing upward.
Although not shown, a heating means such as a heater for heating and melting the resin material is buried in the molds 101 and 102, and the molds 101 and 102 are molded by a heater into a predetermined resin. The resin material is heated and melted by heating to a temperature to become a molten resin 111.
[0004]
That is, first, the substrate 103 is supplied and set to the recess 120 with the upper die 101 and the lower die 102 opened, with the mounting side of the chip 104 and the wire 105 of the substrate 103 facing upward.
Next, the upper mold 101 and the lower mold 102 are completely clamped, and the chips 104 and wires 105 (resin molded body) fitted in the cavities 108 of the upper mold surface 106 are heated and melted in advance. The molten resin 111 is injected through the resin passage 107, and then the molten resin 111 resin-sealed to the chip 104 and the wire 105 mounted on the substrate 103 is cured to form a cured resin and sealed. A fixed substrate (product) is formed.
[0005]
In addition, although the patent document etc. which describe the conventional example described above were investigated, they could not be found.
[0006]
[Problems to be solved by the invention]
However, in recent years, the size and thickness of the substrate have been reduced, and the following problems in resin molding have occurred, resulting in reduced product productivity.
[0007]
That is, as the size of the substrate becomes larger and thinner, the thickness of the substrate varies. For example, when the substrate is thin, a gap is generated between the upper mold surface and the substrate surface, and the resin infiltrates the upper surface of the substrate to form a resin flash, or the surface on which the semiconductor chip is not mounted (the bump forming surface / substrate). The resin may penetrate into the lower surface) to form a resin flash.
When the substrate is thick, cracks occur in the substrate due to the clamping pressure between the upper die surface and the substrate surface.
Therefore, a configuration in which a bottom surface member (float) of a sliding type corresponding to the thickness of the substrate is provided in the lower mold has been studied.
However, resin infiltrates between the lower mold and the bottom member, causing the bottom member (float) to slide poorly, requiring frequent repairs and maintenance of the mold, thereby lowering product productivity. are doing.
[0008]
In addition, the use of high-density resin is increasing due to the increase in size and thickness of the substrate, and the adhesion between the cavity surface and the resin molded body is increased. Cracks occur in the molded body, and the flow of the resin deteriorates, so that air or the like is caught in the resin and cracks occur in the resin molded body. Therefore, a configuration in which film forming in which a release film is suction-fixed to a cavity surface and resin sealing is performed and vacuum forming in which at least air or the like is forcibly discharged from the cavity and resin sealing molding is performed in combination is being studied. .
However, the above-mentioned release film moves into the cavity due to the pressure, and the release film deforms or breaks the wire, and the product yield is reduced.
[0009]
In addition, when a substrate is supplied and set at a predetermined position in a mold due to the increase in size and thickness of the substrate, the substrate is easily warped due to the thinness of the substrate. The wire is easily deformed or broken, and the product yield is reduced.
[0010]
Therefore, the present invention efficiently prevents resin burrs due to substrate warpage and wire deformation, and efficiently solves various problems in resin molding to efficiently improve product productivity. It is an object to provide a stop molding method and a mold.
[0011]
[Means for Solving the Problems]
In order to solve the above-mentioned technical problem, a resin sealing molding method for an electronic component according to the present invention includes a resin molding method provided between one mold and the other mold and both molds and formed in a penetrating state. Preparing a mold for resin-sealing molding of an electronic component including an intermediate plate having a cavity for mounting, and mounting the electronic component electrically connected to the substrate side by wires at a predetermined position of the other mold. A step of supplying and setting a substrate, a step of supplying a resin material to a predetermined position of the mold and heating and melting, a step of clamping the mold, and a step of clamping the mold, A step of forming a cavity space from the cavity and the mold surface of one of the molds, and a step of clamping the mold during the mold, with the substrate being elastically supported by the other mold. In the cavity space, Fitting and setting a part and a wire; and connecting the heat-fused resin material to the cavity space through a resin passage communicated with the cavity space and provided in a non-contact state with the substrate. A step of resin-molding the wire and the electronic component in the cavity space by injection.
Therefore, during the mold clamping step of the mold, the substrate can be supplied and set at a predetermined position of the other mold while being elastically supported by the sliding member. It can be prevented efficiently.
[0012]
Further, in order to solve the above-mentioned technical problem, a resin sealing molding method for an electronic component according to the present invention is provided between at least one of the molds and the other mold and both the molds, and is formed in a penetrated state. A resin sealing molding die for an electronic component including an intermediate plate having a molded resin molding cavity, a release film supplied between one of the dies and the intermediate plate, and the other of the other A step of preparing a substrate supplied between the mold and the intermediate plate and a substrate on which electronic components electrically connected by wires are mounted; and a substrate on which the electronic components are mounted at a predetermined position of the other mold. Supplying and setting, supplying a resin material to a predetermined position of the mold and heating and melting, and clamping the mold, and the mold clamping step of the mold, The mold surface of one of the molds A step of forming a cavity space from the cavity and the mold surface of one of the molds coated with the release film by coating a film, and during the mold clamping step of the mold, the other of the other A step of fitting and setting the electronic component and the wire in the cavity while the substrate is elastically supported by the mold; and, during the mold clamping step of the mold, the one mold and the intermediate plate. A step of forming a resin passage for injecting the heat-melted resin material in a non-contact state with the substrate in the cavity space described above, and at least a mold clamping step of the mold described above. A step of forming an outside air blocking area by bringing a mold surface in contact with the heat-melted resin material into an outside air blocking state, and forcibly sucking and discharging air in the outside air blocking area as described above. By setting the cavity space described above to a predetermined degree of vacuum, and by injecting the heat-melted resin material into the cavity space set to the predetermined degree of vacuum through the resin passage, A step of resin-molding the wire and the electronic component in the cavity space.
Therefore, during the mold clamping process, the release film is coated on one of the mold surfaces, so that the release film does not move into the cavity space without being affected by the set pressure at a predetermined degree of vacuum. The resin that efficiently prevents the film from deforming or breaking the wire, and is heated and melted through a resin passage that communicates with the cavity space and is provided in a non-contact state with the substrate in a state where a predetermined degree of vacuum is set. Since the material is injected, the flow of the molten resin is improved, and the generation of voids is efficiently prevented.
Further, when the sealed substrate is released from the mold, the release film can be coated on one mold surface, so that the substrate is efficiently prevented from being warped and cracked by the conventional ejector pins. .
Therefore, it is possible to efficiently solve various problems in resin molding and efficiently improve product productivity.
[0013]
In addition, in order to solve the above-mentioned technical problem, a resin-sealing molding die for an electronic component according to the present invention includes one die, the other die opposed to one die, and the above-mentioned two die. And a resin molding cavity provided in a state penetrating through the intermediate plate, and a substrate on which the electronic component provided in the other mold and electrically connected to the substrate side by wires is mounted. A sliding member for a substrate set elastically supporting the substrate in a state where the wires and the electronic components are fitted in the cavities, and one of the dies and the intermediate plate, which are formed by clamping. And a resin passage for resin injection.
Therefore, during the mold clamping step of the mold, the substrate can be supplied and set at a predetermined position of the other mold while being elastically supported by the sliding member. It can be prevented efficiently.
[0014]
Further, in order to solve the above-mentioned technical problem, a resin-sealing-molding mold for an electronic component according to the present invention includes one mold, another mold opposed to the one mold, and both molds described above. An intermediate plate provided therebetween, a cavity for resin molding provided in a state penetrating the intermediate plate, a release film covering the mold surface of one of the molds, and a mold release film provided on the other mold. A board-mounting sliding member for elastically supporting a board on which an electronic component electrically connected to the board side with a wire is mounted in a state where the wire and the electronic component are oriented in the cavity direction; A resin passage for resin injection formed by clamping the mold and the intermediate plate with the resin material provided on at least one mold surface with the other mold and the intermediate plate and in contact with the heat-melted resin material described above; Block the mold surface A seal member in a state to form the external air shutoff circumference, characterized in that it comprises a vacuum mechanism for forcibly sucking and discharging the air from the outside air cut off the above-mentioned range.
Therefore, during the mold clamping process, the release film is coated on one of the mold surfaces, so that the release film does not move into the cavity space without being affected by the set pressure at a predetermined degree of vacuum. The resin that efficiently prevents the film from deforming or breaking the wire, and is heated and melted through a resin passage that communicates with the cavity space and is provided in a non-contact state with the substrate in a state where a predetermined degree of vacuum is set. Since the material is injected, the flow of the molten resin is improved, and the generation of voids is efficiently prevented.
Further, when the sealed substrate is released from the mold, the release film can be coated on one mold surface, so that the substrate is efficiently prevented from being warped and cracked by the conventional ejector pins. .
Therefore, it is possible to efficiently solve various problems in resin molding and efficiently improve product productivity.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
The details will be described below with reference to FIGS.
FIG. 1 to FIG. 4 are schematic enlarged longitudinal sectional views showing each step in the resin molding die according to the present invention step by step.
[0016]
That is, in the mold for resin sealing molding of an electronic component according to the present invention, for example, as shown in FIG. 1, an upper mold 1 (one mold) and a lower mold 2 (the other mold) opposed to the upper mold 1 are arranged. Mold) and an intermediate plate 3 provided between the molds 1 and 2, and a release film 4 covering the mold surface of the upper mold 1 with the upper mold 1 and the intermediate plate 3. A release film supply mechanism (not shown) for supplying between the molds, and a mold surface provided on the mold surfaces of the molds 1 and 2 and in contact with the resin material heated and melted, to shut off the outside air. A seal member 5 forming a range and a vacuuming mechanism (not shown) for forcibly sucking and discharging air from the outside air blocking range are provided.
[0017]
The substrate 6 on which electronic components (semiconductor chips 7 such as ICs) in this embodiment are mounted is, for example, a semiconductor which is die-bonded to a predetermined position on the substrate 6 and arranged in a matrix as shown in FIG. At least the chip 7 and the wires 8 for electrically connecting the substrate 6 and the chip 7 are provided, and the electronic component sides 7.8 are resin-sealed with a heat-melted resin material. A resin molded body 9 and a substrate outer peripheral portion 10 which is not resin-sealed are formed and configured.
As the other substrate 6 on which the electronic components are mounted, a flip-chip substrate including a semiconductor chip 7 electrically connected to predetermined portions of the substrate 6 via bumps may be used.
[0018]
Also, as shown in FIG. 1, for example, the upper mold 1 has an upper mold surface 11 and inclined portions 12A and 12B, which can cover the release film 4 with tension, and have a downwardly convex shape. , A film holding member 14A / 14B provided so as to surround the protrusion block 13, and an elastic member which reciprocates the holding members 14A / 14B slidably up and down. 15A and 15B, and an upper die fixing block 17 having an upper die fixing surface 16 into which the convex block 13, the holding members 14A and 14B, and the elastic members 15A and 15B can be removably fitted. An outer peripheral block 18 provided with the seal member 5 is provided around the outer periphery of the upper fixed block 17.
[0019]
The intermediate plate 3 is provided, for example, as shown in FIG. 1 so as to penetrate the intermediate plate 3 and fit the electronic component side 7.8 mounted on the substrate 6 with the cavity 19 and the upper mold 1. The film holding surface 21 and the inclined surface 20A formed through the release film 4 that can be joined to the upper mold fixing surface 16, the holding member 14A, and the inclined portion 12A, the substrate outer peripheral portion 10, the lower mold fixing surface 25, and the lower mold A substrate contact surface 22 that contacts the seal member 5 attached to the fixed block 27, an inclined surface 20 </ b> B into which a heat-melted resin material can be injected, and a resin passage surface 28 are formed.
[0020]
Further, the lower die 2 has a sliding member 23 for a substrate set which can elastically support the substrate 6 on which the electronic component (semiconductor chip 7) and the wire 8 are mounted in a predetermined position in the upward direction (toward the cavity 19). An elastic member 24 that reciprocates the sliding member 23 up and down slidably; and a lower die fixing block 26 having a lower die fixing surface 25 into which the sliding member 23 and the elastic member 24 can be detachably fitted. And a lower mold outer peripheral block 27 provided with a seal member 5 around the outer periphery of the lower mold fixed block.
[0021]
The upper elastic members 15A and 15B and the lower elastic member 24 are provided with, for example, a spring or the like.
Although not shown, a heating means such as a heater for heating and melting the resin material is embedded in the molds 1, 2, and 3, and the molds 1, 2, and 3 are heated by the heater. The resin material is heated and melted by heating to a predetermined resin molding temperature to form a molten resin 31.
Although not shown, the molds 1, 2, and 3 are configured to inject a resin into the resin molded body 11 of the two substrates 6, and only one substrate 6 is used. You may make it resin-mold.
[0022]
Therefore, when the resin molded body 11 of the substrate 6 is sealed with the molds 1, 2, and 3, the molds 1, 2, and 3 are first opened as shown in FIG. A release film 4 held horizontally while being stretched to a predetermined tension is supplied between the upper mold 1 and the intermediate plate 3, and the substrate 6 is placed on the resin molded body 11 side (the electronic component side 7). 8) With 8) turned upward, it is supplied between the intermediate plate 3 and the lower mold 2 and is supplied to a position immediately above a predetermined position of the sliding member 23.
At this time, the elastic members 15A and 15B and the elastic member 24 separately attached to the holding members 14A and 14B and the sliding member 23 are interlocked, and the elastic members 15A, 15B and 24 are in the extended state (restored state). State), at least the bottom surfaces of the holding members 15A and 15B are configured to protrude downward from the upper die fixing surface 16, and the top surface of the sliding member 23 is It is configured to protrude upward from the fixing surface 25.
[0023]
Next, the substrate 6 supplied to a position immediately above the predetermined position of the sliding member 23 is supplied and set to the sliding member 23, and then, as shown in FIG. That is, the substrate contact surface 22 comes into contact with the substrate outer peripheral portion 10 and the lower die fixing surface 25, and comes into contact with the seal member 5 attached to the lower die fixing block 27. At this time, the substrate 6 and the sliding member 23 move downward (slide downward) in accordance with the thickness of the substrate 6 and the elastic member 24 attached to the sliding member 23 is in a contracted state. Are elastically supported by the elastic member 23 with an elastic force so as not to damage the substrate 6 in a state of being elastically supported, and are brought into contact with no gap between the substrate fixing portion 10 and the substrate contact surface 22. It is configured to:
Therefore, the substrate 6 can be supplied and set at a predetermined position of the elastic member 23 of the lower mold 2 while being elastically supported by the sliding member 23, so that resin burrs due to warpage of the substrate and wire deformation can be efficiently prevented. can do.
[0024]
Note that, as shown in FIG. 2, the release film 4 is in a horizontal state and waits between the upper mold 1 and the intermediate plate 3, but at this time, the film 4 is moved by the film supply mechanism. The upper mold 1 is moved upward to cover and contact the upper mold surface 11, the inclined portions 12A and 12B, the bottom surfaces of the film holding members 14A and 14B, and the upper mold fixing surface 16 in advance in the upper mold 1. The film 4 of the fixing surface 16 may be configured to be tensioned to cover the film 4.
[0025]
Next, as shown in FIG. 3, the upper mold 1, the lower mold 2, and the intermediate plate 3 are completely clamped by clamping the upper mold 1 and the intermediate plate 3.
At this time, when the upper mold 1 and the intermediate plate 3 are clamped by the mold, the release film 4 is tensioned to the upper mold surface 11 which is formed in the upper mold block 13 and has a downward convex shape. It is constituted so that it may cover.
Also, the upper mold 1 and the intermediate plate 3 are clamped to form a cavity space 29 formed by the upper mold surface 11 that covers the release film 4 by tension and the cavity 19 of the intermediate plate 3. The resin passage 30 is formed by the inclined portion 12B and the holding member 14B, which is in communication with the cavity space 29 and covers the film 4, and is formed by the inclined surface 20B and the resin passage surface 28.
[0026]
Here, as shown in FIG. 3, when the upper mold surface 11 is covered with the release film 4 by tension, the film 4 comes into contact with the upper mold surface 11 and is covered to form the inclined portion 12A. 12B, the film 4 is in contact with and coated along the shape of the film 12B, so that the upper mold surface 11 is tensioned and covered without generating film wrinkles, and the inclined portion 12A The holding member 14A bottom / upper die fixing surface 16 and the holding surface 21A / inclined surface 20A of the intermediate plate 3 hold and hold the film 4. At this time, the holding member 14A moves upward and the elastic member 15A is moved. The film 4 is configured to be pinched and held by contracting.
Similarly to the holding member 14A of the upper mold 1, the holding member 14B is also configured to move upward while covering the film 4 and to contract the elastic member 15A, and the film 4 is held with the inclined portion 12B. If the resin passage 30 can be formed by covering the member 14A, the upper convex block 13 and the holding member 14B may be provided integrally without providing the elastic member 15B.
[0027]
Therefore, as shown in FIG. 3, during the mold clamping process of the dies 1, 2, and 3, the electronic component (semiconductor chip 7) and the wire 8 of the resin molded body 9 part fitted and set in the cavity space 28 are formed. In a non-contact state, the molten resin 31 is injected through a resin passage 30 using a resin material previously melted by heating as a molten resin 31.
At this time, at the time of the mold clamping process of the dies 1, 2, and 3, each sealing member 5 attached to the upper mold fixing block 18 and the lower mold fixing block 27 is attached to the holding surface 21 of the intermediate plate 3 and the substrate contact surface. 22 and a mold surface in contact with the molten resin 31 at least in a state of blocking the outside air to form an outside air blocking range, and forcibly suck and discharge air from the outside air blocking range by a vacuuming mechanism. At least the cavity space 28 is set to a predetermined degree of vacuum, and the molten resin 31 is injected through the resin passage 30.
[0028]
Next, although not shown, the electronic components (semiconductor chip 7) and the wires 8 of the resin molded body 9 fitted and set in the cavity space 28 during the mold clamping process of the dies 1, 2, and 3. In a non-contact state, a resin material that has been heated and melted is injected as molten resin 31 into the cavity space 28 set to a predetermined degree of vacuum through the resin passage 30, thereby forming a resin molded body in the cavity space 28. Nine parts of the electronic component (semiconductor chip 7) and the wire 8 are molded with resin.
Therefore, during the mold clamping process of the molds 1, 2, and 3, the release film 4 is coated on the upper mold surface 11, so that it is not affected by the pressure set to a predetermined degree of vacuum by the vacuuming mechanism. While the film 4 does not move into the cavity space 28, the film 4 is efficiently prevented from deforming or breaking the wire 8, and the cavity 4 is set to a predetermined degree of vacuum by the vacuuming mechanism. Since the resin material that has been heated and melted is injected through the resin passage 30 that communicates with the inside of the portion 28 and is provided in a non-contact state with the substrate 6, the flow of the molten resin 31 is improved and the generation of voids is efficiently prevented.
[0029]
Next, although not shown, at the time of the mold clamping process of the dies 1, 2, and 3, the molten resin 31 in the resin passage 30 and the cavity space 28 is cured to form a cured resin 32, and the cured resin 32 is cured. A sealed substrate 33 including the resin passage 30 portion that has become the resin 32 is formed.
Here, at least when the molten resin 31 in the cavity space 28 is injected and the cured resin 32 is molded, the predetermined degree of vacuum set by the vacuuming mechanism is released.
[0030]
Next, although not shown, the upper mold 1 covered with the release film 4 was opened while the intermediate plate 3 and the lower mold 2 were clamped, and the film 4 was covered. The sealed substrate 33 including the resin passage 30 is released from the upper mold surface 11 (the top surface of the cavity space 28), the inclined portion 12B, and the bottom surface of the holding member 14B.
When the sealed substrate 33 including the resin passage 30 is released from the mold, an ejector mechanism (not shown) configured to project downward from the upper mold surface 11 via the film 4. It may be provided to further improve the release force.
[0031]
Next, as shown in FIG. 4, simultaneously with opening the intermediate plate 3 and the lower mold 2, the direction of restoring the elastic member 24 in the lower mold 2, that is, the sliding member 23 is moved upward and sealed. The stopped substrate 33 is released from the state of elastic support.
At this time, the sealed substrate 33 and the resin passage 30 are separated (degated), and the sealed substrate 33 is placed on the sliding member 23 released from the elastic support state. Have been.
When the sealed substrate 33 and the resin passage 30 are separated from each other, a degate mechanism (not shown) may be supplied into the mold and separated.
Therefore, when the sealed substrate 33 is released from the molds 1, 2, and 3, the release film 4 can be coated on the upper mold surface 11, so that the substrate 6 like a conventional release pin can be used. However, it is possible to efficiently prevent the occurrence of cracks due to warpage.
[0032]
Next, as shown in FIG. 1, the sealed substrate 33 from which the resin passage 30 was cut was transported from a predetermined position of the sliding member 23 of the lower mold 2 to the next step, and was covered with the upper mold 1. The used release film 4 is moved downward by the film supply mechanism, stretched with a predetermined tension to be in a horizontal state, separated from the mold surface of the upper mold 1, and then the used film 4 is removed. The film 4 before being transported and used is supplied by the film supply mechanism.
Therefore, as described above, the resin molded body 11 can be resin-sealed and molded with the dies 1, 2, and 3 on the substrate 6 on which the electronic components (semiconductor chips 7) and the wires 8 are mounted. Therefore, it is possible to efficiently solve various problems in resin molding and efficiently improve product productivity.
[0033]
That is, as described above, a resin for electronic components that efficiently prevents resin burrs due to substrate warpage and wire deformation and efficiently solves various problems in resin molding and efficiently improves product productivity. A sealing molding method and a mold can be provided.
[0034]
In addition, the coating surface of the upper mold 1 side of the release film 4 (the non-contact surface of the heat-melted resin material) may have adhesiveness.
[0035]
Although the above-described substrate 6 has been described as mounting electronic components arranged in a matrix, it may be a substrate 6 having a single or a single row of semiconductor chips 7 mounted on the substrate 6.
[0036]
Further, when the substrate 6 is supplied and set at a predetermined position of the sliding member 23, the substrate 6 is described as being elastically supported horizontally. However, the substrate 6 can be supplied and set to the sliding member 23. It may be configured to provide a recess or a positioning pin (not shown) for substrate setting.
[0037]
In addition, the seal member 5 is attached to the upper die outer peripheral block 18 and the lower die outer block 25. At the time of the die clamping process of the dies 1, 2, and 3, at least the resin material that has been heated and melted. If the configuration is such that the outside air blocking range is formed by setting the mold surface in contact with the outside air into the outside air blocking state, the seal member 5 is appropriately provided, or the entire mold 1, 2, or 3 is formed as the outside air blocking range. It may be configured.
In this case, the upper mold outer peripheral block 18 and the lower mold outer peripheral block 25 may not be provided.
[0038]
In the mold clamping process of the dies 1, 2, and 3, the resin passage 30 of the resin material heated and melted may be provided on the top surface of the cavity space 28 if it is not in contact with the substrate 6.
[0039]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .
[0040]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, while efficiently preventing resin burrs and wire deformation due to substrate warpage, efficiently solving various problems in resin molding, and efficiently improving the productivity of products, the resin sealing of electronic components is improved. This provides an excellent effect of providing a stop molding method and a mold.
[Brief description of the drawings]
FIG. 1 is a schematic enlarged longitudinal sectional view of a main part of a mold for resin sealing molding according to the present invention, and shows a state in which an upper mold, a lower mold, and an intermediate plate are opened.
FIG. 2 is a schematic enlarged longitudinal sectional view of a main part of a mold for resin sealing molding according to the present invention, showing a state in which a lower mold and an intermediate plate are clamped.
FIG. 3 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding die according to the present invention, in which an upper die, a lower die, and an intermediate plate are clamped and heated and melted. This shows a state where a resin material is injected.
FIG. 4 is a schematic enlarged longitudinal sectional view of a main part of a resin sealing molding die according to the present invention, in which an upper die and an intermediate plate are opened to release a sealed substrate. Indicates the status.
FIG. 5 is a schematic enlarged longitudinal sectional view of a main part of a conventional resin molding die.
[Explanation of symbols]
1 Upper type
2 lower mold
3 Intermediate plate
4 Release film
5 Seal members
6 substrate
7 Semiconductor chip
8 wires
9 Resin molding
10 Peripheral part of substrate
11 Upper mold surface
12A ・ 12B Inclined part
13 Upper die block
14A ・ 14B Holding member
15A / 15B / 24 Elastic member
16 Upper die fixing surface
17 Upper fixed block
18 Upper die outer peripheral block
19 cavities
20A ・ 20B Inclined surface
21 Holding surface
22 Board contact surface
23 Sliding member
25 Lower die fixing surface
26 Lower fixed block
27 Lower die outer peripheral block
28 Resin passage surface
29 Cavity space
30 resin passage
31 molten resin
32 Cured resin
33 Sealed Substrate (Product)

Claims (4)

A step of preparing a mold for resin sealing molding of an electronic component including one mold, the other mold, and an intermediate plate having a resin molding cavity formed in a state penetrated between the two molds; When,
A step of supplying and setting a board mounted with electronic components electrically connected to the board side and wires at predetermined positions of the other mold,
A step of supplying a resin material to a predetermined position of the mold and heating and melting the resin material,
A step of clamping the mold,
A step of forming a cavity space from the cavity and the mold surface of the one mold during the mold clamping step of the mold,
At the time of the mold clamping step of the mold, a step of fitting and setting the electronic component and the wire in the cavity space while elastically supporting the substrate with the other mold,
By injecting the heat-melted resin material into the cavity space through a resin passage that is communicated with the cavity space and is provided in a non-contact state with the substrate, the cavity space portion is filled with the resin material. A resin sealing molding of the formed wire and the electronic component. At least, one mold and the other mold and a resin sealing molding die of an electronic component including an intermediate plate provided with a resin molding cavity formed in a penetrating state provided between the two dies, A release film supplied between one of the molds and the intermediate plate, and an electronic component electrically connected to a substrate side supplied between the other mold and the intermediate plate by a wire were mounted. A step of preparing a substrate and
A step of supplying and setting a substrate on which the electronic component is mounted at a predetermined position of the other mold,
A step of supplying a resin material to a predetermined position of the mold and heating and melting the resin material,
A step of clamping the mold,
During the mold clamping process of the mold, by covering the mold surface of the one mold with the release film, the cavity and the mold surface of the one mold coated with the mold film are removed. Forming a cavity space,
At the time of the mold clamping step of the mold, a step of fitting and setting the electronic component and the wire in the cavity in a state where the substrate is elastically supported by the other mold,
During the mold clamping step, the heat-fused resin communicated with the inside of the cavity space between the one mold and the intermediate plate and provided in a non-contact state with the substrate. Forming a resin passage for injecting the material;
During the mold clamping step of the mold, a step of forming an outside air cutoff area by setting the mold surface in contact with at least the heat-melted resin material to the outside air cutoff state,
A step of forcibly sucking and discharging air in the outside air cutoff range and setting at least the cavity space to a predetermined degree of vacuum,
By injecting the heat-melted resin material into the cavity space set to the predetermined degree of vacuum through the resin passage, the wire and the electronic component are sealed in the cavity space by resin. And a step of resin-molding the electronic component. One mold, the other mold opposed to one mold, the intermediate plate provided between the two molds, the resin molding cavity provided in a state penetrating the intermediate plate, and the other mold A board set that elastically supports the above-mentioned substrate in a state where the above-mentioned wire and the electronic component are fitted in the above-mentioned cavity in a substrate having an electronic component mounted on the mold and electrically connected to the substrate side by a wire. A resin-molding mold for electronic parts, comprising: a sliding member for use; and a resin passage for resin injection formed by clamping one of the molds and the intermediate plate. One mold, the other mold facing the one mold, an intermediate plate provided between the two molds, and a resin molding cavity provided in a state penetrating the intermediate plate, A mold release film covering the mold surface of one mold, and a substrate on which an electronic component electrically connected by wires to the substrate side provided on the other mold is mounted. A substrate setting sliding member elastically supported in a state facing the direction, a resin passage for resin injection formed by clamping one of the molds and the intermediate plate, and an intermediate between the other mold and the other mold. A seal member provided on at least one of the mold surfaces and in contact with the heated and melted resin material to form an outside air blocking area with the outside air blocking state, and air from the outside air blocking area. Forced Resin sealing mold of the electronic component which comprises a vacuum unit for suction and discharge.

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