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JP2004230707A - Method and apparatus for sealing and molding electronic component with resin - Google Patents

Method and apparatus for sealing and molding electronic component with resin Download PDF

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Publication number
JP2004230707A
JP2004230707A JP2003021900A JP2003021900A JP2004230707A JP 2004230707 A JP2004230707 A JP 2004230707A JP 2003021900 A JP2003021900 A JP 2003021900A JP 2003021900 A JP2003021900 A JP 2003021900A JP 2004230707 A JP2004230707 A JP 2004230707A
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Prior art keywords
resin
release film
mold
chip
lead frame
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JP2003021900A
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JP4336502B2 (en
Inventor
Kazuteru Kawakubo
一輝 川窪
So Watanabe
創 渡辺
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for sealing and molding an electronic component with a resin capable of efficiently solve the problems on resin molding such as resin burrs on a face 10 where a chip is not mounted, inferiority of a wire and excessive use of the resin by closely sticking the face where the chip is not mounted for a lead frame mounted with a semiconductor chip being the electronic component and a release film without any gap and surely, and an apparatus therefor. <P>SOLUTION: In the method for sealing and molding the electronic component with the resin, when upper and lower molds 1 and 2 are clamped, a sliding member 21 is moved upward from a part approximately just below a plurality of the chips 8 and the wires 9 inserted and mounted in a cavity forming part 5, and a required amount of a molten resin 13 on the top face of the sliding member 21 is also elevated therewith to immerse and wrap a plurality of the number of the chips 8 and the wires 9 and it is compression-molded by a required pressure to closely stick without gap and surely the face 10 where the chip is not mounted of the lead frame 7 mounted with the chips 8 being the electronic components and the release film 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品である複数個の半導体チップを装着したリードフレームに離型フィルムを介して樹脂封止する電子部品の樹脂封止成形方法及び装置の改良に関するものである。
【０００２】
【従来の技術】
従来から、固定上型と可動下型とから成る樹脂封止成形用金型を搭載した電子部品の樹脂封止成形装置を用いて、複数個の半導体チップを装着したリードフレームの半導体チップ非装着面に離型フィルムを被覆した状態で、複数個の半導体チップを嵌装したキャビティ内に樹脂を注入する、トランスファー成形が行われている。
【０００３】
即ち、まず、複数個の半導体チップをワイヤで電気的に接続されたリードフレームを下型面の所定位置に設けたセット用凹所に該チップ装着面側を下方向に向けて供給セットすると共に、上型面と半導体チップ非装着面との間に離型フィルムを供給して上型面に貫通して上型に設けたフィルム吸引孔より離型フィルムを吸引して上型面に被覆し、次に、両型を型締めして下型に設けた樹脂注入用のキャビティ内に複数個の該チップとワイヤとを嵌装セットし、次に、下型面に設けた樹脂材料供給用のポットより加熱溶融化された溶融樹脂を樹脂通路を介してキャビティ内に溶融樹脂を注入して複数個の該チップとワイヤとをキャビティ内で成形する樹脂成形体を樹脂封止することにより、リードフレームにおける該チップ非装着面のリード部に溶融樹脂を成形しない状態で樹脂封止する。
次に、溶融樹脂で形成された樹脂成形体が硬化するのに必要な所要時間の経過後に、樹脂成形体と樹脂通路とが硬化して硬化樹脂を成形して、硬化した樹脂通路と樹脂成形体との樹脂封止済部分が一体となって成形される。
つまり、従来の技術では、上型面に離型フィルムを吸引した状態で、複数個の該チップとワイヤとを嵌装したキャビティ内に溶融樹脂を注入充填して樹脂封止する、トランスファー成形を採用している（例えば、特許文献１参照。）。
【０００４】
【特許文献１】
特開２００１−２０３２２７号公報（第５−６頁、第１図）
【０００５】
【発明が解決しようとする課題】
しかしながら、近年の傾向として、リードフレームの厚みが薄くなったうえにリードフレームの形状が大きくなったり、リードフレーム上にマトリクス状に配置された大量の半導体チップを装着したうえに、該チップ自体も極小化・極薄化しており、その該チップと電気的に接続するワイヤ自体も極細化や多ピン化となっている。
以上のことからも、離型フィルムを吸引して上型面へ被覆した状態で上下型を型締めして、従来のトランスファー成形で該チップとワイヤとを嵌装したキャビティ内に樹脂を注入する時の、その樹脂の流れは水平方向であり、その水平方向からの樹脂圧によりリードフレーム自体が樹脂圧に押されて波打った状態となって、離型フィルムと該チップ非装着面との間に隙間が発生して完全に密着しない状態となるので、該チップ非装着面に樹脂が廻り込み樹脂ばりが発生すると云う問題があった。
加えて、キャビティの鉛直方向の長さ（厚み）も短くなり、キャビティ底面の面積が大きくなるので、前述した水平方向からの樹脂圧によりワイヤの屈曲や欠損等のワイヤ不良が発生したり、キャビティ全体に樹脂が行き渡らずに未充填不良が発生すると云う問題があった。
さらに、樹脂通路を介してキャビティ内に嵌装された複数個の該チップとワイヤとを樹脂で注入する際に使用される樹脂量は不要となる樹脂通路部分の樹脂量も余分に使用する必要があり、さらには、樹脂成形体と基板との密着性を向上させるのには、高密度な樹脂材料を使用することからもコスト高となる樹脂材料を過剰に使用することになるので、樹脂の歩留まりを著しく低下することになる。
【０００６】
即ち、本発明は、電子部品である半導体チップを装着したリードフレームの半導体チップ非装着面と離型フィルムとを隙間なく確実に密着して、樹脂成形上の問題を効率良く解決する、電子部品の樹脂封止成形方法及び装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
前記技術的課題を解決するために本発明に電子部品の樹脂封止成形方法は、上型と下型とから成る樹脂封止成形用金型を用いて、電子部品である複数個の半導体チップを装着されたリードフレームにおける該チップ非装着面のリード部を離型フィルムで被覆した状態で、前記上下型を型締めして加熱溶融化された樹脂材料で樹脂封止する電子部品の樹脂封止成形方法であって、前記した上下型の型締め時において、前記した下型の金型面の所定位置に該チップ装着側を下方向に向け且つ前記した該チップ非装着面と前記上型の金型面との間にある前記離型フィルムを介して前記リードフレームが供給された状態で、前記した複数個の該チップを前記した下型に備えたキャビティ形成部にある加熱溶融化された樹脂材料で圧縮成形すると共に、前述した圧縮成形における所要圧力により前記した離型フィルムと該チップ非装着面とを隙間なく確実に密着することを特徴とする。
【０００８】
また、前記技術的課題を解決するために本発明に電子部品の樹脂封止成形装置は、上型と該上型に対向配置した下型とから成る樹脂封止成形用金型と、前記上型の金型面に被覆し且つ電子部品である複数個の半導体チップを装着されたリードフレームにおける該チップ非装着面のリード部を被覆する離型フィルムを供給する離型フィルム供給機構と、前記した複数個の該チップを樹脂封止する樹脂材料を供給する樹脂材料供給機構とを含む電子部品の樹脂封止成形装置であって、前記した上下型の型締め時において、前記した下型の金型面の所定位置に該チップ装着側を下方向に向け且つ前記した該チップ非装着面と前記上型の金型面との間にある前記離型フィルムを介して前記リードフレームが供給された状態で、前記した複数個の該チップを前記した下型に備えたキャビティ形成部にある加熱溶融化された樹脂材料で圧縮成形すると共に、前述した圧縮成形における所要圧力により前記した離型フィルムと該チップ非装着面とを隙間なく確実に密着することを特徴とする。
【０００９】
【発明の実施の形態】
以下、図１乃至図８における実施例図に基づいて、説明する。
なお、図１乃至図８は、本発明に係る樹脂封止成形装置を示した図である。
【００１０】
即ち、従来装置における金型構造に備えたポット・プランジャ・樹脂通路部分（カル部・ランナ部・ゲート部）を全く設けることのない、本発明に係る電子部品の樹脂封止成形装置において、図１に示すように、例えば、上型１と該上型１に対向配置した下型２とから成る樹脂封止成形用金型と、上型１の金型面（上型面３）に被覆する離型フィルム４を上下型１・２間に所定の張力で張架して供給する離型フィルム供給機構（図示しない）と、下型２に備えたキャビティ形成部５に樹脂材料（本実施例では顆粒樹脂６を示す）を供給する樹脂材料供給機構（図示しない）とを設けている。
【００１１】
また、本実施例で用いるリードフレーム７は、図３に示すように、例えば、リードフレーム７上の所定個所に配置された複数個の半導体チップ８と、該チップ８装着側のリードフレーム７と該チップ８とを電気的に接続するワイヤ９と、該チップ８を装着しない半導体チップ非装着面１０に装着されたリード部（図示しない）とで形成されていると共に、該チップ非装着面１０は、リード部が突出せずに水平に構成されており、リードフレーム７には鉛直方向に貫通した空隙部１１が形成されている。
【００１２】
従って、上下型１・２を搭載した前記装置を用いて、リードフレーム７の複数個の該チップ８とワイヤ９とを上下型１・２を型締めして圧縮成形で樹脂封止すると樹脂成形体１２を形成し、樹脂封止しない該チップ装着側にフレーム外周部２３が形成されると共に、空隙部１１にも樹脂が浸漬するが、該チップ非装着面１０には当該樹脂が廻り込まないように、離型フィルム４を隙間なく確実に密着するように構成されている。
また、圧縮成形で樹脂封止された樹脂成形体１２を形成後に、樹脂成形体１２が硬化するのに必要な所要時間経過後に、樹脂成形体１２が加熱溶融化された樹脂材料である溶融樹脂１３から硬化樹脂１４となり、つまりは、硬化された樹脂成形体１２を装着したリードフレーム７である樹脂成形済基板１５（製品）が完成される（図８参照）。
【００１３】
また、上型１は、図１に示すように、例えば、離型フィルム４を介してリードフレーム７を金型内の所定位置へ供給するほぼ直上部に位置し且つ上型１から着脱自在に取付け・取外しすることができて、例えば、ゴム・スポンジ・金属・セラミック等の多孔質材料を用いた多孔性部材１６と、その多孔性部材１６と連通し且つ上型１を貫通した貫通孔１７と、その貫通孔１７の経路から離型フィルム４を吸引したり、離型フィルム４と該チップ非装着面１０とが密着するように多孔性部材１６から、例えば、空気（圧縮空気）・窒素ガス・炭酸ガス等の気体を離型フィルム４に対して圧送する気体吸引圧送機構（図示しない）と、上型面３に離型フィルム４を吸引して上型１を貫通した多孔性部材１６の外周囲に位置し且つ任意の箇所にあるフィルム用吸引孔１８と、そのフィルム吸引孔１８の経路と連通して離型フィルム４を吸引するフィルム吸引機構（図示しない）とから構成されている。
なお、気体吸引圧送機構には、気体を圧送する機能（圧送機能）と気体を吸引する機能（吸引機能）との両方の機能を兼ね備えており、圧縮成形で樹脂封止する段階に応じて、適宜に変換して運転したり、停止したりできるように構成されている。
また、前述した気体吸引圧送機構の吸引機能とフィルム吸引機構とは、所定の張力にて張架された離型フィルム４を吸引して上型面３に緊張して被覆できるように連動して動作することができるように構成されている。
【００１４】
また、下型２は、図１に示すように、例えば、リードフレーム７に装着された該チップ装着側を下方向に向けた状態で供給セットできる下型面１９の所定位置にあるセット用凹所２０と、リードフレーム７を凹所２０に供給セットすることで樹脂成形体１２が嵌装セットされて圧縮成形で樹脂封止する前述したキャビティ形成部５と、そのキャビティ形成部５の底面を形成し、且つ、その底面位置が図例におけるキャビティ形成位置Ａ（最上面位置）から樹脂材料を供給する樹脂供給位置Ｂ（最下面位置）まで上下に摺動する摺動部材２１と、キャビティ形成部５に供給される樹脂材料を加熱溶融化する少なくとも下型２（摺動部材２１も含む）に埋設された加熱ヒータ２２（加熱手段）とが設けられている。
なお、摺動部材２１は、下型２から着脱自在に装設することができ、且つ、上下型１・２の型締め時に加熱溶融化された樹脂材料を樹脂供給位置Ｂからキャビティ形成位置Ａの底面位置まで上動して所要圧力で圧縮成形するように構成されている。
また、可動する下型２を型締め・型開きさせるために設けたプレス手段（図示しない）は、任意の水圧・油圧・気体等の作動流体を使用した機構や、電動プレスによる機構によって、下型２（摺動部材２１も含む）が上下に可動するように構成されている。
また、上下型１・２の型締時において、摺動部材２１は、単独で上動して所要圧力で圧縮成形したり（図６参照）、樹脂成形体１２が成形されて硬化して樹脂成形済基板１５が完成後にキャビティ形成位置Ａから樹脂供給位置Ｂへ単独で下動して硬化した樹脂成形体１２から離型したり（図７参照）する上下に摺動することができる、つまりは、単独で上下に摺動部材２１を摺動するのには、前述したプレス手段における任意の機構や任意のシリンダ・モータ・弾性部材等を駆動源とする駆動機構を備えたクランプ手段を設けて構成されている。
従って、上下型１・２の型締め時に、摺動部材２１を単独で上動して圧縮成形における所要圧力により、離型フィルム４と該チップ非装着面１０とを隙間なく確実に密着するように構成されている。
【００１５】
ここで、上下型１・２と離型フィルム４とを用いて、リードフレーム７の樹脂成形体１１を圧縮成形で樹脂封止する方法について、以下に説明する。
【００１６】
まず、図１に示すように、上下型１・２が型開きした状態で、上下型１・２間には、所定の張力にて張架した離型フィルム４が水平状態で保持されており、下型２に装設された摺動部材２１は、樹脂供給位置Ｂで待機する。
【００１７】
次に、図２に示すように、上下型１・２が型開きした状態で、離型フィルム４を上動させ伸張させて上型面３に当接させ、次に、上型面３に当接した離型フィルム４が、上型面３に貫通したフィルム吸引孔１８の経路を経て該フィルム吸引機構から、並びに、上型面３とほぼ同一平面上にある多孔性部材１６の表面から多孔性部材１６の空間形成部を通り貫通孔１７の経路を経て気体圧送吸引機構から、つまりは、その両機構から空気を吸引して所定の張力にて張架された離型フィルム４を上型面３に緊張させて被覆させる。
また、樹脂材料供給機構から、例えば、所要量の顆粒樹脂６（樹脂材料）をキャビティ形成部５の底面における樹脂供給位置Ｂに供給するのは、図１における上型面３に離型フィルム４を緊張させて被覆させる状態から図３におけるリードフレーム７を金型内へ供給するまでに実施するればよく、この場合は、図２の状態で顆粒樹脂６を供給する。
このとき、顆粒樹脂６をキャビティ形成部５へ供給前に、予め加熱ヒータ２２にて金型を顆粒樹脂６が加熱溶融化できるぼぼ所定温度近傍まで加熱しておくことが好ましい。
【００１８】
次に、図３に示すように、上下型１・２が型開きした状態で、且つ、上型面３に離型フィルム４を被覆した状態で、複数個の該チップ８とワイヤ９とを装着したリードフレーム７の該チップ装着側を下方向に向けて下型面１９の所定位置である凹所２０の直上部にリードフレーム７を供給する。
なお、顆粒樹脂６が加熱溶融化できる所定温度に金型を加熱して顆粒樹脂６を加熱溶融化して溶融樹脂１３とするタイミングは、図２におけるキャビティ形成部５に顆粒樹脂６が供給されてから図５における上下型１・２を型締めするまでの間に実施すればよく、この場合は、図３の状態で顆粒樹脂６が溶融樹脂１３となる。
【００１９】
次に、図４に示すように、上下型１・２が型開きした状態で、且つ、上型面３に離型フィルム４を被覆した状態で、下型面１９の所定位置である凹所２０の直上部にあるリードフレーム７を凹所２０に供給セットする。
このとき、凹所２０に供給セットされた樹脂成形前のリードフレーム７における複数個の該チップ８・ワイヤ９と、キャビティ形成部５に供給された所要量の顆粒樹脂６（完全に溶融樹脂１３となるまでの状態を含む）の表面とが、接触しないように、適宜に、キャビティ形成部５の底面（摺動部材２１の天面）における樹脂供給位置Ｂをクランプ手段にて摺動部材２１を単独で上下に駆動させて底面位置を適宜に変更して実施するように構成されている。
【００２０】
次に、図５に示すように、上型面３に離型フィルム４を被覆した状態で、且つ、リードフレーム７を凹所２０に供給セットした状態で、且つ、キャビティ形成部５の底面における樹脂供給位置Ｂに加熱溶融化された顆粒樹脂６を供給した状態で、上下型１・２における上型面３と下型面１９との間に離型フィルム３を狭持して型締めする、つまりは、下型２（摺動部材２１を含む）が上方向にプレス手段にて可動することにより固定された上型１と離型フィルム４を介して型締めするように構成されている。
このとき、図５におけるリードフレーム７の鉛直方向の長さ（厚み）よりも凹所２０における鉛直方向の長さのほうが高く形成されているので、下型面１９とリードフレーム７のフレーム外周部２３とは狭持しないように構成されている。また、図５における上下型１・２の型締め時において、気体圧送吸引機構の吸引機能から圧送機能に変換して貫通孔１７の経路から多孔性部材１６の空間形成部を通して多孔性部材１６の表面を経て気体を圧送することにより、離型フィルム４と該チップ非装着面１０とを密着するように構成されている。
【００２１】
次に、図６に示すように、上下型１・２を型締めした状態で、下型２に装設された摺動部材２１が前述したプレス手段とは別のクランプ手段にて単独でキャビティ形成部５の底面におけるキャビティ形成位置Ａまで上動するのと同時に、キャビティ形成部５の底面を形成する摺動部材２１の天面上に供給された溶融樹脂１３も上昇してキャビティ形成部５内にある複数個の該チップ８とワイヤ９とを浸漬内包してキャビティ形成部５内を所要圧力で圧縮成形する。
このとき、上下型１・２が型締め時に、図５における摺動部材２１が樹脂供給位置Ｂに待機した状態から、図６における摺動部材２１がキャビティ形成位置Ａに到達する状態までの間において、任意のタイミングで多孔性部材１６の表面から気体を常時圧送することも可能であると共に、例えば、リードフレーム７の空隙部１１に溶融樹脂１３が浸漬する直前に瞬時に圧送したりするように、適宜に変更して実施できるように構成されている。
従って、上下型１・２の型締め時に、キャビティ形成部５に嵌装された複数個の該チップ８とワイヤ９とのほぼ直下部から摺動部材２１が上動することで摺動部材２１の天面上にある所要量の溶融樹脂１３も上昇して複数個の該チップ８とワイヤ９とを浸漬内包して所要圧力で圧縮成形するので、電子部品である該チップ８を装着したリードフレーム７の該チップ非装着面１０と離型フィルム４とを隙間なく確実に密着して、該チップ非装着面１０の樹脂ばりやワイヤ不良や過剰な樹脂を使用する樹脂成形上の問題を効率良く解決することができる。
【００２２】
次に、図示していないが、図６の状態のままで、キャビティ形成部５内にある溶融樹脂１３が硬化するのに必要な所要時間経過後に樹脂成形体１２が硬化して硬化樹脂１４を形成して、樹脂成形済基板１５（製品）を完成させる。
【００２３】
次に、図７で示すように、上型面３に離型フィルム４を被覆した状態で、上下型１・２を型開きする、つまりは、離型フィルム４を上型面３に被覆されて固定された上型１から下型２（摺動部材２１を含む）が下方向にプレス手段にて可動することにより型開きすることになる。
また、図７に示すように、下型２に装設された摺動部材２１をキャビティ形成位置Ａから樹脂供給位置Ｂまでクランプ手段にて硬化した樹脂成形体１２の底面と離型するタイミングは、樹脂成形済基板１５が完成してから図８における金型外部へ樹脂成形済基板１５を取出すまでの間に、適宜に実施すればよい。
また、硬化した樹脂成形体１２の底面が摺動部材２１の天面より離型しているから、凹所２０に供給セットされている樹脂成形済基板１５を凹所２０のほぼ直上部に容易に取出すことができる。
このとき、気体圧送吸引機構の圧送機能から吸引機能に変換してフィルム吸引機構と同様に、離型フィルム４を上型面３に吸引して被覆するように構成されている。
【００２４】
次に、図８に示すように、上下型１・２を型開きした状態で、凹所２０のぼぼ直上部にある樹脂成形済基板１５を金型外部へ取出すと共に、上型面に被覆されていた離型フィルム４を気体吸引圧送機構とフィルム吸引機構の吸引機能を停止させて下動させて所定の張力にて張架させて水平状態で待機させる。
【００２５】
次に、図示していないが、使用済の離型フィルム４を上下型１・２間から金型外部へ送り出されて使用前の離型フィルム４が金型内へ供給され、次に、前述した図１から図８までの圧縮成形で樹脂封止する工程を連続して実施することができる。
【００２６】
即ち、電子部品である半導体チップ８を装着したリードフレーム７の半導体チップ非装着面１０と離型フィルム３とを隙間なく確実に密着して、該チップ非装着面１０の樹脂ばりやワイヤ不良や過剰な樹脂を使用する樹脂成形上の問題を効率良く解決することができる、電子部品の樹脂封止成形方法及び装置を提供することができる。
【００２７】
なお、他の実施例として、本実施例で用いた装置を用いて、半導体チップ非装着面１０と離型フィルム３とを隙間なく確実に、より一層密着できるように、供給された離型フィルム４の該チップ非装着面１０側に、例えば、微粘着層を有する離型フィルム４（微粘着フィルム）を形成して実施してもよい。
ここでいう微粘着層とは、リードフレーム７における該チップ非装着面１０と離型フィルム４に形成された微粘着層が、圧縮成形で樹脂封止して樹脂成形済基板５を金型外部へ取出す際に、微粘着層を該チップ非装着面１０に残存しない程度、つまりは、微粘着フィルムから樹脂成形済基板５を容易に剥離することができる程度で形成することになる。
また、本実施例で用いた装置に離型フィルム４から微粘着フィルムへ変更させて圧縮成形で樹脂封止する場合、微粘着フィルムの粘着力を利用することで、図３・図４におけるリードフレーム７を凹所２０に供給セットするのではなく、上型面３に緊張して被覆された微粘着フィルムにリードフレーム７の該チップ非装着面１０を密着させて供給して、樹脂成形済基板１５が完成して図７における上下型１・２の型開き時に、微粘着フィルムが樹脂成形済基板５の該チップ非装着面１０から剥離させるか、或いは、微粘着フィルムと該チップ非装着面１０とが密着した状態で金型外部へ搬送されて、金型外部に設けた微粘着フィルムを剥離する任意の剥離手段を用いて剥離するような構成で実施してもよい。
【００２８】
また、他の実施例として、離型フィルム４を該チップ非装着面１０に被覆させる場合に、リードフレーム７における空隙部１１に離型フィルム４を食い込ませて圧縮成形で樹脂封止して完成される樹脂成形済基板５、つまりは、スタンドオフ形状の樹脂成形済基板５を成形するように実施してもよい。
【００２９】
また、他の実施例として、本実施例で用いたフィルム吸引機構や気体吸引圧送機構においては、離型フィルム４が上型面３に緊張して被覆するのであれば、図例に示すようなフィルム吸引孔１２と多孔性部材２１・貫通孔１７とを組合せた構造・方法に限定されることなく、例えば、フィルム吸引孔１２のみで離型フィルム４を圧送せず吸引するだけで被覆したり、適宜に選択して実施してもよい。
【００３０】
また、他の実施例として、本実施例で用いた装置を用いて、下型面１９の所定位置おける凹所２０を形成せずに、離型フィルム４を介して上型面３と下型面１９との間で、リードフレーム７におけるフレーム外周部２３を狭持するように実施してもよい。
この場合においては、本実施例で用いた装置における下型２の摺動部材２１の外周囲に備えられ、且つ、リードフレーム７のフレーム外周部２３に当接し、且つ、任意の弾性手段を付設された任意の狭持部材を設けることにより、リードフレーム７のフレーム外周部２３を弾性支受して狭持するように実施してもよい。
【００３１】
また、他の実施例として、本実施例で用いた装置における金型においては、固定上型１と可動下型２の金型構造にて説明したが、上下型１・２の両方共が可動するようにしたり、可動上型と固定下型となるように実施してもよい。
【００３２】
また、他の実施例として、本実施例で用いた装置における樹脂材料は、顆粒樹脂６をキャビティ形成部５に供給するように説明したが、例えば、任意の粉状樹脂や樹脂シートを供給するように実施してもよい。
加えて、前述したような樹脂材料をキャビティ形成部５に供給する場合には、樹脂材料が加熱溶融化されて溶融樹脂１３となる際に、ボイド等が発生しないように樹脂材料を供給前と供給後のいずれか一方、或いは、供給前後で任意の押圧手段にて均一に押圧した状態で実施してもよいし、或いは、少なくとも溶融樹脂１３を供給するキャビティ形成部５を強制的に空気等を吸引排出してボイド等を除去する真空成形を併用して実施してもよい。
【００３３】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に変更・選択して採用できるものである。
【００３４】
【発明の効果】
本発明によれば、電子部品である半導体チップを装着したリードフレームの半導体チップ非装着面と離型フィルムとを隙間なく確実に密着して、樹脂成形上の問題を効率良く解決する、電子部品の樹脂封止方法及び装置を提供するという、優れた効果を奏するものである。
【図面の簡単な説明】
【図１】図１は、本発明に係わる樹脂封止装置を概略的に示す概略拡大縦断面図であって、上下型の型開き状態を示す。
【図２】図２は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、上型の金型面に離型フィルムを被覆して樹脂材料を供給した状態を示す。
【図３】図３は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、リードフレームを供給して樹脂材料が加熱溶融化された状態を示す。
【図４】図４は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、リードフレームを下型の金型面に供給セットした状態を示す。
【図５】図５は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、上下型の型締め状態を示す。
【図６】図６は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、上下型を型締めして摺動部材にて圧縮成形で樹脂封止する状態を示す。
【図７】図７は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、上下型を型開きして樹脂成形済基板を金型から離型した状態を示す。
【図８】図８は、図１に対応する前記装置を概略的に示す概略拡大縦断面図であって、樹脂成形済基板を取出す状態を示す。
【符号の説明】
１ 上型
２ 下型
３ 上型面
４ 離型フィルム
５ キャビティ形成部
６ 顆粒樹脂（樹脂材料）
７ リードフレーム
８ 半導体チップ
９ ワイヤ（接続電極）
１０ 半導体チップ非装着面
１１ 空隙部
１２ 樹脂成形体
１３ 溶融樹脂
１４ 硬化樹脂
１５ 樹脂成形済基板（製品）
１６ 多孔性部材
１７ 貫通孔
１８ フィルム吸引孔
１９ 下型面
２０ 凹所
２１ 摺動部材
２２ 加熱ヒータ（加熱手段）
２３ フレーム外周部
Ａ キャビティ形成位置
Ｂ 樹脂供給位置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement in a method and an apparatus for resin-encapsulating an electronic component which is resin-encapsulated via a release film on a lead frame on which a plurality of semiconductor chips as electronic components are mounted.
[0002]
[Prior art]
Conventionally, a semiconductor chip is not mounted on a lead frame on which a plurality of semiconductor chips are mounted by using a resin-sealing molding apparatus for an electronic component on which a resin-sealing mold including a fixed upper mold and a movable lower mold is mounted. Transfer molding is performed in which a resin is injected into a cavity in which a plurality of semiconductor chips are fitted in a state where the surface is covered with a release film.
[0003]
That is, first, a lead frame in which a plurality of semiconductor chips are electrically connected by wires is supplied and set in a setting recess provided at a predetermined position on a lower mold surface with the chip mounting surface side facing downward. Supplying a release film between the upper die surface and the non-semiconductor chip mounting surface, penetrating the upper die surface, sucking the release film from a film suction hole provided in the upper die, and covering the upper die surface. Next, the two molds are clamped, a plurality of the chips and wires are fitted and set in a resin injection cavity provided in the lower mold, and then a resin material supply provided on the lower mold surface is provided. By injecting the molten resin heated and melted from the pot through the resin passage into the cavity and molding a plurality of the chips and wires in the cavity by resin sealing, Lead portion of the chip non-mounting surface of the lead frame Resin-sealed in a state of not forming a molten resin.
Next, after a lapse of time required for the resin molded body formed of the molten resin to cure, the resin molded body and the resin passage are cured to form a cured resin, and the cured resin passage and the resin molding are formed. The resin-sealed portion with the body is integrally molded.
That is, in the prior art, transfer molding, in which molten resin is injected and filled into a cavity in which a plurality of the chips and wires are fitted, and resin sealing is performed in a state where the release film is sucked on the upper mold surface. (For example, see Patent Document 1).
[0004]
[Patent Document 1]
JP 2001-203227 A (Pages 5-6, FIG. 1)
[0005]
[Problems to be solved by the invention]
However, as a trend in recent years, the thickness of the lead frame has become thinner and the shape of the lead frame has become larger, and a large number of semiconductor chips arranged in a matrix on the lead frame have been mounted, and the chip itself has become The size of the wires, which are electrically connected to the chip itself, have become extremely thin and multi-pin.
From the above, the upper and lower molds are clamped in a state where the release film is sucked and covered on the upper mold surface, and the resin is injected into the cavity in which the chip and the wire are fitted by the conventional transfer molding. At this time, the flow of the resin is in the horizontal direction, and the lead frame itself is pressed by the resin pressure due to the resin pressure from the horizontal direction and becomes wavy, so that the release film and the chip non-mounting surface are in contact with each other. Since a gap is generated between the chips and the chip is not completely adhered, there is a problem that the resin flows around the chip non-mounting surface and resin burrs are generated.
In addition, the length (thickness) of the cavity in the vertical direction is also reduced, and the area of the bottom surface of the cavity is increased, so that wire failure such as bending or breakage of the wire due to the resin pressure from the horizontal direction occurs, There was a problem that unfilling failure occurred because the resin did not spread throughout.
Furthermore, the amount of resin used when injecting a plurality of chips and wires fitted into the cavity through the resin passage with resin becomes unnecessary, and the amount of resin in the resin passage portion also needs to be used extra. In addition, in order to improve the adhesion between the resin molded body and the substrate, since a high-density resin material is used, an excessively expensive resin material will be used. Yield will be significantly reduced.
[0006]
In other words, the present invention provides an electronic component that can reliably solve the problem of resin molding by securely adhering a release film to a semiconductor chip non-mounting surface of a lead frame on which a semiconductor chip as an electronic component is mounted, without any gap. It is an object of the present invention to provide a resin sealing molding method and apparatus.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned technical problem, the present invention provides a method for resin-encapsulating and molding an electronic component using a resin-encapsulating mold including an upper die and a lower die. In a state in which the lead portion of the lead frame on which the chip is not mounted in the lead frame on which the chip is mounted is covered with a release film, the upper and lower molds are clamped and resin-sealed with a heat-melted resin material. In the stop molding method, at the time of closing the upper and lower molds, the chip mounting side faces downward at a predetermined position on the mold surface of the lower mold, and the chip non-mounting surface and the upper mold In a state where the lead frame is supplied via the release film between the mold surface and the mold, the plurality of chips are heated and melted in a cavity forming portion provided in the lower mold. Compression molding with the resin material Characterized in that it adhere the release film and the chip non-mounting surface above the required pressure in the compression molding was mentioned reliably without gaps.
[0008]
According to another aspect of the present invention, there is provided a resin sealing molding apparatus for an electronic component, comprising: an upper mold and a lower mold opposed to the upper mold; A release film supply mechanism for supplying a release film covering a lead portion of a chip non-mounting surface of a lead frame in which a plurality of semiconductor chips as electronic components are mounted on a mold surface of the mold; A resin material supply mechanism for supplying a resin material for resin-encapsulating the plurality of chips, a resin-sealing molding apparatus for an electronic component, The lead frame is supplied at a predetermined position on a mold surface with the chip mounting side facing downward and via the release film between the chip non-mounting surface and the upper mold surface. In a state where the plurality of chips Is compression-molded with the heat-melted resin material in the cavity forming portion provided in the lower mold, and the release film and the chip non-mounting surface are securely tightly secured by the required pressure in the compression molding described above. It is characterized in that it adheres closely to.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, description will be made based on the embodiment diagrams in FIGS. 1 to 8.
1 to 8 are views showing a resin molding apparatus according to the present invention.
[0010]
That is, in the resin sealing and molding apparatus for an electronic component according to the present invention, which does not have any pot, plunger, and resin passage portions (cull portion, runner portion, gate portion) provided in the mold structure in the conventional device. As shown in FIG. 1, for example, a resin-sealing-molding mold including an upper mold 1 and a lower mold 2 disposed opposite to the upper mold 1 and a mold surface (upper mold surface 3) of the upper mold 1 are coated. A release film supply mechanism (not shown) for supplying the release film 4 to be stretched between the upper and lower dies 1 and 2 with a predetermined tension, and a resin material (not shown in the present embodiment) for the cavity forming section 5 provided in the lower die 2. In the example, a resin material supply mechanism (not shown) for supplying the granular resin 6 is provided.
[0011]
As shown in FIG. 3, for example, the lead frame 7 used in this embodiment includes a plurality of semiconductor chips 8 arranged at predetermined locations on the lead frame 7 and a lead frame 7 on the chip 8 mounting side. It is formed of wires 9 for electrically connecting the chip 8 and leads (not shown) mounted on the semiconductor chip non-mounting surface 10 on which the chip 8 is not mounted. Is formed horizontally without protruding the lead portion, and a gap 11 penetrating in the vertical direction is formed in the lead frame 7.
[0012]
Accordingly, when the plurality of chips 8 and the wires 9 of the lead frame 7 are closed with the upper and lower molds 1 and 2 and sealed with a resin by compression molding using the above-described apparatus having the upper and lower molds 1 and 2, resin molding is performed. The frame 12 is formed on the chip mounting side that is not resin-sealed and the frame outer peripheral portion 23 is formed, and the resin is immersed also in the gap portion 11, but the resin does not enter the chip non-mounting surface 10. In this manner, the release film 4 is configured to be securely adhered to the mold without any gap.
Further, after forming the resin molded body 12 sealed with the resin by compression molding, after a lapse of a necessary time required for the resin molded body 12 to harden, the molten resin which is a resin material obtained by heating and melting the resin molded body 12 is used. The cured resin 14 is converted from the resin 13, that is, a resin-molded substrate 15 (product), which is the lead frame 7 on which the cured resin molded body 12 is mounted, is completed (see FIG. 8).
[0013]
As shown in FIG. 1, for example, the upper mold 1 is located almost immediately above the mold so as to supply the lead frame 7 to a predetermined position in the mold via the release film 4, and is detachable from the upper mold 1. A porous member 16 which can be attached / detached and is made of a porous material such as rubber, sponge, metal, ceramic or the like, and a through hole 17 which communicates with the porous member 16 and penetrates the upper die 1 Then, the release film 4 is sucked from the path of the through hole 17, or the porous member 16 is supplied with, for example, air (compressed air) / nitrogen from the porous member 16 so that the release film 4 and the chip non-mounting surface 10 are in close contact. A gas suction / pressure feeding mechanism (not shown) for feeding a gas such as a gas or carbon dioxide to the release film 4, and a porous member 16 which sucks the release film 4 to the upper die surface 3 and penetrates the upper die 1. Is located around and outside of And Irumu suction hole 18, is configured from a film suction mechanism (not shown) for sucking the release film 4 in communication with the path of the film suction holes 18.
In addition, the gas suction / pressure feeding mechanism has both the function of feeding the gas (pressure feeding function) and the function of sucking the gas (suction function). Depending on the stage of resin sealing by compression molding, It is configured such that it can be operated or stopped after being appropriately converted.
Further, the suction function of the gas suction / pressure feeding mechanism and the film suction mechanism described above are interlocked so that the release film 4 stretched at a predetermined tension is sucked and the upper mold surface 3 can be tensioned and covered. It is configured to be operable.
[0014]
As shown in FIG. 1, for example, the lower mold 2 is provided with a setting recess at a predetermined position on a lower mold surface 19 which can be supplied and set with the chip mounting side mounted on the lead frame 7 facing downward. Location 20, the above-described cavity forming section 5 in which the resin molded body 12 is fitted and set by supplying and setting the lead frame 7 to the concave section 20 and sealing the resin by compression molding, and the bottom surface of the cavity forming section 5 A sliding member 21 which is formed and slides up and down from a cavity forming position A (top position) in the illustrated example to a resin supply position B (bottom surface position) for supplying a resin material; A heater 22 (heating means) embedded in at least the lower mold 2 (including the sliding member 21) for heating and melting the resin material supplied to the section 5 is provided.
The sliding member 21 can be removably mounted on the lower mold 2, and the resin material heated and melted at the time of clamping the upper and lower molds 1 and 2 is moved from the resin supply position B to the cavity forming position A. And is formed so as to move up to the bottom surface position and perform compression molding at a required pressure.
Pressing means (not shown) provided for closing and opening the movable lower mold 2 is provided by a mechanism using a working fluid such as any hydraulic, hydraulic, or gas, or a mechanism using an electric press. The mold 2 (including the sliding member 21) is configured to move up and down.
Further, when the upper and lower dies 1 and 2 are clamped, the sliding member 21 moves upward alone and is compression-molded at a required pressure (see FIG. 6), or the resin molded body 12 is molded and cured to form a resin. After the molded substrate 15 is completed, it can be individually moved downward from the cavity forming position A to the resin supply position B and released from the cured resin molded body 12 (see FIG. 7), and can slide up and down. In order to independently slide the sliding member 21 up and down, there is provided a clamping means provided with an arbitrary mechanism in the above-described pressing means or a driving mechanism using an arbitrary cylinder, motor, elastic member or the like as a driving source. It is configured.
Therefore, when the upper and lower dies 1 and 2 are clamped, the sliding member 21 is moved up alone to ensure that the release film 4 and the chip non-mounting surface 10 are tightly adhered to each other by the required pressure in the compression molding without any gap. Is configured.
[0015]
Here, a method of resin-sealing the resin molded body 11 of the lead frame 7 by compression molding using the upper and lower dies 1 and 2 and the release film 4 will be described below.
[0016]
First, as shown in FIG. 1, in a state where the upper and lower dies 1 and 2 are opened, a release film 4 stretched with a predetermined tension is held between the upper and lower dies 1 and 2 in a horizontal state. The sliding member 21 mounted on the lower mold 2 waits at the resin supply position B.
[0017]
Next, as shown in FIG. 2, in a state where the upper and lower dies 1 and 2 are opened, the release film 4 is moved up and extended to abut on the upper mold surface 3. The abutting release film 4 passes through the path of the film suction hole 18 penetrating the upper mold surface 3 from the film suction mechanism and from the surface of the porous member 16 which is substantially flush with the upper mold surface 3. The release film 4 stretched at a predetermined tension by suctioning air from the gas pressure feeding and suction mechanism via the path of the through hole 17 through the space forming portion of the porous member 16, that is, by sucking air from both mechanisms, is lifted up. The mold surface 3 is tensioned and coated.
The supply of the required amount of the granular resin 6 (resin material) to the resin supply position B on the bottom surface of the cavity forming portion 5 from the resin material supply mechanism is performed, for example, by the release film 4 on the upper mold surface 3 in FIG. 3 may be performed until the lead frame 7 in FIG. 3 is supplied into the mold. In this case, the granular resin 6 is supplied in the state of FIG.
At this time, before the granular resin 6 is supplied to the cavity forming section 5, it is preferable that the mold is previously heated by the heater 22 to approximately a predetermined temperature at which the granular resin 6 can be heated and melted.
[0018]
Next, as shown in FIG. 3, in a state where the upper and lower molds 1 and 2 are opened, and in a state where the upper mold surface 3 is covered with the release film 4, a plurality of the chips 8 and the wires 9 are connected. With the chip mounting side of the mounted lead frame 7 facing downward, the lead frame 7 is supplied just above the recess 20 which is a predetermined position on the lower mold surface 19.
The timing at which the granular resin 6 is supplied to the cavity forming section 5 in FIG. 5 until the upper and lower dies 1, 2 in FIG. 5 are clamped. In this case, the granular resin 6 becomes the molten resin 13 in the state of FIG.
[0019]
Next, as shown in FIG. 4, in a state where the upper and lower molds 1 and 2 are opened, and in a state where the upper mold surface 3 is covered with the release film 4, a concave portion which is a predetermined position of the lower mold surface 19 is formed. The lead frame 7 located directly above 20 is supplied and set in the recess 20.
At this time, the plurality of chips 8 and wires 9 in the lead frame 7 before resin molding set in the recess 20 and the required amount of granular resin 6 (completely molten resin 13) supplied to the cavity forming portion 5 are formed. The resin supply position B on the bottom surface of the cavity forming portion 5 (the top surface of the sliding member 21) is appropriately adjusted by the clamping means so that the surface of the sliding member 21 does not contact with the surface of the sliding member 21 (including the state until the sliding member 21 is closed). Are independently driven up and down, and the bottom position is appropriately changed.
[0020]
Next, as shown in FIG. 5, in a state where the upper mold surface 3 is covered with the release film 4, and in a state where the lead frame 7 is supplied and set in the recess 20, and at the bottom surface of the cavity forming portion 5. With the granular resin 6 heated and melted supplied to the resin supply position B, the release film 3 is clamped between the upper mold surface 3 and the lower mold surface 19 of the upper and lower molds 1 and 2 to clamp the mold. In other words, the lower mold 2 (including the sliding member 21) is configured to be clamped via the release film 4 and the upper mold 1 fixed by being moved upward by the pressing means. .
At this time, since the vertical length in the recess 20 is formed to be higher than the vertical length (thickness) of the lead frame 7 in FIG. 5, the lower mold surface 19 and the outer peripheral portion of the frame of the lead frame 7 are formed. 23 is not held. Further, when the upper and lower dies 1 and 2 in FIG. 5 are clamped, the suction function of the gas pressure-feeding suction mechanism is changed to the pressure-feeding function, and the porous member 16 is passed through the space of the porous member 16 from the path of the through hole 17. The structure is such that the release film 4 and the chip non-mounting surface 10 are brought into close contact with each other by pumping the gas through the surface.
[0021]
Next, as shown in FIG. 6, in a state where the upper and lower dies 1 and 2 are clamped, the sliding member 21 mounted on the lower die 2 is individually cavity-clamped by a clamp means different from the press means described above. The molten resin 13 supplied on the top surface of the sliding member 21 forming the bottom surface of the cavity forming portion 5 rises simultaneously with the upward movement to the cavity forming position A on the bottom surface of the forming portion 5 and the cavity forming portion 5 A plurality of the chips 8 and the wires 9 inside are immersed and encapsulated, and the inside of the cavity forming portion 5 is compression molded at a required pressure.
At this time, from the state where the sliding member 21 in FIG. 5 waits at the resin supply position B when the upper and lower dies 1 and 2 are closed, from the state where the sliding member 21 reaches the cavity forming position A in FIG. In this case, it is also possible to constantly pump gas from the surface of the porous member 16 at an arbitrary timing, and to instantaneously pump gas immediately before the molten resin 13 is immersed in the void 11 of the lead frame 7. In addition, it is configured to be able to be implemented by being changed appropriately.
Therefore, when the upper and lower dies 1 and 2 are clamped, the sliding member 21 moves upward from almost immediately below the plurality of chips 8 and the wires 9 fitted in the cavity forming portion 5, thereby causing the sliding member 21 to move upward. The required amount of molten resin 13 on the top surface of the lead also rises, and a plurality of the chips 8 and wires 9 are immersed therein and compression-molded at a required pressure. The chip non-mounting surface 10 of the frame 7 and the release film 4 are securely adhered to each other without any gap, and the resin non-burring and wire failure of the chip non-mounting surface 10 and the problem of resin molding using excessive resin are efficiently performed. Can be solved well.
[0022]
Next, although not shown, the resin molded body 12 is cured after a required time required for the molten resin 13 in the cavity forming portion 5 to be cured in the state of FIG. Then, the resin-molded substrate 15 (product) is completed.
[0023]
Next, as shown in FIG. 7, the upper and lower molds 1 and 2 are opened while the upper mold surface 3 is covered with the release film 4, that is, the release film 4 is covered with the upper mold surface 3. The lower die 2 (including the sliding member 21) is moved downward by the pressing means from the upper die 1 fixed by the pressing, so that the die is opened.
Further, as shown in FIG. 7, the timing at which the sliding member 21 mounted on the lower mold 2 is released from the bottom surface of the resin molded body 12 cured from the cavity forming position A to the resin supply position B by the clamp means is released. The process may be appropriately performed between completion of the resin-molded substrate 15 and removal of the resin-molded substrate 15 to the outside of the mold in FIG.
Further, since the bottom surface of the cured resin molded body 12 is separated from the top surface of the sliding member 21, the resin molded substrate 15 supplied and set in the concave portion 20 can be easily placed almost immediately above the concave portion 20. Can be taken out.
At this time, the pressure-feeding function of the gas pressure-feeding suction mechanism is converted into a suction function, and the release film 4 is sucked and covered on the upper mold surface 3 similarly to the film suction mechanism.
[0024]
Next, as shown in FIG. 8, in a state where the upper and lower dies 1 and 2 are opened, the resin-molded substrate 15 immediately above the concave portion 20 is taken out of the mold, and the upper mold surface is covered. The release function of the release film 4 is stopped by stopping the suction function of the gas suction / pressure feeding mechanism and the film suction mechanism, stretched by a predetermined tension, and kept in a horizontal state.
[0025]
Next, although not shown, the used release film 4 is sent out of the mold from between the upper and lower molds 1 and 2 and the release film 4 before use is supplied into the mold. The steps of sealing the resin by the compression molding shown in FIGS. 1 to 8 can be continuously performed.
[0026]
That is, the semiconductor chip non-mounting surface 10 of the lead frame 7 on which the semiconductor chip 8 as an electronic component is mounted and the release film 3 are securely adhered to each other without any gap, and resin burrs and wire defects on the chip non-mounting surface 10 are reduced. It is possible to provide a method and an apparatus for resin-encapsulating and molding electronic components, which can efficiently solve the problem of resin molding using excess resin.
[0027]
As another embodiment, the supplied release film is used so that the semiconductor chip non-mounting surface 10 and the release film 3 can be more securely adhered to each other without any gap by using the apparatus used in this embodiment. For example, a release film 4 (a slight adhesive film) having a slight adhesive layer may be formed on the side of the chip non-mounting surface 10 of the chip 4.
The term "small adhesive layer" as used herein means that the small adhesive layer formed on the chip non-mounting surface 10 of the lead frame 7 and the release film 4 is resin-sealed by compression molding to form the resin-molded substrate 5 outside the mold. When the substrate is taken out, the adhesive layer is formed to such an extent that the adhesive layer does not remain on the chip non-mounting surface 10, that is, to such an extent that the resin molded substrate 5 can be easily peeled off from the adhesive film.
Further, when the device used in this example is changed from the release film 4 to a slightly adhesive film and sealed with a resin by compression molding, the lead in FIGS. 3 and 4 is utilized by utilizing the adhesive force of the slightly adhesive film. Rather than setting the frame 7 in the recess 20, the chip non-mounting surface 10 of the lead frame 7 is supplied in close contact with the slightly adhesive film coated on the upper mold surface 3 with tension, and the resin is molded. When the substrate 15 is completed and the upper and lower dies 1 and 2 in FIG. 7 are opened, the slightly adhesive film is peeled off from the non-chip mounting surface 10 of the resin molded substrate 5, or the slightly adhesive film and the non-chip It may be carried out in a configuration in which the surface 10 is conveyed to the outside of the mold in a state where the surface 10 is in close contact with the mold, and is peeled off by using any peeling means for peeling the slightly adhesive film provided outside the mold.
[0028]
Further, as another embodiment, when the release film 4 is coated on the chip non-mounting surface 10, the release film 4 is cut into the void portion 11 of the lead frame 7, and the resin is sealed by compression molding to complete the process. The resin molded substrate 5 to be formed, that is, the resin molded substrate 5 having a stand-off shape may be formed.
[0029]
Further, as another embodiment, in the film suction mechanism and the gas suction / pressure feeding mechanism used in this embodiment, if the release film 4 covers the upper mold surface 3 by being tensioned, as shown in the example of the drawing. It is not limited to the structure and method in which the film suction hole 12 is combined with the porous member 21 and the through hole 17. For example, the release film 4 may be covered only by suctioning the release film 4 without pressure by using only the film suction hole 12. May be appropriately selected and implemented.
[0030]
As another embodiment, the upper mold surface 3 and the lower mold surface are interposed via the release film 4 without forming the recess 20 at a predetermined position of the lower mold surface 19 using the apparatus used in this embodiment. The embodiment may be implemented such that the outer peripheral portion 23 of the lead frame 7 is held between the surface 19 and the surface 19.
In this case, the elastic member is provided on the outer periphery of the sliding member 21 of the lower mold 2 in the device used in the present embodiment, abuts on the frame outer peripheral portion 23 of the lead frame 7, and is provided with any elastic means. By providing an arbitrary holding member described above, the frame outer peripheral portion 23 of the lead frame 7 may be elastically supported and held.
[0031]
Further, as another embodiment, in the mold in the apparatus used in the present embodiment, the mold structure of the fixed upper mold 1 and the movable lower mold 2 has been described. Or may be carried out so that a movable upper die and a fixed lower die are provided.
[0032]
Further, as another embodiment, the resin material in the apparatus used in the present embodiment has been described to supply the granular resin 6 to the cavity forming section 5, but for example, an arbitrary powdery resin or a resin sheet is supplied. May be implemented as follows.
In addition, when the resin material as described above is supplied to the cavity forming portion 5, when the resin material is heated and melted to form the molten resin 13, the resin material is supplied before the supply so that voids and the like do not occur. Either after the supply, or in a state in which the resin is uniformly pressed by an arbitrary pressing means before and after the supply, or at least the cavity forming part 5 for supplying the molten resin 13 may be forcibly forced into air or the like. , And vacuum forming for removing voids and the like by suction and discharge may be performed in combination.
[0033]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .
[0034]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the semiconductor component non-mounting surface of the lead frame on which the semiconductor chip as the electronic component is mounted and the release film are securely adhered to each other without any gap, and the electronic component is efficiently solved. Which provides an excellent effect of providing a resin sealing method and apparatus.
[Brief description of the drawings]
FIG. 1 is a schematic enlarged longitudinal sectional view schematically showing a resin sealing device according to the present invention, and shows a state in which a vertical die is opened.
FIG. 2 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state in which a mold film of an upper mold is covered with a release film and a resin material is supplied. Show.
FIG. 3 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state where a resin material is heated and melted by supplying a lead frame.
FIG. 4 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state in which a lead frame is supplied and set on a lower mold surface.
FIG. 5 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state in which the upper and lower dies are clamped.
FIG. 6 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state in which the upper and lower dies are clamped, and a resin is sealed by compression molding with a sliding member. Show.
FIG. 7 is a schematic enlarged longitudinal sectional view schematically showing the device corresponding to FIG. 1, showing a state in which the upper and lower molds are opened and the resin-molded substrate is released from the mold; .
8 is a schematic enlarged longitudinal sectional view schematically showing the apparatus corresponding to FIG. 1, showing a state in which a resin-molded substrate is taken out.
[Explanation of symbols]
1 Upper type
2 lower mold
3 Upper mold surface
4 Release film
5 Cavity forming part
6 Granular resin (resin material)
7 Lead frame
8 Semiconductor chip
9 wires (connection electrodes)
10. Semiconductor chip non-mounting surface
11 gap
12 Resin molding
13 molten resin
14 Cured resin
15 Resin molded board (product)
16 Porous members
17 Through hole
18 Film suction hole
19 Lower mold surface
20 recess
21 Sliding member
22 heater (heating means)
23 Outer edge of frame
A Cavity formation position
B Resin supply position

Claims (2)

上型と下型とから成る樹脂封止成形用金型を用いて、電子部品である複数個の半導体チップを装着されたリードフレームにおける該チップ非装着面のリード部を離型フィルムで被覆した状態で、前記上下型を型締めして加熱溶融化された樹脂材料で樹脂封止する電子部品の樹脂封止成形方法であって、
前記した上下型の型締め時において、
前記した下型の金型面の所定位置に該チップ装着側を下方向に向け且つ前記した該チップ非装着面と前記上型の金型面との間にある前記離型フィルムを介して前記リードフレームが供給された状態で、前記した複数個の該チップを前記した下型に備えたキャビティ形成部にある加熱溶融化された樹脂材料で圧縮成形すると共に、前述した圧縮成形における所要圧力により前記した離型フィルムと該チップ非装着面とを隙間なく確実に密着することを特徴とする電子部品の樹脂封止成形方法。Using a mold for resin molding composed of an upper mold and a lower mold, a lead portion of a lead frame on which a plurality of semiconductor chips as electronic components were mounted was covered with a release film on a chip non-mounting surface. In a state, a resin sealing molding method of an electronic component in which the upper and lower molds are mold-closed and resin-encapsulated with a resin material heated and melted,
At the time of closing the upper and lower molds,
The chip mounting side is directed downward at a predetermined position on the lower mold surface and the release film is provided between the chip non-mounting surface and the upper mold surface. While the lead frame is supplied, the plurality of chips are compression-molded with the heat-melted resin material in the cavity forming portion provided in the lower mold, and the pressure required in the compression molding described above. A resin sealing molding method for an electronic component, wherein the release film and the chip non-mounting surface are securely adhered to each other without any gap. 上型と該上型に対向配置した下型とから成る樹脂封止成形用金型と、前記上型の金型面に被覆し且つ電子部品である複数個の半導体チップを装着されたリードフレームにおける該チップ非装着面のリード部を被覆する離型フィルムを供給する離型フィルム供給機構と、前記した複数個の該チップを樹脂封止する樹脂材料を供給する樹脂材料供給機構とを含む電子部品の樹脂封止成形装置であって、
前記した上下型の型締め時において、
前記した下型の金型面の所定位置に該チップ装着側を下方向に向け且つ前記した該チップ非装着面と前記上型の金型面との間にある前記離型フィルムを介して前記リードフレームが供給された状態で、前記した複数個の該チップを前記した下型に備えたキャビティ形成部にある加熱溶融化された樹脂材料で圧縮成形すると共に、前述した圧縮成形における所要圧力により前記した離型フィルムと該チップ非装着面とを隙間なく確実に密着することを特徴とする電子部品の樹脂封止成形装置。A resin-sealing-molding mold including an upper mold and a lower mold opposed to the upper mold, and a lead frame on which the mold surface of the upper mold is covered and on which a plurality of semiconductor chips as electronic components are mounted. An electronic device comprising: a release film supply mechanism for supplying a release film for covering a lead portion of the chip non-mounting surface in the above, and a resin material supply mechanism for supplying a resin material for resin-sealing the plurality of chips. A resin sealing molding device for parts,
At the time of closing the upper and lower molds,
The chip mounting side is directed downward at a predetermined position on the lower mold surface and the release film is provided between the chip non-mounting surface and the upper mold surface. While the lead frame is supplied, the plurality of chips are compression-molded with the heat-melted resin material in the cavity forming portion provided in the lower mold, and the pressure required in the compression molding described above. A resin sealing molding apparatus for an electronic component, wherein the release film and the chip non-mounting surface are securely adhered to each other without any gap.
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