JP2003309137A - Resin sealing and molding method for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a wire 16 electrically connecting an electronic component 4 to a lead from being cut or deformed with satisfactory efficiency by a method wherein when the electronic component 4 mounted on a lead frame 5 by using a resin sealing and molding metal mold composed of a fixed cope 2 and a movable drag 3 is resin-sealed and molded, carbon dioxide gas having affinity and plasticity with respect to a resin is dissolved in a molten resin so as to lower the viscosity of the molten resin. <P>SOLUTION: First, both the fixed cope 2 and the movable drag 3 are clamped, the electronic component is fitted and set inside both an upper cavity 7 and a lower cavity 8, the carbon dioxide gas is pressure-fed and introduced by a carbon-dioxide-gas pressure feed mechanism 18 into at least a pot 11 including a cull 13 in the metal mold, a resin passage 14 and both cavities 7, 8, and the molten resin is injected and filled into both cavities 7, 8. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a resin encapsulation molding method for electronic parts, for example, in which electronic parts such as ICs mounted on a lead frame are encapsulated with a resin material.

[0002]

[Prior art]

Conventionally, the electronic parts mounted on the lead frame have been sealed and molded by a transfer molding method with a thermosetting resin material containing, for example, an epoxy resin. This method is usually carried out as follows, for example, using a metal mold for resin sealing molding of an electronic component including a fixed upper mold and a movable lower mold.

That is, first, both the above-mentioned molds are heated to a predetermined resin molding temperature (for example, 175 ° C.), a resin material is supplied into the pot of the lower mold, and an electron is applied to a predetermined position of the lower mold. The lead frame having the parts mounted thereon is supplied and set, and the two molds are clamped. At this time, the electronic component described above, the lead frame around the electronic component, and the wire that electrically connects the electronic component and the lead are fitted and set in the mold cavity for resin molding. Further, next, the resin material heated and melted in the pot is pressed by a resin pressurizing plunger to be pressed against a resin distribution cull arranged opposite to the pot, and the molten resin is pressed into the mold. By injecting into the mold cavity through a resin passage (for example, a runner and a gate), the electronic component described above and the lead frame around the electronic component are molded into a resin molded body (package) molded in the mold cavity. It is designed to be sealed. Therefore,
After the lapse of the time required for the thermosetting of the molten resin, the molds are opened and the resin molding (product) is ejected from the molds and released.

[0005]

However, in the above-mentioned product, the resin moldability of the above-mentioned product becomes a secondary one because the electrical characteristics ensuring is the highest priority issue, and in the above-mentioned product, voids (air bubbles) or Wire sleep (wire breakage or deformation) often occurred. Further, the generation of voids in the above-mentioned product has been solved by FM forming (vacuum forming), but the above-mentioned wire sleep has not been solved. Therefore, the present invention provides
A commercially available resin material is used to dissolve carbon dioxide gas having a resin affinity and a plasticizing property in a resin material that has been heated and melted to reduce the melt viscosity of the resin, and thus the wire described above. This is a solution to the problem of resin molding called sleep.

That is, when the above-mentioned thermosetting resin material is heated and melted, the melt viscosity of the above-mentioned resin is usually increased during resin molding, so that the fluidity of the resin is poor (low).
Therefore, there is a problem in resin molding such as the wire sleep mentioned above. Therefore, there is an adverse effect that the above-mentioned problems in resin molding cannot be efficiently solved and a product of high quality and high reliability cannot be obtained.

In particular, when a thermosetting resin material is used, the surface layer of the molten resin is more easily cured by the conduction heat from the mold surface as compared with the inside thereof. Therefore, a problem in resin molding such as occurrence of wire sleep due to deterioration of substantial fluidity of the molten resin in the resin passage (due to increase in viscosity of the molten resin) is likely to occur.

Therefore, according to the present invention, by improving the fluidity of the resin (reducing the melt viscosity of the resin), it is possible to efficiently solve the problem of resin molding such as wire sleep, and to obtain high quality and The purpose is to obtain a highly reliable product.

[0009]

SUMMARY OF THE INVENTION A resin encapsulation molding method for an electronic component according to the present invention for solving the above technical problem is provided by using a resin encapsulation molding die for an electronic component. By melting the resin material supplied in the pot by heating and injecting the molten resin into the mold cavity through the resin passage, the electronic parts supplied and set in the mold cavity are resin-sealed. A resin encapsulation molding method, characterized in that a step of introducing carbon dioxide gas into at least the mold pot is performed before the step of injecting the molten resin into the mold cavity.

Further, a method for resin-sealing and molding an electronic component according to the present invention for solving the above-mentioned technical problem is
In the mold cavity, by heating and melting the resin material supplied into the mold pot using the mold for resin sealing molding of electronic parts and injecting the molten resin into the mold cavity through the resin passage. A method for resin encapsulation molding of an electronic component for resin-molding an electronic component set and supplied, wherein carbon dioxide is present in at least the resin passage before performing the step of injecting the molten resin into the mold cavity. It is characterized in that a step of introducing gas is performed.

Further, a method for resin-molding an electronic component according to the present invention for solving the above-mentioned technical problem is
In the mold cavity, by heating and melting the resin material supplied into the mold pot using the mold for resin sealing molding of electronic parts and injecting the molten resin into the mold cavity through the resin passage. In a resin encapsulation molding method of an electronic component for resin-encapsulating an electronic component supplied and set to, before performing a step of injecting the molten resin into the mold cavity, at least the pot and the resin passage The method is characterized in that a step of introducing carbon dioxide gas is performed.

Further, a method for resin-sealing and molding an electronic component according to the present invention for solving the above-mentioned technical problem is
In the mold cavity, by heating and melting the resin material supplied into the mold pot using the mold for resin sealing molding of electronic parts and injecting the molten resin into the mold cavity through the resin passage. A resin encapsulation molding method for an electronic component, in which an electronic component supplied and set in a resin is molded by a resin, wherein the mold pot / resin passage is formed before the step of injecting the molten resin into the mold cavity is performed. -Characterized by performing a step of introducing carbon dioxide gas into the resin contact portion of the mold including the mold cavity.

Further, a method for resin-molding and molding an electronic component according to the present invention for solving the above-mentioned technical problem is
Before introducing the carbon dioxide gas, a vacuuming step of exhausting at least the inside of the mold pot is performed.

Further, a method for resin-sealing and molding an electronic component according to the present invention for solving the above-mentioned technical problem is
Before introducing the carbon dioxide gas, a vacuuming step of exhausting the inside of the mold-constituting space including at least the mold pot, the resin passage, and the mold cavity is performed.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, according to the present invention, first, in a resin encapsulation molding die for an electronic component, carbon dioxide gas is separately provided in the resin material supply portion and the resin molding portion inside the die. Carbon dioxide gas is pumped (introduced) by the pumping mechanism
Then, the resin material heated and melted by the resin material supply section is transferred to the resin molding section to resin-mold the electronic component. Further, the resin material supply unit corresponds to a pot (plunger) containing cull in the mold, and the resin molding unit corresponds to a resin passage and a cavity in the mold. Therefore, the resin material supply unit and the resin molding unit according to the present invention will be separately described.

That is, regarding the above-mentioned resin material supply section,
First, carbon dioxide gas is dissolved in at least the surface layer side of the resin material (resin tablet) in the softened and swollen state in the pot, and then, in this state, the resin material is pressed against the cull by the plunger. At this time, carbon dioxide gas can be mixed with the above-mentioned molten resin, and at least the carbon dioxide gas can be dissolved in the molten resin transferred to the resin passage side. Therefore, next, by pouring and filling the molten resin into the mold cavity through the resin passage, the electronic component on the lead frame is resin-sealed in the resin molded body corresponding to the shape of the mold cavity. be able to. That is, since the molten resin can be made to have a low viscosity by dissolving carbon dioxide gas in the molten resin, the fluidity of the resin can be improved, and at the same time, in the mold cavity, the wire It is possible to efficiently solve the problem of resin molding called disconnection or deformation (wire sleep). Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

Further, in the above-mentioned resin molding portion, since the inside of the resin passage or the inside of the mold cavity is in the carbon dioxide gas atmosphere, the carbon dioxide gas can be dissolved in the surface layer of the molten resin, and the molten resin can be dissolved. The viscosity of the resin can be reduced, and the fluidity of the resin can be improved.
That is, the pressure applied to the resin transferred into the mold cavity through the resin passage can be lowered, and the wire can be efficiently prevented from being broken or deformed. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

That is, according to the present invention, first, the carbon dioxide gas is mixed with the molten resin in the pot containing the cull, and then the surface layer of the molten resin is formed in the resin passage or the mold cavity. Since the carbon dioxide gas can be dissolved, the viscosity of the molten resin can be further reduced. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

In particular, when a thermosetting resin material is used, the surface layer of the molten resin is cured from the inside by conduction heat from the mold and the like, and the viscosity of the surface layer of the molten resin is increased. Is likely to be high. However, the present invention is a configuration that can dissolve the carbon dioxide gas in the surface layer of the molten resin to reduce the viscosity of the surface layer,
It is possible to reduce the viscosity of the surface layer that has been cured as described above, and it is possible to reduce the substantial viscosity of the entire molten resin, thereby improving the fluidity of the resin. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

[0020]

Embodiments will be described below with reference to the drawings.

First, a first embodiment will be described with reference to FIGS. 1, 2 and 3. That is, the resin encapsulation molding die of the electronic component shown in FIGS. 1, 2, and 3 is composed of a fixed upper die 2 and a movable lower die 3, and the lower die 3 has an electronic surface. Part 4
There is provided a setting recess 6 for supplying and setting the lead frame 5 on which is mounted. Further, upper and lower cavities 7 and 8 for resin molding are provided opposite to the mold surfaces of the above-mentioned molds 2 and 3, and heating means 9 and 10 such as a heater are provided in the above-mentioned molds 2 and 3, respectively. It is provided separately. Further, a pot 11 for supplying a thermosetting resin material R is arranged on the mold surface of the lower mold 3, and a plunger 12 for resin pressurization is fitted in the pot 11 so as to be vertically slidable. It is equipped and configured. Further, in the upper mold 2, a resin distribution cull 13 is provided at a position corresponding to the lower mold pot 11, and a resin for transferring a molten resin between the cull 13 and the upper cavity 7. Resin passage 14 for transfer
(Eg, runners and gates). The upper cavity 7 is provided with an air vent 15 for communicating air between the upper and lower cavities 7 and 8 and the outside of the mold when the molds 2 and 3 are clamped. Further, in both the molds 2 and 3, at least the pot 11, the resin passage 14, and the upper and lower cavities 7 and 8 come into contact with the molten resin to form a resin contact portion of the mold. The electronic component 4 and the lead (lead frame 5) described above are electrically connected by a wire 16.

That is, by supplying and setting the lead frame 5 to the setting recess 6 and clamping the molds 2 and 3, the lead frame 5 is placed on the lead frame 5 in the upper and lower cavities 7 and 8. The electronic component 4 and the lead frame 5 and the wire 16 around the electronic component 4 can be fitted and set, and the inside of the upper and lower cavities 7 and 8 and the pot 11 are the cull 13 and the resin passage. 1
It is configured so that a communication connection can be made through In addition, by clamping the molds 2 and 3, the pot 1
The resin material that is heated and melted in
The molten resin can be injected into the upper and lower cavities 7 and 8 by pressurizing. In addition, in the upper and lower cavities 7 and 8 described above, the electronic component 4 on the lead frame 5 and the lead frame 5 and the wire 16 around the lead frame 5 are molded by resin corresponding to the shapes of the upper and lower cavities 7 and 8. It is configured so that it can be resin-sealed and molded in the body.

Further, as shown in FIGS. 1, 2, and 3, the above-mentioned mold is provided with a carbon dioxide gas pressure-feeding mechanism 18 for pressure-feeding carbon dioxide gas (carbon dioxide gas: CO ₂ gas). The inside of the die (three places) and the carbon dioxide gas pressure feed mechanism 18 are configured to communicate with each other through a pressure feed path 19 such as a pressure feed pipe. That is, in the illustrated example, the discharge port of the pressure feeding path 19 in the above-mentioned mold is provided separately on the cull 13 side, the resin passage 14 side, and the upper cavity 7 side, respectively. . Therefore, when the two molds 2 and 3 are clamped, the carbon dioxide gas pressure feeding mechanism 18 causes the pot to pass through the space inside the mold, that is, inside the cull 13 and mainly through the cull 13. 11, carbon dioxide gas can be pumped into the resin passage 14 or into the upper and lower cavities 7 and 8. The pot 11, the resin passage 14, and the mold cavities 7 and 8 constitute a resin contact portion of the mold.

That is, in the first embodiment shown in FIG. 1, FIG. 2, and FIG. 3, first, the heating means 9 for both the molds 2 and 3 is first described.
Heating at 10 to a predetermined resin molding temperature (for example, 175 ° C.), fitting and setting the lead frame 5 in the setting recess 6 and setting the resin material R (the resin in the example shown in the drawing) in the pot 11 Both types 2 by supplying tablets)
・ Clamp 3 At this time, the electronic component 4 and the lead frame 5 and the wire 16 around the electronic component 4 are fitted and set in the upper and lower cavities 7 and 8. Further, at this time, the resin tablet R is gradually softened and swelled in the pot 11 by being heated by the radiant heat or the conductive heat from the inner wall of the pot 11 described above ( (See FIG. 3). Further, next, the carbon dioxide gas pressure feeding mechanism 1 described above is used.
At 8, carbon dioxide gas is pumped and introduced into the space inside the mold. At this time, carbon dioxide gas should be filled into the cull 13, mainly through the cull 13, into the pot 11, further into the resin passage 14, or into the upper and lower cavities 7 and 8. You can In addition, next, the resin material softened and swelled in the pot 1 and heated and melted is pressed by the plunger 12 and pressed against the cull 13. Molten resin is injected into the cavities 7 and 8 to fill the upper and lower cavities 7 and 8.
The electronic component 4 on the lead frame 5 and the lead frame 5 and the wire 16 around the lead frame 5 can be resin-molded in a resin molded body corresponding to the shapes of the upper and lower cavities 7 and 8 described above. . Therefore, after the lapse of the time required for the thermosetting of the molten resin, both the molds 2 and 3 are opened, and the resin molded body (product) is ejected from the molds 2 and 3 and released. You can

The inventor of the present invention has shown that carbon dioxide gas has an affinity and a plasticizing property for a resin,
The present invention has been completed by finding that the (melting) viscosity of the molten resin can be reduced by dissolving carbon dioxide gas in the molten resin.
That is, by dissolving the carbon dioxide gas in the molten resin, the viscosity of the molten resin can be lowered, so that the fluidity of the molten resin becomes good. Further, by dissolving the carbon dioxide gas in the surface layer of the molten resin, the surface layer can be reduced in viscosity to exhibit the action of lubricating oil, so that the substantial viscosity of the entire molten resin is lowered. Can be made. It is to be noted that, by lowering the viscosity of the molten resin and improving the wettability of the resin with respect to the mold surface (contact surface with the resin), the shape transferability of the molten resin is improved.

Further, particularly when a thermosetting resin material is used, conduction from the mold surface (contact surface with resin) such as the inner wall surface of the resin passage 14 and the inner wall surfaces of the upper and lower cavities 7 and 8 described above. By heating the molten resin with heat or the like, the surface layer of the molten resin is easily cured, and the viscosity of the surface layer tends to increase. In this case,
By allowing the molten resin to exist in a carbon dioxide gas atmosphere, carbon dioxide gas can be dissolved in the surface layer of the molten resin, so that the viscosity of the surface layer can be reduced and the molten resin as a whole. The substantial viscosity of can be reduced. Therefore, carbon dioxide gas exerts a remarkable effect as a plasticizer on the thermosetting resin material.

Further, there is the following reason for the action of the carbon dioxide gas as a plasticizer. That is, it is speculated that the (melting) viscosity of the molten resin is caused by the frictional resistance force generated between the molecular chains of the polymer in the molten resin, but the carbon dioxide gas is, for example, the molecular chain of the polymer in the molten resin. The friction resistance between the molecular chains can be reduced by entering the gap between them and acting as a roller against the molecular chains, thus reducing the viscosity of the molten resin. It is presumed that it is possible.

Further, in the first embodiment, there are two routes, a route to the resin material supply unit and a route to the resin molding unit, as the system for pressure-feeding the carbon dioxide gas into the mold. The resin material supply unit described above is
Corresponding to the pot 11, and the resin molding portion corresponds to the resin passage 14 and the upper and lower cavities 7 and 8. Therefore, the action and effect of carbon dioxide gas in the resin material supply section and the resin molding section will be described separately.

That is, in the resin material supply section in the above-mentioned first embodiment, since at least the inside of the pot 11 is in the atmosphere of the carbon dioxide gas, at least the resin tablet R in the softened and swollen state inside the pot 11 is present. Carbon dioxide gas can be dissolved in the surface layer of (resin material). Further, in this state, the softened and swollen resin material is pressed against the cull 13 by the plunger 12, whereby carbon dioxide gas can be mixed with the molten resin in the pot 11 including the cull 13. That is, carbon dioxide gas can be dissolved in at least the molten resin transferred to the resin passage 14 side. Therefore, since carbon dioxide gas acts as a plasticizer on the molten resin, the melt viscosity of the molten resin can be lowered. Further, the fluidity of the resin can be improved, and the wire 16 can be efficiently prevented from being broken or deformed. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

Further, in the resin molding portion in the above-described first embodiment, at least the inside of the resin passage 14 or both of the upper and lower cavities 7 and 8 are in the atmosphere of the carbon dioxide gas, so that inside the resin passage 14 described above. The carbon dioxide gas can be dissolved in the surface layer of the molten resin that is transferred, or in the surface layers of the molten resin that is injected and filled into the upper and lower cavities 7 and 8, and the substantial viscosity of the entire molten resin can be obtained. Can be reduced. That is, since the substantial viscosity of the entire molten resin injected into the upper and lower cavities 7 and 8 through the resin passage 14 can be reduced, the resin in the resin passage 14 and the upper and lower cavities 7 and 8 can be reduced. It is possible to improve the fluidity and efficiently prevent the wire 16 from being broken or deformed. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

Further, in particular, when a thermosetting resin material is used, the resin passage 14 described above is generated by conduction heat from the inner wall surface of the resin passage 14 or the wall surface without the upper and lower cavities 7 and 8 described above. Also, the surface layer of the molten resin flowing in both the upper and lower cavities 7 and 8 is more likely to be hardened than the inside of the molten resin to increase the viscosity. However, since carbon dioxide gas can be dissolved in the surface layer of the molten resin, the substantial viscosity of the entire molten resin flowing in the resin passage 14 and the upper and lower cavities 7 and 8 can be reduced. In addition, the wire 16 can be efficiently prevented from being broken or deformed. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

Further, as described above, the function and effect of carbon dioxide gas in the resin material supply section and the resin molding section have been described separately, but the carbon dioxide gas in the resin material supply section and the resin molding section has been described. A configuration in which the effects of the above are continuously used together will be described. That is, first, in the pot 11, the viscosity of the molten resin is lowered by mixing carbon dioxide gas with the molten resin, and further, in the resin passage 14 and the upper and lower cavities 7 and 8 respectively. Separately, carbon dioxide gas can be dissolved in the surface layer of the molten resin to further reduce the viscosity of the molten resin. Therefore, it is possible to efficiently solve the resin molding problem of breaking or deforming the wire 16 described above, and obtain a product of high quality and high reliability.

By lowering the viscosity of the molten resin injected and filled in the upper and lower cavities 7 and 8, the wetting of the resin on the inner wall surfaces of the upper and lower cavities 7 and 8 can be improved and the shape of the resin can be improved. Transferability can be improved. Therefore, the shapes of the upper and lower cavities 7 and 8 can be efficiently transferred to the resin moldings molded in the upper and lower cavities 7 and 8. That is, it is possible to efficiently prevent the occurrence of a defect portion outside the resin molded body that is resin-sealed and molded in the upper and lower cavities 7 and 8 in accordance with the shapes of the upper and lower cavities 7 and 8. it can. Therefore, the above-mentioned problems in resin molding can be efficiently solved, and a product of high quality and high reliability can be obtained.

Further, in the first embodiment, as shown in FIG. 3, when the molds 2 and 3 are clamped, both the pot 11 side including the cull 13 and the upper and lower cavities including the resin passage 14 are closed. A configuration may be adopted in which the blocking member 30 for blocking the 7 and 8 sides is provided in the resin passage 14 so as to be vertically slidable. That is, the blocking member 30 sets the inside of the pot 11 containing the cull 13 to the outside air blocking state with the outside, and sends the carbon dioxide gas into the pot 11 containing the outside air blocking state cull 13 under pressure. The configuration may be adopted. Before the carbon dioxide gas is pressure-fed, a vacuuming step may be performed to forcibly discharge the air and the like in the space portion set to the outside air blocking state by the blocking member 30.

Next, a second embodiment will be described with reference to FIG. In the mold shown in FIG. 4, the same mold constituent members as those in the molds shown in FIGS. 1 and 2 are designated by the same reference numerals.

That is, the resin encapsulation molding die of the electronic component shown in FIG. 4 is composed of a fixed upper die 21 and a movable lower die 22, and the above-mentioned die 21 and 22 are provided with the electronic component 4. The set recess 6 for supplying and setting the mounted lead frame 5, upper and lower cavities 7.8, lower mold pot 11, plunger 12, upper mold cull 13, resin passage 14 (runner gate), air vent 15, heating means ( (Not shown) and the like are provided. In addition, a seal member 23 is arranged on the mold surface of the upper mold 21 so as to surround the outer periphery of the cull 13, the resin passage 14, the upper cavity 7, and the air vent 15, and the both molds 21. When the mold 22 is clamped, at least the pot 11 including the cull 13, the resin passage 14, and the mold-constituting space portion including the upper and lower cavities 7 and 8 can be closed to the outside air. In addition, in the required parts of both the molds 21 and 22,
A seal member is appropriately provided and configured so as to bring at least the mold-constituting space into a state where the outside air is shut off. Further, a carbon dioxide gas pressure feeding mechanism 18 for feeding carbon dioxide gas and a vacuum evacuation mechanism 24 (pressure reducing mechanism) for forcibly sucking and discharging air etc. are attached to the mold via a switching valve 25. In addition, in the example shown in FIG. 4, the switching valve 25 is provided with a path 26 such as a pipe that connects the upper cavity 7, the cull 13, and the resin passage 14 to each other.

Therefore, as shown in FIG. 4, first, the lead frame 5 having the electronic component 4 mounted thereon is supplied and set in the setting recess 6 of the lower mold 22, and the pot 1 is also set.
A thermosetting resin material R is supplied into the inside of 1. Next, the lower mold 22 is moved upward to bring the mold surface of the lower mold 22 into contact with the seal member 23 of the upper mold 21, so that both molds 21.
Intermediate mold clamping is performed to clamp the second mold surface at a required interval 27. At this time, the pot 1 including the cull 13 and a space 28 between the mold surfaces formed between the mold surfaces of the molds 21 and 22.
1. A space formed by the resin passage 14 and the upper and lower cavities 7 and 8 becomes an outside air cutoff state, and an outside air cutoff range 2
9 will be formed. Further, next, the lower mold 22 is moved upward to completely clamp the both molds 21 and 22. Further, after the outside air cutoff range 29 is formed (between the intermediate mold clamping and the complete mold clamping), the outside air cutoff range 29 of the above described outside air blocking range 29 is passed through the path 26 and the switching valve 25 in the vacuuming mechanism 24. By forcibly discharging air or the like, the outside air cutoff range 29 is set to a predetermined vacuum degree. Next, by switching the switching valve 25, carbon dioxide gas is pressure-fed / introduced into the outside air cut-off range 29 of the predetermined vacuum degree from the pressure feed mechanism 18 through the above-mentioned path 26, and the outside air cut-off range 29 is reached. Fill with carbon dioxide gas. Next, the molten resin is heated and melted in the pot 11 by the plunger 12 to inject the molten resin into the upper and lower cavities 7 and 8 through the cull 13 and the resin passage 14. You can Therefore, the electronic component 4 and the lead frame 5 and the wire 16 around the electronic component 4 can be sealed in the resin molded body corresponding to the shapes of the upper and lower cavities 7 and 8 in the upper and lower cavities 7 and 8. it can.

That is, by virtue of the construction as described above, the viscosity of the molten resin transferred in the resin passage 14 can be reduced and the fluidity of the resin can be improved, as in the above-mentioned embodiment. Therefore, it is possible to efficiently prevent the wire 16 from being cut or deformed. Therefore, it is possible to efficiently solve the resin molding problem described above and obtain a product of high quality and high reliability.

In each of the above embodiments, first,
The inside of the pot 11 containing the cull 13 is set in a carbon dioxide gas atmosphere, and then the resin material to be heated and melted in the pot 1 is forcibly stirred by a mixing and stirring means such as a mixer to melt the resin material. You may employ | adopt the structure which mixes carbon dioxide gas with resin. For example, in FIG. 3, first, the inside of the pot 11 including at least the cull 13 is set to the outside air shut state by the shutoff member 30 and the air or the like in the outside air shutoff space is forcibly discharged to obtain a predetermined vacuum degree. Then, a configuration in which carbon dioxide gas is introduced into the outside air blocking space and the molten resin is stirred in the pot 11 can be adopted. In this case, since the viscosity of the molten resin can be lowered and the fluidity of the resin can be improved, the above-mentioned problems in resin molding can be efficiently solved, and high quality and high quality can be achieved. You can get reliable products.

In each of the above-described embodiments, the metal mold provided with the pot in the lower mold is used for explanation, but the present invention can employ the metal mold provided with the pot in the upper mold.

Next, a third embodiment will be described with reference to FIG. That is, the present embodiment has a configuration in which carbon dioxide gas is used as a plasticizer when a resin is injected and filled in the gap between the substrate and the chip in the flip chip. For example, as shown in FIG. 5, in a flip chip in which a bump electrode 42 side of a chip 41 such as an IC is connected to a circuit board 43, first, at least a carbon dioxide gas is introduced into a flow range 44 in which a molten resin flows. The flow range 44 is set to a carbon dioxide gas atmosphere from a pressure feed mechanism 45 through a path 46 such as a pipe, and then a molten resin is injected and filled into the gap 47 between the substrate 43 and the chip 41 in the carbon dioxide gas atmosphere. (The flow of resin is indicated by the arrow 48) to form a product (flip chip). That is, it is possible to reduce the viscosity of the molten resin described above and improve the fluidity of the resin, and the chip 4 in the gap 47 described above.
Since it is possible to improve the wettability of the resin between the surface 1 and the surface of the substrate 43 (contact surface with the resin), the chip 41 and the substrate 43 made of the resin filled in the gap 47 described above.
Adhesiveness with can be improved (strong). Therefore, since it is configured as described above, it is possible to reduce the viscosity of the molten resin described above and improve the fluidity of the resin, as in each of the above-described examples, so that the molten resin does not enter the gap. Can be efficiently injected and filled, and a product of high quality and high reliability can be obtained.

Regarding the method of injecting and filling the gap 47 between the substrate 43 and the chip 41 in the flip chip described above, for example, by a transfer molding method, the gap 47 is forcibly injected and filled, or
There is a configuration in which the gap 47 is naturally injected and filled by the potting method.

Further, in each of the above-mentioned embodiments, the thermosetting resin material is used for description, but in each of the above-mentioned embodiments, a thermoplastic resin material can be used. Also,
In each of the embodiments described above, a powdery resin material, a granular resin material, or a resin tablet can be adopted.
Further, in each of the above-described embodiments, a metal lead frame has been described as an example, but in each of the above-described embodiments, a plastic substrate on which electronic components are mounted may be adopted.

The present invention is not limited to the above-mentioned embodiments, and within the scope of the present invention,
It can be arbitrarily and appropriately changed / selected and adopted as needed.

Further, the carbon dioxide gas acts on the molten resin as a plasticizer, whereby the glass transition point (glass transition temperature) Tg of the resin is lowered, and the resin molding temperature can be lowered. Therefore, the electronic component mounted on the lead frame can be resin-sealed at a lower resin molding temperature than the conventional resin molding temperature.

[0046]

According to the present invention, by improving the fluidity of the resin, the problem of resin molding called wire sleep can be efficiently solved and a product of high quality and high reliability can be obtained. It has an excellent effect that it can be achieved.

[Brief description of drawings]

FIG. 1 is a partially cutaway vertical cross-sectional view showing a resin sealing molding die of an electronic component used in a resin sealing molding method according to the present invention, showing a die opened state. ing.

FIG. 2 is a partially cutaway vertical sectional view showing a mold corresponding to FIG. 1, showing a mold clamped state of the mold.

FIG. 3 is a partially cutaway enlarged vertical cross-sectional view showing an enlarged main part of the mold corresponding to FIG.

FIG. 4 is a schematic vertical cross-sectional view schematically showing a mold for resin sealing molding of an electronic component used in another resin sealing molding method according to the present invention.

FIG. 5 is a schematic front view schematically showing a flip chip before filling, which is used in a method of filling a gap in a flip chip according to another embodiment of the present invention.

[Explanation of symbols]

2 fixed upper mold 3 movable lower mold 4 electronic components 5 lead frame 6 sets of recesses 7 Upper cavity 8 lower cavity 9 Heating means 10 Heating means 11 pots 12 Plunger 13 Cal 14 resin passage 15 Air vent 16 wires 18 Carbon dioxide gas pressure feeding mechanism 19 Pumping route 21 Fixed upper mold 22 Movable lower mold 23 Seal member 24 Vacuuming mechanism 25 switching valve 26 routes 27 intervals 28 Mold surface space 29 Outside air cutoff range 30 Blocking member 41 chips 42 bump 43 substrate 44 Flow range 45 Carbon dioxide gas pressure feed mechanism 46 routes 47 Gap 48 Resin flow R resin material

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4F206 AH37 AM32 JA02 JB12 JB17                       JE30 JM02 JM04 JM16 JN26                       JN27                 5F061 AA01 BA01 CA21 DA03 DA04                       DA06 DA07 DA08

Claims (6)

[Claims] 1. A resin material supplied into a mold pot is heated and melted by using a mold for resin sealing molding of electronic parts, and the molten resin is injected into a mold cavity through a resin passage, A resin encapsulation molding method for an electronic component, comprising resin-encapsulating an electronic component supplied and set in the mold cavity, wherein at least the metal is molded before performing a step of injecting the molten resin into the mold cavity. A resin encapsulation molding method for an electronic component, which comprises performing a step of introducing carbon dioxide gas into a mold pot. 2. A resin material supplied into a mold pot is heated and melted by using a mold for resin sealing molding of electronic parts, and the molten resin is injected into a mold cavity through a resin passage, A resin encapsulation molding method for an electronic component, wherein the electronic component supplied and set in the mold cavity is resin-encapsulated, wherein at least the resin is formed before performing the step of injecting the molten resin into the mold cavity. A resin encapsulation molding method for an electronic component, comprising the step of introducing carbon dioxide gas into the passage. 3. A resin material supplied into a mold pot is heated and melted by using a mold for resin sealing molding of electronic parts, and the molten resin is injected into a mold cavity through a resin passage, A resin encapsulation molding method for an electronic component, wherein the electronic component supplied and set in the mold cavity is resin-encapsulated, wherein at least the above-mentioned method is performed before performing a step of injecting the molten resin into the mold cavity. A resin encapsulation molding method for an electronic component, comprising a step of introducing carbon dioxide gas into a pot and a resin passage. 4. A resin material supplied into a mold pot is heated and melted by using a mold for resin sealing molding of electronic parts, and the molten resin is injected into the mold cavity through a resin passage, A resin encapsulation molding method for an electronic component, wherein an electronic component supplied and set in the mold cavity is resin-encapsulated, wherein the above-mentioned metal is molded before performing a step of injecting the molten resin into the mold cavity. A resin encapsulation molding method for an electronic component, which comprises performing a step of introducing carbon dioxide gas into a resin contact portion of a mold including a mold pot, a resin passage, and a mold cavity. 5. The resin encapsulation molding method for an electronic component according to claim 1, further comprising a vacuuming step of exhausting at least the inside of the mold pot before introducing the carbon dioxide gas. 6. The method of claim 1, wherein before the carbon dioxide gas is introduced, a vacuuming step is performed to exhaust the inside of the mold-constituting space portion including at least the mold pot, the resin passage, and the mold cavity. The resin encapsulation molding method for an electronic component according to claim 2, or claim 3, or claim 4.