JP2003243162A - Manufacturing method and manufacturing apparatus for electro-optical device, electro-optical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of an electro-optic device which can laminate together a substrate and a sealing member in a desired state even if the substrate and the sealing member are undulated or slanted. <P>SOLUTION: The manufacturing device of an organic EL device equipped with a substrate 1 and a sealing substrate 2 is provided with an embrocation unit 31 capable of placing an adhesive 21 on a region R where the substrate 1 and the sealing substrate 2 are laminated together, a stage ST2 supporting the substrate 1, and a crimping device 50 which crimps and bond the sealing substrate 2 to the substrate 1 supported by the stage ST2 with a given force while swingably holding the sealing substrate 2. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus having the electro-optical device, and more particularly to an electro-optical device including a light emitting element such as an organic EL element. The present invention relates to a manufacturing method and manufacturing apparatus, an electro-optical device, and an electronic device.

[0002]

2. Description of the Related Art Conventionally, in electro-optical devices such as liquid crystal devices and organic EL (electroluminescence) devices, a plurality of circuit elements, electrodes,
Some have a structure in which liquid crystal or EL elements are laminated. For example, an organic EL device has a light emitting element in which a light emitting layer containing a light emitting substance is sandwiched between electrode layers of an anode and a cathode, and holes injected from the anode side and electrons injected from the cathode side are included. The phenomenon of emitting light when recombination between and in the light-emitting layer having light-emitting ability and when the excited state is collapsed is used.

[0003]

However, the above-mentioned conventional electro-optical device has the following problems. Since the organic EL device having the above-described configuration includes the current-driven light emitting element, a current must be passed between the anode and the cathode when emitting light. As a result, the element generates heat during light emission, and when oxygen or moisture is present around the element, oxidation of the element constituent material due to the oxygen or moisture is promoted to deteriorate the element. In particular, the alkali metal or alkaline earth metal used for the cathode has the property of being easily oxidized. The typical deterioration of the device due to oxidation and water is the generation and growth of dark spots. The dark spot is a light emission defect point. Then, as the deterioration of the light emitting element progresses along with the driving of the organic EL device, the emission brightness decreases, the light emission becomes unstable, and the like.
There is a problem that stability with time is low and life is short.

Therefore, as an example of a measure for suppressing the above deterioration, the substrate on which the light emitting element is arranged and the sealing member are integrated with each other with an adhesive, and the substrate, the sealing member and the adhesive are formed. There is known a technique of arranging a light emitting element in a closed space to shield the atmosphere from the atmosphere. However, when the size of the substrate is increased, when the substrate and the sealing member are attached to each other, it may not be possible to attach them accurately with each other due to the waviness of the substrate and a thickness error. In particular, when bonding with an adhesive, the sealing member may be tilted with respect to the substrate and may not be bonded in a desired state.

The present invention has been made in view of the above circumstances. When the substrate and the sealing member are attached to each other, the substrate and the sealing member have undulations or the sealing member is inclined with respect to the substrate. It is an object of the present invention to provide an electro-optical device manufacturing method and a manufacturing apparatus, an electro-optical device, and an electronic apparatus including the electro-optical device that can be bonded to each other even in a desired state.

[0006]

In order to solve the above problems, in the method of manufacturing an electro-optical device of the present invention, a light emitting element disposed on a first member and the first member are bonded together. In a method of manufacturing an electro-optical device including a second member, a first step of arranging an adhesive in a bonding area where the first member and the second member are bonded, and the first step. And a second step of bonding the first member and the second member while swingably supporting at least one of the member and the second member.

According to the present invention, when the first member and the second member are attached to each other via the adhesive, at least one of the first member and the second member is swingably supported. Since they are bonded together, the bonding area of the first member or the second member has undulations or irregularities, or the second member is inclined with respect to the first member. Even in such a case, the first member or the second member bonded by the adhesive agent can cancel the undulation or inclination by swinging. Therefore, the first member and the second member are bonded together with a uniform adhesive thickness, and good adhesiveness is obtained. Since the first member and the second member are bonded together in a desired state, a high sealing property can be obtained, and an electro-optical device that exhibits the desired performance by preventing deterioration of the light emitting element is manufactured. it can.

In the method of manufacturing an electro-optical device according to the present invention, the second step has a structure including a step of pressing the first member and the second member with a predetermined force. It Thereby, the thickness of the adhesive can be adjusted.

Further, in the method of manufacturing an electro-optical device of the present invention, a configuration is adopted in which the adhesive is cured while the pressure is applied. As a result, the adhesive is cured while the positional relationship between the first member and the second member is fixed by pressure bonding, so that the thickness of the adhesive does not change significantly after curing.

Further, in the method of manufacturing an electro-optical device according to the present invention, the adhesive is a photocurable material, and the second
The step of adopting a configuration having a step of irradiating the adhesive with light having a predetermined wavelength is adopted. This allows
The adhesive can be hardened in a short time only by irradiating the adhesive with light.

Further, in the method of manufacturing an electro-optical device of the present invention, a configuration is adopted in which the second step is performed in a high temperature atmosphere with respect to the first step. As a result, the fluidity of the adhesive disposed in the bonding area is increased, so that the adhesive easily spreads, and the pressure bonding and the bonding process can be performed smoothly.

Further, in the method of manufacturing the electro-optical device of the present invention, a construction in which a plurality of the second members are attached to the first member is adopted. With this, a large number of electro-optical devices can be manufactured from one first member, so that productivity can be improved.

In the method of manufacturing an electro-optical device according to the present invention, the light emitting element includes the first member and the second member.
The structure arranged between the member and the member is adopted. As a result, the second member (or the first member) is used as a sealing member, and the light emitting element can be hermetically sealed inside the space formed by the first member and the second member.

Further, in the method of manufacturing the electro-optical device of the present invention, when the adhesive is arranged in the bonding area in the first step, it is arranged discontinuously. Accordingly, when the first member and the second member are pressure-bonded in the second step, the pressure of the space formed between the first member and the second member increases, and this pressure increase The first member and the second member may be misaligned, but since the first material or the second material is discontinuously arranged, the formed discontinuous portion (gap) The gas inside the space formed between the first member and the second member can be discharged to the outside. Therefore, the pressure increase inside the space is suppressed, and it is possible to prevent the occurrence of displacement due to the pressure increase inside the space.

Further, in the method of manufacturing an electro-optical device of the present invention, a configuration is adopted in which the second step is performed in an inert gas atmosphere. This can prevent deterioration of the light emitting element during the second step. Here, the inert gas is a gas inert to the light emitting element, and examples thereof include nitrogen gas and argon gas.

The electro-optical device manufacturing apparatus according to the present invention comprises:
In a manufacturing apparatus of an electro-optical device comprising a light emitting element arranged on the member of (1) and a second member bonded to the first member, the first member and the second member are bonded to each other. A coating device capable of arranging an adhesive in a bonding region to be bonded, a support device supporting the first member, and a support device supporting the second member while swingably holding the second member. A crimping device for crimping and bonding the first member to the first member with a predetermined force.

According to the present invention, when the first member and the second member are attached to each other via the adhesive, the second member is pressed against the first member supported by the supporting device by the crimping device. By squeezing with a predetermined force while swingably supporting the undulation, there is undulation or unevenness in the bonding area of the first member or the second member, or the second member with respect to the first member. Even in the case where the first member or the second member bonded together via an adhesive can be undulated or tilted by rocking even if they are arranged at an angle. Therefore, the first member and the second member are bonded together with a uniform adhesive thickness, and good adhesiveness is obtained. And
Since the first member and the second member are bonded together in a desired state, a high sealing property can be obtained, and it is possible to manufacture an electro-optical device that prevents deterioration of the light emitting element and exhibits desired performance.

Further, in the electro-optical device manufacturing apparatus of the present invention, the second member is bonded to a predetermined surface of the first member, and the pressure bonding device is at least
A configuration in which the second member is swingably held in a direction around a first axis parallel to the predetermined surface and a direction around a second axis parallel to the predetermined surface and orthogonal to the first axis is provided. Adopted. Accordingly, the first member and the second member can be positioned and bonded while canceling the undulations of the first member and the second member.

Further, in the electro-optical device manufacturing apparatus of the present invention, a first chamber for accommodating the coating device, a second chamber for accommodating the supporting device and the pressure bonding device, the first chamber and the first chamber. A configuration including a control device that controls the temperatures of the two chambers is adopted. As a result, the adhesive application process and the pressure bonding process can be performed in a desired temperature atmosphere.

Further, in the electro-optical device manufacturing apparatus according to the present invention, the control device is configured to set the temperature of the second chamber higher than that of the first chamber. This allows
Since the fluidity of the adhesive disposed in the bonding area is increased, the adhesive is easily spread, and the pressure bonding and the bonding process can be smoothly performed.

Further, in the electro-optical device manufacturing apparatus of the present invention, the holding portion for holding the second member of the pressure bonding apparatus can irradiate the adhesive with light having a predetermined wavelength. A configuration in which a different irradiation unit is provided is adopted. Thus, in the crimping step, light can be emitted while the second member is held by the crimping device and crimped to the first member.

An electro-optical device according to the present invention is manufactured by the electro-optical device manufacturing apparatus described in any one of the above.

According to the present invention, the first member and the second member are adhered with a uniform adhesive thickness in a state where the unevenness and the inclination are canceled, so that a good adhesive state is maintained. It

Electronic equipment of the present invention is characterized by including the electro-optical device described above.

According to the present invention, it is possible to obtain a thin and long-life electronic device in which deterioration of the light emitting element is suppressed.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an electro-optical device manufacturing method and device, an electro-optical device, and an electronic apparatus according to the present invention will be described below with reference to the drawings. here,
The electro-optical device of the present invention will be described using an example in which the electro-optical device is an organic EL device.

FIG. 1 is a sectional view of a main part of an organic EL device (electro-optical device). In FIG. 1, an organic EL device (electro-optical device) A includes a substrate (first member) 1, a light emitting element 3 arranged on the substrate 1, and sealing as a sealing member bonded to the substrate 1. And a substrate (second member) 2.

Here, the organic EL device A shown in FIG. 1 has a form in which light emitted from the light emitting element 3 is taken out from the substrate 1 side to the outside of the device. The material for forming the substrate 1 is transparent or transparent to light. Examples include translucent materials such as transparent glass, quartz, sapphire, and transparent synthetic resins such as polyester, polyacrylate, polycarbonate, and polyetherketone. In particular, inexpensive soda glass is preferably used as the material for forming the substrate 1.

On the other hand, when the emitted light is taken out from the side opposite to the substrate 1, the substrate 1 may be opaque. In that case, a ceramic sheet such as alumina or a metal sheet such as stainless steel is subjected to an insulation treatment such as surface oxidation. A resin, a thermosetting resin, a thermoplastic resin or the like can be used.

The light emitting element 3 includes an anode 5 formed on the substrate 1, a hole transport layer 6, and an insulating layer 7 formed so as to expose a surface where the anode 5 is in contact with the hole transport layer 6. The organic light emitting layer 8, the electron transport layer 9, and the cathode 10 are roughly configured.

The material of the anode 5 is aluminum (A
l), gold (Au), silver (Ag), magnesium (M
g), nickel (Ni), zinc-vanadium (Zn
V), indium (In), tin (Sn), and other simple substances, their compounds or mixtures, and conductive adhesives containing metal fillers.
O (Indium Tin Oxide) is used. The anode 5 is preferably formed by sputtering, ion plating, or vacuum deposition, but is formed by the WET process coating method using a spin coater, a gravure coater, a knife coater, screen printing, flexo printing, or the like. May be. The light transmittance of the anode 5 is preferably set to 80% or more.

As the hole transport layer 6, for example, a carbazole polymer and a TPD: triphenyl compound are co-evaporated to have a thickness of 10 to 1000 nm (preferably 100 to 700 n).
The film thickness is m). Here, the material for forming the hole transport layer 6 is not particularly limited, and known materials can be used, and examples thereof include a pyrazoline derivative, an arylamine derivative, a stilbene derivative, and a triphenyldiamine derivative. Specifically, JP-A-63-7025
No. 7, 63-175860, and JP-A-2-135.
359, 2-135361, 2-209988.
No. 3,37,992, and No. 3-152184 are exemplified, but triphenyldiamine derivatives are preferable, and 4,4′-bis (N
(3-Methylphenyl) -N-phenylamino) biphenyl is preferred.

The hole injection layer may be formed in place of the hole transport layer 6, or both the hole injection layer and the hole transport layer may be formed. In that case, examples of the material for forming the hole injection layer include copper phthalocyanine (CuPc), polyphenylene vinylene that is polytetrahydrothiophenylphenylene, and 1,1-bis-
(4-N, N-ditolylaminophenyl) cyclohexane, tris (8-hydroxyquinolinol) aluminum and the like can be mentioned, but especially copper phthalocyanine (CuP
Preference is given to using c).

Alternatively, the hole transport layer 6 may be formed by ejecting a composition ink containing a hole injecting and transport layer material onto the anode 5 by, for example, an ink jet method, and then performing a drying treatment and a heat treatment. Formed on. That is, after the composition ink containing the hole transport layer material or the hole injection layer material described above is ejected onto the electrode surface of the anode 5, the hole transport layer (on the anode 5 is subjected to a drying treatment and a heat treatment. A hole injection layer) is formed. For example, an ink jet head (not shown) is filled with a composition ink containing a hole transport layer material or a hole injection layer material, the ejection nozzle of the ink jet head is opposed to the electrode surface of the anode 5, and the ink jet head and the substrate 1 are While relatively moving the ink droplets, ink droplets whose liquid amount per droplet is controlled are discharged from the discharge nozzle onto the electrode surface. Next, the ejected ink droplets are dried to evaporate the polar solvent contained in the composition ink to form a hole transport layer (hole injection layer).

As the composition ink, it is possible to use, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrene sulfonic acid dissolved in a polar solvent such as isopropyl alcohol. Here, the ejected ink droplets spread on the electrode surface of the anode 5 that has been subjected to the ink-philic treatment. On the other hand, ink drops are repelled and do not adhere to the upper surface of the insulating layer 7 that has been subjected to the ink repellent treatment. Therefore, even if the ink droplet is ejected from the predetermined ejection position onto the upper surface of the insulating layer 7, the upper surface is not wetted by the ink droplet, and the repelled ink droplet is supposed to roll onto the anode 5. There is.

After the step of forming the hole transport layer 6,
In order to prevent the hole transport layer 6 and the organic light emitting layer 8 from being oxidized, it is preferable to carry out in an inert gas atmosphere such as a nitrogen atmosphere or an argon atmosphere.

The insulating layer 7 is formed by forming a silicon oxide film or a nitride film on the entire surface of the substrate by plasma CVD using TEOS, oxygen gas or the like as a raw material, and then patterning it by using a photolithography technique and an etching technique. You can

Similar to the hole transport layer 6, the organic light emitting layer 8 is dried by ejecting the composition ink containing the material for the light emitting layer onto the hole transport layer 6 by, for example, an inkjet method or a mask vapor deposition method. Alternatively, it is formed on the hole transport layer 6 by performing heat treatment. As the light emitting material forming the organic light emitting layer 8, a fluorene polymer derivative, a (poly) paraphenylene vinylene derivative, a polyphenylene derivative, a polyfluorene derivative, a polyvinylcarbazole, a polythiophene derivative, a perylene dye, a coumarin dye, and a rhodamine dye are used. A low molecular weight organic EL material, a high molecular weight organic EL material or the like which is soluble in a dye or other benzene derivative can be used. Materials suitable for the inkjet method include, for example, paraphenylene vinylene derivative, polyphenylene derivative, polyfluorene derivative, polyvinylcarbazole, and polythiophene derivative, and materials suitable for the mask vapor deposition method are perylene-based dyes and coumarin-based materials. Examples thereof include dyes and rhodamine dyes.

As the electron transport layer 9, a metal complex compound formed from a metal and an organic ligand, preferably A
1q3 (tris (8-quinolinolate) aluminum complex), Znq2 (bis (8-quinolinolate) zinc complex),
Bebq2 (bis (8-quinolinolate) beryllium complex), Zn-BTZ (2- (o-hydroxyphenyl) benzothiazole zinc), perylene derivative, etc.
It is vapor-deposited and laminated so as to have a film thickness of 000 nm (preferably 100 to 700 nm).

The cathode 10 is a metal having a low work function, which is preferably Ca, which can efficiently inject electrons into the electron transport layer 9.
It can be formed of a simple substance such as Au, Mg, Sn, In, Ag, Li or Al, or an alloy or compound thereof. In the present embodiment, a cathode mainly composed of Ca and A
It has a two-layer structure of a reflective layer mainly composed of l.

Although not shown, the organic EL device A of the present embodiment is an active matrix type, and actually has a plurality of data lines and a plurality of scanning lines arranged in a grid pattern.
The light emitting element 3 is connected to each pixel arranged in a matrix divided into these data lines and scanning lines via a driving TFT such as a switching transistor or a driving transistor. Then, when a drive signal is supplied through the data line or the scanning line, a current flows between the electrodes,
The light emitting element 3 emits light, and light is emitted to the outer surface side of the transparent substrate 1 to light up the pixel. It goes without saying that the present invention is not limited to the active matrix type and can be applied to a passive drive type display element.

The sealing substrate 2 blocks the entry of air into the light emitting element 3 including the electrodes 5 and 10 from the outside, and is bonded to the substrate 1. Examples of the material for forming the sealing substrate 2 include transparent or translucent materials such as glass, quartz, sapphire, and synthetic resin. Examples of the glass include soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, silica glass and the like. Examples of the synthetic resin include transparent synthetic resins such as polyolefin, polyester, polyacrylate, polycarbonate, and polyetherketone.

The sealing substrate 2 is formed in a U shape facing downward in cross section, and the region (bonding region) R outside the portion where the light emitting element 3 is provided on the upper surface of the substrate 1 and the sealing substrate 2 are sealed.
The sealing space K is formed between the flat substrate 1 and the sealing substrate 2 by being bonded to the lower end surface (bonding region) C of the. The light emitting element 3 including the electrodes 5 and 10 is arranged in the sealed space K. Further, a desiccant 11 is provided on the sealing space K side of the sealing substrate 2. The desiccant 11 suppresses deterioration of the light emitting element 3 arranged in the sealed space K due to moisture.

The substrate 1 and the sealing substrate 2 are adhered by the adhesive 21. FIG. 2 is a view taken along the line BB of FIG. As shown in FIG. 2, on the upper surface of the substrate 1, an adhesive 21 is arranged in a bonding region R that is bonded to the sealing substrate 2. The adhesive 21 is arranged so as to be continuous over the entire square-shaped bonding region R.

The adhesive 21 is composed of a photocurable adhesive (photocurable material). The photo-curable adhesive that constitutes the adhesive 21 is an ultraviolet (UV) curable adhesive that reacts in the ultraviolet region of 200 to 400 nm and is cured in a short time (for example, 1 to 10 seconds) by being irradiated with ultraviolet light. An adhesive may be used. Examples of the ultraviolet curable adhesive include ester acrylate, urethane acrylate,
Radical adhesives using resins such as various acrylates such as epoxy acrylates, melamine acrylates, ether acrylates, and methacrylates, cationic adhesives using cationic polymerization of epoxy compounds, vinyl ether compounds, octacene compounds, thiols
Examples thereof include ene-addition type resin adhesives, and among them, cationic adhesives that are not inhibited by oxygen and that undergo a polymerization reaction even after irradiation with light are preferable. As a cationic adhesive,
A cationic polymerization type UV-curable epoxy adhesive is preferred. A cationic polymerization type UV-curable epoxy adhesive includes a Lewis acid salt type curing agent that releases a Lewis acid catalyst by photolysis by irradiation with light such as UV light as a main photopolymerization initiator, and is generated by light irradiation. Further, it is a type of adhesive in which the Lewis acid serves as a catalyst and an oligomer having an epoxy group as a main component is polymerized and cured by a cationic polymerization type reaction mechanism.

Examples of the epoxy compound which is the main component of the adhesive include epoxidized olefin compounds, aromatic epoxy compounds, aliphatic epoxy compounds, alicyclic epoxy compounds and novolac epoxy compounds. Examples of the photopolymerization initiator include Lewis acid salts of aromatic diazonium, Lewis acid salts of diallyl iodonium, Lewis acid salts of triallyl sulfonium, Lewis acid salts of triallyl selenium, and the like.

In the present embodiment, an acrylic radical polymerization adhesive or an epoxy cationic polymerization adhesive, which is an inorganic filler having a particle diameter of 5 μm or less at 70 wt% or less in consideration of viscosity adjustment and moisture resistance. (Clay mineral, ultrafine particle material) is added, and 0.5-
A spherical or acicular spacer (inorganic oxide type) having a particle size of 4 to 10 μm is added in the range of 5.0 wt%. The coating thickness of the adhesive 21 is set to 4 to 10 μm.
Further, in order to improve the dispersibility of these inorganic materials and the adhesive component, a surfactant represented by a silane coupling agent or the like may be added at appropriate times.

Further, in the present embodiment, glass (preferably alkali-free glass) capable of transmitting ultraviolet light is used as the sealing substrate 2, and the surface roughness of the lower end surface C in contact with the adhesive 21 is , Ra (arithmetic surface roughness) of 1 μm or less and Rmax (maximum height) of 3 μm or less are used. In addition, the concave portion of the sealing substrate 2 (the sealing space K side)
Is engraved with a flat glass by sandblasting or cutting and polishing to a size of about 0.3 to 0.6 mm.

The one organic EL device A has been described above. Here, in this embodiment, as shown in FIG.
A plurality of light emitting elements 3 are provided for one substrate 1, and a plurality of sealing substrates 2 are attached to the substrate 1 so as to correspond to the plurality of light emitting elements 3, respectively. And 1
When a plurality of organic EL devices A are manufactured on one substrate 1,
The substrate 1 is cut so as to divide each.

Next, the step of bonding the substrate 1 and the sealing substrate 2 in the organic EL device A having the above-mentioned structure will be described. The bonding step according to the present embodiment includes a step of arranging the adhesive 21 in the bonding region R where the substrate 1 and the sealing substrate 2 are bonded by using a coating device (first step), and a pressure bonding device. And a step (second step) of attaching the sealing substrate 2 to the substrate 1 while swingably holding the sealing substrate 2. Therefore, first, the bonding region R
FIG. 4 shows a coating device in which the adhesive 21 can be arranged with respect to FIG.
Will be described with reference to.

As shown in FIG. 4, the coating apparatus system S1 capable of coating the substrate 21 with the adhesive 21 includes a stage ST1 capable of supporting the substrate 1 and the substrate 1 supported by the stage ST1.
And a coating device 31 on which the adhesive 21 can be placed. Note that, in FIG. 4, the portion of the substrate 1 corresponding to one organic EL device A is schematically drawn, but actually, as described in FIG. 3, the adhesive 21 is provided on one substrate 1. There are a plurality of bonding areas R to be arranged.

The stage ST1 is arranged in each of the X-axis direction which is one direction in the horizontal plane, the Y-axis direction which is the direction orthogonal to the X-axis direction in the horizontal plane, and the Z-axis direction which is orthogonal to the X-axis direction and the Y-axis direction. It is movable. Stage ST
1 holds the substrate 1 by, for example, a vacuum chuck or an electrostatic chuck. Then, the adhesive 21 is applied to the substrate 1 placed on the stage ST1 from the coating device 31.
Are placed.

The coating device 31 applies the adhesive 2 to the substrate 1.
1 is composed of a dropping device capable of quantitatively dropping. The dropping device is a device that can quantitatively discharge the fluid and can intermittently and intermittently drip the fluid. Therefore, the adhesive dropped from the coating device 21, which is a dropping device, is a fluid.

The fluid is a medium having a viscosity capable of being discharged (dripping) from the nozzle of the dropping device. It is enough that the material has fluidity (viscosity) that can be discharged from a nozzle, etc., and the material (in this case, an adhesive) is dissolved or dispersed in an organic solvent, or the material is heated to a temperature above its melting point to form a fluid. Is mentioned. In addition, even if a solid substance such as a spacer is mixed in the fluid as described above, it may be a fluid as a whole. In addition to the solvent, a dye, a pigment or other functional material may be added.

Examples of the dropping device include a dispenser and an ink jet device. For example, by adopting an inkjet method as a method of applying the adhesive, the adhesive can be attached to an arbitrary position on the upper surface of the substrate 1 at an arbitrary coating thickness with inexpensive equipment. The inkjet method may be a piezo jet method in which the fluid is ejected by a change in the volume of the piezoelectric element, or a method in which the fluid is ejected by rapidly generating steam by applying heat. .

The coating device 31 is provided so as to be movable with respect to the substrate 1 placed on the stage ST1, and X
It is movably provided in each of the axial direction, the Y-axis direction, and the Z-axis direction. Therefore, the coating device 31 can arrange the adhesive 21 in a predetermined pattern by discharging the adhesive while moving with respect to the substrate 1 placed on the stage ST1. The adhesive 21 is applied to the substrate 1
When applying on top, you may apply, moving the stage ST1 side.

Further, the coating device 31 includes a detection device 41 capable of detecting the distance from the surface of the substrate 1. Detection device 4
Reference numeral 1 denotes an optical sensor, which irradiates the substrate 1 with detection light, and the substrate 1 is irradiated with the detection light.
The distance from the substrate 1 can be detected by receiving the light generated from the substrate 1. As shown in FIG. 4B, the distance between the coating device 31 and the substrate 1 in the Z direction can be detected. The coating device 31 is adapted to adjust the position in the height direction (Z direction) with respect to the substrate 1 based on the detection result of the detection device 41, and to adjust the substrate from the optimum height position (position in the Z direction). The adhesive is dropped onto the first layer. By doing so, even if the surface of the substrate 1 has irregularities, the interference between the nozzles 31a of the coating device 31 and the substrate 1 is suppressed and damage to the substrate 1 is prevented. The detection device 41 may be fixed to the coating device 31 or may be provided separately from the coating device 31. In the configuration provided independently of the coating device 31, the detection device optically detects the distance between the nozzle tip of the coating device and the substrate 1.

The coating device 31 disposes the adhesive 21 on the bonding area R set in advance on the substrate 1. When arranging the adhesive 21, the coating device 31 moves X
The adhesive 21 is applied to the bonding region R while moving in the axial direction and the Y-axis direction. At this time, as described above, the coating device 31 performs the coating operation (ejection operation) while adjusting the distance from the substrate 1 based on the detection result of the detection device 41. In this way, the adhesive 21 is arranged in a predetermined pattern.

Here, as shown in FIG. 5, the coating device 31 disposes the adhesive 21 discontinuously in at least two places in the bonding region R and continuously in the other parts. In the present embodiment, as shown in FIG. 5A, the two opposing edge portions of the bonding region R are discontinuously arranged, and the remaining portions are continuously arranged. That is,
The adhesive 21 is arranged so as to be discontinuous at the edge portion in the bonding region R. Note that, as shown in FIG. 5B, the adhesive 21 may be discontinuously arranged at the four edge portions of the bonding region R, or as shown in FIG. You may arrange | position continuously.

The alignment between the coating device 31 and the bonding area R can be performed using, for example, an alignment mark (alignment mark) (not shown) provided on the substrate 1. For example, an alignment mark position detection sensor (not shown) optically detects the alignment mark position, and based on the detection result, the bonding region R where the position is uniquely set with respect to the alignment mark, and the coating The alignment with the device 31 is performed.

Further, a coating apparatus system S1 including the coating apparatus 31.
Are housed in the first chamber (first chamber) H1.
The inside of the first chamber H1 is adjusted to a predetermined temperature by the controller CONT.

Next, a crimping device for crimping and bonding the sealing substrate 2 to the substrate 1 while swingably holding the sealing substrate 2 will be described with reference to FIG. FIG. 6 is a schematic perspective view of the crimping device system S2 including the crimping device 40. Note that, in FIG. 6, the substrate 1 of the portion corresponding to one organic EL device A is schematically drawn, but actually, as described in FIG. 3, the sealing substrate 2 is provided on one substrate 1. There are a plurality of bonding regions R to be bonded.

As shown in FIG. 6, a pressure bonding device system S2 for bonding the sealing substrate 2 to the substrate 1 includes a stage (supporting device) ST2 capable of supporting the substrate 1 on which the adhesive 21 is arranged,
A pressure-bonding device 50 that pressure-bonds the sealing substrate 2 to the substrate 1 supported by the stage ST2 with a predetermined force and holds the sealing substrate 2 while swinging the sealing substrate 2 is provided.

The stage ST2 has an X-axis (first axis) direction which is one direction in the horizontal plane, a Y-axis (second axis line) direction which is a direction orthogonal to the X-axis direction in the horizontal plane, an X-axis direction and It is movable in each of the Z-axis directions orthogonal to the Y-axis direction. Here, since the stage ST2 supports the substrate 1 horizontally, the upper surface (predetermined surface) of the substrate 1 in the X-axis direction.
And the Y-axis direction are parallel to the upper surface (predetermined surface) of the substrate 1 and orthogonal to the X-axis direction. The stage ST2 holds the substrate 1 by, for example, a vacuum chuck or an electrostatic chuck. Then, the sealing substrate 2 held by the pressure bonding device 50 is pressure-bonded to the substrate 1 placed on the stage ST2 and bonded.

The crimping device 50 comprises a body 51 and a body 5.
1 and a holding portion 53 that holds the sealing substrate 2 and that is connected via a connecting portion 52. The pressure bonding device 50 is provided so as to be movable with respect to the substrate 1 placed on the stage ST2, and is provided so as to be movable in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. Then, the sealing substrate 2 being held is moved by moving downward (−Z axis direction).
Is pressed against the substrate 1 supported by the stage ST2.

The holding portion 53 of the crimping device 50 is formed in a flat plate shape and can be connected to the upper surface of the sealing substrate 2 by contacting it. The connecting portion 52 includes swing members 52A and 52B that swingably support the holding portion 53 with respect to the main body portion 51.
It has 52C and a fulcrum part 52G. Swing member 52
A to 52C are configured by elastically deformable members such as springs and air cylinders. Further, the fulcrum portion 52G has ball joints at the upper and lower ends, and is connected to the main body portion 51 and the holding portion 53 via the ball joints. And the fulcrum part 52
G is connected to the central portion of the holding portion 53 in plan view, and the swinging members 52A to 52C are arranged at equal intervals so as to surround the holding portion 53 and are connected to the holding portion 53. The holding portion 53 is different from the main body portion 51 in the swinging member 5.
By being supported by at least three points by 2A to 52C, it is supported so as to be swingable at least in the X axis rotation direction and the Y axis rotation direction. In the present embodiment, the stage S
It is swingably supported in the direction of inclination with respect to T2. Therefore, the holding unit 53 can swing the held sealing substrate 2 at least in the X-axis direction and the Y-axis direction with respect to the upper surface (predetermined surface) of the substrate 1 supported by the stage ST2. In this embodiment, the sealing substrate 2 is held so as to be swingable in the direction of inclination with respect to the upper surface of the substrate 1.

Then, the pressure bonding device 50 and the stage ST2
Is a second chamber (second chamber) H2.
It is housed inside. The inside of the second chamber H2 is adjusted to a predetermined temperature by the controller CONT. Here, the controller CONT controls the temperature inside the second chamber H2 to the first chamber H1 which houses the coating apparatus system S1.
Set so that it is higher than the internal temperature.

FIG. 7A is a side view of the crimping device 50, and FIG.
In (b), the holding portion 53 of the crimping device 50 is moved downward (-Z
It is the figure seen from the side. As shown in FIG. 7, the crimping device 5
Reference numeral 0 denotes a light source device 54 that emits ultraviolet light, and a light source device 5
An optical fiber (branching device) 56 that guides the ultraviolet light from 4 to the irradiation unit 55 provided on the lower surface of the holding unit 53 is provided. The irradiation unit 55 capable of emitting the ultraviolet light from the light source device 54 is provided at a plurality of positions of the holding unit 53, and in the present embodiment, as shown in FIG. 7B, the holding unit 53 having a rectangular shape in plan view. It is provided in each of the four corners. And
The optical fiber 56 is for branching the ultraviolet light emitted from one light source device 54 to each of the plurality of irradiation units 55. The ultraviolet light from the light source device 54 is emitted from each of the plurality of irradiation units 55 via the optical fiber 56.

Further, the crimping device 50 has the suction holes 62 provided on the lower surface of the holding portion 53 and the flow path 6 with respect to the suction holes 62.
Vacuum pump (adsorption device) 64 connected via 3
It has and. In the present embodiment, the suction hole 62 is provided in the substantially central portion of the lower surface of the holding portion 53, and the flow passage 63 is provided.
Passes inside the fulcrum portion 52G. The pressure bonding device 50 holds the sealing substrate 2 by vacuum suction through the suction holes 62 by bringing the holding portion 53 into contact with the sealing substrate 2 and operating the vacuum pump 64, so that the sealing substrate 2 can be transported. .

The position and number of the suction holes 62 can be set arbitrarily. For example, two suction holes 62 may be provided as shown in FIG. 8A, or three suction holes 62 may be provided as shown in FIG.
You can choose one. Further, the arrangement position and the number of the irradiation units 55 can be set arbitrarily. Here, it is preferable that the suction hole 62 is disposed on the center side (that is, inside) of the holding unit 53 with respect to the irradiation unit 55 in a plan view. The pressure bonding device 50 may hold the sealing substrate 2 by another method such as an electrostatic chuck.

Here, with reference to FIG. 9, an outline of the entire structure of the crimping device system S2 will be described. 9A is a plan view of the crimping device system S2, and FIG. 9B is a plan view thereof.
It is a side view of (a). In the pressure bonding device system S2, the pressure bonding device 50 is supported by a moving device 71 that is movable in the X axis direction while being guided by a guide portion 72 extending in the X axis direction. The guide portion 72 is supported by the support base 70. Further, the moving device 71 supports the crimping device 50 so as to be movable in each of the Y-axis direction and the Z-axis direction.

On the substrate 1 supported by the stage ST2, a plurality of sealing substrates 2 are bonded together as described with reference to FIG. The sealing substrate 2 is placed on the sealing substrate tray T and stored in the library LB before being bonded to the substrate 1. The sealed substrate tray T of the library LB is transferred by the transfer device 73 to Y.
It is designed to be transported in the axial direction. Specifically, the sealing substrate tray T is moved by the transfer device 73 as shown in FIG.
The sheet is conveyed between the position P1 shown in and the library LB.
The transport device 73 moves in the Y-axis direction while being guided by the guide portion 74 extending in the Y-axis direction. Also, the crimping device 5
By moving 0 also in the X-axis direction by the moving device 71, the sealed substrate tray T arranged at the position P1 can be accessed.

When the sealing substrate 2 is attached to the substrate 1 placed on the stage ST2 by the pressure bonding device 50, the sealing substrate 2 stored in the library LB is transferred to the sealing substrate tray T.
It is moved to the position P1 by the carrier device 73 and is arranged. Then, the sealing substrate tray T arranged at the position P1
The crimping device 50 accesses the upper sealing substrate 2 by the moving device 71. The pressure bonding device 50 sucks and holds the sealing substrate 2 on the sealing substrate tray T at the position P1. Next, the pressure bonding device 50 conveys the held sealing substrate 2 to the alignment device 75 and places it on the alignment device 75.

The alignment device 75 controls the posture of the sealing substrate 2 so that the bonding region R of the substrate 1 and the lower end surface C of the sealing substrate 2 are aligned with each other. That is, the alignment device 75 includes an alignment sensor (not shown) and a table 75 that can rotate the mounted sealing substrate 2 around the Z axis.
a and has a table 75 with an alignment sensor.
The table 75a is rotated around the Z axis while detecting the position (orientation) of the sealing substrate 2 placed on the stage ST.
The posture of the sealing substrate 2 is adjusted so that the bonding region R of the substrate 1 and the lower end surface C of the sealing substrate 2 are aligned with each other on 2.

After the orientation of the sealing substrate 2 is adjusted by the alignment device 75, the pressure bonding device 50 sucks and holds the sealing substrate 2 and conveys it onto the stage ST2. The substrate 1 on the stage ST2 and the sealing substrate 2 are aligned with each other by, for example, the substrate 1
It is possible to perform it by using an alignment mark (alignment mark) (not shown) provided in the. For example, the alignment mark position detection sensor (not shown) optically detects the alignment mark position, and based on the detection result, the sealing substrate 2 held by the pressure bonding device 50.
And the substrate 1 on the stage ST2 are aligned. Then, the sealing substrate 2 is attached to the substrate 1 supported by the stage ST2 while being aligned.

By repeating the above-mentioned operation, the plurality of sealing substrates 2 are bonded onto the substrate 1. Position P1
When the sealed substrate tray T arranged at is empty, the transport device 73 returns the empty sealed substrate tray T to the library LB.

Next, the step of bonding the substrate 1 and the sealing substrate 2 together will be described with reference to FIG. First,
As shown in FIG. 10A, the substrate 1 including the light emitting element 3 is provided.
The adhesive 21 is arranged by the coating device 31 in the bonding region R of. As described with reference to FIG. 5, the coating device 31 disposes the adhesive 21 in the bonding region R discontinuously.

Here, in order to prevent the deterioration of the light emitting element 3, the inside of the first chamber H1 is filled with an inert gas such as nitrogen gas or argon gas. Therefore, the adhesive 2
The first coating step (first step) is performed in an inert gas atmosphere.

The adhesive 21 is applied to the substrate 1 by the coating device 31.
In arranging the first chamber H1, the controller CONT adjusts the first chamber H1 to a predetermined temperature and pressure. Here, the control device CONT sets the temperature inside the first chamber H1 to a predetermined temperature (for example, the self-weight deformation temperature of the adhesive 21 or less) so that the pattern shape of the adhesive 21 arranged on the substrate 1 can be held. . Specifically, it is set at room temperature or below room temperature (for example, about 10 to 30 ° C.). By setting the first chamber H1 at a low temperature, the fluidity of the adhesive 21 placed on the substrate 1 can be lowered, and therefore the pattern shape of the adhesive 21 placed on the substrate 1 can be maintained. it can. Further, the pressure inside the first chamber H1 is preferably set to about atmospheric pressure.

After the adhesive 21 is placed on the substrate 1, the substrate 1 is transported to the stage ST2 of the pressure bonding device system S2 by a transport device (not shown). The alignment of the substrate 1 and the stage ST2 can be performed using, for example, an alignment mark (alignment mark) (not shown) provided on the substrate 1. Then, the alignment mark position detection sensor (not shown) optically detects the alignment mark position, and the substrate 1 is aligned with the stage ST2 based on the detection result.

Then, as shown in FIG. 10B, the sealing substrate 2 is attached to the substrate 1 by the pressure bonding device 50. The pressure bonding device 50 includes a lower end surface C of the sealing substrate 2 and a bonding region R of the substrate 1 where the adhesive 21 is arranged.
While aligning and, the lower end surface C and the bonding region R are brought into contact with each other, and the substrate 1 and the sealing substrate 2 are pressure-bonded with a predetermined force. In the present embodiment, the crimping force by the crimping device 50 is set to 98 to 980 kPa, for example.

Here, a holding portion 53 for holding the sealing substrate 2
Is swingably supported with respect to the main body 51,
It seems that the bonding region R of the substrate 1 or the lower end surface C of the sealing substrate 2 has irregularities, the substrate 1 or the sealing substrate 2 has undulations, and the sealing substrate 2 is inclined with respect to the substrate 1. Even in such a case, it is possible to cancel the swell and tilt by swinging. Therefore, the substrate 1 and the sealing substrate 2 are attached with a uniform adhesive thickness.

Like the first chamber H1, the inside of the second chamber H2 in which the substrate 1 and the sealing substrate 2 are bonded together is filled with an inert gas such as nitrogen gas or argon gas in order to prevent deterioration of the light emitting element 3. ing. Therefore, the substrate 1
The bonding step (second step) between the sealing substrate 2 and the sealing substrate 2 is also performed in an inert gas atmosphere. In addition, the second chamber H2
Is set to a predetermined temperature and pressure by the controller CONT. The control device CONT includes the second chamber H2.
The internal temperature is set to a temperature higher than at least the internal temperature of the first chamber H1 (for example, the self-weight deformation temperature of the adhesive 21 or higher). As a result, the adhesive 21 placed on the substrate 1
Has a high fluidity, and the adhesive 21 easily spreads. Specifically, the second chamber H2 is set to, for example, about 20 to 50 ° C. By setting the second chamber H2 at a high temperature, it is possible to increase the fluidity of the adhesive 21 arranged on the substrate 1, so that the adhesive 21 arranged on the substrate 2 easily spreads, and the bonding operation is performed. It can be done smoothly.

In order to heat the adhesive 21 in order to increase the fluidity of the adhesive 21, the gas temperature inside the second chamber H2 is raised and the stage ST2 or the holding portion 53 is heated. The adhesive 21 may be heated. In addition, the pressure inside the second chamber H2 is preferably set lower than the pressure inside the first chamber H1 (for example, below atmospheric pressure).

Here, the adhesive 21 placed in the bonding area R is set to a predetermined thickness by pressure bonding between the substrate 1 and the sealing substrate 2, and the application area can be expanded.
That is, as shown in FIG. 5, before the pressure bonding, the adhesive 21 applied so as to make the edge portion of the bonding region R discontinuous is changed to the edge portion after the pressure bonding as shown in FIG. The discontinuous part of is made continuous. After the pressure bonding, the adhesive 21 continues to block the flow of gas between the inside and the outside of the formed sealed space K. Here, in order to prevent the adhesive 21 from sticking out from the bonding region R or the lower end surface C after the pressure bonding and to connect the discontinuous portions after the pressure bonding, the adhesive 21 before the pressure bonding
The application amount and application position of are previously set optimally.

Since the adhesive 21 is provided with the discontinuous portion before the pressure bonding, the substrate 1 and the sealing substrate 2 are bonded during the pressure bonding.
Since the gas in the space formed between and is discharged to the outside through the discontinuous portion, the pressure increase inside the space is suppressed, and the positional deviation between the substrate 1 and the sealing substrate 2 is caused by the pressure increase inside the space. Therefore, the crimping operation can be performed smoothly. Then, after the pressure bonding, the adhesive 21 is continuous in the entire bonding region R, so that the flow of gas between the inside and the outside of the sealed space K is regulated.

When the substrate 1 and the sealing substrate 2 are bonded together,
As shown in FIG. 10C, light (ultraviolet light) having a predetermined wavelength with respect to the adhesive 21 from the irradiation unit 55 in a state where the substrate 1 and the sealing substrate 2 are pressure-bonded by the pressure bonding device 50.
Is irradiated. In the present embodiment, for example, ultraviolet light having a wavelength of 360 nm is emitted from the light source device 54 (see FIG. 7). The ultraviolet light emitted from the light source device 54 is applied to the sealing substrate 2 from each of the plurality of irradiation units 55 via the optical fiber 56. Here, the irradiation unit 5
Since 5 is provided at a position corresponding to the adhesive 21 arranged in the bonding area R, the ultraviolet light emitted from the irradiation unit 55 passes through the wall portion of the sealing substrate 2 and the adhesive 21 is irradiated. Since the sealing substrate 2 is made of a material such as glass that can transmit ultraviolet light, the transmission of ultraviolet light is not hindered.

As shown in FIG. 2, the ultraviolet light from the irradiation section 55 is applied to the adhesive 21 placed in the bonding area R.
The predetermined area AR1 of is irradiated. A part of the area AR1 which is a part of the adhesive 21 is cured in a short time by being irradiated with the ultraviolet light. Thus, the crimping device 50
Cures the area AR1 of the adhesive 21 while pressing the substrate 1 and the sealing substrate 2 under pressure. The substrate 1 and the sealing substrate 2 are temporarily fixed by the adhesive 21 in the cured area AR1.

The amount of the adhesive 21 applied (the amount applied per unit area) is the same as that of the substrate 1 and the sealing substrate 2 in order to perform the temporary fixing process in a short time and in the carrying process in the subsequent process. It is optimally set in advance so that it will not be peeled off or displaced. In addition, the irradiation range of the ultraviolet light by the irradiation unit 55 (that is, the area AR1) is also temporarily fixed so that the substrate 1 and the sealing substrate 2 are not peeled off or displaced from each other in a transfer process or the like in a subsequent process. It is optimally set in advance so as to be performed in the shortest possible time.

After the substrate 1 and the sealing substrate 2 are temporarily fixed in the area AR1 of the adhesive 21, the substrate 1 and the sealing substrate 2 are conveyed to the irradiation device 80 and irradiated as shown in FIG. 10 (d). The device 80 irradiates all the regions of the adhesive 21 including the region AR1 cured by the pressure bonding device 50 with the ultraviolet light.

The irradiation device 80 includes a light source device 81 capable of emitting light having a predetermined wavelength (in this embodiment, ultraviolet light having a wavelength of about 300 to 380 nm), and a support device 82 for supporting the light source device 81. Therefore, the entire adhesive 21 arranged in the bonding region R is irradiated with the ultraviolet light through the sealing substrate 2 which can transmit the ultraviolet light. In this way, the entire adhesive 21 placed in the bonding region R is cured, and the substrate 1 and the sealing substrate 2 are connected.

Here, in the irradiation device 80, irradiation is performed with a predetermined illuminance (for example, 30 to 100 mW / cm ² ) for a predetermined time (for example, 30 to ²⁰⁰ seconds). As a result, the adhesive 21 made of the ultraviolet curable material is entirely cured.

In the irradiation device 80, the adhesive 21
When the ultraviolet light is applied to the entire sealing substrate 2 from above in order to cure the resin, the ultraviolet light may adversely affect the light emitting element 3. Therefore, when irradiating ultraviolet light, a light shielding member (mask) is provided at a position corresponding to the light emitting element 3 such as the central portion of the sealing substrate 2, and the ultraviolet light is irradiated only to the bonding region R where the adhesive 21 is arranged. It should be done.

As described above, when the substrate 1 and the sealing substrate 2 are bonded to each other via the adhesive 21, the sealing substrate 2 is supported while being swingable, so that the substrate 1 and the sealing substrate 2 are bonded together. Even if the bonding region R of the sealing substrate 2 has undulations or irregularities, or the substrate 1 or the sealing substrate 2 is arranged to be inclined, the inclination or irregularity can be canceled by swinging. Therefore, the substrate 1 and the sealing substrate 2 are bonded together with a uniform adhesive thickness, and good adhesiveness is obtained. Since the substrate 1 and the sealing substrate 2 are bonded to each other in a desired state, a high sealing property can be obtained, deterioration of the light emitting element 3 can be prevented, and the desired performance of the organic EL can be achieved.
Device A can be manufactured.

Further, when the substrate 1 and the sealing substrate 2 are bonded to each other via the adhesive 21, the substrate 1 and the sealing substrate 2 are pressure-bonded with each other with a predetermined force. Can be adjusted.

Then, while the substrate 1 and the sealing substrate 2 are pressure-bonded to each other, the adhesive 21 is cured by irradiating ultraviolet light, so that the positional relationship between the substrate 1 and the sealing substrate 2 is fixed by pressure bonding. Since the adhesive 21 is cured in this state, the thickness of the adhesive 21 does not change significantly after curing. Therefore, the substrate 1 and the sealing substrate 2 can be attached to each other with a desired adhesive thickness.

Further, since the adhesive 21 is heated when the substrate 1 and the sealing substrate 2 are pressure-bonded to each other via the adhesive 21, it is possible to bond the adhesive 21 while improving the fluidity of the adhesive 21. In addition to the action of swinging the holding portion 53, it is possible to further achieve the uniformization of the adhesive thickness. In addition, since the fluidity is increased, the adhesive 21 is easily spread, and the pressure bonding and the bonding process can be smoothly performed.

In this embodiment, since a plurality of sealing substrates 2 are attached to one substrate 1, a large number of organic EL devices A can be manufactured from one substrate 1 and productivity is improved. Can be improved.

Since the step of applying the adhesive 21 and the step of bonding the substrate 1 and the sealing substrate 2 are performed in a gas atmosphere which is inert to the light emitting element 3, the light emitting element 3 during the manufacturing process is Deterioration can be prevented. Therefore, the organic EL device A capable of exhibiting desired performance such as high light emission can be manufactured.

The bonding area R of the substrate 1 and the coating device 31
A detection device 41 that can detect the distance to
Since the position of the coating device 31 in the height direction is adjusted based on the detection result of No. 1, the coating device 31 can drop the adhesive from the optimum height position with respect to the bonding region R, and The adhesive can be arranged at a desired position in the matching region R with an optimum coating amount.

In the above embodiment, the coating operation is performed while adjusting the distance between the coating device 31 and the substrate 1 based on the detection result of the detection device 41. However, the detection device 41 is used to detect the substrate 1. The surface shape is detected in advance (the coating operation is not performed at this time), the detection result is stored in the storage device, and the coating device 31 is based on the stored result.
The coating operation may be performed while adjusting the height position of.

In the above embodiment, the adhesive 21
Is applied to the bonding region R of the substrate 1, but it goes without saying that the substrate 1 and the sealing substrate 2 may be bonded after the adhesive is applied to the lower end surface C of the sealing substrate 2. Further, when the substrate 1 and the sealing substrate 2 are attached to each other, it is described that the sealing substrate 2 is swingably supported and pressure-bonded.
You may make it press-bond, supporting the board | substrate 1 swingably.

In the above embodiment, the adhesive 21 is described as an ultraviolet curable adhesive, but any adhesive that can bond the substrate 1 and the sealing substrate 2 may be used.
As the material, it is possible to use an EB (electron beam) curable material, a thermosetting material, a two-component mixed curable material, or the like, which can be cured in a short time.

In the bonding area R, a predetermined material is arranged in a region other than the region where the adhesive 21 is arranged, and the substrate 1
And the sealing substrate 2 may be attached. The predetermined material may be an adhesive capable of adhering the substrate 1 and the sealing substrate 2, or any synthetic material such as polyacrylate, polymethacrylate, polyester, polyethylene, polypropylene, or a combination thereof. It may be a resin material. Among these, as a forming material of the predetermined material, for example, a material having a hygroscopic property is preferably adopted. By doing so, it is possible to prevent moisture from entering the light emitting element 3 from the outside and further prevent element deterioration. Further, the arrangement position of the predetermined material is not particularly limited, and the predetermined material can be arranged at any position in the bonding region R, such as inside or outside of the adhesive 21.

Next, examples of electronic equipment equipped with the organic EL device A of the above-described embodiment will be described. FIG. 11 (a)
FIG. 4 is a perspective view showing an example of a mobile phone. Figure 11
In (a), reference numeral 1000 indicates a mobile phone body,
Reference numeral 1001 indicates a display unit using the organic EL device A described above.

FIG. 11B is a perspective view showing an example of a wrist watch type electronic device. In FIG. 11B, reference numeral 1
Reference numeral 100 indicates a watch body, and reference numeral 1101 indicates the organic E described above.
The display part which used the L apparatus A is shown.

FIG. 11C is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. In FIG. 11C, reference numeral 1200 is an information processing apparatus, reference numeral 1202 is an input unit such as a keyboard, reference numeral 1204 is the information processing apparatus main body, and reference numeral 1206 is a display unit using the organic EL device A.

The electronic devices shown in FIGS. 11A to 11C are
Since the organic EL device A according to the above-described embodiment is provided, it is possible to realize an electronic device including a thin organic EL display unit having a long life.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the case where the light emission of the light emitting element 3 is emitted to the outer surface side through the substrate 1 has been described, but the light emission of the light emitting element 3 is the cathode on the side opposite to the substrate 1. The present invention can be applied even in a form in which light is emitted from the 10 side through the sealing substrate 2. In this case, as the sealing substrate 2,
A transparent or translucent material capable of extracting light is used.

[0111]

As described above, when the first member and the second member are attached to each other via the adhesive, at least one of the first member and the second member is allowed to swing. Since the substrates are bonded while being supported, the bonding region of the first member or the second member has undulations or irregularities, or the second member is inclined with respect to the first member. Even in such a case, it is possible to cancel the swell and inclination by swinging. Therefore, the first member and the second member are bonded with a uniform adhesive thickness, good adhesiveness can be obtained, high sealing performance can be realized, and deterioration of the light emitting element can be prevented to achieve desired performance. It is possible to manufacture an electro-optical device that exhibits the above.

[Brief description of drawings]

FIG. 1 is a main-portion cross-sectional view showing an embodiment of an electro-optical device of the present invention.

FIG. 2 is a sectional view taken along the line BB of FIG.

FIG. 3 is an overall view of an electro-optical device of the present invention.

FIG. 4 is a diagram showing a coating device of the electro-optical device manufacturing apparatus of the invention.

FIG. 5 is a diagram showing an adhesive placed in a bonding area by a coating device.

FIG. 6 is a perspective view showing a crimping device of the electro-optical device manufacturing apparatus of the invention.

FIG. 7 is a side view of FIG. 6 and a plan view seen from below.

FIG. 8 is a diagram showing another embodiment of the crimping device.

FIG. 9 is an overall configuration diagram of a crimping device system in the electro-optical device manufacturing apparatus of the invention.

FIG. 10 is a schematic view showing one embodiment of a method for manufacturing an electro-optical device of the present invention.

FIG. 11 is a diagram illustrating an example of an electronic device including an organic EL display device, in which (a) is a mobile phone, (b) is a wristwatch type electronic device, and (c) is a portable information processing device. Is.

[Explanation of symbols]

1 substrate (first member) 2 Sealing substrate (second member) 3 light emitting element 21 Adhesive 31 coating device 41 detector 50 crimping device 53 Holder 55 Irradiation part A Organic EL device (electro-optical device) CONT control device H1 first chamber (first chamber) H2 2nd chamber (2nd chamber) K Sealed space (space) R bonding area ST2 stage (support device)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hidekazu Kobayashi             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F term (reference) 3K007 AB08 AB11 AB12 AB13 AB18                       BB01 BB04 BB05 DB03 FA02                       FA03

Claims (16)

[Claims] 1. A light emitting device disposed on the first member,
In a method of manufacturing an electro-optical device including a second member bonded to the first member, an adhesive is arranged in a bonding region where the first member and the second member are bonded. A first step; and a second step of bonding the first member and the second member while swingably supporting at least one of the first member and the second member. And a method for manufacturing an electro-optical device. 2. The method for manufacturing an electro-optical device according to claim 1, wherein the second step includes a step of pressure-bonding the first member and the second member with a predetermined force. . 3. The method of manufacturing an electro-optical device according to claim 2, wherein the adhesive is cured while the pressure is applied. 4. The adhesive is a photo-curable material, and the second step includes a step of irradiating the adhesive with light having a predetermined wavelength.
4. The method for manufacturing an electro-optical device according to claim 3. 5. The method according to claim 1, wherein the second step is performed in a high temperature atmosphere with respect to the first step.
5. The method for manufacturing an electro-optical device according to any one of items 4 to 4. 6. The method for manufacturing an electro-optical device according to claim 1, wherein a plurality of the second members are attached to the first member. 7. The manufacture of the electro-optical device according to claim 1, wherein the light emitting element is arranged between the first member and the second member. Method. 8. The electro-optical device according to claim 1, wherein when the adhesive is arranged in the bonding area in the first step, the adhesive is arranged discontinuously. Production method. 9. The method for manufacturing an electro-optical device according to claim 1, wherein the second step is performed in an inert gas atmosphere. 10. A manufacturing apparatus of an electro-optical device comprising a light emitting element arranged on a first member, and a second member bonded to the first member, wherein the first member and the A coating device capable of arranging an adhesive in a bonding region where the second member is bonded, a support device supporting the first member, and a swingable holding of the second member. An apparatus for manufacturing an electro-optical device, comprising: a pressure bonding device that pressure-bonds the first member supported by the supporting device with a predetermined force to bond the first member. 11. The second member is attached to a predetermined surface of the first member, and the pressure bonding device is at least a first surface parallel to the predetermined surface.
11. The second member is swingably held in a direction around the axis of and a direction around a second axis which is parallel to the predetermined surface and is orthogonal to the first axis. Electro-optical device manufacturing equipment. 12. A first chamber for accommodating the coating device, a second chamber for accommodating the supporting device and the pressure bonding device, and a control device for controlling the temperatures of the first chamber and the second chamber. The apparatus for manufacturing an electro-optical device according to claim 10 or 11, wherein: 13. The control device sets the temperature of the second chamber higher than that of the first chamber.
2. The electro-optical device manufacturing apparatus according to 2. 14. The holding section for holding the second member of the pressure bonding apparatus is provided with an irradiation section capable of irradiating the adhesive with light having a predetermined wavelength. The electro-optical device manufacturing apparatus according to claim 10. 15. An electro-optical device manufactured by the electro-optical device manufacturing apparatus according to claim 10. 16. An electronic apparatus comprising the electro-optical device according to claim 15.