JP2003243156A - Encapsulation substrate, manufacturing method thereof, display device, and electronic device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To easily manufacture a sealing substrate which can be easily aligned. A substrate (10) has one or more recesses (2).
0 and the first and second marks 22 and 24 located next to the respective recesses 20 are simultaneously formed. One recess 2
The substrate 10 is cut outside the region having the 0 and the first and second marks 22 and 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing substrate, a method of manufacturing the same, a display device and an electronic device.

[0002]

2. Description of the Related Art Devices using light emitting materials and electrodes that are easily affected by moisture and oxygen (for example, organic EL (Electrolumines)
cence) element), a sealing structure is applied. Conventionally, a sealing substrate used for sealing an organic EL element has been manufactured by engraving a glass substrate and then cutting the glass substrate. When attaching the sealing substrate, the cut surface must be straightened when the glass substrate is cut in order to use the end of the sealing substrate as a reference for alignment, but this was difficult.

The present invention solves the problems of the prior art, and an object thereof is to easily manufacture a sealing substrate that is easily aligned.

[0004]

(1) In the method for manufacturing a sealing substrate according to the present invention, (a) one or more recesses and a mark located next to each recess are formed on the substrate. ,
And (b) cutting the substrate outside the region having the one recess and the mark.

According to the present invention, a sealing substrate having a recess and a mark can be manufactured. This sealing substrate can be easily aligned using the marks. Further, since the recess and the mark are formed at the same time, the mark can be easily formed without increasing the number of steps.

(2) In this method for manufacturing a sealing substrate, in the step (a), a mask having a plurality of openings is provided in the substrate, and a portion of the substrate exposed from the openings is shaved. The recess and the mark may be formed at the same time.

According to this, since the recessed portion and the mark are formed by shaving the exposed portion from the opening of the mask, the relative positional accuracy of the recessed portion and the mark is high.

(3) In this method for manufacturing a sealing substrate, in the step (b), a plurality of chip substrates each having one recess and one mark may be obtained from the substrate.

According to this, since the recesses and marks of a plurality of chip substrates can be formed at the same time, the productivity of the sealing substrate is high.

(4) In this method for manufacturing a sealing substrate, in the step (a), a plurality of the marks are formed on the substrate next to the recesses, and in the step (b), the marks are formed. From the substrate, a plurality of chip substrates each having one recess and the plurality of marks may be obtained.

According to this, it is possible to manufacture a sealing substrate which has at least two marks and whose direction can be detected.

(5) In this method of manufacturing a sealing substrate, in the step (a), each of the recesses is formed so as to have a polygonal opening shape, and one mark of the polygonal shape is formed. It may be formed next to one corner.

According to this, since the plurality of marks are formed at positions separated from each other, it is possible to manufacture the sealing substrate which can be easily positioned.

(6) In this method of manufacturing a sealing substrate, in the step (a), among the plurality of marks, a pair of marks positioned next to a pair of opposite corners of the polygon are You may form in a different shape.

According to this, it is possible to manufacture a sealing substrate which can recognize the opposite direction.

(7) In this method of manufacturing a sealing substrate, the recesses may be formed so as to be arranged in a matrix.

(8) In this method for manufacturing a sealing substrate, the mark may be formed to have a bottom surface having a roughness different from the front and back surfaces of the substrate.

According to this, it is possible to manufacture the sealing substrate in which the mark is easily recognized.

(9) In this method of manufacturing a sealing substrate, the substrate may be light-transmissive, and the mark may be formed so that it can be recognized by light transmitted through the substrate.

According to this, it is possible to manufacture a sealing substrate in which the mark can be recognized from the surface opposite to the surface on which the mark is formed.

(10) In this method for manufacturing a sealing substrate, in the step (b), the position of the cutting line may be determined by the mark to cut the substrate.

According to this, since the substrate is cut with high positional accuracy, the shape of the sealing substrate can be made constant.

(11) The sealing substrate according to the present invention is manufactured by the above method.

(12) A display device according to the present invention includes the above-mentioned sealing substrate and a display section sealed by the sealing substrate.

(13) An electronic device according to the present invention includes the above display device.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 are diagrams illustrating a method of manufacturing a sealing substrate according to an embodiment of the present invention. In the present embodiment, a mask 12 is provided on the substrate 10 as shown in FIG. 2, 3 and 4 are respectively shown in FIG.
II-II line, III-III line, IV-IV line sectional view of.

The substrate 10 does not or hardly permeates oxygen and moisture. The substrate 10 may be formed of an inorganic oxide (glass (soda lime glass, borosilicate glass, aluminosilicate glass, silicate glass, etc.), quartz, ceramics, etc.). In this embodiment,
The substrate 10 may be light-transmissive and only transmit light having a specific wavelength. Alternatively, the substrate 10 may not transmit light. That is, the substrate 1
0 may be transparent or opaque, and may have a color filter function.

The mask 12 includes a plurality of openings (in the present embodiment, one or more first openings 14, one or more second openings 16 and one or more first openings 14). Three
18). The first opening 14 has a shape (for example, a polygon such as a quadrangle (including a rectangle and a square)) corresponding to the opening of the recess 20 of the sealing substrate. As shown in FIG. 1, the plurality of first openings 14 may be arranged in a matrix.

The second and third openings 16 and 18 may have the same shape, but in the present embodiment, they have different shapes. The second opening 16 has an L shape (for example, a line width of 0.2 mm or less). The third opening 18 is
It has a circular shape (for example, a diameter of 0.2 mm or less). The shapes of the second and third openings 16 and 18 are not limited to these, but may be cross-shaped (X-shaped) (for example, a line width of 0.2 mm).
The following) may be applicable.

Next to the one first opening 14, one of at least one opening other than the first opening 14 (for example, at least one second opening 16 and at least one third opening 18). Or both) are formed. When the first opening 14 has a polygonal shape, one opening other than the first opening 14 (second or third opening 1
6, 18) may be formed. The second opening 16 is formed next to one corner of the pair of opposite corners of the first opening 14 (corners at both ends of the diagonal line), and the second opening 16 is formed next to the other corner. The third opening 18 having a different shape from the opening 16 may be formed. Next to a pair of corners located at both ends of one side of the first opening 14, a pair of openings having the same shape (for example, a pair of second openings 16 or a pair of third openings 18) is formed. May be. L-shaped opening (second opening 1
6) may be formed such that the inner corner side thereof is arranged toward the corner of the first opening 14.

The mask 12 can be formed of a resin (for example, a resin sensitive to energy (light or the like)). When a resin is used, a resin layer may be formed on the substrate 10 to form an opening by photolithography, a resin layer having an opening may be formed by screen printing, or a film having an opening in advance may be formed. It may be formed and attached to the substrate 10 as the mask 12.

Next, the portion of the substrate 10 exposed from the openings (first, second, third openings 14, 16, 18) of the mask 12 is shaved. As the method, sandblast, etching (for example, wet etching) or the like can be applied. The substrate 10 is ground at the same time with respect to the exposed portions from all the openings (first, second, third openings 14, 16, 18) of the mask 12.

FIG. 5 is a view showing the substrate 10 with a part thereof cut away, and FIGS. 6, 7 and 8 are respectively VI-VI line of FIG.
FIG. 7 is a sectional view taken along line VII-VII and line VIII-VIII. One or more recesses 20 and marks (for example, the first and second marks 22 and 24) located next to the recesses 20 are simultaneously formed in the substrate 10 by cutting a part. . According to this, since the marks (for example, the first and second marks 22 and 24) are formed at the same time when the recess 20 is formed, the number of steps is not increased. Further, since the recessed portion 20 and the marks (for example, the first and second marks 22 and 24) are formed by shaving the exposed portion from the opening of the mask 12, their relative positional accuracy is high.

The recess 20 is formed by the mask 12 on the substrate 10.
Is formed by shaving the exposed portion from the first opening 14. The recess 20 has a polygonal shape such as a quadrangle (including a rectangle and a square). As shown in FIG.
The plurality of recesses 20 may be arranged in a matrix. The depth of the recess 20 may be greater than or equal to the thickness of the display portion 62 (see FIG. 12) sealed by the sealing substrate.
The bottom surface of the recess 20 may be a rougher surface (for example, an uneven surface) than the front and back surfaces of the substrate 10.

Marks (first and second marks 22, 2
4) is formed by shaving exposed portions from openings (second and third openings 16 and 18) other than the first opening of the mask 12 in the substrate 10.

The first and second marks 22 and 24 may have the same shape, but in the present embodiment, they have different shapes. The first mark 22 has an L shape (for example, a line width of 0.2 mm or less). Second mark 2
4 is a circle (for example, a diameter of 0.2 mm or less). First
The shapes of the second marks 22 and 24 are not limited to these, and may be cross-shaped (X-shaped) (for example, a line width of 0.2 mm or less). The marks (eg, the first and second marks 22 and 24) may be formed shallower than the recess 20.

Next to one recess 20, at least one mark (eg, at least one first mark 22).
And at least one second mark 24 and / or both) are formed. When the opening of the recess 20 is polygonal, one mark (first or second mark 22, 24) may be formed next to one corner thereof.
The first mark 22 is formed next to one corner of the pair of opposite corners of the recess 20 (corners at both ends of the diagonal), and the first mark 22 is formed next to the other corner. The second mark 24 having a different shape may be formed. According to this, it is possible to manufacture a sealing substrate that can recognize the opposite direction.

A pair of marks having the same shape (for example, a pair of first marks 22 or a pair of second marks 24) is formed next to a pair of corners located at both ends of one side of the recess 20. May be. The L-shaped first mark 22 may be formed such that the inner corner side thereof is arranged toward the corner of the recess 20. In the present embodiment, a plurality of marks (for example, the first mark
Since the second marks 22 and 24) are formed at separate positions, it is possible to manufacture a sealing substrate that can be easily positioned.

The condition of the front and back surfaces of the substrate 10 is JIS B0.
According to the definition of 601, the following conditions may be satisfied.

Average surface roughness: 0.001 μm ≦ Ra ≦ 0.05 μm Maximum height difference: 0.1 μm ≦ PV ≦ 1.0 μm Root mean square surface roughness: 0.005 μm ≦ RMS ≦ 0.07 μ
m 10-point average surface roughness: 0.01 μm ≦ Rz ≦ 0.50 μm In this case, the bottom surface of the recess 20 or the mark (for example, the first and second marks 22 and 24) may satisfy the following condition. .

Average surface roughness: 0.05 μm ≦ Ra ≦ 2.0 μm Maximum height difference: 1.0 μm ≦ P−V ≦ 15 μm Root mean square surface roughness: 0.07 μm ≦ RMS ≦ 2.0 μm 10-point average surface roughness Size: 0.50 μm ≦ Rz ≦ 10 μm The marks (for example, the first and second marks 22 and 24) are formed so as to have a bottom surface having a roughness different from the front and back surfaces of the substrate 10, and the substrate 10 is made light-transmissive. If so, the mark (for example, the first and second marks 22 and 24) can be recognized by the light transmitted through the substrate 10. According to this, the marks (for example, the first and second marks 22, 24)
The mark (for example, the first and second marks 22 and 24) can be recognized from the surface opposite to the surface where the mark is formed.

When the substrate 10 is completely ground, the mask 12 is removed, and then the substrate 10 is cut. As shown in FIG. 5, the cutting line L is located so as to avoid the recess 20 and the marks (for example, the first and second marks 22 and 24). In addition, at least one cutting line L is located in a portion that divides the plurality of recesses 20 and is adjacent to each other.
It is located between a pair of marks (for example, first and second marks 22 and 24) corresponding to the pair of recesses 20. The cutting line L surrounds a region having one recess 20 and a mark (for example, the first and second marks 22 and 24). The position of the cutting line L may be determined by marks (for example, the first and second marks 22 and 24). According to this, since the substrate 10 is cut with high positional accuracy, the shape of the chip substrate (sealing substrate) 30 can be made constant.

As a method of cutting the substrate 10, a groove or a scratch may be made on the substrate 10 by a scribe or the like to break the substrate 10, or the substrate 10 may be fully cut by a cutter or the like, or the cutter or the like may be pressed against the substrate 10. The cutting may be performed by stress, or immediately after compressive stress is applied to the substrate 10 by heat, the substrate 10 may be cooled and tensile stress may be applied to cut.

In this embodiment, the substrate 10 is cut to obtain a plurality of chip substrates 26. Each chip board 26
Includes one recess 20 and a mark (one or more first
Mark 22 and one or more second marks 24
And one or both)). The chip substrate 26 is
It becomes a sealing substrate.

FIG. 9 shows the sealing substrate 30 obtained by the above steps. The sealing substrate 30 has a plate portion 34 that forms the bottom surface of the recess 20 and a frame portion 36 that forms the inner wall surface of the recess 20. The frame portion 36 has a shape surrounding at least the display portion 62 (see FIG. 12). The frame portion 36 may have a square ring shape. The inner wall surface of the recess 20 may be perpendicular to the bottom surface or may be inclined. The sealing substrate 30 has a desiccant 32 on the recess 20 (more specifically, on the bottom surface).
May be attached.

According to the present embodiment, it is possible to manufacture the sealing substrate 30 having the recess 20 and the marks (for example, the first and second marks 22 and 24). The sealing substrate 30 has marks (for example, the first and second marks 22,
24) can be used to easily perform the alignment. Since the sealing substrate 30 has at least two marks (for example, the first and second marks 22 and 24), its direction can be detected. Moreover, since the recesses 20 and the marks (for example, the first and second marks 22 and 24) of the plurality of sealing substrates 30 are simultaneously formed, the productivity is high.

10 to 12 are views for explaining the method of manufacturing the display device according to the embodiment of the present invention. In the present embodiment, as shown in FIG. 10, a plurality of sealing substrates 30 are used.
Are arranged on the tray 40. For example, the sealing substrate 30 is arranged with the recess 20 thereof facing the tray 40. Tray 40
Is formed with a partition for partitioning the adjacent sealing substrates 30, and the respective sealing substrates 30 can be arranged corresponding to the mounting direction. When the accuracy of the direction is not high, the direction in which the sealing substrates 30 are arranged is corrected by the direction correction stage 50. On the direction correction stage 50, a moving base (for example, a turntable) 52 on which the sealing substrate 30 is placed and which rotates at least (or additionally moves two-dimensionally) 52, a camera 54,
Is provided. The sealing substrate 30 is transferred from the tray 40 to the moving table 52 using, for example, an adsorption device (not shown). For example, the sealing substrate 30 is arranged so that the concave portion 20 faces the moving table 52.

As shown in FIG. 10 or FIG.
When the sealing substrate 30 is placed on the second substrate 2, a mark (for example, the first and second marks 22 and 2) is recorded by the camera 54.
4) is imaged. Specifically, light is transmitted through the sealing substrate 30, and a mark (engraved) formed (engraved) on the surface of the sealing substrate 30 opposite to the camera 54 (for example, the first
And the second marks 22, 24) are imaged.

As shown in FIG. 11, marks (for example, the first and second marks 2) are formed in the image pickup area 56 of the camera 54.
2, 24) are imaged. An image actually obtained by imaging (hereinafter referred to as an actual image) is stored in the storage unit. In addition, an image (hereinafter, referred to as an accurate image) of a mark (for example, the first and second marks 22 and 24) obtained by imaging when the sealing substrate 30 faces the correct direction is previously stored in the storage unit. In memory and compare the actual image with the accurate image. As a result of the comparison, if it is found that the two are displaced, the movable table 52 is moved (for example, rotated). Then, for example, the movement of the movable table 52 and the comparison between the actual image and the accurate image are repeated, and the movable table 52 is stopped at the position where the actual image and the accurate image are closest to each other. Alternatively, it is also possible to calculate how much in which direction and how much the image is displaced from the actual image and the accurate image, and move the movable table 52 based on the calculated value. Thus, the sealing substrate 3
The arrangement direction of 0 can be corrected.

In this embodiment, the sealing substrate 30 is used.
, A plurality of marks having different shapes (for example, the first and second marks 22 and 24) are formed, and at least two marks are imaged. For example, in a pair of imaging regions 56 targeting a pair of opposite corners of the sealing substrate 30,
The first and second marks 22, 24 are imaged. When the second mark 24 is imaged in the imaging region 56 where the first mark 22 is to be imaged, it is found that the sealing substrate 30 has the opposite direction (the angle is shifted by 180 °). . In that case, the moving table 52 is rotated by 180 °, and then the arrangement direction of the sealing substrate 30 is corrected. According to this, even if the direction of the sealing substrate 30 is opposite, it can be corrected.

Next, as shown in FIG. 12, the sealing substrate 3
0 is attached to the substrate 60. A display unit 62 is provided on the substrate 60, and the sealing substrate 30 is attached to the substrate 60 so as to seal the display unit 62, specifically, the display unit 62 is arranged in the recess 20. In the step, the sealing substrate 30 is adsorbed by an adsorption device (not shown), is moved in parallel from the moving table 52 onto the substrate 60, and is placed on the substrate 60 so that the directions before and after the movement are parallel. Good. The substrate 6
0 is arranged so as to face an accurate direction so as to correspond to the sealing substrate 30 whose arrangement direction is corrected in advance. Alternatively, the arrangement direction of the sealing substrate 30 is corrected so as to correspond to the arrangement direction of the substrate 60.

As shown in FIG. 13, the sealing substrate 30 is fixed to the substrate 60. For example, the frame portion 36 of the sealing substrate 30 and the substrate 60 are pressurized after the adhesive 38 is provided between the frame portion 36 and the substrate 60, and a curing treatment (for example, heating, ultraviolet irradiation, etc.) according to the property of the adhesive 38 is performed. . Thus, the display device can be manufactured.

The display device is, for example, an organic EL (Electrolum).
inescence) panel. The display device includes a substrate 60,
The display unit 62 and the sealing substrate 30 are included. At least the display portion 62 is sealed by the sealing substrate 30. The sealed space may be filled with nitrogen or evacuated. In this display device, the light generated by the display unit 62 is emitted to the substrate 60 side. That is, the image is displayed on the substrate 60 side. As a modification, the desiccant 32 may be omitted and the display unit 62 may be configured so that an image is displayed on the sealing substrate 30 side.

FIG. 14 shows the substrate 6 provided with the display section 62.
It is a figure explaining the detail of 0. The substrate 60 is light transmissive and may be a glass substrate or a plastic substrate. A display unit 62 is provided on the substrate 60 in a region sealed by the sealing substrate 30. Board 60
Includes a scanning side drive circuit 64 for driving the display unit 62.
(And the wiring connected to this). In the present embodiment, the scanning side drive circuit 64 (and part of the wiring connected thereto) is also formed in the region sealed by the sealing substrate 30. Power supply lines 66, 68, and 70 are formed on the substrate 60 in accordance with the three colors of red, green, and blue. The cathode wiring 72 is formed on the substrate 60.
A flexible substrate 76 on which an integrated circuit chip 74 is mounted is attached to the substrate 60. The integrated circuit chip 74 is electrically connected to various wirings formed on the substrate 60. The integrated circuit chip 74 has a data side driving circuit.

FIG. 15 is a diagram showing details of the display unit 62. In the display unit 62, a plurality of switching elements 78 (for example, thin film transistors) are formed on the substrate 60. The display unit 62 has a plurality of colors (for example, three colors of red, green, and blue).
It has a plurality of light emitting elements 80 that emit light of different colors. The switching element 78 controls the light emitting element 80. The light emitting element 80 includes a pixel electrode 82, a cathode 86 (specifically, a part thereof), and a light emitting layer 84 between them. The pixel electrode 82 is composed of the power supply lines 66, 68,
It is electrically connected to 70. The cathode 86 is electrically connected to the cathode wiring 72 shown in FIG. The light emitting layer 84 emits light by the current supplied from the pixel electrode 82.

The adjacent light emitting layers 84 are partitioned by the bank portion 88. The light emitting layer 84 may be a polymer or a low molecule. When a polymer material is used as the light emitting layer 84, it is important to shield it from oxygen and moisture, and it is effective to use the sealing substrate according to the present invention.

As an electronic apparatus having the display device according to the embodiment of the present invention, a notebook personal computer 1000 is shown in FIG. 16, and a mobile phone 200 is shown in FIG.
0 is shown.

The present invention is not limited to the above-described embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a method of manufacturing a sealing substrate according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a diagram illustrating a method of manufacturing the sealing substrate according to the embodiment of the present invention.

6 is a sectional view taken along line VI-VI of FIG.

7 is a sectional view taken along line VII-VII of FIG.

FIG. 8 is a sectional view taken along line VIII-VIII of FIG.

FIG. 9 is a diagram showing a sealing substrate according to an embodiment of the present invention.

FIG. 10 is a diagram for explaining the manufacturing method for the display device according to the embodiment of the present invention.

FIG. 11 is a diagram for explaining the manufacturing method for the display device according to the embodiment of the present invention.

FIG. 12 is a diagram for explaining the manufacturing method for the display device according to the embodiment of the present invention.

FIG. 13 is a diagram showing a display device according to an embodiment of the present invention.

FIG. 14 is a diagram illustrating a substrate on which a display unit is formed.

FIG. 15 is a diagram illustrating a display unit.

FIG. 16 is a diagram showing an electronic device according to an embodiment of the present invention.

FIG. 17 is a diagram showing an electronic device according to an embodiment of the present invention.

[Explanation of symbols]

10 substrates 12 masks 14 First opening 16 Second opening 18 Third opening 20 recess 22 first mark 24 second mark 26 chip substrate 30 Sealing substrate 62 display

Claims (13)

[Claims] 1. A substrate is formed with (a) one or more recesses and a mark located next to each recess at the same time, and (b) a region having one recess and the mark. A method of manufacturing a sealing substrate, which comprises cutting the substrate outside. 2. The method for manufacturing a sealing substrate according to claim 1, wherein in the step (a), a mask having a plurality of openings is provided in the substrate, and a portion of the substrate exposed from the openings of the mask. A method for manufacturing a sealing substrate, in which the recess and the mark are simultaneously formed by shaving. 3. The method for manufacturing a sealing substrate according to claim 1, wherein in the step (b), a plurality of chip substrates each having one recess and one mark are formed from the substrate. A method of manufacturing a sealing substrate to be obtained. 4. The method for manufacturing a sealing substrate according to claim 3, wherein in the step (a), a plurality of the marks are formed on the substrate next to the respective recesses, and the step (b) is performed. Then, a method for manufacturing a sealing substrate, in which a plurality of chip substrates each having one of the recess and the plurality of marks are obtained from the substrate. 5. The method for manufacturing a sealing substrate according to claim 4, wherein in the step (a), each of the recesses is formed so as to have a polygonal opening shape, and one of the marks is formed by the plurality of marks. A method for manufacturing a sealing substrate, which is formed next to one corner of a prism. 6. The method for manufacturing a sealing substrate according to claim 5, wherein in the step (a), a pair of marks positioned adjacent to a pair of opposite corners of the polygon are included in the plurality of marks. A method for manufacturing a sealing substrate in which marks are formed in different shapes. 7. The method for manufacturing a sealing substrate according to claim 1, wherein the recesses are formed so as to be arranged in a matrix. 8. The method for manufacturing a sealing substrate according to claim 1, wherein the mark is formed so as to have a bottom surface having a roughness different from the front and back surfaces of the substrate. Method of manufacturing stop substrate. 9. The method for manufacturing a sealing substrate according to claim 8, wherein the substrate has a light-transmitting property, and the mark is formed so as to be recognizable by light passing through the substrate. Substrate manufacturing method. 10. The method for manufacturing a sealing substrate according to claim 9, wherein in the step (b), the position of the cutting line is determined by the mark and the substrate is cut. 11. A sealing substrate manufactured by the method according to any one of claims 1 to 10. 12. A sealing substrate according to claim 11, A display unit sealed by the sealing substrate, Display device including. 13. An electronic device including the display device according to claim 12.