JP2006253097A - Self-luminous panel and method for producing self-luminous panel - Google Patents

Abstract

[PROBLEMS] To improve the yield of a self-luminous panel that is large and thin.
A self-luminous element 103 having a substrate 101, a film-forming layer including at least a light-emitting layer formed on a lower electrode formed on the substrate 101, and a surface of the substrate 101 on which the self-luminous element 103 is formed are opposed to each other. A self-luminous panel 100 having a sealing substrate 102 and a sealing substrate 102 sealed and bonded to each other, and a supporting member is provided between the at least one self-luminous element 103 and the adjacent self-luminous element 103 on the substrate 101. And a resin member 105 to be bonded to the substrate 101 at least at a position facing the support member on the surface of the sealing substrate 102 to be sealed and bonded to the substrate 101, and the support member and the resin member 105 are bonded to face each other. A hollow portion 106 is provided between the formation position of the self-luminous element 103 on the substrate 101 and the sealing substrate 102 and sealed and bonded.
[Selection] Figure 1

Description

  The present invention relates to a self-luminous panel and a method for manufacturing the self-luminous panel.

  2. Description of the Related Art In recent years, for example, self-luminous panels that use organic electroluminescence (EL) elements as self-luminous elements have been used in display displays and display elements of various information devices. Yes.

  A self-luminous panel is a display device that uses one or more self-luminous elements formed on a substrate as a display element for information display such as characters, symbols, images, and images, or for fixed display such as lighting and various interiors. It is. In particular, in an organic EL panel that uses an organic EL element as a display element, in order to prevent the influence of deterioration factors that degrade the organic EL element, such as moisture contained in the outside air, a sealing means that blocks the organic EL element from the outside air is used. It is sealed. In the present embodiment, the information display is a display used for displaying characters, symbols, images, videos, etc. using a plurality of display elements, or a display such as lighting or various interiors.

  The sealing means here is one that is hermetically sealed by a sealing substrate (hermetic sealing method), one that is solid-sealed with a resin or the like filled between the substrate and the sealing substrate (solid sealing method) And a self-luminous element covered with a film-like or film-like sealing film having a barrier property (film sealing method).

  As one of the above-described hermetic sealing methods, for example, a flat glass is used as a sealing substrate, and a hollow portion is formed between a substrate on which an organic EL element which is one of self-luminous elements is formed. There is a method in which a drying means is installed (for example, see Patent Document 1 below).

  As one of the solid sealing methods, for example, there is a method of sealing an organic EL element using a resin film or the like (for example, see Patent Document 2 below). In this method, the organic EL element is covered with a sealing resin, and the resin film (sealing resin) is sealed with a sealing substrate such as flat glass.

  On the other hand, in the case of an organic EL element, if a part causing a defect such as a light emission failure is a part of the element, the light emission state in the element is irradiated by irradiating the light emission defective part with a laser and peeling the part irradiated with the laser. Can be within a good range (repaired). By this repair, it is possible to improve the yield when manufacturing the self-luminous panel (for example, see Patent Document 3 below).

JP 2002-151252 A Japanese Patent Laid-Open No. 11-40345 Japanese Patent Laid-Open No. 2000-333182

  In the hermetic sealing method, the substrate and a display region (also referred to as an active region) where a display element such as an organic EL element formed on the substrate is sealed and bonded with an adhesive such as a UV curable resin. In this case, the self-luminous panel is made thin by reducing the amount of adhesive applied. However, there are problems such as formation of a portion where the adhesive is insufficiently applied and insufficient sealing of the self-luminous panel. Furthermore, when the self-luminous panel is to be enlarged, the sealing substrate is flexed as the sealing substrate is enlarged, and the drying means formed on the sealing substrate comes into contact with the self-luminous element. Have.

  The solid sealing method does not require any adhesive coating or drying means outside the display area, but since the sealing resin and the self-luminous element are in contact with each other, the display element in which the light emitting failure has occurred is obtained by the above method. Repairs cannot be made, and there are problems such as a decrease in yield and display quality in the manufacture of self-luminous panels.

  Therefore, the present invention is an example of a problem to cope with such problems. That is, an object of the present invention is to reduce the thickness or size of the self-luminous panel. Another object of the present invention is to prevent deterioration in display quality such as light emission failure of a display element of a self-luminous panel. Furthermore, an object of the present invention is to improve the yield in the manufacture of a self-luminous panel.

  In order to achieve such an object, a self-luminous panel and a manufacturing method according to the present invention include at least the configurations according to the following independent claims.

  The self-luminous panel according to the invention of claim 1 is formed on a substrate, a lower electrode formed on the substrate, a film-forming layer including at least a light-emitting layer formed on the lower electrode, and the film-forming layer. A self-luminous element having an upper electrode, and a sealing substrate sealed and bonded to the substrate so as to face the self-luminous element formation surface of the substrate, and the one self-luminous element on the substrate Is formed as a single display element and displays information using a plurality of the self-light-emitting elements, wherein at least one self-light-emitting element adjacent to the self-light-emitting element on the substrate. A support member is provided between the support member and the resin member. The support member and the resin member are provided on the surface of the sealing substrate that is sealed and bonded to the substrate. And face the A hollow portion is provided, characterized in that the sealing joint between the sealing substrate and forming position of the self-luminous element above.

  The self-luminous panel according to the invention of claim 2 is formed on a substrate, a lower electrode formed on the substrate, a film-forming layer including at least a light-emitting layer formed on the lower electrode, and the film-forming layer. A self-luminous element having an upper electrode, and a sealing substrate sealed and bonded to the substrate so as to face the self-luminous element formation surface of the substrate, and the one self-luminous element on the substrate Is a self-luminous panel that displays information using a plurality of self-luminous elements, and is adjacent to at least one self-luminous element on the sealing substrate on the sealing substrate. A support member is provided at a position opposite to the position between the self-luminous elements that match each other, and a resin member that adheres to the substrate is provided on at least the support member surface of the sealing substrate, and the substrate and the sealing substrate Less formation position of the resin member on And adhering one self-light-emitting element to a position between the adjacent self-light-emitting elements facing each other, and forming a hollow portion between the formation position of the self-light-emitting element on the substrate and the sealing substrate. It is provided and sealed and joined.

  According to a seventh aspect of the present invention, there is provided a self-luminous panel manufacturing method comprising a substrate, a lower electrode formed on the substrate, a film-forming layer including at least a light-emitting layer formed on the lower electrode, and the film-forming layer. A self-light-emitting element having an upper electrode formed thereon, and a sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface of the substrate. In a method for manufacturing a self-light-emitting panel in which a self-light-emitting element is formed as one display element and information display is performed using the plurality of self-light-emitting elements, the self-light-emitting element is formed with a plurality of the self-light-emitting elements on the substrate A supporting member forming step of forming a supporting member between the forming step, at least one of the self-luminous elements and the self-luminous element formed at a position adjacent to the self-luminous elements, and at least the sealing substrate on the sealing substrate Said support on the substrate A resin member forming step of forming a resin member at a material forming position, and the support member on the substrate and the position of the resin member on the sealing substrate are opposed to each other on the self-luminous element on the substrate; And a sealing and bonding step of forming a hollow portion between the substrate and the resin member as an adhesive, and sealing and bonding the substrate and the sealing substrate.

  A manufacturing method of a self-luminous panel according to the invention of claim 9 includes a substrate, a lower electrode formed on the substrate, a film-forming layer including at least a light-emitting layer formed on the lower electrode, and the film-forming layer. A self-light-emitting element having an upper electrode formed thereon, and a sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface of the substrate. In a method for manufacturing a self-light-emitting panel in which a self-light-emitting element is formed as one display element and information display is performed using the plurality of self-light-emitting elements, the self-light-emitting element is formed with a plurality of the self-light-emitting elements on the substrate A supporting member at a position opposite to a position between the forming step and at least one of the self-light-emitting element on the substrate and the self-light-emitting element formed at a position adjacent to the self-light-emitting element on the sealing substrate; Support member forming process for forming A resin member forming step of forming a resin member on at least the support member on the sealing substrate, and at least one of the self-light-emitting elements on the substrate and the self-light-emitting elements formed at positions adjacent to the self-light-emitting elements. A position between the element and the position of the support member and the position of the resin member on the sealing substrate are opposed to each other, and a hollow portion is formed between the substrate and the self-luminous element on the substrate. And a sealing bonding step of sealingly bonding the substrate and the sealing substrate using the resin member as an adhesive.

  Exemplary embodiments of a self-luminous panel and a method for producing the self-luminous panel according to the present invention will be described below in detail with reference to the accompanying drawings.

(Embodiment 1)
(Schematic configuration of self-luminous panel)
FIG. 1 is a longitudinal side view showing a schematic configuration of the self-luminous panel of the first embodiment. The self-luminous panel 100 of the first embodiment includes a substrate 101, a sealing substrate 102, a self-luminous element 103, a support member 104, a resin member 105, and a hollow portion 106.

  In the first embodiment, the self-luminous panel is a mobile phone, an in-vehicle monitor, a home appliance operation panel, a dot matrix display panel such as a PC or a TV, a fixed display for a clock or an advertising panel, a scanner, A light source for a printer, illumination, an outdoor display such as an aurora vision, a liquid crystal backlight, and the like correspond to this. Self-luminous panels vary in size from small to large screens such as Aurora Vision.

  For the substrate 101, for example, glass, metal, or a resin such as PET (polyethylene terephthalate) can be used. When the self-luminous element 103 is an organic EL element having a bottom emission structure for extracting light from the substrate 101 side or a TOLED structure for extracting light from both sides of the substrate 101 side and the opposite side, glass or resin having excellent transparency Then, the substrate 101 is formed. For example, when the self-luminous element 103 is an organic EL element having a top emission structure that extracts light from the side opposite to the substrate 101 side, the material forming the substrate 101 is not particularly limited, and may be glass or transparent. The substrate 101 may be formed of any material of the metal to be applied. The substrate 101 may be a substrate on which a driving circuit such as a substrate on which a self-luminous element can be passively driven or a substrate on which a TFT capable of active driving is arranged is not particularly limited.

  The sealing substrate 102 has a flat plate shape. The shape of the sealing substrate 102 is not limited to a flat plate shape. As a material for forming the sealing substrate 102, various materials such as glass substrates such as soda glass and hard glass, plastic substrates such as polyethylene, polypropylene, polyethylene terephthalate, and polyvinyl alcohol, and metal substrates such as aluminum and stainless steel. Can be used. As a material for forming the sealing substrate 102, a suitable material can be appropriately selected according to the configuration of the self-luminous panel 100.

  In addition, when the self-light emitting element 103 is an organic EL element having a top emission structure or a TOLED structure, the sealing substrate 102 is set to a thickness having a high transmittance in addition to using a highly transparent material. It is preferable to do. On the other hand, when the self-light-emitting element 103 is an organic EL element having a bottom emission structure, a transparent metal material or the like may be used as a material for forming the sealing substrate 102.

  The self-light-emitting element 103 according to the first embodiment is realized by an organic EL element. In this embodiment mode, a self-luminous element is an organic EL element, an inorganic EL element, or other self-luminous display element having a film formation layer. Although not particularly shown, the organic EL element has an electrode pair and an organic layer sandwiched between the electrode pair. The organic layer has a structure in which a plurality of layers having various functions are stacked. In such an organic EL element, it is laminated in the order of “lower electrode (anode) / hole injection layer / hole transport layer / organic EL light emitting layer / electron transport layer / electron injection layer / upper electrode (cathode)”. Structures are common.

  Each layer in the organic EL element may be formed of a single organic material, may be formed by mixing a plurality of materials (mixed layer), or organic in a polymer binder. A material in which a functional material of inorganic type or inorganic type is dispersed may be used. The functional material includes a charge transport function, a light emitting function, a charge blocking function, an optical function, and the like. In addition, each layer in the organic EL element may include a layer having a planarizing function for interfering with unevenness on the surface of the light emitting layer generated by the film forming process of the light emitting layer.

  In addition, the organic EL element has a reverse stack structure in which the electrode located above the light emitting layer is an anode and the electrode located below the light emitting layer is a cathode, or a light emitting layer is constituted by a plurality of layers. A structure in which a plurality of light emitting layers having different emission colors are stacked (SOLED: Stacked OLED), a structure in which a layer for injecting electric charge is interposed between an upper electrode and a lower electrode (multiphoton element), a hole transport layer For example, a layer in which a plurality of layers are omitted, a layer in which a plurality of layers are laminated, a device structure having only one organic layer (each functional layer is continuously formed, or a layer boundary is eliminated) may be used. In addition, this Embodiment does not limit the structure of an organic EL element.

  As a specific example, when the lower electrode is an anode, for example, ITO (indium-tin oxide), IZO (indium-zinc oxide), or the like can be used for the anode. Similarly, when the upper electrode is a cathode, an alkali metal such as Al (aluminum) or Ag (silver) calcium (Ca), an alkaline earth metal, an alloy of magnesium and silver, or the like is used for the cathode. As an example of the most suitable organic EL element, there is a structure in which glass is used for the substrate, ITO is used for the anode, and an alloy of Mg and Ag, for example, a metal such as Al is used for the cathode.

  The organic layer has various patterns in which the organic layer corresponds to the emission color of each pixel when an organic EL element exhibiting a plurality of emission colors such as RGB three-color full color, two colors, and four colors is used as the self-light-emitting element 103. It is possible to form. In forming the organic layer, the hole transport layer, the electron transport layer, and the like may be formed to have a desired film thickness in consideration of emission color, optical adjustment, and the like.

  The support member 104 is disposed on the substrate 101 between the self light emitting elements 103, and a hollow portion 106 is provided between the substrate and the sealing substrate 102 to insulate the self light emitting elements 103. Specifically, the support member 104 is provided so that at least one of the electrode pairs included in each light emitting element 103 is insulated for each self light emitting element 103. In the first embodiment, a support member 104 that insulates the lower electrode for each self-luminous element 103 is provided.

  The form of the support member 104 is not particularly limited, and may be a spherical shape, a quadrangular prism, or a triangular prism. The arrangement of the supporting member 104 is on any one of the substrate 101 and the sealing substrate 102, and includes a stripe shape, a lattice shape, a dot shape, and the like, and is not particularly limited. The film thickness of the support member 104 is preferably 0.1 μm to 1000 μm, and more preferably 0.5 μm to 10 μm from the viewpoint that the support member can be satisfactorily formed.

Examples of the material constituting the support member 104 include organic materials such as ultraviolet curable resins, thermosetting resins, thermoplastic resins, and two-component curable resins, and inorganic materials such as SiO ₂ and Al ₂ O ₃ . An inorganic oxide etc. are mention | raise | lifted and these materials are not limited. A highly moisture-proof material that hardly generates gas that adversely affects the self-luminous element 103 during the curing reaction or the like and hardly allows moisture to pass through from the outside air is preferably used.

  If necessary, another support member 104 may be formed on the support member 104, but the added film thickness as the support member is preferably 0.1 μm to 1000 μm.

  The resin member 105 is provided between the substrate 101 and the sealing substrate 102. The resin member 105 is formed by molding a resin into a film shape. As the resin forming the resin member 105, for example, a radically radical polymerizable resin mainly composed of various acrylates such as polyester acrylate, polyether acrylate, epoxy acrylate, polyurethane acrylate, etc., and a resin such as epoxy or vinyl ether as a main component. Photo-curing polymerizable resins, curable resins such as thiol / ene-added resins, polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polystyrene, polyethersulfone, polyarylate, polycarbonate, polyurethane, acrylic resin, poly Acrylic nitrile, polyvinyl acetal, polyamide, polyimide, diacryl phthalate resin, cellulosic plastic, polyvinyl acetate, polyvinyl chloride, polychlorinated Vinylidene and the like, and thermoplastic resins such as those of two or more copolymers, and the like thermosetting resin.

  The hollow portion 106 is provided between the self light emitting element 103 and the resin member 105, that is, between the self light emitting element 103 and the sealing member 107. The hollow portion 106 is provided so as to face the plurality of self-light emitting elements 103 provided on the substrate 101.

  The interval along the facing direction of the self-light emitting element 103 and the sealing member 107 in the hollow portion 106 is such that the resin member 105 is not melted when irradiated with a laser for the purpose of correcting the emission luminance. Is secured. More specifically, the distance along the facing direction between the self-light-emitting element 103 and the sealing member 107 in the hollow portion 106 of the present embodiment is along the facing direction between the self-light-emitting element 103 and the sealing member 107. It is larger than the dimension of the self-light emitting element 103.

The hollow portion 105 may be in a vacuum or may be depressurized from the atmospheric pressure. In this case, the hollow portion 105 is filled with an inert gas such as N _2, and is not limited to these gases as long as it is a gas that does not deteriorate the self-luminous element. In the first embodiment, an example in which the supporting member 104 is arranged on the substrate 101 and the sealing substrate 102 is bonded to form the self-luminous panel 100 is described. However, the supporting member 104 is the sealing substrate. It may be formed on the 102 side.

(Self-luminous panel manufacturing method)
Next, an example of a method for manufacturing the self-luminous panel 100 of the first embodiment will be described. First, a plurality of self-luminous elements 103 are formed on one surface side of the substrate 101. When the self-luminous panel 100 to be manufactured is the self-luminous panel 100 that performs full-color display, the self-luminous elements 103 of each color of R, G, and B are formed. Although illustration and description are omitted because it is a known technique, an electrode (lower electrode and upper electrode) layer or an organic layer is formed by using a vapor deposition method, a sputtering method, or the like when the self-luminous element 103 is formed. Here, the self-luminous element forming step is realized.

  In the self light emitting element formation step, the support member 104 is formed after the lower electrode is formed on the substrate 101. Since the creation method regarding the lower electrode is a known technique, it is omitted. In the case of the self-luminous panel 100 using the common upper electrode, the insulating film 104 that insulates the lower electrode is formed before the upper electrode is formed. In forming the support member 104, for example, before forming the light-emitting element 103 on the substrate 101, after dropping positive photosensitive polyimide on the substrate 101, the film thickness after thermosetting is 0.1 μm to 1000 μm. Then, a uniform film thickness is formed by spin coating. The substrate 101 on which the positive photosensitive polyimide is applied is heated at 120 ° C. With the photomask placed on the heat-treated substrate 101, the substrate 101 is exposed. After the exposure, the substrate 101 is immersed in an alkaline developer, and the unexposed portion is dissolved and removed. Thereby, a pattern of positive photosensitive polyimide is formed. Thereafter, the substrate 101 is stored in a clean oven at 300 ° C. and thermally cured.

Next, the self-luminous element 103 is formed on the substrate 101. In the method for forming a self-luminous element, when an organic EL element is formed as the self-luminous element, the substrate is placed in a film formation chamber. On the substrate 101, the hole injection layer is CuPc (200 angstroms), the hole transport layer is TPD (400 angstroms), the light emitting layer and the electron transport layer are Alq ₃ (600 angstroms), and the upper electrode is an Mg: Ag alloy (1000 angstroms). And a composition ratio of 10: 1) are sequentially formed and laminated.

  When forming the sealing member 107, the sealing substrate 102 coated with an ultraviolet curable resin by a spin coating method and the substrate 101 are bonded together in a vacuum so that the resin does not flow into the light emitting element 103 or the like. The substrate 102 is temporarily cured by irradiating ultraviolet rays from the upper side. Next, after the UV-cured resin that has been temporarily cured is cured by heating, the unnecessary portion of the substrate is cut to obtain the self-luminous panel 100 according to the first embodiment of the present invention.

  Since it is necessary to provide a desiccant in the conventional hermetic sealing, when the self-luminous panel is enlarged, the sealing substrate 102 is bent near the center due to the surrounding environment and the desiccant is self-luminous. It was in contact with the element and caused a lighting failure. However, the self-luminous panel 100 according to the first embodiment does not require a desiccant, and the support member 104 prevents the sealing substrate 102 from being bent near the self-luminous element 103.

  Further, since the sealing member 107 and the substrate 101 are bonded together with a sealing adhesive, a step of applying with a printing applicator such as a dispenser can be omitted, and the process can be simplified.

  By the way, when manufacturing the self-luminous panel 100, the emission luminance is inspected. At this time, in the self-light-emitting panel 100, when a certain self-light-emitting element 103 exceeds a predetermined upper limit luminance or does not satisfy a predetermined lower-limit luminance, the self-light-emitting element 103 is surrounded by It becomes a conspicuous state compared with.

  In the self light emitting panel 100, if a part causing a defect such as a light emitting failure is a part of the self light emitting element 103, the light emitting defective part is irradiated with a laser, and the light emitting defective part is peeled off. It is possible to keep the light emission state within a favorable range (repair).

  According to the self-luminous panel 100 of the first embodiment, unnecessary parts or short-circuited electrode portions can be removed by irradiating a laser to a light emitting failure portion. For this reason, it is possible to prevent the disorder of the layer structure in the self-light-emitting element 103 caused by unnecessary objects and the volume expansion portion caused by the laser irradiation, and the disorder of the light emitting state due to the disorder of the layer structure, and perform reliable repair. be able to.

  As described above, according to the self-luminous panel 100 of the first embodiment, there is no lighting failure that occurs due to contact between the desiccant and the self-luminous element 103 when the self-luminous panel 100 is enlarged. Thus, it is possible to achieve both improvement in yield by repair.

  By the way, at the time of repair in the self-luminous panel 100 that performs sealing using the resin member 105, the upper electrode and the lower electrode are short-circuited by the resin member 105 melted by laser irradiation.

  On the other hand, according to the self-luminous panel 100 of the present embodiment, since the upper electrode and the resin member 105 are separated by providing the hollow portion 106, the upper electrode is formed by the resin member 105 melted by laser irradiation. And the lower electrode can be prevented from being short-circuited. As a result, the occurrence of secondary problems during repair can be solved.

  In particular, since the hollow portion 106 in the self light emitting panel 100 of the first embodiment is provided larger than the size of the self light emitting element 103 along the facing direction of the self light emitting element 103 and the sealing member 107, The occurrence of secondary problems during repair can be solved more reliably.

  Further, when the hollow portion 106 is evacuated, it is possible to suppress the heat generated due to the laser irradiation to the light emitting failure portion from being transmitted from the self light emitting element 103 to the resin member 105. The occurrence of secondary problems can be solved more reliably.

  Note that when the self-light-emitting element 103 is an organic EL element having a bottom emission structure, the sealing substrate 102 can be used as a heat sink by forming the sealing substrate 102 with a metal material. That is, by forming the sealing substrate 102 with a metal material having good thermal conductivity, heat generated in the self-light emitting element 103 due to laser irradiation can be effectively diffused without providing a special configuration.

(Embodiment 2)
(Schematic configuration of self-luminous panel)
FIG. 2 is a longitudinal side view showing a schematic configuration of the self-luminous panel of the second embodiment. The same parts as those of the first embodiment described above are denoted by the same reference numerals, and description thereof is also omitted. The same shall apply hereinafter. The self-luminous panel 200 according to the second embodiment includes a sealing member 202 composed of a resin member 201 and a sealing substrate 102. The sealing substrate 102 includes a protrusion 203 that protrudes closer to the substrate 101 than the self-light-emitting element 103 along the facing direction of the self-light-emitting element 103 and the sealing member 202. The protrusion 203 protrudes larger than the size of the self light emitting element 103 with respect to the self light emitting element 103 along the facing direction of the self light emitting element 103 and the sealing member 202.

  The hollow portion 204 is provided between the substrate 101 and the sealing substrate 102 by overlapping of the support member 104 and the protruding portion 203. That is, since the protruding portion 203 protrudes toward the substrate side along the facing direction of the light emitting element 103 and the substrate 101, the resin member 201 in the sealing member 202 adheres the substrate 101 and the sealing substrate 102. Thus, a hollow portion 204 that opens the light emitting surface side of the self light emitting element 103 is formed between the self light emitting element 103 and the sealing member 202. The protruding portion 203 on the sealing substrate side may be formed of a material different from that of the sealing substrate, and may also serve other roles such as a black matrix.

(Self-luminous panel manufacturing method)
The formation of the protrusion 203 and the resin member 201, which are characteristic parts of the self-luminous panel 200 of the second embodiment, will be described.

  When forming the protrusion 203, for example, a recess is formed on the sealing substrate 102 at a position facing the self-light-emitting element 103 formed on the substrate 101 by a method such as sandblasting or etching. Thus, the generated protrusion 203 is obtained. The height of the hollow portion including the resin member 301 and the protruding portion 203 after curing the two-component curable resin as the resin member 201 using a roll on the sealing substrate 102 is 0.1 μm to 1000 μm. Transcript to.

  The substrate 101 on which the self-luminous element is formed and the sealing substrate 102 coated with the two-component curable resin are bonded together in a vacuum, and then cured by heating or the like.

(Embodiment 3)
(Schematic configuration of self-luminous panel)
FIG. 3 is a longitudinal side view showing a schematic configuration of the self-luminous panel of the third embodiment. The sealing member 301 in the self-light-emitting panel 300 according to the third embodiment includes a resin member 303 having a plurality of holes penetrating along the facing direction of the self-light-emitting element 103 and the sealing member 301, and closing the hole. And a flat-plate-shaped sealing substrate 102. The sealing member 301 is provided so that a plurality of holes provided in the resin member 303 are opposed to the light emitting element 103, respectively.

(Self-luminous panel manufacturing method)
A method for forming the hole of the resin member 303 and a method for forming the sealing member 301 will be described. An epoxy resin film having a thickness of 20 to 30 μm is used for the resin member 303, and a hole portion is previously formed by a method such as photolithography in a portion in contact with the self-light emitting element. The sealing member 301 is formed by bonding the resin member 303 to the sealing substrate 102 with a known laminating apparatus.

  As described above, according to the self-luminous panel 300 in the present third embodiment, the hollow portion is formed by providing the hole in the thin resin member 303 and providing the recess in the sealing substrate 102. Compared to the above, the ease of manufacture and the accuracy of the manufactured product can be ensured.

It is a vertical side view which shows schematic structure of the self-light-emitting panel of this Embodiment 1. It is a vertical side view which shows schematic structure of the self-light-emitting panel of this Embodiment 2. It is a vertical side view which shows schematic structure of the self-light-emitting panel of this Embodiment 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Self-light-emitting panel 101 Substrate 102 Sealing substrate 103 Self-light-emitting element 105 Resin member 106 Hollow part 107 Sealing member 200 Self-light-emitting panel 201 Resin member 202 Sealing member 203 Projection part 204 Hollow part 300 Self-light-emitting panel 301 Sealing member 303 Resin member 304 Hollow part

Claims (12)

A substrate; a lower electrode formed on the substrate; a film-forming layer including at least a light-emitting layer formed on the lower electrode; a self-luminous element having an upper electrode formed on the film-forming layer; and the substrate A sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface, and forming one self-light-emitting element on the substrate as one display element, A self-luminous panel that displays information using a self-luminous element,
A support member between at least one self-luminous element and the adjacent self-luminous element on the substrate;
On the surface of the sealing substrate to be sealed and bonded to the substrate, at least a resin member to be bonded to the substrate at a position facing the support member,
The support member and the resin member are bonded to face each other, and a hollow portion is provided between the formation position of the self-luminous element on the substrate and the sealing substrate to perform sealing joining. Luminescent panel. A substrate; a lower electrode formed on the substrate; a film-forming layer including at least a light-emitting layer formed on the lower electrode; a self-luminous element having an upper electrode formed on the film-forming layer; and the substrate A sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface, and forming one self-light-emitting element on the substrate as one display element, A self-luminous panel that displays information using a self-luminous element,
On the sealing substrate, at least one of the self-light-emitting elements on the substrate and a support member at a position facing the position between the adjacent self-light-emitting elements,
A resin member that adheres to the substrate on at least the support member surface of the sealing substrate;
The substrate and the resin member on the sealing substrate are bonded so that at least one self-light-emitting element and a position between the adjacent self-light-emitting elements are opposed to each other, and the self-light-emitting on the substrate A self-luminous panel characterized in that a hollow portion is provided between an element formation position and the sealing substrate and sealingly joined.   The self-luminous panel according to claim 2, wherein the resin member has a plurality of concave and convex portions, and the support member is formed by the convex portions.   The self-light-emitting panel according to claim 2 or 3, wherein the resin member has a plurality of concave and convex portions, and the concave portion is disposed above the formation position of the self-light-emitting element.   The self-luminous panel according to claim 1, wherein the resin member is formed on the entire surface of the sealing substrate.   The self-luminous panel according to any one of claims 1 to 5, wherein the hollow portion is an inert gas atmosphere in a vacuum state or a reduced pressure. A substrate; a lower electrode formed on the substrate; a film-forming layer including at least a light-emitting layer formed on the lower electrode; a self-luminous element having an upper electrode formed on the film-forming layer; and the substrate A sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface, and forming one self-light-emitting element on the substrate as one display element, In a method for manufacturing a self-luminous panel that displays information using a self-luminous element,
A self light emitting element forming step of forming a plurality of the self light emitting elements on the substrate;
A support member forming step of forming a support member between at least one of the self-light-emitting elements and the self-light-emitting element formed at a position adjacent to the self-light-emitting elements;
A resin member forming step of forming a resin member on at least the support member forming position on the substrate on the sealing substrate;
The support member on the substrate and the position of the resin member on the sealing substrate are opposed to each other, and a hollow portion is formed between the self-luminous element on the substrate and the counter substrate, and the resin member Sealing and bonding step for sealing and bonding the substrate and the sealing substrate with an adhesive,
A method for manufacturing a self-luminous panel, comprising:   Forming a plurality of convex portions between at least one of the self-luminous elements and the self-luminous element formed at a position adjacent to the self-luminous elements, and forming the convex and concave portions as the support member; The manufacturing method of the self-light-emitting panel according to claim 7, comprising: A substrate; a lower electrode formed on the substrate; a film-forming layer including at least a light-emitting layer formed on the lower electrode; a self-luminous element having an upper electrode formed on the film-forming layer; and the substrate A sealing substrate that is sealed and bonded to the substrate so as to face the self-light-emitting element forming surface, and forming one self-light-emitting element on the substrate as one display element, In a method for manufacturing a self-luminous panel that displays information using a self-luminous element,
A self light emitting element forming step of forming a plurality of the self light emitting elements on the substrate;
A support member is formed on the sealing substrate at a position opposite to a position between at least one of the self-light-emitting elements on the substrate and the self-light-emitting elements formed at positions adjacent to the self-light-emitting elements. A member forming step;
A resin member forming step of forming a resin member on at least the support member on the sealing substrate;
A position between at least one of the self-light-emitting elements on the substrate and the self-light-emitting element formed at a position adjacent to the self-light-emitting element, and a position of the support member and the resin member on the sealing substrate. A seal is formed by sealing and bonding the substrate and the sealing substrate by using the resin member as an adhesive, forming a hollow portion between the substrate and the self-luminous element on the substrate. Stop bonding process,
A method for manufacturing a self-luminous panel, comprising:   A step of forming an uneven portion on the surface of the sealing member, forming the protruded portion as the support member, and forming the recessed portion at a position where the self-luminous element is formed. The self-luminous panel manufacturing method according to claim 9.   The method for manufacturing a self-luminous panel according to claim 9, wherein the resin member is formed on the entire surface of the sealing substrate. The method for manufacturing a self-luminous panel according to any one of claims 7 to 11, wherein the hollow portion is an inert gas in a vacuum state or a reduced pressure.

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