JP2003224367A - High frequency printed wiring board and its manufacturing method - Google Patents
High frequency printed wiring board and its manufacturing methodInfo
- Publication number
- JP2003224367A JP2003224367A JP2002020288A JP2002020288A JP2003224367A JP 2003224367 A JP2003224367 A JP 2003224367A JP 2002020288 A JP2002020288 A JP 2002020288A JP 2002020288 A JP2002020288 A JP 2002020288A JP 2003224367 A JP2003224367 A JP 2003224367A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- printed wiring
- multilayer printed
- polyphenylene ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 124
- 239000011347 resin Substances 0.000 claims abstract description 124
- 238000007747 plating Methods 0.000 claims abstract description 39
- 239000004020 conductor Substances 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 86
- 239000010410 layer Substances 0.000 claims description 85
- 239000011889 copper foil Substances 0.000 claims description 47
- 239000011342 resin composition Substances 0.000 claims description 47
- 229920001187 thermosetting polymer Polymers 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 42
- 229910052802 copper Inorganic materials 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 40
- 229920001955 polyphenylene ether Polymers 0.000 claims description 40
- 238000009713 electroplating Methods 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004593 Epoxy Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000004643 cyanate ester Substances 0.000 claims description 14
- 239000011229 interlayer Substances 0.000 claims description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- -1 bromine compound Chemical class 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 7
- 239000000347 magnesium hydroxide Substances 0.000 claims description 7
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000000454 talc Substances 0.000 claims description 7
- 229910052623 talc Inorganic materials 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052794 bromium Inorganic materials 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000007788 roughening Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 102220491117 Putative postmeiotic segregation increased 2-like protein 1_C23F_mutation Human genes 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 101001024616 Homo sapiens Neuroblastoma breakpoint family member 9 Proteins 0.000 description 1
- 102100037013 Neuroblastoma breakpoint family member 9 Human genes 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高周波特性に優
れ、なおかつ微細配線形成に適する多層プリント配線板
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board which has excellent high frequency characteristics and is suitable for forming fine wiring.
【０００２】[0002]
【従来の技術】近年のプリント基板においては、信号伝
播遅延時間の短縮および誘電体損失の低減を目的とし
て、使用される樹脂の低誘電率化並びに低誘電正接化が
要求されてきている。このような要求を満たすために、
例えば特開平１０―３３５８２０にあるように熱硬化型
ポリフェニレンエーテル樹脂を用いた樹脂付き銅箔を内
層板に積層し、サブトラクティブ法により回路形成する
方法、あるいは、特開平１１―２１４５３にあるように
ポリフェニレンエーテルとシアネートエステル化合物と
エポキシ化合物を必須成分とする樹脂組成物を用いた樹
脂付き銅箔を内層板に積層し、サブトラクティブ法によ
り回路形成する方法などが提案されている。2. Description of the Related Art In recent printed circuit boards, it has been required to reduce the dielectric constant and the dielectric loss tangent of a resin used for the purpose of shortening signal propagation delay time and reducing dielectric loss. To meet such demands,
For example, as disclosed in JP-A-10-335820, a method of laminating a resin-coated copper foil using a thermosetting polyphenylene ether resin on an inner layer plate and forming a circuit by a subtractive method, or as disclosed in JP-A-11-21453. A method has been proposed in which a resin-coated copper foil using a resin composition containing a polyphenylene ether, a cyanate ester compound, and an epoxy compound as essential components is laminated on an inner layer board to form a circuit by a subtractive method.
【０００３】またその一方ではプリント配線板の高密度
化が進んでいる。上記したような、従来の樹脂付き銅箔
に由来する銅をエッチングする方法、すなわちサブトラ
クティブ法により作製されるプリント配線板は、サイド
エッチングの影響で配線の微細化には限界があり、基板
の高密度化には限界があった。そこで近年は電気めっき
を用いたセミアディティブ法によるプリント配線板の製
造方法が注目されている。このセミアディティブ法は特
開平11−186716にあるように回路を形成したい樹脂表面
にレーザー等でＩＶＨを形成した後に、化学粗化やプラ
ズマ処理等により３μｍ程度の凹凸を樹脂上に形成す
る。続いてPd触媒を付与し、１μｍ程度の無電解めっき
を行い、パターン電気めっきレジストを形成し、パター
ン電気めっきにより回路形成を行った後にレジスト及び
余分な個所の無電解めっきを除去しする。このセミアデ
ィティブ法においては、めっき層と絶縁層の密着性を確
保する必要があるため、絶縁層として用いられる樹脂組
成物中には通常、シリカ、タルク、水酸化アルミニウ
ム、水酸化マグネシウムなどの無機充填剤が配合されて
おり、化学粗化やプラズマ処理の際に樹脂表面が不均一
に溶解するよう工夫されている。この樹脂組成物の不均
一性により、樹脂上に３μｍ程度の凹凸が形成され、密
着性が向上するこの効果は、アンカー効果と呼ばれる。
また、化学粗化として最も一般的に行われる手法は、ア
ルカリ過マンガン酸水溶液や、クロム酸水溶液による酸
化溶解であるが、これらの薬品による酸化を受けやすい
成分として、ゴムやエラストマーなどが添加される場合
も多い。On the other hand, the density of printed wiring boards is increasing. As described above, a method of etching copper derived from a conventional resin-coated copper foil, that is, a printed wiring board manufactured by a subtractive method, has a limit to the miniaturization of wiring due to the influence of side etching. There was a limit to high density. Therefore, in recent years, a method for manufacturing a printed wiring board by a semi-additive method using electroplating has attracted attention. In this semi-additive method, as described in JP-A-11-186716, IVH is formed on a resin surface on which a circuit is to be formed by a laser or the like, and then unevenness of about 3 μm is formed on the resin by chemical roughening or plasma treatment. Subsequently, a Pd catalyst is applied, electroless plating of about 1 μm is performed to form a patterned electroplating resist, and after circuit formation is performed by the patterned electroplating, the resist and the electroless plating of extra portions are removed. In this semi-additive method, it is necessary to secure the adhesion between the plating layer and the insulating layer, and therefore, the resin composition used as the insulating layer usually contains an inorganic material such as silica, talc, aluminum hydroxide or magnesium hydroxide. A filler is blended and devised so that the resin surface is non-uniformly dissolved during chemical roughening or plasma treatment. This effect of forming unevenness of about 3 μm on the resin due to the non-uniformity of the resin composition and improving the adhesiveness is called an anchor effect.
The most commonly used method of chemical roughening is oxidative dissolution with an alkaline permanganate aqueous solution or a chromic acid aqueous solution, but rubber or elastomer is added as a component susceptible to oxidation by these chemicals. There are many cases.
【０００４】低誘電率を特徴とする熱硬化性樹脂組成物
を絶縁層に用い、セミアディティブ法により、回路形成
を行おうとした場合、大きく問題となるのは、めっき層
と絶縁層の密着性の確保である。絶縁層にシリカ、タル
ク、水酸化アルミニウム、水酸化マグネシウムなどの無
機充填剤やゴム、エラストマーなどの粗化成分を配合す
ると、絶縁層の比誘電率、誘電正接が著しく上昇する場
合が多い。また、元来、低誘電率を特徴とする熱硬化性
樹脂組成物は、樹脂中の極性基を低減させるように設計
されており、めっき層と樹脂層の界面における化学的相
互作用も小さいという問題もあるため、優れた誘電特性
とめっき層と絶縁層の密着性を両立するプリント配線板
は得られていない。When a thermosetting resin composition having a low dielectric constant is used for an insulating layer to form a circuit by the semi-additive method, a major problem is the adhesion between the plating layer and the insulating layer. Is to secure. Incorporation of an inorganic filler such as silica, talc, aluminum hydroxide or magnesium hydroxide, or a roughening component such as rubber or elastomer into the insulating layer often significantly increases the relative dielectric constant and dielectric loss tangent of the insulating layer. Originally, the thermosetting resin composition characterized by a low dielectric constant is designed to reduce polar groups in the resin, and the chemical interaction at the interface between the plating layer and the resin layer is also small. Due to problems, a printed wiring board that has both excellent dielectric properties and adhesion between the plating layer and the insulating layer has not been obtained.
【０００５】本発明は、絶縁樹脂層が低誘電、低誘電正
接であり、尚且つパターン電気めっきで微細配線が形成
された多層プリント配線板ならびにその製造方法を提供
するものである。The present invention provides a multilayer printed wiring board in which an insulating resin layer has low dielectric constant and low dielectric loss tangent, and fine wiring is formed by pattern electroplating, and a method for manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】本発明は、以下のことを
特徴とする。
（1）導体回路と絶縁樹脂層とが順次形成されているプ
リント配線板であって、導体回路の一部がパターン電気
めっきにより形成されており、前記絶縁樹脂層の1GHｚ
における誘電正接が０．０１以下であることを特徴とす
る多層プリント配線板。
（2）導体回路と絶縁樹脂層とが順次形成されているプ
リント配線板であって、導体回路の一部がパターン電気
めっきにより形成されており、前記絶縁樹脂層の1GHｚ
における誘電率が３.０以下であることを特徴とする多
層プリント配線板。
（3）導体回路が厚さ３〜５０μｍのパターン電気めっ
きと厚さ５μｍ以下の電解銅箔からなることを特徴とす
る（1）〜（2）に記載の多層プリント配線板。The present invention is characterized by the following. (1) A printed wiring board in which a conductor circuit and an insulating resin layer are sequentially formed, wherein a part of the conductor circuit is formed by pattern electroplating, and the insulating resin layer has a frequency of 1 GHz.
The dielectric loss tangent in is less than or equal to 0.01. (2) A printed wiring board in which a conductor circuit and an insulating resin layer are sequentially formed, wherein a part of the conductor circuit is formed by pattern electroplating, and the insulating resin layer has a frequency of 1 GHz.
Has a dielectric constant of 3.0 or less. (3) The multilayer printed wiring board according to (1) or (2), characterized in that the conductor circuit is composed of patterned electroplating having a thickness of 3 to 50 μm and electrolytic copper foil having a thickness of 5 μm or less.
【０００７】（4）前記絶縁樹脂層が（Ａ）ポリフェニ
レンエーテルまたは変性ポリフェニレンエーテルを含む
熱硬化性樹脂組成物からなることを特徴とする（1）〜
（3）に記載の多層プリント配線板。
（5）前記絶縁樹脂層が（Ｂ）シアネートエステル化合
物を含む熱硬化性樹脂組成物からなることを特徴とする
（1）〜（4）に記載の多層プリント配線板。
（6）前記絶縁樹脂層が（Ｃ）エポキシ化合物を含む熱
硬化性樹脂組成物からなることを特徴とする（1）〜
（5）に記載の多層プリント配線板。
（7）前記絶縁樹脂層が（Ａ）ポリフェニレンエーテル
または変性ポリフェニレンエーテルと（Ｂ）シアネート
エステル化合物を必須成分とする熱硬化性樹脂組成物か
らなることを特徴とする（1）〜（6）に記載の多層プリ
ント配線板。
（8）前記絶縁樹脂層が（Ａ）ポリフェニレンエーテル
または変性ポリフェニレンエーテルと（Ｃ）エポキシ化
合物を必須成分とする熱硬化性樹脂組成物からなること
を特徴とする（1）〜（7）に記載の多層プリント配線
板。
（9）前記絶縁樹脂層が（Ａ）ポリフェニレンエーテル
または変性ポリフェニレンエーテルと（Ｂ）シアネート
エステル化合物と（Ｃ）エポキシ化合物を必須成分とす
る熱硬化性樹脂組成物からなることを特徴とする（1）
〜（8）に記載の多層プリント配線板。
（10）前記絶縁樹脂層が無機充填剤を含まない熱硬化性
樹脂組成物からなることを特徴とする（1）〜（9）に記
載の多層プリント配線板。
（11）前記絶縁樹脂層がシリカ、タルク、水酸化アルミ
ニウム、水酸化マグネシウムからなる群より選ばれる無
機充填剤を含まない熱硬化性樹脂組成物からなることを
特徴とする（1）〜（10）に記載の多層プリント配線
板。(4) The insulating resin layer is made of a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether (1) to (1)
The multilayer printed wiring board according to (3). (5) The multilayer printed wiring board according to (1) to (4), wherein the insulating resin layer is composed of a thermosetting resin composition containing a cyanate ester compound (B). (6) The insulating resin layer is composed of a thermosetting resin composition containing an epoxy compound (C) (1) to
The multilayer printed wiring board according to (5). (7) In the above (1) to (6), the insulating resin layer comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (B) cyanate ester compound as essential components. The multilayer printed wiring board described. (8) The insulating resin layer comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (C) epoxy compound as essential components, (1) to (7) Multilayer printed wiring board. (9) The insulating resin layer is composed of a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether, (B) cyanate ester compound and (C) epoxy compound as essential components (1 )
~ The multilayer printed wiring board according to (8). (10) The multilayer printed wiring board according to (1) to (9), wherein the insulating resin layer is made of a thermosetting resin composition containing no inorganic filler. (11) The insulating resin layer comprises a thermosetting resin composition containing no inorganic filler selected from the group consisting of silica, talc, aluminum hydroxide and magnesium hydroxide (1) to (10) ) The multilayer printed wiring board described in.
【０００８】（12）前記絶縁樹脂層がさらに臭素化合物
またはリン化合物を含む熱硬化性樹脂組成物であること
を特徴とする（1）〜（11）に記載の多層プリント配線
板。
（13）導体回路を有する内層基板の上下に厚み５μｍ以
下の銅箔付樹脂を積層し、その後基板上にレーザーを照
射することで層間接続のためのＩＶＨ（インタースティ
シャルバイアホール）を形成し、給電層として薄付け無
電解銅めっきを行い、パターン電気めっきレジストを形
成した後にパターン電気めっきを行い、レジストを除去
し、パターン部以外の銅をエッチング除去する工程を少
なくとも有することを特徴とするプリント配線板の製造
方法において、前記銅箔付樹脂の樹脂の1GHｚにおける
誘電正接が０．０１以下であることを特徴とする多層プ
リント配線板の製造方法。
（14）導体回路を有する内層基板の上下に厚み５μｍ以
下の銅箔付樹脂を積層し、その後基板上にレーザーを照
射することで層間接続のためのＩＶＨ（インタースティ
シャルバイアホール）を形成し、給電層として薄付け無
電解銅めっきを行い、パターン電気めっきレジストを形
成した後にパターン電気めっきを行い、レジストを除去
し、パターン部以外の銅をエッチング除去する工程を少
なくとも有することを特徴とするプリント配線板の製造
方法において、前記銅箔付樹脂の樹脂の1GHｚにおける
誘電率が３.０以下であることを特徴とする多層プリン
ト配線板の製造方法。
（15）導体回路を有する内層基板の上下にプリプレグを
介して厚み５μｍ以下の銅箔を積層し、その後基板上に
レーザーを照射することで層間接続のためのＩＶＨ（イ
ンタースティシャルバイアホール）を形成し、給電層と
して薄付け無電解銅めっきを行い、パターン電気めっき
レジストを形成した後にパターン電気めっきを行い、レ
ジストを除去し、パターン部以外の銅をエッチング除去
する工程を少なくとも有することを特徴とするプリント
配線板の製造方法において、プリプレグの樹脂の1GHｚ
における誘電正接が０．０１以下であることを特徴とす
る多層プリント配線板の製造方法。(12) The multilayer printed wiring board according to (1) to (11), wherein the insulating resin layer is a thermosetting resin composition further containing a bromine compound or a phosphorus compound. (13) A copper foil resin having a thickness of 5 μm or less is laminated on the upper and lower sides of an inner layer substrate having a conductor circuit, and then a laser is irradiated on the substrate to form an IVH (interstitial via hole) for interlayer connection. Characterized in that it has at least a step of performing thin electroless copper plating as a power feeding layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern portion. A method for producing a printed wiring board, wherein the resin of the copper foil-coated resin has a dielectric loss tangent at 0.01 GHz of 0.01 or less. (14) Laminating resin with copper foil with a thickness of 5 μm or less on the top and bottom of the inner layer substrate having a conductor circuit, and then irradiating a laser on the substrate to form an IVH (interstitial via hole) for interlayer connection. Characterized in that it has at least a step of performing thin electroless copper plating as a power feeding layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern portion. A method for manufacturing a printed wiring board, wherein the resin of the copper foil-coated resin has a dielectric constant at 1 GHz of 3.0 or less. (15) An IVH (interstitial via hole) for interlayer connection is formed by stacking a copper foil with a thickness of 5 μm or less on the upper and lower sides of an inner layer substrate having a conductor circuit through a prepreg, and then irradiating a laser on the substrate. Forming and performing thin electroless copper plating as a power supply layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern part In the method for manufacturing a printed wiring board, the resin of the prepreg is 1 GHz
And a dielectric loss tangent thereof is 0.01 or less.
【０００９】（16）導体回路を有する内層基板の上下に
プリプレグを介して厚み５μｍ以下の銅箔を積層し、そ
の後基板上にレーザーを照射することで層間接続のため
のＩＶＨ（インタースティシャルバイアホール）を形成
し、給電層として薄付け無電解銅めっきを行い、パター
ン電気めっきレジストを形成した後にパターン電気めっ
きを行い、レジストを除去し、パターン部以外の銅をエ
ッチング除去する工程を少なくとも有することを特徴と
するプリント配線板の製造方法において、プリプレグの
樹脂の1GHｚにおける誘電率が３.０以下であることを特
徴とする多層プリント配線板の製造方法。
（17）パターン部以外の銅をエッチング除去する工程に
硫酸／過酸化水素を主成分とするエッチング液を用いる
ことを特徴とする（13）〜（16）に記載の多層プリント
配線板の製造方法。
（18）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が（Ａ）ポリフェニレンエーテルまたは変性ポリフェニ
レンエーテルを含む熱硬化性樹脂組成物からなることを
特徴とする（13）〜（17）に記載の多層プリント配線板
の製造方法。
（19）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が（Ｂ）シアネートエステル化合物を含む熱硬化性樹脂
組成物からなることを特徴とする（13）〜（18）に記載
の多層プリント配線板の製造方法。
（20）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が（Ｃ）エポキシ化合物を含む熱硬化性樹脂組成物から
なることを特徴とする（13）〜（19）に記載の多層プリ
ント配線板の製造方法。(16) An IVH (interstitial via) for interlayer connection is formed by laminating copper foils with a thickness of 5 μm or less on the upper and lower sides of an inner layer substrate having a conductor circuit via prepregs, and then irradiating a laser on the substrate. Hole), thin electroless copper plating is performed as a power supply layer, pattern electroplating resist is formed, then pattern electroplating is performed, the resist is removed, and copper other than the pattern portion is etched and removed. A method of manufacturing a multilayer printed wiring board according to claim 1, wherein the resin of the prepreg has a dielectric constant at 1 GHz of 3.0 or less. (17) The method for producing a multilayer printed wiring board according to (13) to (16), characterized in that an etching solution containing sulfuric acid / hydrogen peroxide as a main component is used in the step of etching away copper other than the pattern portion. . (18) The multilayer according to (13) to (17), characterized in that the resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether. Manufacturing method of printed wiring board. (19) The multilayer printed wiring board according to (13) to (18), characterized in that the resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing (B) a cyanate ester compound. Manufacturing method. (20) The multilayer printed wiring board according to (13) to (19), wherein the resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (C) an epoxy compound. Production method.
【００１０】（21）前記銅箔付樹脂の樹脂あるいはプリ
プレグの樹脂が（Ａ）ポリフェニレンエーテルまたは変
性ポリフェニレンエーテルと（Ｂ）シアネートエステル
化合物を必須成分とする熱硬化性樹脂組成物からなるこ
とを特徴とする（13）〜（20）に記載の多層プリント配
線板の製造方法。
（22）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が（Ａ）ポリフェニレンエーテルまたは変性ポリフェニ
レンエーテルと（Ｃ）エポキシ化合物を必須成分とする
熱硬化性樹脂組成物からなることを特徴とする（13）〜
（21）に記載の多層プリント配線板の製造方法。
（23）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が（Ａ）ポリフェニレンエーテルまたは変性ポリフェニ
レンエーテルと（Ｂ）シアネートエステル化合物と
（Ｃ）エポキシ化合物を必須成分とする熱硬化性樹脂組
成物からなることを特徴とする（13）〜（22）に記載の
多層プリント配線板の製造方法。
（24）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
が無機充填剤を含まない熱硬化性樹脂組成物からなるこ
とを特徴とする（13）〜（23）に記載の多層プリント配
線板の製造方法。
（25）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
がシリカ、タルク、水酸化アルミニウム、水酸化マグネ
シウムからなる群より選ばれる無機充填剤を含まない熱
硬化性樹脂組成物からなることを特徴とする（13）〜
（24）に記載の多層プリント配線板の製造方法。
（26）前記銅箔付樹脂の樹脂あるいはプリプレグの樹脂
がさらに臭素化合物およびリン化合物を含む熱硬化性樹
脂組成物であることを特徴とする（13）〜（25）に記載
の多層プリント配線板の製造方法。(21) The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (B) cyanate ester compound as essential components. The method for producing a multilayer printed wiring board according to (13) to (20). (22) The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (C) epoxy compound as essential components (13) ) ~
The method for manufacturing a multilayer printed wiring board according to (21). (23) The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether, (B) cyanate ester compound and (C) epoxy compound as essential components. (13) to the manufacturing method of a multilayer printed wiring board according to (22). (24) Manufacturing of the multilayer printed wiring board according to (13) to (23), wherein the resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing no inorganic filler. Method. (25) The resin of the resin with copper foil or the resin of prepreg is composed of a thermosetting resin composition containing no inorganic filler selected from the group consisting of silica, talc, aluminum hydroxide and magnesium hydroxide, Do (13) ~
The method for manufacturing a multilayer printed wiring board according to (24). (26) The multilayer printed wiring board according to (13) to (25), characterized in that the resin with copper foil or the resin with prepreg is a thermosetting resin composition further containing a bromine compound and a phosphorus compound. Manufacturing method.
【００１１】[0011]
【発明の実施の形態】本発明の実施の形態を、図１を用
いて説明する。（a）まず、内層基板の表面に内層銅パ
ターンを形成した配線基板を作製する。この内層基板へ
の銅パターンの形成は、銅張積層板をエッチングして行
なうサブトラクティブ法が一般的である。図1(a)では両
面板であるが、この内層基板は多層板でもよい。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIG. (A) First, a wiring board having an inner layer copper pattern formed on the surface of the inner layer board is manufactured. The subtractive method is generally used to form the copper pattern on the inner layer substrate by etching the copper clad laminate. Although it is a double-sided plate in FIG. 1 (a), this inner layer substrate may be a multi-layered plate.
【００１２】次に内層基板の表面の内層銅パターンを粗
面化し、この銅パターンの上に形成される層間樹脂絶縁
層との密着性を向上させる必要がある。具体的には内層
銅パターンの上に針状の無電解めっきを形成する方法や
内層銅パターンを酸化（黒化）―還元処理する方法、内
層銅パターンをエッチングする方法等がある。Next, it is necessary to roughen the inner layer copper pattern on the surface of the inner layer substrate to improve the adhesion to the interlayer resin insulation layer formed on this copper pattern. Specifically, there are a method of forming needle-shaped electroless plating on the inner layer copper pattern, a method of oxidizing (blackening) -reducing the inner layer copper pattern, a method of etching the inner layer copper pattern, and the like.
【００１３】次に前記（a）で作製した配線基板の上
に、図1(ｂ)に示す様に金属箔の厚みが５μｍ以下であ
り、硬化後の比誘電率が３.０以下または硬化後の誘電
正接が０.０１以下であることを特徴とする熱硬化性樹
脂組成物を用いた樹脂付き金属箔を積層する。樹脂付き
金属箔を積層するかわりに、硬化後の比誘電率が３.０
以下または硬化後の誘電正接が０.０１以下であること
を特徴とする熱硬化性樹脂組成物を用いたプリプレグを
介して厚み５μｍ以下の金属箔を積層してもよい。本発
明においては、半硬化状態の誘電特性に優れる熱硬化性
樹脂組成物に５μｍ以下の金属箔を加熱圧着させるこ
と、あるいは金属箔に樹脂を塗布したを樹脂付き金属箔
を積層することを特徴としており、従来の凹凸を形成さ
せた樹脂硬化物上にめっきを施す方法とは、この点で大
きく異なる。絶縁層に無電解めっきを行い形成した導体
と、金属箔を加熱圧着させた導体のピール強度を比較す
ると、一般的な傾向として、金属箔を加熱圧着させた導
体のピール強度の方が大きい。接着界面における凹凸形
状が同じものを比較すると、金属箔を加熱圧着させた導
体のピール強度は、絶縁層に無電解めっきを行い形成し
た導体に比べて、２倍近い値を示すことが知られてい
る。Next, on the wiring board prepared in (a) above, as shown in FIG. 1 (b), the thickness of the metal foil is 5 μm or less, and the relative permittivity after curing is 3.0 or less or the curing is performed. A resin-coated metal foil using a thermosetting resin composition having a dielectric loss tangent of 0.01 or less is laminated. Instead of laminating resin-coated metal foil, the relative dielectric constant after curing is 3.0.
A metal foil having a thickness of 5 μm or less may be laminated through a prepreg using a thermosetting resin composition having a dielectric loss tangent of 0.01 or less or after curing. In the present invention, a thermosetting resin composition having excellent dielectric properties in a semi-cured state is thermocompression-bonded with a metal foil having a thickness of 5 μm or less, or a resin-coated metal foil coated with a resin is laminated. In this respect, the method is significantly different from the conventional method of plating a cured resin product having irregularities. Comparing the peel strengths of the conductor formed by electroless plating of the insulating layer and the conductor obtained by thermocompression bonding of the metal foil, the peel strength of the conductor obtained by thermocompression bonding of the metal foil is generally higher. It is known that the peel strength of a conductor obtained by heat-pressing a metal foil is nearly twice as high as that of a conductor formed by electroless plating of an insulating layer, when comparing those having the same concavo-convex shape at the bonding interface. ing.
【００１４】誘電特性に優れる樹脂としてはポリフェニ
レンエーテルが例示されるが、ポリフェニレンエーテル
は熱可塑性樹脂であるため、さらに耐熱性および耐薬品
性の向上を目的として熱硬化性を付与させた熱硬化性樹
脂組成物が用いられる。ポリフェニレンエーテルに熱硬
化性を付与させる方法としては、従来の手法を用いるこ
とができ、例えば、ポリフェニレンエーテルの分子鎖中
に二重結合などの官能基を導入する方法や、ポリフェニ
レンエーテルにシアネートエステル化合物やエポキシ化
合物などの熱硬化性樹脂をブレンドする方法などが例示
される。また、本発明においては、前述したように半硬
化状態の誘電特性に優れる熱硬化性樹脂組成物に５μｍ
以下の金属箔を加熱圧着させることを特徴としているた
め、従来のように凹凸を形成させた樹脂硬化物上にめっ
きを施す必要がない。したがって、絶縁層にシリカ、タ
ルク、水酸化アルミニウム、水酸化マグネシウムなどの
無機充填剤やゴム、エラストマーなどの粗化成分を含む
必要がなく、誘電特性に優れる絶縁層とすることができ
る。さらに配線板材料においては材料の難燃性も要求さ
れるが、臭素化合物やリン化合物を用いることにより、
樹脂組成物を難燃化することができる。近年は環境対応
として、臭素化合物を用いない難燃手法が求められるこ
ともあり、リン化合物の配合はさらに好ましい。層間樹
脂絶縁層の厚みは１０から１００μｍ程度、望ましくは
２０から６０μｍがよい。金属箔の粗化面にはクロメー
ト処理等密着促進のための異種金属処理が施されていて
もよい。銅箔の厚みが５μｍより大きいと後の回路形成
時に支障をきたす。Polyphenylene ether is an example of a resin having excellent dielectric properties. Since polyphenylene ether is a thermoplastic resin, it is a thermosetting resin with thermosetting properties for the purpose of improving heat resistance and chemical resistance. A resin composition is used. As a method of imparting thermosetting property to polyphenylene ether, a conventional method can be used, for example, a method of introducing a functional group such as a double bond into the molecular chain of polyphenylene ether, or a cyanate ester compound in polyphenylene ether. Examples thereof include a method of blending a thermosetting resin such as or an epoxy compound. Further, in the present invention, as described above, the thermosetting resin composition having excellent semi-cured dielectric properties has a thickness of 5 μm
Since it is characterized in that the following metal foils are heat-pressed, it is not necessary to perform plating on a resin cured product having irregularities formed as in the conventional case. Therefore, it is not necessary for the insulating layer to contain an inorganic filler such as silica, talc, aluminum hydroxide or magnesium hydroxide, or a roughening component such as rubber or elastomer, and an insulating layer having excellent dielectric properties can be obtained. Furthermore, wiring board materials are required to have flame retardancy, but by using bromine compounds and phosphorus compounds,
The resin composition can be made flame-retardant. In recent years, a flame-retardant method that does not use a bromine compound has been demanded as an environmental measure, and thus the compounding of a phosphorus compound is more preferable. The thickness of the interlayer resin insulation layer is about 10 to 100 μm, preferably 20 to 60 μm. The roughened surface of the metal foil may be subjected to a different metal treatment such as a chromate treatment for promoting adhesion. If the thickness of the copper foil is larger than 5 μm, it will be a hindrance during the subsequent circuit formation.
【００１５】次いで図1（ｃ）に示す様に銅箔の上から
層間樹脂絶縁層にIVHを形成する。IVHを形成する方法と
しては、レーザーを用いるのが好適である。ここで用い
ることが出来るレーザーとしては、CO2やCO、エキシマ
等の気体レーザーやYAG等の固体レーザーがある。CO2レ
ーザーが容易に大出力を得られる事からφ50μｍ以上の
IVHの加工に適している。φ50μｍ以下の微細なIVHを加
工する場合は、より短波長で集光性のよいYAGレーザー
が適している。Then, as shown in FIG. 1C, IVH is formed on the interlayer resin insulation layer from above the copper foil. A laser is suitable as a method for forming the IVH. Lasers that can be used here include gas lasers such as CO2, CO, and excimers, and solid-state lasers such as YAG. Since a CO2 laser can easily obtain a large output, φ50 μm or more
Suitable for IVH processing. When processing a fine IVH of φ50 μm or less, a YAG laser having a shorter wavelength and good condensing property is suitable.
【００１６】次いで過マンガン酸塩、クロム酸塩、クロ
ム酸のような酸化剤を用いてIVH内部の樹脂残さの除去
を行う。Next, the resin residue inside the IVH is removed by using an oxidizing agent such as permanganate, chromate or chromic acid.
【００１７】次いで銅箔上及びIVH内部に触媒核を付与
する。触媒核の付与には、貴金属イオンやパラジウムコ
ロイドを使用する。特にパラジウムコロイドを使用する
のが安価で好ましい。Next, a catalyst nucleus is provided on the copper foil and inside the IVH. Noble metal ions or palladium colloids are used to provide the catalyst nuclei. In particular, it is preferable to use palladium colloid because it is inexpensive.
【００１８】次に図１（ｄ）に示すように、触媒核を付
与した銅箔上及びIVH内部に薄付けの無電解めっき層を
形成する。この無電解めっきには、CUST２０００（日立
化成工業株式会社製、商品名）やCUST２０１（日立化成
工業株式会社製、商品名）等の市販の無電解銅めっきが
使用できる。これらの無電解銅めっきは硫酸銅、ホルマ
リン、錯化剤、水酸化ナトリウムを主成分とする。めっ
きの厚さは次の電気めっきが行うことができる厚さであ
ればよく、0.1〜1μｍ程度で十分である。Next, as shown in FIG. 1 (d), a thin electroless plating layer is formed on the copper foil provided with the catalyst nuclei and inside the IVH. Commercially available electroless copper plating such as CUST2000 (manufactured by Hitachi Chemical Co., Ltd., trade name) and CUST201 (manufactured by Hitachi Chemical Co., Ltd., trade name) can be used for the electroless plating. These electroless copper platings contain copper sulfate, formalin, a complexing agent, and sodium hydroxide as main components. It suffices that the thickness of plating be such that the next electroplating can be performed, and about 0.1 to 1 μm is sufficient.
【００１９】次に図１（e）に示すように無電解めっき
を行った上にめっきレジストを形成する。めっきレジス
トの厚さは、その後めっきする導体の厚さと同程度かよ
り厚い膜厚にするのが好適である。めっきレジストに使
用できる樹脂には、PMER P−LA900PM（東京応化株式会
社製、商品名）のような液状レジストや、HＷ−425（日
立化成工業株式会社、商品名）、RY−3025（日立化成工
業株式会社、商品名）等のドライフィルムがある。ビア
ホール上と導体回路となるべき個所はめっきレジストを
形成しない。Next, as shown in FIG. 1 (e), electroless plating is performed and a plating resist is formed. The thickness of the plating resist is preferably the same as or thicker than the thickness of the conductor to be plated thereafter. Resins that can be used for plating resists include liquid resists such as PMER P-LA900PM (trade name, manufactured by Tokyo Ohka Co., Ltd.), HW-425 (Hitachi Chemical Co., Ltd., trade name), RY-3025 (Hitachi Chemical Co., Ltd.). There are dry films manufactured by Kogyo Co., Ltd., etc.). No plating resist is formed on the via holes and the portions to be conductor circuits.
【００２０】次に図１（ｆ）に示すように電気めっきに
より回路パターンを形成する。電気めっきには、通常プ
リント配線板で使用される硫酸銅電気めっきやピロリン
酸電気めっきが使用できる。めっきの厚さは、回路導体
として使用できればよく、1〜１００μｍの範囲である
事が好ましく、５〜５０μｍの範囲である事がより好ま
しい。また回路形成時の電流密度は０.５A/dm2以上5A/d
m2以下であることが望ましい。Next, as shown in FIG. 1F, a circuit pattern is formed by electroplating. For the electroplating, copper sulfate electroplating or pyrophosphoric acid electroplating which is usually used in printed wiring boards can be used. The thickness of the plating is sufficient if it can be used as a circuit conductor, and it is preferably in the range of 1 to 100 μm, more preferably in the range of 5 to 50 μm. The current density during circuit formation is 0.5 A / dm 2 or more and 5 A / d.
It is preferably m 2 or less.
【００２１】次にアルカリ性剥離液や硫酸あるいは市販
のレジスト剥離液を用いてレジストの剥離を行う。Next, the resist is stripped using an alkaline stripping solution, sulfuric acid or a commercially available resist stripping solution.
【００２２】次にパターン部以外の銅を１０〜３００ｇ
／Lの硫酸及び１０〜２００ｇ／Lの過酸化水素を主成分
とするエッチング液を用いて除去することで回路形成が
終了する。（図1ｇ図）上記エッチング液は過酸化水素
の安定剤が入っていても構わない。硫酸、過酸化水素を
主成分とするエッチング液は、拡散律速性が弱いため微
細配線形成性が良好である。尚、上記濃度域以下の濃度
ではエッチング速度が遅いために作業性が悪く、上記濃
度域以上の濃度ではエッチング速度が速いためにエッチ
ング量のコントロールが難しい。エッチング速度は１〜
１５μｍ/分がよい。さらに回路上に金めっきを行うこ
とも出来る。金めっきの方法としては、ＳＡ―１００
（日立化成工業株式会社製、商品名）のような活性化処
理液で導体界面の活性化処理を行い、ＮＩＰＳ―１００
（日立化成工業株式会社製、商品名）のような無電解ニ
ッケルめっきを１〜10μｍ程度行い、ＨＧＳ―１００
（日立化成工業株式会社製、商品名）のような置換金め
っきを０．０１〜０．１μｍ程度行った後にＨＧＳ―２
０００（日立化成工業株式会社製、商品名）のような無
電解金めっきを０．１〜1μｍ程度行う。Next, 10 to 300 g of copper other than the pattern portion is used.
The circuit formation is completed by removing it by using an etching solution whose main component is / L sulfuric acid and 10-200 g / L hydrogen peroxide. (Fig. 1g) The etching solution may contain a stabilizer of hydrogen peroxide. An etching solution containing sulfuric acid or hydrogen peroxide as a main component has a weak diffusion rate-controlling property, and thus has a good fine wiring forming property. If the concentration is lower than the above concentration range, the workability is poor because the etching rate is slow, and if the concentration is higher than the above concentration range, the etching rate is fast, and it is difficult to control the etching amount. Etching rate is 1 ~
15 μm / min is good. Furthermore, gold plating can be performed on the circuit. As a method of gold plating, SA-100
(Hitachi Kasei Co., Ltd., trade name) is used to activate the conductor interface with an activation treatment liquid, and NIPS-100
(Hitachi Chemical Industry Co., Ltd., trade name) electroless nickel plating about 1-10 μm, HGS-100
(Hitachi Kasei Kogyo Co., Ltd., trade name) and then HGS-2 after performing displacement gold plating of about 0.01 to 0.1 μm.
000 (manufactured by Hitachi Chemical Co., Ltd., trade name) such as electroless gold plating is performed for about 0.1 to 1 μm.
【００２３】[0023]
【実施例】図１（a）に示すように、絶縁基材に、厚さ
１８μｍの銅箔を両面に貼り合わせた厚さ０．２ｍｍの
ガラス布基材エポキシ銅張積層板であるＭＣＬ−Ｅ−６
７９（日立化成工業株式会社製、商品名）を用い、その
不要な箇所の銅箔をエッチング除去し、スルーホール3
を形成して、内層導体回路1を形成し、内層回路板２を
作製した。その内層回路板２の内層導体回路1の処理
を、ＭＥC etch ＢＯＮＤＣＺ−８１００（メック株式
会社製、商品名）を用い、液温３５℃、スプレー圧０．
１５ＭＰの条件で、スプレー噴霧処理し、銅表面を粗面
化して、粗さ３μｍ程度の凹凸を作り、ＭＥC etch Ｂ
ＯＮＤ ＣＬ−８３００（メック株式会社製、商品名）
を用いて、液温２５℃、浸漬時間２０秒間の条件で浸漬
して、銅表面に防錆処理を行なった。図１（ｂ）に示す
ように、内層回路板２の両面に、１０A／dm2の電流密度
で作製した3μｍ銅箔4に接着剤を塗布した樹脂付き銅箔
を、２００℃２０kgf/cm2の条件で９０分加熱加圧ラミ
ネートし、厚さ40μｍの絶縁層4を形成した。用いた接
着剤はトルエン１８３ｇにポリフェニレンエーテル樹脂
（ＰＫＮ４７５２、日本ジーイープラスチックス株式会
社製商品名）５０ｇ、２，２-ビス（４-シアナトフェニ
ル）プロパン（ＡｒｏｃｙＢ−１０、旭チバ株式会社製
商品名）１００ｇ、９，１０-ジヒドロ-９-オキサ-１０
-ホスファフェナントレン-１０-オキサイド（ＨＣＡ-Ｈ
Ｑ、三光化学株式会社製商品名）２８.１ｇ、ナフテン
酸マンガン（Ｍｎ含有量＝６重量％、日本化学産業株式
会社製）の１７％トルエン希釈溶液０.１ｇ、２，２-ビ
ス（４-グリシジルフェニル）プロパン（ＤＥＲ３３１
Ｌ、ダウケミカル日本株式会社製商品名）８８.３ｇを
加え、８０℃で加熱溶解して得た。図１（ｃ）に示すよ
うに、銅箔上から炭酸ガスインパクトレーザー穴あけ機
Ｌ−５００（住友重機械工業株式会社製、商品名）によ
り、直径８０μｍの非貫通穴6をあけ、過マンガン酸カ
リウム６５ｇ／リットルと水酸化ナトリウム４０ｇ／リ
ットルの混合水溶液に、液温７０℃で２０分間浸漬し、
スミアの除去を行なった。その後、パラジウム溶液であ
るＨＳ−２０２Ｂ（日立化成工業株式会社製、商品名）
に、２５℃で１５分間浸漬し、触媒を付与した後、ＣＵ
ＳＴ−２０１（日立化成工業株式会社製、商品名）を使
用し、液温２５℃、３０分の条件で無電解銅めっきを行
ない、図１（ｄ）に示すように厚さ０．３μｍの無電解
銅めっき層７を形成した。図１（e）に示すように、ド
ライフィルムフォトレジストであるＲＹ−３０２５（日
立化成工業株式会社製、商品名）を、無電解めっき層７
の表面にラミネートし、電解銅めっきを行なう箇所をマ
スクしたフォトマスクを介して紫外線を露光し、現像し
てめっきレジスト８を形成した。図１（ｆ）に示すよう
に、硫酸銅浴を用いて、液温２５℃、電流密度１．０Ａ
／ｄｍ2の条件で、電解銅めっきを２０μｍほど行な
い、回路導体幅／回路導体間隔（Ｌ／Ｓ）＝２５／１５
μｍとなるように電解銅めっき層８を形成した。次に図
１（ｇ）に示すように、レジスト剥離液であるHTO（ニ
チゴー・モートン株式会社製、商品名）でドライフィル
ムの除去を行った後にＨ2ＳＯ4２０ｇ／Ｌ、Ｈ2Ｏ2１０
ｇ／Ｌの組成のエッチング液を用いてパターン部以外の
銅をエッチング除去した。エッチング時は基板を片面1
ｄｍ2の小片に切断した後、1Ｌビーカーに入れ、マグネ
ティックスターラーを用いて４０℃で５分間エッチング
を行った。最後に表１に示す条件で導体回路に金めっき
を行った（ｈ図）。EXAMPLE As shown in FIG. 1 (a), MCL- which is a 0.2 mm thick glass cloth base material epoxy copper clad laminate in which a copper foil having a thickness of 18 μm is bonded to both sides on an insulating base material. E-6
79 (manufactured by Hitachi Chemical Co., Ltd., trade name) was used to etch away the copper foil at unnecessary points, and the through hole 3
Then, the inner layer conductor circuit 1 was formed, and the inner layer circuit board 2 was produced. The inner layer conductor circuit 1 of the inner layer circuit board 2 was treated with MEC etch BONDCZ-8100 (trade name, manufactured by Mec Co., Ltd.) at a liquid temperature of 35 ° C. and a spray pressure of 0.
Spraying is performed under the condition of 15MP to roughen the copper surface to make unevenness with a roughness of about 3 μm.
OND CL-8300 (Mec Co., Ltd., trade name)
Was immersed in the solution at a liquid temperature of 25 ° C. for an immersion time of 20 seconds to perform rust prevention treatment on the copper surface. As shown in FIG. 1 (b), a resin-coated copper foil prepared by applying an adhesive to a 3 μm copper foil 4 produced at a current density of 10 A / dm2 was applied on both surfaces of the inner layer circuit board 2 under conditions of 200 ° C. and 20 kgf / cm2. The laminate was heated and pressurized for 90 minutes to form an insulating layer 4 having a thickness of 40 μm. The adhesive used was 50 g of polyphenylene ether resin (PKN4752, a product name of Nippon GE Plastics Co., Ltd.) in 183 g of toluene, 2,2-bis (4-cyanatophenyl) propane (ArocyB-10, a product of Asahi Ciba Co., Ltd.). Name) 100 g, 9,10-dihydro-9-oxa-10
-Phosphaphenanthrene-10-oxide (HCA-H
Q, Sanko Chemical Co., Ltd. product name) 28.1 g, manganese naphthenate (Mn content = 6% by weight, manufactured by Nippon Kagaku Sangyo Co., Ltd.) 0.1% toluene dilute solution 0.1 g, 2,2-bis (4) -Glycidylphenyl) propane (DER331
L, 88.3 g of Dow Chemical Japan Co., Ltd. product name) was added, and the mixture was heated and dissolved at 80 ° C. to obtain. As shown in FIG. 1 (c), a non-through hole 6 having a diameter of 80 μm was drilled from a copper foil with a carbon dioxide gas impact laser drilling machine L-500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.) to give permanganate. Immerse in a mixed aqueous solution of potassium 65 g / liter and sodium hydroxide 40 g / liter at a liquid temperature of 70 ° C. for 20 minutes,
The smear was removed. After that, HS-202B which is a palladium solution (Hitachi Chemical Co., Ltd., trade name)
After immersing in CU at 25 ° C for 15 minutes to apply a catalyst, CU
Using ST-201 (manufactured by Hitachi Chemical Co., Ltd., trade name), electroless copper plating was performed at a liquid temperature of 25 ° C. for 30 minutes and a thickness of 0.3 μm as shown in FIG. 1 (d). The electroless copper plating layer 7 was formed. As shown in FIG. 1 (e), a dry film photoresist, RY-3025 (trade name, manufactured by Hitachi Chemical Co., Ltd.) was used as an electroless plating layer 7.
Was laminated on the surface of, and exposed to ultraviolet rays through a photomask which masked a portion to be subjected to electrolytic copper plating, and developed to form a plating resist 8. As shown in FIG. 1 (f), using a copper sulfate bath, the liquid temperature was 25 ° C. and the current density was 1.0 A.
Electrolytic copper plating of about 20 μm under the condition of / dm 2 , circuit conductor width / circuit conductor interval (L / S) = 25/15
The electrolytic copper plating layer 8 was formed to have a thickness of μm. Next, as shown in FIG. 1 (g), after removing the dry film with HTO (trade name, manufactured by Nichigo Morton Co., Ltd.), which is a resist remover, H 2 SO 4 20 g / L, H 2 O 2 10
Copper other than the pattern portion was removed by etching using an etching solution having a composition of g / L. One side of the substrate when etching
After cutting into small pieces of dm2, the pieces were placed in a 1 L beaker and etched at 40 ° C for 5 minutes using a magnetic stirrer. Finally, the conductor circuit was gold-plated under the conditions shown in Table 1 (Fig. H).
【００２４】[0024]
【表１】 金めっき条件 [Table 1] Gold plating conditions
【００２５】[0025]
【比較例】3μｍ銅箔に接着剤を塗布した樹脂付き銅箔
に、エポキシ樹脂ベースのMCF6000E（日立化成工業株式
会社製、商品名）を用いた他は実施例と同様に基板を作
製した。[Comparative Example] A substrate was prepared in the same manner as in Example except that epoxy resin-based MCF6000E (manufactured by Hitachi Chemical Co., Ltd., trade name) was used for a resin-coated copper foil obtained by applying an adhesive to a 3 μm copper foil.
【００２６】実施例及び比較例で得られたプリント配線
板について、誘電率及び誘電正接を測定し、さらにこの
プリント配線板上にICチップを登載し、半導体装置を作
製し、信号遅延及び信号エラーが発生するか否かの評価
を行った。表２に示したように実施例では低誘電率、低
誘電正接の材料を用い、パターン電気めっきにより微細
配線を形成し、半導体装置の信号遅延、信号エラーを抑
制することが出来た。With respect to the printed wiring boards obtained in Examples and Comparative Examples, the dielectric constant and the dielectric loss tangent were measured, and an IC chip was mounted on the printed wiring board to produce a semiconductor device, and a signal delay and a signal error were produced. It was evaluated whether or not occurs. As shown in Table 2, in Examples, a material having a low dielectric constant and a low dielectric loss tangent was used, and fine wiring was formed by pattern electroplating, so that signal delay and signal error of the semiconductor device could be suppressed.
【００２７】[0027]
【表２】 基板及び半導体装置の特性 [Table 2] Characteristics of substrate and semiconductor device
【００２８】以上示したように本発明により絶縁樹脂層
が低誘電、低誘電正接であり、尚且つパターン電気めっ
きで微細配線が形成された多層プリント配線板を製造す
ることが出来る。As described above, according to the present invention, it is possible to manufacture a multilayer printed wiring board in which an insulating resin layer has a low dielectric constant and a low dielectric loss tangent and fine wiring is formed by pattern electroplating.
【００２９】[0029]
【図１】 本発明の−実施例における高周波用プリント
配線板の製造工程断面図を図１に示す。FIG. 1 is a sectional view of a manufacturing process of a high frequency printed wiring board according to a first embodiment of the present invention.
1 内層導体回路 2 内層回路板 3 スルーホール 4 銅箔 5 絶縁層 6 非貫通穴（IVH） 7 無電解銅めっき 8 めっきレジスト 9 パターン電気めっき 10 Ni／Auめっき 1 Inner layer conductor circuit 2 Inner layer circuit board 3 through hole 4 copper foil 5 insulating layer 6 Non-through hole (IVH) 7 Electroless copper plating 8 Plating resist 9 pattern electroplating 10 Ni / Au plating
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 63/00 Ｃ０８Ｌ 63/00 Ｚ ５Ｅ３３９ 71/12 71/12 ５Ｅ３４３ 79/00 79/00 Ｚ ５Ｅ３４６ Ｃ２３Ｆ 1/00 Ｃ２３Ｆ 1/00 Ｚ 1/18 1/18 Ｃ２５Ｄ 7/00 Ｃ２５Ｄ 7/00 Ｊ Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｈ 3/00 3/00 Ｎ 3/06 3/06 Ｎ 3/18 3/18 Ｈ Ｆターム(参考） 4F072 AA01 AA04 AA07 AB09 AB28 AD11 AD23 AD42 AD53 AE07 AG03 AG16 AK05 AL12 AL13 4F100 AB01A AB17A AH05H AK01B AK53B AK54B AL06B AR00B BA02 BA03 BA25A CA08B EH71A GB43 HB00A JB13B JG01A JG04B YY00A 4J002 CD001 CH071 CM021 EB136 EW006 FD136 GQ01 4K024 AA09 AB02 AB08 AB17 BA14 BB11 CA06 DB09 FA05 4K057 WA10 WB04 WC08 WE03 WE25 WG03 WN01 5E339 AB02 AD05 AE01 BC02 BD02 BD06 BD08 BE17 CD01 5E343 AA02 AA12 AA16 BB12 BB14 BB24 BB67 BB71 DD33 DD43 GG13 5E346 AA12 AA32 AA43 AA51 BB02 CC08 CC09 CC32 DD02 DD12 DD22 DD33 EE33 FF01 FF04 FF07 FF15 GG15 GG17 GG22 GG28 HH06 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C08L 63/00 C08L 63/00 Z 5E339 71/12 71/12 5E343 79/00 79/00 Z 5E346 C23F 1 / 00 C23F 1/00 Z 1/18 1/18 C25D 7/00 C25D 7/00 J H05K 1/03 610 H05K 1/03 610H 3/00 3/00 N 3/06 3/06 N 3/18 3 / 18 H F-term (reference) 4F072 AA01 AA04 AA07 AB09 AB28 AD11 AD23 AD42 AD53 AE07 AG03 AG16 AK05 AL12 AL13 4F100 AB01A AB17A AH05H AK01B AK53B AK54B AL06B AR00B BA02 BA03 BA25A CA08B EH71A GB43 HB00A JB13B JG01A JG04B YY00A 4J002 CD001 CH071 CM021 EB136 EW006 FD136 GQ01 4K024 AA09 AB02 AB08 AB17 BA14 BB11 CA06 DB09 FA05 4K057 WA10 WB04 WC08 WE03 WE25 WG03 WN01 5E339 AB02 AD05 AE01 BC02 BD02 BD06 BD08 BE17 CD01 5E343 AA02 AA12 AA16 BB1 2 BB14 BB24 BB67 BB71 DD33 DD43 GG13 5E346 AA12 AA32 AA43 AA51 BB02 CC08 CC09 CC32 DD02 DD12 DD22 DD33 EE33 FF01 FF04 FF07 FF15 GG15 GG17 GG22 GG28 HH06
Claims (26)
いるプリント配線板であって、導体回路の一部がパター
ン電気めっきにより形成されており、前記絶縁樹脂層の
1GHｚにおける誘電正接が０．０１以下であることを特
徴とする多層プリント配線板。1. A printed wiring board in which a conductor circuit and an insulating resin layer are sequentially formed, wherein a part of the conductor circuit is formed by pattern electroplating.
A multilayer printed wiring board having a dielectric loss tangent of 0.01 or less at 1 GHz.
いるプリント配線板であって、導体回路の一部がパター
ン電気めっきにより形成されており、前記絶縁樹脂層の
1GHｚにおける誘電率が３.０以下であることを特徴とす
る多層プリント配線板。2. A printed wiring board in which a conductor circuit and an insulating resin layer are sequentially formed, wherein a part of the conductor circuit is formed by pattern electroplating.
A multilayer printed wiring board having a dielectric constant of 3.0 or less at 1 GHz.
気めっきと厚さ５μｍ以下の電解銅箔からなることを特
徴とする請求項１〜２に記載の多層プリント配線板。3. The multilayer printed wiring board according to claim 1, wherein the conductor circuit is composed of patterned electroplating having a thickness of 3 to 50 μm and electrolytic copper foil having a thickness of 5 μm or less.
ーテルまたは変性ポリフェニレンエーテルを含む熱硬化
性樹脂組成物からなることを特徴とする請求項１〜３に
記載の多層プリント配線板。4. The multilayer printed wiring board according to claim 1, wherein the insulating resin layer is made of a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether.
ル化合物を含む熱硬化性樹脂組成物からなることを特徴
とする請求項１〜４に記載の多層プリント配線板。5. The multilayer printed wiring board according to claim 1, wherein the insulating resin layer comprises a thermosetting resin composition containing a cyanate ester compound (B).
含む熱硬化性樹脂組成物からなることを特徴とする請求
項１〜５に記載の多層プリント配線板。6. The multilayer printed wiring board according to claim 1, wherein the insulating resin layer comprises a thermosetting resin composition containing an epoxy compound (C).
ーテルまたは変性ポリフェニレンエーテルと（Ｂ）シア
ネートエステル化合物を必須成分とする熱硬化性樹脂組
成物からなることを特徴とする請求項１〜６に記載の多
層プリント配線板。7. The insulating resin layer comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (B) cyanate ester compound as essential components. The multilayer printed wiring board described.
ーテルまたは変性ポリフェニレンエーテルと（Ｃ）エポ
キシ化合物を必須成分とする熱硬化性樹脂組成物からな
ることを特徴とする請求項１〜７に記載の多層プリント
配線板。8. The thermosetting resin composition, wherein the insulating resin layer comprises (A) polyphenylene ether or modified polyphenylene ether and (C) epoxy compound as essential components, according to any one of claims 1 to 7. Multilayer printed wiring board.
ーテルまたは変性ポリフェニレンエーテルと（Ｂ）シア
ネートエステル化合物と（Ｃ）エポキシ化合物を必須成
分とする熱硬化性樹脂組成物からなることを特徴とする
請求項１〜８に記載の多層プリント配線板。9. The thermosetting resin composition, wherein the insulating resin layer comprises (A) polyphenylene ether or modified polyphenylene ether, (B) cyanate ester compound and (C) epoxy compound as essential components. The multilayer printed wiring board according to claim 1.
熱硬化性樹脂組成物からなることを特徴とする請求項１
〜９に記載の多層プリント配線板。10. The insulating resin layer comprises a thermosetting resin composition containing no inorganic filler.
The multilayer printed wiring board according to any one of items 1 to 9.
化アルミニウム、水酸化マグネシウムからなる群より選
ばれる無機充填剤を含まない熱硬化性樹脂組成物からな
ることを特徴とする請求項１〜１０に記載の多層プリン
ト配線板。11. The insulating resin layer comprises a thermosetting resin composition containing no inorganic filler selected from the group consisting of silica, talc, aluminum hydroxide and magnesium hydroxide. 10. The multilayer printed wiring board according to 10.
はリン化合物を含む熱硬化性樹脂組成物であることを特
徴とする請求項１〜１１に記載の多層プリント配線板。12. The multilayer printed wiring board according to claim 1, wherein the insulating resin layer is a thermosetting resin composition further containing a bromine compound or a phosphorus compound.
５μｍ以下の銅箔付樹脂を積層し、その後基板上にレー
ザーを照射することで層間接続のためのＩＶＨ（インタ
ースティシャルバイアホール）を形成し、給電層として
薄付け無電解銅めっきを行い、パターン電気めっきレジ
ストを形成した後にパターン電気めっきを行い、レジス
トを除去し、パターン部以外の銅をエッチング除去する
工程を少なくとも有することを特徴とするプリント配線
板の製造方法において、前記銅箔付樹脂の樹脂の1GHｚ
における誘電正接が０．０１以下であることを特徴とす
る多層プリント配線板の製造方法。13. An IVH (interstitial via hole) for interlayer connection is formed by laminating a resin with a copper foil having a thickness of 5 μm or less on the upper and lower sides of an inner layer substrate having a conductor circuit, and then irradiating a laser on the substrate. Forming and performing thin electroless copper plating as a power supply layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern part In the method for manufacturing a printed wiring board as described above, 1 GHz of the resin with the copper foil
And a dielectric loss tangent thereof is 0.01 or less.
５μｍ以下の銅箔付樹脂を積層し、その後基板上にレー
ザーを照射することで層間接続のためのＩＶＨ（インタ
ースティシャルバイアホール）を形成し、給電層として
薄付け無電解銅めっきを行い、パターン電気めっきレジ
ストを形成した後にパターン電気めっきを行い、レジス
トを除去し、パターン部以外の銅をエッチング除去する
工程を少なくとも有することを特徴とするプリント配線
板の製造方法において、前記銅箔付樹脂の樹脂の1GHｚ
における誘電率が３.０以下であることを特徴とする多
層プリント配線板の製造方法。14. An IVH (interstitial via hole) for interlayer connection is formed by laminating a resin with a copper foil having a thickness of 5 μm or less on an inner layer substrate having a conductor circuit and irradiating a laser on the substrate. Forming and performing thin electroless copper plating as a power supply layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern part In the method for manufacturing a printed wiring board as described above, 1 GHz of the resin with the copper foil
The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the dielectric constant is less than or equal to 3.0.
プレグを介して厚み５μｍ以下の銅箔を積層し、その後
基板上にレーザーを照射することで層間接続のためのＩ
ＶＨ（インタースティシャルバイアホール）を形成し、
給電層として薄付け無電解銅めっきを行い、パターン電
気めっきレジストを形成した後にパターン電気めっきを
行い、レジストを除去し、パターン部以外の銅をエッチ
ング除去する工程を少なくとも有することを特徴とする
プリント配線板の製造方法において、プリプレグの樹脂
の1GHｚにおける誘電正接が０．０１以下であることを
特徴とする多層プリント配線板の製造方法。15. A copper foil having a thickness of 5 μm or less is laminated on the upper and lower sides of an inner layer substrate having a conductor circuit via prepregs, and then the substrate is irradiated with a laser beam to form an interlayer connection I.
VH (interstitial via hole) is formed,
A print comprising at least steps of performing thin electroless copper plating as a power feeding layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern portion. A method for manufacturing a wiring board, wherein the resin of the prepreg has a dielectric loss tangent at 1 GHz of 0.01 or less.
プレグを介して厚み５μｍ以下の銅箔を積層し、その後
基板上にレーザーを照射することで層間接続のためのＩ
ＶＨ（インタースティシャルバイアホール）を形成し、
給電層として薄付け無電解銅めっきを行い、パターン電
気めっきレジストを形成した後にパターン電気めっきを
行い、レジストを除去し、パターン部以外の銅をエッチ
ング除去する工程を少なくとも有することを特徴とする
プリント配線板の製造方法において、プリプレグの樹脂
の1GHｚにおける誘電率が３.０以下であることを特徴と
する多層プリント配線板の製造方法。16. A copper foil having a thickness of 5 μm or less is laminated on the upper and lower sides of an inner layer substrate having a conductor circuit through a prepreg, and then the substrate is irradiated with a laser beam to form an interlayer connection I.
VH (interstitial via hole) is formed,
A print comprising at least steps of performing thin electroless copper plating as a power feeding layer, forming a pattern electroplating resist, then performing pattern electroplating, removing the resist, and etching away copper other than the pattern portion. A method of manufacturing a wiring board, wherein the resin of the prepreg has a dielectric constant of 3.0 or less at 1 GHz.
る工程に硫酸／過酸化水素を主成分とするエッチング液
を用いることを特徴とする請求項１３〜１６に記載の多
層プリント配線板の製造方法。17. The method for manufacturing a multilayer printed wiring board according to claim 13, wherein an etching solution containing sulfuric acid / hydrogen peroxide as a main component is used in the step of etching away copper other than the pattern portion. .
グの樹脂が（Ａ）ポリフェニレンエーテルまたは変性ポ
リフェニレンエーテルを含む熱硬化性樹脂組成物からな
ることを特徴とする請求項１３〜１７に記載の多層プリ
ント配線板の製造方法。18. The multilayer according to claim 13, wherein the resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether. Manufacturing method of printed wiring board.
グの樹脂が（Ｂ）シアネートエステル化合物を含む熱硬
化性樹脂組成物からなることを特徴とする請求項１３〜
１８に記載の多層プリント配線板の製造方法。19. The resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing a cyanate ester compound (B).
18. The method for manufacturing a multilayer printed wiring board according to item 18.
グの樹脂が（Ｃ）エポキシ化合物を含む熱硬化性樹脂組
成物からなることを特徴とする請求項１３〜１９に記載
の多層プリント配線板の製造方法。20. The multilayer printed wiring board according to claim 13, wherein the resin of the resin with copper foil or the resin of the prepreg is a thermosetting resin composition containing an epoxy compound (C). Production method.
グの樹脂が（Ａ）ポリフェニレンエーテルまたは変性ポ
リフェニレンエーテルと（Ｂ）シアネートエステル化合
物を必須成分とする熱硬化性樹脂組成物からなることを
特徴とする請求項１３〜２０に記載の多層プリント配線
板の製造方法。21. The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (B) cyanate ester compound as essential components. The method for manufacturing a multilayer printed wiring board according to any one of claims 13 to 20.
グの樹脂が（Ａ）ポリフェニレンエーテルまたは変性ポ
リフェニレンエーテルと（Ｃ）エポキシ化合物を必須成
分とする熱硬化性樹脂組成物からなることを特徴とする
請求項１３〜２１に記載の多層プリント配線板の製造方
法。22. The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing (A) polyphenylene ether or modified polyphenylene ether and (C) epoxy compound as essential components. A method for manufacturing the multilayer printed wiring board according to claim 13.
グの樹脂が（Ａ）ポリフェニレンエーテルまたは変性ポ
リフェニレンエーテルと（Ｂ）シアネートエステル化合
物と（Ｃ）エポキシ化合物を必須成分とする熱硬化性樹
脂組成物からなることを特徴とする請求項１３〜２２に
記載の多層プリント配線板の製造方法。23. A thermosetting resin composition in which the resin of the resin with copper foil or the resin of prepreg contains (A) polyphenylene ether or modified polyphenylene ether, (B) cyanate ester compound and (C) epoxy compound as essential components. The method for manufacturing a multilayer printed wiring board according to any one of claims 13 to 22, comprising:
グの樹脂が無機充填剤を含まない熱硬化性樹脂組成物か
らなることを特徴とする請求項１３〜２３に記載の多層
プリント配線板の製造方法。24. The production of a multilayer printed wiring board according to claim 13, wherein the resin of the resin with copper foil or the resin of the prepreg comprises a thermosetting resin composition containing no inorganic filler. Method.
グの樹脂がシリカ、タルク、水酸化アルミニウム、水酸
化マグネシウムからなる群より選ばれる無機充填剤を含
まない熱硬化性樹脂組成物からなることを特徴とする請
求項１３〜２４に記載の多層プリント配線板の製造方
法。25. The resin of the resin with copper foil or the resin of prepreg comprises a thermosetting resin composition containing no inorganic filler selected from the group consisting of silica, talc, aluminum hydroxide and magnesium hydroxide. The method for manufacturing a multilayer printed wiring board according to any one of claims 13 to 24.
グの樹脂がさらに臭素化合物およびリン化合物を含む熱
硬化性樹脂組成物であることを特徴とする請求項１３〜
２５に記載の多層プリント配線板の製造方法。26. The resin of the resin with copper foil or the resin of prepreg is a thermosetting resin composition further containing a bromine compound and a phosphorus compound.
25. The method for manufacturing a multilayer printed wiring board according to 25.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020288A JP2003224367A (en) | 2002-01-29 | 2002-01-29 | High frequency printed wiring board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020288A JP2003224367A (en) | 2002-01-29 | 2002-01-29 | High frequency printed wiring board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003224367A true JP2003224367A (en) | 2003-08-08 |
Family
ID=27743822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002020288A Pending JP2003224367A (en) | 2002-01-29 | 2002-01-29 | High frequency printed wiring board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003224367A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150211A (en) * | 2003-11-12 | 2005-06-09 | Hitachi Chem Co Ltd | Multilayer wiring board and its manufacturing method |
| WO2005053368A1 (en) * | 2003-11-27 | 2005-06-09 | Fuji Photo Film Co., Ltd. | Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same |
| WO2009041137A1 (en) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
| KR101408549B1 (en) | 2011-09-28 | 2014-06-17 | 이비덴 가부시키가이샤 | Printed wiring board |
| JP2014189750A (en) * | 2013-03-28 | 2014-10-06 | Dic Corp | Curable composition, cured product and printed circuit board |
| JP2021130743A (en) * | 2020-02-18 | 2021-09-09 | Dic株式会社 | Curable resin composition and cured product |
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|---|---|---|---|---|
| JP2005150211A (en) * | 2003-11-12 | 2005-06-09 | Hitachi Chem Co Ltd | Multilayer wiring board and its manufacturing method |
| WO2005053368A1 (en) * | 2003-11-27 | 2005-06-09 | Fuji Photo Film Co., Ltd. | Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same |
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| WO2009041137A1 (en) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
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| KR101408549B1 (en) | 2011-09-28 | 2014-06-17 | 이비덴 가부시키가이샤 | Printed wiring board |
| JP2014189750A (en) * | 2013-03-28 | 2014-10-06 | Dic Corp | Curable composition, cured product and printed circuit board |
| JP2021130743A (en) * | 2020-02-18 | 2021-09-09 | Dic株式会社 | Curable resin composition and cured product |
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