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JP2003195081A - Method of forming optical waveguide - Google Patents

Method of forming optical waveguide

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Publication number
JP2003195081A
JP2003195081A JP2001394902A JP2001394902A JP2003195081A JP 2003195081 A JP2003195081 A JP 2003195081A JP 2001394902 A JP2001394902 A JP 2001394902A JP 2001394902 A JP2001394902 A JP 2001394902A JP 2003195081 A JP2003195081 A JP 2003195081A
Authority
JP
Japan
Prior art keywords
optical waveguide
clad layer
film
dry film
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001394902A
Other languages
Japanese (ja)
Other versions
JP4186462B2 (en
Inventor
Yuuichi Eriyama
祐一 江利山
Kentaro Tamaki
研太郎 玉木
Hideaki Takase
英明 高瀬
Tomohiro Uko
友広 宇高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2001394902A priority Critical patent/JP4186462B2/en
Publication of JP2003195081A publication Critical patent/JP2003195081A/en
Application granted granted Critical
Publication of JP4186462B2 publication Critical patent/JP4186462B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

(57)【要約】 【課題】 光IC、光モジュール、LED、LD等の
光デバイスに搭載される光導波路を簡便に製造する方法
を得る。 【解決手段】 下部クラッド層、コア部分および上部
クラッド層からなる光導波路であって、下部クラッド層
およびコア部分の少なくとも1つをドライフィルムを用
いて形成することを特徴とする光導波路の形成方法。
(57) Abstract: A method for easily manufacturing an optical waveguide mounted on an optical device such as an optical IC, an optical module, an LED, and an LD is provided. An optical waveguide comprising a lower cladding layer, a core portion, and an upper cladding layer, wherein at least one of the lower cladding layer and the core portion is formed using a dry film. .

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光IC、光モジュー
ル、LED、LD等の光デバイスに搭載される光導波路
の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical waveguide mounted on an optical device such as an optical IC, an optical module, an LED and an LD.

【0002】[0002]

【従来の技術】近年、光デーダリンクモジュール、光I
C、LED、LD等の発光素子、フォトダイオード、フ
ォトトランジスター等の受光素子が搭載されてきてお
り、同一基板内においても、これら発光素子や受光素子
を光導波路で接続することが要求されている。このよう
な要求に対して、光ファイバーと光コネクターとを組み
合わせて素子間を接続する方法等が提案されており、例
えば、特開平3−29905号公報等に記載されている
ように、配線板上に形成された絶縁膜内に光ファイバー
を埋め込む方法等が提案されている。
2. Description of the Related Art Recently, an optical data link module, an optical I
Light emitting elements such as C, LEDs, and LDs, and light receiving elements such as photodiodes and phototransistors have been mounted, and it is required to connect these light emitting elements and light receiving elements with an optical waveguide even within the same substrate. . In order to meet such demands, a method of connecting elements by combining an optical fiber and an optical connector has been proposed. For example, as disclosed in Japanese Patent Laid-Open No. 29905/1993, on a wiring board. There has been proposed a method of embedding an optical fiber in the insulating film formed in the above.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、光ファ
イバーを使用する場合には、光ファイバーを引っかけた
りして損傷させたり切断させたりする恐れがあり、その
取扱いに注意を要するとともに、光データバスや光アド
レスバス等では多数の光ファイバーを接続する必要があ
り、その配列だけでも非常に手間がかかるものであり、
生産性に劣るという問題点を有していた。また、光ファ
イバーの固定もソルダーレジスト等への埋め込み作業は
非常に煩雑なものとなる。さらに、光コネクタによる配
線では、省スペース化が困難であるという問題点をも有
していた。本発明は、光導波路を効率的に、容易に形成
することができる光導波路の製造方法を提供することを
目的とするものである。
However, when an optical fiber is used, there is a risk that the optical fiber may be hooked, damaged or cut, and care must be taken in handling the optical fiber as well as the optical data bus and optical address. It is necessary to connect a large number of optical fibers in a bus etc., and it is very troublesome just to arrange them.
It had a problem of poor productivity. Further, fixing the optical fiber also makes the work of embedding it in a solder resist or the like very complicated. Furthermore, the wiring using the optical connector has a problem that it is difficult to save space. It is an object of the present invention to provide a method of manufacturing an optical waveguide, which enables efficient and easy formation of the optical waveguide.

【0004】[0004]

【課題を解決するための手段】本発明者等は、上記のよ
うな従来技術の問題点に鑑み、光導波路を形成方法につ
いて鋭意検討することによって本発明に到達したもので
ある。すなわち、本発明は下部クラッド層、コア部分お
よび上部クラッド層からなる光導波路であって、下部ク
ラッド層およびコア部分の少なくとも1つをドライフィ
ルムを用いて形成することを特徴とする光導波路の形成
方法を提供するものである。
The present inventors have arrived at the present invention by earnestly examining a method for forming an optical waveguide in view of the problems of the prior art as described above. That is, the present invention is an optical waveguide comprising a lower clad layer, a core portion and an upper clad layer, wherein at least one of the lower clad layer and the core portion is formed using a dry film. It provides a method.

【0005】本発明のドライフィルムは、ポリエチレン
テレフタレート等のベースフィルムと、ベースフィルム
上に形成された樹脂層とからなり、必要に応じて、ベー
スフィルムと反対側にポリエチレンやポリプロピレン等
のカバーフィルムを保護フィルムとしてラミネートし、
樹脂層がベースフィルムとカバーフィルムとの間に挟ま
れる構造としてもよい。
The dry film of the present invention comprises a base film such as polyethylene terephthalate and a resin layer formed on the base film. If necessary, a cover film such as polyethylene or polypropylene may be provided on the side opposite to the base film. Laminate as a protective film,
The resin layer may be sandwiched between the base film and the cover film.

【0006】上記において、樹脂層は(メタ)アクリル
系重合体は、例えば(A)(メタ)アクリル系重合体、
(B)分子中に2個以上の重合性反応基を有する化合物
および(C)放射線重合開始剤を含む樹脂組成物を挙げ
ることができる。特にコア部分を形成するためのドライ
フィルムには放射線硬化性樹脂組成物を使用することが
できる。 (A)(メタ)アクリル系重合体としては、カルボキシ
ル基を有するラジカル重合性化合物とそれ以外のラジカ
ル重合性化合物から得られるアルカリ可溶性共重合体な
らびに下記一般式(1)で表される重合体を使用するこ
とが好ましい。 一般式(1)
In the above, the resin layer is a (meth) acrylic polymer, for example, (A) a (meth) acrylic polymer,
Examples thereof include a resin composition containing (B) a compound having two or more polymerizable reactive groups in the molecule and (C) a radiation polymerization initiator. In particular, a radiation-curable resin composition can be used for the dry film for forming the core portion. As the (A) (meth) acrylic polymer, an alkali-soluble copolymer obtained from a radically polymerizable compound having a carboxyl group and a radically polymerizable compound other than that, and a polymer represented by the following general formula (1) Is preferably used. General formula (1)

【化1】 [R1,R2,R3は水素または1〜12の炭素鎖を有するアルキ
ル基、Xはカルボキシル基を有する基、Yは重合性基を
有する基、ZはXおよびY以外の有機基である]
[Chemical 1] [R 1 , R 2 and R 3 are hydrogen or an alkyl group having a carbon chain of 1 to 12, X is a group having a carboxyl group, Y is a group having a polymerizable group, Z is an organic group other than X and Y. is there]

【0007】本発明においてドライフィルムは、ベース
フィルム上に上記(A)〜(C)成分を含む組成物を直
接、塗布することによっても製造できるが、有機溶剤に
溶解させ、スピンコート法、ディッピング法、スプレー
法、バーコート法、ロールコート法、カーテンコート
法、グラビア印刷法、シルクスクリーン法、またはイン
クジェット法等の方法を用いて塗布した後、乾燥機等を
用いて溶剤を飛散させる方法でも製造できる。この場
合、有機溶剤としては、前記成分(A)の共重合体の調
製時に使用される有機溶剤を用いることができ、特に、
沸点の高くない溶剤が好ましい。これら溶剤は、単独あ
るいは2種以上を混合して使用することができ、(A)
〜(C)成分の合計量100重量部に対して、10〜1
50重量部の範囲内の値とすることが好ましい。
In the present invention, the dry film can be produced by directly coating the composition containing the above-mentioned components (A) to (C) on the base film, but the dry film is dissolved in an organic solvent, followed by spin coating and dipping. Method, spray method, bar coating method, roll coating method, curtain coating method, gravure printing method, silk screen method, or a method of spraying the solvent using a dryer etc. after applying using a method such as an inkjet method Can be manufactured. In this case, as the organic solvent, the organic solvent used at the time of preparing the copolymer of the component (A) can be used, and particularly,
Solvents with low boiling points are preferred. These solvents may be used alone or in combination of two or more, and (A)
10 to 1 to 100 parts by weight of the total amount of the component (C)
It is preferable to set the value within the range of 50 parts by weight.

【0008】本発明においては、下部クラッド層および
コア部分の少なくとも1つ、好ましくは両方をドライフ
ィルムで形成する。なお、下部クラッド層形成用ドライ
フィルムとコア部分形成用ドライフィルムとの屈折率差
は0.1%以上であることが必要である。
In the present invention, at least one of the lower clad layer and the core portion, preferably both of them, is formed of a dry film. The refractive index difference between the lower clad layer forming dry film and the core part forming dry film must be 0.1% or more.

【0009】本発明においては、ドライフィルムレジス
トを、ベースフィルムが上になるように基板にカバーフ
ィルムを除去しながら、常圧熱ロール圧着法、真空熱ロ
ール圧着法、真空熱プレス圧着法等の積層方法を用い
て、適当な熱と圧力を加えながら、積層する。次いで、
下部クラッド層の場合にはそのまま熱または放射線によ
り硬化する。一方、下部クラッド層と同様にして下部ク
ラッド上に積層した後、所望の光導波路のパターンが描
かれたフォトツールをベースフィルム上に載置し、紫外
線露光法、可視光露光法、レーザー露光法等を用いて、
フォトツールを通して感光性樹脂層に露光する。これに
よって、感光性樹脂層の露光部分では光重合が進み硬化
し、フォトツールのパターンによって遮光された部分
(未露光部分)は未硬化のままとなる。
In the present invention, the dry film resist is removed by removing the cover film from the substrate such that the base film is on top of the dry film resist while applying a normal pressure hot roll pressure bonding method, a vacuum heat roll pressure bonding method, a vacuum heat press pressure bonding method, or the like. Using the lamination method, the layers are laminated while applying appropriate heat and pressure. Then
In the case of the lower clad layer, it is cured by heat or radiation as it is. On the other hand, after stacking on the lower clad in the same manner as the lower clad layer, a phototool on which a desired optical waveguide pattern is drawn is placed on the base film, and the ultraviolet exposure method, visible light exposure method, laser exposure method is used. And so on,
The photosensitive resin layer is exposed through a photo tool. As a result, photopolymerization proceeds and cures in the exposed portion of the photosensitive resin layer, and the portion shielded by the pattern of the phototool (unexposed portion) remains uncured.

【0010】その後、ベースフィルム1を剥離して、炭
酸ナトリウム水溶液、リン酸ナトリウム水溶液、炭酸カ
リウム水溶液等の現像剤を用いて未硬化部分の除去を行
う。現像剤には、少量の消泡剤や界面活性剤を添加して
もよい。また、未露光部分の除去は、一般的には現像剤
をスプレー法によって吹き付ける方法が使用されるが、
現像剤中に浸漬させる浸漬法で行うこともできる。未露
光部分の除去を行うことによって、フォトツール8のパ
ターンに従った、コア部分の下にクラッド層形成され
る。
After that, the base film 1 is peeled off, and the uncured portion is removed using a developer such as an aqueous sodium carbonate solution, an aqueous sodium phosphate solution, an aqueous potassium carbonate solution. A small amount of antifoaming agent or surfactant may be added to the developer. Further, the removal of the unexposed portion is generally performed by spraying a developer with a spray method.
It can also be carried out by a dipping method of dipping in a developer. By removing the unexposed portion, a clad layer is formed under the core portion according to the pattern of the photo tool 8.

【0011】次いで上部クラッド層を形成する。本発明
においては、上部クラッド層は下部クラッド層と同様の
樹脂層からなることが好ましい。上部クラッド層はドラ
イフィルムを用いて形成することもできるが、樹脂成分
と有機溶剤からなる塗布液を下部クラッド層およびコア
部分に塗布し、熱または放射線により硬化することによ
り形成することができる。
Next, an upper clad layer is formed. In the present invention, the upper clad layer is preferably made of the same resin layer as the lower clad layer. The upper clad layer can be formed by using a dry film, but can be formed by applying a coating solution containing a resin component and an organic solvent to the lower clad layer and the core portion and curing the coating by heat or radiation.

【0012】[0012]

【実施例】以下、本発明を実施例によって具体的に説明
する。共重合体(A)の調製例1 ドライアイス/メタノール還流器の付いたフラスコを窒
素置換した後、重合開始剤として2,2‘−アゾビスイ
ソブチロニトリルを1.3g、有機溶剤として乳酸エチ
ルを53.8gを仕込み、重合開始剤が溶解するまで攪
拌した。引き続いて、メタクリル酸6.7g、ジシクロ
ペンタニルメタクリレート15.7g、スチレン9.0
g、およびn−ブチルアクリレート13.5gを仕込ん
だ後、緩やかに攪拌を始めた。その後、溶液の温度を8
0℃に上昇させ、この温度で4時間重合を行った。その
後、反応生成物を多量のヘキサンに滴下して反応生成物
を凝固させた。さらに、この凝固物と同重量のテトラヒ
ドロフランに再溶解し、多量のヘキサンで再度凝固させ
た。この再溶解−凝固操作を計3回行った後、得られた
凝固物を40℃で48時間真空乾燥し、目的とする共重
合体A−1を得た。
EXAMPLES The present invention will be specifically described below with reference to examples. Preparation Example 1 of Copolymer (A) 1 After replacing a flask equipped with a dry ice / methanol reflux device with nitrogen, 1.3 g of 2,2′-azobisisobutyronitrile as a polymerization initiator and lactic acid as an organic solvent were used. 53.8 g of ethyl was charged and stirred until the polymerization initiator was dissolved. Subsequently, 6.7 g of methacrylic acid, 15.7 g of dicyclopentanyl methacrylate and 9.0 of styrene.
After charging g and 13.5 g of n-butyl acrylate, gentle stirring was started. After that, increase the temperature of the solution to 8
The temperature was raised to 0 ° C., and polymerization was carried out at this temperature for 4 hours. Then, the reaction product was dropped into a large amount of hexane to solidify the reaction product. Further, the coagulated product was redissolved in tetrahydrofuran of the same weight and coagulated again with a large amount of hexane. This redissolution-coagulation operation was performed three times in total, and the obtained coagulated product was vacuum dried at 40 ° C. for 48 hours to obtain the target copolymer A-1.

【0013】共重合体(A)の調製例2 ドライアイス/メタノール還流器の付いたフラスコを窒
素置換した後、重合開始剤として2,2‘−アゾビスジ
メチルバレロニトリルを0.5g、有機溶剤として乳酸
エチルを54.3gを仕込み、重合開始剤が溶解するま
で攪拌した。引き続いて、メタクリル酸4.5g、ジシ
クロペンタニルメタクリレート9.0g、メチルメタク
リレート20.4g、およびn−ブチルアクリレート1
1.3gを仕込んだ後、緩やかに攪拌を始めた。その
後、溶液の温度を80℃に上昇させ、この温度で4時間
重合を行った。その後、反応生成物を多量のヘキサンに
滴下して反応生成物を凝固させた。さらに、この凝固物
と同重量のテトラヒドロフランに再溶解し、多量のヘキ
サンで再度凝固させた。この再溶解−凝固操作を計3回
行った後、得られた凝固物を40℃で48時間真空乾燥
し、目的とする共重合体A−2を得た。
Preparation Example 2 of Copolymer (A) After replacing the flask equipped with a dry ice / methanol reflux vessel with nitrogen, 0.5 g of 2,2'-azobisdimethylvaleronitrile as a polymerization initiator and an organic solvent were used. Then, 54.3 g of ethyl lactate was charged and stirred until the polymerization initiator was dissolved. Subsequently, 4.5 g of methacrylic acid, 9.0 g of dicyclopentanyl methacrylate, 20.4 g of methyl methacrylate, and 1 of n-butyl acrylate.
After charging 1.3 g, gentle stirring was started. Then, the temperature of the solution was raised to 80 ° C., and polymerization was carried out at this temperature for 4 hours. Then, the reaction product was dropped into a large amount of hexane to solidify the reaction product. Further, the coagulated product was redissolved in tetrahydrofuran of the same weight and coagulated again with a large amount of hexane. This redissolution-coagulation operation was performed three times in total, and the obtained coagulated product was vacuum dried at 40 ° C. for 48 hours to obtain the target copolymer A-2.

【0014】共重合体(A)の調製例3 ドライアイス/メタノール還流器の付いたフラスコを窒
素置換した後、重合開始剤として2,2‘−アゾビスイ
ソブチロニトリルを1.3g、有機溶剤として乳酸エチ
ルを53.8gを仕込み、重合開始剤が溶解するまで攪
拌した。引き続いて、メタクリル酸6.7g、イソボル
ニルメタクリレート15.7g、スチレン9.0g、お
よびn−ブチルアクリレート13.5gを仕込んだ後、
緩やかに攪拌を始めた。その後、溶液の温度を80℃に
上昇させ、この温度で4時間重合を行った。その後、反
応生成物を多量のヘキサンに滴下して反応生成物を凝固
させた。さらに、この凝固物と同重量のテトラヒドロフ
ランに再溶解し、多量のヘキサンで再度凝固させた。こ
の再溶解−凝固操作を計3回行った後、得られた凝固物
を40℃で48時間真空乾燥し、目的とする共重合体A
−3を得た。
Preparation Example 3 of Copolymer (A) After a flask equipped with a dry ice / methanol reflux was replaced with nitrogen, 1.3 g of 2,2'-azobisisobutyronitrile was used as a polymerization initiator. 53.8 g of ethyl lactate was charged as a solvent, and the mixture was stirred until the polymerization initiator was dissolved. Subsequently, 6.7 g of methacrylic acid and isobol
Nyl methacrylate 15.7 g, styrene 9.0 g,
And after charging 13.5 g of n-butyl acrylate ,
The stirring was started gently. Then, the temperature of the solution was raised to 80 ° C., and polymerization was carried out at this temperature for 4 hours. Then, the reaction product was dropped into a large amount of hexane to solidify the reaction product. Further, the coagulated product was redissolved in tetrahydrofuran of the same weight and coagulated again with a large amount of hexane. This re-dissolution-coagulation operation was performed three times in total, and the obtained coagulated product was vacuum dried at 40 ° C. for 48 hours to obtain the target copolymer A.
-3 was obtained.

【0015】放射線硬化性ドライフィルムJ−1の調製 上述した共重合体A−1 32.0重量部に対し、重合
反応性多官能アクリレート(東亞合成社製、M810
0)を10.0重量部、トリメチロールプロパントリア
クリレートを6.5重量部、放射線ラジカル重合開始剤
であるIrgcure.369(チバスペシャリティ・
ケミカルズ社製)を3.0重量部、乳酸エチルを48.
5重量部添加、混合し、均一な溶液を得た。続いて、本
溶液をポリエチレンテレフタレートフィルム(膜厚:5
0μm)上にスピンコートにて塗布した後、100℃で
15分乾燥することで膜厚55μmの放射線硬化性ドラ
イフィルムJ−1を得た。
Preparation of radiation curable dry film J-1 Polymerization reactive polyfunctional acrylate (manufactured by Toagosei Co., Ltd., M810) was added to 32.0 parts by weight of the above-mentioned copolymer A-1.
0), 10.0 parts by weight, trimethylolpropane triacrylate, 6.5 parts by weight, and Irgcure. 369 (Ciba Specialty
Chemicals Co., Ltd.) 3.0 parts by weight, ethyl lactate 48.
5 parts by weight were added and mixed to obtain a uniform solution. Then, this solution was added to a polyethylene terephthalate film (film thickness: 5
(0 μm) by spin coating and then dried at 100 ° C. for 15 minutes to obtain a radiation curable dry film J-1 having a film thickness of 55 μm.

【0016】放射線硬化性ドライフィルムJ−2の調製 上述した共重合体A−2 27.7重量部に対し、重合
反応性ある多官能アクリレート(東亞合成社製、M81
00)を16.6重量部、トリメチロールプロパントリ
アクリレートを11.1重量部、放射線ラジカル重合開
始剤であるIrgcure.369(チバスペシャリテ
ィ・ケミカルズ社製)を3.0重量部、乳酸エチルを4
1.6重量部添加・混合し、均一な溶液を得た。続い
て、本溶液をポリエチレンテレフタレートフィルム(膜
厚:50μm)上にスピンコートにて塗布した後、10
0℃で15分乾燥することで膜厚55μmの放射線硬化
性ドライフィルムJ−2を得た。
Preparation of Radiation-Curable Dry Film J- 2 Based on 27.7 parts by weight of the above-mentioned copolymer A-2, a polyfunctional acrylate having polymerization reactivity (M81 manufactured by Toagosei Co., Ltd.).
00) in 16.6 parts by weight, trimethylolpropane triacrylate in 11.1 parts by weight, and Irgcure. 369 (manufactured by Ciba Specialty Chemicals) 3.0 parts by weight, ethyl lactate 4 parts
1.6 parts by weight were added and mixed to obtain a uniform solution. Subsequently, this solution was applied onto a polyethylene terephthalate film (film thickness: 50 μm) by spin coating, and then 10
A radiation-curable dry film J-2 having a film thickness of 55 μm was obtained by drying at 0 ° C. for 15 minutes.

【0017】[実施例1] (1)光導波路の形成 下部クラッド層の形成 放射線硬化性ドライフィルムJ−2をシリコン基板の表
面上に常圧熱ロール圧着法(温度:80℃)にて転写
し、ホットプレートを用いて120℃、10分間の条件
でプリベークした。次いで、放射線硬化性ドライフィル
ムJ−2からなる塗膜に、波長365nm、照度200
mW/cm2の紫外線を5秒間照射して、放射線硬化さ
せた。そして、この硬化膜を200℃、1時間の条件で
ポストベークをすることにより、厚さ50μmの下部ク
ラッド層とした。このようにして形成した下部クラッド
層の屈折率(測定波長824nm)を測定したところ、
1.50であった。
Example 1 (1) Formation of Optical Waveguide Formation of Lower Clad Layer The radiation-curable dry film J-2 was transferred onto the surface of a silicon substrate by a normal pressure heat roll pressure bonding method (temperature: 80 ° C.). Then, prebaking was performed using a hot plate under the conditions of 120 ° C. and 10 minutes. Then, a coating film made of the radiation-curable dry film J-2 was coated with a wavelength of 365 nm and an illuminance of 200
It was irradiated with an ultraviolet ray of mW / cm 2 for 5 seconds to be radiation-cured. Then, this cured film was post-baked under the condition of 200 ° C. for 1 hour to form a lower clad layer having a thickness of 50 μm. When the refractive index (measurement wavelength: 824 nm) of the lower clad layer thus formed was measured,
It was 1.50.

【0018】コア部分の形成 次に、放射線硬化性ドライフィルムJ−1を下部クラッ
ド層の上に常圧熱ロール圧着法(温度:80℃)にて転
写し、ホットプレートを用いて120℃、10分の条件
でプレベークした。その後、放射線硬化性ドライフィル
ムJ−1からなる厚さ50μmの塗膜に、幅50μmの
ライン状パターンを有するフォトマスクを介して、波長
365nm、照度200mW/cm2の紫外線を5秒間
照射して、塗膜を放射線硬化させた。次に、放射線照射
した塗膜を100℃、1分間の条件でPEBを行った。
次いで、放射線硬化させた塗膜を有する基板を1.8%
テトラメチルアンモニウムヒドロキシド水溶液(TMA
H)からなる現像液中に浸漬して、塗膜の未露光部を溶
解させた。その後、200℃、1時間の条件でポストベ
ークを行い、幅50μmのライン状パターンを有するコ
ア部分を形成した。また、このコア部分の屈折率(測定
波長824nm)を測定したところ1.52であった。
なお、この段階(ライン幅約50μm)の矩形状のコア
部分が、精度良く形成されていることであった。
Formation of core part Next, the radiation curable dry film J-1 was transferred onto the lower clad layer by the atmospheric pressure heat roll pressure bonding method (temperature: 80 ° C.) and 120 ° C. using a hot plate. It was prebaked under the condition of 10 minutes. Thereafter, the coating film having a thickness of 50 μm made of the radiation curable dry film J-1 was irradiated with ultraviolet rays having a wavelength of 365 nm and an illuminance of 200 mW / cm 2 for 5 seconds through a photomask having a line pattern having a width of 50 μm, The coating was radiation cured. Next, PEB was performed on the irradiated coating film at 100 ° C. for 1 minute.
Then, 1.8% of the substrate having the radiation-cured coating film
Tetramethylammonium hydroxide aqueous solution (TMA
The unexposed portion of the coating film was dissolved by immersing it in a developing solution containing H). Then, post-baking was performed under the condition of 200 ° C. for 1 hour to form a core portion having a line-shaped pattern with a width of 50 μm. Further, the refractive index (measuring wavelength 824 nm) of this core portion was measured and found to be 1.52.
It was to be noted that the rectangular core portion at this stage (line width of about 50 μm) was accurately formed.

【0019】上部クラッド層の形成 次いで、コア部分を有する下部クラッド層の上面に、ド
ライフィルム作製前(スピンコート前)のJ−2溶液を
スピンコータで塗布し、ホットプレートを用いて120
℃、10分の条件でプリベークした。その後、J−2か
らなる塗膜に、波長365nm、照度200mW/cm
2の紫外線を5秒間照射することにより、厚さ50μm
の上部クラッド層を形成した。その後、この上部クラッ
ド層を、200℃、6時間の条件でポストベークした。
形成された上部クラッド層の屈折率(測定波長824n
m)を測定したところ1.50であった。得られた光導
波路は図1に示す構造であった。 結果 上記の方法において、コア高さ、コア幅ともに50±5
μmの形状が形成された。また、得られた光導波路につ
いて、波長824nmの光を一端から入射させた。そし
て、他端から出射する光量を測定することにより、単位
長さ当たりの導波路損失をカットバック法により求めた
ところ0.3であった。
Formation of Upper Clad Layer Next, the J-2 solution before dry film preparation (before spin coating) is applied on the upper surface of the lower clad layer having a core portion by a spin coater, and 120 is applied using a hot plate.
Prebaking was carried out under the conditions of 10 ° C. and 10 minutes. Then, a coating film made of J-2 has a wavelength of 365 nm and an illuminance of 200 mW / cm.
50 μm thick by irradiating with 2 ultraviolet rays for 5 seconds
The upper clad layer of was formed. Then, the upper clad layer was post-baked at 200 ° C. for 6 hours.
Refractive index of the formed upper clad layer (measurement wavelength 824n
When m) was measured, it was 1.50. The obtained optical waveguide had the structure shown in FIG. Results In the above method, both core height and core width are 50 ± 5
A μm shape was formed. In addition, light having a wavelength of 824 nm was made incident from one end of the obtained optical waveguide. Then, the waveguide loss per unit length was measured by the cutback method by measuring the amount of light emitted from the other end, and it was 0.3.

【0020】[0020]

【発明の効果】本発明の光導波路の製造方法によれば、
光素子間を効率よく接続でき、光導波路を損傷する恐れ
もなく、複雑な光導波路パターンであっても容易に形成
することができる。
According to the method of manufacturing an optical waveguide of the present invention,
The optical elements can be efficiently connected, there is no fear of damaging the optical waveguide, and even a complicated optical waveguide pattern can be easily formed.

【0021】[0021]

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1で得られた光導波路の断面図を示す。FIG. 1 shows a sectional view of an optical waveguide obtained in Example 1.

フロントページの続き (72)発明者 宇高 友広 東京都中央区築地二丁目11番24号 ジェイ エスアール株式会社内 Fターム(参考) 2H047 KA04 PA01 PA02 PA15 PA22 PA24 PA28 QA05 TA42 TA43 TA44 Continued front page    (72) Inventor Tomohiro Utaka             2-11-21 Tsukiji, Chuo-ku, Tokyo J             Within SRL Co., Ltd. F term (reference) 2H047 KA04 PA01 PA02 PA15 PA22                       PA24 PA28 QA05 TA42 TA43                       TA44

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 下部クラッド層、コア部分および上部
クラッド層からなる光導波路であって、下部クラッド層
およびコア部分の少なくとも1つをドライフィルムを用
いて形成することを特徴とする光導波路の形成方法。
1. An optical waveguide comprising a lower clad layer, a core part and an upper clad layer, wherein at least one of the lower clad layer and the core part is formed by using a dry film. Method.
【請求項2】 上部クラッド層を放射線硬化性樹脂また
は熱硬化性樹脂ならびに有機溶剤からなる塗布液を塗布
し、硬化することを特徴とする請求項1記載の光導波路
の製造方法。
2. The method of manufacturing an optical waveguide according to claim 1, wherein the upper clad layer is coated with a coating liquid containing a radiation curable resin or a thermosetting resin and an organic solvent and cured.
【請求項3】 ドライフィルムが放射線硬化性樹脂から
なることを特徴とする請求項1記載の光導波路の製造方
法。
3. The method of manufacturing an optical waveguide according to claim 1, wherein the dry film is made of a radiation curable resin.
JP2001394902A 2001-12-26 2001-12-26 Method for forming optical waveguide Expired - Fee Related JP4186462B2 (en)

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