JP2003096425A - Adhesive composition for fixing optical part - Google Patents
Adhesive composition for fixing optical partInfo
- Publication number
- JP2003096425A JP2003096425A JP2001288340A JP2001288340A JP2003096425A JP 2003096425 A JP2003096425 A JP 2003096425A JP 2001288340 A JP2001288340 A JP 2001288340A JP 2001288340 A JP2001288340 A JP 2001288340A JP 2003096425 A JP2003096425 A JP 2003096425A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing
- adhesive composition
- initiator
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Optical Couplings Of Light Guides (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、光ファイバーその
他の光学部品を組み立ての際に接着、またはシールする
ための光学部品固定用接着剤組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition for fixing optical parts for adhering or sealing optical fibers and other optical parts during assembly.
【０００２】[0002]
【従来の技術】光学部品の組立では、光軸や、焦点距離
等の固定位置合わせが非常に重要であり、その調整に時
間を要するため、光硬化性樹脂を用いた短時間での接着
が求められている。光によるラジカル反応で硬化するア
クリレート系の光硬化性樹脂が広く知られているが、酸
素による表面硬化性の阻害、揮発成分の多さ、硬化収縮
等の弱点を含んでおり、特に光学部品の組立において
は、揮発成分による光学部品の入出射端面（例えばレン
ズ）の汚れや、硬化収縮による光軸のずれが問題とな
る。その為、これらの問題を含まない、エポキシ系の光
硬化性樹脂がこの用途には適している。ところが光学部
品の接着箇所は、その複雑な形状と、固定位置合わせ治
具の為に、光照射に対して影になる部分が生じやすい。
光硬化性樹脂は、光が当たらない所は硬化しないという
当たり前の弱みを持つ。2. Description of the Related Art In the assembly of optical parts, fixed positioning such as optical axis and focal length is very important, and it takes time to adjust them. It has been demanded. Acrylate-based photo-curable resins that cure by radical reaction by light are widely known, but they contain weaknesses such as inhibition of surface curability by oxygen, a large amount of volatile components, and curing shrinkage. In assembly, there are problems such as contamination of the input / output end faces (for example, lenses) of the optical component due to volatile components, and deviation of the optical axis due to curing shrinkage. Therefore, an epoxy-based photocurable resin that does not have these problems is suitable for this application. However, due to the complicated shape and the fixed positioning jig, the bonded portion of the optical component is likely to have a portion that is shaded by light irradiation.
The photo-curable resin has a natural weakness that it does not cure when it is not exposed to light.
【０００３】光が直接当たらない箇所を硬化させる方法
として、以下に例示する技術が一般に知られている。例
えば、（１）エポキシ系の光硬化性樹脂を用いて光が直
接当たらない箇所を硬化させる方法として、光カチオン
硬化開始剤と熱カチオン硬化開始剤を併用する方法が知
られている。（特開平９−１７６６０６）（２）特開平
7-118369では、注入前の樹脂に光を照射した後、光の当
たらない注型部に注入することが知られている。The following techniques are generally known as a method for curing a portion which is not directly exposed to light. For example, (1) a method of using a photocationic curing initiator and a thermocationic curing initiator in combination is known as a method of curing a portion not directly exposed to light by using an epoxy-based photocurable resin. (JP-A-9-176606) (2) JP-A-9-176606
7-118369, it is known to irradiate the resin before injection with light and then inject it into a casting part that is not exposed to light.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記
（１）は熱硬化を併用することにより光硬化だけで得ら
れる不十分な物性を向上させるものであり、影部を硬化
させるに充分な熱硬化性を有しているとは言い難い。上
記（２）については、硬化が、多少の誘導期間があった
としても、光照射時から始まるので可使時間には自ずと
限界があり、光学部品組み立てのように被着体の位置合
わせに比較的長時間を要する場合には、上記方法は適用
できない。開始剤の活性を抑え、可使時間を長くするこ
とは可能だが、光硬化の利点である速硬化性は失われ
る。However, the above-mentioned (1) is intended to improve insufficient physical properties obtained only by photo-curing by using heat-curing together. It is hard to say that it has sex. With regard to (2) above, even if there is some induction period, the curing starts from the time of light irradiation, so the pot life naturally has a limit, and it is compared with the alignment of the adherend like optical component assembly. If a long time is required, the above method cannot be applied. Although it is possible to suppress the activity of the initiator and prolong the pot life, the fast curing property, which is an advantage of photocuring, is lost.
【０００５】本発明の目的は、光による速硬化性と、光
が直接当たらない影部をも熱硬化させるに充分な熱硬化
性を併せ持つ、エポキシ樹脂の光学部品固定用接着剤組
成物を提供することである。It is an object of the present invention to provide an epoxy resin adhesive composition for fixing optical parts, which has both fast curing property by light and thermosetting property sufficient for thermosetting even shadow areas not directly exposed to light. It is to be.
【０００６】[0006]
【課題を解決するための手段】本発明者は、エポキシ樹
脂について詳しく検討した結果、特定の光硬化開始剤及
び熱硬化開始剤を含有させることによりエポキシ樹脂組
成物が光による速硬化性と熱硬化性を併せ持つことを見
出し本発明に至った。Means for Solving the Problems As a result of a detailed study of epoxy resins, the present inventor has found that the epoxy resin composition contains a specific photo-curing initiator and a thermo-curing initiator so that the epoxy resin composition can be rapidly cured by light and heat. The inventors have found that they also have curability and have reached the present invention.
【０００７】即ち本発明は、エポキシ樹脂、光硬化開始
剤及び熱硬化開始剤を含む光学部品固定用接着剤組成物
において、前記光硬化開始剤および前記熱硬化開始剤が
ともにSbF6-を対アニオンとするスルホニウム塩類であ
ることを特徴とする光学部品固定用接着剤組成物であ
る。That is, the present invention provides an adhesive composition for fixing an optical component, which comprises an epoxy resin, a photo-curing initiator and a thermo-curing initiator, wherein the photo-curing initiator and the thermo-curing initiator both contain SbF 6- . An adhesive composition for fixing an optical component, which is a sulfonium salt as an anion.
【０００８】代表的エポキシ樹脂として、ビスフェノー
ルA型エポキシ樹脂、ブロモ化ビスフェノールＡ型エポ
キシ樹脂、水素化ビスフェノールＡ型エポキシ樹脂、水
添型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、
フェノールノボラック型エポキシ樹脂、オルソクレゾー
ルノボラック型エポキシ樹脂、脂環式エポキシ樹脂等が
知られている。これらのエポキシ樹脂は何れも本発明に
使用することが出来る。これらの中でエポキシ樹脂とし
て、官能基数が２の脂環式エポキシ樹脂がエポキシ樹脂
全体に対して25〜95重量％であり、且つ、官能基数が少
なくとも３の脂環式エポキシ樹脂がエポキシ樹脂全体に
対して５〜50重量％であるものが、硬化速度を大きくす
るので、好ましく用いられる。エポキシ樹脂は上記官能
基数２の脂環式エポキシ樹脂および上記官能基数３以上
の脂環式エポキシ樹脂のみから構成されていてもよい
が、その他にビスフェノールＡ型エポキシ樹脂を含有す
ることが、硬化物が脆くなり過ぎるのを防止させるので
好ましい。この場合のビスフェノールＡ型エポキシ樹
脂、官能基数２の脂環式エポキシ樹脂および官能基数３
以上の脂環式エポキシ樹脂の好ましい配合比はそれぞれ
15〜75重量％、20〜80重量％および5〜50重量％であ
る。As typical epoxy resins, bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, hydrogenated type epoxy resin, bisphenol F type epoxy resin,
Phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, alicyclic epoxy resin and the like are known. Any of these epoxy resins can be used in the present invention. Among them, as the epoxy resin, the alicyclic epoxy resin having 2 functional groups is 25 to 95% by weight based on the whole epoxy resin, and the alicyclic epoxy resin having at least 3 functional groups is the whole epoxy resin. With respect to 5 to 50% by weight, the curing rate is increased, so that it is preferably used. The epoxy resin may be composed only of the alicyclic epoxy resin having the above-mentioned 2 functional groups and the alicyclic epoxy resin having the above-mentioned 3 functional groups, but it is preferable that the epoxy resin further contains a bisphenol A type epoxy resin. Is preferred because it prevents the material from becoming too brittle. In this case, bisphenol A type epoxy resin, alicyclic epoxy resin having 2 functional groups and 3 functional groups
The preferred compounding ratio of the above alicyclic epoxy resin is
15-75% by weight, 20-80% by weight and 5-50% by weight.
【０００９】官能基数２の脂環式エポキシ樹脂として
は、例えばシクロヘキセンオキシド骨格をそれぞれ有す
る、ダイセル化学工業社製「セロキサイド２０２１」、
「セロキサイド２０８０シリーズ」および「セロキサイ
ド３０００」等が挙げられる。官能基数３以上の脂環式
エポキシ樹脂は、通常多官能と称されるが、例示すれ
ば、ダイセル化学工業社製「エポリードGTシリーズ」、
同「EHPE３１５０」等が挙げられる。またビスフェノー
ルＡ型エポキシ樹脂を例示すれば「エピコート８２
５」，「エピコート８２７」，「エピコート８２８」
〔油化シェル社製、エポキシ当量（g/eq.)：それぞれ１
７２〜１７８，１８０〜１９０，および１８４〜１９
４〕，「エポトートＹＤ−１２６」，「エポトート１２
７」，「エポトート１２８」〔東都化成社製、エポキシ
当量（g/eq.)：それぞれ１７５〜１９０，１８０〜１９
０，および１８４〜１９４〕，「ＲＥ−３１０Ｓ」，
「ＲＥ−４１０Ｓ」〔日本化薬社製、エポキシ当量（g/
eq.)：それぞれ１８０〜１９０および１７５〜１８
５〕、「エピクロン８４０」，「エピクロン８５０」
〔大日本インキ化学工業社製、エポキシ当量（g/eq.)：
それぞれ１８０〜１９０および１８４〜１９４〕、「ア
デカレジンＥＰ−４１００」，「アデカレジンＥＰ−４
３００」〔旭電化工業社製、エポキシ当量（g/eq.)：そ
れぞれ１８０〜２００および１８０〜２００〕、「Ｄ.
Ｅ.Ｒ.３３０」，「Ｄ.Ｅ.Ｒ.３３１Ｃ」〔ダウ・ケミ
カル日本社製、エポキシ当量（g/eq.)：それぞれ１７６
〜１８５および１８６〜１９０〕等が挙げられる。The alicyclic epoxy resin having 2 functional groups includes, for example, "Ceroxide 2021" manufactured by Daicel Chemical Industries, Ltd., each of which has a cyclohexene oxide skeleton.
Examples include "Celoxide 2080 series" and "Celoxide 3000". An alicyclic epoxy resin having 3 or more functional groups is usually called polyfunctional, but, for example, "Eporide GT series" manufactured by Daicel Chemical Industries,
The “EHPE3150” and the like can be mentioned. If a bisphenol A type epoxy resin is used as an example, "Epicoat 82
5 "," Epicote 827 "," Epicote 828 "
[Epoxy equivalent (g / eq.) Manufactured by Yuka Shell Co., Ltd .: 1 each
72-178, 180-190, and 184-19
4], "Epotote YD-126", "Epotote 12
7 "," Epototo 128 "[manufactured by Tohto Kasei Co., epoxy equivalent (g / eq.): 175 to 190, 180 to 19 respectively.
0, and 184-194], "RE-310S",
"RE-410S" [Nippon Kayaku Co., Ltd., epoxy equivalent (g /
eq.): 180 to 190 and 175 to 18 respectively
5], "Epiclon 840", "Epiclon 850"
(Dainippon Ink and Chemicals, epoxy equivalent (g / eq.):
180-190 and 184-194], respectively, "Adeka Resin EP-4100", "Adeka Resin EP-4".
300 "[Asahi Denka Kogyo KK, epoxy equivalent (g / eq.): 180 to 200 and 180 to 200, respectively]," D.
E.R. 330 "," D.E.R. 331C "[manufactured by Dow Chemical Japan, epoxy equivalent (g / eq.): 176 each
~ 185 and 186-190] and the like.
【００１０】一般にエポキシ樹脂用の光硬化開始剤は、
光のエネルギーでルイス酸もしくはブレンステッド酸を
発生させる化合物であり、芳香族ジアゾニウム塩、ジフ
ェニルヨードニウム塩及びその誘導体のような芳香族ヨ
ードニウム塩類、トリフェニルスルホニウム塩及びその
誘導体のような芳香族スルホニウム塩類、芳香族ホスホ
ニウム塩、等が挙げられる。これらの中で、本発明にお
いては、SbF6-を対アニオンとする芳香族スルホニウム
塩類が使用される。本発明の目的である、光による速硬
化性を有するためには、10Ｊ／cm2程度の光エネルギー
で硬化させる活性が必要であり、SbF6-を対アニオンと
するトリアリールスルホニウム塩が好適に用いられる。
SbF6-を対アニオンとするトリアリールスルホニウム塩
類からなる光硬化開始剤として、例えばトリフェニルス
ルホニウムヘキサフルオロアンチモネート、（４−フェ
ニルチオフェニル）ジフェニルスルホニウムヘキサフル
オロアンチモネート、ビス[４−（ジフェニルスルホニ
オ）フェニル]スルフィド−ビス−ヘキサフルオロアン
チモネート、（４−メトキシフェニル）ジフェニルスル
ホニウムヘキサフルオロアンチモネート等を挙げること
ができる。該光開始硬化剤の含有量はエポキシ樹脂に対
し0.5〜10重量％が好ましい。また、光の吸収効率を上
げる為に、本発明の効果を喪失しない範囲で増感剤を使
用することが可能である。Generally, the photo-curing initiator for epoxy resin is
A compound that generates a Lewis acid or Bronsted acid by the energy of light, and is an aromatic iazonium salt such as an aromatic diazonium salt, a diphenyliodonium salt and a derivative thereof, or an aromatic sulfonium salt such as a triphenylsulfonium salt and a derivative thereof. , Aromatic phosphonium salts, and the like. Among these, aromatic sulfonium salts having SbF 6 − as a counter anion are used in the present invention. In order to have a fast curing property by light, which is an object of the present invention, an activity of curing with light energy of about 10 J / cm 2 is required, and a triarylsulfonium salt having SbF 6- as a counter anion is suitable. Used.
Examples of the photocuring initiator comprising a triarylsulfonium salt having SbF 6- as a counter anion include triphenylsulfonium hexafluoroantimonate, (4-phenylthiophenyl) diphenylsulfonium hexafluoroantimonate, and bis [4- (diphenylsulfonium). Examples thereof include nio) phenyl] sulfide-bis-hexafluoroantimonate and (4-methoxyphenyl) diphenylsulfonium hexafluoroantimonate. The content of the photo-initiated curing agent is preferably 0.5 to 10% by weight based on the epoxy resin. Further, in order to increase the light absorption efficiency, it is possible to use a sensitizer within the range where the effect of the present invention is not lost.
【００１１】一般にエポキシ樹脂を熱硬化させる方法は
種々あり、硬化様式によって分類すると、酸無水物を用
いるもの、アミン化合物を用いるもの、イミダゾール類
を用いるもの、等が一般的であるが、これらの硬化系は
全て塩基性物質を含む。本発明に用いられる光硬化開始
剤は、カチオンを発生させるものであるから、上記熱硬
化方法に用いられる量の塩基性物質と混合して使用する
ことは出来ない。本発明に用いられる熱硬化開始剤は、
加熱によってルイス酸もしくはブレンステッド酸を発生
させる化合物であり、SbF6-を対アニオンとするスルホ
ニウム塩類が使用される。この熱硬化開始剤として、硫
黄原子に結合する３つの置換基のうち少なくとも１つが
アルキル基であるスルホニウム塩が好ましく用いられ
る。熱硬化開始剤として日本曹達製「CI2624」、日本曹
達製「CI2946」、旭電化工業製「CP66」を例示すること
ができる。該熱開始硬化剤の含有量はエポキシ樹脂に対
し0.5〜10重量％が好ましい。Generally, there are various methods for thermally curing an epoxy resin, and when classified according to the curing mode, the ones using an acid anhydride, the ones using an amine compound, the ones using an imidazole, etc. are generally used. All curing systems contain basic substances. Since the photo-curing initiator used in the present invention generates a cation, it cannot be used as a mixture with the basic substance in an amount used in the above-mentioned thermosetting method. The thermosetting initiator used in the present invention is
It is a compound that generates a Lewis acid or Bronsted acid by heating, and a sulfonium salt having SbF 6- as a counter anion is used. As the thermosetting initiator, a sulfonium salt in which at least one of the three substituents bonded to the sulfur atom is an alkyl group is preferably used. Examples of the thermosetting initiator include "CI2624" manufactured by Nippon Soda, "CI2946" manufactured by Nippon Soda, and "CP66" manufactured by Asahi Denka Kogyo. The content of the thermal initiation curing agent is preferably 0.5 to 10% by weight based on the epoxy resin.
【００１２】エポキシ樹脂に無機充填剤その他の充填剤
を添加することができる。無機充填剤の例としては、ア
ルミナ、タルク、ガラス粉末、セラミック粉末、結晶性
シリカ、溶融シリカ等が挙げられる。また、充填剤の含
有量は、エポキシ樹脂１００重量部に対して、５〜１０
０重量部配合することが適当である。Inorganic fillers and other fillers can be added to the epoxy resin. Examples of the inorganic filler include alumina, talc, glass powder, ceramic powder, crystalline silica, fused silica and the like. Further, the content of the filler is 5 to 10 with respect to 100 parts by weight of the epoxy resin.
It is suitable to add 0 part by weight.
【００１３】[0013]
【発明の実施の形態】［実施例１，２、比較例１〜３］
発明の詳細を実施例に基づいて説明する。なお、これは
例示であり、本発明はこれに限定されるものではない。BEST MODE FOR CARRYING OUT THE INVENTION [Examples 1 and 2, Comparative Examples 1 to 3]
The details of the invention will be described based on examples. Note that this is an example, and the present invention is not limited to this.
【００１４】表１に実施例１，２及び比較例１〜３で用
いた接着剤組成物の配合を示す。以下断りのない限り数
量は重量部を表す。光硬化性の評価は、表に示す組成の
樹脂を厚さ２ｍｍのガラス板２枚の間に、隙間0.1mmで
挟み、70mW／cm2の高圧水銀灯の光を照射して行った。
照射時間30秒以内で硬化したものを○、30秒を超え60秒
以内で硬化したものを△、60秒で硬化しなかったものを
×とした。熱硬化性の評価は、表に示す組成の樹脂を10
0℃に加熱したガラス板上で硬化させて行った。６０秒
以内でゲル化したものを○、６０秒を超え１２０秒以内
でゲル化したものを△、１２０秒でゲル化しなかったも
のを×とした。また厚さ２ｍｍで１５ｍｍ巾、長さ３０
ｍｍのガラス板２枚を重ね合わせ長さを５ｍｍとして重
ね合わせてその間に、樹脂を隙間0.1mmで挟み、70mW／c
m2の高圧水銀灯の光を６０秒間照射したもの、および上
記と同様に樹脂を挟み、１５０℃の熱風を３０分間吹き
付けたものについて、接着されたガラス板の両端を引張
試験機で接着力（Ｋｇ／ｃｍ 2）を測定した。実施例で
は、光硬化性、熱硬化性共に良好であったが、比較例で
は、光硬化性・接着力（光硬化）および熱硬化性・接着
力（熱硬化）の何れか一方もしくは両方が不充分であっ
た。Used in Examples 1 and 2 and Comparative Examples 1 to 3 in Table 1.
2 shows the formulation of the adhesive composition that was used. Numbers unless otherwise noted
The quantities represent parts by weight. The photocurability was evaluated by the composition shown in the table.
There is a 0.1mm gap between two glass plates with a thickness of 2mm.
Sandwich, 70mW / cm2It was performed by irradiating the light of the high pressure mercury lamp.
Cured within 30 seconds of irradiation time ○, over 30 seconds and 60 seconds
Those that have been cured within △, those that have not cured within 60 seconds
It was set to x. For the evaluation of thermosetting property, the resin composition shown in the table
The curing was performed on a glass plate heated to 0 ° C. 60 seconds
Gelled within ○, over 60 seconds and within 120 seconds
What gelled in △ △, did not gel in 120 seconds
Was marked as x. Also, the thickness is 2 mm, the width is 15 mm, and the length is 30.
2 mm glass plates are stacked and the length is 5 mm
Put them together and sandwich the resin between them with a gap of 0.1 mm, 70 mW / c
m2Of high pressure mercury lamp for 60 seconds, and
As in the above, sandwich the resin and blow hot air at 150 ° C for 30 minutes.
About the attached one, pull both ends of the bonded glass plate
Adhesion force (Kg / cm) 2) Was measured. In the example
Was good in both photo-curing property and heat-curing property.
Is photocurable / adhesive (photocurable) and thermosetting / adhesive
Either or both of the forces (heat curing) are insufficient
It was
【００１５】[0015]
【表１】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 実施例 比較例 1 2 1 ２ ３ ─────────────────────────────────エヒ゜コート 8281) 60 30 30 20 94セロキサイト゛ 20212) 30 60 60 70 0 EHPE31503) 10 10 10 10 0 1,6-ヘキサンジオール 0 0 0 0 3リカヒ゛ノール HB4) 0 0 0 0 3 光硬化開始剤 SP172 5) 2 2 0 2 0 SP150 6) 0 0 2 0 3 熱硬化開始剤 CI2624 7) 3 0 2 0 0 CI2946 8) 0 2 0 0 0 CI2920 9) 0 0 0 3 0 CP66 10) 0 0 0 0 1.5 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− 光硬化性 ○ ○ △ △ △ 熱硬化性 ○ ○ △ ○ ○ 接着力（光硬化） 20 25 ５未満 ５未満 ５未満 接着力（熱硬化） 30 25 ５未満 10 10 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ １） 油化シェル製「エヒ゜コート828」； ヒ゛スフェノールA型エホ゜キシ樹脂 ２） タ゛イセル化学工業製「セロキサイト゛2021」； 脂環式エホ゜キシ樹脂（官能基数２） ３） タ゛イセル化学工業製「EHPE3150」； 脂環式エホ゜キシ樹脂（官能基数３以上） ４） 新日本理化製「リカビノールＨＢ」；水素化ビスフェノール ５） 光硬化開始剤 旭電化工業製「SP172」（スルホニウム塩類、対アニオン：SbF6-） ６） 光硬化開始剤 旭電化工業製 「SP150」（スルホニウム塩類、対アニオン：PF6-） ７） 熱硬化開始剤 日本曹達製 「CI2624」（スルホニウム塩類、対アニオン：SbF6-） ８） 熱硬化開始剤 日本曹達製 「CI2946」（スルホニウム塩類、対アニオン：SbF6-） ９） 熱硬化開始剤 日本曹達製 「CI2920」（スルホニウム塩類、対アニオン：PF6-） 10） 熱硬化開始剤 旭電化工業製 「CP66」（スルホニウム塩類、対アニオン：SbF6-）[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Example Comparative Example 1 2 1 2 3 ──── ───────────────────────────── Ekocoat 828 1) 60 30 30 20 94 Celoxite 2021 2) 30 60 60 70 0 EHPE3150 3) 10 10 10 10 0 1,6-hexanediol 0 0 0 0 3 Licabinol HB 4) 0 0 0 0 3 Photocuring initiator SP172 5) 2 2 0 2 0 SP150 6) 0 0 2 0 3 Thermal curing initiator CI2624 7) 3 0 2 0 0 CI2946 8) 0 2 0 0 0 CI2920 9) 0 0 0 3 0 CP66 10) 0 0 0 0 1.5 −−−−−−−−−−−−−−−−−−−− −−−−−−−−−−−−−−− Photocurability ○ ○ △ △ △ Thermosetting ○ ○ △ ○ ○ Adhesive strength (photocuring) 20 25 5 Less than 5 Less than 5 Less than 5 Adhesive strength (thermosetting ) 30 25 Less than 5 10 10 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 1) “Eh 828 "; bisphenol A type epoxy resin 2)" Celoxite 2021 "manufactured by Daicel Chemical Industry; alicyclic epoxy resin (functional group 2) 3)" EHPE3150 "manufactured by Daicel Chemical Industry; alicyclic epoxy resin (functional group 3) 4) New Japan Rika "Rikabinol HB"; hydrogenated bisphenol 5) Photocuring initiator Asahi Denka Kogyo "SP172" (sulfonium salts, counter anion: SbF 6- ) 6) Photocuring initiator Asahi Denka Kogyo "SP150" (sulfonium salts, counter anion: PF 6- ) 7) Thermosetting initiator made by Nippon Soda "CI2624" (sulfonium salts, counter anion: SbF 6- ) 8) Thermosetting initiator made by Nippon Soda "CI2946" ( sulfonium salts, counteranion: SbF 6-) 9) thermally curing initiator manufactured by Nippon Soda Co. "CI2920" (sulfonium salts, the counter anion: PF 6-) 10) thermally curing initiator ADEKA "CP66" (sulfonium salts, counter anion: SbF 6-)
【００１６】[0016]
【発明の効果】本発明のエポキシ樹脂組成物は、光によ
る速硬化性と、光が直接当たらない影部をも熱硬化させ
るに充分な熱硬化性を併せ持つ。それゆえ、光硬化によ
って固着した後、熱硬化を行うことで、光照射において
影部を生じやすい部品の接着もしくはシールをすること
が可能であり、光学部品の組立、例えばガラス製光ファ
イバとガラス製屈折率分布型マイクロレンズとの接合、
受発光素子金属枠へのガラス製屈折率分布型マイクロレ
ンズの接合等において、精密位置固定、作業効率の向上
等を実現するのものである。EFFECT OF THE INVENTION The epoxy resin composition of the present invention has both fast curing property by light and sufficient thermosetting property to thermally cure even a shadow portion which is not directly exposed to light. Therefore, it is possible to bond or seal components that are apt to produce shadows by light irradiation by performing heat curing after fixing by light curing, and assembling optical components such as glass optical fiber and glass. Bonding with refractive index distribution type micro lens,
When a glass graded index microlens is bonded to a metal frame of a light emitting / receiving element, it is possible to achieve precise position fixing and improvement of working efficiency.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H037 DA17 4J040 EC041 EC061 EC071 EC261 HB06 HC14 HD18 HD27 HD40 JB02 JB08 KA12 KA13 LA05 LA06 MB02 NA17 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 2H037 DA17 4J040 EC041 EC061 EC071 EC261 HB06 HC14 HD18 HD27 HD40 JB02 JB08 KA12 KA13 LA05 LA06 MB02 NA17
Claims (4)
開始剤を含む光学部品固定用接着剤組成物において、前
記光硬化開始剤および前記熱硬化開始剤がともにSbF6-
を対アニオンとするスルホニウム塩類であることを特徴
とする光学部品固定用接着剤組成物。1. An adhesive composition for fixing an optical component, comprising an epoxy resin, a photocuring initiator and a thermosetting initiator, wherein both the photocuring initiator and the thermosetting initiator are SbF 6-
An adhesive composition for fixing an optical component, which is a sulfonium salt having a counter anion.
剤が前記エポキシ樹脂に対してそれぞれ0.5〜10重量％
および0.5〜10重量％含有される請求項１記載の光学部
品固定用接着剤組成物。2. The photo-curing initiator and the heat-curing initiator are each 0.5 to 10% by weight based on the epoxy resin.
And 0.5 to 10% by weight of the adhesive composition for fixing optical parts according to claim 1.
エポキシ樹脂および官能基数が少なくとも３の脂環式エ
ポキシ樹脂をそれぞれ25〜95重量％および5〜50重量％
含有する請求項１または２に記載の光学部品固定用接着
剤組成物。3. The alicyclic epoxy resin having a functionality of 2 and the alicyclic epoxy resin having a functionality of at least 3 are 25 to 95% by weight and 5 to 50% by weight, respectively.
The adhesive composition for fixing an optical component according to claim 1, which contains the adhesive composition.
エポキシ樹脂、官能基数が２の脂環式エポキシ樹脂およ
び官能基数が少なくとも３の脂環式エポキシ樹脂をそれ
ぞれ15〜75重量％、20〜80重量％および5〜50重量％含
有する請求項１または２に記載の光学部品固定用接着剤
組成物。4. The epoxy resin is a bisphenol A type epoxy resin, an alicyclic epoxy resin having 2 functional groups and an alicyclic epoxy resin having at least 3 functional groups are 15 to 75% by weight and 20 to 80% by weight, respectively. And 5 to 50% by weight of the adhesive composition for fixing an optical component according to claim 1 or 2.
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|---|---|---|---|
| JP2001288340A JP2003096425A (en) | 2001-09-21 | 2001-09-21 | Adhesive composition for fixing optical part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001288340A JP2003096425A (en) | 2001-09-21 | 2001-09-21 | Adhesive composition for fixing optical part |
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| Publication Number | Publication Date |
|---|---|
| JP2003096425A true JP2003096425A (en) | 2003-04-03 |
Family
ID=19111007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001288340A Pending JP2003096425A (en) | 2001-09-21 | 2001-09-21 | Adhesive composition for fixing optical part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003096425A (en) |
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