JP2003087076A - Chip-like lc composite component and circuit using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip-like LC composite component for electrically combining respective output signals of a plurality of filters into an output by connecting, to respective output ports of a plurality of band-pass filters and rotating phases, so that the phases of the plurality of filters can be recognized as an open characteristic each other. SOLUTION: Input terminal electrodes 32, 33 and an output terminal electrode 34 are formed on an end surface of a laminate 23 formed by laminating a plurality of dielectric layers 22. Various conductive patterns 38-48 for providing inductors or capacitors are formed inside the laminate. A plurality of inductor patterns 39-42 are arrayed of their being on one plane while independent of each other not to be mutually connected before an end 25 of the laminate 23, and connection electrodes 36, 37 and another conductive pattern 45 are used to connect the patterns 39-42 to an output terminal electrode 34.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped LC composite component and a circuit using the same, and particularly,
A chip-shaped LC composite component which is electrically connected to each output port of a plurality of bandpass filters and electrically combines the output signals of these bandpass filters into one output, and the same It is about circuits.

[0002]

2. Description of the Related Art In the field of mobile communication equipment such as mobile phones, for example, DCS (Digital) is used.
Cellular System: 1800MHz band)
Signals and PCS (Personal Communications)
(Tion Services: 1900 MHz band) signal and two signals in frequency bands relatively close to each other are received, so that two surface acoustic waves close to each other in the pass frequency band as shown in FIG. 17 are received. Filter 1
A dual surface acoustic wave filter 3 in which and 2 are combined as one chip is used.

The DCS signal is input to either one of the input ports 4 and 5 of the dual surface acoustic wave filter 3,
The PCS signal is input to the other one, and the signals filtered by the dual surface acoustic wave filter 3 are output from the output ports 6 and 7, respectively.

Most of the small filters used in the high frequency range, such as the surface acoustic wave filters 1 and 2 described above,
The phase in the attenuation frequency range is in the range of 90 degrees to 270 degrees on the Smith chart. This indicates that the impedance in the attenuation frequency range is in the short mode. In this mode filter, when two filters having different pass frequency ranges are connected in parallel, the pass frequency range of one filter becomes the attenuation frequency range of the other filter, and the filter in this attenuation frequency range becomes the short mode. Therefore, it attenuates the signal that should be passed.

In order to avoid the above problems, as shown in FIG. 17, the output port 6 of the dual surface acoustic wave filter 3 is used.
A high-frequency switch 8 is connected to and 7, whereby a signal path is forcibly selected and a target signal is taken out from an output terminal 9 of the high-frequency switch 8.

On the other hand, GSM (Global System)
m for Mobile Communicatio
(n: 800 MHz band) signal and the above-described DCS signal, when the frequency bands are relatively distant from each other, FIG.
The configuration shown in is adopted.

That is, two surface acoustic wave filters 11 are provided.
A GSM signal is input to either one of the input ports 13 and 14 of
The CS signal is input. These signals are filtered by the surface acoustic wave filters 11 and 12, respectively, and output from the respective output ports 15 and 16. The two types of signals output from the output ports 15 and 16 are supplied to the low-pass filter 17 and the high-pass filter 18, respectively.
Through the diplexer 19 configured by the above, the attenuation characteristic of the diplexer 19 is utilized to separate into two signals having different bands, and the signal in the target band is extracted from the output terminal 20 of the diplexer 19.

[0008]

In the configuration shown in FIG. 17, the high-frequency switch 8 is used to forcibly select the signal path. Therefore, even if the frequency bands are close to each other, two signals can be output. Can be properly selected, but the high-frequency switch 8 requires a control power supply, and cannot drive two signal systems at the same time.
There is a problem.

On the other hand, in the configuration shown in FIG. 18, since the diplexer 19 is used, for example, a DCS signal and a PC are used.
When two signals whose frequency bands are close to each other, such as the S signal, are handled, there is a problem that sufficient attenuation and passing characteristics cannot be obtained, and the signals cannot be separated.

A duplexer that has two surface acoustic wave filters and a matching element that combines LC is also proposed, but this is an integral part, and therefore the performance of the surface acoustic wave filter, for example. When the value is inferior, even if the characteristics of the matching element are good, the overall characteristics are inferior and the degree of freedom in design is not so high. For example, even though the surface acoustic wave filter of company A is the best in the first frequency band, while the surface acoustic wave filter of company B is the best in the second frequency band, both
It cannot be built into one component.

In addition, since the quality of the characteristics of the above-described integrated component cannot be determined until it becomes a finished product, if any one of the circuit elements included therein is defective, even if it is other Even if the circuit element of (1) is a non-defective product, it must be discarded as a whole as a result of selection, so that the defective rate becomes high when the product is completed.

Therefore, an object of the present invention is to electrically solve the problems as described above while electrically connecting to the output ports of a plurality of bandpass filters and electrically connecting the output signals of these bandpass filters. It is an object of the present invention to provide a chip-shaped LC composite component and a circuit using the same, which can be synthesized into a single output and can function as a matching element.

[0013]

According to the present invention, the output port of each of a plurality of band pass filters has a phase in the attenuation frequency range in each transmission characteristic in the range of 90 degrees to 270 degrees on the Smith chart. Are electrically connected to each other, and by rotating the phases so that the phase characteristics of the plurality of bandpass filters look like open characteristics, the output signals of the plurality of bandpass filters are electrically combined to form one First directed to a chip-like LC composite part for output.

The chip-shaped LC composite component according to the present invention is
A laminate is provided which is composed of a plurality of laminated dielectric layers and has a main surface extending in the extending direction of the dielectric layers and an end surface extending in the laminating direction of the dielectric layers.

In the first aspect of the present invention, a plurality of input terminal electrodes electrically connected to respective output ports of a plurality of bandpass filters to be connected are provided on the end face of the laminated body, and a plurality of input terminal electrodes are provided. And an output terminal electrode for outputting a combined output signal of the band pass filters.

In the chip-shaped LC composite component according to the first aspect, a low-pass filter is formed in each of the plurality of signal paths provided between the plurality of input terminal electrodes and the plurality of output terminal electrodes. To form a filter, a plurality of inductor conductor patterns for giving a plurality of inductors and a plurality of capacitor conductor patterns for giving a plurality of capacitors are formed inside the laminated body. .

One end of the inductor conductor pattern and a specific capacitor conductor pattern are electrically connected to each input terminal electrode.

The output terminal electrode is electrically connected to the other ends of the plurality of inductor moving body patterns in common, and is different from the capacitor conductor pattern electrically connected to the input terminal electrode. Are electrically connected.

The plurality of inductor conductor patterns as described above are arranged on a specific dielectric layer in a state of being arranged on one plane and independent of each other and not connected to each other up to the end face of the laminate. It is characterized by being.

In order to realize the characteristic structure as described above, preferably, a connection electrode is formed on the end face of the laminate, and a connection electrically connected to the connection electrode is formed inside the laminate. The conductor pattern is formed, and the ends of the plurality of inductor conductor patterns are commonly electrically connected to the output terminal electrode via the connection electrode and the connection conductor pattern.

The above-mentioned connecting conductor pattern may also serve as a capacitor conductor pattern electrically connected to the output terminal electrode.

The input terminal electrode and the output terminal electrode are
It is preferable that the laminates are arranged at positions facing each other.

A ground terminal electrode may be formed on the end surface of the laminated body, and a ground conductor pattern electrically connected to the ground terminal electrode may be arranged inside the laminated body.

The above-mentioned ground terminal electrode is preferably located between the plurality of input terminal electrodes.

The ground conductor pattern may also serve as the capacitor conductor pattern.

In the second aspect of the present invention, a plurality of input terminal electrodes electrically connected to the respective output ports of the plurality of bandpass filters to be connected are provided on the end face of the laminated body, and a plurality of input terminal electrodes are provided. An output terminal electrode for outputting a combined output signal of the band pass filters and a ground terminal electrode are formed.

In the chip-shaped LC composite component according to the second aspect, both the low-pass filter and the high-pass filter are formed in the plurality of signal paths provided between the plurality of input terminal electrodes and the output terminal electrodes. , To configure these lowpass and highpass filters,
A plurality of inductor conductor patterns for providing a plurality of inductors and a plurality of capacitor conductor patterns for providing a plurality of capacitors are formed inside the laminated body.

One end of the first inductor conductor pattern and the first capacitor conductor pattern are electrically connected to the first input terminal electrode.

A second capacitor conductor pattern is electrically connected to the second input terminal electrode.

One end of the second inductor conductor pattern is electrically connected to the ground terminal electrode.

To the output terminal electrode, the other ends of the first and second inductor conductor patterns are commonly electrically connected, and the third capacitor conductor pattern is electrically connected.

The plurality of inductor conductor patterns as described above are arranged on a specific dielectric layer in a state of being aligned on one plane and independent of each other and not connected to the end surface of the laminate. It is characterized by being done.

Also in this second aspect, in order to realize the characteristic structure as described above, the connection electrode is formed on the end face of the laminate, and the connection electrode is electrically connected to the inside of the laminate. A connection conductor pattern to be connected to the output terminal electrode may be commonly connected to the other end of each of the plurality of inductor conductor patterns through the connection electrode and the connection conductor pattern. preferable.

The above-mentioned connecting conductor pattern may also serve as the third capacitor conductor pattern.

The input terminal electrode and the output terminal electrode are
It is preferable that the laminates are arranged at positions facing each other.

The ground terminal electrode is preferably located between the plurality of input terminal electrodes.

Further, a ground conductor pattern electrically connected to the ground terminal electrode may be arranged inside the laminated body.

In the above case, the ground conductor pattern is
You may make it serve also as a capacitor conductor pattern.

In the third aspect of the present invention, a plurality of input terminal electrodes electrically connected to respective output ports of a plurality of bandpass filters to be connected are provided on the end face of the laminated body, and a plurality of input terminal electrodes are provided. An output terminal electrode for outputting a combined output signal of the band pass filters and a ground terminal electrode are formed.

In the chip-shaped LC composite component according to the third aspect, a high pass filter is formed in each of the plurality of signal paths provided between the plurality of input terminal electrodes and the plurality of output terminal electrodes. To form a filter, a plurality of inductor conductor patterns for giving a plurality of inductors and a plurality of capacitor conductor patterns for giving a plurality of capacitors are formed inside the laminated body. .

One end of each of the plurality of first inductor conductor patterns and a specific capacitor conductor pattern are electrically connected to each input terminal electrode.

A capacitor conductor pattern different from the capacitor conductor pattern electrically connected to one end of the second inductor conductor pattern and the input terminal electrode is electrically connected to the output terminal electrode.

The ground terminal electrode has a first and a second
The other end of each inductor conductor pattern is electrically connected.

The plurality of inductor conductor patterns as described above are arranged on a specific dielectric layer in a state of being arranged on one plane and independent of each other, and the laminate is not connected to the end face. It is characterized by being done.

Also in this third aspect, it is preferable that the input terminal electrode and the output terminal electrode are arranged at positions facing each other in the laminated body.

In the third aspect, a plurality of ground terminal electrodes are provided, and the plurality of ground terminal electrodes are electrically connected to the other ends of the plurality of inductor conductor patterns described above. It is preferably connected.

Also in the third aspect, the ground terminal electrode is preferably located between the plurality of input terminal electrodes.

The present invention is also directed to a circuit using the chip-like LC composite component as described above as a matching element for electrically combining the output signals of a plurality of bandpass filters.

That is, in the circuit according to the present invention, a plurality of the chip-shaped LC composite parts as described above and the phases in the attenuation frequency range in each transmission characteristic are in the range of 90 degrees to 270 degrees on the Smith chart. And a plurality of band-pass filters, each of the plurality of input terminal electrodes of the chip-shaped LC composite component, the output circuit of the plurality of band-pass filters are electrically connected, the above-mentioned circuit, preferably, Used in mobile communication equipment.

[0050]

1 is a diagram showing an internal structure of a chip-shaped LC composite component 21 according to a first embodiment of the present invention, and FIG. 2 is a chip-shaped LC composite component 2 shown in FIG.
2 is a perspective view showing the appearance of FIG.

The chip-shaped LC composite component 21 includes a laminated body 23 having a plurality of laminated dielectric layers 22. In FIG. 1, the dielectric layer 2 that constitutes the laminate 23 is shown.
A typical one of the two is illustrated in a plan view, and is illustrated in the order of (1) to (6) according to the stacking order.

The laminated body 23 has a main surface 24 extending in the extending direction of the dielectric layer 22 and an end surface 25 extending in the laminating direction of the dielectric layer 22.

This chip-shaped LC composite component 21 realizes an equivalent circuit as shown in FIG. 3 and has two band pass filters, for example, two surface acoustic wave filters 26 and 27.
Is used as a matching element for electrically combining the output signals of 1) to 1 output.

The surface acoustic wave filter 26 includes the input port 2
8 and an output port 29, on the other hand, the surface acoustic wave filter 27 has an input port 30 and an output port 31.

The end face 25 of the laminate 23 provided in the chip-shaped LC composite component 21 is electrically connected to the output ports 29 and 31 of the two surface acoustic wave filters 26 and 27 to be connected, respectively. Output terminal electrode 3 for outputting a combined output signal of two input terminal electrodes 32 and 33 and two surface acoustic wave filters 26 and 27.
4, a ground terminal electrode 35, and two connecting electrodes 3
6 and 37 are formed.

As shown in FIG. 2, these electrodes 32 to 37 may be formed so as to extend from above the end surface 25 of the laminate 23 to a part of the main surface 24.

Inside the laminated body 23, the two inductors L1 and L2 shown in FIG. 3 and the three capacitors C1, C2 and C3 are formed. The structure of the conductor pattern for providing the inductors L1 and L2, the capacitors C1 to C3, etc. will be described with reference to FIG.

On the dielectric layer 22 shown in FIG. 1 (1),
A shield conductor pattern 38 is formed and electrically connected to the ground terminal electrode 35.

On the dielectric layer 22 shown in FIG. 1B,
Two inductor conductor patterns 39 and 40 for forming a part of each of inductors L1 and L2 shown in FIG. 3 are formed. The inductor conductor patterns 39 and 40 are arranged side by side on one plane and independent of each other, and are not connected to the end surface 25 of the stacked body 23. One end of each of the inductor conductor patterns 39 and 40 is electrically connected to the connecting electrodes 36 and 37, respectively.

On the dielectric layer 22 shown in FIG. 1 (3),
Inductor conductor patterns 41 and 42 for providing the remaining portions of the inductors L1 and L2 shown in FIG. 3 are connected to each other until reaching the end surface 25 of the stacked body 23 while being aligned on one plane and independent from each other. It is placed in a state where it is not. One end of each of the inductor conductor patterns 41 and 42 has an input terminal electrode 32, respectively.
And 33 electrically.

The other end of each of the inductor conductor patterns 39 and 40 shown in FIG.
It is electrically connected to the other end of each of the inductor conductor patterns 41 and 42 shown in FIG. 1C via via hole conductors 43 and 44 which are schematically shown.

On the dielectric layer 22 shown in FIG. 1 (4),
A capacitor / connecting conductor pattern 45 that also serves as a capacitor conductor pattern and a connecting conductor pattern is formed. The capacitor / connecting conductor pattern 45 provides one electrode of the capacitor C3 shown in FIG. Further, the capacitor / connection conductor pattern 45 is electrically connected in common to the output terminal electrode 34 and the connection electrodes 36 and 37.

On the dielectric layer 22 shown in FIG. 1 (5),
Two capacitor conductor patterns 46 and 47 are formed in a state of being arranged on one plane. The capacitor conductor pattern 46 provides one electrode of the capacitor C1 shown in FIG. 3, and is electrically connected to the input terminal electrode 32.
Further, the capacitor conductor pattern 47 provides one electrode of the capacitor C2 shown in FIG. 3 and is electrically connected to the input terminal electrode 33.

On the dielectric layer 22 shown in FIG. 1 (6),
The ground conductor pattern 48 is formed. The ground conductor pattern 48 is electrically connected to the ground terminal electrode 35. The ground conductor pattern 48 is shown in FIG.
The capacitor / connection conductor pattern 45 shown in (4) and the capacitor conductor pattern 46 shown in FIG. 1 (5).
And 47 respectively. Therefore, the ground conductor pattern 48 also serves as a capacitor conductor pattern, and the capacitor C3 is provided by facing the capacitor / connecting conductor pattern 45, and the capacitor C1 is provided by facing the capacitor conductor pattern 46.
By facing the capacitor conductor pattern 47, the capacitor C2 is provided.

The surface acoustic wave filters 26 and 27 shown in FIG. 3 are provided by, for example, a dual surface acoustic wave filter in which they are combined as one chip. 1. Of these surface acoustic wave filters 26 and 27.
A Smith chart of the transmission characteristics in the frequency range of 76 to 2.05 GHz is shown in FIG. FIG. 4 shows the reflection characteristics at S11, that is, the output terminal electrode 34 shown in FIG.

As shown in FIG. 4, the phase in the attenuation frequency range in the transmission characteristic is in the range of 90 degrees to 270 degrees,
The impedance in the attenuation frequency range is in short mode. When the chip-shaped LC composite component 21 is used as a matching element, the phases can be rotated so that the phase characteristics of the two surface acoustic wave filters 26 and 27 appear to be open characteristics with each other, whereby the attenuation frequency range of each of them can be changed. 2 with the characteristics in
The output signals of the individual surface acoustic wave filters 26 and 27 can be electrically combined and bundled into one output.

In the chip-shaped LC composite component 21 having the above-mentioned function, the two inductors L1 and L2 are provided.
If magnetic coupling or capacitive coupling occurs between the two, or if capacitive coupling occurs between the two input terminal electrodes 32 and 33,
The isolation characteristic between the input ports, that is, between the input terminal electrodes 32 and 33 is deteriorated, and the phase cannot be rotated. In order to solve this problem, the following measures are taken in this embodiment.

First, as shown in FIG. 1, inductor conductor patterns 39 and 41 and an inductor conductor pattern 40.
And 42 are arranged so as not to be connected to each other up to the end surface 25 of the stacked body 23, and are electrically connected to the output terminal electrode 24 in common, so that the connection electrode 36 formed on the end surface 25. And 37 and another conductor pattern 45 for connection with a capacitor formed on another dielectric layer 22. For this reason, magnetic coupling between the inductor conductor patterns 39 and 41 and the inductor conductor patterns 40 and 42 is made difficult to occur.

The inductor conductor pattern 39 and the inductor conductor pattern 40 are arranged side by side on one plane, and the inductor conductor pattern 41 and the inductor conductor pattern 42 are arranged side by side on one plane. This makes it difficult for capacitive coupling to occur between the inductor conductor patterns 39 and 41 and the inductor conductor patterns 40 and 42.

Further, by arranging the ground terminal electrode 35 between the input terminal electrodes 32 and 33, that is, by not adjoining the two input terminal electrodes 32 and 33, the input terminal electrodes 32 and 33 are separated from each other. The stray capacitance generated at the ground level (DC
Bias) to achieve good isolation between the input terminal electrodes 32 and 33.

Further, by disposing the input terminal electrodes 32 and 33 and the output terminal electrode 34 at positions facing each other in the laminated body 23, the distance between them is increased, and good isolation is achieved. There is.

FIG. 5 is a block diagram corresponding to FIG. 3 and is used to explain FIG. In FIG.
Elements corresponding to those shown in FIG. 3 are designated by similar reference numerals.

The chip-shaped LC composite component 21 constitutes a low-pass filter 49 in the signal path from one input terminal electrode 32 to the output terminal electrode 34, and in the signal path from the other input terminal electrode 33 to the output terminal electrode 34. ,
The low pass filter 50 is configured.

In the block diagram shown in FIG. 5, the reflection characteristic S11 at the output terminal electrode 34, the transmission characteristic S21 between the output terminal electrode 34 and the input port 28, and the transmission characteristic S21 between the output terminal electrode 34 and the input port 30. The frequency characteristics of each of the transmission characteristics S31 in FIG.

In FIG. 6, transmission characteristics S21 and S3.
Referring to FIG. 1, a DCS reception signal of 1.085 to 1.880 GHz and a PCS reception signal of 1.930 to 1.990 GHz in a frequency range relatively close to each other are provided with sufficient attenuation and passage characteristics. , You can see that they can be separated from each other. Therefore, the chip-shaped LC composite component 21 matches, for example, two output signals of the dual surface acoustic wave filter constituted by the surface acoustic wave filters 26 and 27 for receiving the DCS signal and the PCS signal into one output. As an element, especially GS
It can be advantageously used as a matching element for bundling two output signals of a dual surface acoustic wave filter for receiving DCS signals and PCS signals in a triple machine that handles three signals of M signals, DCS signals and PCS signals into one output. it can.

Further, according to this embodiment, as described above, both the signal path from the input terminal electrode 32 to the output terminal electrode 34 and the signal path from the input terminal electrode 33 to the output terminal electrode 34 are low-passed. A filter is constructed. Therefore, the impedance can be freely designed in each signal path, and the input terminal electrodes 32 and 33 can be designed.
It is easy to optimally design the impedance at. Further, although it is considered that an IC or the like is connected to the output terminal electrode 34, it is easy to design an impedance suitable for the IC or the like.

FIG. 7 is a view corresponding to FIG. 1, showing a second embodiment of the present invention. In FIG. 7, elements corresponding to those shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.

In the chip-shaped LC composite component 51 shown in FIG. 7, instead of the capacitor / connecting conductor pattern 45 shown in FIG. 1, a dedicated connecting conductor pattern 52 and a capacitor conductor pattern 53 have corresponding dielectrics. Body layer 22
It is characterized by being formed on the top.

More specifically, the connecting conductor pattern 52 is formed on the dielectric layer 22 shown in FIG. 7 (4).
The connecting conductor pattern 52 is electrically connected to the output terminal electrode 34 and the connecting electrodes 36 and 37.
Therefore, one end of each of the inductor conductor patterns 39 and 40 shown in FIG. 7B is electrically connected to the output terminal electrode 34 via the connecting electrodes 36 and 37 and the connecting conductor pattern 52.

On the dielectric layer 22 shown in FIG. 7 (5),
Capacitor conductor pattern 53 is formed together with capacitor conductor patterns 46 and 47. The capacitor conductor pattern 53 is electrically connected to the output terminal electrode 34. The capacitor conductor pattern 53 faces the ground conductor pattern 48 which also serves as the capacitor conductor pattern, and constitutes the capacitor C3 shown in FIG.

The other configurations of the chip-shaped LC composite component 51 shown in FIG. 7 are substantially the same as those of the chip-shaped LC composite component 21 shown in FIG.

The embodiment similar to the embodiment shown in FIG. 7 is also applicable as a modification of each of the third to fifth embodiments described later, though not particularly shown.

8 to 10 are for explaining the third embodiment of the present invention. Here, FIG. 8 corresponds to FIG. 1, FIG. 9 corresponds to FIG. 2, and FIG. 10 corresponds to FIG. In FIG. 10, elements corresponding to those shown in FIG. 3 are designated by the same reference numerals, and redundant description will be omitted.

The chip-shaped LC composite component 61 shown in FIGS. 8 to 10 is provided with a laminated body 63 composed of a plurality of laminated dielectric layers 62. The laminated body 63 has a main surface 64 extending in the extending direction of the dielectric layer 62 and an end surface 65 extending in the laminating direction of the dielectric layer 62.

On the end face 65 of the laminated body 63, the surface acoustic wave filters 26 and 2 as two band pass filters are provided.
Two input terminal electrodes 66 and 67 electrically connected to each of the seven output ports 29 and 31 and an output terminal electrode 68 for outputting a combined output signal of the two surface acoustic wave filters 26 and 27. And the ground terminal electrode 69
, A connection electrode 70, and a dummy electrode 71 are formed.

The dummy electrode 71 is formed at the same time when the other electrodes 66 to 70 formed on the end face 65 are formed, and has no electrical function. Therefore, the dummy electrode 71 may not be formed depending on the method adopted for forming the electrodes 66 to 70.

On the dielectric layer 62 shown in FIG. 8A,
The shield conductor pattern 72 is formed. The shield conductor pattern 72 is electrically connected to the ground terminal electrode 69.

On the dielectric layer 62 shown in FIG. 8B,
Two inductor conductor patterns 73 and 74 for providing a part of each of the inductors L1 and L2 shown in FIG. 10 are arranged in one plane and reach the end surface 65 of the laminated body 63 independently of each other. They are formed without being connected to each other. One end of each of the inductor conductor patterns 73 and 74 is electrically connected to the connection electrode 70 and the output terminal electrode 68, respectively.

On the dielectric layer 62 shown in FIG. 8C,
Inductor conductor patterns 75 and 76 for providing the remaining portions of the inductors L1 and L2 are formed in a state of being arranged on one plane and independent of each other and not connected to the end surface 65 of the laminated body 63. It One end of each of the inductor conductor patterns 75 and 76 is electrically connected to the input terminal electrode 66 and the ground terminal electrode 69, respectively.

The other end of each of the inductor conductor patterns 73 and 74 is electrically connected to the other end of each of the inductor conductor patterns 75 and 76 through via hole conductors 77 and 78.

On the dielectric layer 62 shown in FIG. 8 (4),
The capacitor conductor pattern 79 is formed. The capacitor conductor pattern 79 is electrically connected to the input terminal electrode 67. The capacitor conductor pattern 79 provides one electrode of the capacitor C2 shown in FIG.

On the dielectric layer 62 shown in FIG. 8 (5),
A capacitor conductor pattern 80 and a capacitor / connecting conductor pattern 81 that also serves as a capacitor conductor pattern and a connecting conductor pattern are formed in a state of being arranged on one plane. The capacitor conductor pattern 80 provides one electrode of the capacitor C1 shown in FIG. 10, and is electrically connected to the input terminal electrode 66. The capacitor / connection conductor pattern 81 includes an output terminal electrode 68 and a connection electrode 70.
Are electrically connected to each other, and the capacitor C2 shown in FIG. 10 is provided so as to face the capacitor conductor pattern 79, and one electrode of the capacitor C3 shown in FIG. 10 is also provided.

On the dielectric layer 62 shown in FIG. 8 (6),
The ground conductor pattern 82 is formed. The ground conductor pattern 82 is electrically connected to the ground terminal electrode 69. The ground conductor pattern 82 is also
The capacitor C1 also serves as a capacitor conductor pattern, and the capacitor C1 shown in FIG. 10 is provided by facing the capacitor conductor pattern 80, and the capacitor C3 shown in FIG. 10 is provided by facing the capacitor / connecting conductor pattern 81. I'm giving.

In this embodiment, as shown in FIG.
A low-pass filter is formed in the signal path from the input terminal electrode 66 to the output terminal electrode 68, while a high-pass filter is formed in the signal path from the input terminal electrode 67 to the output terminal electrode 68. Therefore, even if an electrostatic surge or the like enters the output terminal electrode 68 of the chip-shaped LC composite component 61, it is possible to prevent such a surge from being applied to the surface acoustic wave filters 26 and 27. It is possible to prevent the surface acoustic wave filters 26 and 27 from being broken by a surge or the like.

Also in this embodiment, magnetic coupling or capacitive coupling may occur between the two inductors L1 and L2, or capacitive coupling may occur between the two input terminal electrodes 66 and 67. Measures are taken to prevent it.

That is, the inductor conductor patterns 73 and 75 and the inductor conductor patterns 74 and 76 are arranged so as not to be connected to each other until the end face 65 of the laminated body 63, and they are electrically connected to the output terminal electrode 68 in common. In order to connect with the capacitor, a connecting electrode 70 formed on the end face 65 and a capacitor / connecting conductor pattern 81 formed on another dielectric layer 62 are used. Therefore, magnetic coupling is less likely to occur between the inductor conductor patterns 73 and 75 and the inductor conductor patterns 74 and 76.

The inductor conductor pattern 73 and the inductor conductor pattern 74 are arranged side by side on one plane, and the inductor conductor pattern 75 and the inductor conductor pattern 76 are arranged side by side on one plane. This makes it difficult for capacitive coupling to occur between the inductor conductor patterns 73 and 75 and the inductor conductor patterns 74 and 76.

By arranging the ground terminal electrode 69 between the input terminal electrodes 66 and 67, the stray capacitance generated between the input terminal electrodes 66 and 67 is reduced to the ground level, and the input terminal electrode 66 is reduced.
Good isolation is achieved between and 67.

Further, by arranging the input terminal electrodes 66 and 67 and the output terminal electrode 68 at positions facing each other in the laminated body 63, the distance between them is separated, and good isolation is achieved. There is.

11 to 13 are for explaining the fourth embodiment of the present invention. Here, FIG.
Corresponds to FIG. 1, FIG. 12 corresponds to FIG. 2, and FIG. 13 corresponds to FIG.
Is equivalent to. In FIG. 13, elements corresponding to those shown in FIG. 3 are designated by the same reference numerals, and redundant description will be omitted.

The chip-shaped LC composite component 91 according to this embodiment includes a laminated body 93 having a plurality of laminated dielectric layers 92. The laminated body 93 includes a main surface 94 extending in a direction in which the dielectric layer 92 extends and a dielectric layer 92.
Has an end surface 95 extending in the stacking direction.

On the end surface 95 of the laminated body 93, two surface acoustic wave filters 26 and 27 as the two band pass filters shown in FIG. 13 are electrically connected to the output ports 29 and 31, respectively. Input terminal electrodes 96 and 97, an output terminal electrode 98 for outputting a combined output signal of the surface acoustic wave filters 26 and 27, and three ground terminal electrodes 99, 100 and 101.

A capacitor conductor pattern 102 is formed on the dielectric layer 92 shown in FIG. 11 (1). The capacitor conductor pattern 102 is electrically connected to the output terminal electrode 98.

Two capacitor conductor patterns 103 and 104 are formed on the dielectric layer 92 shown in FIG. 11 (2).
Are formed in a state of being aligned on one plane. The capacitor conductor pattern 103 faces the capacitor conductor pattern 102, so that the capacitor C1 shown in FIG.
And is electrically connected to one of the input terminal electrodes 96. The capacitor conductor pattern 104 faces the capacitor conductor pattern 102, so that the capacitor conductor pattern 104 shown in FIG.
The capacitor C2 shown in FIG. 2 is provided and is electrically connected to the other input terminal electrode 97.

On the dielectric layer 92 shown in FIG. 11C, the three inductor conductor patterns 105, 106 and 107 are arranged in one plane and are independent of each other, and the end surface 95 of the laminated body 93. Are formed without being connected to each other.

The inductor conductor pattern 105 is shown in FIG.
A part of the inductor L1 shown in FIG. 2 is provided, and one end thereof is electrically connected to the input terminal electrode 96. The inductor conductor pattern 106 provides a part of the inductor L2 shown in FIG. 13, and one end thereof is electrically connected to the input terminal electrode 97. Inductor conductor pattern 1
07 provides a part of the inductor L3 shown in FIG. 13, and one end thereof is electrically connected to the output terminal electrode 98.

On the dielectric layer 92 shown in FIG. 11 (4), three inductor conductor patterns 108, 109 and 110 are arranged in one plane and are independent of each other, and the end surface 95 of the laminated body 93. Are formed without being connected to each other.

The inductor conductor pattern 108 is shown in FIG.
To provide the rest of the inductor L1 shown in
One end thereof is electrically connected to the ground terminal electrode 99. The inductor conductor pattern 109 provides the remaining portion of the inductor L2 shown in FIG. 13, and one end thereof is electrically connected to the ground terminal electrode 100. The inductor conductor pattern 110 provides the remaining portion of the inductor L3 shown in FIG. 13, and one end thereof is electrically connected to the ground terminal electrode 101.

The inductor conductor patterns 105, 1
The other ends of 06 and 107 are electrically connected to the other ends of inductor conductor patterns 108, 109, and 110 via via-hole conductors 111, 112, and 113, respectively.

In this embodiment, one input terminal electrode 9
As shown in FIG. 13, a high-pass filter is formed in both the signal path from 6 to the output terminal electrode 98 and the signal path from the other input terminal electrode 97 to the output terminal electrode 98. Therefore, as in the case of the third embodiment described above, even if an electrostatic surge or the like enters the output terminal electrode 98 of the chip-shaped LC composite component 91, the surface acoustic wave filters 26 and 27 are prevented from being surged. Therefore, it is possible to prevent the surface acoustic wave filters 26 and 27 from being damaged by an electrostatic surge or the like.

Also in this chip-shaped LC composite component 91, magnetic coupling or capacitive coupling occurs between the three inductors L1, L2 and L3, or the two input terminal electrodes 9 are connected.
Measures are taken to prevent capacitive coupling between 6 and 97.

That is, first, as shown in FIG. 11, the inductor conductor patterns 105 and 108, the inductor conductor patterns 106 and 109, and the inductor conductor patterns 107 and 110 are not connected to each other until the end surface 95 of the laminated body 93. And place it in
Inductor conductor patterns 108, 109 and 110
Are individually electrically connected to the ground terminal electrodes 99, 100, and 101, respectively, so that magnetic coupling is less likely to occur between the inductor conductor patterns 105 to 110.

Further, the inductor conductor patterns 105-1
07 are arranged side by side on one plane, and inductor conductor patterns 108 to 110 are arranged side by side on one plane, so that between these inductor conductor patterns 105 to 107 and between inductor conductor patterns 108 to 110. Capacitive coupling is less likely to occur between 110.

By arranging the ground terminal electrode 101 between the input terminal electrodes 96 and 97, the stray capacitance generated between these input terminal electrodes 96 and 97 is reduced to the ground level, and the input terminal electrode 96
And 97, good isolation is achieved.

By arranging the input terminal electrodes 96 and 97 and the output terminal electrode 98 at positions facing each other in the laminated body 93, the distance between them is increased, and good isolation is achieved. There is.

14 to 16 are for explaining the fifth embodiment of the present invention. Here, FIG.
1 corresponds to FIG. 1, FIG. 15 corresponds to FIG. 2, and FIG. 16 corresponds to FIG.
Is equivalent to.

In the chip-shaped LC composite component 121 according to the fifth embodiment, the structure of the chip-shaped LC composite component 21 according to the first embodiment described with reference to FIGS. 1 to 3 is two ports. On the other hand, it is characterized by a 3-port configuration. That is, as shown in FIG. 16, the chip-shaped LC composite component 121 electrically combines the outputs of the three surface acoustic wave filters 122, 123, and 124 as the bandpass filters to form one output. It is used as a matching element.

The surface acoustic wave filter 122 has an input port 125 and an output port 126, and the surface acoustic wave filter 123 has an input port 127 and an output port 12.
8 and the surface acoustic wave filter 124 includes the input port 1
29 and an output port 130.

The chip-shaped LC composite component 121 is a laminated body 13 having a plurality of laminated dielectric layers 131.
Equipped with 2. The laminated body 132 has a main surface 133 extending in the extending direction of the dielectric layer 131 and an end surface 134 extending in the laminating direction of the dielectric layer 131.

At the end face 134 of the laminated body 132, the output ports 126, 128 and 130 of each of the three surface acoustic wave filters 122, 123 and 124 to be connected.
Three input terminal electrodes 13 each electrically connected to
5, 136 and 137, an output terminal electrode 138 that outputs a combined output signal of the three surface acoustic wave filters 122 to 124, a ground terminal electrode 139, and three connection electrodes 140, 141 and 142. Are formed.

A shield conductor pattern 143 is formed on the dielectric layer 131 shown in FIG. 14A and electrically connected to the ground terminal electrode 139.

On the dielectric layer 131 shown in FIG. 14 (2), three inductor conductor patterns 144, 145 and 146 for providing a part of each of the inductors L1, L2 and L3 shown in FIG. However, they are formed in a state where they are arranged on one plane and are not connected to each other until reaching the end face 134 of the laminated body 132 while being independent from each other. One end of each of the inductor conductor patterns 144, 145 and 146 has connection electrodes 140, 141 and 14 respectively.
2 electrically connected.

On the dielectric layer 131 shown in FIG. 14 (3), inductor conductor patterns 147, 14 for providing the remaining portions of the inductors L1, L2 and L3, respectively.
8 and 149 are formed in a state of being arranged on one plane and independent of each other and not connected to the end surface 134 of the laminated body 132. One end of each of the inductor conductor patterns 147, 148 and 149 is electrically connected to the input terminal electrodes 135, 136 and 137, respectively.

In addition, the inductor conductor patterns 144-1
The other end of each of 46 is electrically connected to the other end of each of the inductor conductor patterns 147 to 149 via via hole conductors 150, 151 and 152.

On the dielectric layer 131 shown in FIG. 14 (4), a capacitor / connecting conductor pattern 153 which also serves as a capacitor conductor pattern and a connecting conductor pattern is formed, and three capacitor conductor patterns 15 are formed.
4, 155 and 156 are formed.

Capacitor / connecting conductor pattern 153
Provides one electrode of the capacitor C4 shown in FIG. Also, capacitor / connector conductor pattern 1
53 is an output terminal electrode 138 and a connecting conductor 140.
To 142 commonly connected electrically.

The capacitor conductor pattern 154 is shown in FIG.
It provides one electrode of the capacitor C1 shown in (4) and is electrically connected to the input terminal electrode 135. The capacitor conductor pattern 155 provides one electrode of the capacitor C2 and is electrically connected to the input terminal electrode 136.
The capacitor conductor pattern 156 provides one electrode of the capacitor C3 and is electrically connected to the input terminal electrode 137.

A ground conductor pattern 157 is formed on the dielectric layer 131 shown in FIG. 14 (5). The ground conductor pattern 157 is the ground terminal electrode 13
9 electrically connected.

The ground conductor pattern 157 faces each of the above-mentioned capacitor / connecting conductor pattern 153 and capacitor conductor patterns 154 to 156. Therefore, the ground conductor pattern 157 also serves as the capacitor conductor pattern, and when the ground conductor pattern 157 faces the capacitor / connecting conductor pattern 153, the capacitor C is formed.
4, the capacitor C1 is provided by facing the capacitor conductor pattern 154, the capacitor C2 is provided by facing the capacitor conductor pattern 155, and the capacitor C3 is provided by facing the capacitor conductor pattern 156.

As described above, the chip-shaped LC composite component 121
Can be applied to a three-band system that handles three signals such as GSM signals, DCS signals and PCS signals. The chip-shaped LC composite component 21 according to the first embodiment is changed to the chip-shaped LC composite component 121 according to the fifth embodiment in addition to the chip-shaped LC composite component 121. The above configuration can also be adopted.

Also in the chip-shaped LC composite component 121, magnetic coupling or capacitive coupling occurs between the three inductors L1, L2 and L3, and the three input terminal electrodes 13 are formed.
Measures are taken to prevent capacitive coupling between 5, 136 and 137.

That is, the inductor conductor pattern 144
And 147 and inductor conductor patterns 145 and 1
While arranging 48 and the inductor conductor patterns 146 and 149 so as not to be connected to the end surface 134 of the laminated body 132, these are connected to the output terminal electrode 13
8 are commonly connected to each other, connection electrodes 140, 141 and 142 formed on the end face 134 and a capacitor / connection conductor pattern 153 formed on another dielectric layer 131 are used. Therefore, magnetic coupling is less likely to occur between the inductor conductor patterns 144 to 149.

Further, the inductor conductor patterns 144 to 1
46 are arranged side by side on one plane, and inductor conductor patterns 147 to 149 are arranged side by side on one plane, so that between these inductor conductor patterns 144 to 146 and between inductor conductor patterns 147 to 147. Capacitive coupling is less likely to occur between 149.

By arranging the ground terminal electrode 139 between the input terminal electrodes 136 and 137, the stray capacitance generated between these input terminal electrodes 136 and 137 is reduced to the ground level, and the input terminal electrodes 136 and 137 Good isolation is achieved between 137.

By disposing the input terminal electrodes 135 to 137 and the output terminal electrode 138 at positions facing each other in the laminated body 132, the distance between them is increased,
I try to achieve good isolation.

Although the present invention has been described above with reference to some illustrated embodiments, various other modifications are possible within the scope of the present invention.

For example, the form of a conductor pattern such as an inductor conductor pattern or a capacitor conductor pattern formed on each dielectric layer, the state of drawing from these conductor patterns to the end face of the laminate, the input terminal on the end face of the laminate. The arrangement of electrodes such as electrodes and output terminal electrodes, or the order of laminating conductor patterns such as inductor conductor patterns and capacitor conductor patterns can be variously changed according to the required design.

[0138]

As described above, according to the chip-shaped LC composite component of the present invention, a plurality of inductor conductor patterns formed therein are arranged in a plane on a specific dielectric layer. Since they are arranged in such a state that they are independent of each other and are not connected to each other up to the end face of the laminated body, it is possible to prevent undesired magnetic coupling or capacitive coupling between these inductor conductor patterns. Therefore, good isolation characteristics can be obtained between the plurality of input terminal electrodes.

From this, the phase in the attenuation frequency range in each transmission characteristic is 90 degrees to 2 degrees on the Smith chart.
The input terminal electrodes are electrically connected to the respective output ports of a plurality of bandpass filters which are in the range of 70 degrees and whose impedance in the attenuation frequency range is in the short mode. When the LC composite component is used as a matching element for the plurality of bandpass filters, the phases can be rotated so that the phase characteristics of the plurality of bandpass filters look like open characteristics with each other. Each output signal of the pass filter can be electrically combined and bundled into one output.

Therefore, it is possible to use only one circuit after the filter, which makes it possible to reduce the size and cost of mobile communication equipment such as a mobile phone.

In the chip-shaped LC composite component according to the present invention, the input terminal electrode and the output terminal electrode are arranged at positions facing each other of the laminated body, or the ground terminal electrode is positioned between the plurality of input terminal electrodes. By
The isolation characteristics described above are further improved, and the function of rotating the phase of the bandpass filter can be further enhanced.

Further, according to the chip-shaped LC composite component of the present invention, the control power supply required when using the high frequency switch is unnecessary, and therefore the current consumption by the control power supply can be eliminated.

Further, according to the chip-shaped LC composite component of the present invention, since the inductor and the capacitor are built in the chip-shaped laminated body provided therein, the miniaturization of the inductor and the capacitor can be achieved, and the inductor and the capacitor can be reduced. When the characteristic values of circuit elements such as capacitors vary, they also vary in the same direction, and because the coupling between multiple inductors and the capacitance between terminal electrodes can be fixed, the total matching characteristic is stable. can do.

Further, when the chip-shaped LC composite component according to the present invention is used as a matching element, it does not utilize the attenuation characteristics of the low-pass filter or the high-pass filter unlike the diplexer. Stable matching characteristics can be provided regardless of variations in filter characteristics.

The chip-shaped LC composite component according to the present invention is
When the low-pass filter is configured in each of the plurality of signal paths as described in claim 1, the impedance can be freely designed in each signal path, and the impedance at the input terminal electrode is optimally designed. In addition, it is easy to design the IC and the like connected to the output terminal electrode to have an optimum impedance.

On the other hand, when the chip-shaped LC composite component according to the present invention forms a high-pass filter in at least one of a plurality of signal paths as described in claim 8 or 15, the chip-shaped LC composite component is provided. Even if an electrostatic surge, etc., enters the output terminal electrode of the composite part, the bandpass filter connected to the input terminal electrode can be prevented from receiving such a surge. It is possible to prevent the filter from being broken.

[Brief description of drawings]

FIG. 1 shows a chip-like LC according to a first embodiment of the present invention.
It is a top view of some dielectric layers 22 with which the composite component 21 is provided, and is for showing the internal structure of the chip-like LC composite component 21.

2 is a perspective view showing an external appearance of the chip-shaped LC composite component 21 shown in FIG.

3 shows an equivalent circuit diagram of the chip-shaped LC composite component 21 shown in FIG. 1 and a circuit diagram when the chip-shaped LC composite component 21 is used as a matching element.

4 is a surface acoustic wave filter 26 and 2 shown in FIG.
7 is a Smith chart showing the reflection characteristic S11 of the output terminal electrode 34 of FIG.

FIG. 5 is a block diagram corresponding to FIG.

6 is a diagram showing frequency characteristics of each of a reflection characteristic S11 and transmission characteristics S21 and S31 of the chip-shaped LC composite component 21 shown in FIG.

FIG. 7 is a chip-like LC according to a second embodiment of the present invention.
It is a figure corresponding to FIG. 1 which shows the composite component 51.

FIG. 8 is a chip-like LC according to a third embodiment of the present invention.
It is a figure corresponding to FIG. 1 which shows the composite component 61.

9 is a perspective view showing the external appearance of the chip-shaped LC composite component 61 shown in FIG.

10 shows an equivalent circuit diagram of the chip-shaped LC composite component 61 shown in FIG. 8 and a circuit diagram when the chip-shaped LC composite component 61 is used as a matching element.

FIG. 11 is a chip-like L according to a fourth embodiment of the present invention.
It is a figure corresponding to FIG. 1 which shows C composite component 91.

12 is a perspective view showing the external appearance of the chip-shaped LC composite component 91 shown in FIG.

13 shows an equivalent circuit diagram of the chip-shaped LC composite component 91 shown in FIG.
6 is a circuit diagram when is used as a matching element.

FIG. 14 is a chip-like L according to a fifth embodiment of the present invention.
It is a figure corresponding to FIG. 1 which shows C composite component 121.

15 is a sectional view of the chip-shaped LC composite part 121 shown in FIG.
3 is a perspective view showing the external appearance of FIG.

FIG. 16 is a chip-like LC composite part 121 shown in FIG.
1 shows an equivalent circuit diagram of the chip-shaped LC composite component 1
The circuit diagram when 21 is used as a matching element is shown.

FIG. 17 is a block diagram for explaining a first conventional technique of the present invention.

FIG. 18 is a block diagram for explaining a second conventional technique of the present invention.

[Explanation of symbols]

21, 51, 61, 91, 121 Chip-shaped LC composite component 22, 62, 92, 131 Dielectric layer 23, 63, 93, 132 Laminated body 24, 64, 94, 133 Main surface 25, 65, 95, 134 End surface 26, 27, 122-124 Surface acoustic wave filter (bandpass filter) 28, 30, 125, 127, 129 Input port 29, 31, 126, 128, 130 Output port 32, 33, 66, 67, 96, 97, 135-137
Input terminal electrodes 34, 68, 98, 138 Output terminal electrodes 35, 69, 99-101, 139 Ground terminal electrodes 36, 37, 70, 140-142 Connection electrodes 39-42, 73-76, 105-110, 144 ~ 1
49 inductor conductor patterns 43, 44, 77, 78, 111-113, 150-1
52 via-hole conductors 45, 81, 153 capacitors / connection conductor patterns 46, 47, 53, 79, 80, 102-104, 15
4 to 156 capacitor conductor patterns 48, 82, 157 ground conductor pattern 52 connection conductor pattern

Claims (20)

[Claims] 1. A plurality of bandpass filters each having a phase in an attenuation frequency range in each transmission characteristic in a range of 90 degrees to 270 degrees on a Smith chart, are electrically connected to respective output ports, and a plurality of bandpass filters are provided. A chip for electrically combining the output signals of the plurality of bandpass filters by rotating the phases so that the phase characteristics of the bandpass filters look like open characteristics. An LC composite component, comprising: a laminate having a plurality of laminated dielectric layers and having a main surface extending in the extending direction of the dielectric layers and an end surface extending in the laminating direction of the dielectric layers. A plurality of input terminals electrically connected to respective output ports of the plurality of bandpass filters to be connected to the end surface of the laminated body, A pole and an output terminal electrode for outputting a combined output signal of the plurality of bandpass filters are formed, and a plurality of inductor conductor patterns for respectively providing a plurality of inductors inside the laminate. And a plurality of capacitor conductor patterns for giving a plurality of capacitors respectively, and one end of the inductor conductor pattern and a specific capacitor conductor pattern are electrically connected to each of the input terminal electrodes. The output terminal electrode is electrically connected to the other ends of the plurality of inductor conductor patterns in common, and is different from the capacitor conductor pattern electrically connected to the input terminal electrode. A capacitor conductor pattern is electrically connected, and a plurality of inductor conductor patterns are On the layer are arranged in a state of not being connected to each other up to the end face of the laminate while independently aligned state and from each other on one plane, the chip-shaped LC composite part. 2. A connection electrode is formed on the end surface of the laminated body, and a connection conductor pattern electrically connected to the connection electrode is formed inside the laminated body. 2. The chip-shaped LC composite according to claim 1, wherein each other end of the inductor conductor pattern is electrically connected in common to the output terminal electrode via the connection electrode and the connection conductor pattern. parts. 3. The chip-shaped LC composite component according to claim 2, wherein the connection conductor pattern also serves as the capacitor conductor pattern electrically connected to the output terminal electrode. 4. The chip-shaped LC composite component according to claim 1, wherein the input terminal electrode and the output terminal electrode are arranged at positions facing each other in the laminated body. 5. The ground terminal electrode is formed on the end surface of the laminated body, and a ground conductor pattern electrically connected to the ground terminal electrode is arranged inside the laminated body. The chip-shaped LC composite component according to any one of 1 to 4. 6. The chip-shaped LC composite component according to claim 5, wherein the ground terminal electrode is located between a plurality of the input terminal electrodes. 7. The chip-shaped LC composite component according to claim 5, wherein the ground conductor pattern also serves as the capacitor conductor pattern. 8. A plurality of band-pass filters each having a phase in an attenuation frequency range in each transmission characteristic in a range of 90 degrees to 270 degrees on a Smith chart, are electrically connected to respective output ports, and a plurality of band-pass filters are provided. A chip for electrically combining the output signals of the plurality of bandpass filters by rotating the phases so that the phase characteristics of the bandpass filters look like open characteristics. An LC composite component, comprising: a laminate having a plurality of laminated dielectric layers and having a main surface extending in the extending direction of the dielectric layers and an end surface extending in the laminating direction of the dielectric layers. A plurality of input terminals electrically connected to respective output ports of the plurality of bandpass filters to be connected to the end surface of the laminated body, A pole, an output terminal electrode for outputting a combined output signal of the plurality of bandpass filters, and a ground terminal electrode are formed, and a plurality of inductors are provided inside the laminated body. A plurality of inductor conductor patterns and a plurality of capacitor conductor patterns for respectively providing a plurality of capacitors are formed, and the first input terminal electrode has one end of the first inductor conductor pattern and the first inductor conductor pattern. Of the capacitor conductor pattern are electrically connected, the second input terminal electrode is electrically connected to the second capacitor conductor pattern, and the ground terminal electrode is connected to the second inductor conductor pattern. One end of each of the first and second inductor conductor patterns is electrically connected to the output terminal electrode. Are electrically connected in common, and the third capacitor conductor pattern is electrically connected, and the plurality of inductor conductor patterns are arranged on one plane on the specific dielectric layer. A chip-shaped LC composite component, which is arranged independently of each other and is not connected to the end surface of the laminated body. 9. A connection electrode is formed on the end surface of the laminated body, and a connection conductor pattern electrically connected to the connection electrode is formed inside the laminated body. 9. The chip-shaped LC composite according to claim 8, wherein the other end of each of the inductor conductor patterns is electrically connected in common to the output terminal electrode via the connection electrode and the connection conductor pattern. parts. 10. The conductor pattern for connection comprises the third conductor pattern.
10. The chip-shaped LC composite component according to claim 9, which also serves as the capacitor conductor pattern. 11. The input terminal electrode and the output terminal electrode are arranged at positions facing each other in the stacked body,
The chip-shaped LC composite component according to any one of claims 8 to 10. 12. The ground terminal electrode is located between a plurality of the input terminal electrodes.
1. The chip-shaped LC composite component according to any one of 1. 13. The chip-shaped LC composite component according to claim 8, wherein a ground conductor pattern electrically connected to the ground terminal electrode is arranged inside the laminated body. 14. The chip-shaped LC composite component according to claim 13, wherein the ground conductor pattern also serves as the capacitor conductor pattern. 15. A plurality of band-pass filters each having a phase in an attenuation frequency range in each transmission characteristic in a range of 90 degrees to 270 degrees on a Smith chart are electrically connected to each output port, A chip for electrically combining the output signals of the plurality of bandpass filters by rotating the phases so that the phase characteristics of the bandpass filters look like open characteristics. An LC composite component, comprising: a laminate having a plurality of laminated dielectric layers and having a main surface extending in the extending direction of the dielectric layers and an end surface extending in the laminating direction of the dielectric layers. A plurality of input terminals electrically connected to the respective output ports of the plurality of bandpass filters to be connected to the end surface of the laminated body, An electrode, an output terminal electrode for outputting a combined output signal of the plurality of band pass filters, and a ground terminal electrode are formed, and a plurality of electrodes for providing a plurality of inductors are provided inside the stack. A plurality of inductor conductor patterns and a plurality of capacitor conductor patterns for respectively providing a plurality of capacitors are formed, and each of the input terminal electrodes has one end of each of the plurality of first inductor conductor patterns and The specific capacitor conductor pattern is electrically connected, and the output terminal electrode is different from the capacitor conductor pattern electrically connected to one end of the second inductor conductor pattern and the input terminal electrode. A capacitor conductor pattern is electrically connected to the ground terminal electrode, and the first and second Each of the other ends of the inductor conductor patterns is electrically connected, and the plurality of inductor conductor patterns are arranged in a plane on the specific dielectric layer and independently of each other, the end surface of the laminate. The chip-shaped LC composite parts are arranged so as not to be connected to each other. 16. The input terminal electrode and the output terminal electrode are arranged at positions facing each other in the laminate.
The chip-shaped LC composite component according to claim 15. 17. A plurality of the ground terminal electrodes,
The chip-shaped LC composite component according to claim 15 or 16, which is formed so as to be individually electrically connected to each of the other ends of the plurality of inductor conductor patterns. 18. The chip-shaped LC composite component according to claim 15, wherein the ground terminal electrode is located between a plurality of the input terminal electrodes. 19. The chip-shaped LC composite component according to any one of claims 1 to 18, wherein a plurality of phases of respective transmission characteristics in an attenuation frequency range are in a range of 90 degrees to 270 degrees on a Smith chart. And a plurality of band pass filters, wherein output ports of the plurality of band pass filters are electrically connected to the plurality of input terminal electrodes of the chip-shaped LC composite component, respectively. 20. Used in a mobile communication device,
The circuit according to claim 19.