JP2003087074A - Multilayer filter - Google Patents
Multilayer filterInfo
- Publication number
- JP2003087074A JP2003087074A JP2001271487A JP2001271487A JP2003087074A JP 2003087074 A JP2003087074 A JP 2003087074A JP 2001271487 A JP2001271487 A JP 2001271487A JP 2001271487 A JP2001271487 A JP 2001271487A JP 2003087074 A JP2003087074 A JP 2003087074A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- filter
- conductor pattern
- coils
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Abstract
(57)【要約】
【課題】 複数のコイルが近接して配置されると、互い
に相互誘導結合する。従って、コイルの配置の仕方によ
って結合の大きさが変化し、充分な減衰特性が得られな
い。
【解決手段】 絶縁体層と導体パターンを積層して積層
体内に複数のコイルを有するLCフィルタが形成され
る。このLCフィルタの複数のコイルは、互いに重畳し
ない様に巻軸をずらして形成され、かつ、隣接するコイ
ルはLCフィルタ内を伝送される信号によって発生する
磁束の方向が同じになる様に形成される。
(57) [Summary] When a plurality of coils are arranged close to each other, they are mutually inductively coupled to each other. Therefore, the magnitude of the coupling changes depending on the arrangement of the coils, and sufficient attenuation characteristics cannot be obtained. SOLUTION: An insulating layer and a conductor pattern are laminated to form an LC filter having a plurality of coils in a laminated body. The plurality of coils of this LC filter are formed with their winding axes shifted so as not to overlap each other, and the adjacent coils are formed such that the directions of magnetic flux generated by signals transmitted through the LC filter become the same. You.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、絶縁体層と導体パ
ターンを積層して積層体内に形成したLCフィルタで、
移動体通信端末や高周波通信機器に実装される積層型フ
ィルタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LC filter formed by laminating an insulating layer and a conductor pattern in a laminated body,
The present invention relates to a laminated filter mounted on a mobile communication terminal or a high frequency communication device.
【0002】[0002]
【従来の技術】従来の積層型フィルタに、絶縁体層と導
体パターンを積層して積層体内に図4に示す様なLCフ
ィルタが形成されたものがある。図4は、ローパスフィ
ルタであり、入力端子41と出力端子42間にコイルL
3とコンデンサC6が並列に接続され、コイルL3の入
力端子41側とアース間にコンデンサC7が接続され、
コイルL3の出力端子42側とアース間にコンデンサC
8が接続される。この種のローパスフィルタは、主に高
周波通信機器のパワーアンプの出力直後に接続して、R
F部で発生する不用な高調波成分を除去するのに用いら
れている。近年、高周波通信機器においては、遮断帯域
における高減衰化が望まれている。しかしながら、この
様な従来の積層型フィルタは、次数が低いため、コイル
のインダクタンス値やコンデンサの容量値を調整して
も、遮断帯域において不用な高調波成分を充分に減衰で
きなかった。2. Description of the Related Art There is a conventional laminated filter in which an insulator layer and a conductor pattern are laminated to form an LC filter as shown in FIG. 4 in the laminated body. FIG. 4 shows a low-pass filter, which has a coil L between the input terminal 41 and the output terminal 42.
3 and the capacitor C6 are connected in parallel, and the capacitor C7 is connected between the input terminal 41 side of the coil L3 and the ground,
A capacitor C is connected between the output terminal 42 side of the coil L3 and the ground.
8 are connected. This type of low-pass filter is mainly connected immediately after the output of the power amplifier of a high-frequency communication device,
It is used to remove unnecessary harmonic components generated in the F section. In recent years, high-frequency communication devices are required to have high attenuation in the stop band. However, since such a conventional multilayer filter has a low order, even if the inductance value of the coil or the capacitance value of the capacitor is adjusted, unnecessary harmonic components cannot be sufficiently attenuated in the stop band.
【0003】この様な問題を解決するために、フィルタ
の回路構成を、図5に示す様に高次数化することが考え
られている。図5の積層型フィルタは、絶縁体層と導体
パターンを積層して積層体内に、入力端子51と出力端
子52間にコイルL4とコンデンサC9の並列回路と、
コイルL5とコンデンサC10の並列回路を直列に接続
し、コイルL4とコンデンサC9の並列回路と、コイル
L5とコンデンサC10の並列回路の接続点とアース間
にコンデンサC12を、コイルL4とコンデンサC4の
並列回路の入力端子側とアース間にコンデンサC11
を、コイルL5とコンデンサC10の並列回路の出力端
子側とアース間にコンデンサC13をそれぞれ接続した
ローパスフィルタが形成される。In order to solve such a problem, it is considered to increase the circuit configuration of the filter as shown in FIG. The laminated filter shown in FIG. 5 has an insulating layer and a conductor pattern laminated, and a parallel circuit of a coil L4 and a capacitor C9 between an input terminal 51 and an output terminal 52 in the laminated body.
A parallel circuit of the coil L5 and the capacitor C10 is connected in series, and a capacitor C12 is connected between the parallel circuit of the coil L4 and the capacitor C9, a connection point of the parallel circuit of the coil L5 and the capacitor C10, and the ground, and a parallel circuit of the coil L4 and the capacitor C4. Capacitor C11 between the input terminal side of the circuit and ground
To form a low-pass filter in which a capacitor C13 is connected between the output terminal side of the parallel circuit of the coil L5 and the capacitor C10 and the ground.
【0004】[0004]
【発明が解決しようとする課題】この様な従来の積層型
フィルタは、小型化に伴って回路を構成する各素子間の
間隔が狭くなる傾向にあり、特にコイルL4とコイルL
5が近接して配置された場合、2つのコイルが相互誘導
結合する。従って、従来の積層型フィルタは、コイルの
配置の仕方によって結合の大きさが変化し、充分な減衰
特性が得られない場合があった。Such a conventional multilayer filter tends to have a narrower space between the respective elements constituting the circuit as the size thereof is reduced, and in particular, the coils L4 and L
If the 5's are placed close together, the two coils will be inductively coupled to each other. Therefore, in the conventional multilayer filter, the size of the coupling may change depending on how the coils are arranged, and sufficient attenuation characteristics may not be obtained.
【0005】本発明は、フィルタを構成する複数のコイ
ルが近接して配置されても、充分な減衰特性を得ること
ができる積層型フィルタを提供することを目的とする。An object of the present invention is to provide a laminated filter capable of obtaining a sufficient attenuation characteristic even if a plurality of coils forming the filter are arranged close to each other.
【0006】[0006]
【課題を解決するための手段】本発明の積層型フィルタ
は、LCフィルタを構成する複数のコイルの巻軸を互い
にずらした状態で、隣接するコイルの磁束の方向が同じ
になる様に形成することにより、前述の課題を解決す
る。すなわち、絶縁体層と導体パターンを積層して積層
体内に複数のコイルを有するLCフィルタが形成され、
複数のコイルは、互いに重畳しない様に巻軸をずらして
配置され、かつ、隣接するコイルはLCフィルタ内を伝
送される信号によって発生する磁束の方向が同じになる
様に形成される。また、複数のコイルは、入力端子と出
力端子間に直列に接続される。The laminated filter of the present invention is formed so that the directions of the magnetic flux of adjacent coils are the same while the winding axes of a plurality of coils constituting the LC filter are offset from each other. By doing so, the aforementioned problems are solved. That is, an LC filter having a plurality of coils is formed by stacking an insulator layer and a conductor pattern,
The plurality of coils are arranged with their winding axes displaced from each other so as not to overlap each other, and the adjacent coils are formed so that the directions of magnetic flux generated by the signals transmitted in the LC filter are the same. Further, the plurality of coils are connected in series between the input terminal and the output terminal.
【0007】[0007]
【発明の実施の形態】本発明の積層型フィルタは、絶縁
体層と導体パターンを積層して積層体内に、2つのコイ
ルを有するLCフィルタが形成される。このLCフィル
タは、第1のコイルと第2のコイルを入力端子と出力端
子間に直列に接続し、第1のコイルと並列に第1のコン
デンサを、第2のコイルと並列に第2のコンデンサをれ
ぞれ接続し、第1のコイルと第2のコイルの接続点とア
ース間に第3のコンデンサを接続し、第1のコイルの入
力端子側とアース間に第4コンデンサを、第2のコイル
の出力端子側とアース間に第5のコンデンサをそれぞれ
接続してローパスフィルタが形成される。第1のコイル
と第2のコイルは、互いに重畳しない様に横に並べて形
成されると共に、ローパスフィルタ内を伝送される信号
によって発生する磁束の方向が同じになる様に巻回方向
を設定する。従って、本発明の積層型フィルタは、第1
のコイルの磁束と第2のコイルの磁束が互いに干渉し、
相互誘導結合を小さくできる。BEST MODE FOR CARRYING OUT THE INVENTION In the laminated filter of the present invention, an LC filter having two coils is formed by laminating an insulating layer and a conductor pattern. In this LC filter, a first coil and a second coil are connected in series between an input terminal and an output terminal, a first capacitor is connected in parallel with the first coil, and a second capacitor is connected in parallel with the second coil. A capacitor is connected to each of them, a third capacitor is connected between the connection point of the first coil and the second coil and the ground, and a fourth capacitor is connected between the input terminal side of the first coil and the ground. A fifth capacitor is connected between the output terminal side of the second coil and the ground to form a low-pass filter. The first coil and the second coil are formed side by side so as not to overlap each other, and the winding direction is set so that the directions of the magnetic flux generated by the signal transmitted through the low pass filter are the same. . Therefore, the laminated filter of the present invention is the first
The magnetic flux of the coil and the magnetic flux of the second coil interfere with each other,
Mutual inductive coupling can be reduced.
【0008】[0008]
【実施例】以下、本発明の積層型フィルタを図1乃至図
3を参照して説明する。図1は本発明の積層型フィルタ
の実施例を示す分解斜視図である。図1において、11
A〜11Hは絶縁体層、12〜19は導体パターンであ
る。絶縁体層11A〜11Hは、誘電体、磁性体等の絶
縁材料で形成される。絶縁体層11Aの表面には、アー
ス用導体パターン12が形成される。このアース電極1
2は、絶縁体層11Aの対向する側面まで引き出され
る。絶縁体層11Bの表面には、容量用導体パターン1
3、14が形成される。容量用導体パターン13と容量
用導体パターン14は、アース用導体パターン12と対
向する位置に形成される。容量用導体パターン13の引
出し端と容量用導体パターン14の引出し端は、互いに
異なる側面まで引出される。絶縁体層11Cの表面に
は、アース用導体パターン12が形成される。このアー
ス電極12は、絶縁体層11Cの対向する側面まで引き
出される。絶縁体層11Dの表面には、容量用導体パタ
ーン15が形成される。容量用導体パターン15は、絶
縁体層11Cのアース用導体パターン12と対向する位
置に形成される。絶縁体層11Eの表面には、容量用導
体パターン16、17が形成される。容量用導体パター
ン16と容量用導体パターン17は、容量用導体パター
ン15と対向する位置に形成される。容量用導体パター
ン16の引出し端と容量用導体パターン17の引出し端
は、互いに異なる側面まで引出される。絶縁体層11F
の表面には、コイル用導体パターン18A、19Aが形
成される。コイル用導体パターン18Aとコイル用導体
パターン19Aは、それぞれ1ターン未満のパターンを
横に並べて互いに接触しない様に間隔をあけて形成され
る。コイル用導体パターン18Aの一端とコイル用導体
パターン19Aの一端は、それぞれスルーホールを介し
て容量用導体パターン15に接続される。絶縁体層11
Gの表面には、コイル用導体パターン18B、19Bが
形成される。コイル用導体パターン18Bとコイル用導
体パターン19Bは、それぞれ1ターン未満のパターン
を横に並べて互いに接触しない様に間隔をあけて形成さ
れる。コイル用導体パターン18Bの一端は、絶縁体層
11Gのスルーホールを介してコイル用導体パターン1
8Aの他端に接続される。コイル用導体パターン19B
の一端は、絶縁体層11Gのスルーホールを介してコイ
ル用導体パターン19Aの他端に接続される。コイル用
導体パターン18Bの他端とコイル用導体パターン19
Bの他端は、互いに異なる側面まで引出される。この様
にコイル用導体パターン18Aとコイル用導体パターン
18Bが接続されてコイルL1が形成される。また、コ
イル用導体パターン19Aとコイル用導体パターン19
Bが接続されてコイルL2が形成される。このコイルL
1とコイルL2は、容量用導体パターン15を介して直
列に接続される。この時、コイルL1とコイルL2は、
入出力端子間を流れる信号によって発生する磁束が同一
方向になる様に巻回方向、引出し方向、他の素子との接
続位置が設定される。絶縁層11Aから絶縁層11Gま
で順次積層し、保護用絶縁層11Hで覆われた積層体の
側面には、図2に示す様に端子電極21、22、23、
24、25、26が形成される。そして、端子電極22
によって容量用導体パターン13と容量用導体パターン
16と絶縁体層11Gのコイル用導体パターン19Bの
他端とが接続される。また、端子電極25によって容量
用導体パターン14と容量用導体パターン17と絶縁体
層11Gのコイル用導体パターン18Bの他端とが接続
される。さらに、端子電極21、23、24、26によ
って絶縁体層11Aのアース用導体パターン12と絶縁
体層11Cのアース用導体パターン12が接続される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The laminated filter of the present invention will be described below with reference to FIGS. FIG. 1 is an exploded perspective view showing an embodiment of the laminated filter of the present invention. In FIG. 1, 11
A to 11H are insulator layers, and 12 to 19 are conductor patterns. The insulator layers 11A to 11H are made of an insulating material such as a dielectric material or a magnetic material. The ground conductor pattern 12 is formed on the surface of the insulator layer 11A. This earth electrode 1
2 is drawn to the opposite side surfaces of the insulator layer 11A. On the surface of the insulator layer 11B, the capacitor conductor pattern 1 is formed.
3, 14 are formed. The capacitance conductor pattern 13 and the capacitance conductor pattern 14 are formed at positions facing the grounding conductor pattern 12. The lead-out end of the capacitance conductor pattern 13 and the lead-out end of the capacitance conductor pattern 14 are drawn to different side surfaces. The conductor pattern 12 for grounding is formed on the surface of the insulator layer 11C. The ground electrode 12 is led out to the opposite side surfaces of the insulator layer 11C. The conductor pattern 15 for capacitance is formed on the surface of the insulator layer 11D. The capacitance conductor pattern 15 is formed at a position facing the ground conductor pattern 12 of the insulator layer 11C. Capacitor conductor patterns 16 and 17 are formed on the surface of the insulator layer 11E. The capacitance conductor pattern 16 and the capacitance conductor pattern 17 are formed at positions facing the capacitance conductor pattern 15. The lead-out end of the capacitance conductor pattern 16 and the lead-out end of the capacitance conductor pattern 17 are drawn to different side surfaces. Insulator layer 11F
The coil conductor patterns 18A and 19A are formed on the surface of the. The coil conductor pattern 18A and the coil conductor pattern 19A are formed by arranging the patterns of less than one turn side by side with an interval so as not to contact each other. One end of the coil conductor pattern 18A and one end of the coil conductor pattern 19A are connected to the capacitor conductor pattern 15 through through holes, respectively. Insulator layer 11
Coil conductor patterns 18B and 19B are formed on the surface of G. The coil conductor pattern 18B and the coil conductor pattern 19B are formed by arranging the patterns of less than one turn side by side so as to be spaced from each other so as not to contact each other. One end of the coil conductor pattern 18B is connected to the coil conductor pattern 1 through the through hole of the insulator layer 11G.
It is connected to the other end of 8A. Coil conductor pattern 19B
One end of is connected to the other end of the coil conductor pattern 19A through a through hole of the insulator layer 11G. The other end of the coil conductor pattern 18B and the coil conductor pattern 19
The other end of B is pulled out to different side surfaces. In this way, the coil conductor pattern 18A and the coil conductor pattern 18B are connected to form the coil L1. Further, the coil conductor pattern 19A and the coil conductor pattern 19
B is connected to form the coil L2. This coil L
1 and the coil L2 are connected in series via the conductor pattern 15 for capacitance. At this time, the coil L1 and the coil L2 are
The winding direction, the drawing direction, and the connection position with other elements are set so that the magnetic fluxes generated by the signals flowing between the input and output terminals are in the same direction. As shown in FIG. 2, terminal electrodes 21, 22, 23, on the side surface of the laminated body in which the insulating layers 11A to 11G are sequentially laminated and covered with the protective insulating layer 11H,
24, 25, 26 are formed. Then, the terminal electrode 22
Thus, the capacitance conductor pattern 13, the capacitance conductor pattern 16 and the other end of the coil conductor pattern 19B of the insulator layer 11G are connected. The terminal electrode 25 connects the capacitance conductor pattern 14, the capacitance conductor pattern 17, and the other end of the coil conductor pattern 18B of the insulator layer 11G. Further, the ground conductor pattern 12 of the insulator layer 11A and the ground conductor pattern 12 of the insulator layer 11C are connected by the terminal electrodes 21, 23, 24, and 26.
【0009】この様に形成された積層体内には、図3に
示すようなローパスフィルタが形成される。すなわち、
コイル用導体パターン18A、18Bによって形成され
たコイルL1とコイル用導体パターン19A、19Bに
よって形成されたコイルL2が入力端子31と出力端子
32間に接続される。また、容量用導体パターン15と
容量用導体パターン17間に形成された容量によってコ
ンデンサC1がコイルL1に並列に接続され、容量用導
体パターン15と容量用16間に形成された容量によっ
てコンデンサC2がコイルL2に並列に接続される。さ
らに、容量用導体パターン13とその両側のアース導体
パターン12間に形成された容量によってコイルL1の
入力側とアース間にコンデンサC3が、容量用導体パタ
ーン14とその両側のアース導体パターン12間に形成
された容量によってコイルL2の出力側とアース間にコ
ンデンサC5が、容量用導体パターン15と絶縁体層1
1Cのアース用導体パターン12間に形成された容量に
よって2つの並列回路の接続点とアース間にコンデンサ
C4がそれぞれ接続される。A low-pass filter as shown in FIG. 3 is formed in the laminated body thus formed. That is,
The coil L1 formed by the coil conductor patterns 18A and 18B and the coil L2 formed by the coil conductor patterns 19A and 19B are connected between the input terminal 31 and the output terminal 32. Further, the capacitor C1 is connected in parallel to the coil L1 by the capacitance formed between the capacitance conductor pattern 15 and the capacitance conductor pattern 17, and the capacitor C2 is formed by the capacitance formed between the capacitance conductor pattern 15 and the capacitance conductor 16. It is connected in parallel to the coil L2. Further, due to the capacitance formed between the capacitance conductor pattern 13 and the ground conductor patterns 12 on both sides thereof, a capacitor C3 is provided between the input side of the coil L1 and the ground, and between the capacitance conductor pattern 14 and the ground conductor patterns 12 on both sides thereof. Due to the formed capacitance, the capacitor C5 is provided between the output side of the coil L2 and the ground, and the capacitor conductor pattern 15 and the insulating layer 1 are provided.
The capacitor C4 is connected between the connection point of the two parallel circuits and the ground by the capacitance formed between the 1C ground conductor patterns 12.
【0010】この様に形成された積層型フィルタは、2
つのコイルが積層体内で横に並べて配置されると共に、
入力端子31を構成する端子電極25から入力された信
号によってコイルL1に発生する磁束の方向と、出力端
子32を構成する端子電極22から出力される信号によ
ってコイルL2に発生する磁束の方向が同じになる。The multilayer filter thus formed has two
Two coils are placed side by side in the stack,
The direction of the magnetic flux generated in the coil L1 by the signal input from the terminal electrode 25 configuring the input terminal 31 is the same as the direction of the magnetic flux generated in the coil L2 by the signal output from the terminal electrode 22 configuring the output terminal 32. become.
【0011】以上、本発明の積層型フィルタの実施例を
述べたが、本発明はこの実施例に限られるものではな
い。例えば、2つのコイルは、互いに重畳しない様に巻
軸を互いにずらした状態で、隣接するコイルの磁束の方
向が同じになる様に形成されればよく、それぞれ渦巻き
状のコイル用導体パターンによって構成されてもよい。
また、一方のコイルを構成するコイル用導体パターンと
他方のコイルを構成するコイル用導体パターンを異なっ
た絶縁体層に形成してもよい。さらに、実施例ではコイ
ルの巻軸が実装面と垂直なものを示したが、コイルの巻
軸を実装面と水平にしてもよい。また、本発明は、3つ
以上のコイルを有するLCフィルタに適用することもで
きる。Although the embodiment of the laminated filter of the present invention has been described above, the present invention is not limited to this embodiment. For example, the two coils may be formed so that the directions of the magnetic flux of the adjacent coils are the same in a state where the winding axes are offset from each other so as not to overlap each other. Each of the two coils is formed by a spiral coil conductor pattern. May be done.
Further, the coil conductor pattern forming one coil and the coil conductor pattern forming the other coil may be formed on different insulating layers. Furthermore, although the winding axis of the coil is perpendicular to the mounting surface in the embodiment, the winding axis of the coil may be horizontal to the mounting surface. The present invention can also be applied to an LC filter having three or more coils.
【0012】[0012]
【発明の効果】以上述べたように、本発明の積層型フィ
ルタは、絶縁体層と導体パターンを積層して積層体内に
複数のコイルを有するLCフィルタが形成され、複数の
コイルは、互いに重畳しない様に巻軸をずらして配置さ
れ、かつ、隣接するコイルはLCフィルタ内を伝送され
る信号によって発生する磁束の方向が同じになる様に形
成されるので、隣接するコイルの磁束が互いに干渉し、
相互誘導結合を小さくできる。従って、本発明の積層型
フィルタは、フィルタを構成する複数のコイルが近接し
て配置されても、充分な減衰特性を得ることができる。
また、本発明の積層型フィルタは、フィルタを構成する
複数のコイルを近接して配置できるので、従来のものよ
りも小型化できる。さらに、本発明の積層型フィルタ
は、相互誘導結合の影響を考慮する必要がなくなるの
で、設計が容易になる。As described above, in the laminated filter of the present invention, an LC filter having a plurality of coils is formed by laminating an insulating layer and a conductor pattern, and the plurality of coils are superposed on each other. The coils are arranged so that the winding axes are offset so that the adjacent coils are formed so that the directions of the magnetic fluxes generated by the signals transmitted in the LC filter are the same, so the magnetic fluxes of the adjacent coils interfere with each other. Then
Mutual inductive coupling can be reduced. Therefore, the multilayer filter of the present invention can obtain a sufficient attenuation characteristic even if a plurality of coils forming the filter are arranged close to each other.
Further, in the laminated filter of the present invention, a plurality of coils constituting the filter can be arranged close to each other, so that the laminated filter can be made smaller than the conventional one. Further, the laminated filter of the present invention does not need to consider the influence of mutual inductive coupling, which facilitates the design.
【図1】 本発明の積層型フィルタの実施例を示す分解
斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of a laminated filter of the present invention.
【図2】 本発明の積層型フィルタの実施例を示す斜視
図である。FIG. 2 is a perspective view showing an embodiment of the laminated filter of the present invention.
【図3】 図1、図2の回路図である。FIG. 3 is a circuit diagram of FIGS. 1 and 2.
【図4】 従来の積層型フィルタの回路図である。FIG. 4 is a circuit diagram of a conventional multilayer filter.
【図5】 従来の別の積層型フィルタの回路図である。FIG. 5 is a circuit diagram of another conventional multilayer filter.
11A〜11H 絶縁体層 12〜19 導体パターン 11A-11H Insulator layer 12-19 conductor pattern
フロントページの続き Fターム(参考) 5E070 AA05 CB02 CB13 5J024 AA01 BA01 CA03 DA01 DA29 EA01 Continued front page F term (reference) 5E070 AA05 CB02 CB13 5J024 AA01 BA01 CA03 DA01 DA29 EA01
Claims (4)
体内に複数のコイルを有するLCフィルタが形成され、
該複数のコイルは、互いに重畳しない様に巻軸をずらし
て配置され、かつ、隣接するコイルはLCフィルタ内を
伝送される信号によって発生する磁束の方向が同じにな
る様に形成されることを特徴とする積層型フィルタ。1. An LC filter having a plurality of coils is formed by stacking an insulating layer and a conductor pattern,
The plurality of coils are arranged with their winding axes displaced from each other so as not to overlap each other, and adjacent coils are formed so that the directions of magnetic flux generated by signals transmitted through the LC filter are the same. Characteristic multilayer filter.
子間に直列に接続された請求項1に記載の積層型フィル
タ。2. The multilayer filter according to claim 1, wherein the plurality of coils are connected in series between an input terminal and an output terminal.
ある請求項1又は請求項2に記載の積層型フィルタ。3. The multilayer filter according to claim 1, wherein the LC filter is a low pass filter.
体内に2つのコイルを有するLCフィルタが形成され、
該LCフィルタは、第1のコイルと第2のコイルを入力
端子と出力端子間に直列に接続し、該第1のコイルと並
列に第1のコンデンサを、該第2のコイルと並列に第2
のコンデンサをれぞれ接続し、該第1のコイルと該第2
のコイルの接続点とアース間に第3のコンデンサを接続
し、第1のコイルの入力端子側とアース間に第4コンデ
ンサを、第2のコイルの出力端子側とアース間に第5の
コンデンサをそれぞれ接続してローパスフィルタが形成
され、該第1のコイルと該第2のコイルは、互いに重畳
しない様に巻軸をずらして配置され、かつ、該入力端子
と該出力端子間を伝送される信号によって発生する磁束
の方向が同じになる様に形成されることを特徴とする積
層型フィルタ。4. An LC filter having two coils is formed by stacking an insulator layer and a conductor pattern,
The LC filter has a first coil and a second coil connected in series between an input terminal and an output terminal, a first capacitor in parallel with the first coil and a second capacitor in parallel with the second coil. Two
Of the first coil and the second coil.
A third capacitor is connected between the connection point of the coil and the ground, a fourth capacitor is connected between the input terminal side of the first coil and the ground, and a fifth capacitor is connected between the output terminal side of the second coil and the ground. To form a low-pass filter, the first coil and the second coil are arranged with their winding axes displaced from each other so as not to overlap each other, and are transmitted between the input terminal and the output terminal. The multilayer filter is formed so that the directions of magnetic fluxes generated by the signals that are generated are the same.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001271487A JP2003087074A (en) | 2001-09-07 | 2001-09-07 | Multilayer filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001271487A JP2003087074A (en) | 2001-09-07 | 2001-09-07 | Multilayer filter |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003087074A true JP2003087074A (en) | 2003-03-20 |
Family
ID=19096987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001271487A Pending JP2003087074A (en) | 2001-09-07 | 2001-09-07 | Multilayer filter |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007124172A (en) * | 2005-10-27 | 2007-05-17 | Ube Ind Ltd | High frequency low pass filter |
JP2007250941A (en) * | 2006-03-17 | 2007-09-27 | Ngk Spark Plug Co Ltd | Laminated electronic component |
JP2008278100A (en) * | 2007-04-27 | 2008-11-13 | Ngk Spark Plug Co Ltd | Laminated demultiplexer |
JP2009182376A (en) * | 2008-01-29 | 2009-08-13 | Tdk Corp | Laminated low-pass filter |
JP2012231279A (en) * | 2011-04-26 | 2012-11-22 | Murata Mfg Co Ltd | Filter circuit |
WO2013099562A1 (en) * | 2011-12-28 | 2013-07-04 | 株式会社村田製作所 | Electronic component |
WO2013164929A1 (en) * | 2012-05-02 | 2013-11-07 | 株式会社村田製作所 | High frequency module |
DE102014219697A1 (en) * | 2013-10-30 | 2015-04-30 | Murata Manufacturing Co., Ltd. | electronic component |
CN106816259A (en) * | 2015-10-16 | 2017-06-09 | Tdk株式会社 | Coil component and its manufacture method and the circuit substrate of coil component is installed |
KR20170093537A (en) * | 2016-02-05 | 2017-08-16 | 주식회사 아모텍 | Differential and common mode filter |
-
2001
- 2001-09-07 JP JP2001271487A patent/JP2003087074A/en active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007124172A (en) * | 2005-10-27 | 2007-05-17 | Ube Ind Ltd | High frequency low pass filter |
JP2007250941A (en) * | 2006-03-17 | 2007-09-27 | Ngk Spark Plug Co Ltd | Laminated electronic component |
JP2008278100A (en) * | 2007-04-27 | 2008-11-13 | Ngk Spark Plug Co Ltd | Laminated demultiplexer |
JP2009182376A (en) * | 2008-01-29 | 2009-08-13 | Tdk Corp | Laminated low-pass filter |
US7999634B2 (en) | 2008-01-29 | 2011-08-16 | Tdk Corporation | Layered low-pass filter having a conducting portion that connects a grounding conductor layer to a grounding terminal |
JP2012231279A (en) * | 2011-04-26 | 2012-11-22 | Murata Mfg Co Ltd | Filter circuit |
US9013249B2 (en) | 2011-12-28 | 2015-04-21 | Murata Manufacturing Co., Ltd. | Electronic component |
WO2013099562A1 (en) * | 2011-12-28 | 2013-07-04 | 株式会社村田製作所 | Electronic component |
JPWO2013099562A1 (en) * | 2011-12-28 | 2015-04-30 | 株式会社村田製作所 | Electronic components |
WO2013164929A1 (en) * | 2012-05-02 | 2013-11-07 | 株式会社村田製作所 | High frequency module |
US9118298B2 (en) | 2012-05-02 | 2015-08-25 | Murata Manufacturing Co., Ltd. | High frequency module |
DE102014219697A1 (en) * | 2013-10-30 | 2015-04-30 | Murata Manufacturing Co., Ltd. | electronic component |
US9479136B2 (en) | 2013-10-30 | 2016-10-25 | Murata Manufacturing Co., Ltd. | Electronic component |
DE102014219697B4 (en) | 2013-10-30 | 2023-02-02 | Murata Manufacturing Co., Ltd. | electronic component |
CN106816259A (en) * | 2015-10-16 | 2017-06-09 | Tdk株式会社 | Coil component and its manufacture method and the circuit substrate of coil component is installed |
CN106816259B (en) * | 2015-10-16 | 2018-05-25 | Tdk株式会社 | Coil component and its manufacturing method and the circuit substrate for being equipped with coil component |
KR20170093537A (en) * | 2016-02-05 | 2017-08-16 | 주식회사 아모텍 | Differential and common mode filter |
KR101968585B1 (en) * | 2016-02-05 | 2019-04-12 | 주식회사 아모텍 | Differential and common mode filter |
US10566947B2 (en) | 2016-02-05 | 2020-02-18 | Amotech Co., Ltd. | Filter for both differential mode and common mode |
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