JP2003060354A - Component built-in printed circuit board and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a printed circuit board with a built-in component capable of supporting high density, high reliability, high productivity, and wide applicability to electronic equipment, and a method of manufacturing the same. Further, the present invention provides a widely applicable printed circuit board with built-in components which can be applied to a double-sided printed circuit board, a multilayer printed circuit board, a build-up board, a heat dissipation board, and the like. SOLUTION: A first fusion layer is formed at a desired portion of a conductor circuit formed on an electronic base material, and a second fusion layer is formed at a connection portion of an electronic component to be connected to the circuit. An electronic component is connected to the circuit via a fusion layer, and an insulating resin layer is disposed thereon to integrally laminate the components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a component-embedded printed circuit board, and a double-sided board, a multilayer board, a build-up board and a heat dissipation board using the same. The components incorporated in the present invention are chip components and semiconductors, which are single or mixed products.

[0002]

2. Description of the Related Art Conventional printed circuit boards with built-in components have the following features: 1) After printing a conductor paste having a resistance and a capacitor function on desired portions between conductors such as circuits, terminals and pads formed on a plane. 2) Obtained by baking and drying. 2) A substance having a resistance or a capacitor function is formed by a wet method such as electroless plating or a vacuum method (dry method) such as vacuum deposition or sputtering.
However, in these conventional methods, (1) it is not a three-dimensional formation, but it is difficult to increase the circuit density (3) it is difficult to control the thickness of the printed material (4) the desired electrical resistance And it is difficult to obtain electric capacity (5) It is often necessary to trim and adjust the width of the formed parts (6) There are large variations in quality (7) Manufacturing costs are high (8) Applicable substances are limited There were many drawbacks such as being done. In addition, a method of forming a so-called component-embedded printed circuit board for connecting electronic components to a desired portion is also known, which is (1) forming a cavid on a substrate of a component connecting portion, Nothing is covered, or (2) it is sealed by resin potting, and these require (1) formation of cavities (2) lack of connection reliability because it is not covered on the parts (3) The cover by potting sealing has many drawbacks such as lack of reliability and accuracy due to movement of parts and generation of irregularities. (4) Direct connection cannot be made because wire bonding connection is mainly used.

[0003]

SUMMARY OF THE INVENTION The present invention solves many of these problems by connecting an electronic component to a desired portion of a conductor circuit formed on an electronic base material via respective fusion layers, To provide a component-embedded printed circuit board in which an electronic component is incorporated in the layer by laminating an insulating resin layer thereon, and a manufacturing method thereof. The present invention also provides a double-sided board, a multi-layer board, a build-up board, and a heat dissipation board in a component-embedded printed circuit board in which electronic components are laminated and built in between conductor circuits, and a method for manufacturing them is also provided. is there.

[0004]

In the method for manufacturing a component-embedded printed circuit board according to the present invention, a first fusion bonding layer is formed on a desired portion of a conductor circuit formed on an electronic base material, and the conductor circuit is connected to the circuit. A second fusion bonding layer is formed at a connection portion of the electronic component, the electronic component is connected to the conductor circuit via the fusion bonding layer, and an insulating resin layer is laminated on the second fusion bonding layer to form a component-embedded printed circuit board. It is characterized by doing.

According to the method of manufacturing a printed circuit board with a built-in component of the present invention, tin is added to a connection portion of an electronic component connected to the conductor circuit,
From a simple metal of any one of bismuth, antimony, silver, gold, zinc, copper and indium, or a multi-element metal containing at least one of these elements, or a conductive paste containing these, or an anisotropic conductive film A fusion layer made of a metal element other than lead or a lead-free alloy is formed at the connection portion of the conductor circuit, and the conductor circuit and the electronic circuit are formed through the fusion layers formed respectively. It is characterized in that parts are connected and formed.

The method of manufacturing a component-embedded printed circuit board according to the present invention is characterized in that the electronic components laminated and built-in are chip components and / or semiconductors.

The method for manufacturing a component-embedded printed circuit board according to the present invention is characterized in that a lid substrate and / or an opening insulating resin layer is attached to the built-in electronic component as required to form a laminate.

The method of manufacturing a printed circuit board with built-in component according to the present invention is characterized in that the conductor circuit formed on the electronic base material in which the electronic components are laminated and built is a smoothing circuit.

The component built-in printed circuit board of the present invention is characterized in that it is a double-sided board, a multilayer board, a build-up board, or a heat dissipation board.

The component-embedded printed circuit board of the present invention is formed by connecting an electronic component to a desired portion of a conductor circuit formed on an electronic base material via a fusion bonding layer and laminating an insulating resin layer thereon. It is characterized by being

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention is shown in FIG.
As shown in FIG. 2, a first fusion layer is formed on the conductor circuit 3 formed on the copper foil on the insulating base material 5, and a second fusion layer is formed on the connection part of the electronic component 1 to be connected to the conductor circuit. After forming the adhesive layer 2, the insulating resin layer 6 is placed and laminated around the electronic component 1 with the opening insulating resin layer 7 interposed therebetween, and the first fusion layer 4 and the second fusion layer 2 on both sides are laminated. By forming the connection layer 8 by fusing, a component built-in printed circuit board in which electronic components are connected to a conductor circuit as shown in FIG. 2 is formed.

In the second embodiment of the present invention, as shown in FIG. 3, conductor circuits are formed on both sides of a glass epoxy double-sided copper-clad laminate, and a first fusion layer 4 is formed on the surface of the laminate to form a fusion bond. After forming a conductor circuit with a layer 3 ', a second fusion layer 2 is formed at a connection site of the electronic component 1 with a desired conductor circuit to form an electronic component with a fusion layer 1' Further, a lid substrate 10 and an opening insulating resin layer 7 are attached to the surroundings, and a prepreg (+ an insulating base material provided as needed) layer 5'and a copper foil are laid up, and pressure heating conditions are applied in a laminating press. After laminating underneath, the required conductor circuit 3 is formed on the outermost copper foil to form a component-embedded four-layer printed circuit board.

In the third embodiment of the present invention, as shown in FIG. 4, a conductor circuit 3'with a fusion layer formed on a smooth substrate 14 is formed.
After mounting the electronic component 1 ′ with the fusion layer on the desired portion of the prepreg and laminating it in the laminating press via the prepreg layer 11, the inner layer via hole IVH 13 is formed on the required portion, and the prepreg (+ insulation provided as needed) is formed. The base material layer 5'and the copper foil are laid up and laminated in a laminating press, then the through holes 12 are formed in the necessary portions, and the necessary conductor circuit 3 is formed in the outermost copper foil, thereby providing IVH. Built-in parts 6
A layered printed circuit board is formed.

The fourth embodiment of the present invention, as shown in FIG. 5, is a conductor circuit 3'with a fusion layer formed on a smooth substrate 14.
An inner layer via hole IVH13 is formed in a required portion of the electronic component 1'with a fusion layer at a desired portion of the conductor circuit 3'with a fusion layer.
And laying up the prepreg 11 and the copper foil 15 with resin, and forming a blind via hole BVH16 by a laser via method on the ground and a desired portion under the lamination in a lamination press, thereby forming a four-layer component built-in IVH and BVH component A printed circuit board is formed.

In the fifth embodiment of the present invention, as shown in FIG. 6, an IVH 13 and a conductor circuit 3'with a fusion layer are formed on a smooth substrate 14, and an electronic component with a fusion layer is provided at a desired conductor circuit portion thereof. 1'is placed, and the prepreg layer 11 and the heat dissipation plate 17 having an opening in a necessary portion, the prepreg (+ an insulating base material provided as needed) layer 5'and the copper foil are laid up and laminated in a laminating press. After that, through-holes 12 are formed in necessary parts, and necessary conductor circuits 3 are formed in the outermost copper foil to form a 4-layer heat dissipation printed circuit board with built-in IVH.

[0016]

Example 1 Conductor circuits were formed by etching on both sides of a 1.0 mm-thick 35 μm Cu glass epoxy double-sided copper-clad laminate under an ordinary condition with an iron chloride etching solution, and electroless tin plating was applied to the circuit surfaces. To obtain a conductor circuit with a fusion layer. Then, tin / silver paste is formed by a printing method at the connection part with the conductor circuit of the thin square chip resistor to form an electronic component with a fusion layer, and then the size is such that the component is placed on and around the chip resistor. An epoxy resin layer with the same size as the cavity processed lid substrate was attached, and two 0.1 mm prepregs were used.
Lay up 5 μm copper foil and place 18 in a vacuum laminating press.
After stacking at 0 ° C. and 2 MPa for 60 minutes, a conductor circuit was etched on the outermost copper foil with an iron chloride etching solution under ordinary conditions to form a 4-layer component-embedded multilayer printed circuit board. .

Example 2 A 1.0 mm thick unclad glass epoxy core substrate 3
A 5 μm Cu resin-coated copper foil was laminated, a necessary circuit was etched on the copper foil, and then pressed in a laminating press to form a smooth circuit board. This conductor circuit was subjected to electroless tin plating, and then tin / bismuth paste was formed at a desired connection portion of the 1005 chip capacitor by a printing method to obtain an electronic component with a fusion layer. After laminating in a laminating press through one 0.2 mm prepreg layer, 0.3
After forming an inner layer via hole IVH having a diameter of 2 mm, two 0.2 mm prepregs and a 18 μm copper foil were laid up and laminated in a laminating press at 180 ° C., 2 MPa for 60 minutes, and then a required area of 0. A 5 mm-sulfur was formed, and a conductor circuit was formed on the outermost copper foil with a chloride etching solution under a strip condition to form a 6-layer printed circuit board with a built-in IVH component.

Example 3 IVH was reduced to 0.3 mm by drilling and electroless copper plating on a necessary portion of a smooth substrate obtained in the same manner as in Example 2.
After forming, the conductor circuit on the smoothing circuit was plated with tin / copper to obtain a conductor circuit with a fusion layer. A tin / indium paste was formed on the desired portion by a printing method.
A 05 chip capacitor and a 0603 chip resistor are placed, and the smooth substrate and the electronic component are laid up with two 0.1 mm prepregs and a copper foil with 35 μm resin,
Laminated in a laminating press. Lay on the desired part of the substrate after lamination.
The blind processing of 0.15mm blind via was opened by the processing,
BVH was formed by electroless copper plating to form a component-embedded 4-layer printed circuit board with IVH and BVH.

Example 4 An electronic component with a fusion layer obtained in the same manner was placed on a desired portion of a smooth base with a fusion circuit and a conductor circuit obtained in the same manner as in Example 3, and two 0.2 mm prepregs were required. Two 1.0 mm aluminum heat sinks with open parts, 0.1 mm prepreg 2
The 35 μm Cu single-sided copper-clad laminate was laid up and laminated in a vacuum lamination press at 180 ° C. for 1.9 MPa for 60 minutes. After forming sulfol plating with a diameter of 1.0 mm on the required portion, a necessary circuit was formed on the outermost copper foil with a chloride etching solution to form a 4-layer heat dissipation printed circuit board with IVH.

In the method for manufacturing each printed circuit board according to the present invention, the conditions are not limited at all. That is, (1) the insulating resin of the electronic base material is epoxy, phenol,
Polyimide, aramid, BT, PTFE, PPE, PP
There is no limitation as long as it has electrical insulating properties such as O, PPS, polyolefin, and thermoplastic resin. Further, the base material may be ceramic or composite material. (2) The holes may be formed by any method such as drilling, laser, photo, punching. (3) The method of forming the fusion layer on the conductor circuit may be any of screen printing, roller coater, transfer method, plating, fluidizing method, spraying and the like. (4) The material of the conductor layer is not particularly limited as long as it is electrically conductive such as copper, gold, silver, nickel, tin, solder, and palladium. (5) The lid substrate and the opening insulating resin layer may be formed by any of punching, router, counterbore, and insert. (6) The lamination method is not particularly limited as long as it is a lamination press, a laminator, a roller, or the like. (7) The material of the heat dissipation substrate is not particularly limited as long as it has a heat dissipation effect such as aluminum, copper and iron.

[0021]

The present invention is as described above, and the inventions of claims 1, 2 and 3 form a first fusion-bonding layer on a desired portion of a conductor circuit formed on an electronic substrate, and the circuit is formed. A second fusion layer is formed at a connection portion of the electronic component to be connected to the electronic circuit, the electronic component is connected to the conductor circuit via the fusion layer, and an insulating resin is laminated on the connection layer to form the electronic circuit. As compared with the conventional method, since it is connected to and is built in the layer at the same time, high reliability electronic parts are built in beforehand, so it is highly reliable as a printed circuit board, can be used for high density, and can form a three-dimensional structure. , Quality variation is extremely small, desired electrical characteristics can be obtained, high productivity and low manufacturing cost, wide range of applicable electronic parts, no cavity shape of built-in parts, no potting or wire bonding And many more There is an effect.

According to the fourth aspect of the present invention, since the electronic component to be built in is provided with the lid substrate and / or the opening insulating resin layer as needed, the electronic components are laminated to form a laminated structure. Therefore, the pressure and heat stress to the electronic components are reduced. Therefore, there is an effect that not only the performance and reliability of the parts can be sufficiently ensured, but also the planarity as the component-embedded printed circuit board can be ensured at the same time.

According to the fifth aspect of the invention, since the conductor circuit formed on the electronic base material is a smoothing circuit, the fusion accuracy of the electronic component is high, and the thickness of the component-embedded printed circuit board is very thin. The effect is that you can.

According to a sixth aspect of the present invention, the component built-in printed circuit board to be manufactured is a double-sided plate, a multilayer board, a build-up board, and a heat dissipation board, so that the application range as a printed circuit board is very wide. , Is effective.

According to a seventh aspect of the invention, in the component built-in printed circuit board to be manufactured, the multi-component metal formed at the connection part of the electronic component is tin / silver type, tin / silver / bismuth / copper type, tin / zinc.・ Bismuth type, tin / indium type, tin / gold type,
Further, since the metal element other than lead or the alloy containing no lead, which is formed in the connection portion of the conductor circuit, is a single metal of tin, silver, copper, nickel, gold or an alloy containing one of these elements and containing no lead, It has effects such as high connection reliability, no movement of parts, and wide stacking conditions.

[Brief description of drawings]

FIG. 1 is a layup vertical cross-sectional view of Embodiment 1 of the present invention.

FIG. 2 is a vertical cross-sectional view of Embodiment 1 of the present invention.

FIG. 3 is a vertical cross-sectional view of Embodiment 2 of the present invention.

FIG. 4 is a vertical cross-sectional view of Embodiment 3 of the present invention.

FIG. 5 is a vertical sectional view of embodiment 4 of the present invention.

FIG. 6 is a vertical cross-sectional view of Embodiment 5 of the present invention.

[Explanation of symbols]

1 electronic components 1'Electronic component with fusion layer 2 Second fusing layer 3 conductor circuit 3'Fused conductor circuit 4 Fourth fusion layer 5 Insulating material 5'insulating base material + prepreg layer 6 Insulating resin layer 7 Opening insulating resin layer 8 connection layers 9 Laminated insulating resin layer 10 Lid substrate 11 Prepreg layer 12 Through Hole 13 IVH 14 Smooth substrate 15 Copper foil with resin 16 BVH 17 Heat sink

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 1/02 H05K 1/02 L 1/18 Q 1/18 3/32 B 3/32 C H01L 23/12 B J (72) Inventor Mitsuhiro Watanabe 1-7-1, Kawa, Yokosuka City, Kanagawa Within the stock company Multi (72) Inventor Higashi Hironi 3260 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama 27 Inside the East Materials Research Institute (72) Invention Person Hashimoto Chisen 2023 Okubun, Omine-cho, Mitsumi-shi, Yamaguchi Prefecture F-term (reference) inside Ube Electronics Co., Ltd. GG03 GG14 GG30 5E338 AA02 AA03 BB05 BB19 BB75 CC08 EE02 EE23 EE31 5E346 AA06 AA12 AA15 AA22 AA32 AA43 AA51 BB16 CC02 CC08 CC32 CC42 DD02 EE06 EE07 FF45 GG15 GG28 HH17 HH25 HH17 HH25

Claims (8)

[Claims] 1. A first fusion-bonding layer is formed on a desired portion of a conductor circuit formed on an electronic base material, and a second fusion-bonding layer is formed on a connecting portion of an electronic component to be connected to the circuit. Built-in component characterized in that a conductor circuit and an electronic component are fixedly connected to each other by connecting an electronic component to the conductor circuit via a fusion layer, and arranging an insulating resin layer thereon to integrally laminate Method of manufacturing printed circuit board. 2. The printed circuit board according to claim 1, wherein the second fusing layer at the connection site of the electronic component is any one of tin, bismuth, antimony, silver, gold, zinc, copper and indium. A single metal, a multi-element metal containing at least one of these elements, a conductor paste, or an anisotropic conductive film, and the first fusion bonding layer of the connecting portion of the conductor circuit is a metal element other than lead or lead. A method of manufacturing a component-embedded printed circuit board, which is an alloy not containing, and in which a conductor circuit and an electronic component are connected and formed via respective fusion layers formed. 3. The method of manufacturing a printed circuit board according to claim 1, wherein the electronic parts are chip parts and / or semiconductors. 4. The printed circuit board manufactured according to claim 1, wherein a lid substrate and / or a built-in electronic component are provided as necessary.
Alternatively, a method of manufacturing a component-embedded printed board is characterized in that an opening insulator resin layer is additionally provided and laminated. 5. The method of manufacturing a printed circuit board according to claim 1, wherein the conductor circuit formed on the electronic base material is a smoothing circuit. 6. The printed circuit board manufactured according to claim 1,
A method of manufacturing a component-embedded printed circuit board, comprising a double-sided board, a multilayer board, a build-up board, and a heat dissipation board. 7. A printed circuit board manufactured according to claim 1, wherein:
The multi-component metals formed at the connection parts of electronic parts are tin / silver based, tin / silver / bismuth / copper based, tin / zinc / bismuth based, tin / indium based, tin / gold based, and conductor circuit connecting parts. The component-embedded print characterized in that the metal element other than lead or a lead-free alloy formed in is a single metal of tin, silver, copper, nickel, or gold, or an alloy containing one of these elements and containing no lead. Circuit board manufacturing method. 8. A conductor circuit and an electronic component are fixedly connected by connecting an electronic component to a desired portion of a conductor circuit formed on an electronic base material, and disposing an insulating resin layer thereon and integrally laminating it. Printed circuit board with built-in components.