JP2003051697A - Taping device - Google Patents
Taping deviceInfo
- Publication number
- JP2003051697A JP2003051697A JP2001236635A JP2001236635A JP2003051697A JP 2003051697 A JP2003051697 A JP 2003051697A JP 2001236635 A JP2001236635 A JP 2001236635A JP 2001236635 A JP2001236635 A JP 2001236635A JP 2003051697 A JP2003051697 A JP 2003051697A
- Authority
- JP
- Japan
- Prior art keywords
- storage groove
- tape
- storage
- chip component
- taping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Abstract
(57)【要約】 (修正有)
【課題】 認識に係る時間を減少させ、極力生産時間の
短縮化を図ること。
【解決手段】 インデックスユニットを介する回転盤2
0の90度回転に合わせて次のステーションに搬送さ
れ、更にその次の部品挿入ステーションに搬送される。
この搬送中において、認識カメラ16により搬送レール
4上のテープ本体3Aの3個の収納溝3Bを撮像する。
即ち、最左の収納溝3B内にチップ部品30が挿入され
たか否かの有無確認のためと、ひとつおいて最右の収納
溝3B内には挿入されていない(空である)ことの確認
及び当該最右の収納溝3Bの位置認識のために3個の収
納溝3Bを同時に撮像する。
(57) [Summary] (Modifications required) [Problem] To reduce the time required for recognition and reduce the production time as much as possible. SOLUTION: A rotary disk 2 via an index unit.
It is transported to the next station according to the 90-degree rotation of 0, and further transported to the next component insertion station.
During this conveyance, the recognition camera 16 images the three storage grooves 3B of the tape main body 3A on the conveyance rail 4.
That is, to check whether the chip component 30 has been inserted into the leftmost storage groove 3B, and to confirm that the chip component 30 has not been inserted (empty) in the rightmost storage groove 3B. In addition, the three storage grooves 3B are simultaneously imaged to recognize the position of the rightmost storage groove 3B.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、収納テープ内の各
収納溝にチップ部品を装填し、カバーテープで当該収納
溝上面の開口部を閉塞して成るテーピング装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a taping device in which a chip component is loaded in each storage groove in a storage tape and an opening on the upper surface of the storage groove is closed by a cover tape.
【0002】[0002]
【従来の技術】従来のこの種テーピング装置にあって
は、前記収納テープ内の収納溝にチップ部品を装填する
過程において、認識カメラによる撮像により挿入前の収
納溝を位置認識し、次に同じく前記認識カメラによる撮
像により挿入動作終了後の挿入部品の有無認識を行なっ
た後、該収納テープを搬送する。2. Description of the Related Art In a conventional taping device of this type, in the process of loading a chip component into the storage groove in the storage tape, the position of the storage groove before insertion is recognized by an image pickup by a recognition camera, and then the same. The storage tape is conveyed after the presence / absence of the inserted component is recognized after the insertion operation by the image pickup by the recognition camera.
【0003】[0003]
【発明が解決しようとする課題】しかし、前記認識カメ
ラによる撮像を2回しなければならず、生産に要する時
間が余計に掛かっていた。However, since the image pickup by the recognition camera has to be performed twice, it takes extra time for production.
【0004】そこで本発明は、認識に係る時間を減少さ
せ、極力生産時間の短縮化を図ることを目的とする。Therefore, an object of the present invention is to reduce the time required for recognition and shorten the production time as much as possible.
【0005】[0005]
【課題を解決するための手段】このため第1の発明は、
収納テープ内の各収納溝にチップ部品を順次装填し、カ
バーテープで当該収納溝上面の開口部を閉塞して成るテ
ーピング装置において、チップ部品供給部からチップ部
品を取出す吸着装填ノズルが所定間隔を存して配設され
て間欠回転する回転盤と、該回転盤の間欠回転中に既に
前記装填ノズルによりチップ部品が挿入された前記収納
テープの収納溝及び挿入前の収納溝を同時に撮像する認
識カメラとを設けたことを特徴とする。Therefore, the first invention is
In a taping device in which chip components are sequentially loaded into each storage groove in a storage tape and an opening on the upper surface of the storage groove is closed with a cover tape, suction loading nozzles that take out chip components from a chip component supply unit are arranged at predetermined intervals. Recognizing an image of the rotary disc that is installed and is rotated intermittently, and the storage groove of the storage tape in which the chip component has already been inserted by the loading nozzle and the storage groove before insertion are simultaneously imaged during the intermittent rotation of the rotary disc. A camera is provided.
【0006】第2の発明は、前記認識カメラはチップ部
品の有無の確認のため前記装填ノズルによりチップ部品
が挿入された前記収納テープの収納溝を撮像し、挿入前
の収納溝の位置の認識のため当該収納溝を撮像すること
を特徴とする。In a second aspect of the invention, the recognition camera images the storage groove of the storage tape in which the chip component is inserted by the loading nozzle to confirm the presence or absence of the chip component, and recognizes the position of the storage groove before insertion. Therefore, the storage groove is imaged.
【0007】[0007]
【発明の実施の形態】以下、本発明のテーピング装置の
実施形態について、図面を参照しながら説明する。先
ず、図1のテーピング装置の平面図に基づき、テーピン
グ装置について説明する。1はテーピング装置本体で、
この本体1に立設されたピンにテープ供給リール2が回
転可能に係止され、当該テープ供給リール2に巻装され
たテープ本体(キャリアテープとも称される。)3Aの
先端が、当該テープ本体3Aに図示しないプーリにより
適度なテンションを与えられ、搬送レール4を介して巻
取りリール5に固定されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a taping device of the present invention will be described below with reference to the drawings. First, the taping device will be described based on the plan view of the taping device in FIG. 1. 1 is the taping device body,
A tape supply reel 2 is rotatably locked to a pin erected on the main body 1, and a tip end of a tape main body (also referred to as a carrier tape) 3A wound around the tape supply reel 2 is the tape. Appropriate tension is applied to the main body 3A by a pulley (not shown), and the main body 3A is fixed to the take-up reel 5 via the transport rail 4.
【0008】そして、図示しない回転駆動系による当該
巻取りリール5の回転に合わせて順次テープ本体3Aが
所定量搬送されて(巻取りリール5に巻取られて)いく
間で、テープ本体3Aの収納溝3B内にチップ部品が挿
入され、更に所定位置まで搬送されて収納溝3B上面の
開口部をカバーテープ供給リール(図示せず)から供給
されるカバーテープ3Cで被覆した後、前記巻取りリー
ル5に巻取られていく。尚、上述したようにテープ本体
3Aと、これに設けられた収納溝3Bと、その上面に圧
着されるカバーテープ(トップテープ)3Cとでテープ
3が形成されるが、前記テープ本体3Aはボトムテープ
と間隔子とで形成される。Then, while the tape body 3A is sequentially conveyed by a predetermined amount (wound by the take-up reel 5) in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the tape body 3A The chip component is inserted into the storage groove 3B, further conveyed to a predetermined position, and the opening on the upper surface of the storage groove 3B is covered with a cover tape 3C supplied from a cover tape supply reel (not shown), and then the winding is performed. It is wound up on reel 5. As described above, the tape 3 is formed by the tape main body 3A, the storage groove 3B provided in the tape main body 3A, and the cover tape (top tape) 3C that is pressure-bonded to the upper surface of the tape main body 3A. It is formed by a tape and a spacer.
【0009】そして、部品装填装置10によるテープ本
体3Aの収納溝3B内へチップ部品が挿入された後、部
品検査機構(図示せず)により部品が検査され、そして
テープ圧着機構(図示せず)によりテープ本体3Aとカ
バーテープ3Cとが圧着され、巻取りリール5に巻き取
られることとなる。Then, after the chip component is inserted into the storage groove 3B of the tape body 3A by the component loading device 10, the component is inspected by the component inspection mechanism (not shown), and the tape crimping mechanism (not shown). As a result, the tape body 3A and the cover tape 3C are pressure-bonded to each other and wound on the take-up reel 5.
【0010】次に、前記部品装填装置10について、以
下図1及び図2を参照しながら説明する。先ず、駆動モ
ータ11AによりY方向に移動可能なY軸テーブル11
の上には駆動モータ12AによりX方向に移動可能なX
テーブル12が設けられ、該Xテーブル12の上に枠体
13が固定されている。そして、前記枠体13には取付
板14が固定されて、該取付板14の中央部にはインデ
ックスユニット15が、また前後部には対向して認識カ
メラ16及び認識カメラ17が設けられている。Next, the component loading apparatus 10 will be described below with reference to FIGS. 1 and 2. First, the Y-axis table 11 that can be moved in the Y direction by the drive motor 11A.
X on the top is movable by the drive motor 12A in the X direction.
A table 12 is provided, and a frame 13 is fixed on the X table 12. An attachment plate 14 is fixed to the frame body 13, an index unit 15 is provided at the center of the attachment plate 14, and a recognition camera 16 and a recognition camera 17 are provided at the front and rear portions so as to face each other. .
【0011】また、前記取付板14の下面には図示しな
い駆動モータにより前記インデックスユニット15を介
して間欠回転(90度間隔で)する回転盤20が設けら
れ、該回転盤20には複数個、例えば90度間隔で4個
配設された各装着ヘッド21に吸着装填ノズル22が配
設されている。On the lower surface of the mounting plate 14, there is provided a turntable 20 which is intermittently rotated (at intervals of 90 degrees) via the index unit 15 by a drive motor (not shown). For example, the suction loading nozzles 22 are arranged in each of the four mounting heads 21 arranged at intervals of 90 degrees.
【0012】尚、前記吸着装填ノズル22は図示しない
上下駆動モータにより装着ヘッド21が上下動可能に構
成されると共に、θ回転モータにより垂直線回りに回転
可能である。The suction loading nozzle 22 is constructed such that the mounting head 21 can be moved up and down by a vertical drive motor (not shown), and can be rotated around a vertical line by a θ rotation motor.
【0013】また、前記Xテーブル12の上には駆動モ
ータ24AによりY方向に移動可能なY軸テーブル24
が設けられ、更に該Y軸テーブル24の上には駆動モー
タ25AによりX方向に移動可能なX軸テーブル25が
設けられている。そして、該X軸テーブル25上は取付
部材26を介してチップ部品供給テーブル27が設けら
れ、該供給テーブル27上にはシート28に貼付された
ウエハがダイシングされて個々のチップ部品30に分割
された状態で固定するもので、この部品は裏面より突き
上げピン(図示せず)により突き上げられながら、取出
されるものである。A Y-axis table 24, which is movable in the Y direction by a drive motor 24A, is mounted on the X table 12.
Further, an X-axis table 25 movable in the X direction by a drive motor 25A is provided on the Y-axis table 24. A chip component supply table 27 is provided on the X-axis table 25 via a mounting member 26, and a wafer attached to a sheet 28 is diced on the supply table 27 and divided into individual chip components 30. In this state, the part is fixed while being pulled up from the back surface by a push-up pin (not shown).
【0014】図1における認識カメラ17の下方は部品
吸着(取出し)ステーションで、この図1の状態、即ち
回転盤20の移動中にチップ部品供給テーブル27上の
次に取出すべきチップ部品30を認識カメラ17で撮像
して当該チップ部品30の位置を認識し、移動してくる
吸着装填ノズル22の直下方位置に位置するよう前記Y
テーブル24及びXテーブル25を移動させ、この部品
吸着ステーションでチップ部品供給テーブル27上のチ
ップ部品30を前記吸着装填ノズル22が下降して吸着
して取出す。Below the recognition camera 17 in FIG. 1 is a component suction (take-out) station, which recognizes the next chip component 30 to be taken out on the chip component supply table 27 in the state of FIG. 1, that is, while the rotary table 20 is moving. The position of the chip component 30 is recognized by capturing an image with the camera 17, and the Y position is set so as to be positioned immediately below the moving suction loading nozzle 22.
The table 24 and the X table 25 are moved, and at this component suction station, the chip component 30 on the chip component supply table 27 is sucked down by the suction loading nozzle 22 and sucked out.
【0015】次にインデックスユニットを介する回転盤
20の90度回転に合わせて次のステーションに搬送さ
れ、更にその次の部品挿入ステーションに搬送される。
この搬送中において、認識カメラ16により搬送レール
4上のテープ本体3Aの3個の収納溝3Bを撮像する。
即ち、最左の収納溝3B内にチップ部品30が挿入され
たか否かの有無確認のためと、ひとつおいて最右の収納
溝3B内には挿入されていない(空である)ことの確認
及び当該最右の収納溝3Bの位置認識のために3個の収
納溝3Bを同時に撮像する。Next, it is conveyed to the next station in synchronization with the 90 ° rotation of the turntable 20 through the index unit, and further to the next component insertion station.
During this transportation, the recognition camera 16 images the three storage grooves 3B of the tape body 3A on the transportation rail 4.
That is, in order to confirm whether or not the chip component 30 has been inserted into the leftmost storage groove 3B, and to confirm that the chip component 30 has not been inserted (empty) into the rightmost storage groove 3B. Also, the three storage grooves 3B are simultaneously imaged in order to recognize the position of the rightmost storage groove 3B.
【0016】従って、撮像した後に認識処理回路(図示
せず)により当該最右の収納溝3Bの位置を認識処理
し、その結果に基づいて図示しない制御装置が前記Yテ
ーブル11の駆動モータ11A、Xテーブル12の駆動
モータ12A及び前記θ回転モータを補正制御し、真中
の収納溝3B内の適正位置に下降する吸着装填ノズル2
2によりチップ部品30を挿入することとなる。即ち、
この部品挿入ステーションでは、吸着装填ノズル22に
吸着されたチップ部品30を下方で待機している搬送レ
ール4上のテープ本体3Aの収納溝3B内に、回転盤2
0のXY方向の補正移動及び吸着装填ノズル22のθ方
向の補正移動により、適正な位置に挿入装填することが
できるものである。Therefore, after the image is picked up, a recognition processing circuit (not shown) recognizes the position of the rightmost storage groove 3B, and based on the result, a control device (not shown) drives the drive motor 11A of the Y table 11. The suction loading nozzle 2 that corrects and controls the drive motor 12A of the X table 12 and the θ rotation motor and descends to an appropriate position in the middle storage groove 3B.
2, the chip component 30 is inserted. That is,
At this component insertion station, the turntable 2 is placed in the storage groove 3B of the tape body 3A on the transport rail 4 on which the chip component 30 sucked by the suction loading nozzle 22 is waiting below.
By the correction movement of 0 in the XY directions and the correction movement of the suction loading nozzle 22 in the θ direction, the insertion and loading can be performed at an appropriate position.
【0017】そして、この挿入装填後に、図示しない回
転駆動系による当該巻取りリール5の回転に合わせて順
次テープ本体3Aが所定量搬送されて(巻取りリール5
に巻取られて)いく間に、部品検査機構が前記テープ本
体3Aの収納溝3B内に挿入された状態のチップ部品に
対して部品検査(例えば、電気特性検査等)を行い、テ
ープ圧着機構でチップ部品30の検査が終了したテープ
本体3Aとカバーテープ3Cとを圧着させて、テーピン
グを完了させるものである。After the insertion and loading, the tape main body 3A is successively conveyed by a predetermined amount in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown) (the take-up reel 5).
The tape crimping mechanism performs a component inspection (for example, an electrical characteristic inspection) on the chip component inserted in the storage groove 3B of the tape main body 3A while the tape crimping mechanism is used. Then, the tape body 3A and the cover tape 3C whose inspection of the chip component 30 has been completed are pressure-bonded to each other to complete taping.
【0018】尚、最左の収納溝3B内にチップ部品30
が挿入されたか否かの有無確認のため、前記認識カメラ
16の撮像に基づく認識処理の結果、挿入されていない
と判断された場合には、当該テーピング装置を停止する
ように前記制御装置が制御する。The chip component 30 is placed in the leftmost storage groove 3B.
In order to confirm whether or not the taping device has been inserted, if it is determined that the taping device has not been inserted as a result of the recognition processing based on the imaging by the recognition camera 16, the control device controls the taping device to be stopped. To do.
【0019】また、最右の収納溝3B内には既に挿入さ
れていると判断された場合にも、当該テーピング装置を
停止するように前記制御装置が制御する。Further, even when it is determined that the taping device has already been inserted into the rightmost storage groove 3B, the control device controls so as to stop the taping device.
【0020】以上本発明の実施態様について説明した
が、上述の説明に基づいて当業者にとって種々の代替
例、修正又は変形が可能であり、本発明はその趣旨を逸
脱しない範囲で前述の種々の代替例、修正又は変形を包
含するものである。Although the embodiments of the present invention have been described above, various alternatives, modifications or variations can be made by those skilled in the art based on the above description, and the present invention can be carried out in the above-mentioned various forms without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.
【0021】[0021]
【発明の効果】従来は、収納テープ内の収納溝にチップ
部品を装填する過程において、認識カメラによる撮像に
より挿入前の収納溝を位置認識し、次に同じく前記認識
カメラによる撮像により挿入動作終了後の挿入部品の有
無認識を行うようにしていたために、前記認識カメラに
よる撮像を2回しなければならず、生産に要する時間が
余計に掛かっていたが、本発明によれば、撮像を1回と
して認識に係る時間を減少させ、極力生産時間の短縮化
を図ることができる。According to the prior art, in the process of loading a chip component into the storage groove in the storage tape, the position of the storage groove before insertion is recognized by the image pickup by the recognition camera, and then the insertion operation is completed by the image pickup by the recognition camera. Since the presence / absence of the inserted component is to be recognized later, it is necessary to take the image by the recognition camera twice, which takes extra time for production, but according to the present invention, the image is taken once. As a result, the time required for recognition can be reduced, and the production time can be shortened as much as possible.
【図1】テーピング装置を示す平面図である。FIG. 1 is a plan view showing a taping device.
【図2】テーピング装置を示す左側面図である。FIG. 2 is a left side view showing a taping device.
1 テーピング装置本体 3 収納テープ 3A テープ本体 3B 収納溝 3C カバーテープ 10 部品装填装置 20 回転盤 21 装着ヘッド 22 吸着装填ノズル 30 チップ部品 1 Taping device body 3 storage tape 3A tape body 3B storage groove 3C cover tape 10 Parts loading device 20 turntable 21 mounting head 22 Suction loading nozzle 30 chip parts
───────────────────────────────────────────────────── フロントページの続き (72)発明者 別府 徹 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 Fターム(参考) 3E067 AA12 AB47 AC04 AC11 BA26A BB14A BC06A BC07A EA32 EB27 EC24 EC38 FA01 FC01 3F072 AA14 GA10 GE03 GE05 GE09 GG03 KC01 KC05 KC07 KC10 KC12 KD30 5E313 AA03 AA18 AA21 AA31 CC02 CC04 CD06 DD02 DD03 DD07 DD32 DD50 EE24 EE25 FF31 FG10 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Toru Beppu 2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture Within Yo Denki Co., Ltd. F term (reference) 3E067 AA12 AB47 AC04 AC11 BA26A BB14A BC06A BC07A EA32 EB27 EC24 EC38 FA01 FC01 3F072 AA14 GA10 GE03 GE05 GE09 GG03 KC01 KC05 KC07 KC10 KC12 KD30 5E313 AA03 AA18 AA21 AA31 CC02 CC04 CD06 DD02 DD03 DD07 DD32 DD50 EE24 EE25 FF31 FG10
Claims (2)
順次装填し、カバーテープで当該収納溝上面の開口部を
閉塞して成るテーピング装置において、チップ部品供給
部からチップ部品を取出す吸着装填ノズルが所定間隔を
存して配設されて間欠回転する回転盤と、該回転盤の間
欠回転中に既に前記装填ノズルによりチップ部品が挿入
された前記収納テープの収納溝及び挿入前の収納溝を同
時に撮像する認識カメラとを設けたことを特徴とするテ
ーピング装置。1. In a taping device in which chip components are sequentially loaded in respective storage grooves in a storage tape and an opening on the upper surface of the storage groove is closed by a cover tape, suction loading for removing chip components from a chip component supply section. A rotary disk having nozzles arranged at predetermined intervals and rotating intermittently, a storage groove of the storage tape in which chip components have already been inserted by the loading nozzle during the intermittent rotation of the rotary disk, and a storage groove before insertion. A taping device, which is provided with a recognition camera for simultaneously picking up images.
認のため前記装填ノズルによりチップ部品が挿入された
前記収納テープの収納溝を撮像し、挿入前の収納溝の位
置の認識のため当該収納溝を撮像することを特徴とする
請求項1に記載のテーピング装置。2. The recognition camera images the storage groove of the storage tape in which the chip component is inserted by the loading nozzle to confirm the presence or absence of the chip component, and stores the storage groove for recognizing the position of the storage groove before insertion. The taping device according to claim 1, wherein the groove is imaged.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001236635A JP4641678B2 (en) | 2001-08-03 | 2001-08-03 | Taping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001236635A JP4641678B2 (en) | 2001-08-03 | 2001-08-03 | Taping device |
Publications (2)
Publication Number | Publication Date |
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JP2003051697A true JP2003051697A (en) | 2003-02-21 |
JP4641678B2 JP4641678B2 (en) | 2011-03-02 |
Family
ID=19067862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2001236635A Expired - Fee Related JP4641678B2 (en) | 2001-08-03 | 2001-08-03 | Taping device |
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JP (1) | JP4641678B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9383089B2 (en) | 2008-06-24 | 2016-07-05 | Hongwu Yang | Heat radiation device for a lighting device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1013088A (en) * | 1996-06-25 | 1998-01-16 | Sony Corp | Taping device |
JP2001018911A (en) * | 1999-07-08 | 2001-01-23 | Rohm Co Ltd | Continuously taping apparatus for electronic component |
JP2001122216A (en) * | 1999-10-29 | 2001-05-08 | Sanyo Electric Co Ltd | Taping equipment and taping method |
-
2001
- 2001-08-03 JP JP2001236635A patent/JP4641678B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1013088A (en) * | 1996-06-25 | 1998-01-16 | Sony Corp | Taping device |
JP2001018911A (en) * | 1999-07-08 | 2001-01-23 | Rohm Co Ltd | Continuously taping apparatus for electronic component |
JP2001122216A (en) * | 1999-10-29 | 2001-05-08 | Sanyo Electric Co Ltd | Taping equipment and taping method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9383089B2 (en) | 2008-06-24 | 2016-07-05 | Hongwu Yang | Heat radiation device for a lighting device |
Also Published As
Publication number | Publication date |
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JP4641678B2 (en) | 2011-03-02 |
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