JP2003013338A - Glass fiber fabric for printed wiring boards, prepreg and laminate for printed wiring boards - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] Even if it is very thin, it exhibits good insulation reliability when impregnated with synthetic resin, and has a small ratio of synthetic resin to improve insulation reliability in the thickness direction. To provide excellent glass fiber fabrics. SOLUTION: This is a glass fiber woven fabric 3 for a printed wiring board comprising a warp yarn 1 and a weft yarn 2 in which a plurality of glass single fibers are converged, and the glass fiber woven fabric 3 is subjected to an opening process. It is configured so as to have predetermined characteristics by fiber processing.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a glass fiber woven fabric for a printed wiring board, a prepreg for a printed wiring board, and a laminated board.

[0002]

2. Description of the Related Art One prepreg in which a synthetic resin is coated and impregnated on a glass fiber woven fabric, and the impregnated synthetic resin provides a synthetic resin layer having a predetermined thickness above and below the glass fiber woven fabric. A laminated board obtained by laminating and pressing a copper foil on the surface layer using the above is a printed wiring board (a printed circuit is formed on the copper foil provided on the laminated board).
As the lightness, thinness, and shortness of the product continue to advance, it is required to be as thin as possible and yet have excellent insulation reliability.

In order to form this laminated plate as thin as possible, it is necessary that the prepreg constituting the laminated plate is thin, that is, the glass fiber woven fabric and the synthetic resin layer constituting the prepreg are as thin as possible.

However, there is a limit in reducing the thickness of the synthetic resin layer. For example, when the thickness of the synthetic resin layer existing above and below the glass fiber woven fabric is zero, the glass fiber woven fabric is exposed and comes into contact with the copper foil, and copper ions from the exposed portion are added to the glass fiber of the glass fiber woven fabric. Easy to grow along (conductiveive anodonic film)
A phenomenon called ent. Hereinafter referred to as CAF. ) This C
Due to AF, the insulating property deteriorates. Thus, the insulating properties of the laminated plate are strongly influenced by the thickness of the surface synthetic resin layer.
Therefore, in the laminated board for a printed wiring board, it is desirable that the synthetic resin layer has a thickness of 3 (μm) or more on the glass fiber fabric.

Therefore, in order to obtain a thin laminated plate, not only a method of thinning a synthetic resin layer but also a method of using a glass fiber woven fabric as thin as possible must be adopted.

However, when using a glass fiber woven fabric that is as thin as possible, attention must be paid to the following points a to c.

A It is difficult for voids to exist when the laminate is used. The void is a void in which neither glass fiber nor synthetic resin is present when a glass fiber woven fabric is impregnated with synthetic resin. When a void is present, water is likely to be accumulated in the void and CAF is likely to occur. , The insulation reliability will be reduced.

B When a laminated plate is used, the surface should be smooth and should not be scratched. The scrape is a phenomenon in which the glass fiber woven fabric is exposed from the synthetic resin by the pressing when forming the laminated plate, and tends to occur when the warp of the warp or the weft is large.

C When the laminated plate is used, the ratio of the synthetic resin in the space of the glass fiber woven fabric × the predetermined area is small. If the ratio of synthetic resin in the laminated plate is large, the coefficient of thermal expansion in the thickness direction becomes high, and the reliability of through holes and the
The reliability of the connection with the chip will decrease, and the warpage that occurs when the synthetic resin cures will increase.

Therefore, in order to prevent such a problem from occurring, a glass fiber woven fabric is used that has been subjected to a fiber-opening process (a process of separating warp yarns and weft yarns).

However, in the conventional glass fiber woven fabric subjected to the opening treatment, the above problems a to c do not occur only when the mass per unit area of the glass fiber woven fabric exceeds a certain level. In the glass fiber woven fabric having a small mass per area, the above problems a to c are likely to occur. this is,
In a glass fiber woven fabric with a light mass per unit area, the gap between the threads (the eye formed by the warp and the weft)
Is inevitably large, voids occur, or synthetic resin is filled in this space, the synthetic resin layer of the surface layer of the glass fiber woven fabric is insufficient, and the scrape occurs, or the ratio of synthetic resin when used as a laminated plate. This is because, in particular, the above-mentioned c is specifically explained. Glass specific gravity (density) = 2.54 × 10 ³ (kg / m ³ ), synthetic resin specific gravity (density) = 1.20 × In the case of a laminated plate of 10 ³ (kg / m ³ ), the laminated plate mass per unit area, and the mass ratio of synthetic resin in the space of the glass fiber woven fabric × the predetermined area (%, hereinafter referred to as RCmin), Is as shown in Table 1 below.
The ratio of the synthetic resin is calculated when the glass fiber woven fabric is impregnated with the synthetic resin.

[0012]

[Table 1]

That is, the lighter the mass per unit area of the glass fiber woven fabric, the greater the RCmin, and the greater the problem of c.

Further, the problem of the above-mentioned item c becomes remarkable when the synthetic resin layers are formed on the upper and lower sides of the glass fiber fabric with a predetermined thickness. That is, for example, the mass per unit area and the ratio (R of the synthetic resin in the laminated plate when the synthetic resin is applied and impregnated to have a thickness of 3 (μm) above and below the glass fiber fabric
C6 μm) is as shown in Table 2 below.

[0015]

[Table 2]

Therefore, the conventional glass fiber woven fabric can satisfy the above condition c when the mass of the glass fiber woven fabric per unit area is 0.100 (kg / m ² ) or more.

However, as described above, with the further lightening, thinness and shortness of the laminated board, there is a current demand in the printed wiring board industry for a thinner glass fiber woven fabric or prepreg.

The present invention has been accomplished in view of the above circumstances, and a glass fiber woven fabric provided with specific conditions is a glass fiber woven fabric that is very thin, has a smooth surface, and has very few voids. Therefore, it is suitable for an extremely thin printed wiring board, and it was achieved by confirming that a laminated plate for an extremely thin printed wiring board can be obtained by using the glass fiber woven fabric.

[0019]

The gist of the present invention will be described with reference to the accompanying drawings.

A glass fiber woven fabric 3 for a printed wiring board, comprising a warp yarn 1 and a weft yarn 2 in which a plurality of glass monofilaments are bundled, and the glass fiber woven fabric 3 is subjected to an opening treatment. The present invention relates to a glass fiber woven fabric for a printed wiring board, which is configured to have the following characteristics by treatment. Note 16 x 10 ^-3 ≤ A ≤ 80 x 10 ^-3 60 ≤ X <100 90 ≤ Y ≤ 100 47 ≤ Vmin ≤ 61 Vmin = [1- (1 / B) x A / D] x 100 However, A = Mass per unit area of the glass fiber woven fabric 3 (kg / m ² ) B = Specific gravity of glass of glass single fiber (= density, kg / m ³ ) D = Thickness of the glass fiber woven fabric 3 (m) X = Warp yarn 1 open ratio (%) = ratio of the total width of the warp threads 1 in the predetermined width of the glass fiber fabric 3 Y = open ratio of the weft yarn 2 (%) = width of the weft yarn 2 in the predetermined length of the glass fiber fabric 3 Proportion of total Vmin = proportion (%) of voids that can be impregnated with the synthetic resin 4 in a space of a predetermined area of the glass fiber woven fabric 3 × D. Further, in the glass fiber woven fabric for a printed wiring board according to claim 1, a single glass fiber The present invention relates to a glass fiber woven fabric for a printed wiring board, which has a diameter of 7 (μm) or less.

Further, in the glass fiber woven fabric for a printed wiring board according to any one of claims 1 and 2, the same yarn is used as the warp yarn 1 and the weft yarn 2 for the printed wiring board. The present invention relates to a glass fiber woven fabric.

Further, in the glass fiber woven fabric for a printed wiring board according to any one of claims 1 to 3, the glass fiber woven fabric 3 woven by a plain weave is adopted. The present invention relates to a glass fiber woven fabric for a wiring board.

A prepreg for a printed wiring board, characterized in that the glass fiber woven fabric 3 for a printed wiring board according to any one of claims 1 to 4 is coated and impregnated with a synthetic resin 4. It is a thing.

A prepreg 6 for a printed wiring board, which is obtained by impregnating a synthetic resin 4 into a glass fiber woven fabric 3 composed of a warp yarn 1 and a weft yarn 2 in which a plurality of glass single fibers are bundled. The prepreg 6 is as follows. The present invention relates to a prepreg for a printed wiring board, which is characterized by having the following characteristics. 16 × 10 ⁻³ ≦ A ≦ 80 × 10 ⁻³ 60 ≦ X <100 90 ≦ Y ≦ 100 α ≦ RCmin ≦ β RCmin = [(D−A / B) × G] / [(D−A / B ) ×
2.54 × 10 ³ × A / B] × 100 α = −2 × 10 ⁻⁶ × G ² + 2.23 × 10 ⁻² × G + 6.75 β = −3 × 10 ⁻⁶ × G ² + 2.63 × 10 ^{− 2} × G + 15.20 However, A = mass per unit area of the glass fiber woven fabric 3 (kg / m ² ), B = specific gravity of glass single glass fiber (= density, kg / m ³ ) D = glass fiber woven fabric 3 Thickness (m) G = specific gravity of the impregnated synthetic resin 4 (= density, kg / m ³ ) X = openness of warp yarn 1 (%) = width of warp yarn 1 in a given width of glass fiber fabric 3 Proportion of total Y = Opening ratio (%) of weft yarn 2 = Percentage of total width of weft yarn 2 in a predetermined length of glass fiber woven fabric RCmin = Predetermined area of glass fiber woven fabric 3 x Proportion of synthetic resin 4 in a space of D (%) Further, a conductive material 5 is laminated on at least one of upper and lower surfaces of the prepreg 6 for a printed wiring board according to any one of claims 5 and 6. On the board It is something.

A plurality of prepregs 6 for printed wiring board according to any one of claims 1 to 7 are laminated,
The present invention relates to a laminated plate, in which a conductive material 5 is laminated on at least one of upper and lower surfaces of the laminated body.

[0026]

The present invention summarizes the results of repeated experiments as the claims, and the mass per unit area (k
g / m ²⁾ is 16 × 10 ^{- 3} or more 80 × 10 ^-3 or less, the warp 1 Open繊率
(%) Is 60 or more and less than 100, and the open ratio (%) of weft 2 is 9
The ratio (%) of voids that can be impregnated with the synthetic resin 4 in a space having a predetermined area of the glass fiber woven fabric 3 and a thickness of 47 or more and 61 or less (these 47 and 61 are made of glass (Calculated from the ratio of the volume of the predetermined area of the textile fabric 3 x the thickness and the volume of the synthetic resin impregnable void.)
Even if it is very thin, it exhibits good insulation reliability when it is impregnated with the synthetic resin 4, and the insulation reliability in the thickness direction is small because the proportion of the synthetic resin 4 is small. It has been confirmed that it is suitable for a printed wiring board, which is also excellent.

Since the present invention is configured as described above, it is a technique for obtaining a very thin printed wiring board.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings illustrate one embodiment of the present invention and will be described below.

The present embodiment is a glass fiber woven fabric 3 for a printed wiring board, which comprises a warp yarn 1 and a weft yarn 2 in which a plurality of glass single fibers are bundled, and the glass fiber woven fabric 3 is subjected to an opening treatment. By this opening treatment, the following characteristics are exhibited. Note 16 x 10 ^-3 ≤ A ≤ 80 x 10 ^-3 60 ≤ X <100 90 ≤ Y ≤ 100 47 ≤ Vmin ≤ 61 Vmin = [1- (1 / B) x A / D] x 100 However, A = Mass per unit area of the glass fiber woven fabric 3 (kg / m ² ) B = Specific gravity of glass of glass single fiber (= density, kg / m ³ ) D = Thickness of the glass fiber woven fabric 3 (m) X = Warp yarn 1 open ratio (%) = ratio of the total width of the warp threads 1 in the predetermined width of the glass fiber fabric 3 Y = open ratio of the weft yarn 2 (%) = width of the weft yarn 2 in the predetermined length of the glass fiber fabric 3 Proportion of total Vmin = proportion of voids that can be impregnated with the synthetic resin 4 in a space of a predetermined area of the glass fiber woven fabric 3 × D (%) The warp thread 1 and the weft thread 2 are a predetermined number of ordinary glass monofilaments (glass monofilaments) The glass yarn is formed by converging a predetermined number of glass yarns.

The nominal diameter of glass monofilament is E
The following, that is, a diameter of 7 (μm) or less is adopted. In addition, as for this glass single fiber, a nominal diameter of B is currently put into practical use, that is, a diameter of 3 (μm) or more is practically used. The smaller the diameter, the thinner the glass fiber woven by the opening treatment. 3 will be obtained.

The warp yarn 1 and the weft yarn 2 are made of the same yarn.

As the glass fiber woven fabric 3, a warp yarn 1 and a weft yarn 2 woven by plain weaving are used, which are subjected to an opening treatment. A normal weaving machine is used for this weaving.

Mass per unit area of the glass fiber woven fabric 3
(kg / m ² ) is 16 × 10 ⁻³ or more and 80 × 10 ⁻³ or less, but the smaller the value, the thinner the glass fiber woven fabric 3 is. For example, at 23 × 10 ⁻³ , the thickness is 21 (Μm) is obtained.

In addition, CSP (Chi
In an ultra-thin laminated plate such as p Size / Scale Package), 4 layers of synthetic resin are present on the upper and lower sides of the glass fiber woven fabric 3 in a thickness of 3 μm or more, and the glass fiber woven fabric 3 and the synthetic resin are used as a laminated plate. Sum of thickness of 4 layers is 30μ
Since the thickness is required to be m or less, in this case, the thickness of the glass fiber woven fabric 3 should be 24 (μm) or less.

The warp yarn 1 has an opening ratio of 60 or more and less than 100 (%) and the weft yarn 2 has an opening ratio of 90 or more and 100 or less (%). For example, only one of the warp yarn 1 and the weft yarn 2 is opened. When the fiber is fine, the thickness on the side not opened is thick and the swell does not become so small.
Cannot be filled.

Vmin of the glass fiber woven fabric 3 is 47 or more and 61 or less, but when it is more than 61, the ratio of the impregnated synthetic resin 4 is too large and the through hole reliability and the connection reliability with the chip are high. Of the glass fiber woven fabric 3 is very thick, but thin ones such as those used for printed wiring boards cannot be produced. In addition, as for the Vmin, the lighter the mass of the glass fiber woven fabric 3, the larger the proportion of the voids in which the synthetic resin 4 can be impregnated tends to increase (for example, the proportion of the eyes formed by the warp threads 1 and the weft threads 2 increases. ), It becomes difficult to satisfy the above numerical values.

Specific examples of the opening process include the following two methods.

<First opening treatment method> The warp yarn 1 of the woven glass fiber woven fabric has an excessive tension (0.15 per warp yarn).
To 0.27 N), the weft yarn 2 is intensively opened by pressing the glass fiber fabric against an appropriate roller while rubbing it and rubbing it, and then the glass fiber fabric. A support material (for example, a net having holes arranged in parallel) is arranged in a laminated state on one surface or both upper and lower surfaces of the glass fiber woven fabric so that tension does not act, that is, in a tension-free state, and the support material is pulled. A method in which the support material and the glass fiber woven fabric are brought into contact with a rotating roller in which liquid is squeezed out from the surface to intensively open the warp yarn 1.
Note that, hereinafter, the opening of the first warp yarn 1 to which excessive tension is applied is referred to as pressing opening, and the opening with the support material provided is referred to as tension-free opening.

In this first opening treatment method, since excessive tension is applied to the warp yarn 1 during the pressure opening, the warp of the warp yarn 1 up and down becomes small, and therefore the warp yarn 1 The force that restrains the weft yarn 2 due to the undulation is small, and the weft yarn 2 is in a state in which the weft yarn 2 is very easily opened, so that the weft yarn 2 is favorably opened. Further, at the time of this pressure opening, the warp yarn 1 is prevented from opening the warp yarn 1 by the excessive tension, and the contact area of the intersecting portion between the warp yarn 1 and the weft yarn 2 does not increase so much. The small size prevents the opening of the weft yarn 1 as much as possible, and in this respect also, the opening of the weft yarn 2 proceeds well.

Further, during tension-free opening, no tension acts on the warp yarn 1 and the weft yarn 2 when pulling the glass fiber woven fabric, so that the above-mentioned pressing opening is not affected by the tension. It is possible to open the warp yarn 1 which has not been opened during the fiber-making. That is, for example, when a glass fiber woven fabric is directly pulled in the longitudinal direction of the warp yarn 1, the tension acting on the warp yarn 1 due to this movement is perpendicular to the direction in which the warp yarn 1 spreads, and therefore the tension of the warp yarn 1 Although opening will be hindered, according to the opening with the support material arranged, the tension due to this pulling does not act on the glass fiber woven fabric, so the opening is not hindered by the tension, and therefore, , Opening of the warp yarn 1 proceeds well. Further, in the tension-free opening, when the supporting material is arranged only on one surface of the glass fiber woven fabric, the supporting material is on the opposite side of the rotating roller.

In this first opening treatment method, for example, a roller is arranged in a bath, and a large number of liquid outlets are provided on the outer peripheral surface of the roller, and the glass fiber woven fabric is attracted to the roller while the glass is blown onto the roller. A method of pressing the fiber woven fabric to rotate the roller, and opening the warp yarn 1 and the weft yarn 2 by pressing the roller and the liquid pressure of the liquid blown out from the liquid outlet (so-called vibro washer method) and water. A conventional fiber-opening treatment method such as a jet method may be used together.

<Second opening processing method> An ultrasonic oscillator is provided in the bath, and the glass fiber woven fabric woven in the bath is passed and moved to open the glass fiber woven fabric. Sonic wave opening.). In addition, the distance between the ultrasonic oscillator, the moving glass fiber woven fabric, and the liquid surface is kept constant, and uniform opening is performed. Also, do not press the glass fiber fabric against the rollers that guide the movement of the glass fiber fabric in the bath. According to this ultrasonic opening, both the warp yarn 1 and the weft yarn 2 are opened simultaneously due to the vibration of the ultrasonic waves.

The specific conditions for this ultrasonic fiber opening are set, for example, such that the frequency of the ultrasonic oscillator is 28 kHz and the processing time is 5 to 15 (seconds).

As with the first opening treatment method, a conventional opening treatment method may be used in combination.

It has been confirmed that the first opening treatment method and the second opening treatment method are suitable for high opening efficiency when applied to a glass fiber woven fabric immediately after weaving. Also,
It has been confirmed that even if the glass fiber woven fabric before the heat cleaning treatment for removing the organic material (the sizing agent or the like) in which the glass single fibers are bundled is performed, the opening efficiency is high and it is suitable.

The glass fiber woven fabric 3 capable of exhibiting the above-mentioned characteristics by the opening treatment is used in the state of the prepreg 6 impregnated with the synthetic resin 4 such as epoxy resin.

The synthetic resin 4 is applied and impregnated in consideration of the thicknesses of the layers of the synthetic resin 4 formed on the upper and lower sides of the glass fiber woven fabric 3 when the laminated plate is formed. For example, in an ultra-thin substrate such as the CSP, the thickness of each layer of the synthetic resin 4 is 3
(Μm) or more so as to be coated and impregnated.

The prepreg 6 exhibits the following characteristics. 16 × 10 ⁻³ ≦ A ≦ 80 × 10 ⁻³ 60 ≦ X <100 90 ≦ Y ≦ 100 α ≦ RCmin ≦ β RCmin = [(D−A / B) × G] / [(D−A / B ) ×
2.54 × 10 ³ × A / B] × 100 α = −2 × 10 ⁻⁶ × G ² + 2.23 × 10 ⁻² × G + 6.75 β = −3 × 10 ⁻⁶ × G ² + 2.63 × 10 ^{− 2} × G + 15.20 However, A = mass per unit area of the glass fiber woven fabric 3 (kg / m ² ), B = specific gravity of glass single glass fiber (= density, kg / m ³ ) D = glass fiber woven fabric 3 Thickness (m) G = specific gravity of impregnated synthetic resin 4 (= density, kg / m ³ ) X = opening ratio of warp yarn 1 (%) = width of warp yarn 1 in a given width of glass fiber fabric 3 Proportion of total Y = Opening ratio (%) of weft yarn 2 = Proportion of total width of weft yarn 2 in a predetermined length of glass fiber woven fabric RCmin = Predetermined area of glass fiber woven fabric 3 × Ratio of synthetic resin 4 in space D (%) By the way, RCmin is composed of glass fiber woven fabric 3 and synthetic resin 4
Is assumed to be impregnated with, and the ratio of the impregnated synthetic resin 4 is calculated. The ratio of the synthetic resin 4 impregnated in the glass fiber woven fabric 3 is the same as the ratio of the synthetic resin 4 laminated on and below the glass fiber woven fabric 3 (that is, the glass fiber woven fabric 3).
Area x thickness. Refer to the code RCmin in FIG. ), Determined by the properties of the glass fiber fabric 3.

Therefore, for example, a general-purpose epoxy resin containing no filler is adopted as the impregnating synthetic resin 4,
When E glass, which is generally used for printed wiring boards, is adopted as the glass used, the specific gravity of the synthetic resin =
1.20 × 10 ³ (kg / m ³ ), specific gravity of E glass = 2.54
Since it is × 10 ³ (kg / m ³ ), RCmi is calculated by the following formula.
n can be calculated.

RCmin = [(D−A / 2.54 × 10 ³ ) × 1.2 ×
10 ³ ] / [(D−A / 2.54 × 10 ³ ) × 1.2 × 10 ³ + 2.54 × 10 ³
× A / 2.54 × 10 ³ ] × 100 = (1.524 × 10 ⁵ × D−6.7 × 10 × A) × 100 / (1.524 × 10 ⁵
× D + 6.7 × 10 × A) × 100 Further, if Vmin at this time is 47 and 60, α. β and R
Cmin is as follows.

Α = 30 β = 42 30 ≦ RCmin ≦ 42 The meaning of RCmin is the same as that of Vmin. Therefore, the upper limit value β and the lower limit value α of RCmin are
They correspond to Vmin of 61 and 47, respectively. Also, this RCm
Both in and Vmin are such that when the prepreg 6 is obtained by impregnating the glass fiber woven fabric 3 with the synthetic resin 4, the prepreg 6 maintains the insulation reliability required for the printed wiring board, and The amount of impregnation is small, the coefficient of thermal expansion in the thickness direction of the laminate is appropriate, the reliability of through holes and the reliability of connection with chips are not impaired, and the warpage that occurs when the synthetic resin 4 is cured is large. It is a value indicating the range where the dimensional stability such as not becoming excellent is excellent.

One or a plurality of the prepregs 6 are laminated with an electrically conductive material 5, for example, copper foil to form a laminated plate.

In the obtained laminated plate, the glass fiber woven fabric 3 has a substantially uniform thickness, and the synthetic resin 4 laminated on and under the glass fiber woven fabric 3 has substantially the same thickness. Thus, the properties required for the laminated plate can be exhibited well.

As described above, in this embodiment, the mass of the glass fiber woven fabric 3, the ratio of the synthetic resin 4 which can be impregnated into the glass fiber woven fabric 3, and the opening ratio of the warp yarn 1 and the weft yarn 2 are properly set. Therefore, the prepreg 6 is extremely thin and suitable for a printed wiring board.

Experimental results confirming the effects of the present embodiment will be described in detail below.

The glass fiber fabric used is as shown in Table 3 below. The glass fiber woven fabric used was manufactured by Arisawa Manufacturing Co., Ltd.

[0057]

[Table 3]

Experiments were conducted on these glass fiber fabrics, and the results shown in Tables 4 to 8 below were obtained.

[0059]

[Table 4]

[0060]

[Table 5]

[0061]

[Table 6]

[0062]

[Table 7]

[0063]

[Table 8]

Comparative Example 1 was not subjected to the fiber-spreading treatment, Comparative Example 2 was subjected to the fiber-spreading treatment by the Vibro-Washer method, and Comparative Example 3 was the fiber-spreading treatment using only the pressure fiber-spreading. The applied one, Experimental Example 1 is the one subjected to the opening processing of the first opening processing method, and Experimental Example 2 is the one subjected to the opening processing of the second opening processing method. In addition, the method of performing the fiber-spreading treatment after the weaving of the glass fiber woven fabric 3 and before the heat cleaning was adopted.

In addition, the HAST test was conducted on the glass fiber fabric 3
Was impregnated with epoxy resin varnish to a predetermined RC and dried to obtain prepreg 6, and 18 (μm) copper foil was laminated on the upper and lower sides of one prepreg 6 and 170 (° C.), 40
(Kg / cm ² ) to obtain a laminated plate by heating and pressurizing, leaving a part of the copper foil at the center of the laminated plate, and removing the remaining copper foil by etching to make the remaining copper foil an electrode connection part, 85 (℃),
This is an insulation reliability evaluation in which a voltage of 100 (V) was applied under a humidified heat condition of 85 (%) and the resistance value in the volume direction was measured. A sample having a resistance value of 1 × 10 ⁸ (Ω) or more after 400 hours had passed was marked as ◯.

As is clear from Tables 4 to 8, the prepreg 6 obtained from the glass fiber woven fabric 3 subjected to the opening treatment by the first opening treatment method or the second opening treatment method has a mass per unit area. Opening rate and RCmi of warp yarn 1 and weft yarn 2
It was confirmed that n satisfies the numerical value of the above formula and exhibits good insulation reliability even if it is thin.

Therefore, according to the above experimental results, it was confirmed that the prepreg 6 obtained from the glass fiber woven fabric 3 of this example exhibits good insulation reliability even if it is thin.

[Brief description of drawings]

FIG. 1 is an explanatory plan view of a glass fiber woven fabric 3 of this embodiment.

FIG. 2 is an explanatory cross-sectional view of a laminated board of this example.

[Explanation of symbols]

1 warp thread 2 weft 3 glass fiber fabric 4 synthetic resin 5 Materials with electrical conductivity 6 prepreg

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akiko Yoshito             1-5-5 Minamihonmachi, Joetsu City, Niigata Prefecture Stock             Company Arizawa Factory (72) Inventor Hiroaki Nagashima             1-5-5 Minamihonmachi, Joetsu City, Niigata Prefecture Stock             Company Arizawa Factory F-term (reference) 4F072 AA02 AB09 AB15 AB28 AD23                       AG03 AH02 AL13                 4F100 AG00A AK01A AK53A AR00B                       AR00C BA02 BA03 BA06                       BA08 BA10B BA10C DG03A                       DG12A DH01A GB43 JG01B                       JG01C JK15 JL03                 4L048 AA03 AB10 AB11 BA01 BA02                       CA00 CA15 DA43 EB00

Claims (8)

[Claims] 1. A glass fiber woven fabric for a printed wiring board, comprising a warp yarn and a weft yarn in which a plurality of glass single fibers are bundled, wherein the glass fiber woven fabric is subjected to an opening treatment, and by this opening treatment A glass fiber woven fabric for a printed wiring board, which is configured to have the following properties. Note 16 x 10 ^-3 ≤ A ≤ 80 x 10 ^-3 60 ≤ X <100 90 ≤ Y ≤ 100 47 ≤ Vmin ≤ 61 Vmin = [1- (1 / B) x A / D] x 100 However, A = Mass per unit area of glass fiber fabric (kg / m ² ) B = Specific gravity of glass of glass single fiber (= density, kg / m ³ ) D = Thickness of glass fiber fabric (m) X = Warp opening Fineness (%) = ratio of the total width of warp threads in a predetermined width of the glass fiber fabric Y = ratio of weft opening (%) = ratio of the total width of weft threads in a predetermined length of the glass fiber fabric Vmin = glass fiber fabric Percentage of voids that can be impregnated with synthetic resin in the space of prescribed area x D (%) 2. The glass fiber woven fabric for a printed wiring board according to claim 1, wherein the glass single fiber has a diameter of 7 mm.
A glass fiber woven fabric for a printed wiring board, which has a thickness of (μm) or less. 3. The glass for a printed wiring board according to claim 1, wherein the same yarn is used as the warp yarn and the weft yarn in the glass fiber woven fabric for a printed wiring substrate according to claim 1. Textile fabric. 4. The glass fiber woven fabric for a printed wiring board according to claim 1, wherein the glass fiber woven fabric is a plain weave woven fabric. Fiberglass fabric for substrates. 5. A prepreg for a printed wiring board, wherein the glass fiber woven fabric for a printed wiring board according to any one of claims 1 to 4 is coated and impregnated with a synthetic resin. 6. A prepreg for a printed wiring board, which is obtained by impregnating a synthetic resin into a glass fiber woven fabric composed of warp yarns and weft yarns in which a plurality of glass single fibers are bundled, and the prepreg has the following characteristics. A prepreg for a printed wiring board, which is characterized in that 16 × 10 ⁻³ ≦ A ≦ 80 × 10 ⁻³ 60 ≦ X <100 90 ≦ Y ≦ 100 α ≦ RCmin ≦ β RCmin = [(D−A / B) × G] / [(D−A / B ) ×
2.54 × 10 ³ × A / B] × 100 α = −2 × 10 ⁻⁶ × G ² + 2.23 × 10 ⁻² × G + 6.75 β = −3 × 10 ⁻⁶ × G ² + 2.63 × 10 ^{− 2} x G + 15.20 where A = mass of glass fiber fabric per unit area (kg / m ² ) B = specific gravity of glass monofilament glass (= density, kg / m ³ ) D = thickness of glass fiber fabric (M) G = Specific gravity of impregnated synthetic resin (= Density, kg / m ³ ) X = Opening ratio (%) of warp yarn = Ratio of total warp yarn width in a given width of glass fiber fabric Y = Weft yarn Open ratio (%) = ratio of total width of weft threads in a predetermined length of glass fiber fabric RCmin = ratio of synthetic resin in a predetermined area of glass fiber fabric x D space (%) 7. A laminate having a conductive material laminated on at least one of the upper and lower surfaces of the prepreg for a printed wiring board according to any one of claims 5 and 6. 8. A plurality of prepregs for printed wiring boards according to claim 1, wherein a plurality of prepregs are laminated, and an electrically conductive material is laminated on at least one of upper and lower surfaces of the laminate. Laminated board characterized by being.