JP2003004963A - Optical packaging substrate and image forming device as well as position control method for optical packaging substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical packaging substrate which is capable of dealing with the trends toward the higher density and larger size of the substrate, is strong even to an environment change, such as a temperature change in packing the substrate with ICs, can be easily positioned without enhancing its accuracy and can be improved in the degree of freedom in wiring and an image forming device as well as a position control method for the optical packaging substrate. SOLUTION: This optical packaging substrate is constituted by forming a printed circuit board 10 disposed with a semiconductor IC 12 having a light emitting element 13 from which signal light is emitted and a light receiving element 15 in which the signal light is received by separating the ICs from each other. The substrate described above includes a light transmission layer (a space section 6) which is formed across the rear surface of the printed circuit board 10 and transmits the signal light emitted from the light emitting element 13 through the space to the light receiving element 15, a reflecting mirror 20 which reflects the signal light, a reflecting mirror 22 which reflects the signal light reflected by the reflecting mirror 20 so as to make the signal light incident toward the light receiving element 14, a photosensor which is disposed at the light receiving element 15 and a control section 50 which regulates and controls the reflecting surface of the reflecting mirror 20 in accordance with the result detected by the photosensor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical mounting board, and more particularly to an optical mounting board for propagating signal light, an image processing apparatus using the optical mounting board, and a position control method for the optical mounting board.

[0002]

2. Description of the Related Art Conventionally, in a circuit board on which various integrated circuits (ICs) such as CPU and memory and system LSI are mounted, performance such as operating frequency (or processing speed) and circuit function of CPU and memory are provided. Each I with the improvement of
There has been a need for high-speed transmission of electric signals in electric wiring such as a data bus connecting Cs with a bus structure.

Therefore, the bus connecting the ICs must be
The operating speed of the bus is being improved by shortening the electrical wiring and promoting differential transmission.

However, in the method of shortening the wiring distance, various problems such as impedance mismatch and crosstalk occur, and when the wiring distance has to be lengthened due to a change or addition of a system, high speed transmission is impossible. The signal delay causes the system processing speed to be limited by the operating speed of the bus.

That is, when the distance between the ICs according to the operating frequency of the CPU reaches a limit, and a high-speed CPU is mounted on the board, it is attempted to increase the signal transmission speed by electric wiring, the wiring length and It can only be achieved in a fixed shape.

Also in the circuit board used for an image forming apparatus or the like, even when the image reading clock becomes faster as the resolution of the CCD increases, similarly, the pattern design of the electric wiring becomes very difficult. .

In addition, electromagnetic noise (EMI: Electr) due to high-density bus connection wiring and high-speed system operation
The problem of "organic interference" is also a major limitation for improving the processing speed of the system. In particular, in a substrate such as a high-density mounting (MCM: multi-chip module) or a system LSI, since the data transfer speed (electric signal transmission speed) is increased,
EMI countermeasures become difficult.

In order to solve such a problem and improve the operating speed of the bus, an optical transmission technique is used in the circuit board, and the high-speed transmission portion in the board is changed from an electric signal to an optical signal. Transmission is attempted.

For example, a method of applying a transmission system in which each IC is connected by an optical fiber to a data bus or a light guide path (optical waveguide)
Various forms have been proposed depending on the configuration contents of the circuit board such as a method using the above.

[0010]

However, the method using an optical fiber has a problem that the wiring layout is limited and it is difficult to increase the density.

Further, the method using the light guide has a problem that it is difficult to use when the wirings cross each other and the degree of freedom of the wirings is low. Further, when a member such as quartz is used, there is a problem that it cannot be used for a large substrate.

Furthermore, when an IC chip or the like is mounted on a substrate, accumulated errors including mounting errors and dimensional errors in mounting, variations in the wavelength of a laser which is signal light according to each IC, and various types. It is conceivable that complicated alignment may be required to optically and precisely couple the light emitting element / light receiving element due to warpage of the substrate due to environmental changes.
In particular, if the accuracy of such alignment is increased, the cost will increase.

The present invention has been made in view of the above circumstances, and an object of the present invention is to cope with higher density and larger size of a board, and when mounting an IC on the board, there is no change in temperature. To provide an optical mounting substrate, an image forming apparatus, and a position control method for the optical mounting substrate, which are resistant to environmental changes, can be easily implemented without increasing the positioning accuracy, and can improve the degree of freedom of wiring. is there.

[0014]

In order to achieve the above object, the invention according to claim 1 is a first integrated circuit having a light emitting portion for emitting signal light, and the signal light is received. And a second integrated circuit having a light receiving portion, the light emitting portion being formed on a back surface of the substrate layer, the light emitting portion emitting light from the light emitting portion. It is characterized by having an optical transmission layer for transmitting the generated signal light to the light receiving section through a space.

Further, the invention according to claim 2 includes a first integrated circuit having a light emitting portion for emitting signal light and a second integrated circuit having a light receiving portion for receiving signal light. An optical mounting substrate formed by forming substrate layers arranged apart from each other, for propagating signal light emitted from the light emitting unit to the light receiving unit, which is formed over the back surface of the substrate layer. An optical transmission layer that forms a space, a guide unit that reflects the signal light from the light emitting unit in the optical transmission layer and guides the signal light to the light receiving unit, and the light receiving unit that is provided in the light receiving unit It is characterized by including a detection means for detecting the incident position of the optical axis of the signal light, and a control means for adjusting and controlling the reflecting surface of the guide means based on the detection result by the detection means.

The invention according to claim 4 includes a first integrated circuit having a light emitting portion for emitting signal light, and a second integrated circuit having a light receiving portion for receiving signal light. An optical mounting substrate formed by forming substrate layers arranged apart from each other, for propagating signal light emitted from the light emitting unit to the light receiving unit, which is formed over the back surface of the substrate layer. An optical transmission layer forming a space, a first optical element formed in the optical transmission layer at a position where the signal light from the light emitting unit can be received, and reflecting the emitted signal light; Second optical element that reflects the signal light reflected by the optical element so that the signal light is incident on the light receiving section, and the optical axis of the signal light is incident on the light receiving section. Based on the detection means for detecting the position and the detection result by the detection means Control means for adjusting and controlling the first optical element, wherein the first optical element is formed of a diffractive optical element, and the control means adjusts a pitch of each slit of the diffractive optical element. It is characterized by controlling.

According to a seventh aspect of the present invention, there is provided an optical mounting board having a substrate layer in which at least two integrated circuits each having a light emitting / receiving section for receiving / emitting signal light are arranged apart from each other. Which is formed over the back surface of the substrate layer,
It is characterized in that it has an optical transmission layer for transmitting signal light between each of the light receiving and emitting parts through a space.

Further, the invention according to claim 8 is an image forming apparatus comprising the above-mentioned optical mounting board, wherein the optical mounting board transmits an image for transmitting image data between the integrated circuits. It has a data bus, and the signal light is transmitted to the image data bus.

According to a ninth aspect of the present invention, the first and second integrated circuits that are processed at high speed and an image data bus for transmitting image data between the first and second integrated circuits are provided. An image forming apparatus comprising a control board having a control line for controlling power supply for supplying power to the first and second integrated circuits, wherein the image data bus includes:
The optical signal is transmitted and an electric signal is transmitted to the control line.

The invention according to claim 10 includes a first integrated circuit having a light emitting portion for emitting signal light, and a second integrated circuit having a light receiving portion for receiving signal light. A substrate layer disposed apart from each other, an optical transmission layer formed over the back surface of the substrate layer and forming a space for propagating the signal light emitted from the light emitting section to the light receiving section, A first optical element formed in a position capable of receiving the signal light from the light emitting unit in the light transmission layer and reflecting the emitted signal light; and the signal reflected by the first optical element. A second light reflecting member for making the light incident on the light receiving unit
And a position control method in an optical mounting substrate for controlling the incident position of the optical axis of the signal light with respect to the light receiving unit by controlling the direction of the reflection surface of the first optical element. Then, the step of scanning the signal light by a plurality of detection sensors for detecting the incident position of the optical axis of the signal light arranged in parallel in the light receiving unit, and the optical axis position of the signal light is Adjusting the reflecting surface of the first optical element so as to move toward the reference coordinates of the part, detecting a received light amount difference between each of the plurality of detection sensors, and based on the received light amount difference. And adjusting the reflection surface of the first optical element so that the optical axis position of the signal light moves toward the reference coordinates of the light receiving unit.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an example of a preferred embodiment of the present invention will be specifically described with reference to the drawings.

(First Embodiment) First, the structure of the optical mounting board of the present embodiment will be described with reference to FIG.
FIG. 1 is a sectional view showing an optical mounting board of the present invention.

As shown in FIG. 1, the optical mounting substrate 1 of the present embodiment includes, for example, a frame body 2 framed in a substantially rectangular shape, and a lower base material 4 mounted on one surface of the frame body 2. , A printed wiring board 10 constituting a substrate layer mounted on the other surface of the frame body 2, and semiconductor ICs 12 and 14 which are integrated circuits formed on the upper surface of the printed wiring board 10. . Then, each semiconductor I is used as an optical transmission layer for transmitting the signal light in the space 6 (free space) surrounded by the frame body 2, the lower base material 4, and the printed wiring board 10.
Optical data transmission between C12 and C14 is performed.

The space 6 spatially optically couples the semiconductor ICs 12 and 14 on the printed wiring board 10 and functions as an optical data bus for mutual transmission between the semiconductor ICs 12 and 14. That is, a space layer is provided for the printed wiring board 10 which is one board, and the space layer is used as a path for light. Here, there is no medium in the space portion 6, and air or vacuum may be used in the light transmission layer. However, in the air, light deteriorates as compared with the case where a medium such as quartz exists. It is preferable because it will not be attenuated.

Further, in the present embodiment, the distance required for optical transmission, that is, the distance between the semiconductor ICs 12 and 14 is a relatively long distance such as a signal delay for ordinary electrical wiring, for example, about 20 cm. An example assuming a case is disclosed.

The printed wiring board 10 has a semiconductor IC 1
Holes 11a and 11 for transmitting light are provided at positions corresponding to 2 and 14.
b, the reflection mirrors 20 and 22 are arranged below the printed wiring board 10 at positions corresponding to the holes 11a and 11b of the printed wiring board 10 in a state of being inclined at a predetermined angle. Has been done.

The semiconductor IC 12 is provided with a light emitting element 13 such as a semiconductor laser, and through a light transmitting hole 11a formed at a position corresponding to the semiconductor IC 12 on the printed wiring board 10. The laser beam B which is the signal light is formed so as to be emitted toward the position control reflection mirror 20. On the other hand, the semiconductor IC 14 is provided with a light receiving element 15 which is a light receiving portion for receiving the laser light B emitted from the light emitting element 13.

The reflection mirror 20 which is an optical element (polarization optical element) for position control is a mirror for position control which is arranged below the light emitting element 13 which is a light emitting portion, and its reflecting surface is rotated by rotating. Can be turned in any direction. The emitted laser light B is reflected in one direction by the reflection mirror 20 and output.

Here, when the laser light is reflected, the elements to be adjusted and controlled are the inclination of the optical axis of the laser light,
The height and the deviation in the plane direction are included. Further, when the reflection mirror 20 which is a polarization optical element is formed to have a length of 5 mm, for example, in order to tilt the control angle by 1 degree, it is necessary to move the reflection mirror 20 by 87.3 μm. The use of the reflection mirror 20 as the optical element for position control facilitates the manufacture.

On the other hand, the reflecting mirror 22 is preferably fixed at a predetermined angle. Here, the reflection mirror 20 corresponds to the “first optical element” of the present invention, and the reflection mirror 22
Corresponds to the “second optical element” in the present invention. Furthermore, the "guide means" of the present invention can be configured by the first optical element and the second optical element.

The optical mounting board of this embodiment is a so-called optical / electrical mixed board in which a semiconductor IC or the like is electrically driven and a bus line or the like transmits by an optical signal. Further, the "integrated circuit" referred to in the present invention or the present specification
The term “literally” means a so-called semiconductor integrated circuit or an IC chip, but in the present invention or the present specification, a module including a plurality of integrated circuits (CPU module, memory module, etc.), A module including one or a plurality of light emitting element ICs and various kinds of ICs, a module including one or a plurality of light receiving element ICs and various kinds of ICs, one or a plurality of light emitting element ICs, and one or a plurality of light emitting element ICs , A module including the light-receiving element IC and various ICs, an optical integrated circuit in which a light-emitting element such as a semiconductor laser and various ICs are integrally formed in a process (for example, on a Si substrate), a light-receiving element and various Optical integrated circuit in which each IC is integrally formed in a process, and optical integrated circuit in which a light emitting element, a light receiving element, a photoelectric conversion means, and various other ICs are integrally formed in a process Including VLSI and system LSI.

In the optical mounting board 1 having the above-mentioned structure, the laser light B emitted from the light emitting element 13 of the one semiconductor IC 12 is transmitted through the hole 11a and is reflected by the reflection mirror 2.
The light is reflected at 0 and 22, transmitted through the hole 11b, and received by the light receiving element 15.

At this time, the reflection surface of the reflection mirror 20 is adjusted so that the optical axis of the laser beam B does not deviate on the path of the light emitting element 13, the reflection mirrors 20 and 22, and the light receiving element 15. Become.

Here, the reflection mirror 20 is shown in FIG.
As shown in (B), for example, it is formed in a rectangular shape and has a short side and a long side, and is arranged so that the side seen in the cross-sectional view of FIG. 1 is the short side, for example. It is assumed that

In the following, an orthogonal coordinate system is set for the reflecting mirror, the propagation direction of the signal light is the Z axis, the direction perpendicular to the propagation direction of the signal light in the substrate plane is the X axis, and the direction perpendicular to the substrate surface. This direction is the Y axis. At this time, one of the two axes intersecting with each other on the plane forming the reflection mirror 20 (the direction perpendicular to the paper surface of FIG. 1) is the Y axis, and the other direction (parallel to the short side of the reflection mirror). Direction) is the X axis. As shown in FIG. 2, the reflection mirror 20 has θ1 about the Y axis.
In the direction, it is formed so as to be rotatable in the θ2 direction around the X axis, and the position adjustment is performed by the control in each of these directions.

In this example, it is assumed that only the reflection mirror 20 is positionally adjustable and the reflection mirror 22 is fixed in advance at a predetermined inclination angle.

Next, the structure of the control system for controlling the position adjustment of the reflection mirror 20 in the optical mounting board 1 as described above, which is a characteristic structure of this embodiment, will be described with reference to FIG. FIG. 2 is an explanatory diagram showing the configuration of the control system of the reflection mirror.

The control system 100 receives the reflection light from the reflection mirror 20 for position adjustment, a plurality of piezoelectric elements 21 for mirror control arranged on the back surface side of the reflection mirror 20, and the reflection mirror 22. A light receiving element 15 for position control, an arithmetic circuit 30 for calculating the light receiving position based on the light receiving signals S1 to S4 from the light receiving element 15, information relating to the light receiving position and the angle of the mirror corresponding to the light receiving position. A memory 40 that records various tables that describe the correspondence relationship with
And the reflection mirror 2 while referring to the table in the memory 40 based on the light reception signals S1 to S4 from the arithmetic circuit 30.
The control unit 50 is a control unit that outputs the piezoelectric element drive signals A1 to A3 according to the inclination angle of 0 and controls the drive of the piezoelectric element 21.

The light receiving element 15 is formed of, for example, a four-division photo sensor, and the light receiving signal S1 from each photo sensor is used.
~ S4 is input to the arithmetic circuit 30. That is, the light receiving element 15 has not only the function of receiving the laser light B from the light emitting element 13 and transmitting the signal light, but also the arithmetic circuit 30.
It also functions as a detecting means for detecting the light receiving position of the optical axis of the laser beam B by being combined with, and is also used in the position control.

If a photosensor having a large light receiving area with respect to the laser diameter of the laser light is used as the photosensor, it is possible to easily detect the position of the laser light at the time of coarse adjustment described later.

A piezoelectric element (P
For example, three ZT) 21 are formed on the back surface of the reflection mirror 20, and are disclosed as reference numerals 21a, 21b, and 21c (hereinafter sometimes referred to as piezoelectric elements 21a, 21b, and 21c) in FIG.

In addition to this, as a control element for position control, for example, a solenoid, a linear motor, a cam or the like may be used for control. Alternatively, even if it is a piezoelectric element, for example, an epitaxial PZT, a PZT piezo element, or a PL containing a few moles of La in PZT-based ceramics.
You may use ZT, another control element, etc.

In the example of FIG. 1, three piezoelectric elements 21 are disclosed on the back surface of the reflection mirror 20. In this case, the flatness of the reflecting surface of the reflecting mirror 20 is easily obtained, which is preferable. The number of piezoelectric elements formed on the back surface of the reflection mirror 20 is not limited to three, and may be plural, for example, four or two.

When four piezoelectric elements are formed, the control becomes simple, which is preferable. When two piezoelectric elements are formed, the number of parts can be minimized, and the cost can be reduced. In addition, when configuring two piezoelectric elements,
In the same structure as the case where three piezoelectric elements are formed, it is preferable that one certain point is fixed by a member other than the piezoelectric element (fixing member) and the other two points are constituted by the piezoelectric element.

When the reflection mirror 20 is adjusted in the θ2 direction about the X axis, for example, the piezoelectric elements 21a and 21b are driven to rotate the reflection mirror 20, or the piezoelectric element is rotated. 21c may be driven to rotate the reflection mirror 20.

When the reflection mirror 20 is adjusted in the θ1 direction about the Y axis, the piezoelectric elements 21a and 21c are driven to rotate the reflection mirror 20, or the piezoelectric element 21b. The piezoelectric element 21c may be driven to rotate the reflection mirror 20.

By combining these basic operations and driving the piezoelectric elements 21a, 21b, 21c, the reflecting surface of the reflecting mirror 20 can be oriented in any direction. Thus, the piezoelectric element should have at least 3
If there is a dot, control in the XYZ directions is possible.

When a piezoelectric element is used to control the direction of the reflection mirror, it is necessary to separately provide a dedicated wiring for controlling the piezoelectric element on the printed wiring board. For example, by using the back side of the printed wiring board, the control system IC
Make electrical wiring. In addition, the polarizing element such as the reflection mirror,
It is advantageous to have an element that is moved toward the printed wiring board side rather than the bottom side of the optical mounting board 1. This is because if it is on the bottom side, it is necessary to dispose a control circuit or the like on another control line or on the bottom side.

The control section 50 can also be made to have a high-speed response by being configured by a dedicated logic circuit. Further, of course, a CPU may be used.

In the control system 100 having such a structure, when the laser light B which is the signal light emitted from the light emitting element 13 is reflected by the reflection mirror 20 which is inclined at a predetermined angle, the laser light B concerned. Is received by the four-division photo sensor of the light receiving element 15.

At this time, the arithmetic circuit 30 sets the so-called coordinate system by extracting the end portions of the 4-division photo sensor in the X and Y directions and the center coordinates of the 4-division photo sensor.

When the laser beam B is received at a specific position on the light receiving surface of the light receiving element 15, the arithmetic circuit 30
Calculates which part of the four-division photo sensor the laser beam B is received on the basis of the detection result of the light receiving element 15. These pieces of information are stored in the memory 40.

Assuming that the position of the optical axis of the laser beam B is at the position T1 on the four-division photosensor, the position T
The control unit 50 controls the piezoelectric element 21 (21a, 21b, 2 so that 1 becomes the target position T2 of the optical axis corresponding to the center coordinate.
1c) is operated to control the direction of the reflection surface of the reflection mirror 20.

In this manner, the piezoelectric element 21 is controlled to move the light receiving position of the laser light B toward the center coordinates of the photo sensor. First, the optical axis of the laser light is divided into four photosensors. A position adjustment (so-called “coarse adjustment”, which will be described later in detail) is performed so that the optical axis enters the center of the photo sensor.

Further, the light receiving position of the laser beam B (optical axis)
In order to adjust the position of T1 to the position (center position) T2 in the center coordinates of the four-division photo sensor,
The light receiving element 15 has a received light amount I1 in the first area of the four-division photo sensor I1, a received light amount I2 in the second area of the four-division photo sensor, and a received light amount I3 in the third area of the four-division photo sensor. Each of the received light amounts I4 in the four regions is detected, and the detection results are supplied to the arithmetic circuit 30 as the received light signals S1 to S4.

The arithmetic circuit 30 stores these pieces of information in the memory 4
0, and each received light amount difference | I1-I2 |,
| I2-I3 |, | I3-I4 |, | I4-I1 | are calculated, and the calculation result is stored in the memory 40 in the same manner. The control unit 50 controls the piezoelectric element 21 to control the position of the reflection mirror 20 (so-called “fine adjustment”, details will be described later) so that the difference between the received light amounts becomes zero.

Here, the fact that the difference in the amount of received light in each area is zero means that the light receiving position of the laser beam B is in the area of the position T2, and therefore corresponds to the center coordinates of the four-division photo sensor. It is possible to accurately guide the light receiving position to the position.

As a result, the position of the optical axis of the laser light is adjusted to the center position of the photosensor where the difference in the amount of received light becomes zero, so that more accurate position control is performed. In this way, both rough adjustment and fine adjustment are performed.

Here, in controlling the direction of the reflecting surface of the reflecting mirror 20, three-dimensional direction control can be performed by operating any of the piezoelectric elements 21a, 21b, 21c.

When performing the alignment control, it is conceivable that the reflecting mirror 20 is moved or the angle of the reflecting mirror 20 is adjusted and controlled. At that time, as a result of the diligent study by the present inventors, for example, It has been found that, for a substrate having a scale of about 20 cm, for example, correction of several tens of microns is necessary. Furthermore, it was also found that it is only necessary to control on the order of several tens of microns to several hundreds of microns at the maximum when calculating the assumed numerical values such as the displacement in the height direction, the inclination of the optical axis, and the displacement in the surface direction. .

In this way, by controlling the reflecting mirror and the like in the X, Y, and Z directions in a particular three-dimensional XYZ coordinate system, accurate alignment becomes possible.

Here, when the signal light is transmitted from the semiconductor IC located at one point to the semiconductor IC located at the other point, based on the change of the environmental temperature,
When the substrate is deformed, the distance between the semiconductor ICs is changed, so that the position where the laser is incident is inside or outside the target point, or is deviated from side to side.

Therefore, in the present invention, a photosensor for position detection is provided at or around the light receiving element serving as the target point. Then, based on the difference between the target point position and the incident position detected by this photo sensor (according to the position change of the optical axis of the laser etc.), the positional deviation can be detected by controlling the optical element such as the mirror. Based on
The polarization angle of laser light is changed. This displacement is
It constantly monitors (detects).

Here, when controlling the reflection mirror 20 and the light receiving element 15 for position control, etc., there is a problem even if the signals (data) exchanged between these respective parts are slow signals to some extent. Since it does not exist, an electric signal may be used. The control unit 50 and the memory 40 use a CPU and a memory to be mounted on an existing mounting board to perform normal processing performed by the CPU on the mounting board and control processing related to the mirror control. It may be configured such that one of the CPUs is used in common, or a dedicated element may be used for the control processing related to the mirror control.

By the way, the signals related to these controls may be used as electric signals, in which the signal detected by the position control light receiving element is supplied to the position control reflection mirror 20 via the control section 50. This is because the direction opposite to the direction in which the laser light B goes straight is opposite.

Next, a processing procedure for adjusting the position of the reflection mirror in the optical mounting board having the above-described structure will be described with reference to FIG.

First, when the adjustment process is started, coarse adjustment is performed (step, hereinafter "S" 100).

In this step S100, the processing for scanning the laser light by the piezoelectric element for controlling the mirror position is performed, and the position is adjusted so that the laser light can contact or receive the ends of the sensor and the light receiving element. .

Specifically, first, the ends of the photo sensor in the X and Y directions are detected (S101). Next, the arithmetic circuit extracts the center coordinates of the photosensor, and (S1
02) A process of storing the extracted center coordinates of the photosensor in the memory is performed (S103).

Then, the processing for moving the laser beam to the central coordinates of the photosensor is performed by the piezoelectric element for controlling the mirror position (S104).

As a result, the laser light can be detected by the four-division photosensor, so that the optical axis of the laser light enters the four-division photosensor, and the optical axis is positioned at the center coordinates of the photosensor. The position is adjusted so that In the present embodiment, such a series of processing is
It is defined as "coarse adjustment".

Next, when the rough adjustment processing of S100 is completed,
Fine adjustment processing is performed (S110). This S11
In 0, the optical axis of the laser beam is finely adjusted with respect to the above "coarse adjustment". That is, in order to adjust the position of the optical axis T1 of the laser light shown in FIG. 2 to the position (center position) T2 in the central coordinates of the 4-division photo sensor, the amount of light received in the first region of the 4-division photo sensor is adjusted. I1, the amount of received light I2 in the second region of the four-division photo sensor I2, the amount of received light I3 in the third region of the four-division photo sensor, based on the detection results of the amount of received light I4 in the fourth region of the four-division photo sensor The circuit consists of each received light amount difference | I1-I2 |, | I2
-I3 |, | I3-I4 |, | I4-I1 |
The reflection mirror 2 is operated until the difference between these received light amounts becomes zero.
The position control of 0 is performed.

Specifically, first, the difference in the amount of received light between the four photosensors is detected, and the difference is calculated by the arithmetic circuit (S111). Then, a process of storing the center coordinates of the photosensor in the memory is performed (S112).

Next, the processing for moving the laser beam to the central coordinates of the photo sensor is performed by the mirror position control piezoelectric element (S113).

As a result, the position of the optical axis of the laser beam is adjusted to the center position of the photosensor where the difference in the amount of received light becomes zero, so that more accurate position control is performed. In the present embodiment, such a series of processes is defined as “fine adjustment”.

By thus performing both the rough adjustment and the fine adjustment, the accurate position adjustment of the reflecting surface of the reflecting mirror is performed, whereby the light of the laser light due to the warp of the substrate or the like caused by the environmental change. It is possible to prevent the displacement of the axial position and ensure an accurate optical transmission path.

As described above, according to the present embodiment, the light receiving element capable of receiving the signal light from the light emitting element and detecting the light receiving position of the laser light which is the signal light (in the present embodiment, the light receiving element Is used both as a light receiving portion and a detecting means), and position control for guiding or guiding the signal light from the light emitting element by reflecting or knitting the signal light from the light emitting element based on the detection result regarding the light receiving position detected by By performing feedback control of the reflecting surface or the knitting surface of the reflecting mirror, which is an optical element for use in a mirror, the adjustment of the optimum position and the optimum tilt angle of the reflecting mirror (control of optical alignment) can be easily performed with a simple configuration. be able to.

Therefore, for example, when disposing the reflection mirror on the optical mounting substrate, it is not necessary to perform an alignment work and it is not necessary to provide various members for improving the alignment accuracy. You can also go down.

Further, for example, there are problems in variations in mounting optical elements and semiconductor ICs (chips), and problems in alignment due to substrate warpage, laser beam emission angle, wavelength, and optical axis variation. It can be solved and is resistant to environmental changes such as temperature, and optical mounting is possible with existing mounting accuracy.

Further, for data transmission between the semiconductor ICs, optical coupling with a free space formed by a light receiving element and a light emitting element is used, and the signal light is transmitted using the space portion.
For example, compared with the method using an optical fiber or an optical light guide, the degree of freedom and the expandability of the layout of the bus lines of the optical data bus are increased, and all semiconductor ICs can be comprehensively optically connected. Further, when the light is transmitted using the space, the light travels in the parallel direction in a straight line, so that the light loss is small.

Further, in space transmission, since free wiring is possible on the circuit board and density can be easily increased,
It is possible to build a highly flexible system that is highly expandable.

Therefore, by using the optical mounting board having the structure capable of performing the control as in this example, high-speed transmission can be performed by the local bus and the image bus on the optical mounting board, and in addition, the problem of EMI is caused. Can also be solved. This makes it faster
A high-resolution image forming apparatus and image processing apparatus can be realized.

Further, when light is transmitted from each semiconductor IC in free space, the light emitted from one point can be transmitted to one fixed point by using the reflection mirror, and it is controlled with high accuracy. Therefore, it is possible to reduce the occurrence of interference (crosstalk) between adjacent optical data transmission paths and data transmission failure. Especially, by replacing the bus lines with optical signals, the delay time can be ignored.
Further, EMI noise can be eliminated because it is transmitted by light.

Further, it is possible to surely optically couple a plurality of semiconductor ICs each having a light emitting / receiving section by a simple mounting method without requiring precise optical alignment according to environmental changes and the like.

In this example, an example in which signal light is emitted from one semiconductor IC to another semiconductor IC has been disclosed, but from one semiconductor IC to a plurality of other semiconductor ICs. In contrast, the signal light may be emitted at the same time.

Furthermore, although the case where at least one signal light is emitted from one semiconductor IC to another semiconductor IC has been illustrated, a plurality of, for example, eight signal lights are emitted, respectively. It may be an example of receiving light. In this case, it is preferable to configure a plurality of light emitting elements of one semiconductor IC and a plurality of light receiving elements of the other semiconductor IC.

Although the example of FIG. 1 discloses an example in which laser light is transmitted in parallel within the light transmission layer, the laser light is transmitted by being reflected multiple times on the substrate layer and the lower base material. It is of course possible to use the above method or a method of simultaneously transmitting a plurality of laser beams having different wavelengths or the same wavelength.

(Second Embodiment) Next, a second embodiment according to the present invention will be described with reference to FIG. Note that, in the following, description of substantially the same configuration as that of the first embodiment will be omitted, and only different portions will be described. FIG. 5 is a cross-sectional view showing the configuration of the optical mounting board according to the second embodiment of the present invention.

In the above-described first embodiment, the structure is adjusted by rotating the reflecting mirror, but this example discloses a structure in which position adjustment is performed using a diffractive optical element. .

Specifically, the optical mounting substrate 110 of this example is
As shown in FIG. 5, a substrate 120, semiconductor ICs 122 and 124 provided on the substrate 120, and diffractive optical elements 130 and 1 which are optical elements provided below the substrate.
And 32.

The semiconductor IC 122 is provided with a light emitting element 123, and the semiconductor IC 124 is provided with a light receiving element 125. The light emitting element 123 and the light receiving element 12 of the substrate 120
4, the polarization optical elements 134, 13 are provided at positions corresponding to 4 respectively.
6 are provided.

The diffractive optical element 130 is arranged so that its reflection surface is substantially orthogonal to the optical axis of the light emitted from the light emitting element 123 (laser light B), and is expandable / contractible in the direction parallel to the substrate 120. Has been done. That is, the diffractive optical element 130 has a plurality of slits 131 as shown in FIG.
Is formed and expands and contracts in the Z direction shown in FIG. 6, so that the pitch (width) of each slit 131 can be changed.

Since a diffractive optical element is used as an optical element for position control, when a light emitting element or a light receiving element is attached, as compared with the case of the reflecting mirror as in the first embodiment. The allowable range for the positional deviation in the surface direction becomes large, and the assembly becomes easy.

Here, the diffractive optical element 130 is such that the polarization direction due to diffraction changes depending on the wavelength of the laser beam B from the light emitting element 123, and a plurality of slits are arranged at intervals of a certain wavelength pitch. 131 is formed. At that time, when the pitch of the slits 131 is changed, the reflection and refraction angles of the emitted light are changed, so that it is only necessary to control the surface direction of the diffractive optical element 130, that is, the X direction and the Y direction. As described above, when the diffractive optical element 130 is used as the deflecting optical element, it is not always X.
No control is required in each of the YZ directions.

Further, in this example, by mounting a piezoelectric element on the diffractive optical element 130 or by configuring the diffractive optical element 130 itself by the piezoelectric element, the piezoelectric element itself is arranged in the pitch direction at both ends of the piezoelectric element. When the slit width is changed by the extension and the emitted light emitted from the light emitting element 123 is transmitted or reflected in the slit of the piezoelectric element, the reflection angle of the emitted light in the piezoelectric element is changed, and the output is changed. The direction of the optical axis of the emitted light can be controlled. In this case, the slit width is changed and the polarization angle is changed by extending and contracting the diffraction grating itself by the piezoelectric element.

When a material for the piezoelectric element is used for the diffractive optical element 130 itself, electrodes are attached to both ends of the diffractive optical element 130, and a certain voltage is applied to the slit 13.
Since the pitch of 1 changes, this changes the reflection angle. When the diffractive optical element 130 is manufactured by a piezoelectric element, it is preferable that the diffractive optical element 130 is processed by a laser or by etching from the viewpoint of forming a grating in a unit of several microns. Further, in the present embodiment, the piezoelectric element as the diffractive optical element may have a structure in which ZnO is deposited as a piezoelectric body by using a high frequency magnetron sputtering device or the like.

As described above, according to the present embodiment, since the position adjustment of the optical coupling between the light receiving element and the light emitting element is performed using the diffractive optical element, the slit pitch of the diffractive optical element is adjusted in the pitch direction. Only control is required, and adjustment can be performed by easier control. Further, since the diffractive optical element can be formed of a piezoelectric element, the number of parts can be reduced.

In the diffractive optical element, even if each slit width is uniformly expanded or contracted, as the diffractive optical element expands or contracts, each slit becomes closer to the end region from the central region. You may comprise so that the enlargement ratio or contraction ratio of a slit width may differ.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view showing the configuration of the optical mounting board according to the third embodiment of the present invention.

The third embodiment discloses a mode in which the laser light from the light emitting element is transmitted through the space while being reflected by the upper and lower substrates of the optical mounting substrate.

Specifically, the optical mounting board 140 of this example is
As shown in FIG. 7, a substrate 150, a semiconductor IC 152 including a light emitting element provided on the substrate 150, and a diffractive optical element 160 which is an optical element provided below the substrate 150 are configured. ing. Although not shown, of course, a semiconductor IC having a light receiving element is also formed.

The substrate 120 is formed with a hole 151a for transmitting the light emitted from the light emitting element.
The laser light B, which is the signal light, is emitted toward the diffractive optical element 160 via 51a.

The diffractive optical element 160 is arranged so that its reflection surface is substantially orthogonal to the optical axis of the light emitted from the light emitting element (laser light B), and is configured to be expandable / contractible in the direction parallel to the substrate 150. As in the second embodiment, it has a plurality of slits (not shown).

In the optical mounting board having the above-mentioned structure, the laser light B emitted from the light emitting element and passing through the hole 151a is reflected by the diffractive optical element 160, and the upper substrate 150 and the lower substrate are separated from each other. The light is sequentially reflected alternately and reaches the light receiving element of the other semiconductor IC (not shown).

As described above, according to the present embodiment, in the light reflection type, as compared with the light parallel type as in the above-described first embodiment, the semiconductor IC having the light receiving element is passed over. Since it is also possible to transmit the signal light by means of this, it is possible to further increase the degree of freedom of wiring.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8A is a sectional view showing the structure of the optical mounting board according to the fourth embodiment of the present invention.

In the above-described third embodiment, the diffraction grating element is mounted on the lower substrate, but in this example, the diffraction grating element is mounted on the back surface of the substrate.

Specifically, the optical mounting board 200 of this example is
As shown in FIG. 8A, a substrate 210 and this substrate 21
A semiconductor IC 212 including a light emitting element, a semiconductor IC 214 including a light receiving element, and a diffractive optical element 220 and a semiconductor IC 214 which are optical elements provided at positions corresponding to the semiconductor IC 212 on the back surface of the substrate 210. It is configured to include a diffractive optical element 222 that is an optical element provided at a corresponding position and a lower substrate.

The diffractive optical elements 220 and 222 are arranged so that their polarization planes are substantially orthogonal to the optical axis of the light emitted from the light emitting element (laser light B), and can be expanded and contracted in the direction parallel to the substrate 210. Configured, similar to the second embodiment,
It has a plurality of slits (not shown).

The optical mounting board 20 having the structure as described above.
At 0, the laser light B emitted from the light emitting element is
Immediately, the light is deflected by the diffractive optical element 220 on the back surface of the substrate 210, reflected by the lower substrate, deflected by the diffractive optical element 222, and incident on the light receiving element of the semiconductor IC 214.

As described above, according to this embodiment, by mounting the optical element on the back surface of the substrate, a control circuit for controlling the optical element, a memory and the like can be mounted on the substrate side.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 8B is a sectional view showing the structure of the optical mount board according to the fifth embodiment of the present invention.

In the fifth embodiment, a plurality of laser beams having different wavelengths are emitted. Specifically, as shown in FIG. 8B, the optical mounting substrate 230 of this example includes a substrate 240, a semiconductor IC 242 including a light emitting element and a semiconductor IC 244 including a light receiving element, which are provided on the substrate 240. , A diffractive optical element 250 which is an optical element provided at a position corresponding to the semiconductor IC 242 on the lower substrate below the substrate 240, and a diffractive optical element 25 which is an optical element provided at a position corresponding to the semiconductor IC 244.
2 and a lower substrate.

In this example, especially the semiconductor IC2
A plurality of, for example, three laser beams B1 to B3 having wavelengths different from each other are emitted from the light emitting element of 42, respectively. On the other hand, in the light receiving element of the semiconductor IC 244, these laser beams B1 to B3 are formed so as to be able to respectively receive. There is. Therefore, on the semiconductor IC 242 side, one light emitting element may be formed, or a plurality of light emitting elements may be formed according to different wavelengths. In addition, also on the semiconductor IC 244 side, one light receiving element may be formed, or a plurality of light receiving elements may be formed according to different wavelengths.

Further, in the region of the substrate 240 corresponding to the semiconductor IC 242, through which the laser beams B1 to B3 pass, for example, holes may be formed through which the laser beams B1 to B3 can pass. It is also possible to form one hole having a large aperture through which the laser beams B1 to B3 can pass as a bundle. The same can be said for the position of the substrate 240 corresponding to the semiconductor IC 244.

The diffractive optical elements 250 and 252 are arranged so that their polarization planes are substantially orthogonal to the optical axis of the light emitted from the light emitting element (laser light B), and can be expanded and contracted in the direction parallel to the substrate 240. Configured, similar to the second embodiment,
It has a plurality of slits (not shown).

The optical mounting board 23 having the above structure.
0, a plurality of laser beams B1 to B3 emitted from the light emitting element of the semiconductor IC 242 and having different wavelengths from each other.
Are reflected by the diffractive optical element 250, and the substrate 24
0, the lower substrate is repeatedly reflected, and reaches the diffractive optical element 252 through the space.

Also in the diffractive optical element 252, the laser beams B1 to B3 are reflected and received by the light receiving elements of the semiconductor IC 244.

As described above, according to this embodiment, a plurality of laser beams having different wavelengths can be transmitted at one time, so that the data transmission rate can be improved.

(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a sectional view showing the structure of the optical mounting board according to the sixth embodiment of the present invention.

This embodiment discloses an example in which another semiconductor IC is installed between the semiconductor ICs already arranged on the optical mounting substrate.

Specifically, the optical mounting board 300 of this example is
As shown in FIG. 9, a substrate 310, semiconductor ICs 312 and 314 already disposed on the substrate 310, a semiconductor IC 316 to be disposed later, and semiconductor ICs 312 below the substrate 310, Reflecting mirrors 320, 322, and 324 are arranged at positions corresponding to 314 and 316, respectively, and are inclined at a predetermined angle.

The semiconductor IC 312 is provided with a light emitting element 313 such as a semiconductor laser, and the substrate 31
The reflection mirror 3 for position control is provided through a hole for light transmission which is formed at a position corresponding to the semiconductor IC 312 on the 0.
It is formed so as to be able to emit laser light as signal light toward 20. Further, the semiconductor IC 314 is similarly provided with the light emitting element 315. On the other hand, semiconductor IC31
6 is provided with a light receiving element 317 that receives the laser beam emitted from the light emitting element 313 or the light emitting element 315.

In this example, as the position controlling optical element (polarizing optical element), the reflecting mirrors 320, 322,
324 shall be used. Furthermore, the semiconductor IC 316
It is assumed that the same sensor and control system as those in the first embodiment are provided on the side.

The optical mounting board 30 having the above structure.
0, the semiconductor IC 31 is previously mounted on the substrate 310.
2, 314 are provided and each semiconductor IC 312, 3 is provided.
A semiconductor IC 316 is newly mounted between the fourteen.

When performing such initial setting of the semiconductor IC 316, first, laser light is scanned from the light emitting element 313 of the semiconductor IC 312. At this time, the laser light from the light emitting element 313 is reflected by the reflection mirrors 320, 3 and 3.
The points where the laser light enters through 24 and where the laser light enters and exits through the holes of the substrate 310 are extracted.

Also, by changing the direction of the reflection mirror 324,
Laser light is scanned from the light emitting element 315 of the semiconductor element 314. At this time, the laser light from the light emitting element 315 enters through the reflection mirrors 322 and 324, and the points where the laser light enters and exits through the holes of the substrate 310 are extracted.

Then, for example, as shown in FIG. 10, the center point O of each of these points P1 to P4 is calculated to perform setting as the setting position of the semiconductor IC 316.

As described above, according to the present embodiment, the position to be mounted can be calculated even when the semiconductor IC is mounted for the first time and the arrangement position is misaligned and cannot be understood.

(Seventh Embodiment) Next, a seventh embodiment according to the present invention will be described with reference to FIG. FIG. 11 is an explanatory diagram showing the configuration of the optical mounting board according to the seventh embodiment of the present invention.

In this example, the optical data bus using the spatial transmission method described in any of the above-described embodiments is used in an image forming apparatus which is an example of an information processing apparatus and various kinds of equipment. It is a disclosure of a circuit forming example used for a substrate.

Specifically, in the control board 400 of this example,
A plurality of semiconductor ICs, a first LSI 401 and a second LSI
402, third LSI 403, fourth LSI 404, and RA
An M405 and a CPU 406 that controls these components are arranged on the circuit board.

Besides RAM 405, of course, flash memory, ROM, DRAM, SDRAM, SRAM or the like may be used.

Then, the first LSI 401 and the second LSI 4
02, between the second LSI 402 and the third LSI 403, between the third LSI 403 and the fourth LSI 404, the third
Between the LSI 403 and the RAM 405, between the CPU 406 and the second LSI 402, and between the CPU 406 and the fourth LSI
Image data D is transmitted to and from 404, and a transmission path for transmitting each of these image data D is an optical data bus of any structure disclosed in each of the above-described embodiments, that is, an image data bus. Is forming.

Further, the first LSI 401, the second LSI
402, third LSI 403, fourth LSI 404, CPU
An optical transmission line is also formed for the transmission line that transmits the system clock CL supplied to each of the 406.
The system clock CL is for transmitting the image data D in synchronization with the reference system clock CL.

The CPU 406 and each of the first to fourth LSs
The transmission path for transmitting the LSI control signal formed between the I 401, 402, 403, and 404 is formed as a transmission path for transmitting the electric signal. In addition, the first LSI 401
And the second LSI 402, the second LSI 402 and the third L
Between SI403, third LSI403 and fourth LSI40
4 and between the third LSI 403 and the RAM 405, various other control signals are transmitted, and a transmission line (control line) for transmitting each of these control signals is also formed as a transmission line for transmitting electric signals. To be done. Further, a transmission line (control line) for controlling power supply for supplying power is also formed as a transmission line for electric signals.

Further, it is preferable that the wavelength of the signal light transmitted by the system clock CL and the wavelength of the signal light of the bus line for transmitting the image data D etc. are different from each other.

As described above, in the control board of the image forming apparatus or the image processing apparatus, the other control parts such as signals used for power supply of the LSI and driving of the load that do not need high speed transmission are High-speed image processing can be performed by using ordinary electrical wiring and adopting a configuration in which only the image signal is transmitted by signal light, such as an image data bus line for passing the image signal.

If not only the image bus and the clock but also the bus line between the memory and the CPU is replaced by the transmission by the signal light, the processing capability of the CPU is dramatically improved.

As described above, according to this embodiment, high speed transmission of the local bus and the image bus is possible. Further, not only the optical mounting board used in the image processing apparatus but also the information processing apparatus, such as a personal computer, can be applied to increase the processing speed in the information processing apparatus. , Printer output is also faster, for example PC
The color print is output immediately after the print instruction of.

Although the apparatus and method according to the present invention have been described in accordance with some specific embodiments thereof,
Various modifications can be made to the embodiments described in the text of the present invention without departing from the spirit and scope of the present invention. For example, in each of the above-described embodiments, an example in which information is transmitted and received between the IC including the light emitting element and the IC including the light receiving element has been shown, but the present invention is not limited to this, and the light emitting element and the light receiving element are not limited thereto. Needless to say, information may be exchanged between the IC including the (light emitting / receiving unit) and the IC including the light emitting / receiving unit.

Further, in the above-described embodiment, the piezoelectric element is composed of a piezoelectric material such as ZnO. However, the method for forming the piezoelectric element, the material for forming the piezoelectric element, etc. are not particularly limited and may be set appropriately. It is something.

Further, it goes without saying that examples of the respective embodiments, or combinations of any of them with modifications are included.

[0144]

As described above, according to the present invention, since the optical axis of the signal light from the light emitting portion to the light receiving portion can be controlled by controlling the first optical element, the warp of the substrate and the signal light can be controlled. It is possible to eliminate blurring due to fluctuations in wavelength, emission angle, and optical axis. This makes it possible to realize high-speed transmission of signal light between the integrated circuits on the board without loss.
Furthermore, the problem of EMI cannot occur.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of the configuration of an optical mounting board of the present invention.

FIG. 2 is an explanatory diagram showing a configuration of a control system of a reflection mirror of the optical mounting substrate of FIG.

3A and 3B are explanatory views for explaining a control direction of a reflection mirror of the optical mounting substrate of FIG.

FIG. 4 is a flowchart showing a control procedure for controlling the reflection mirror of the optical mounting board of the present invention.

FIG. 5 is a cross-sectional view showing an example of the configuration of the optical mounting board of the present invention.

6 is an explanatory diagram for explaining a control direction of a diffractive optical element of the optical mounting substrate of FIG.

FIG. 7 is a cross-sectional view showing an example of the configuration of the optical mounting board of the present invention.

8A and 8B are cross-sectional views showing an example of the configuration of the optical mounting board of the present invention.

FIG. 9 is an explanatory diagram for explaining an example of the configuration of the optical mounting board of the present invention.

FIG. 10 is an explanatory diagram for explaining an error of an optical axis.

FIG. 11 is an explanatory diagram for explaining an example of a circuit configuration to which an optical transmission method in the optical mounting board of the present invention is applied.

[Explanation of symbols]

1 Optical mounting board 10 Printed wiring board 12 Semiconductor IC 13 Light emitting device 14 Semiconductor IC 15 Light receiving element 20 reflective mirror 22 Reflective mirror 50 control unit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Kamata             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company F-term (reference) 2H041 AA12 AB14 AC08 AZ02 AZ03                       AZ06                 2H047 KA03 KB08 KB09 MA07 QA05                       RA08 TA05 TA11 TA47                 5E338 AA02 BB75 BB80 CC10 EE11                 5F089 AA01 AB01 AC13 AC16 AC24                       CA12 CA21

Claims (10)

[Claims] 1. A first device comprising a light emitting portion for emitting signal light.
Of an integrated circuit and a second integrated circuit having a light receiving portion for receiving the signal light, the substrate layer being formed so as to be spaced apart from each other, and the back surface of the substrate layer. An optical mounting substrate having an optical transmission layer which is formed over the entire length and which transmits the signal light emitted from the light emitting unit to the light receiving unit through a space. 2. A first device comprising a light emitting section for emitting signal light.
Second integrated circuit and a light receiving section for receiving signal light
Is an optical mounting board formed by forming a substrate layer in which the integrated circuit and the integrated circuit are spaced apart from each other, and the signal light emitted from the light emitting portion is formed over the back surface of the substrate layer. An optical transmission layer forming a space for propagating to, a guide means for reflecting the signal light from the light emitting section in the optical transmission layer and guiding the signal light to the light receiving section, and provided in the light receiving section, A detection unit that detects an incident position of the optical axis of the signal light with respect to the light receiving unit; and a control unit that adjusts and controls the reflection surface of the guide unit based on a detection result of the detection unit. Optical mounting board. 3. The guide means is formed in the light transmission layer at a position where the signal light from the light emitting portion can be received, and reflects the emitted signal light.
And a second optical element that reflects the signal light reflected by the first optical element so as to enter the signal light toward the light receiving unit, and the control unit includes the detection unit. 3. The light according to claim 2, wherein one or both of the reflection surface of the first optical element and the reflection surface of the second optical element are adjusted and controlled based on the detection result by the light. Mounting board. 4. A first device comprising a light emitting section for emitting signal light.
Second integrated circuit and a light receiving section for receiving signal light
Is an optical mounting board formed by forming a substrate layer in which the integrated circuit and the integrated circuit are spaced apart from each other, and the signal light emitted from the light emitting portion is formed over the back surface of the substrate layer. An optical transmission layer that constitutes a space for propagating to the first optical transmission layer, and a first optical transmission layer that is formed in the optical transmission layer at a position where the signal light from the light emitting unit can be received and reflects the emitted signal light.
An optical element, a second optical element that reflects the signal light reflected by the first optical element so as to enter the signal light toward the light receiving section, and the second optical element is provided in the light receiving section and is provided for the light receiving section. A detection unit that detects an incident position of the optical axis of the signal light; and a control unit that adjusts and controls the first optical element based on a detection result of the detection unit, the first optical element Is formed of a diffractive optical element, and the control means adjusts and controls the pitch of each slit of the diffractive optical element. 5. A lower base material layer disposed opposite to the base material layer with the light transmission layer interposed therebetween, wherein the diffractive optical element is disposed on the lower base material layer. The optical mounting board according to claim 4. 6. The diffractive optical element is disposed on the back surface of the base material layer, and the control means adjusts the refraction angle of the signal light transmitted through the diffractive optical element based on the adjustment of the pitch of the slits. The optical mounting board according to claim 4, which is controlled. 7. An optical mounting substrate comprising a substrate layer in which at least two integrated circuits each having a light emitting / receiving unit for receiving and emitting signal light are spaced apart from each other, and a back surface of the substrate layer. An optical mounting substrate having an optical transmission layer which is formed over the entire length and which transmits the signal light between the respective light receiving and emitting portions through a space. 8. An image forming apparatus comprising the optical mounting board according to claim 1, wherein the optical mounting board transmits image data between the integrated circuits. An image forming apparatus, comprising: an image data bus for performing the operation, wherein the signal light is transmitted to the image data bus. 9. A first and second integrated circuit that is processed at high speed, an image data bus for transmitting image data between the first and second integrated circuits, and the first and second integrated circuits. An image forming apparatus comprising a control board having a power supply control for supplying power to a circuit, wherein the optical signal is transmitted to the image data bus, and Is an image forming apparatus in which an electric signal is transmitted. 10. A substrate layer in which a first integrated circuit having a light emitting portion for emitting signal light and a second integrated circuit having a light receiving portion for receiving signal light are arranged apart from each other. And an optical transmission layer that is formed over the back surface of the substrate layer and forms a space for propagating the signal light emitted from the light emitting unit to the light receiving unit, and the light emitting unit in the optical transmission layer. A first optical element that is formed at a position capable of receiving the signal light from and reflects the emitted signal light; and the signal light reflected by the first optical element enters the light receiving unit. And a second optical element that reflects the light so as to control the direction of the reflecting surface of the first optical element to control the incident position of the optical axis of the signal light with respect to the light receiving unit. A method for controlling a position on a mounting board, comprising: With a plurality of detection sensors for detecting the incident position of the optical axis of the signal light, the step of scanning the signal light, the optical axis position of the signal light is moved toward the reference coordinates of the light incident portion, Adjusting the reflecting surface of the first optical element, detecting a received light amount difference between each of the plurality of detection sensors, based on the received light amount difference, the optical axis position of the signal light, Adjusting the reflection surface of the first optical element so that the first optical element moves toward the reference coordinates of the light receiving section.