JP2002511196A - 集積回路用基板として用いられるホイル - Google Patents
集積回路用基板として用いられるホイルInfo
- Publication number
- JP2002511196A JP2002511196A JP55140799A JP55140799A JP2002511196A JP 2002511196 A JP2002511196 A JP 2002511196A JP 55140799 A JP55140799 A JP 55140799A JP 55140799 A JP55140799 A JP 55140799A JP 2002511196 A JP2002511196 A JP 2002511196A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- edge
- conductor track
- filmstrip
- perforations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000011888 foil Substances 0.000 title claims abstract description 107
- 239000000758 substrate Substances 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 238000005553 drilling Methods 0.000 description 8
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.エッジ穿孔及び金属ホイルから切り取られホール又は開口を具備する合成ホ イルに接着される導体トラックを備え、好ましくはチップカードに組み込まれ る複数の集積回路に関するキャリアとして役立つ長形フィルムストリップ形状 のホイルにおいて、異なる導体トラックパターンを備える個々の金属ホイルが 前記合成ホイルの各側に接着され、両側のこれら金属ホイルが、特定される導 体トラックパターンに加え、前記ホイルストリップの長手方向における短い間 隔での前記フィルムストリップの長手方向に垂直な両方の金属ホイルの全体の 断面積の大幅な低減を達成するために、断続部を有することを特徴とするホイ ル。 2.前記合成ホイルが一定の間隔でエッジ穿孔を具備する請求項1に記載のホイ ルにおいて、前記両方の金属ホイルが前記エッジ穿孔のエリアに対応する位置 に、複数の連続しているエッジ穿孔にわたって延在する開口を具備することを 特徴とするホイル。 3.前記合成ホイルが一定の間隔でエッジ穿孔を具備する請求項1に記載のホイ ルにおいて、少なくとも1つの金属ホイルが前記エッジ穿孔のエリアで、当該 エッジ穿孔と接触しないが、2つの連続するエッジ穿孔毎の間に延在する少な くとも1つの開口を具備することを特徴とするホイル。 4.前記両方の金属ホイルが、前記エッジ穿孔の範囲の対応する位置に、当該エ ッジ穿孔と接触していないが、2つの連続するエッジ穿孔毎の間に延在する開 口を具備することを特徴とする請求項3に記載のホイル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19816066.6 | 1998-04-09 | ||
DE19816066A DE19816066A1 (de) | 1998-04-09 | 1998-04-09 | Folie als Träger von integrierten Schaltungen |
PCT/IB1999/000591 WO1999053545A1 (de) | 1998-04-09 | 1999-04-07 | Folie als träger von integrierten schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002511196A true JP2002511196A (ja) | 2002-04-09 |
Family
ID=7864210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55140799A Ceased JP2002511196A (ja) | 1998-04-09 | 1999-04-07 | 集積回路用基板として用いられるホイル |
Country Status (6)
Country | Link |
---|---|
US (1) | US6420660B1 (ja) |
EP (1) | EP0992065B1 (ja) |
JP (1) | JP2002511196A (ja) |
AT (1) | ATE346381T1 (ja) |
DE (2) | DE19816066A1 (ja) |
WO (1) | WO1999053545A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10202257B4 (de) | 2002-01-21 | 2005-12-01 | W.C. Heraeus Gmbh | Verfahren zum Fixieren von Chipträgern |
WO2004036648A2 (en) * | 2002-10-15 | 2004-04-29 | Axalto Sa | Method of manufacturing a data carrier |
DE10318688A1 (de) * | 2003-04-24 | 2004-11-25 | W. C. Heraeus Gmbh & Co. Kg | Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür |
CN109315064B (zh) * | 2016-05-11 | 2021-10-19 | 立联信控股有限公司 | 带有至少两个叠置的导体路径层的导体路径结构 |
CN108040418B (zh) * | 2017-12-05 | 2024-06-28 | 深圳比特微电子科技有限公司 | 数据处理装置和计算机服务器 |
US10763203B1 (en) | 2019-02-08 | 2020-09-01 | Nxp B.V. | Conductive trace design for smart card |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3547724A (en) * | 1967-02-07 | 1970-12-15 | Rogers Corp | Method of and apparatus for producing printed circuits |
NL7900244A (nl) * | 1979-01-12 | 1980-07-15 | Philips Nv | Vlakke tweelaags electrische spoel. |
US4356627A (en) * | 1980-02-04 | 1982-11-02 | Amp Incorporated | Method of making circuit path conductors in plural planes |
US4555291A (en) * | 1981-04-23 | 1985-11-26 | Minnesota Mining And Manufacturing Company | Method of constructing an LC network |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS6344732A (ja) * | 1986-08-11 | 1988-02-25 | Seiko Epson Corp | テ−プキヤリアの製造方法 |
FR2616995A1 (fr) * | 1987-06-22 | 1988-12-23 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques |
JPH0780386B2 (ja) * | 1989-01-25 | 1995-08-30 | 東海金属株式会社 | 共振タグおよびその製造方法 |
CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
DE4421607A1 (de) * | 1994-06-21 | 1996-01-04 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern |
US5527740A (en) * | 1994-06-28 | 1996-06-18 | Intel Corporation | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
FR2733553B1 (fr) * | 1995-04-25 | 1997-07-11 | Pem Sa Protection Electrolytiq | Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant |
EP0876251B1 (en) * | 1995-12-05 | 2000-08-02 | Sherbrooke Securities Limited | Charge card |
-
1998
- 1998-04-09 DE DE19816066A patent/DE19816066A1/de not_active Withdrawn
-
1999
- 1999-04-07 JP JP55140799A patent/JP2002511196A/ja not_active Ceased
- 1999-04-07 DE DE59913999T patent/DE59913999D1/de not_active Expired - Lifetime
- 1999-04-07 EP EP99910583A patent/EP0992065B1/de not_active Expired - Lifetime
- 1999-04-07 US US09/445,235 patent/US6420660B1/en not_active Expired - Lifetime
- 1999-04-07 AT AT99910583T patent/ATE346381T1/de not_active IP Right Cessation
- 1999-04-07 WO PCT/IB1999/000591 patent/WO1999053545A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE59913999D1 (de) | 2007-01-04 |
DE19816066A1 (de) | 1999-10-14 |
EP0992065A1 (de) | 2000-04-12 |
WO1999053545A1 (de) | 1999-10-21 |
EP0992065B1 (de) | 2006-11-22 |
US6420660B1 (en) | 2002-07-16 |
ATE346381T1 (de) | 2006-12-15 |
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Legal Events
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