JP2002368302A - 3D electrode formation method - Google Patents

Abstract

(57) [Summary] An object of the present invention is to form an appropriate three-dimensional electrode. To achieve this object, the present invention forms a continuous conductive film 12 on one surface and the other surface of a three-dimensional structure, and then forms a resist film 13 on the conductive film 12 by electrodeposition. Thereafter, a mask is provided on the resist film 13 to perform exposure, and then a developer is brought into contact with the three-dimensional structure to pattern the resist film 13. Then, the conductive film is formed using the patterned resist film 13. The drive electrodes 3 and 4 and the detection electrodes 5 and 6 having a predetermined shape are formed by performing etching of 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming electrodes on a three-dimensional body such as various electronic parts.

[0002]

2. Description of the Related Art For example, in various electronic parts, there is a type in which electrodes are formed on one surface of a three-dimensional body and another surface in contact with the three-dimensional body. In the case where the electrode is provided on one surface of the solid and the other surface in contact with the solid, a continuous conductive film is formed on one surface of the solid and the other surface in contact with the solid, and then sprayed on the conductive film. Forming a resist film, then performing exposure by providing a mask on the resist film, then patterning the resist film by contacting the solid with a developer, and then using this patterned resist film The conductive film is etched to form an electrode having a predetermined shape.

[0003]

A problem in the above prior art is that it is not possible to form appropriate electrodes on one surface of the solid and on the other surface in contact with it. That is, in a conventional example, as a pre-process for forming this electrode, a resist film is formed by spraying on a conductive film continuously formed on one surface of a three-dimensional surface and the other surface in contact with the three-dimensional surface. The thickness of the resist film is inevitably thin, and a resist film having an appropriate thickness is formed by repeatedly applying the resist film.

However, in such a method of forming a resist film by the spray method, a shadow is formed on the spray because of the three-dimensional structure. A resist film having a large thickness could not be formed. As a result, an appropriate shape cannot be reproduced in the electrodes formed thereafter by the resist film, and it is impossible to form appropriate electrodes on one surface and the other surface of the three-dimensional object as described above.

Therefore, an object of the present invention is to make it possible to form an appropriate three-dimensional electrode.

[0006]

In order to achieve this object, the present invention provides a method in which a continuous conductive film is formed on one surface of a three-dimensional structure and on the other surface in contact with the solid, by electrodeposition on the conductive film. A resist film is formed. That is, when a resist film is formed by electrodeposition, this three-dimensional process is performed in a state where the resist film is immersed in an electrodeposition liquid. Therefore, in this immersed state, even if it is a three-dimensional object, no shadow is formed on the three-dimensional object, and as a result, an appropriate resist film can be formed on one surface of the three-dimensional object and the other surface in contact with it. As a result, an appropriate electrode can be formed thereafter using this resist film.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a continuous conductive film is formed on one surface of a solid and the other surface in contact with the solid, and then a resist film is formed on the conductive film by electrodeposition. Forming, then performing exposure by providing a mask on the resist film, then patterning the resist film by contacting the solid with a developer, and then using the patterned resist film to form the conductive film This is a method of forming an electrode in a three-dimensional shape by forming an electrode of a predetermined shape by performing etching, and when forming a resist film, the resist film is formed by electrodeposition. Since the resist film is formed in the immersed state, unlike the conventional spray method, no shadow is formed on the solid, and as a result, the resist film having an appropriate thickness is formed on one surface and the other surface of the solid. It can be formed, whereby it is made to be suitable electrode formed later.

According to a second aspect of the present invention, the thickness of the resist film formed on the other surface is made larger than the thickness of the resist film formed on one surface of the three-dimensional body. In the method of forming an electrode on the three-dimensional, by increasing the thickness of the resist film formed on the other surface than the thickness of the resist film formed on one surface of the three-dimensional, in the portion in contact with one surface and the other surface, The thickness of the resist film can be sufficiently secured, and as a result, an appropriate electrode can be formed.

[0009] To explain this point a little more, if one surface of the three-dimensional object and the other surface that is in contact with it are in a right angle state, the part of the three-dimensional object that is in contact with the one surface of the three-dimensional object and the other surface are orthogonal. It is conceivable that the thickness of the resist film becomes inevitably thin in the portion where such an edge is formed, and the resist film no longer functions as a resist film. Therefore, in claim 2 of the present invention, the thickness of the resist film formed on the other surface is made larger than the thickness of the resist film formed on the one surface of the three-dimensional body, so that the one surface and the other surface are orthogonal to each other. Even when the edge is in such a state that the edge can be formed, the thickness of the resist film in this portion can be secured to an appropriate thickness, and as a result, an appropriate electrode can be formed thereafter as described above. It becomes.

Next, according to a third aspect of the present invention, in the electrodeposition step of the resist film, an electrodeposition liquid flow is formed along one surface of the solid in the electrodeposition liquid bath in which the solid is immersed. Item 3. The method for forming an electrode on a solid according to Item 2, wherein the flow of the electrodeposition liquid is slower on the other surface of the solid by forming an electrodeposition liquid flow along one surface of the solid. A state, that is, a slight but stagnant state is formed. This stagnant state means that the resist film is easily formed on the other surface of the three-dimensional structure, and as a result, the thickness of the resist film on the other surface can be increased. It is.

An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 and FIG. 2 show an angular velocity sensor used in, for example, a car as an embodiment of the present invention. This angular velocity sensor has a tuning fork shape as shown in FIGS. 1 and 2, and two tuning forks 2 are provided on a base 1. In this state, a drive electrode 3 is formed on each surface of the tuning fork 2 as shown in FIG. Further, on the rear surface side, a drive electrode 4 is formed as shown in FIG. 1B and FIG. 2B. The detection electrodes 5 are formed on both inner surfaces of the tuning fork 2, and the detection electrodes 6 are formed on both side surfaces as shown in FIGS. 1 and 2.

Since the structure of the angular velocity sensor itself is well known, its structure will be briefly described. First, a half of the power supply voltage, for example, 2.5 V, is applied between the drive electrodes 3 and 4 of the tuning fork 2. An AC signal of about 17 kHz based on the above is applied. As a result, the vibration spreads outward in FIG. 1 and contracts inward in the next state. When an acceleration is applied to this angular velocity sensor in this state, a force acts on the front side and the rear side in FIG. 1, and a signal of, for example, 16.7 kHz can be detected between the detection electrodes 5 and 6 in a state where the force acts. It has become. The above is the well-known angular velocity sensor.

Here, what is particularly desired to be described in the present embodiment is that the tuning fork 2 has a rectangular shape as shown in FIG. 1 and FIG. This means that various electrodes are to be formed. Such drive electrodes 3 and 4 and detection electrodes 5 and 6 are formed in a state as shown in FIG.

First, FIG. 3A shows a state in which two quartz plates 7 and 8 are attached to each other to form the tuning fork 2. The bonded surfaces of the quartz plates 7 and 8 are polished to a smooth surface, and when bonded and heated in this state, an interatomic bond sharing oxygen atoms between the two quartz plates 7 and 8 is formed. Become. That is, when heating is performed between the quartz plates 7 and 8, moisture evaporates, and the evaporation of the moisture causes an interatomic bond between the quartz plates 7 and 8 sharing an oxygen atom. . This point is also a technique that has been conventionally proposed.

In the state where the quartz plates 7 and 8 are integrated as described above, first, etching resists 9 and 10 are applied to the front surface of the quartz plate 7 and the back surface of the quartz plate 8 as shown in FIG. Each is provided by patterning. In this state, when the portions where these etching resists 9 and 10 are not provided are etched in an etching solution, FIG.
As a result, four crystal plates 7 and 8 are formed. This shows a state in which, for example, two angular velocity sensors shown in FIGS. 1 and 2 are formed in parallel. That is, the state shown in FIGS. 1 and 2 is located on both sides of the center line 11 in FIG. FIG. 4 shows a state in which three angular velocity sensors are arranged in parallel on a substrate on which the quartz plates 7 and 8 are integrated. Usually, the manufacturing process proceeds with a large number of such sensors taken. .

Now, in such a state, FIG.
As shown in FIG.
10 is removed. After the removal, as shown in FIG. 3D, an Au conductive film 12 is formed on the entire outer periphery of the quartz plates 7 and 8 by vacuum evaporation. After that, as shown in FIG. 3E, the entire outer periphery of the conductive film 12 is covered with the resist film 13.

The resist film 13 is deposited by electrodeposition as shown in FIG. In other words, FIG. 6 shows a simplified version of this, but the tuning fork 2 shown in FIG.
This is immersed in an electrodeposition liquid bath 14, a positive potential is applied to the tuning fork 2, and a negative potential is applied to the electrode plates 15 located on both sides of the tuning fork 2. In such a state, the resist film 13 is formed on the tuning fork 2 as shown in FIG.

In this case, as shown in FIGS. 1 and 2, each part including the tuning fork 2 has a three-dimensional shape, but as shown in FIG. Since it is performed, even if it is three-dimensional, shadows cannot be formed.
(E) As shown in FIG.
3 will be formed. In the state where the resist film 13 is thus formed, exposure is performed on the resist film 13 by providing a mask (not shown).

After this exposure, if the resist film 13 is immersed in a developing solution, the resist film 13 is patterned as shown in FIG. When immersed in an etching solution in a state patterned as shown in FIG. 3 (f), the conductive film 12 not covered with the resist 13 is etched as shown in FIG. 3 (g).
4 and sensing electrodes 5 and 6 are formed. FIG.
(G) shows a state in which the resist film 13 has been removed from the drive electrodes 3 and 4 and the detection electrodes 5 and 6 thereafter. Further, by dicing along the center line 11 in FIG. 4, it can be divided into angular velocity sensors.

Next, the formation of the above-described resist film 13 will be described again with reference to FIG. As shown in FIG. 6, a pipe 17 is opened above the electrodeposition liquid tank 14,
The electrodeposition liquid 16 circulated from the electrodeposition liquid tank 14 via the pipe 18 and the pump 19 is made to flow from above the tuning fork 2 between the electrode plates 15 on both sides as shown in FIGS. That is, the electrodeposition liquid 16 moves downward from above. In that case, FIG.
As shown in FIG. 1, the base 1 shown in FIGS. 1 and 2 is located above and the tuning fork 2 is installed below. In this case, the flow of the electrodeposition liquid 16 flowing from the upper side to the lower side is formed such that the flow of the electrodeposition liquid 16 along the tuning fork 2, particularly along the drive electrodes 3 and 4. In this case, the flow is slightly but stagnant on the surface of the tuning fork 2 where the detection electrode 5 exists. As a result, as shown in FIG. 7, the thickness of the resist film 13a between the tuning forks 2 can be increased.

FIG. 7 shows a cross section taken along an arrow A in FIG. 5. The resist film 13a in FIG. 7 is a resist film thickness in a portion B on the side surface of the boundary between the base 1 and the tuning fork 2 in FIG. Is shown. In this case, even if the resist film 13 is subsequently heated and contracted as shown in FIG.
At the edge of the portion, that is, at the portion C in FIG. 8, the resist film 13a having a sufficient film thickness is formed. Therefore, since the edge C is not exposed, a sufficient resist effect can be expected even if the edge C is present.

[0023]

As described above, according to the present invention, when a continuous conductive film is formed on one surface of a three-dimensional structure and another surface in contact with the three-dimensional structure, an electrode film is formed on one surface and the other surface. Since the resist film is formed by electrodeposition, a resist film having an appropriate thickness can be formed on the conductive film, and as a result, the patterning of the conductive film is appropriately performed using the resist film later. In this way, an appropriate electrode can be formed as a result.

[Brief description of the drawings]

FIG. 1A is a front view of an angular velocity sensor according to an embodiment of the present invention, and FIG.

2A is a perspective view from the front side, and FIG. 2B is a perspective view from the back side.

3 (a) to 3 (g) are cross-sectional views each showing a manufacturing process.

FIG. 4 is a front view showing the manufacturing process.

FIG. 5 is a perspective view showing the manufacturing process.

FIG. 6 is a sectional view showing the manufacturing process.

FIG. 7 is a cross-sectional view of the main part.

FIG. 8 is a sectional view of a main part thereof.

[Explanation of symbols]

 Reference Signs List 1 base 2 tuning fork 3,4 drive electrode 5,6 detection electrode 7,8 crystal plate 9,10 etching resist 11 center line 12 conductive film 13 resist film 14 electrodeposition liquid tank 15 electrode plate 16 electrodeposition liquid 17,18 pipe 19 pump

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) G01P 9/04 H01L 41/08 Z G03F 7/40 521 41/18 101A F-term (Reference) 2F105 AA02 BB15 CC01 CC06 CD02 CD06 2H096 AA27 HA17 JA04 5J108 MM14

Claims (3)

[Claims] 1. A continuous conductive film is formed on one surface of a three-dimensional body and the other surface in contact with the three-dimensional structure, a resist film is formed on the conductive film by electrodeposition, and then a mask is provided on the resist film to perform exposure. Then, a pattern is formed on the resist film by bringing a developer into contact with the solid, and then the conductive film is etched using the patterned resist film to form an electrode having a predetermined shape. Electrode forming method. 2. The method for forming a three-dimensional electrode according to claim 1, wherein the thickness of the resist film formed on the other surface is larger than the thickness of the resist film formed on one surface of the three-dimensional body. 3. The method for forming an electrode on a three-dimensional object according to claim 2, wherein an electrodeposition liquid flow along one surface of the three-dimensional object is formed in an electrodeposition liquid bath in which the three-dimensional object is immersed in the step of electrodepositing the resist film.