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JP2002346912A - Glass substrate for information recording medium and manufacturing method therefor - Google Patents

Glass substrate for information recording medium and manufacturing method therefor

Info

Publication number
JP2002346912A
JP2002346912A JP2001148932A JP2001148932A JP2002346912A JP 2002346912 A JP2002346912 A JP 2002346912A JP 2001148932 A JP2001148932 A JP 2001148932A JP 2001148932 A JP2001148932 A JP 2001148932A JP 2002346912 A JP2002346912 A JP 2002346912A
Authority
JP
Japan
Prior art keywords
glass substrate
recording medium
information recording
polishing
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001148932A
Other languages
Japanese (ja)
Inventor
Yoichi Tajima
洋一 田島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Sheet Glass Co Ltd
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Priority to JP2001148932A priority Critical patent/JP2002346912A/en
Publication of JP2002346912A publication Critical patent/JP2002346912A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a glass substrate for an information recording medium capable of reducing generation of orange peel and scratch and the glass substrate for the information recording medium polished by the manufacturing method. SOLUTION: In this manufacturing method for the glass substrate for the information recording medium, lapping, first polisher working and second polisher working are performed in a polishing process after substrate working is performed for the glass substrate for the information recording medium. In the first polisher working and second polisher working, cerium oxide is used as polishing agent. In the polishing agent, specific surface area of abrasive grain is 6 to 14 m<2> /g and a maximum particle size of a secondary particle size is 3.0 to 7.0 μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、情報記録媒体用ガ
ラス基板及びその製造方法に関する。
The present invention relates to a glass substrate for an information recording medium and a method for manufacturing the same.

【0002】[0002]

【従来の技術】情報記録媒体には磁気ディスク等があ
り、この磁気ディスク用の基板としては、ガラス基板が
用いられる。このガラス基板は、磁気ディスクの小型
化、薄板化に適しているのに加えて、高密度記録化のた
めに基板記録面の平坦性及び基板強度が優れている。ガ
ラス基板としては、一般に、化学強化や結晶化によって
基板強度を向上させた化学強化ガラス基板や結晶化ガラ
ス基板が用いられている。
2. Description of the Related Art An information recording medium includes a magnetic disk and the like, and a glass substrate is used as a substrate for the magnetic disk. This glass substrate is suitable not only for reducing the size and thickness of the magnetic disk, but also has excellent flatness of the substrate recording surface and excellent substrate strength for high-density recording. As the glass substrate, generally, a chemically strengthened glass substrate or a crystallized glass substrate whose substrate strength is improved by chemical strengthening or crystallization is used.

【0003】また、磁気ディスク上に記録された情報を
読取る磁気ヘッドも、高密度記録化に伴って薄膜ヘッド
から磁気抵抗型ヘッド(MRヘッド)、大型磁気抵抗型
ヘッド(GMRヘッド)へと推移してきている。
[0003] Magnetic heads for reading information recorded on a magnetic disk have also changed from thin film heads to magnetoresistive heads (MR heads) and large magnetoresistive heads (GMR heads) as recording density has increased. Have been doing.

【0004】このような磁気ディスク用ガラス基板は、
以下に述べるような製造方法により製造される(例え
ば、特開平11−221742号公報)。
[0004] Such a glass substrate for a magnetic disk is
It is manufactured by the manufacturing method described below (for example, JP-A-11-221742).

【0005】円盤加工工程 まず、アルミノシリケートガラスを母材とするガラス素
板をカッターホイールで円盤状に切り出す。
Disk Processing Step First, a glass base material using aluminosilicate glass as a base material is cut into a disk shape by a cutter wheel.

【0006】内外周端面面取り工程 次に、円筒状の砥石を用いてガラス基板の中心部に円孔
をあけると共に、外周端面及び内周端面に所定の面取り
加工を施す。このときの内外周端面の表面粗さ(Rma
x)は14μmである。
[0006] Then the outer peripheral edge chamfering process, by using a cylindrical grindstone with opening a round hole in the center of the glass substrate is subjected to a predetermined chamfering the outer peripheral end face and the inner peripheral end face. At this time, the surface roughness (Rma
x) is 14 μm.

【0007】内周端面研磨工程 ガラス基板を重ね合わせた状態でガラス基板の内周端面
を回転ナイロンブラシにより酸化セリウム砥粒研磨剤を
用いて研磨する。
Inner Peripheral End Surface Polishing Step The inner peripheral end surface of the glass substrate is polished by a rotating nylon brush using a cerium oxide abrasive abrasive with the glass substrates superposed.

【0008】記録面ラッピング工程 両面ラッピングマシンにより、自公転する樹脂製キャリ
アのホール内に収容されたガラス基板の記録面を鋳鉄製
の一対の定盤で粒度#1000のアルミナ砥粒研磨剤を
用いて表面粗さ(Rmax)2μm程度にラッピングす
る。
Recording surface lapping process The recording surface of the glass substrate housed in the hole of the resin carrier revolving around by a double-sided lapping machine is formed on a pair of cast iron platens using an alumina abrasive having a grain size of # 1000. Lapping to a surface roughness (Rmax) of about 2 μm.

【0009】記録面研磨工程 記録面ラッピング工程でラッピングされたガラス基板の
記録面を、当該記録面ラッピング工程で残留した傷や歪
みを除去するために酸化セリウム懸濁液を用いてポリシ
ャ(硬質布)により研磨し、さらに、別のポリシャ(軟
質布)により研磨する。
Recording surface polishing step The recording surface of the glass substrate wrapped in the recording surface lapping step is polished with a cerium oxide suspension (hard cloth) to remove scratches and distortion remaining in the recording surface lapping step. ), And further polished with another polisher (soft cloth).

【0010】洗浄工程 記録面研磨工程で研磨されたガラス基板を酸性水溶液及
びアルカリ性水溶液を使用して洗浄する。
Cleaning Step The glass substrate polished in the recording surface polishing step is cleaned using an acidic aqueous solution and an alkaline aqueous solution.

【0011】[0011]

【発明が解決しようとする課題】しかしながら、記録面
磨工程においてオレンジピール(白曇り現象)やスクラ
ッチなどが発生することがある。このオレンジピールや
スクラッチは、磁気記録膜をコーティングしたときに記
録膜表面に凹凸を与えるので、ヘッドによる読出し、書
込みのエラーの原因となるので除去する必要があるが、
記録面第2研磨工程の次の洗浄工程では除去することが
できない。したがって、オレンジピールやスクラッチの
発生した情報記録媒体用ガラス基板は廃棄せざるを得な
いので不経済であるという問題が生じる。
However, in the process of polishing the recording surface, orange peel (white clouding phenomenon) and scratches may occur. These orange peels and scratches give irregularities to the surface of the recording film when the magnetic recording film is coated, and cause reading and writing errors by the head, so it is necessary to remove them.
It cannot be removed in the cleaning step following the recording surface second polishing step. Therefore, there is a problem that the glass substrate for an information recording medium having orange peel or scratches has to be discarded, which is uneconomical.

【0012】本発明の目的は、研磨力を維持しつつオレ
ンジピール、スクラッチなどの発生を防止できる情報記
録媒体用ガラス基板の製造方法及び該製造方法によって
研磨された情報記録媒体用ガラス基板を提供することに
ある。
An object of the present invention is to provide a method of manufacturing a glass substrate for an information recording medium which can prevent the occurrence of orange peel, scratches, etc. while maintaining a polishing force, and a glass substrate for an information recording medium polished by the manufacturing method. Is to do.

【0013】[0013]

【課題を解決するための手段】上記目的を達成するため
に、請求項1記載の製造方法は、研磨剤を使用して情報
記録媒体用ガラス基板を精密研磨処理する情報記録媒体
用ガラス基板の製造方法において、前記研磨剤は、砥粒
の比表面積が6〜14m2/gの酸化セリウムであるこ
とを特徴とする。
According to a first aspect of the present invention, there is provided a manufacturing method of a glass substrate for an information recording medium, wherein the glass substrate for an information recording medium is precisely polished using an abrasive. In the manufacturing method, the abrasive is cerium oxide having a specific surface area of abrasive grains of 6 to 14 m 2 / g.

【0014】請求項1記載の製造方法によれば、研磨剤
は、砥粒の比表面積が6m2/g〜14m2/gの酸化セ
リウムであるので、化学的研磨力を維持しつつオレンジ
ピールの発生を防止できる。
[0014] According to the manufacturing method according to claim 1, wherein, the abrasive, orange peel and the specific surface area of the abrasive grains are cerium oxide 6m 2 / g~14m 2 / g, while maintaining the chemical polishing force Can be prevented.

【0015】請求項2記載の製造方法は、請求項1記載
の製造方法において、前記研磨剤は、二次粒径の最大粒
径が3.0〜7.0μmであることを特徴とする。
According to a second aspect of the present invention, in the manufacturing method of the first aspect, the abrasive has a maximum secondary particle diameter of 3.0 to 7.0 μm.

【0016】請求項2記載の製造方法によれば、前記研
磨剤は、二次粒径の最大粒径が3.0〜7.0μmであ
るので機械的研磨力を維持しつつスクラッチの発生を防
止できる。
According to the second aspect of the present invention, the abrasive has a maximum secondary particle diameter of 3.0 to 7.0 μm, so that it can prevent scratches while maintaining a mechanical polishing force. Can be prevented.

【0017】上記目的を達成するために、請求項3記載
の情報記録媒体用ガラス基板は、請求項1又は2記載の
情報記録媒体用ガラス基板の製造方法によって研磨され
たことを特徴とする。
In order to achieve the above object, a glass substrate for an information recording medium according to claim 3 is polished by the method for manufacturing a glass substrate for an information recording medium according to claim 1 or 2.

【0018】請求項3記載の情報記録媒体用ガラス基板
によれば、オレンジピール、スクラッチなどのない情報
記録媒体用ガラス基板を得ることができる。
According to the glass substrate for an information recording medium according to the third aspect, it is possible to obtain a glass substrate for an information recording medium free of orange peel, scratches, and the like.

【0019】[0019]

【発明の実施の形態】本発明者は、上記目的を達成すべ
く鋭意検討を行った結果、研磨剤を使用して情報記録媒
体用ガラス基板を精密研磨処理する情報記録媒体用ガラ
ス基板の製造方法において、前記研磨剤は、砥粒の比表
面積が6〜14m2/gの酸化セリウムであるときに、
化学的研磨力を維持しつつオレンジピールの発生を防止
できることを見出した。
BEST MODE FOR CARRYING OUT THE INVENTION As a result of intensive studies to achieve the above object, the present inventor has produced a glass substrate for an information recording medium in which the glass substrate for an information recording medium is precisely polished using an abrasive. In the method, when the abrasive is cerium oxide having a specific surface area of abrasive grains of 6 to 14 m 2 / g,
It has been found that the generation of orange peel can be prevented while maintaining the chemical polishing power.

【0020】また、本発明者は、研磨剤は、二次粒径の
最大粒径が3.0〜7.0μmであるときに、機械的研
磨力を維持しつつスクラッチの発生を防止できることを
見出した。
The present inventor has reported that the abrasive can prevent scratches while maintaining the mechanical polishing force when the maximum secondary particle size is 3.0 to 7.0 μm. I found it.

【0021】本発明は、上記研究の結果に基づいてなさ
れたものである。
The present invention has been made based on the results of the above research.

【0022】以下、本発明の実施の形態に係る情報記録
媒体用ガラス基板の製造方法を図面を参照しながら詳細
に説明する。
Hereinafter, a method for manufacturing a glass substrate for an information recording medium according to an embodiment of the present invention will be described in detail with reference to the drawings.

【0023】図1は、本発明の実施の形態に係る情報記
録媒体用ガラス基板の研磨を含む情報記録媒体の製造工
程図である。
FIG. 1 is a process chart for manufacturing an information recording medium including polishing of a glass substrate for an information recording medium according to an embodiment of the present invention.

【0024】図1に示すように、情報記録媒体用ガラス
基板は、基板加工工程1→研磨工程2→テクスチャ処理
工程3→化学強化処理工程4→仕上げ洗浄工程5を経て
作製され、その後成膜工程6で基板上に多層膜を積層す
ることにより情報記録媒体が製造される。
As shown in FIG. 1, a glass substrate for an information recording medium is manufactured through a substrate processing step 1 → polishing step 2 → texture processing step 3 → chemical strengthening processing step 4 → finish cleaning step 5 and then forming a film. In step 6, an information recording medium is manufactured by laminating a multilayer film on the substrate.

【0025】以下、上記各工程を順次説明する。Hereinafter, each of the above steps will be sequentially described.

【0026】(1)基板加工工程 基板加工工程1では、ダイヤモンド砥石等の砥石を使用
してシート状のガラス材料に研削加工を施し、所定のド
ーナツ形状からなるガラス基板を作製する。
(1) Substrate Processing Step In the substrate processing step 1, a sheet-like glass material is ground using a grindstone such as a diamond grindstone to produce a glass substrate having a predetermined donut shape.

【0027】ガラス基板の基板材料は特に限定されるも
のではなく、表面加工処理が容易で且つ弾性率と剛性、
強度の高いガラスや結晶化ガラスを使用することができ
るが、酸に対して溶出し易く良好なテクスチャを形成す
ることのできる無機ガラス、例えばLiO2等のアルカ
リ金属酸化物やMgO等のアルカリ土類金属酸化物、及
びAl23等を含有したアルミナシリケート系ガラスを
使用するのが好ましい。
The substrate material of the glass substrate is not particularly limited, and the surface processing is easy, and the elastic modulus and the rigidity are high.
High-strength glass or crystallized glass can be used, but inorganic glass that can be easily eluted with acid and can form a good texture, for example, an alkali metal oxide such as LiO 2 or an alkaline earth such as MgO. It is preferable to use an alumina silicate-based glass containing a metal oxide and Al 2 O 3 or the like.

【0028】(2)研磨工程 研磨工程2は、ラッピング加工、第1のポリシャ加工、
第2のポリシャ加工、及び仕上げ研磨加工の4段階に分
けて行われる。
(2) Polishing Step The polishing step 2 includes a lapping process, a first polisher process,
The second polishing process and the finish polishing process are performed in four stages.

【0029】すなわち、まず、ラッピング装置を使用
し、所定の砥粒粒度を有するアルミナ等の砥粒でラッピ
ング加工を行い、次いで、遊離砥粒を研磨液に分散させ
た酸化セリウム(CeO2)研磨剤と硬質ポリシャとを
使用して第1のポリシャ加工を行い、さらに、硬質ポリ
シャを軟質ポリシャに代えて第2のポリシャ加工を行
う。
That is, first, using a lapping apparatus, lapping is performed with abrasive grains such as alumina having a predetermined grain size, and then cerium oxide (CeO 2 ) polishing in which free abrasive grains are dispersed in a polishing solution. The first polisher processing is performed using the agent and the hard polisher, and the second polisher processing is performed instead of the hard polisher by the soft polisher.

【0030】ここで、図2を参照しながら研磨装置につ
いて説明する。
Here, the polishing apparatus will be described with reference to FIG.

【0031】図2は、図1における研磨工程で使用され
る研磨装置の主要部の部分切欠き斜視図である。なお、
ラッピング装置の構造は研磨装置20の構造と同一であ
り、後述するポリシャの有無と研磨剤の種類とが研磨装
置20とは異なるだけであるのでラッピング装置の説明
は省略する。
FIG. 2 is a partially cutaway perspective view of a main part of the polishing apparatus used in the polishing step in FIG. In addition,
The structure of the lapping device is the same as the structure of the polishing device 20, and the only difference between the polishing device 20 and the presence or absence of a polisher described later is the description of the lapping device.

【0032】研磨装置20は、鋳鉄製の水平な上定盤2
1と、同じく鋳鉄製の水平な下定盤22とから成る。上
定盤21の研磨面はピッチ20mmの格子状に幅2.5
mmの溝が切られており、下定盤22の研磨面はピッチ
30mmの格子状に幅2.5mmの溝が切られている。
また、上定盤21は、回転支持軸23を有し、この回転
支持軸23の回りにスラリー状のCeO2砥粒研磨剤の
供給口24が16個等角度間隔で設けられている。
The polishing apparatus 20 comprises a horizontal upper platen 2 made of cast iron.
1 and a horizontal lower platen 22 also made of cast iron. The polishing surface of the upper stool 21 has a width of 2.5
The polishing surface of the lower platen 22 is cut in a grid shape with a pitch of 30 mm and has a width of 2.5 mm.
The upper platen 21 has a rotation support shaft 23, and around the rotation support shaft 23, 16 supply ports 24 of slurry-like CeO 2 abrasive abrasive are provided at equal angular intervals.

【0033】上定盤21は、上から見て時計回りに(以
下、時計回り及び反時計回りという場合は全て上から見
た回転方向をいう。)16〜18rpmで、下定盤22
は、反時計回りに50〜55rpmで回転する。
The upper platen 21 is 16-18 rpm clockwise as viewed from above (hereinafter, clockwise and counterclockwise all refer to the rotational direction as viewed from above), and the lower platen 22.
Rotates counterclockwise at 50-55 rpm.

【0034】下定盤22の中心部には、太陽歯車25が
配されており、同外周部には、内歯歯車26が配されて
いる。また、下定盤22上には、太陽歯車25及び内歯
歯車26の双方に噛合する遊星歯車を備えるキャリア2
7が5個配されている。研磨装置20では、太陽歯車2
5が、例えば15〜22rpmで反時計回りに回転する
と共に、内歯歯車26は、例えば21〜29rpmで反
時計回りに回転するときに、キャリア27は、下定盤2
2上で時計回りに自転しながら、例えば50rpmで反
時計回りに公転する。キャリア27は、ガラス繊維入り
エポキシ樹脂であり、その厚さは、ガラス基板の仕上げ
厚さ(例えば1mm)より、例えば0.2〜0.6mm
小さい値である。キャリア27の材料は、アラミド繊維
入りエポキシであってもよい。
A sun gear 25 is arranged at the center of the lower platen 22, and an internal gear 26 is arranged at the outer periphery. A carrier 2 having a planetary gear meshing with both the sun gear 25 and the internal gear 26 is provided on the lower platen 22.
7 are arranged. In the polishing apparatus 20, the sun gear 2
5 rotates counterclockwise at, for example, 15 to 22 rpm, and the internal gear 26 rotates counterclockwise at, for example, 21 to 29 rpm.
2, while revolving clockwise, revolves counterclockwise at, for example, 50 rpm. The carrier 27 is an epoxy resin containing glass fiber, and its thickness is, for example, 0.2 to 0.6 mm from the finished thickness (for example, 1 mm) of the glass substrate.
It is a small value. The material of the carrier 27 may be an epoxy containing aramid fiber.

【0035】図3は、図2におけるキャリア27の拡大
斜視図である。キャリア27は、ガラス基板を収容する
ホール28を、例えば7個周方向に等角度間隔で備えて
いる。また、ホール28の直径は、図4に示すように、
ガラス基板30の外径より、例えば2.25mm大きく
設定されている。このようにホール28の直径を設定す
ると、ガラス基板30の外周端面の損傷を少なくするこ
とができる。ホール28の直径とガラス基板30の外径
との差は1〜2mmであってもよい。また、ホール28
を規定するキャリア27の壁にスポンジのような柔軟な
介在物を貼り付けてもよい。
FIG. 3 is an enlarged perspective view of the carrier 27 in FIG. The carrier 27 has, for example, seven holes 28 for accommodating glass substrates at equal angular intervals in the circumferential direction. The diameter of the hole 28 is as shown in FIG.
For example, the outer diameter of the glass substrate 30 is set to be larger by 2.25 mm. By setting the diameter of the hole 28 in this manner, damage to the outer peripheral end surface of the glass substrate 30 can be reduced. The difference between the diameter of the hole 28 and the outer diameter of the glass substrate 30 may be 1 to 2 mm. In addition, hall 28
May be attached to the wall of the carrier 27 which defines the above.

【0036】上記研磨装置20と同様のラッピング装置
によってガラス基板にラッピング加工を行った後に研磨
装置20によってガラス基板を研磨する。研磨装置20
は、自転するキャリヤ27内に収容されたガラス基板3
0の記録面をCeO2砥粒研磨剤を用いて研磨する。こ
のCeO2砥粒は、比表面積が6〜14m2/gのもので
あって、さらに、懸濁液中のCeO2砥粒の二次粒径の
最大粒子径(Dmax)が3.0〜7.0μmのものであ
る。この際に情報記録媒体用ガラス基板の研磨にこのよ
うな研磨剤を使用したのは以下の理由による。
After the lapping process is performed on the glass substrate by the same lapping device as the polishing device 20, the glass substrate is polished by the polishing device 20. Polishing device 20
Is the glass substrate 3 accommodated in the carrier 27 that rotates.
The recording surface of No. 0 is polished using CeO 2 abrasive. The CeO 2 abrasive has a specific surface area of 6 to 14 m 2 / g, and the maximum secondary particle diameter (D max ) of the CeO 2 abrasive in the suspension is 3.0. ~ 7.0 µm. The reason for using such an abrasive for polishing the glass substrate for an information recording medium at this time is as follows.

【0037】下記の、表1、表2、及び図5に示すよう
に、CeO2砥粒の比表面積が6m2/gよりも小さい場
合、化学的研磨力が小さくなって実用的でない。一方、
CeO2砥粒の比表面積が14m2/gよりも大きい場
合、オレンジピールが発生するようになる。
As shown in Tables 1 and 2 below and FIG. 5, when the specific surface area of the CeO 2 abrasive grains is smaller than 6 m 2 / g, the chemical polishing power is too small to be practical. on the other hand,
When the specific surface area of the CeO 2 abrasive grains is larger than 14 m 2 / g, orange peel is generated.

【0038】[0038]

【表1】 [Table 1]

【0039】[0039]

【表2】 [Table 2]

【0040】また、Dmaxが3.0μmよりも小さい場
合、機械的研磨力が小さいので研磨レートが実用的でな
い程に低い。一方、Dmaxが7.0μmよりも大きい場
合、スクラッチが発生するようになる。Dmaxが3.0
〜7.0μmの場合は、スクラッチが発生せず、かつ、
研磨レートが0.45〜0.7μm/minと高い。以
上のような理由から、本実施の形態ではCeO2砥粒の
比表面積と二次粒径の最大粒子径(Dmax)とが夫々上
記の範囲のものを使用した。
When D max is smaller than 3.0 μm, the polishing rate is too low to be practical because the mechanical polishing power is small. On the other hand, when Dmax is larger than 7.0 μm, scratches occur. D max is 3.0
In the case of up to 7.0 μm, no scratch occurs, and
The polishing rate is as high as 0.45 to 0.7 μm / min. For the reasons described above, in this embodiment, the specific surface area of CeO 2 abrasive grains and the maximum particle diameter (D max ) of the secondary particle diameter in the respective ranges described above were used.

【0041】研磨剤に使用される遊離砥粒は、焼成処理
された焼結体を粉砕して得られるが、遊離砥粒原料とし
て例えば天然のCeO2を使用した場合、CeO2中に
は、通常6wt%〜8wt%のフッ素成分が金属フッ化
物の形態で含有されている。
The free abrasive used in the abrasive is obtained by pulverizing a sintered body which has been subjected to a firing treatment. When natural CeO 2 is used as a raw material for free abrasive, for example, CeO 2 contains: Usually, 6 to 8 wt% of a fluorine component is contained in the form of metal fluoride.

【0042】尚、研磨剤は、分取した上澄み液に超音波
を照射したり激しく撹拌し、或いは高圧のジェット流を
内壁に衝突させることにより遊離砥粒を微粉砕及び分散
させることにより容易に所望の調整を行なうことができ
る。
The polishing agent can be easily obtained by irradiating the separated supernatant liquid with ultrasonic waves or stirring vigorously, or by finely pulverizing and dispersing free abrasive grains by impinging a high-pressure jet stream on the inner wall. Desired adjustments can be made.

【0043】そして、前記研磨剤及びスエードタイプの
研磨パッドを使用して研磨を行う。
Then, polishing is performed using the polishing agent and a suede type polishing pad.

【0044】この場合、懸濁液を湿式分級した後、所定
時間T1(例えば、40時間)以内に使用すれば遊離砥
粒が凝集したり、研磨剤中にバクテリアが発生するのを
回避することができ、したがって研磨剤は前記所定時間
T1内で使用するのが好ましい。
In this case, if the suspension is used within a predetermined time T1 (for example, 40 hours) after the wet classification, it is possible to avoid aggregation of free abrasive grains and generation of bacteria in the abrasive. Therefore, the abrasive is preferably used within the predetermined time T1.

【0045】また、砥粒の形状としては、多面体形状を
有することが好ましい。
It is preferable that the abrasive grains have a polyhedral shape.

【0046】すなわち、ガラス基板に微小凹凸を形成す
るのに必要な微細な圧縮層は、遊離砥粒の角部がガラス
基板の表面に押圧され、このためガラス基板に局所的な
応力が負荷されて形成されるものと考えられる。したが
って、砥粒の形状が球形状の場合は、前記局所的な応力
が負荷されないために所望のエッチング処理に好適した
圧縮層を形成し難くなる。このため、砥粒の形状は多面
体形状が好ましい。
That is, in the fine compressed layer necessary for forming minute irregularities on the glass substrate, the corners of the free abrasive grains are pressed against the surface of the glass substrate, and therefore local stress is applied to the glass substrate. It is considered to be formed. Therefore, when the shape of the abrasive grains is spherical, it is difficult to form a compressed layer suitable for a desired etching process because the local stress is not applied. For this reason, the shape of the abrasive grains is preferably a polyhedral shape.

【0047】また研磨に使用する研磨パッドについて
は、特に限定されず、不織布や発泡体を用いることがで
きる。連続発泡層の表面を仕上げて開口部を形成した層
(NAP層)とベース層から形成されるスエードパッド
を使用すると、ガラス基板が傷付きにくく好ましい。ま
た、研磨前にパッド表面を仕上げてより均質性を高める
ことは、極微細な圧縮応力層をより均一に形成できる点
で好ましい。
The polishing pad used for polishing is not particularly limited, and a nonwoven fabric or a foam can be used. It is preferable to use a layer (NAP layer) in which an opening is formed by finishing the surface of the continuous foam layer and a suede pad formed from the base layer, since the glass substrate is unlikely to be damaged. It is preferable to improve the homogeneity by finishing the pad surface before polishing, since an extremely fine compressive stress layer can be formed more uniformly.

【0048】(3)テクスチャ処理工程 テクスチャ処理工程3は、洗浄工程と乾燥工程とからな
る。
(3) Texture processing step Texture processing step 3 includes a cleaning step and a drying step.

【0049】まず、洗浄工程では酸性水溶液及びアルカ
リ性水溶液を使用し研磨処理されたガラス基板を洗浄す
る。
First, in the cleaning step, the polished glass substrate is cleaned using an acidic aqueous solution and an alkaline aqueous solution.

【0050】すなわち、酸性水溶液中ではガラス中の一
部の成分が溶出して、ガラスの骨格成分であるSiO2
に富んだ状態となる。このSiO2はアルカリ性水溶液
に対し可溶性を有するため、ガラス基板1を酸性水溶液
で洗浄した後、アルカリ性水溶液で洗浄するとガラス基
板1の表面はエッチングされ易くなる。
That is, in the acidic aqueous solution, some components in the glass are eluted and SiO 2 which is a skeleton component of the glass is eluted.
It will be rich. Since this SiO 2 is soluble in an alkaline aqueous solution, if the glass substrate 1 is washed with an acidic aqueous solution and then washed with an alkaline aqueous solution, the surface of the glass substrate 1 is easily etched.

【0051】酸性水溶液及びアルカリ性水溶液の濃度は
特に限定されず、洗浄時間及び洗浄温度も特に限定され
ない。
The concentrations of the acidic aqueous solution and the alkaline aqueous solution are not particularly limited, and the washing time and the washing temperature are not particularly limited.

【0052】洗浄方法は、例えば、ガラス基板を酸性水
溶液又はアルカリ水溶液に浸漬して行う。この場合、ガ
ラス基板に超音波を照射しながら洗浄を行ってもよい。
また、この浸漬方式の他、シャワー方式、噴射方式等を
使用してもよい。
The cleaning method is performed, for example, by immersing the glass substrate in an acidic aqueous solution or an alkaline aqueous solution. In this case, the cleaning may be performed while irradiating the glass substrate with ultrasonic waves.
In addition to the immersion method, a shower method, an injection method, or the like may be used.

【0053】次に、乾燥工程に移り、前記洗浄されたガ
ラス基板を乾燥させる。
Next, the process proceeds to a drying step, and the washed glass substrate is dried.

【0054】乾燥方法も特に限定されるものではなく、
イソプロピルアルコール(IPA)蒸気中にガラス基板1
を浸漬するIPA蒸気乾燥法や、ガラス基板を高速回転
させて洗浄水を除去するスピン乾燥法等を実行できる。
The drying method is not particularly limited, either.
Glass substrate 1 in isopropyl alcohol (IPA) vapor
Immersion, or a spin drying method in which a glass substrate is rotated at high speed to remove washing water.

【0055】(4)化学強化処理工程 化学強化処理工程4では、所定温度に調整された溶融
塩、例えば硝酸カリウム(KNO3)と硝酸ナトリウム
(NaNO3)の混合溶液からなる溶融塩にガラス基板
を所定時間浸漬し、ガラス基板の化学成分中のLi+1
Na+1をイオン半径の大きいK+1にイオン交換する化学
強化処理が実行される。このような化学強化処理を行う
ことにより表面圧縮応力が高められ、これにより磁気デ
ィスクを高速回転させても破損するのを防止することが
できる。
(4) Chemical strengthening treatment step In the chemical strengthening treatment step 4, the glass substrate is placed on a molten salt adjusted to a predetermined temperature, for example, a molten salt composed of a mixed solution of potassium nitrate (KNO 3 ) and sodium nitrate (NaNO 3 ). After immersion for a predetermined time, a chemical strengthening process is performed in which Li +1 and Na +1 in the chemical components of the glass substrate are ion-exchanged into K +1 having a large ionic radius. By performing such a chemical strengthening treatment, the surface compressive stress is increased, and thereby, even if the magnetic disk is rotated at a high speed, it can be prevented from being damaged.

【0056】次に、ガラス基板を常温まで徐冷し、ガラ
ス基板に付着している溶融塩を純水中で洗い落とす。
Next, the glass substrate is gradually cooled to room temperature, and the molten salt attached to the glass substrate is washed away in pure water.

【0057】(5)仕上げ洗浄工程 仕上げ洗浄工程5ではガラス基板をアルカリ性水溶液中
に浸漬し、必要に応じて超音波を照射しながらアルカリ
洗浄を行い、ガラス基板に固着している鉄粉等の不純
物、すなわち残留異物をエッチング除去する。
(5) Finish Cleaning Step In the finish cleaning step 5, the glass substrate is immersed in an alkaline aqueous solution and, if necessary, washed with alkali while irradiating ultrasonic waves to remove iron powder or the like adhered to the glass substrate. Impurities, that is, residual foreign matters are removed by etching.

【0058】(6)成膜工程 成膜工程6では周知のスパッタリング法を使用してシー
ド層、下地層、磁性層、及び保護層をガラス基板上に順
次積層し、その後、浸漬法により保護層の表面に潤滑層
を形成し、これにより情報記録媒体が製造される。
(6) Film Forming Step In the film forming step 6, a seed layer, an underlayer, a magnetic layer, and a protective layer are sequentially laminated on a glass substrate by using a well-known sputtering method. A lubricating layer is formed on the surface of the substrate, whereby an information recording medium is manufactured.

【0059】[0059]

【実施例】次に、本発明の実施例を具体的に説明する。Next, embodiments of the present invention will be described specifically.

【0060】本発明者等は、SiO2:67mol%、A
23:10mol%、Li2O:7mol%、Na2O:9mo
l%、MgO:3mol%、CaO:4mol%の化学組成を
有するアルミノシリケートガラスに対し、ダイヤモンド
砥石を使用して研削加工を施し、外径65mm、内径2
0mm、板厚1.0mmのドーナツ状ガラス基板を作製
した。
The present inventors have found that SiO 2: 67 mol%, A
l 2 O 3 : 10 mol%, Li 2 O: 7 mol%, Na 2 O: 9 mol
An aluminosilicate glass having a chemical composition of l%, MgO: 3 mol%, and CaO: 4 mol% is subjected to grinding using a diamond grindstone to have an outer diameter of 65 mm and an inner diameter of 2 mm.
A doughnut-shaped glass substrate having a thickness of 0 mm and a thickness of 1.0 mm was produced.

【0061】次いで、ラッピング装置を使用し、砥粒粒
度#1000のアルミナ砥粒を使用して表面粗さRaが
2μm程度となるようにラッピング加工を施した。
Then, using a lapping apparatus, lapping was performed using alumina abrasive grains having an abrasive grain size of # 1000 so that the surface roughness Ra was about 2 μm.

【0062】次に、このようにしてラッピング加工が施
されたガラス基板を純水槽に浸漬して洗浄した後、研磨
パッドとして硬質ポリシャを使用すると共に、比表面積
が6〜14m2/gのものであって、さらに、懸濁液中
の二次粒径の最大粒子径(Dm ax)が3.0〜7.0μ
mのCeO2砥粒を水中に分散させた研磨剤を使用して
第1のポリシャ加工及び第2のポリシャ加工を行った。
Next, lapping is performed in this manner.
After immersing the cleaned glass substrate in a pure water bath and cleaning it,
Uses hard polisher as pad and specific surface area
Is 6-14mTwo/ G and further in the suspension
Maximum secondary particle diameter (Dm ax) Is 3.0 to 7.0 μm
m CeOTwoUsing an abrasive with abrasive particles dispersed in water
The first polisher processing and the second polisher processing were performed.

【0063】[0063]

【発明の効果】以上詳細に説明したように、請求項1記
載の製造方法によれば、研磨剤は、砥粒の比表面積が6
〜14m2/gの酸化セリウムであるので、化学的研磨
力を維持しつつオレンジピールの発生を防止できる。
As described above in detail, according to the manufacturing method of the first aspect, the abrasive has a specific surface area of the abrasive grains of 6%.
Since it is リ ウ ム 14 m 2 / g of cerium oxide, it is possible to prevent the occurrence of orange peel while maintaining the chemical polishing force.

【0064】請求項2記載の製造方法によれば、前記研
磨剤は、二次粒径の最大粒径が3.0〜7.0μmであ
るので機械的研磨力を維持しつつスクラッチの発生を防
止できる。
According to the manufacturing method of the second aspect, the abrasive has a maximum secondary particle size of 3.0 to 7.0 μm, so that the abrasive can prevent scratches while maintaining a mechanical polishing force. Can be prevented.

【0065】請求項3記載の情報記録媒体用ガラス基板
によれば、オレンジピール、スクラッチなどのない情報
記録媒体用ガラス基板を得ることができる。
According to the glass substrate for an information recording medium according to the third aspect, a glass substrate for an information recording medium free of orange peel, scratches, etc. can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に係る情報記録媒体用ガラ
ス基板の研磨を含む情報記録媒体の製造工程図である。
FIG. 1 is a manufacturing process diagram of an information recording medium including polishing of a glass substrate for an information recording medium according to an embodiment of the present invention.

【図2】図1における研磨工程で使用される研磨装置の
主要部の部分切欠き斜視図である。
FIG. 2 is a partially cutaway perspective view of a main part of a polishing apparatus used in a polishing step in FIG.

【図3】図2におけるキャリア27の拡大斜視図であ
る。
FIG. 3 is an enlarged perspective view of a carrier 27 in FIG.

【図4】図2のキャリア27の部分説明図である。FIG. 4 is a partial explanatory view of a carrier 27 of FIG. 2;

【図5】酸化セリウムの最大粒子径と研磨レートの関係
を示す図である。
FIG. 5 is a graph showing a relationship between a maximum particle diameter of cerium oxide and a polishing rate.

【符号の説明】[Explanation of symbols]

2 研磨工程 20 研磨装置 21 上定盤 22 下定盤 24 供給口 25 太陽歯車 26 内歯歯車 27 キャリア 28 ホール 30 ガラス基板 2 Polishing process 20 Polishing device 21 Upper surface plate 22 Lower surface plate 24 Supply port 25 Sun gear 26 Internal gear 27 Carrier 28 Hole 30 Glass substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 研磨剤を使用して情報記録媒体用ガラス
基板を精密研磨処理する情報記録媒体用ガラス基板の製
造方法において、 前記研磨剤は、砥粒の比表面積が6〜14m2/gの酸
化セリウムであることを特徴とする情報記録媒体用ガラ
ス基板の製造方法。
1. A method for manufacturing a glass substrate for an information recording medium, wherein the glass substrate for an information recording medium is precisely polished using an abrasive, wherein the abrasive has a specific surface area of abrasive grains of 6 to 14 m 2 / g. A method for producing a glass substrate for an information recording medium, wherein the glass substrate is cerium oxide.
【請求項2】 前記研磨剤は、二次粒径の最大粒径が
3.0〜7.0μmであることを特徴とする請求項1記
載の情報記録媒体用ガラス基板の製造方法。
2. The method for manufacturing a glass substrate for an information recording medium according to claim 1, wherein the abrasive has a maximum secondary particle diameter of 3.0 to 7.0 μm.
【請求項3】 請求項1又は2記載の情報記録媒体用ガ
ラス基板の製造方法によって研磨されたことを特徴とす
る情報記録媒体用ガラス基板。
3. A glass substrate for an information recording medium, polished by the method for producing a glass substrate for an information recording medium according to claim 1.
JP2001148932A 2001-05-18 2001-05-18 Glass substrate for information recording medium and manufacturing method therefor Pending JP2002346912A (en)

Priority Applications (1)

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Family

ID=18994169

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104812529A (en) * 2012-12-28 2015-07-29 Hoya株式会社 Manufacturing method of glass substrate for use in information recording medium
WO2018052133A1 (en) * 2016-09-16 2018-03-22 ニッタ・ハース株式会社 Polishing pad
JP7524257B2 (en) 2022-04-28 2024-07-29 浙江美迪凱光学半導体有限公司 Square sheet polishing process

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JPH11181404A (en) * 1997-12-18 1999-07-06 Hitachi Chem Co Ltd Cerium oxide abrasive and grinding of substrate
JP2000182677A (en) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd Rechargeable battery charger
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JP2000239654A (en) * 1998-12-21 2000-09-05 Showa Denko Kk Cerium oxide slurry for polishing, preparation thereof, and polishing method
JP2000288922A (en) * 1999-03-31 2000-10-17 Hoya Corp Polishing carrier, polishing method and manufacture of information recording medium substrate
JP2000303060A (en) * 1999-04-19 2000-10-31 Seimi Chem Co Ltd Abrasive material for semiconductor containing fluorocompound abrasive grains
JP2001023154A (en) * 1999-07-08 2001-01-26 Mitsui Kinzoku Precision:Kk Method of manufacturing glass substrate for magnetic recording medium
JP2001072962A (en) * 1999-06-28 2001-03-21 Nissan Chem Ind Ltd Hard disc abrasive made of glass

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JPH10233378A (en) * 1997-01-10 1998-09-02 Texas Instr Inc <Ti> High-selectivity slurry for processing of shallow groove bury separation
JPH11181404A (en) * 1997-12-18 1999-07-06 Hitachi Chem Co Ltd Cerium oxide abrasive and grinding of substrate
JP2000182677A (en) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd Rechargeable battery charger
JP2000239654A (en) * 1998-12-21 2000-09-05 Showa Denko Kk Cerium oxide slurry for polishing, preparation thereof, and polishing method
JP2000188270A (en) * 1998-12-22 2000-07-04 Hitachi Chem Co Ltd Cerium oxide abrasive and method of grinding substrate
JP2000288922A (en) * 1999-03-31 2000-10-17 Hoya Corp Polishing carrier, polishing method and manufacture of information recording medium substrate
JP2000303060A (en) * 1999-04-19 2000-10-31 Seimi Chem Co Ltd Abrasive material for semiconductor containing fluorocompound abrasive grains
JP2001072962A (en) * 1999-06-28 2001-03-21 Nissan Chem Ind Ltd Hard disc abrasive made of glass
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104812529A (en) * 2012-12-28 2015-07-29 Hoya株式会社 Manufacturing method of glass substrate for use in information recording medium
WO2018052133A1 (en) * 2016-09-16 2018-03-22 ニッタ・ハース株式会社 Polishing pad
JPWO2018052133A1 (en) * 2016-09-16 2019-07-04 ニッタ・ハース株式会社 Polishing pad
JP7524257B2 (en) 2022-04-28 2024-07-29 浙江美迪凱光学半導体有限公司 Square sheet polishing process

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