JP2002337975A - Electronic component packaging cover tape - Google Patents
Electronic component packaging cover tapeInfo
- Publication number
- JP2002337975A JP2002337975A JP2001150368A JP2001150368A JP2002337975A JP 2002337975 A JP2002337975 A JP 2002337975A JP 2001150368 A JP2001150368 A JP 2001150368A JP 2001150368 A JP2001150368 A JP 2001150368A JP 2002337975 A JP2002337975 A JP 2002337975A
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- layer
- olefin
- electronic component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000004711 α-olefin Substances 0.000 claims abstract description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000005977 Ethylene Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 4
- 239000004677 Nylon Substances 0.000 claims abstract description 4
- 229920001778 nylon Polymers 0.000 claims abstract description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- 229920000554 ionomer Polymers 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims description 2
- 239000000088 plastic resin Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 40
- 230000009191 jumping Effects 0.000 abstract description 4
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 3
- 239000002216 antistatic agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 3
- -1 lithium perchlorate Chemical compound 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 101100160821 Bacillus subtilis (strain 168) yxdJ gene Proteins 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【発明が属する技術分野】本発明は、電子部品の保管、
輸送、装着に際し、電子部品を汚染から保護し、電子回
路基板に実装するために整列させ、取り出せる機能を有
する包装体のうち、収納ポケットを形成したプラスチッ
ク製キャリアテープにシールされ得るカバーテープに関
するものである。The present invention relates to the storage of electronic components,
A package having a function of protecting electronic components from contamination during transportation and mounting, aligning and mounting for mounting on an electronic circuit board, and a cover tape which can be sealed with a plastic carrier tape having a storage pocket formed therein. It is.
【0002】[0002]
【従来の技術】ICを始めとして、トランジスター、ダ
イオード、コンデンサー、圧電素子レジスター、などの
表面実装用電子部品は、電子部品の形状に合わせて、収
納しうるエンボス成形されたポケットを連続的に形成し
たプラスチック製キャリアテープとキャリアテープにシ
ールし得るカバーテープとからなる包装体に包装されて
供給されている。内容物の電子部品は包装体のカバーテ
ープを剥離した後、自動的に取り出され電子回路基板に
表面実装されている。近年、電子部品は小型化し、軽量
且つ薄型になってきている。一方、表面実装速度は高速
化が進みキャリアテープからカバーテープが引き剥がさ
れる速度も共に高速化している。その為、引き剥がされ
る際の強度(以下、剥離強度)が強くなったり弱くなっ
たりと言った脈動現象が顕著に現れ、包装された電子部
品がキャリアテープから飛び出すと言ったいわゆるジャ
ンピングトラブルが増加している。この様なトラブルを
防ぐ為に剥離強度を予め低く設定されるケースが増えて
いるがその為、剥離強度の僅かな経時変化や外力により
輸送途上にカバーテープが剥がれ電子部品がキャリアテ
ープからこぼれるトラブルも発生している。包装される
電子部品が比較的大きい場合は輸送途上、キャリアテー
プからの飛び出しを防止する為に予め剥離強度を強く設
定する場合が多い。しかし、その場合、剥離強度が経時
変化し剥離強度が強くなり過ぎると実装時、カバーテー
プがスムーズに剥がせなくなり電子部品を取り出せなく
なったりカバーテープが破断するトラブルが発生する場
合がある。2. Description of the Related Art Surface mounting electronic components such as ICs, transistors, diodes, capacitors, piezoelectric element registers, etc., continuously form embossed pockets that can be accommodated according to the shape of the electronic components. It is packaged and supplied by a plastic carrier tape and a cover tape that can be sealed to the carrier tape. After the cover tape of the package is peeled off, the electronic components of the contents are automatically taken out and surface-mounted on the electronic circuit board. In recent years, electronic components have become smaller, lighter and thinner. On the other hand, the surface mounting speed is increasing, and the speed at which the cover tape is peeled off from the carrier tape is also increasing. As a result, the pulsation phenomenon that the strength at the time of peeling (hereinafter referred to as peeling strength) becomes stronger or weaker appears remarkably, and the so-called jumping trouble that the packaged electronic component jumps out of the carrier tape increases. are doing. In order to prevent such troubles, the peel strength is often set to a low value in advance. Has also occurred. When the electronic components to be packaged are relatively large, the peel strength is often set in advance to prevent the electronic components from jumping out of the carrier tape during transportation. However, in this case, if the peel strength changes with time and the peel strength becomes too strong, there may be a problem that the cover tape cannot be peeled off smoothly during mounting, the electronic components cannot be taken out, or the cover tape breaks.
【0003】[0003]
【発明が解決しようとする課題】本発明は、前述の実装
時のジャンピングトラブル、剥離強度の経時変化による
輸送時の電子部品の飛び出し、実装時、カバーテープが
スムーズに剥がせなかったり破断してしまうと言った実
装トラブルを防止し、剥離強度が適度で且つ、透明なカ
バーテープを提供する。SUMMARY OF THE INVENTION According to the present invention, the above-mentioned jumping trouble at the time of mounting, the jump of the electronic component at the time of transportation due to the temporal change of the peeling strength, the cover tape at the time of mounting cannot be peeled off smoothly or breaks. Provided is a transparent cover tape which prevents mounting troubles such as accidental mounting and has an appropriate peel strength and is transparent.
【0004】[0004]
【課題を解決するための手段】本発明は、電子部品を収
納する収納ポケットを連続的に形成したプラスチック製
キャリアテープに、熱シールし得るカバーテープであっ
て、該カバーテープは、ポリエステル、ナイロンのいず
れかであるフィルム(以下、基材層)と熱可塑性樹脂か
らなる接着剤層とからなり該接着剤層がエチレンとα・
オレフィンの重量比率が異なる2種以上のエチレン−α
・オレフィン共重合体からなる事を特徴とする電子部品
包装用カバーテープである。また本発明は、上述α・オ
レフィンが酢酸ビニル、アクリル酸、アクリル酸メチ
ル、アクリル酸エチル、メタクリル酸、メタクリル酸メ
チル、アイオノマーであり、さらに、全光線透過率が7
0%以上で曇度が60%以下である電子部品包装用カバ
ーテープである。SUMMARY OF THE INVENTION The present invention is a cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, the cover tape being made of polyester, nylon or the like. (Hereinafter, a substrate layer) and an adhesive layer made of a thermoplastic resin, the adhesive layer comprising ethylene and α ·
Two or more types of ethylene-α having different olefin weight ratios
-A cover tape for packaging electronic parts, characterized by being made of an olefin copolymer. Further, in the present invention, the α-olefin is vinyl acetate, acrylic acid, methyl acrylate, ethyl acrylate, methacrylic acid, methyl methacrylate, and an ionomer.
It is a cover tape for packaging electronic parts having a haze of 0% or more and 60% or less.
【0005】[0005]
【発明の実施の形態】本発明のカバーテープ1の構成要
素の一例を図1で説明する。本発明の第1の態様では、
基材層3の表面に帯電防止剤層2を有さないものである
が、帯電防止剤層2を有することがより好ましい。第1
層である帯電防止剤層2は、界面活性剤、ポリピロール
系、ポリアニリン系、ポリチオフェン系等のπ電子共役
系導電性ポリマー、或いは酸化錫、酸化インジウム、酸
化亜鉛、酸化チタン、カーホ゛ンフ゛ラック、Si系有機化合物、ポリアル
キレングリコールと過塩素酸リチウムなどの過塩素酸塩
との複合体等の導電性フィラーからなり、帯電防止性を
上げる為に導電性フィラーにアンチモン等をドーピング
したものを使用してもよい。帯電防止剤層2を有しない
場合は予め基材層に上述帯電防止剤やアルキルアンモニ
ウム塩などの界面活性剤を練り込み帯電防止性を付与す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One example of components of a cover tape 1 of the present invention will be described with reference to FIG. In a first aspect of the present invention,
Although it does not have the antistatic agent layer 2 on the surface of the base material layer 3, it preferably has the antistatic agent layer 2. First
The antistatic agent layer 2, which is a layer, is made of a surfactant, a polypyrrole-based, polyaniline-based, polythiophene-based π-electron conjugated conductive polymer, or tin oxide, indium oxide, zinc oxide, titanium oxide, carbon black, or Si-based. Organic compounds, composed of conductive fillers such as a complex of polyalkylene glycol and perchlorate such as lithium perchlorate, and using a conductive filler doped with antimony or the like to increase antistatic properties Is also good. In the case where the antistatic agent layer 2 is not provided, the above-mentioned antistatic agent or a surfactant such as an alkylammonium salt is previously kneaded into the base material layer to impart antistatic properties.
【0006】第2層は、ポリエステルフィルム、ナイロ
ンフィルムのいずれかであるが剛性を持たせる為に延伸
されたフィルムを用いるのが好ましい。厚みは6〜10
0μmで透明なフィルムである。[0006] The second layer is either a polyester film or a nylon film, but it is preferable to use a stretched film to impart rigidity. The thickness is 6-10
0 μm transparent film.
【0007】第3層は熱可塑性樹脂からなり、厚みが
0.5〜100μmの接着剤層4であり、透明な層であ
る。第2層と第3層との接着強度を上げる為に第2層の
接着面をコロナ処理したり層間にイソシアネート等の熱
硬化性樹脂層5を設けても良い。図1(a)は、第2層
及び第3層間に熱硬化性樹脂層を設けない場合を示し、
図1(b)は第2層及び第3層間に熱硬化性樹脂層5を
設ける場合を示す。また、フィルムとしてのクッション
性をもたす為或いはコストダウン目的で熱硬化性樹脂層
5と接着剤層4の間にポリオレフィン層を設けてもよ
い。The third layer is made of a thermoplastic resin, is an adhesive layer 4 having a thickness of 0.5 to 100 μm, and is a transparent layer. In order to increase the bonding strength between the second layer and the third layer, the bonding surface of the second layer may be subjected to corona treatment, or a thermosetting resin layer 5 such as isocyanate may be provided between the layers. FIG. 1A shows a case where a thermosetting resin layer is not provided between the second layer and the third layer,
FIG. 1B shows a case where a thermosetting resin layer 5 is provided between the second layer and the third layer. In addition, a polyolefin layer may be provided between the thermosetting resin layer 5 and the adhesive layer 4 for providing cushioning properties as a film or for cost reduction.
【0008】接着剤層4はα・オレフィンが酢酸ビニ
ル、アクリル酸、アクリル酸メチル、アクリル酸エチ
ル、メタクリル酸、メタクリル酸メチル、アイオノマー
でありエチレンとα・オレフィンの重量比率が異なるエ
チレン−α・オレフィン共重合体2種以上の混合物から
なる。帯電防止性を持たせる為に接着剤層表面に導電性
ポリマー、導電性フィラー、界面活性剤等、帯電防止剤
をコーティングしたり練り込んでも良い。積層方法は押
出コーティングやダイコーター、グラビュアコーターに
よる。[0008] The adhesive layer 4 is composed of ethylene-α-olefin in which α-olefin is vinyl acetate, acrylic acid, methyl acrylate, ethyl acrylate, methacrylic acid, methyl methacrylate, and ionomer, and the weight ratio of ethylene and α-olefin is different. It consists of a mixture of two or more olefin copolymers. The surface of the adhesive layer may be coated or kneaded with an antistatic agent such as a conductive polymer, a conductive filler, or a surfactant in order to impart antistatic properties. Lamination is performed by extrusion coating, a die coater, or a gravure coater.
【0009】該カバーテープは全光線透過率は70%以
上、曇度は60%以下になる様、積層しなければならな
い。全光線透過率が70%未満、または曇度が60%以
上になると検査員にもよるがカバーテープで電子部品を
包装した後に内容物が正しく挿入されているかどうか検
査する際、困難になる。The cover tape must be laminated so that the total light transmittance is 70% or more and the haze is 60% or less. If the total light transmittance is less than 70% or the haze is 60% or more, it will be difficult to inspect whether the contents are correctly inserted after packaging the electronic component with a cover tape, depending on the inspector.
【0010】[0010]
【実施例】本発明の実施例を以下に示すがこれらの実施
例によって本発明は何ら限定されるものではない。接着
剤層4についてはα・オレフィンの例として酢酸ビニル
をあげるがこれは上述した他のα・オレフィンがカバー
テープ用接着剤としての特性が酢酸ビニルと非常に類似
している為に該樹脂で代表する。基材層についても今
回、特性として挙げている剥離強度、透明性については
ポリエステル、ナイロン共に代用しても特に有意な差は
見られないのでポリエステルで統一した。EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited by these examples. The adhesive layer 4 is exemplified by vinyl acetate as an example of α-olefin. However, this is because the other α-olefin described above is very similar to vinyl acetate in properties as an adhesive for a cover tape. To represent. Regarding the base material layer, the peel strength and the transparency, which are listed as characteristics, were unified with polyester since no significant difference was observed even when both polyester and nylon were substituted.
【0011】<<比較例1〜3、実施例1、2、について
>>厚みが25μmの二軸延伸ポリエチレンテレフタレー
トフィルム(第2層)の一方に帯電防止剤層(第1層)
をグラビュアコーティング法により積層した後、第2層
のもう一方の面にポリウレタン系熱硬化性樹脂をコーテ
ィングし該表面に厚み15μmのポリエチレン、更に該
表面に厚み15μmの接着剤層をそれぞれ押出ラミネー
ト法により積層し図2に示した層構成のカバーテープを
得た。接着剤層は表1に示したエチレンと酢酸ビニルの
重量比が異なるエチレン酢酸ビニル共重合体の混合物を
予め二軸混連押出機で混合し調製した。全光線透過率、
曇度はJIS K7105に従って測定した。<< Comparative Examples 1 to 3 and Examples 1 and 2
>> An antistatic layer (first layer) on one side of a biaxially stretched polyethylene terephthalate film (second layer) having a thickness of 25 μm
Is laminated by a gravure coating method, and then the other surface of the second layer is coated with a polyurethane-based thermosetting resin. The layers were laminated by a method to obtain a cover tape having a layer configuration shown in FIG. The adhesive layer was prepared by previously mixing a mixture of ethylene-vinyl acetate copolymers having different weight ratios of ethylene and vinyl acetate shown in Table 1 with a twin-screw extruder. Total light transmittance,
The haze was measured according to JIS K7105.
【0012】[0012]
【表1】 [Table 1]
【0013】比較例4としてVA=10%及びVA=2
8%のエチレン−酢酸ビニル共重合体それぞれを混合比
率、50:50となる様、混合し製膜を試みたが接着剤
層の厚みが15μmにならない上に均一にならず剥離強
度測定には至らなかった。透明性については光線透過率
が65%〜85%、曇度は20〜65%の範囲でばらつ
き、電子部品の表面に記載された文字を正しく認識する
のは困難な結果になった。表1で得られたカバーテープ
を5.5mm巾にスリット後、8mm巾のポリスチレン
を素材とするキャリアテープと180℃でシールを行い
シール後、5分後に剥離強度を測定した値を表2の初期
値に示した。また、それらを室温23℃湿度50%(以
下、23℃×50%RHと略す)、40℃×90%、60
℃、−15℃で30日保管後、剥離強度を測定した値を
表中該当欄に示した。As Comparative Example 4, VA = 10% and VA = 2
An 8% ethylene-vinyl acetate copolymer was mixed to form a mixture ratio of 50:50, and an attempt was made to form a film. Did not reach. Regarding the transparency, the light transmittance varied in the range of 65% to 85% and the haze varied in the range of 20% to 65%, and it was difficult to correctly recognize the characters written on the surface of the electronic component. After slitting the cover tape obtained in Table 1 to a width of 5.5 mm, sealing was performed at 180 ° C. with a carrier tape made of polystyrene having a width of 8 mm, and after sealing, the peel strength was measured 5 minutes later. The initial values are shown. Further, they are stored at room temperature 23 ° C., humidity 50% (hereinafter abbreviated as 23 ° C. × 50% RH), 40 ° C. × 90%, 60%
The values measured for the peel strength after storage at 30 ° C and -15 ° C for 30 days are shown in the corresponding columns in the table.
【0014】表2が示す様に比較例1の40℃×90%
RH、60℃及び比較例2の60℃で保管後の測定値は初
期値に比べ10cN以上剥離強度が減少している事が観
察された。また、比較例3では60℃及び-15℃で保管
後の測定値は初期値に比べ30cN以上剥離強度が上昇
し、また、脈打ち幅も30cN以上になっている事が観
察された。しかし、これら比較例1〜3で使用した接着
剤を混合して得られた実施例1及び2は何れも初期値か
らの変位及び脈打ち幅共に10cN以内に収まっている
のが確認された。As shown in Table 2, 40 ° C. × 90% of Comparative Example 1
The measured values after storage at RH, 60 ° C. and 60 ° C. in Comparative Example 2 were observed to have a decrease in peel strength of 10 cN or more compared to the initial value. In Comparative Example 3, the measured values after storage at 60 ° C. and −15 ° C. were higher than the initial value by 30 cN or more in peel strength, and the pulse width was also observed to be 30 cN or more. However, in Examples 1 and 2 obtained by mixing the adhesives used in Comparative Examples 1 to 3, it was confirmed that both the displacement from the initial value and the pulse width were within 10 cN.
【0015】[0015]
【表2】 [Table 2]
【0016】[0016]
【発明の効果】本発明によれば、剥離強度が適度で且
つ、透明なカバーテープが得られ、各種の実装トラブル
を防止することができる。According to the present invention, it is possible to obtain a transparent cover tape having an appropriate peel strength and to prevent various mounting troubles.
【図1】本発明のカバーテープの層構成を示す断面図で
ある。FIG. 1 is a sectional view showing a layer structure of a cover tape of the present invention.
【図2】実施例で作製したカバーテープの層構成を示す
断面図である。FIG. 2 is a cross-sectional view illustrating a layer configuration of a cover tape manufactured in an example.
1:カバーテープ 2:帯電防止剤層(第1層) 3:二軸延伸フィルム(第2層) 4:接着剤層(第3層) 5:熱硬化性樹脂層 6:ポリエチレン層 1: cover tape 2: antistatic agent layer (first layer) 3: biaxially stretched film (second layer) 4: adhesive layer (third layer) 5: thermosetting resin layer 6: polyethylene layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C09J 131/04 C09J 133/02 133/02 133/04 133/04 B65D 85/38 P Fターム(参考) 3E067 AA11 AB41 AC04 BA34A BB14A CA11 CA24 EA06 EA13 EA32 FA01 FC01 GD08 3E096 AA06 BA08 CA15 DA17 DB06 DC02 EA02 FA12 FA27 GA07 4F100 AK04B AK41A AK46A AK68B AK70B AL01B AL05B AR00C BA02 BA03 BA07 BA10B BA10C CA18C CA22C CB00B GB15 GB41 JG03C JL07 JN01 YY00 4J004 AA07 AA09 AA10 AB01 CA06 CB03 CC05 CE02 FA04 FA08 FA10 4J040 DA051 DA061 DA071 DE031 DF011 DF031 JA09 JB09 LA10 MA09 MA10 NA06 NA20──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C09J 131/04 C09J 133/02 133/02 133/04 133/04 B65D 85/38 PF term (Reference) 3E067 AA11 AB41 AC04 BA34A BB14A CA11 CA24 EA06 EA13 EA32 FA01 FC01 GD08 3E096 AA06 BA08 CA15 DA17 DB06 DC02 EA02 FA12 FA27 GA07 4F100 AK04B AK41A AK46A AK68B AK70B AL01B AL01B03C02 BA02 BA02 BA02 BA02 BA02 BA02 BA02A AA09 AA10 AB01 CA06 CB03 CC05 CE02 FA04 FA08 FA10 4J040 DA051 DA061 DA071 DE031 DF011 DF031 JA09 JB09 LA10 MA09 MA10 NA06 NA20
Claims (3)
的に形成したプラスチック製キャリアテープに、熱シー
ルし得るカバーテープであって、該カバーテープは、ポ
リエステル、ナイロンのいずれかからなるフィルムと熱
可塑性樹脂からなる接着剤層とからなり該接着剤層がエ
チレンとα・オレフィンの重量比率が異なる2種以上の
エチレン−α・オレフィン共重合体からなる事を特徴と
する電子部品包装用カバーテープ。1. A cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, wherein the cover tape is made of a film made of either polyester or nylon and heat-sealed. A cover tape for packaging electronic parts, comprising an adhesive layer made of a plastic resin, wherein the adhesive layer is made of two or more ethylene-α-olefin copolymers having different weight ratios of ethylene and α-olefin. .
ニル、アクリル酸、アクリル酸メチル、アクリル酸エチ
ル、メタクリル酸、メタクリル酸メチル、アイオノマー
の何れかである請求項1記載の電子部品包装用カバーテ
ープ。2. The electronic component packaging according to claim 1, wherein the α-olefin according to claim 1 is any one of vinyl acetate, acrylic acid, methyl acrylate, ethyl acrylate, methacrylic acid, methyl methacrylate, and an ionomer. Cover tape.
上で曇度が60%以下である請求項1または2記載の電
子部品包装用カバーテープ。3. The cover tape according to claim 1, wherein the cover tape has a total light transmittance of 70% or more and a haze of 60% or less.
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JP2001150368A JP4569043B2 (en) | 2001-05-21 | 2001-05-21 | Cover tape for packaging electronic parts |
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JP4569043B2 JP4569043B2 (en) | 2010-10-27 |
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ID=18995394
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100571538B1 (en) | 2004-05-24 | 2006-04-17 | (주)코스탯아이앤씨 | Cover tape for packaging electronic components and manufacturing method thereof |
KR100806844B1 (en) * | 2003-02-13 | 2008-02-22 | 오지 세이시 가부시키가이샤 | Container paper board for containing electronic chips |
JP2012006658A (en) * | 2010-05-25 | 2012-01-12 | Line Plast:Kk | Chip type electronic component packaging cover tape |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09267450A (en) * | 1996-01-29 | 1997-10-14 | Dainippon Printing Co Ltd | Cover tape |
JPH1017025A (en) * | 1996-06-28 | 1998-01-20 | Chiyoda Container- Kk | Corrugated board cushion |
-
2001
- 2001-05-21 JP JP2001150368A patent/JP4569043B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09267450A (en) * | 1996-01-29 | 1997-10-14 | Dainippon Printing Co Ltd | Cover tape |
JPH1017025A (en) * | 1996-06-28 | 1998-01-20 | Chiyoda Container- Kk | Corrugated board cushion |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100806844B1 (en) * | 2003-02-13 | 2008-02-22 | 오지 세이시 가부시키가이샤 | Container paper board for containing electronic chips |
KR100571538B1 (en) | 2004-05-24 | 2006-04-17 | (주)코스탯아이앤씨 | Cover tape for packaging electronic components and manufacturing method thereof |
JP2012006658A (en) * | 2010-05-25 | 2012-01-12 | Line Plast:Kk | Chip type electronic component packaging cover tape |
Also Published As
Publication number | Publication date |
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JP4569043B2 (en) | 2010-10-27 |
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