JP2002323538A - Probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fabricate parts constituting a probe device in advance. SOLUTION: A probe device 30 is provided with a printed circuit board 40 having a through window 41 at its center, a top clamp 50 having a through window 51 at its center and to be fixed onto the printed circuit board 40, a mounting base clamp 60 to be fixed onto this top clamp 50, a plurality of mounting bases 70 arranged inside the through window 41 of the printed circuit board 40 and the through window 51 of the top clamp 50 and fixed to a bottom face 63 of the mounting base clamp 60, and a contact probe 1 having a plurality of contact pins 2a provided on a bottom face 75 of each of the mounting bases 70 and electrically connected to the printed circuit board 40.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe apparatus for performing an electrical test such as a circuit test by bringing a contact pin into contact with a fine electrode of an object to be inspected such as a semiconductor device.

[0002]

2. Description of the Related Art A probe device is used for an electrical test performed by pressing a contact pin of a contact probe into contact with an electrode such as a bump or a pad of a semiconductor device and connecting it to a tester or the like via a printed circuit board. It is. As shown in FIG. 6, for example, a contact probe 1 includes a plurality of pattern wirings 2 made of a nickel-based alloy or the like.
A film 3 is adhered onto the... Via an adhesive layer, and the tips of the pattern wirings 2 projecting from the film 3 are formed as contact pins 2a. A window 4 is formed in the wide base 1b of the film 3, and the window 4 is provided with lead-out wiring portions 5 for pattern wirings 2.

As shown in FIGS. 7, 8, and 9, a contact probe 1 is incorporated in mechanical parts to form a probe device 10, and contact pins 2a are connected to a semiconductor IC.
It is subjected to an electrical test by being brought into contact with a fine electrode terminal such as a chip or a bump of an LCD or the like. The probe device 10 is configured as follows. A printed circuit board 11 having a disk shape and having a window 11a in the center is mounted on a top clamp 1
The four mounting bases 13 fixed to the lower side of the contact probe 2 with flathead screws 18 and the tip 1a of the contact probe 1 attached to the lower surface of the contact probe 1 with double-sided tape or the like are provided in the window 11a of the printed board 11 and the lower surface of the top clamp 12. And is fixed to the top clamp 12 with bolts 15. Then, the contact probe 1 is connected to the printed circuit board 11 and the bottom clamp 14 disposed therebelow.
The bottom clamp 14 is fixed by screwing a bolt 16 into the bottom clamp 14 from above the top clamp 12 with the base 1b of the bottom clamp 14 interposed therebetween.

The lower surface of the mounting base 13 is thick at the center and has a downwardly inclined surface, whereby the tip 1a of the contact probe 1 is held in a downwardly inclined state on the lower surface of the mounting base 12, and The pin 2a is also held in an obliquely downwardly inclined posture. In the base 1b of the contact probe 1, the lead-out wiring portions 5 of the pattern wires 2
Is pressed by an electrode (not shown) on the lower surface of the printed circuit board 10 through the window portion 4 by the elastic body 17 attached thereto, and is held in a contact state. Then, an electrical test can be performed by connecting the printed board 11 to a tester or the like.

At the time of the test, as shown in FIG.
The probe device 10 is connected to a device to be inspected, for example, I
Arranged horizontally with respect to the C chip 20 and contact pins 2
a while holding the probe device a at an inclined position with respect to the pad (or bump) 20 a of the IC chip 20.
By moving the C chip 20 up and down relatively, the contact pins 2a are connected to the pads 20a.

In the probe apparatus 10, a plurality of sizes of printed boards 11 are prepared in advance corresponding to devices to be inspected.
When the size of 1 changes, the size of the concave portion 11a also changes. Further, the bottom clamp 14 is also prepared in advance corresponding to each printed circuit board 11.

[0007]

However, in the conventional probe device 10, since the versatility of the top clamp 12 is low, it is difficult to make and prepare the probe in advance. More specifically, there are a plurality of types of devices that can be inspected by one printed circuit board 11, and when the device type is changed within this inspectable range, the mounting position of the mounting base 13 is changed horizontally in the concave portion 12a of the top clamp 12. Fine tune. However, when the horizontal position of the mounting base 13 is changed, the mounting holes for the bolts 15 provided on the top clamp 12 and the screw holes for the bolts 15 provided on the mounting base 13 do not match, and the bolt 15 cannot be mounted. , That is, mounting base 1
3 cannot be attached. Further, the mounting base 13 is provided with a plurality of pulling screws 13a and pin screws 13b for adjusting the height position of the tips of the contact pins 2a. However, when the horizontal position of the mounting base 13 is changed, the pulling screws 13b are removed. The head may interfere with the top clamp 12 and, as a result, the horizontal position of the mounting base 13 may not be adjusted. Therefore, the top clamp 12 could not be manufactured until the electrode position of the device to be inspected was determined. That is, the top clamp 1
2 could not be made and stored in advance.

When the position of the mounting base 13 is adjusted by horizontally moving the mounting base 13 in the recess 12a of the top clamp 12 as described above,
3 is slid with respect to the upper surface 12b of the concave portion 12a. However, since the upper surface 12b of the concave portion 12a is formed by milling, the surface becomes rough. Therefore, when the mounting base 13 is slid, the mounting base is slid. As a result, the height of the tip of the contact pin 2a is slightly shifted. Therefore, the present invention provides a probe device that can be made up of a large number of members that can be stored, is versatile, and can be easily assembled.

[0009]

According to an aspect of the present invention, there is provided a printed circuit board having a through window in the center and a printed circuit board having a through window in the center. And a mounting base clamp fixed on the top clamp,
A plurality of mounting bases disposed inside the through-holes of the printed circuit board and the through-holes of the top clamp and fixed to the bottom surface of the mounting base clamp; and a plurality of mounting bases attached to the bottom surfaces of the mounting bases and electrically connected to the printed circuit board. And a contact probe having a plurality of contact pins that are electrically connected. With this configuration, since the mounting base is not attached to the top clamp, the versatility of the top clamp is enhanced, and the top clamp can be prepared and stored in advance.

According to a second aspect of the present invention, in the first aspect, the bottom surface of the mounting base clamp is formed as a flat surface, and the upper surface of the mounting base is in contact with the flat surface. It is characterized by the following. With this configuration, the bottom surface of the mounting base clamp can be polished and finished, and a very dense finished surface can be obtained.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the top clamp includes an adjusting mechanism for adjusting a horizontal position of the mounting base. With this configuration, the horizontal position of the mounting base can be easily adjusted.

According to a fourth aspect of the present invention, in any one of the first to third aspects of the present invention, a bottom clamp for holding the contact probe in cooperation with the printed circuit board is provided. I do. With this configuration, the contact probe can be reliably fixed.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a probe device according to the present invention will be described below with reference to FIGS. Since the contact probe 1 is the same as the conventional one, FIG. 6 is referred to and the description is omitted. FIG. 1 is a plan view of the probe device 30, FIG. 2 is a longitudinal sectional view thereof, and FIG. 3 is an exploded perspective view thereof. The probe device 30 includes a printed circuit board 40, a top clamp 50, a mounting base clamp 60, four mounting bases 70,
One contact probe 1, a bottom clamp 80,
Is provided.

The printed circuit board 40 has a disk shape and has a square through-hole 41 in the center in plan view. The printed circuit board 40 is fixed below the top clamp 50. FIG. 4 is a plan view of the top clamp 50. The top clamp 50 has a flat plate shape, and is provided with a through-hole 51 having a cross shape in a plan view at the center. The through window 51 has four rectangular bulges 52, and the distance between the bulges 52 facing each other is the same as the length of one side of the through window 41 of the printed circuit board 40. The printed circuit board 40 includes a through window 41.
Is positioned concentrically with the through-hole 51 of the top clamp 50, and is disposed below the top clamp 50 so as to coincide with the bulging portion 52 of the through-hole 51, and is mounted on the lower surface of the printed circuit board 40 by the flathead screw 42 It is fixed to the top clamp 50.

Three of the four side surfaces 53 of the top clamp 50 are provided with a pair of through holes 54 and a pair of screw holes 55 penetrating through the three bulging portions 52 of the through window 51. Also, on the four side surfaces 53 of the top clamp 50,
A screw hole 56 penetrating the three bulging portions 52 is provided.

FIG. 5 shows a mounting base clamp 60.
The mounting base clamp 60 has a flat plate shape, and has a through window 61 having a substantially square shape in plan view at the center. The mounting base clamp 60 is disposed above the top clamp 50 so as to substantially cover the through window 51, and its four corners are fixed to the top clamp 50 by bolts 62.

The mounting base 70 has a base 71 that is wide and has a rectangular shape in plan view, a tip 72 that has a trapezoidal shape in plan view, and a slit 73 that opens at the tip of the tip 72 at the approximate center in the height direction. Is provided. The upper surface 74 of the mounting base 70 is formed flat, and the bottom surface 75 is an inclined surface inclined downward. Further, as shown in FIG. 2, three pulling screws 76 and two pin screws 77 are screwed into the tip 72, and the pulling screws 76 pass through the slit 73 and are lower than the slit 73. It is screwed into the hole, and the pin screw 77 has its tip abutting below the slit 73. The pulling screw 76 and the pin screw 77 are for finely adjusting the height of the tip of the contact pin 2a. When the pulling screw 76 is tightened, the gap of the slit 73 is reduced and the contact pin 2a is drawn upward. When the pin screw 77 is tightened, the gap between the slits 73 is widened and the contact pin 2a is pushed downward.

A tip portion 1a of the contact probe 1 is attached to the bottom surface 75 of the mounting base 70 by a double-sided tape or the like, and a contact pin 2a is attached so as to protrude from the tip of the mounting base 70. The four mounting bases 70 provided with the contact probes 1 are accommodated in the through-holes 41 of the printed circuit board 40 and the through-holes 51 of the top clamp 50, and the upper surface 74 of the mounting base 70 faces the bottom surface 63 of the mounting base clamp 60. It is brought into contact and is fixed to the mounting base clamp 60 by the bolt 64. More specifically, the base 71 of the mounting base 70 is housed in the bulge 52 of the through window 51, and the tip 72
Are projected more toward the center of the through window 51 than the bulging portion 52.

The bottom clamp 80 has a flat plate shape, and is provided with a through window 81 having a substantially square shape in plan view at the center. The bottom clamp 80 is disposed below the printed circuit board 40 so as to surround the outside of the through window 41, and is a bolt inserted from above the top clamp 50 and screwed through the printed circuit board 40 and the contact probe 1. 82
Fixed by As a result, the base 1b of the contact probe 1 is
It will be firmly fixed by being clamped at zero.

The through hole 54 of the top clamp 50
The head portion of the bolt 57 is locked in the counterbore hole of the through hole 54, the screw portion is screwed into the base portion 71 of the mounting base 70, and a pin screw is inserted into the screw hole 55 of the top clamp 50. The top end of the pin screw 58 abuts against the base end of the mounting base 70, and the screw hole 56 of the top clamp 50 is screwed.
The pin screw 59 is screwed into the mounting base 70 so that the tip of the pin screw 59 abuts against the base side surface of the mounting base 70.
These bolts 57 and pin screws 58 and 59 constitute an adjustment mechanism for finely adjusting the horizontal position of the mounting base 70.
Moves in a direction away from the center of the through window 51, and when the pin screw 58 is screwed in, the mounting base 70 moves in a direction approaching the center of the through window 51, and when the pin screw 59 is screwed in, the mounting base 70 moves in the left and right direction. .

The elastic body 82 fitted in the groove of the bottom clamp 80 presses the lead-out wiring section 5 of the contact probe 1 through the window section 4 against an electrode (not shown) on the lower surface of the printed circuit board 40 to make contact. The state is maintained. Then, an electrical test can be performed by connecting the printed circuit board 40 to a tester or the like.

In this test, the probe device 30 is disposed horizontally with respect to a device 90 such as an IC chip to be inspected, and the contact pins 2 a are inclined with respect to the pads (or bumps) 91 of the device 90. The probe pins 30 and the device 90 are moved up and down and approached while holding the contact pins 2a, so that the contact pins 2a are
Contact.

In the probe device 30, the portion corresponding to the top clamp 12 which was formed as a single component in the conventional probe device 10 is divided into two parts, and the top clamp 50 and the mounting base clamp 60 are separated.
Therefore, the top clamp 50 can be prepared and prepared in advance in correspondence with the printed circuit board 40. The reason is that this probe device 3
0, the mounting base 70 is attached to the top clamp 5
Mounting base clamp 6 not attached to 0
This is because the head is attached to the top clamp 50 and the head of the pulling screw 76 of the mounting base 70 does not interfere with the top clamp 50. as a result,
As in the prior art, the horizontal position of the mounting base 70 cannot be adjusted due to interference with the head portion of the pulling screw 76, and the mounting of the mounting base 70 cannot be disabled due to the screw holes not being aligned.
Therefore, the versatility of the top clamp 50 is improved, and the top clamp 50 can be made and stored.

On the other hand, the mounting base clamp 60
Can not be prepared in advance because of the mounting of the mounting base 70 on the mounting base clamp 60, but since the mounting base clamp 60 has a very simple structure in which a through-hole 61 is provided in a flat plate-shaped member, the design and It can be easily manufactured and can be prepared with a short delivery time.

The mounting base clamp 60
Since the bottom surface 63 has a flat plate shape, the bottom surface 63 can be polished and finished, and the bottom surface 63 can be formed as a very dense finished surface. As a result, when the mounting base 70 is moved horizontally for fine adjustment of the horizontal position while the upper surface 74 of the mounting base 70 is in contact with the bottom surface 63 of the mounting base clamp 60, the mounting base 70 does not move up and down.
Does not shift the height of the tip of the contact pin 2a.

The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the mounting base clamp is constituted by one component, but this may be divided into a plurality of parts. For example, each part is divided into four parts.

[0027]

As described above, according to the first aspect of the present invention, since the mounting base is not attached to the top clamp, the versatility of the top clamp is improved, and the top clamp is prepared and stored in advance. There is an effect that can be put. According to the second aspect of the present invention, since the bottom surface of the mounting base clamp can be made a very dense finished surface by polishing, the horizontal position of the mounting base can be adjusted while bringing the upper surface of the mounting base into contact with the bottom surface. Even if it is performed, there is an effect that the mounting base does not move up and down and the height of the contact pin is kept constant.

According to the third aspect of the invention, the horizontal position of the mounting base can be easily adjusted. According to the invention described in claim 4, the contact probe can be securely fixed.

[Brief description of the drawings]

FIG. 1 is a plan view of an embodiment of a probe device according to the present invention.

FIG. 2 is a longitudinal sectional view of the probe device.

FIG. 3 is an exploded perspective view of the probe device.

FIG. 4 is a plan view of a top clamp in the probe device.

FIG. 5 is a plan view of a mounting base clamp in the probe device.

FIG. 6 is a plan view of a contact probe.

FIG. 7 is a plan view of a conventional probe device.

FIG. 8 is a longitudinal sectional view of the conventional probe device.

FIG. 9 is an exploded perspective view of the conventional probe device.

FIG. 10 is a perspective view of a top clamp in the conventional probe device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact probe 2a Contact pin 30 Probe device 40 Printed circuit board 41 Through window 50 Top clamp 51 Through window 60 Mounting base clamp 63 Bottom 70 Mounting base 74 Top surface 75 Bottom surface 80 Bottom clamp 57 Bolt (adjustment mechanism) 58, 59 Pin screw (adjustment mechanism) )

Continued on the front page F-term (reference) 2G011 AA02 AA17 AE03 AF06 2G132 AA01 AF01 AF05 AF06 AL03 AL09 AL13

Claims (4)

[Claims] 1. A printed circuit board having a through window in the center,
A top clamp having a through window at the center and fixed on the printed circuit board, a mounting base clamp fixed on the top clamp, and a through hole in the printed circuit board and a through window in the top clamp. A plurality of mounting bases arranged and fixed to the bottom surface of the mounting base clamp, and a contact probe having a plurality of contact pins attached to the bottom surface of each mounting base and electrically connected to the printed circuit board, A probe device, comprising: 2. The probe device according to claim 1, wherein the bottom surface of the mounting base clamp is formed as a flat surface, and the upper surface of the mounting base is in contact with the flat surface. 3. The probe device according to claim 1, wherein the top clamp includes an adjustment mechanism for adjusting a horizontal position of the mounting base. 4. The probe device according to claim 1, further comprising a bottom clamp for holding the contact probe in cooperation with the printed circuit board.