JP2002311439A - Liquid crystal display and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display and its manufacture capable of sufficiently irradiating a seal layer to which a pair of substrates are stuck with irradiation light and hardening the seal layer by more evenly irradiating the entire seal layer with the irradiation light. SOLUTION: Drawing wiring 103, 105 drawn from a display part 401 formed on a lower substrate 101 and light shielding bodies 106a, 106b, 106c are overlapped with the seal layer 201 and area not to be overlapped with the drawing wiring 103, 105 and the light shielding bodies 106a, 106b, 106c is selected as >=25% of unit area of the seal layer 201.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display and a method of manufacturing the same, and more particularly, to a liquid crystal display manufactured by a liquid crystal drop bonding method and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a method of manufacturing a liquid crystal display panel, a liquid crystal vacuum injection method and a liquid crystal drop bonding method are known. In the liquid crystal vacuum injection method, a pair of substrates are bonded and baked with a sealing layer of a thermosetting resin having an injection hole to form a so-called empty cell, and a liquid crystal material is sucked into the empty cell by a pressure difference from a vacuum state. After that, the injection hole is sealed. In the liquid crystal drop bonding method, a pair of substrates are bonded with a sealing layer of an ultraviolet curable resin and irradiated with ultraviolet light.
The seal layer is cured.

In the liquid crystal vacuum injection method mentioned above, a liquid crystal material is sucked into an empty cell due to a pressure difference. Therefore, in a large liquid crystal display panel, it is difficult for the liquid crystal material to sufficiently spread to a portion far from the injection hole in the panel. Various problems have become remarkable with the increase in the size of the liquid crystal display panel, such as that it takes a long time to suck and that the display unevenness due to the injection is likely to occur in the panel near the injection hole.

On the other hand, according to the liquid crystal drop bonding method,
Such a problem caused by the liquid crystal vacuum injection method can be solved, and it has been applied to the manufacture of large liquid crystal display panels.

[0005]

The details of such a liquid crystal drop bonding method will be discussed. As shown in FIGS. 11, 12, and 13, the lower substrate of the liquid crystal display device includes:
A plurality of pixels 109 arranged in an array at the center thereof
A common voltage is supplied to a common electrode to a display portion including a display portion and to a peripheral portion around the display portion, to a lead wire such as a gate lead wire 102 and a drain lead wire 105 drawn from a pixel 109 of the display portion and to a common electrode. A common voltage supply wiring and light-shielding body 106 that performs a light-shielding function is formed.
The seal layer 201 is formed so as to cross over the lead-out wiring and the common voltage supply wiring and light-shielding body, and the lower substrate is bonded to the upper substrate.

After bonding in this manner, the sealing layer 201
Is irradiated with ultraviolet light to be cured. When a UV mask 501 having a mask pattern 502 formed thereon is arranged below the lower substrate and the seal layer 201 is irradiated with ultraviolet light, the portion of the common voltage supply wiring and light shield 106 shown in FIG. As shown in FIG. 14 which is a cross-sectional view taken along line −C ′, the ultraviolet light applied to the lower substrate 101 is shielded by the common voltage supply wiring
It was found that there was a problem that it did not reach the target sufficiently. As described above, if the ultraviolet light is not sufficiently irradiated on the ultraviolet-curable resin, the components of the resin that have not been sufficiently cured may dissolve into the liquid crystal layer and cause display defects. Among the portions shown in FIGS. 11, 12, and 13 in the seal layer 201, in particular, a band-like common voltage supply wiring and light shield 106 along the direction in which the seal layer 201 shown in FIG.
This problem becomes prominent in places where the two parts overlap and overlap each other.

Further, since the seal layer 201 is irradiated with ultraviolet light depending on the shape of a portion overlapping with the common electrode supply wiring / light shield 106 and the lead-out wiring, the ultraviolet light is applied to the inside of the annular seal layer 201. The amount of light irradiation increased, and the unevenness of curing increased. With the increase in the size and definition of the liquid crystal display device, the distance between the lead wirings is further reduced, and such a problem cannot be ignored. Eliminating the common voltage supply wiring and light shield 106 can solve the problem of poor curing of the seal layer 201, but makes it impossible to supply a common voltage to the common electrode, and it is easy for external light to enter the display unit from outside the display unit. It is not realistic because display failure occurs.

Accordingly, an object of the present invention is to provide a liquid crystal display device capable of sufficiently irradiating irradiation light and curing the sealing layer by irradiating the irradiation light more uniformly over the entirety of the sealing layer, and manufacturing the same. A method is provided.

[0009]

In order to solve the above-mentioned problems, the present invention employs the following new structure.

That is, the liquid crystal display device of the present invention comprises a lower substrate having a display portion and a peripheral portion therearound, and a liquid crystal layer sandwiched between the lower substrate and a peripheral portion of the lower substrate. A liquid crystal display device having a lower substrate and an upper substrate bonded to each other with a seal layer formed on the lower substrate, wherein a lead wire and a light-shielding member are drawn from a display portion formed on the peripheral portion of the lower substrate. Are overlapped with the seal layer, and an area which does not overlap with the lead-out wiring and the light shield is selected to be 25% or more with respect to a unit area of the seal layer.

The method of manufacturing a liquid crystal display device according to the present invention further comprises a step of forming a seal layer on the peripheral portion of the lower substrate having a display portion and a peripheral portion therearound; A method for manufacturing a liquid crystal display device, comprising: a step of dropping a liquid crystal material in a region surrounded by layers and bonding the upper substrate and the seal layer, and a step of irradiating the seal layer with light to cure the seal layer. In addition, the lead-out wiring and the light-shielding body drawn out from the display unit formed in the peripheral portion of the lower substrate overlap with the seal layer, and the area that does not overlap with the lead-out wiring and the light-shielding body is smaller. It is characterized in that it is selected to be at least 25% with respect to the unit area of the sealing layer.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings, taking as an example a case where the present invention is applied to a twisted nematic (TN) type liquid crystal display device.

First, a first embodiment will be described. FIG. 1 is a plan view of a liquid crystal display panel for describing a liquid crystal display device according to a first embodiment of the present invention. FIG.
FIG. 2 is a sectional view taken along line AA ′ of FIG. FIG.
FIG. 2 is an enlarged plan view of a part a in FIG. 1. FIG. 4 is an enlarged plan view of a portion b in FIG. FIG. 5 is an enlarged plan view of a portion c in FIG. FIG. 6 is an enlarged plan view of the unit pixel shown in FIGS. FIG. 7 is an outline view in the order of steps for explaining the liquid crystal drop bonding method. FIG. 8 is a sectional view taken along the line BB ′ of FIG.

The liquid crystal display device according to the present embodiment includes a lower substrate 101 having a display portion 401 and a peripheral portion 402 around the display portion 401, and a liquid crystal layer 203 interposed between the lower substrate 101 and the lower substrate 101. A liquid crystal display device including a lower substrate 101 and an upper substrate 301 bonded to each other with a sealing layer 201 formed on a peripheral portion 402 of the side substrate 101, wherein the liquid crystal display device is drawn from a display portion 401 formed on the lower substrate 101. Drawn out wirings 103 and 15 and light shielding bodies 106a and 106b,
106c overlaps with the seal layer 201, and the lead wirings 103 and 105 and the light shielding bodies 106a and
It is characterized in that the area not overlapping with 06b and 106c is selected to be 25% or more with respect to the unit area of the sealing layer 201.

That is, the lead wirings 103 and 105 and the light shielding bodies 106 a and 1
06b and 106c are devised with respect to the shape and arrangement.
% Or more is set to transmit ultraviolet light. Also,
The interval between the transmission portions is 80 μm or less. 15 and 16, the critical meaning of “the installation area of the transmission holes should be 25% or more” and “the installation interval of the transmission holes should be 80 μm or less” will be described.

The amount of light applied to the sealing material alone is 150
It is confirmed from experimental results that the composition is cured at 0 mJ / cm ₂ or more. However, considering margins, at least 200
0 mJ / cm _{2 is} required. Considering the aperture ratio of the wiring portion transmission holes, the amount of light applied to the seal itself is given by the following equation, and the respective relationships are as shown in FIG. (Amount of light applied to the seal) = (Amount of irradiation applied to the whole) × (Opening ratio of the wiring portion transmission hole) In order to perform UV curing, an amount corresponding to the seal itself is 200 in consideration of a margin.
0 mJ / cm ₂ is sufficient, and when the aperture ratio is low, a larger amount of light may be applied accordingly. However, in order to reduce the process time and minimize the temperature rise of the substrate due to UV irradiation, the amount of light emitted from the UV lamp must be
It is desirably 8000 mJ / cm ₂ or less. According to the graph shown in FIG. 15, in order to satisfy the above, it is desired that the aperture ratio of the UV transmission hole is 25% or more.

Next, an experiment was carried out to measure the degree of cure of the seal portion by changing the distance between the transmission holes. In the experiment, the aperture ratio of the transmission hole is fixed at 25%. FIG. 16 shows the results.
From FIG. 16, it can be seen that in order for the sealing material to be completely cured, the interval between the transmission holes needs to be 80 μm or less. Incidentally, even when the aperture ratio is larger than 25%, it can be said that in principle, if the interval is 80 μm or less, it is sufficient.

Referring to the cross-sectional view of such a liquid crystal display device, as shown in FIG. 2, a lower substrate 101 is provided with common voltage supply wiring and light shielding bodies 106b and 106c in a peripheral portion 402 thereof. An insulating film 107 is formed thereon. On the upper substrate 301, an opposing light-shielding body 302 is formed around the periphery thereof, and an opposing electrode 303 is formed thereon. Although not shown, a lattice-shaped black stripe is formed on the upper substrate 301 in the display portion, and a strip-shaped opposing side light shield 30 is formed around the periphery thereof.
2 are formed, and the opposing light shield 302 and the lower substrate 1
01 common voltage supply wiring and light shields 106b and 106c
Are opposed to each other. The lower substrate 101 and the upper substrate 301 are attached to each other with a spacer 204 and a liquid crystal layer 203 scattered on the display unit 401 with a seal layer 201 in a peripheral part 402, and a common voltage supply wiring and light shield 106b And a plurality of transfer units 202 for supplying a common voltage from the common voltage supply wiring / shading bodies 106b and 106c to the counter electrode 303 of the upper substrate 301 through openings provided in the insulating film 107 on the insulating film 107 on the upper substrate 301. . The transfer 202 is made of a silver paste or the like.
1 outside.

As shown in FIG. 6, each pixel 109 of the display section 401 has a scanning line 111 formed on the lower substrate 101 and a gate electrode 123 extending from the scanning line 111.
, A signal line 112 intersecting with the scanning line 111, and a scanning line 1
A pixel electrode 121 composed of a transparent conductive film disposed in a region surrounded by the gate electrode 1 and the signal line 112;
Semiconductor layer 12 disposed on gate electrode 23 via a gate insulating film
A drain electrode 122 extending from the signal line 112 and connected to one end of the semiconductor layer 122;
And a source electrode 124 connected to the pixel electrode 121 at the other end.

Next, means for realizing the above-described conditions will be specifically described.

First, with respect to the lead wirings 103 and 105 overlapping the seal layer 201, the gate lead wiring 103 and the drain lead wiring 105 are connected to the display unit 401.
Of the gate terminal 102 and the drain terminal 104
The width of the lead wiring having a long distance to the outside is made large to prevent an increase in resistance value. In addition, if the width is simply increased, the distance between the adjacent extraction wirings is reduced, and light for curing the seal layer is hardly transmitted. Therefore, in the present embodiment, the width of the long extraction wiring is increased and the adjacent extraction wiring is increased. It is characterized by widening the interval between them.

Light shield 10 located at a corner of display 401
6a is as follows. As shown in FIG.
In the part a of the lower substrate 101, each pixel 10
The gate lead-out wiring 102 is drawn out from the nine scanning lines 111, and a plurality of gate terminals 104 are arranged on one side of the substrate. Also, the drain lead-out wiring 1 from the signal line 112
05 is drawn out, and the drain terminal 10 is connected to the other side of the substrate.
4 are arranged. At the corner between these lead wires,
A polygonal common voltage supply wiring / light shield 106a is provided, and the common terminal 11 is disposed adjacent to the gate terminal 102 and the drain terminal 104 from the light shield 106a.
0 is arranged. In a portion of the polygonal common voltage supply wiring / light shield 106 a overlapping with the seal layer 201, a plurality of U
A V transmission hole 601 is formed. A transfer 202 is formed outside the seal layer 201.

The light shield 106b is as follows. As shown in FIG. 4, in the part b of the lower substrate 101,
The drain extraction wiring 105 is extracted from the signal line 112 of each pixel 109 of the display unit 401, and a plurality of drain terminals 104 are arranged on one side of the substrate. Further, adjacent to this, the drain extraction wiring 105 is extracted from the signal line 112 of each pixel 109 of the display unit 401, and a plurality of drain terminals 104 are arranged on one side of the substrate. A triangular common voltage supply wiring / light shield 106b is provided between these lead wirings, and common terminals 110 are arranged adjacent to the drain terminal 104 from the light shield 106b. A portion of the triangular common voltage supply wiring / light shield 106b overlapping the seal layer 201 is provided with a plurality of UVs along the direction in which the seal layer 201 extends.
A transmission hole 601 is formed. A transfer 202 is formed outside the seal layer 201.

Further, the light shield 106c is as follows. As shown in FIG. 5, c of the lower substrate 101
In the section, a band-shaped common voltage supply wiring / light shield 106c is provided. This common voltage supply wiring and light shield 106c
The portion overlapping with the seal layer 201 has a plurality of UV transmission holes 6 along the direction in which the seal layer 201 extends.
01 is formed. A transfer 202 is formed outside the seal layer 201.

Next, a method of manufacturing the liquid crystal display of the present embodiment will be described with reference to FIG. In the present embodiment,
With respect to the lower substrate having the shape shown in FIG. 1 as described above, in the (1) seal drawing process, the relative position between the dispenser and the lower substrate 101 is changed so that the ultraviolet curable resin is 0.2 to 0.2
An annular seal layer 201 is formed by drawing at a height of 0.6 mm and a height of 10 to 50 μm. Next, in the (2) liquid crystal dropping / substrate bonding step, a liquid crystal material is dropped onto a region surrounded by the annular seal layer 201 of the lower substrate 101, and a spacer is fixedly formed (fixed spacer). Or a spacer with pillars) upper substrate 301 and lower substrate 101
While positioning in a vacuum, pressurized with a platen,
After that, the pressure is returned to the atmospheric pressure and bonding is performed by atmospheric pressing (platen load 200 to 3000N). The substrates are turned upside down in a state of being adhered to each other, and (3) in a UV irradiation / temporary curing step, linear ultraviolet light is collectively irradiated at 5000 to 8000 mJ / cm 2 from the lower substrate 101 to the seal layer 201 to be cured.

At this time, as shown in FIG. 8, which is a cross-sectional view taken along the line BB 'of FIG. 5, the width of the portion corresponding to the seal layer 201 was determined in consideration of the amount of misalignment. By irradiating through a UV mask 501 having an opening and forming a mask pattern 502 for shielding a display region of a liquid crystal display panel from light, only the periphery of the seal layer 201 is selectively irradiated with ultraviolet light. Irradiation via the mask pattern 502 prevents adverse effects such as deterioration of the alignment film located in the display region due to ultraviolet light. Lower substrate 10
UV light irradiated from 1 through the UV mask 501 is
At the location of the common voltage supply wiring and light shield 106c, the seal layer 201 is transmitted through the plurality of UV transmission holes 601 formed.
To cure the seal layer 201. Further, the ultraviolet light transmitted through the seal layer 201 is reflected by the opposing light shielding body 302 formed on the upper substrate 301, and is reflected again by the seal layer 20.
1 to contribute to the hardening of the seal layer 201. Further, the seal layer 201 overlapping with the plurality of lead wirings 103 and 105 is irradiated with ultraviolet light transmitted through the gap between the lead wirings, so that the seal layer 201 can be cured. Further, the ultraviolet light transmitted through the UV transmission hole 601 is also applied to the seal layer 201 overlapping the common voltage supply wiring and light shield 106a shown in FIG. 3 and the common voltage supply wiring and light shield 106b shown in FIG. The irradiation can cure the seal layer 201.

After the sealing layer 201 is temporarily cured in this way, the substrate temperature is set to 120 in the (4) curing / main curing step.
The liquid crystal display device is completed by fully curing the seal layer 201 by heat treatment at a temperature of 1 ° C. for one hour.

According to the present embodiment, of the gate lead-out wiring 103 and the drain lead-out wiring 105, the lead-out wiring having a long distance to the gate terminal 102 or the drain terminal 104 has a large width and is connected to the adjacent lead-out wiring. Since the interval is set to be wide, the ultraviolet curable resin is sufficiently irradiated to the ultraviolet curable resin through the gap between the lead wires, so that the seal layer 201 can be cured sufficiently and uniformly. Further, the resistance value of the lead wiring can be kept uniform.

Further, according to the present embodiment, a plurality of U's are provided along the portions of the common voltage supply wiring and light shielding bodies 106a, 106b, 106c which overlap the seal layer 201.
Since the V transmission holes 601 are provided, a plurality of UV transmission holes 601 are provided.
, And the ultraviolet light is irradiated to the ultraviolet-curable resin, whereby the seal layer 201 can be sufficiently cured. Moreover, since the transmission holes 601 are provided in the common voltage supply wiring and light shielding bodies 106a, 106b, and 106c, respectively, where curing failure is most likely to occur in the conventional technology, the sealing layer 201 includes:
The irradiation amount of the ultraviolet light is made more uniform as a whole, the curing state of the seal can be made uniform, and display failure due to curing failure can be prevented.

Here, if the transmission hole is simply provided, the resistance value of the common voltage supply wiring and light shield 106 increases, and
It is assumed that the common voltage supplied to the counter electrode 303 via the transfer 202 decreases. In addition, simply providing a transmission hole reduces the light-shielding ability as a light-shielding body,
When used as a liquid crystal display device, it is assumed that external light enters the display unit from the outside of the display unit to deteriorate display characteristics. On the other hand, in this embodiment, the common voltage supply wiring and light shielding bodies 106a, 106b, and 106c are selectively provided with UV light.
Since the transmission hole 601 is provided, the resistance value of the common voltage supply wiring and the light-shielding body is maintained sufficiently low, and while the light-shielding performance is sufficiently maintained, poor curing at the time of curing the seal is reduced to improve display failure. Can be done.

Next, a second embodiment of the present invention will be described. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 9 is a sectional view for explaining a liquid crystal display device according to a second embodiment of the present invention. Upper substrate 30
1, a lattice-shaped black stripe is formed in the display portion, and a strip-shaped opposing side light blocking member 302 is formed around the periphery thereof.
Are formed, and the opposing light shield 302 and the lower substrate 10
One common voltage supply wiring / light shield 106 is opposed. In the present embodiment, the common voltage supply wiring and light shielding body 10
A plurality of UV transmission holes 601 are provided in the opposing light-shielding body 302 provided in the peripheral portion of the upper substrate 301 facing the substrate 6.

Next, a method of manufacturing the liquid crystal display device of the present embodiment will be described. As in the first embodiment, after the upper substrate 301 is aligned with and bonded to the lower substrate 101, the upper substrate 302 is irradiated with the line-shaped ultraviolet light to the sealing layer 201 at a time to be cured. As shown in FIG. 9, a mask pattern 502 that has an opening whose width is determined in consideration of the amount of misalignment at a position corresponding to the seal layer 201 and that shields the display area of the liquid crystal display panel is formed. U
By irradiating the V mask 501 on the upper side of the upper substrate 301, only the periphery of the seal layer 201 is selectively irradiated with ultraviolet light. UV mask 50 from upper substrate 301
1 is transmitted through a plurality of UV transmission holes 601 formed in the opposing side light shielding body 302 and the sealing layer 2.
Irradiation is performed to cure the seal layer 201. further,
The ultraviolet light transmitted through the seal layer 201 is reflected by the common voltage supply wiring / light shield 106 and the lead-out wiring of the lower substrate 101 and enters the seal layer 201 again to contribute to the curing of the seal layer 201. After the sealing layer 201 is temporarily cured in this way, the sealing layer 201 is fully cured by heat treatment, and a liquid crystal display device is completed.

According to the present embodiment, the opposing side light shield 30
The ultraviolet curing resin is irradiated with ultraviolet light through the plurality of UV transmitting holes 601 provided in the second resin layer 2, so that the sealing layer 201 can be sufficiently cured. Thus, the cured state of the seal can be made uniform, and display failure due to poor curing can be prevented.

Next, a third embodiment will be described. The same components as those in the first or second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 10 is a partial plan view for explaining a liquid crystal display device according to a third embodiment of the present invention. In the present embodiment, the vernier 1
08 is provided, and the vernier 108 is composed of a scale 108a and a numeral 108b each formed of a transmission hole. The vernier 108 is for checking the thickness of the annular sealing layer 201 formed by dropping on the lower substrate 101 and the relative arrangement on the lower substrate 101. The vernier 108 overlaps the sealing layer 201. 108 scale 10
8a and the number 108b are read and checked. For this check, the vernier 108 is placed on the sealing layer 201.
Voltage wiring / shading body 10 of four sides overlapping with
6 respectively. For example, in the plan view of FIG. 1, a vernier is provided on the triangular common voltage supply wiring / light shield 106b on one side on the left side of the paper where the gate terminal is provided.
A vernier is provided on the triangular common voltage supply wiring / light shield 106b on one upper side of the paper where the drain terminal is provided, and a vernier is provided on the band-like common voltage supply wiring / light shield 106c on the other two sides.

According to the present embodiment, when the ultraviolet light is irradiated, the scale 108a composed of the transmission hole of the vernier 108 is formed.
And the numeral 108b are transmitted to the seal layer 201, and the seal layer 201 is irradiated with ultraviolet light, whereby the seal layer 201 can be sufficiently cured, and the irradiation amount of the ultraviolet light in the seal layer 201 is made more uniform as a whole. The cured state can be made uniform, and display defects due to poor curing can be prevented.

Although the preferred embodiment has been described above, the present invention is not limited to this embodiment, and various changes and additions may be made. For example, in the above-described embodiment, a case has been described in which the present invention is applied to a twisted nematic (TN) liquid crystal display device. However, other types of liquid crystal display devices, such as a horizontal electric field liquid crystal display device and a vertical alignment type liquid crystal display device, are used. It is also applicable to: In the horizontal electric field type liquid crystal display device, the liquid crystal layer is controlled by the electric field between the common electrode and the pixel electrode formed on the lower substrate. Therefore, a configuration in which a common voltage is supplied to the upper substrate as in the above-described embodiment. Not required. Therefore, in the case of a horizontal electric field type liquid crystal display device, the transfer in the above-described embodiment may be omitted, and a configuration may be adopted in which a common voltage is supplied from the common voltage wiring and light shield to the common electrode of the lower substrate.

Although the above-mentioned liquid crystal display devices are all assumed to be of the transmission type, the reflection type liquid crystal display device in which light incident from the upper substrate is reflected by a reflection electrode formed on the lower substrate for display is also used. Applicable.

When a substrate having low heat resistance, such as plastic, is used, the application of the present invention is particularly effective because it is necessary to cure the sealing material only with UV light.

Further, when a transparent conductive film typified by ITO is laminated on the structure of the present invention, the resistance can be reduced and the effect can be enhanced.

[0042]

As described above, according to the liquid crystal display of the present invention, the display characteristics are improved, the common voltage can be sufficiently supplied to the common electrode, and the light shielding performance can be sufficiently maintained.

Further, according to the method of manufacturing a liquid crystal display device of the present invention, the lower substrate and the upper substrate can be maintained while sufficiently maintaining the resistance value of the common voltage supply wiring and the light-shielding member and sufficiently maintaining the light-shielding performance. Insufficient curing during curing of the seal layer to be bonded to the substrate can be reduced, and display defects can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line A-A 'of FIG.

FIG. 3 is an enlarged plan view of a part a in FIG. 1;

FIG. 4 is an enlarged plan view of a portion b in FIG.

FIG. 5 is an enlarged plan view of a portion c in FIG. 1;

FIG. 6 is an enlarged plan view of a unit pixel shown in FIGS. 3 to 5;

FIG. 7 is a schematic view of a process order for explaining a liquid crystal dropping and bonding method.

FIG. 8 is a sectional view taken along the line B-B 'of FIG.

FIG. 9 is a cross-sectional view illustrating a second embodiment of the present invention.

FIG. 10 is a cross-sectional view for explaining a third embodiment of the present invention.

FIG. 11 is a partially enlarged plan view illustrating a conventional liquid crystal display device.

FIG. 12 is a partially enlarged plan view illustrating a conventional liquid crystal display device.

FIG. 13 is a partially enlarged plan view illustrating a conventional liquid crystal display device.

FIG. 14 is a sectional view taken along the line C-C ′ in FIG.

FIG. 15 is a diagram showing the relationship between the aperture ratio of a transmission hole and the amount of ultraviolet light necessary for curing a sealing material.

FIG. 16 is a diagram showing a relationship between a transmission hole interval and a degree of curing of a sealing material.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 101 Lower substrate 102 Gate terminal 103 Gate lead wiring 104 Drain terminal 105 Drain lead wiring 106a, 106b, 106c Common voltage supply wiring and light shield 107 Insulating film 108 Vernier 110 Common terminal 201 Seal layer 202 Transfer 203 Liquid crystal layer 204 Spacer 301 Upper Substrate 302 Opposing side light shield 303 Opposing electrode

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ken Sasaki 5-7-1 Shiba, Minato-ku, Tokyo F-term in NEC Corporation (reference) 2H089 LA41 MA07 NA22 QA12 QA14 TA02 TA09 2H091 FA34Y LA12 2H092 GA32 JB22 JB31 JB52 NA27 NA29 PA03 PA04 PA09 QA07

Claims (11)

[Claims] 1. A lower substrate having a display portion and a peripheral portion surrounding the display portion, and a liquid crystal layer sandwiched between the lower substrate and a lower layer formed by a seal layer formed on the peripheral portion of the lower substrate. A liquid crystal display device having a side substrate and an upper substrate bonded to each other, wherein a lead wire and a light shield formed in the peripheral portion of the lower substrate and drawn from a display portion overlap with the seal layer. A liquid crystal display device characterized in that an area which does not overlap with the lead-out wiring and the light shield is selected to be 25% or more with respect to a unit area of the seal layer. 2. The liquid crystal display device according to claim 1, wherein a distance between the lead wiring and the region that does not overlap with the light shield is 80 μm or less. 3. A light-shielding body located at a corner of the display unit, wherein a plurality of transmission holes are formed in a portion overlapping the seal layer along a direction in which the seal layer extends. 2. The liquid crystal display device according to claim 1, wherein: 4. A plurality of transmission holes along a direction in which the seal layer extends, in a portion of the light shield located between the plurality of lead wirings drawn from the display unit and overlapping the seal layer. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is formed. 5. A light-shielding body extending in a strip shape adjacent to the display section, wherein a plurality of transmission holes are formed in a portion overlapping with the seal layer along a direction in which the seal layer extends. The liquid crystal display device according to claim 1, wherein: 6. A plurality of lead-out lines are drawn out from the display section and intersect with the seal layer, and among the plurality of lead-out lines, a line having a large width sets a large interval between adjacent lead-out lines. 2. The liquid crystal display device according to claim 1, wherein 7. An opposing light-shielding member facing the light-shielding member of the lower substrate is provided on the upper substrate, and a portion of the opposing light-shielding member that overlaps with the seal layer is provided along the seal layer. 2. The liquid crystal display device according to claim 1, further comprising a plurality of transmission holes. 8. The liquid crystal display device according to claim 1, wherein the light shielding body of the lower substrate is provided with a vernier formed of scales and numerals formed of transmission holes. 9. A step of forming a seal layer on the peripheral portion of the lower substrate having a display portion and a peripheral portion therearound, and dropping a liquid crystal material on a region of the lower substrate surrounded by the seal layer. And bonding the upper substrate and the seal layer together, and irradiating the seal layer with light to cure the seal layer, wherein the peripheral portion of the lower substrate And the light-shielding body and the lead-out wiring drawn out from the display portion overlap with the seal layer, and the area that does not overlap with the lead-out wiring and the light-shielding body is 25% of the unit area of the seal layer. A method for manufacturing a liquid crystal display device, which is selected as described above. 10. The light-shielding body in a portion overlapping the seal layer has a plurality of transmission holes along the seal layer, and irradiates light from the lower substrate side to cure the seal layer. The method for manufacturing a liquid crystal display device according to claim 9, wherein: 11. An opposing light-shielding member facing the light-shielding member of the lower substrate is provided on the upper substrate, and a part of the opposing light-shielding member overlapping with the seal layer is provided along the seal layer. The liquid crystal display device according to claim 9, further comprising a plurality of transmission holes, and irradiating light from the upper substrate side to cure the seal layer.