JP2002280921A - Wireless device housing - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a wireless device housing which has good incorporation properties and can be made thin and small. A wireless device housing includes a metal housing main body.
1 and an upper lid 32, and a circuit board 33 is mounted in the lower opening. On both sides in the longitudinal direction of the housing body 31, a plurality of long holes 34 are provided near the lower opening, and on both sides in the longitudinal direction of the circuit board 33, projections 35 corresponding to the long holes 34 are provided, The protrusion 35 is inserted into the long hole 34 of the housing body 31. In addition, a ground pattern is formed along the outer periphery of both sides of the circuit board 33. The circuit board 33 includes:
The protruding portion 35 is inserted into the elongated hole 34 of the housing main body 31 to bring the ground pattern into contact with the housing main body 31 and solder them together, so that electrical connection and heat between the circuit board 33 and the housing main body 31 can be made. The configuration is such that conduction is good and heat generated on the circuit board 33 side can be efficiently radiated through the housing body 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless device housing incorporating a short-range wireless communication device such as a wireless LAN.

[0002]

2. Description of the Related Art Conventionally, a wireless device housing incorporating a short-distance wireless communication device such as a wireless LAN is configured as shown in FIG. In FIG. 6, reference numeral 10 denotes a wireless device housing, a metal housing main body 11, an upper cover 12 provided at an upper opening of the housing main body 11, and a lower cover 1 provided at a lower opening.
It consists of three. A circuit board 14 is arranged at the center of the housing body 11, and an outer peripheral surface of the circuit board 14 is brought into contact with an inner side surface of the housing body 11 to perform soldering 15, so that a circuit board 14 is formed. The substrate 14 is electrically connected.

The circuit board 14 has a ground plane (G
A high-frequency circuit 16 is formed on the upper surface, and a microcomputer (microcomputer) circuit 17 is formed on the lower surface using a multilayer substrate provided with an ND surface. On the upper surface of the circuit board 14, circuit components 16a, 1
6b, and a heating component 16c such as a power amplification element (HPA). The circuit components 17a, 17b,... Constituting the microcomputer circuit 17 are provided on the lower surface, and a metal block 18 for heat radiation is provided at a position corresponding to the heat-generating component 16c.

A connector 19 for external connection is provided on a side surface of the housing body 11. This connector 19
Are connected to a circuit pattern formed on the circuit board 14.

[0005] An antenna substrate 21 is mounted on the outer surface of the upper lid 12. Power is supplied to the antenna board 21 from the high-frequency circuit 16 formed on the circuit board 14 via a coaxial cable 22.

[0006]

As described above, the conventional wireless device housing is provided with a circuit board having a ground plane formed in an internal layer as a measure against noise sneaking between circuits due to miniaturization and integration of the device. The circuit board 14 is electrically connected to a metal housing body 11 surrounding the circuit board 14 by soldering 15 to shield the front and rear surfaces of the circuit board 14. The high frequency circuit 16 is provided on the front side of the circuit board 14 and the microcomputer circuit 17 is provided on the back side of the circuit board 14, thereby suppressing the noise from flowing between the two circuits. The high frequency circuit 16
A metal block 18 is attached to the back surface of the circuit board 14 as a measure for radiating heat generated by the heat-generating component 16c such as a power amplification element.

However, the high-frequency circuit 16 and the microcomputer circuit 1
In the conventional method of shielding the circuit board 7 separately on the front side and the back side of the circuit board 14, both sides of the circuit board 14 become component faces, so that reflow must be performed twice, and solder paste having two kinds of temperature characteristics is used. Is required. Further, the antenna board 21 is also prepared separately from the circuit board 14, and the coaxial cable 2
It is necessary to connect these in 2 etc. For these reasons, the conventional wireless device housing has a problem that its incorporation is poor.

Further, since the metal block 18 is attached to the back surface of the circuit board 14 for heat radiation of the heat generating component 16c, an extra space is occupied on the circuit board 14.
In addition, since the thickness of the metal block 18 is required, there is a problem in downsizing the device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a wireless device housing which can be reduced in thickness and size and has good incorporation.

[0010]

According to a first aspect of the present invention, there is provided a wireless device housing including a housing main body having an upper surface and a lower surface opened, an upper lid mounted on an upper opening surface of the housing main body, A plurality of long holes provided on the side surface near the lower opening of the housing body, a protrusion is provided at a position corresponding to the long hole, and a ground pattern is formed near the outer periphery, and the protrusion is provided on the housing body. And a multilayer circuit board which is inserted into the elongated hole and soldered.

According to the above configuration, the electrical connection and the heat conduction between the circuit board and the housing body can be improved, and the heat from the heat-generating components mounted on the circuit board can be efficiently transmitted to the housing body. To dissipate heat. Therefore, it is not necessary to provide a metal block for heat radiation, so that incorporation can be improved, and the thickness and size of the wireless device housing can be reduced.

According to a second aspect of the present invention, the circuit board according to the first aspect of the present invention includes a grounding layer inside, a high-frequency circuit section and an information processing circuit formed above the grounding layer, and a top surface. A plurality of ground through holes are provided on the side at an interval of half a wavelength or less, and a shield wall is formed between the high-frequency circuit section and the information processing circuit over an internal layer.

As described above, a plurality of grounded through holes are provided in the circuit board at an interval of half a wavelength or less, and a shield wall is formed over the inner layer of the circuit board, so that the high-frequency circuit and the information processing circuit can be reliably connected. Can be shielded. In addition, by providing a ground layer on the circuit board, and providing an electronic circuit section on the upper layer side of the ground layer and an antenna section on the lower layer side, it is not necessary to separately provide a board dedicated to the antenna, thereby simplifying the configuration. Can be.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing a configuration of a wireless device housing according to the present invention. In FIG. 1, 30
Is a wireless device housing, which comprises a metal housing main body 31 and an upper lid 32 attached to the upper opening of the housing main body 31 by screwing or the like, and a circuit board 33 is provided in a lower opening of the housing main body 31. Is attached. That is, a plurality of long holes 34 are provided in the vicinity of the lower opening on the sides of the housing body 31, for example, on both sides in the longitudinal direction, and the protrusions 35 corresponding to the long holes 34 are provided on the sides of the circuit board 33. Provided, this protrusion 35
Is inserted into the elongated hole 34 of the housing body 31 as shown in FIG. In this case, a ground (GND) pattern 36 is formed along the outer periphery of both sides of the circuit board 33. This ground pattern 36 is also formed on the outer surface of the recess formed between the protrusions 35.

In the circuit board 33, the projecting portion 35 is inserted into the elongated hole 34 of the housing main body 31, the ground pattern 36 is brought into contact with the housing main body 31, and both are soldered to connect the ground pattern 36 to the housing main body 31. The main body 31 is electrically connected. That is, by contacting the protrusion 35 of the circuit board 33 inserted into the long hole 34 of the housing main body 31 and the recess formed between the protrusions 35 with the housing main body 31, the ground pattern 36 has a large area. To make the electrical connection and the heat conduction between the circuit board 33 and the housing body 31 good, and the heat generated on the circuit board 33 side passes through the housing body 31 It is configured to efficiently radiate heat. As shown in FIG. 1, a connector 37 for external connection is mounted on the side of the housing body 31 as necessary, and is connected to the circuit pattern of the circuit board 33.

FIGS. 3A and 3B show the structure of the circuit board 33. FIG. 3A is a plan view, and FIG.
FIG. 3 is a sectional view taken along line A of FIG. The circuit board 33 is configured using a multilayer board, and for example, a high frequency circuit (RF circuit) 41 is provided in the left half of the drawing, and an information processing circuit, that is, a microcomputer (microcomputer) circuit 42 is provided in the right half.
In this case, a plurality of ground through holes 43 are provided at a boundary surface between the high frequency circuit 41 and the microcomputer circuit 42, and the distance d between the ground through holes 43 is set to λ / 2 (half wavelength) or less. The shield between the microcomputer circuit 42 is shielded.

The circuit board 33 is provided with a ground layer 44 as an internal layer, an electronic circuit is provided on an upper layer side of the ground layer 44, and an antenna element such as a microstrip antenna 4 is provided on a lower layer side.
5 are formed. The ground layer 44 is connected to the ground through hole 43. The microstrip antenna 45 is supplied with power by the high-frequency circuit 41.
The electronic circuit is provided with a power supply line 46 and a high-frequency grounding layer 47 as internal layers, and a component surface 4 on the uppermost surface.
8 are provided. The component surface 48 includes a high-frequency circuit 41
And the electronic component 50 of the microcomputer circuit 42 are mounted.

Next, the microstrip antenna 4
The power supply method 5 will be described. FIG. 4A shows an example of a back-feed type, in which a feed line 51 passes through a through hole 52 provided in the ground layer 44 from inside the circuit board 33 to constitute a microstrip antenna 45. Power is supplied to the feeding point 54 of the circular patch element 53 from the back side.

FIG. 4B shows an example of the same-surface feeding type, in which the feeding line 51 is connected from the inside of the circuit board 33 to the ground layer 44.
Is supplied to the feeding point 54 of the circular patch element 53 from the side (the same plane).

FIG. 4C shows an example of an electromagnetic power supply type. A power supply line 51 passes through a through hole 52 provided in the ground layer 44 from the inside of the circuit board 33, and thereafter, the circuit board 33 33, the wiring is wired in parallel to the center of the circular patch element 53. That is, the leading end of the power supply line 51 is wired in the circuit board 33 to a position facing the center of the circular patch element 53, and is supplied with power by electromagnetic coupling with the circular patch element 53.

Next, the microstrip antenna 4
5 will be described. FIG. 5A shows an example of a linear polarization type, in which the circular patch element 53 constituting the microstrip antenna 45 is fed with one point from a side feed point 55.

FIG. 5B shows a basic configuration of a circularly polarized wave type. A signal input to a feeding point 55 is divided into two by a two-way divider 61, one of which is a 90 ° phase shifter. Power is supplied to the circular patch element 53 via 62, and the other is directly supplied to the circular patch element 53. That is, a 90 ° phase shifter 62 is provided to generate a 90 ° phase difference in the power supply signal, and power is supplied to two power supply points that are orthogonal to each other, so that circular polarization is generated.

FIG. 5C shows a practical configuration of a circularly polarized wave type, in which cuts 63 and 64 are formed in a circular patch element 53.
, And one point is fed from a feeding point 55 provided on the side. That is, the cuts 63 and 6 are formed in the circular patch element 53.
4, the circular polarization is generated, and the circular polarization is adjusted by the positions of the cuts 63 and 64 with respect to the feed point 55.

According to the above-described embodiment, the projection 35 is provided on the outer periphery of the circuit board 33 so as to be uneven, the ground pattern 36 is formed on the outer periphery, and the projection 35 is provided on the housing body 31. Since it is inserted into the elongated hole 34 and soldered, the electrical connection and heat conduction between the circuit board 33 and the housing body 31 can be improved, and the circuit board 33 is provided on the circuit board 33. Heat from the heat-generating components is efficiently transmitted to the housing body 31 and radiated. Therefore, it is not necessary to provide a metal block for heat dissipation, so that the incorporation can be made good, and the thickness and size of the wireless device housing 30 can be reduced.

Further, since a plurality of ground through holes 43 are provided in the circuit board 33 at intervals of half a wavelength or less and a shield wall is formed over the inner layer of the circuit board 33,
Thus, the high-frequency circuit 41 and the microcomputer circuit 42, which are formed on the upper layer side, can be reliably shielded.

Further, since the ground layer 44 is provided on the circuit board 33, the electronic circuit section is provided on the upper layer side of the ground layer 44, and the antenna section is provided on the lower layer side, the antenna can be integrated with the circuit board 33. Can be simplified.

As described above, since the thickness and size of the wireless device housing can be reduced, the present invention can be applied to, for example, an IC card used in a wireless ticket gate at a station.

[0028]

As described above in detail, according to the present invention, a protruding portion is provided on the outer periphery of a circuit board, a ground pattern is formed on the outer peripheral portion, and the protruding portion is provided on a housing body. And soldering, the ground pattern can contact the housing body over a large area to improve the electrical connection and heat conduction between the circuit board and the housing body, and to be mounted on the circuit board The heat from the heat-generating component can be efficiently transmitted to the housing body and radiated. Therefore, it is not necessary to provide a metal block for heat radiation, so that incorporation can be improved, and the thickness and size of the wireless device housing can be reduced. Further, by providing a plurality of grounded through holes on the circuit board at intervals of half a wavelength or less and forming a shield wall over the inner layer of the circuit board, the high-frequency circuit and the information processing circuit can be reliably shielded. . Furthermore, since the ground layer is provided on the circuit board, and the electronic circuit section is provided on the upper layer side of the ground layer and the antenna section is provided on the lower layer side, it is not necessary to separately provide a board dedicated to the antenna, thereby simplifying the configuration. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view of a wireless device housing according to an embodiment of the present invention.

FIG. 2 is an exemplary perspective view showing a connection structure between a circuit board and a housing body according to the embodiment;

3A is a plan view of the circuit board according to the embodiment, and FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A.

FIG. 4 is an exemplary view showing various feeding methods of the microstrip antenna in the embodiment.

FIG. 5 is an exemplary view showing a power supply method corresponding to linear polarization and circular polarization of the microstrip antenna in the embodiment.

FIG. 6 is a cross-sectional view illustrating a configuration of a conventional wireless device housing.

[Explanation of symbols]

 Reference Signs List 30 wireless device housing 31 housing main body 32 upper lid 33 circuit board 34 long hole 35 projecting portion 36 ground pattern 37 connector 41 high frequency circuit 42 microcomputer circuit 43 ground through hole 44 ground layer 45 microstrip antenna 46 power supply line 47 high frequency ground layer 48 Component surface 49, 50 Electronic component 51 Feed line 52 Through hole 53 Circular patch element 54, 55 Feed point 61 2 Divider 62 90 ° phase shifter 63, 64 Cut

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H05K 9/00 H05K 9/00 R 5K011 CU F term (reference) 5E321 AA01 AA17 CC02 CC12 GG05 GH03 5E322 AA03 AB02 EA11 5E348 AA04 AA05 AA08 AA35 5J045 AB05 BA01 CA01 CA04 DA10 EA08 MA07 5J046 AA12 AB13 PA07 5K011 AA01 AA03 AA15 KA00

Claims (4)

[Claims] 1. A housing body having upper and lower openings, an upper lid mounted on an upper opening surface of the housing body, and a plurality of lengths provided on side surfaces near a lower opening of the housing body. A multi-layer circuit board having a hole, a protrusion at a position corresponding to the slot and a ground pattern formed near the outer periphery, wherein the protrusion is inserted into the slot of the housing body and soldered. A housing for a wireless device, comprising: 2. A housing body having upper and lower openings, an upper lid mounted on an upper opening surface of the housing body, and a plurality of lengths provided on side surfaces near a lower opening of the housing body. A hole, a multilayer circuit board having a projection at a position corresponding to the elongated hole and a ground pattern formed near the outer periphery, wherein the projection is inserted into the elongated hole of the housing body and soldered; A wireless device housing comprising: an electronic component mounted on an inner surface of the circuit board; and an antenna provided on an outer surface of the circuit board. 3. The circuit board according to claim 1, wherein the projecting portion inserted into the elongated hole of the housing main body and the recess formed between the projecting portions are brought into contact with the housing main body, and at least a portion in contact with the housing main body. 2. A heat radiation property is improved by forming a ground pattern on upper and lower outer peripheral surfaces and an outer surface including:
Or the wireless device housing according to 2. 4. The circuit board includes a ground layer inside,
A high-frequency circuit section and an information processing circuit are formed above the ground layer, and a plurality of ground through holes are provided on the upper surface at intervals of half a wavelength or less, and an internal layer is provided between the high-frequency circuit section and the information processing circuit. The wireless device housing according to claim 1, wherein a shield wall is formed over the wireless device.