JP2002254548A - Laminated film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated film which enables obtaining of a higher resolution than does a conventional laminated film when exposed to light and shows the easy follow-up behavior of a transfer layer tot irregularities on the surface of a substrate to be laminated. SOLUTION: This laminated film has a photosensitive layer 12 bonded to one side of a flexible support layer and a coat layer 13 bonded to the surface of the photosensitive layer 12. Further, the adhesive force between the support layer and the photosensitive layer 12 is reduced compared to the adhesive force between the coat layer 13 and the photosensitive layer 12 and the transfer layer to be transferred to an object for lamination is composed of the coat layer 13 and the photosensitive layer 12. During laminating, the photosensitive layer 12 is brought into contact with the substrate S.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film, and more particularly, to a laminated film which is suitably used as a resist film for plating or etching, for example, when manufacturing a printed wiring board.

[0002]

2. Description of the Related Art A conventional laminated film used as a resist film for plating or etching when manufacturing a printed wiring board has, for example, a structure shown in FIG. The conventional laminated film 100 is configured by sequentially laminating and bonding a photosensitive layer 102 and a covering layer (protective film) 103 on a support layer (base film) 101. In the laminated film 100, the support layer 101 and the photosensitive layer 102
Becomes a transition layer 104, and is laminated on the substrate S of the printed wiring board to be laminated.

When laminating the conventional laminated film 100, the coating layer 103 is peeled off and the photosensitive layer 1 is removed.
The transfer layer 104 is placed on the substrate S with the reference numeral 02 facing the substrate S, and then the transfer layer 104 is pressed from the support layer 101 side by a heating roll and pressed. Therefore, the cross section of the substrate S after lamination is as shown in FIG.

Next, a negative mask is placed on the support layer 101, and the photosensitive layer 102 is exposed by irradiating light beams for exposure through the negative mask. Thereafter, when the negative mask is removed, the support layer 101 is peeled off, and then development is performed, so that a photosensitive layer 102 having the same pattern as the negative mask is obtained. Therefore, using this photosensitive layer 102 as a resist film,
The next plating or etching step is performed.

A film such as polyethylene terephthalate (PET) is used for the support layer 101, and its thickness is, for example, 20 μm. The photosensitive layer 102 is formed of a photosensitive resin composition whose physical properties change when irradiated with ultraviolet rays or the like, and a suitable composition is selected according to the purpose of use. The thickness of the photosensitive layer 102 is set to, for example, 25 μm, 33 μm, 40 μm, or 50 μm according to the purpose. As the coating layer 103, a film such as polyethylene is used, and its thickness is, for example, 30 μm.

A conventional laminated film having the above structure and a method and apparatus for laminating the same are disclosed, for example, in JP-A-47-46.
No. 102, JP-A-2-213849.

[0007]

In recent years, the density of wiring has been increased in printed wiring boards, and a resist film with higher resolution has been desired. However, in the conventional laminated film 100, the support layer 101 is required to increase the tensile strength.
It is necessary to increase the thickness to some extent (for example, about 20 μm) and also to increase the hardness to some extent. For this reason, there is a problem that refraction and scattering of the exposure light beam generated in the support layer 101 are increased, and higher resolution cannot be obtained. Further, since the flexibility of the entire transfer layer 104 is not sufficient due to the above-mentioned thickness and hardness required by the support layer 101, the transfer layer 1 may have unevenness on the surface of the substrate to be laminated.
04 is difficult to follow, as a result, the unbonded portion between the substrate S and the transition layer increases, and there is a problem that a sufficient production yield cannot be obtained.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a laminated film which can obtain a higher resolution than conventional ones at the time of exposure, and in which a transition layer can easily follow irregularities on the surface of an object to be laminated.

[0009]

Means for Solving the Problems (1) The first aspect of the present invention
The laminated film of the above, comprising a flexible support layer, a photosensitive layer adhered to one surface of the support layer, and a coating layer adhered to the surface of the photosensitive layer opposite to the support layer A laminated film having a three-layer structure, wherein the coating layer contains a thermoplastic resin transparent to light for exposure to the photosensitive layer, and the photosensitive layer is laminated on a surface to be laminated. Has a resistance to heat and pressure applied to, when a tensile force is applied between the support layer and the photosensitive layer while applying a predetermined tension to the laminated film, the coating layer and the photosensitive layer Both are configured to be separated from the support layer as a transfer layer, and when the transfer layer separated from the support layer is transferred to the surface of the object, the photosensitive layer is brought into contact with the surface of the object. To the photosensitive layer. Irradiation of the exposure light beam is performed through the coating layer, and the heat and pressure applied when laminating the photosensitive layer are applied to the photosensitive layer through the coating layer. It is characterized by having done.

(2) The second laminated film of the present invention comprises a flexible support layer, a photosensitive layer composed of a photosensitive resin composition applied and dried on one surface of the support layer, and a photosensitive layer. And a coating layer containing a thermoplastic resin adhered to the surface on the opposite side of the support layer, wherein the transfer layer transferred to an object to be laminated is the coating film. And a photosensitive layer.

(3) The third laminated film of the present invention comprises a flexible support layer, a photosensitive layer composed of a photosensitive resin composition adhered to one surface of the support layer, and A support film and a laminated film having a three-layer structure comprising a coating layer containing a thermoplastic resin adhered to the surface on the opposite side, wherein the transfer layer transferred to the object to be laminated is the coating layer and It is characterized by comprising the photosensitive layer.

(4) A fourth laminated film according to the present invention includes a support layer having flexibility, a photosensitive layer made of a photosensitive resin composition adhered to one surface of the support layer, and the photosensitive layer. A support layer and a laminated film having a three-layer structure comprising a coating layer containing a thermoplastic resin adhered to the surface on the opposite side, when laminating the photosensitive layer on the surface to be laminated. Is characterized in that the support layer is peeled off and the coating layer and the photosensitive layer are transferred to the object.

(5) In the first to fourth laminated films of the present invention, since the support layer is peeled off before laminating, the support layer has flexibility and can peelably bond the photosensitive layer. If it is a thing, it will not be specifically limited. Examples include paper, release paper, and films of polyethylene terephthalate, polypropylene, polyethylene, polystyrene, and the like. Further, it may be transparent or non-transparent. When the photosensitive layer is formed, it usually passes through a drying oven, so that it is necessary that the photosensitive layer is not damaged at the temperature of the drying oven.

Although the thickness of the support layer is not particularly limited,
Considering the size when wound in a roll,
It is preferably 200 μm.

The photosensitive layer can be arbitrarily used as long as it is a photosensitive resin composition used for this kind of laminated film. Therefore, the photosensitive layer may be formed of any photosensitive resin composition according to the purpose of use. Since this photosensitive layer is preferably formed by applying and drying a suitable photosensitive resin composition on the support layer, a photosensitive resin composition suitable for the intended use may be selected and applied. Good. In this case, the photosensitive layer contacts the support layer.

Examples of usable photosensitive resin compositions are described in, for example, JP-A-50-147323 and JP-A-52-147323.
94388, JP-A-52-130701,
JP-A-53-128688, JP-A-53-560
No. 18, JP-A-52-11798, JP-A-6-11
0-69646 and the like.

Although the thickness of the photosensitive layer is not particularly limited,
The thickness is preferably 5 to 250 μm.

In the laminated film of the present invention, since the support layer is peeled off and the transfer layer composed of the photosensitive layer and the coating layer is placed on an object to be laminated, taking into account the heating / pressing action at the time of lamination, The coating layer contains a thermoplastic resin.

Preferred thermoplastic resins for the coating layer include, for example, polypropylene, polyethylene, polycarbonate, polyethylene terephthalate, polyvinyl alcohol, polyacrylate, gelatin, carboxymethyl cellulose, styrene / maleic acid copolymer, and polyvinylpyrrolidone. Can be

It is preferable that the coating layer exhibits an elongation of 10% or more at a temperature at the time of lamination, and a stress at the time of 10% elongation is 500 gf or less. The measurement method of "elongation" and "stress" here is that the ambient temperature is set to the temperature at the time of laminating, and then both ends of a test piece having a width of 2 cm produced by the coating layer are put on a commercially available tensile tester. The chuck interval is 2 cm and the strain rate is 2 cm /
It is to pull as a minute.

The reason why the elongation is 10% or more is that if the elongation is less than 10%, the ability of the photosensitive layer to follow irregularities on the surface of the object to be laminated decreases. Further, if the film is broken before the elongation reaches 10%, the photosensitive layer is exposed from the broken portion in a subsequent exposure step, so that the photosensitive layer may have poor photocuring or may be contaminated. It is. Although there is no upper limit for elongation, it is usually 750%.

The reason why the stress at 10% elongation is set to 500 gf or less is that if it exceeds 500 gf, the ability of the photosensitive layer to follow irregularities on the surface of the object to be laminated decreases. The stress at this time is preferably 100 gf or less, more preferably 20 gf or less, and 1 gf or less.
It is particularly preferred to be 0 gf or less. Although there is no lower limit of this stress, it is usually 1 gf.

The softening point or melting point of the coating layer is preferably 40 ° C. or higher. When the temperature is lower than 40 ° C., when the transfer layer is laminated while being heated and pressed from the side of the coating layer, a tack is generated on the surface of the coating layer to reduce workability, or the coating layer itself is wrinkled. This is because there is a risk of occurrence. There is no upper limit for the softening point or melting point, but it is usually 200 ° C.

The thickness of the coating layer is not particularly limited. In order to reduce the refraction of the exposure light beam, it is preferable that the thickness is as thin as possible. However, in consideration of the tensile strength at the time of lamination and the ease of lamination, it is not preferable to make the thickness extremely thin. Therefore, an appropriate value may be set in consideration of these conditions. However, the thickness of the coating layer is preferably 0.01 to 50 μm, and 0.1 to 50 μm.
More preferably, it is 20 μm.

The adhesive force (A) between the support layer and the photosensitive layer
1) is defined as the adhesive force (A) between the coating layer and the photosensitive layer.
It is preferable that the adhesive force (A2) between the coating layer and the photosensitive layer is larger than the adhesive force (A1) between the support layer and the photosensitive layer. . This is because the work of peeling off only the support layer at the time of lamination cannot be suitably performed unless this is done. In this case, it is preferable that the support layer is peeled off and the coating layer and the photosensitive layer are transferred to an object to be laminated.

The adhesive force (A) between the support layer and the photosensitive layer
1) is preferably 100 gf / cm or less as a 180 ° peel strength. If it is too large, there is a tendency that the support layer cannot be peeled off smoothly. The adhesive force (A2) between the coating layer and the photosensitive layer is 180
に お い て It is sufficient that the peel strength is larger than the adhesive strength (A1), and there is no particular limitation.

[0027]

In the laminated film of the present invention, when the transfer layer is transferred to an object to be laminated, the coating layer is present on the photosensitive layer, so that the light beam for exposure passes through the coating layer through the coating layer. Is irradiated. Since this coating layer can be formed to be extremely thin as compared with the support layer, refraction and scattering of the light beam by the coating layer are suppressed, and as a result, a higher resolution than before can be obtained.

Further, since the transfer layer in which the photosensitive layer has been transferred to the surface to be laminated toward the surface can be laminated by applying pressure from the side of the coating layer while heating, the transfer layer can be thickened together with the photosensitive layer. As compared with a conventional example in which a support layer having low flexibility is laminated, the transition layer more easily follows irregularities on the surface to be laminated.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Laminated Film] (Configuration of Laminated Film) FIGS. 1 and 2 show one embodiment of the laminated film of the present invention. FIG. 1 shows a state in which the transition layer is laminated on a printed wiring board substrate,
FIG. 2 is a cross section of the laminated film. This laminated film is used as a resist film for plating or etching when manufacturing a printed wiring board.

The laminated film 10 shown in FIG. 2 is constituted by laminating and bonding a photosensitive layer 12 and a coating layer 13 on a support layer 11 in order. In the laminated film 10, the coating layer 13
The photosensitive layer 12 and the photosensitive layer 12 become the transfer layer 14 and are laminated on the printed wiring board substrate S.

As the support layer 11, a film of polyester, polyethylene terephthalate (PET) or the like is used, and its thickness is, for example, 20 μm.

The photosensitive layer 12 is formed of a photosensitive resin composition whose physical properties change when irradiated with light such as ultraviolet rays, and a suitable composition is selected according to the purpose of use. The thickness of the photosensitive layer 12 is, for example, 25 μm depending on the purpose.
m, 33 μm, 40 μm or 50 μm.

For the coating layer 13, for example, polyvinyl alcohol (PVA) is used. The coating layer 13 includes the photosensitive layer 12
It can be easily obtained by applying a solution such as polyvinyl alcohol to a predetermined thickness on the top and then drying it. The thickness of the coating layer 13 is, for example, 1 μm.

The covering layer 13 is transferred onto the substrate S together with the photosensitive layer 12, and the photosensitive layer 12 is irradiated with light for exposure through the covering layer 13, so that the covering layer 13 is as thin as possible without interfering with the laminating operation. And it is preferable to make it flexible.

The laminated film 10 having such a configuration
As shown in FIG. 1, the transfer layer 14 obtained by peeling the support layer 11 is laminated on the substrate S with the photosensitive layer 12 facing the substrate S. Thereafter, the photosensitive layer 12 is exposed through a negative mask placed on the coating layer 13, and the coating layer 13 is peeled off, and then the photosensitive layer 12 is developed. Then, the photosensitive layer 12 to which the pattern of the negative mask is transferred is obtained. Therefore, the next plating or etching step is performed using the photosensitive layer 12 as a resist film.

As described above, the laminated film 10 of the present invention
Since the thin and flexible coating layer 13 is present on the photosensitive layer 12 when laminated on the substrate S, the refraction of the exposure light beam is smaller than when the support layer 11 is left on the photosensitive layer 12. The possibility that the resolution is reduced due to light scattering or the like is extremely small. In addition, since the flexibility of the transition layer 14 is high,
Compared with the case where the transition layer 14 is composed of the photosensitive layer 12 and the support layer 11, the followability to the unevenness of the surface of the substrate S is improved, and as a result, a high production yield can be obtained. (Method of Manufacturing Laminated Film) FIG. 3 shows an example of an apparatus for manufacturing the laminated film 10 having the above configuration.

In the laminated film manufacturing apparatus 20 shown in FIG. 3, the film 31 for the support layer 11 fed from the feed roller 21 is taken up by the take-up roller 28 while being fed at predetermined speeds by feed rollers 22, 23 and 27. The photosensitive layer 12 is formed on the surface during the process.
The solution 24 of the photosensitive resin composition for forming the photosensitive layer 12 is
It is stored near the feed roller 23 and is automatically applied to the surface of the running support layer 11 film. The coating thickness of the photosensitive resin composition is adjusted to a predetermined value by a coating thickness adjusting roller 25 provided near the feed roller 23. The support layer film 31 on which the photosensitive resin composition layer 32 is formed passes through a dryer 26 provided between the feed rollers 23 and 27. At this time, the photosensitive resin composition layer 32 is dried with hot air. Is done. Thus, the photosensitive resin composition layer 32 is formed on the surface of the film 31 for the support layer 11.

The winding speed of the winding roller 28 is, for example, 1 m / min, and the temperature of the hot air of the dryer 26 is, for example, 90 ° C.

Although the portion for forming the coating layer 13 is not shown, it has the same structure as that of the photosensitive layer forming portion in FIG. 3, and by repeating the same steps as the above-mentioned photosensitive layer forming step, the photosensitive resin is formed. A resin layer for the coating layer 13 is formed on the composition layer 32. That is, the film 31 for the support layer 11 having the photosensitive resin composition layer 32 formed on the surface thereof is fed out from the feed roller 21 and fed to the feed rollers 22, 23, 27.
The film is wound by the winding roller 28 while being fed. A resin solution for the coating layer 13 is placed in place of the photosensitive resin composition solution 24, and is applied onto the photosensitive resin composition layer 32 while being adjusted to a predetermined application thickness by an application thickness adjusting roller 25. The support layer film 31 passes through a dryer 26 provided between the feed rollers 23 and 27, and at that time, the resin layer for the coating layer 13 is dried with hot air.

In this way, the photosensitive resin composition layer 32 and the resin layer for the coating layer 13 are sequentially formed on the surface of the film 31 for the support layer 11, and the laminated film 10 having the structure shown in FIG. 2 is obtained.

The laminated film 10 can be produced by an apparatus other than that shown in FIG. 3 as long as the apparatus produces this kind of laminated film. (Specific Example of Laminated Film) A specific example of the laminated film 10 having the above-described structure is shown below together with the manufacturing method.

A polyester film (manufactured by Teijin Limited) was used as the support layer 11, and a photosensitive resin composition solution having the following composition was applied to one surface of the polyester film so that the thickness after drying was 50 μm. Thereafter, the photosensitive layer 12 is formed by drying with hot air. Next, a 1% by weight ethanol solution of polyvinyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd., degree of polymerization: about 2000) is dried on the surface of the photosensitive layer 12 opposite to the support layer 11 so as to have a thickness of 1 μm. , And dried with warm air to form a coating layer 13. Thus, the laminated film 10 of the present invention is obtained. Composition of photosensitive resin composition solution Copolymer of 25% by weight of methacrylic acid / 75% by weight of methyl methacrylate (weight average molecular weight: 75,000) 60 parts by weight Tetrapropylene glycol diacrylate 40 parts by weight Diethylaminobenzophenone 0.2 parts by weight Benzophenone 5 Parts by weight crystal violet 0.03 parts by weight and methyl ethyl ketone 100 parts by weight [First example of laminated film laminating apparatus] Next, FIG.
An apparatus for laminating the laminated film 10 on the printed wiring board substrate S will be described.

FIG. 4 shows a first example of a laminated film laminating apparatus. The laminating apparatus 40 includes cutting, peeling, and transferring units having the same configuration above and below the traveling path of the substrate S. Further, applicator rollers 41 and 51 are provided as means for holding the transfer layer 14 of the laminated film 10 in a developed state.

The laminated film 10 in the form of a roll is supported on pay-out shafts 42 and 52 so as to be payable. Here, the laminated film 10 is wound with the covering layer 13 facing inward. The fed-out laminated film 10 is fed toward the applicator rollers 41 and 51 at a predetermined speed by a pair of feed rollers 44 and 54 driven by the nip. The fed-out laminated film 10 supports the coating layer 13 toward the applicator rollers 41 and 51.

As shown in FIG. 5, the applicator roller 41 has a cylindrical outer cylinder 41a rotatably mounted on a non-rotating central shaft 41b and having a plurality of radially extending through holes 41d. And a partition plate 41c vertically attached to the shaft 41b so as not to rotate. The outer peripheral surface of the outer cylinder 41a is covered with a material having such a hardness that the laminated film 10 is not damaged when the cutter 50 is pressed. On the outer peripheral surface of the outer cylinder 41a, the opening of the through-hole 41d is exposed almost entirely.

The inside of the outer cylinder 41a is divided by a partition plate 41c into a first chamber 41e near the laminated film 10 and a second chamber 41f far from the laminated film 10. First
The chamber 41e is constantly evacuated by a vacuum pump (not shown) so as to have a low vacuum. Thereby, the outer cylinder 41a
The transfer layer 14 disposed in the vicinity of the outer peripheral surface can be vacuum-sucked through the through hole 41d.

The second chamber 41f is constantly blown by a blower (not shown) and is maintained at a pressure slightly higher than the atmospheric pressure. Thereby, at the location facing the second chamber 41f,
Air is blown through the through-hole 41d to the transfer layer 14 that is vacuum-adsorbed on the outer peripheral surface of the outer cylinder 41a, and as a result, the transfer layer 14 can be reliably separated from the outer cylinder 41a. The second chamber 41f may be equal to the atmospheric pressure.

The laminated film 10 fed from the feed shafts 42 and 52 has a transfer layer 14 on which the applicator roller 4
1, 51 are partially contacted with the outer peripheral surface. The laminated film 10 has a cutting device 50 near the contact point.
60 cuts only the transition layer 14 to a predetermined length.

As shown in FIG. 6, the cutting device 50 includes a rotating body 50a rotatably supported on a rotating shaft 50b, and a blade 50c is formed on the outer peripheral edge of the rotating body 50a. When the transition layer 14 is cut by the cutter 50 while leaving the support layer 11, the blade 50 c is pressed from above the support layer 11 while applying a tensile force, and traverses the laminated film 10 in that state. Axis of rotation 50
Move b. Therefore, the shape of the blade 50c is set so that the transition layer 14 can be deformed without cutting the support layer 11 at that time. Any material can be used as the material of the blade 50c.

The transfer layer 14 cut to a predetermined length is held in a state of being separated (developed state) along the outer peripheral surfaces of the applicator rollers 41 and 51 by vacuum suction. At this time, the coating layer 13 is in contact with the outer peripheral surfaces of the applicator rollers 41 and 51.

On the other hand, the support layer 1 separated from the transition layer 14
1 is fed to the take-up shafts 43 and 53 by feed rollers 45, 55, 46 and 56 provided in front of the applicator rollers 41 and 51, and is taken up by the take-up shafts 43 and 53 at a predetermined speed. .

The transfer layer 14 held in the deployed state by the applicator rollers 41 and 51
The rotation of the applicator rollers 4
The substrate S sent between 1 and 51 is approached. Thereafter, the applicator rollers 41 and 51 move toward the substrate S, and transfer the held transfer layer 14 to the upper and lower surfaces of the substrate S, respectively. This transfer is performed using the adhesive force of the surface of the photosensitive layer 12.

In the first example, since the pressure in the second chamber 41b is higher than the atmospheric pressure, the transfer layer 14 is easily separated from the applicator rollers 41 and 51.

The rotation speed of the applicator rollers 41 and 51 is the same as the feed speed of the laminated film 10 (for example, 2 m / min).
Is set to sync.

The transfer layer 14 transferred to the substrate S is fed by feed rollers 48 and 58, and has a predetermined temperature (for example, 10 ° C.).
The pressure is applied to the substrate S at a predetermined pressure (for example, 3 kg / cm 2) by the pressure rollers 49 and 59 heated to 5 ± 5 ° C. Thus, the transition layer 14 adheres to the substrate S. The state at this time is as shown in FIG. 1, in which the photosensitive layer 12 is adhered to the substrate S, and the coating layer 13 is adhered on the photosensitive layer 12.

Next, a method of laminating the laminated film 10 using the laminating apparatus 40 will be described in more detail with reference to FIGS. Since the upper and lower cutting / peeling / transfer units have the same configuration, only the upper unit will be described here.

The laminated film 10 fed from the feed shaft 42 is in contact with the outer peripheral surface of the applicator roller 41 in a state as shown in FIG. In this state, the cutter 50 is separated from the laminated film 10. Further, a predetermined tensile force acts on the laminated film 10.

First, after the feeding of the laminated film 10 and the rotation of the applicator roller 41 are stopped, the front end of the transfer layer 14 is cut by the cutter 50 as follows. That is, the cutter 50 is moved toward the laminated film 10, and as shown in FIG. 8, the laminated film 10 is pressed from above the support layer 11 to deform the transfer layer 14.
The pressing force and the amount of biting into the transfer layer 14 at this time act on the laminated film 10 when a shear force acts on the transfer layer 14 by the blade 50 c of the cutter 50 and the cutter 50 is separated from the laminated film 10. The value is set so that the transition layer 14 is naturally broken by the applied tensile force.

Thereafter, the cutter 50 is separated from the laminated film 10 and returned to the original position. At this time, the support layer 11 slightly expands due to the tensile force acting on the laminated film 10, but the transition layer 14 is softer and easier to expand than the support layer 11 and has a small breaking strength, as shown in FIG. , Blade 50c
(The part where the layer thickness is reduced)
Breaks at Thus, the front end of the laminated film 14 is cut.

Next, the laminated film 10 is moved at a predetermined speed, and at the same time, the applicator roller 41 is rotated in synchronization with the feed speed. Then, the transition layer 14 in front of the cut portion is taken up together with the support layer 11 by the winding shaft 4.
It is wound on 3. The transition layer 14 behind the cut point is
Since the outer peripheral surface of the applicator roller 41 is vacuum-sucked, it is gradually peeled off as the applicator roller 41 rotates. The exfoliated transfer layer 14 is held on the outer peripheral surface of the applicator roller 41 by vacuum suction.

Next, the rear end of the transition layer 14 whose front end has been previously cut is cut so that the transition layer 14 having a predetermined length is obtained. That is, after stopping the feeding of the laminated film 10 and the rotation of the applicator roller 41 again, FIG.
As shown in FIG. 1, the cutting device 50 is moved in the same manner as when the front end is cut, and the transition layer 14 is deformed. After that, when the applicator roller 41 is rotated while the feeding of the laminated film 10 is stopped, the transfer layer 14 is vacuum-sucked on the outer peripheral surface of the applicator roller 41, so that the transfer layer 14 Breaks. Thus, the transition layer 14 having a predetermined length is obtained. The feeding of the laminated film 10 is started slightly after the start of the rotation of the applicator roller 41.

The transfer layer 14 having a predetermined length obtained as described above moves to a predetermined position shown in FIG. 12 as the applicator roller 41 rotates. There, the applicator roller 41 is stopped. In this position, the front end of the transition layer 14 coincides with a position at a distance L from the front end of the substrate S. Further, the transition layer 14 is separated from the substrate S. Since this position is set in a range where the front end of the transfer layer 14 faces the first chamber 41e, the transfer layer 14 is held by vacuum suction even at a position close to the substrate S, so that the transfer layer 14 moves toward the substrate S There is no danger of sagging.

As shown in FIG. 12, with respect to the applicator roller 51 of the lower peeling / transferring unit, the transfer layer 14 having a predetermined length is held on the outer peripheral surface of the applicator roller 51 in exactly the same manner as described above. Then, it moves to a predetermined position shown in FIG. 51a is an outer cylinder, 51c is a partition plate, 51d is a through hole radially formed in the outer cylinder 51a, 51e and 51f are a first chamber and a second chamber respectively formed inside the outer cylinder 51a, and an applicator.・ Roller 41
Similarly, the first chamber 51e is set lower than the atmospheric pressure, and the second chamber 51f is set higher than the atmospheric pressure.

Next, while rotating the applicator rollers 41 and 51 and feeding the substrate S in synchronization therewith,
The applicator rollers 41, 51 are moved toward the substrate S, causing the transfer layer 14 to contact the substrate S. The state at this time is as shown in FIG. Applicator roller 4
The transfer layer 14 held in the first and the first chamber 51 is in the second chamber 41.
f, 51f, when reaching the position facing the through hole 41d,
The outer cylinders 41a, 51
applicator roller 4
The substrate is easily and reliably transferred to the substrate S with the rotation of the first and the 51st. The transfer layer 14 transferred to the substrate S adheres to both upper and lower surfaces of the substrate S by the adhesive force of the photosensitive layer 12.

Next, as shown in FIG. 14, the substrate S provided with the transfer layer 14 is sent to the pressing rollers 49, 59 by the feeding rollers 48, 58, where it is pressed from both upper and lower sides. Since the pressure rollers 49 and 59 are pre-heated to a predetermined temperature, the transfer layer 14 is firmly adhered to both the upper and lower surfaces of the substrate S, thereby obtaining the laminate structure shown in FIG.

When the transfer of the transfer layer 14 is completed, the cut, peeling, transfer, heating and pressurization of the transfer layer 14 are performed again in the same manner as described above. Thus, the same steps as above are repeated thereafter. [Second Example of Laminated Film Laminating Apparatus] FIG.
2 shows a second example of a laminated film laminating apparatus.

The laminating apparatus 70 of FIG. 15 is different from the laminating apparatus 40 in that
It has a rotatable applicator plate 71, and the overall configuration of both is substantially the same.

In FIG. 15, reference numeral 71 denotes an applicator plate, 72 denotes a feeding axis of the laminated film 10 as a roll, 73 denotes a winding axis of the support layer 11, 74, 75, and 76 denote feed rollers of the support layer 11, 77 , 78 are feed rollers for the substrate S, 79 is a pressure roller for the transfer layer 14 transferred to the substrate S, 80 is a cutter for the transfer layer 14, and 81 is a cutter receiver for receiving the cutter 80 during cutting.

Although not shown, all the components are symmetrically provided in the lower part of the traveling path of the substrate S in this second example. In FIG.
Only the feed rollers 97 and 98 and the pressure roller 99 are shown.

The applicator plate 71 is a hollow flat plate as shown in FIG. 16, and has a chamber 71a formed therein, and a plurality of through holes 71b formed in the front (laminated film 10) wall. ing. The chamber 71a is connected to a vacuum pump and a blower (not shown), and is set at a low vacuum or higher than the atmospheric pressure according to the process. The pressure in the chamber 71a may be equal to the atmospheric pressure instead of being higher than the atmospheric pressure. The applicator plate 71 is supported on a horizontal axis 82 by a support 71c.
And is rotatably supported as shown in FIG.

The cutting device 80 is the same as the cutting device 50 described in the first example.
And the operation is the same. That is,
A rotating body 80a rotatable around the rotating shaft 80b is provided, and an outer peripheral edge of the rotating body 80a is a blade 80c. However, in the second example, as in the first example, the cutting device 8
0 is not pressed against the applicator plate 71, so that the transfer layer 14 is cut while receiving the cutting blade 80c by the cutter receiver 81. The outer peripheral surface of the cutter holder 81 is covered with a material having a hardness that does not damage the laminated film 10 when the cutter 80 is pressed.

At the time of cutting, the cutter 80 is moved toward the laminated film 10 at the same time as the cutter 80 is moved toward the laminated film 10. Then, after fixing the cutter receiver 81 close to the support layer 11, the cutter 80 is pressed from the side of the coating layer 13, and then the cutter 80 is moved in a direction crossing the laminated film 10 to change the transfer layer. Cut 14 When the cutting is completed, the cutter 80 and the cutter receiver 81 are separated from the laminated film 10 and stopped at the original position.

The step of peeling the transfer layer 14 from the support layer 11 is also different from the first example. That is, in the second example, after the transfer layer 14 is cut into a predetermined length, the transfer layer 14 is vacuum-sucked to the surface of the applicator plate 71, and in that state, the feed roller 75 is moved along the applicator plate 71. Is raised, the support layer 11 is peeled off.

Next, the laminating apparatus 7 having the above configuration
The method of laminating the laminated film 10 using 0
This will be described in more detail with reference to FIGS. Since the upper and lower cutting / peeling units have the same configuration, only the upper unit will be described here.

The laminated film 10 fed from the feed shaft 72 extends vertically between the feed rollers 74 and 75 in the state shown in FIG. 15 near the outer surface of the applicator plate 71. . In this state, the laminated film 10 is not in contact with the applicator plate 71, and the cutter 80 and the cutter receiver 81 are also separated from the laminated film 10. A predetermined tensile force acts on the laminated film 10.

First, the feeding of the laminated film 10 is stopped, and the front end of the transfer layer 14 is cut by the cutter 80 and the cutter receiver 81 as follows. That is, the cutting device 80
And the cutter receiver 81 are moved toward the laminated film 10, and in a state where the cutter receiver 81 is close to the support layer 11,
The laminated film 10 is cut from above the coating layer 13 by the cutter 80.
Press. Then, since the laminated film 10 is sandwiched between the cutter receiver 81 and the cutter 80, the transfer layer 14 is deformed. The pressing force and the amount of biting into the transition layer 14 at this time act on the laminated film 10 when a shear force acts on the transition layer 14 by the blade 80 c of the cutter 80 and the cutter 80 is separated from the laminated film 10. The value is set so that the transition layer 14 is naturally broken by the applied tensile force.

Thereafter, the cutter receiver 81 and the cutter 50 are separated from the laminated film 10 and returned to their original positions. At this time, the support layer 11 slightly expands due to the tensile force acting on the laminated film 10, but the transition layer 14 is softer and easier to expand than the support layer 11 and has a small breaking strength, as shown in FIG. At the location deformed by the blade 80c (the location where the layer thickness is reduced). Thus, the front end of the laminated film 14 is cut.

Next, the laminated film 10 is moved at a predetermined speed, and the position of the rear end of the transfer layer 14 to be cut is determined by the cutter 80.
Stop to match the height of In the meantime, the transition layer 14 in front of the cut point is taken up together with the support layer 11 by the winding shaft 7.
It is wound on 3. The transition layer 14 behind the cut point is
It remains adhered to the support layer 11.

Next, after the feeding of the laminated film 10 is stopped again, the cutter 80 and the cutter receiver 81 are moved to cut the transition layer 14 in the same manner as when the front end is cut. Then, the laminated film 10 is slightly moved so that the transfer layer 14 cut to a predetermined length is adsorbed to a predetermined position on the surface of the applicator plate 71, and then the chamber 71a inside the applicator plate 71 is removed. Apply vacuum. Then, the transfer layer 14 is vacuum-sucked to the surface of the applicator plate 71, and becomes a state as shown in FIG.

Next, as shown in FIG. 17, the feed roller 75 is moved upward to the position shown by the broken line in FIG.
Since the transfer layer 14 is held by the applicator plate 71, this movement causes the support layer 11 to peel off from the transfer layer 14. In this manner, the transfer layer 14 cut to a predetermined length is held on the applicator plate 71 in a state of being spread.

Next, the applicator plate 71 rotates downward by 90 ° and stops, and as shown in FIG. 18, the substrate S sent by the feed rollers 77 and 78 is turned off.
The transfer layer 14 is made to face. The feeding of the substrate S is also stopped at the position shown in FIG. In this position, the front end of the transition layer 14 coincides with a position at a distance L from the front end of the substrate S. Further, the transition layer 14 is separated from the substrate S. At this position, the chamber 71a is kept in a vacuum so that the transfer layer 14 does not fall.

When the peeling is completed, the applicator plate 7
When 1 rotates by 90 °, the feed roller 75 returns to the original position (the position indicated by the solid line in FIG. 15). In this example, while the feed roller 75 moves up and down, the tensile force of the laminated film 10 is kept substantially constant by a tensile force adjusting mechanism (not shown).

Next, the feed roller 78 is moved in advance to a position where it does not hinder the transfer of the transfer layer 14 held on the applicator plate 71 to the substrate S. 71 is lowered toward the substrate S, and the transfer layer 14 is brought into contact with the substrate S. The state at this time is as shown in FIG. Therefore, when the pressure in the chamber 71a of the applicator plate 71 is switched to the atmospheric pressure or higher, the attraction force is lost, and the transfer layer 14 held on the applicator plate 71 is peeled off. Thus, the transfer layer 14 is transferred to the substrate S.

The transfer layer 14 having a predetermined length is transferred to the lower surface of the substrate S as shown in FIG. The transfer layer 14 transferred to the lower surface of the substrate S adheres by the adhesive force of the photosensitive layer 12.

Next, the substrate S having the transfer layer 14 on both the upper and lower surfaces is fed by the feed rollers 78 and 98 to the pressing roller 79,
It is sent to 99, where it is pressurized from both upper and lower sides. Since the pressure rollers 79 and 99 are preheated to a predetermined temperature, the transfer layer 14 is firmly adhered to both the upper and lower surfaces of the substrate S, thereby obtaining the laminate structure shown in FIG.

After the transfer is completed, the applicator plate rotates 270 ° and stops at the position shown in FIG. Then, the same steps as above are repeated.

As described above, both of the laminating apparatus 40 of the first example and the laminating apparatus 70 of the second example have a high reliability.
Can be transferred onto the substrate S.

In the above description, the laminated film 10 is described as being used as a resist film for plating or etching when manufacturing a printed wiring board, and the laminating devices 40 and 70 are used to connect the laminated film 10 to the printed wiring board. Although described as an apparatus for laminating on a substrate, the present invention is not limited to these, and can be applied to other uses.

[0089]

According to the laminated film of the present invention, it is possible to obtain not only a higher resolution than before, but also an effect that the transition layer easily follows irregularities on the surface of the object to be laminated.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view showing a state in which a transfer layer according to one embodiment of a laminated film of the present invention is laminated on a substrate.

FIG. 2 is a partial sectional view of one embodiment of the laminated film of the present invention.

FIG. 3 is a schematic configuration diagram of an apparatus used for manufacturing the laminated film of FIG.

FIG. 4 is a schematic configuration diagram of a first example of a laminating apparatus.

FIG. 5 is a sectional view of an applicator roller of the laminating apparatus of FIG. 4;

FIG. 6 is a front view of a cutter of the laminating apparatus of FIG. 4;

FIG. 7 is a cross-sectional view of a main part showing a step of cutting a front end of a laminated film to be laminated in the laminating apparatus of FIG. 4;

FIG. 8 is a cross-sectional view of a main part showing a step of cutting a front end of a laminated film to be laminated in the laminating apparatus of FIG.

9 is a fragmentary cross-sectional view showing a step of cutting a front end of a laminated film to be laminated in the laminating apparatus of FIG. 4;

FIG. 10 is a sectional view of a main part showing a step of cutting the rear end of the laminated film to be laminated in the laminating apparatus of FIG.

11 is a cross-sectional view of a main part showing a step of cutting the rear end of the laminated film to be laminated in the laminating apparatus of FIG. 4;

12 is a fragmentary cross-sectional view showing a step of transferring a cut laminated film onto a substrate in the laminating apparatus of FIG. 4;

13 is a fragmentary cross-sectional view showing a step of transferring a cut laminated film onto a substrate in the laminating apparatus of FIG. 4;

14 is a fragmentary cross-sectional view showing a step of pressure-bonding the laminated film transferred onto the substrate in the laminating apparatus of FIG. 4;

FIG. 15 is a schematic configuration diagram of a second example of the laminating apparatus.

16 is a fragmentary cross-sectional view showing a step of peeling a support layer from the cut laminated film in the laminating apparatus of FIG. 15;

17 is a fragmentary cross-sectional view showing a step of peeling a support layer from the laminated film cut in the laminating apparatus of FIG.

18 is a fragmentary cross-sectional view showing a step of transferring a transfer layer transferred to an applicator plate onto a substrate in the laminating apparatus of FIG. 15;

19 is a fragmentary cross-sectional view showing a step of transferring a transfer layer transferred to an applicator plate onto a substrate in the laminating apparatus of FIG. 15;

20 is a fragmentary cross-sectional view showing a step of pressure-bonding a transfer layer transferred onto a substrate in the laminating apparatus of FIG. 15;

FIG. 21 is a partial cross-sectional view showing a state in which a transition layer as an example of a conventional laminated film is laminated on a substrate.

FIG. 22 is a partial cross-sectional view of an example of a conventional laminated film.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Laminated film 11 Support layer 12 Photosensitive layer 13 Coating layer 14 Transition layer 20 Laminated film manufacturing apparatus 21 Feeding roll 22, 23, 27 Feeding roll 24 Photosensitive resin composition 25 Coating thickness adjusting roll 26 Dryer 28 Winding roll 30 Roll Take-up roll 31 Film for support layer 32 Photosensitive resin composition layer 40 Laminating device 41 Applicator roller 41a Outer cylinder 41b Central shaft 41c Partition plate 41d Through-hole 41e First chamber 41f Second chamber 42 Feeding shaft 43 Winding shaft 44 , 45, 46, 47, 48 Feeding roller 49 Pressure roller 50 Cutting device 50a Rotating body 50b Rotating shaft 50c Blade 51 Applicator roller 51a Outer cylinder 51c Partition plate 51d Through hole 51e First chamber 51f Second chamber 52 Feeding axis 53 Take-up shaft 54, 55, 56, 57, 58 Feed Roller 59 Pressure roller 60 Cutting device 70 Laminating device 71 Applicator plate 71a Chamber 71b Through hole 71c Supporting member 72 Feeding shaft 73 Winding shaft 74, 75, 76, 77, 78 Feeding roller 79 Pressing roller 80 Cutting device 80a Rotating body 80b Rotating shaft 80c Blade 81 Cutting device receiver 97, 98 Feed roller 99 Pressure roller S Substrate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kazuhiko Onoda 4-3-1, Higashicho, Hitachi City, Ibaraki Prefecture F-term in Hitachi Chemical Co., Ltd. Yamazaki Factory 4F100 AK01C AK17A AR00B AT00A AT00C BA02 BA03 BA07 BA10A BA10C EA02 EC04 EH46B EJ19 EJ30 EJ86B GB43 JA04C JA20A JA20C JB16C JK08C JK13A JL11A JL14B JL14C JN17B YY00A YY00C 5E339 BE13 CC01 CC02 CD01 CE16 CF01 CF16 CF17 CG04 DD04 GG10 5E343 CC63 DD08 GG10 5E343 CC63

Claims (13)

[Claims] 1. A photoconductor comprising: a support layer having flexibility; a photosensitive layer adhered to one surface of the support layer; and a coating layer adhered to a surface of the photosensitive layer opposite to the support layer. A laminated film having a three-layer structure, wherein the coating layer contains a thermoplastic resin transparent to light for exposure to the photosensitive layer, and when laminating the photosensitive layer on the surface to be laminated Has a resistance to heat and pressure applied to the laminate film, when a tensile force is applied between the support layer and the photosensitive layer while applying a predetermined tension to the laminated film, the coating layer and the photosensitive layer Both are configured to be separated from the support layer as a transfer layer, and when the transfer layer separated from the support layer is transferred to the surface of the object, the photosensitive layer is brought into contact with the surface of the object. To the photosensitive layer Irradiation of the exposure light beam is performed through the coating layer, and further, heat and pressure applied when laminating the photosensitive layer are applied to the photosensitive layer through the coating layer. A laminated film characterized by the above-mentioned. 2. A flexible support layer, a photosensitive layer made of a photosensitive resin composition applied and dried on one surface of the support layer, and a photosensitive layer on the opposite side of the photosensitive layer from the support layer. A laminated film having a three-layer structure including a bonded coating layer containing a thermoplastic resin, wherein a transfer layer transferred to an object to be laminated includes the coating layer and the photosensitive layer. Characterized laminated film. 3. A flexible support layer, a photosensitive layer comprising a photosensitive resin composition adhered to one surface of the support layer,
A three-layer laminated film comprising a thermoplastic resin-containing coating layer adhered to a surface of the photosensitive layer opposite to the support layer, the transfer layer being transferred to an object to be laminated. Is composed of the coating layer and the photosensitive layer. 4. A flexible support layer, a photosensitive layer comprising a photosensitive resin composition adhered to one surface of the support layer,
A coating layer containing a thermoplastic resin adhered to a surface of the photosensitive layer opposite to the support layer, the laminated film having a three-layer structure, wherein the photosensitive layer is formed on a surface to be laminated. When laminating, the support layer is peeled off, and the coating layer and the photosensitive layer are transferred to the object. 5. The coating layer having a thickness of 0.01 μm to 50 μm.
The laminated film according to any one of claims 1 to 4, which is in a range of µm. 6. The coating layer has a thickness of 0.1 μm to 20 μm.
The laminated film according to any one of claims 1 to 4, which is in a range of µm. 7. The support layer has a thickness of 5 μm to 200 μm.
The laminated film according to any one of claims 1 to 6, which is in a range of m. 8. The photosensitive layer has a thickness of 5 μm to 250 μm.
The laminated film according to any one of claims 1 to 7, which is in a range of m. 9. The laminated film according to claim 1, wherein the coating layer is in contact with the photosensitive layer. 10. The softening point or melting point of the coating layer is 40.
The laminated film according to any one of claims 1 to 9, which is at least 0C. 11. The method according to claim 1, wherein the coating layer exhibits an elongation of 10% or more at a temperature at the time of lamination, and a stress at the time of 10% elongation is 500 gf or less. Laminated film. 12. The method according to claim 1, wherein an adhesive force between the coating layer and the photosensitive layer is larger than an adhesive force between the support layer and the photosensitive layer. Laminated film. 13. An adhesive force between the covering layer and the photosensitive layer is larger than an adhesive force between the support layer and the photosensitive layer, and the photosensitive layer is provided on the surface of the object to be laminated. The laminated film according to any one of claims 1 to 11, wherein, when laminating, the support layer is peeled off, and the coating layer and the photosensitive layer are transferred to the target.