JP2002164413A - Pitch converter - Google Patents

Abstract

(57) [Problem] To provide a pitch conversion device which can change the pitch between a plurality of support plates at a time, is easy to control, and operates smoothly. Kind Code: A1 Abstract: A base 2, a cam plate 4, which is provided in the base 2 so as to be able to advance and retreat and has a plurality of inclined cam grooves 3, and a follower 5 which slides in the cam grooves 3. A plurality of support plates 6 arranged in parallel with the cam plates 4, 4, and a guide portion 7 formed on the support plate 6 and extending from the base 2 along the direction in which the plurality of support plates 6 are arranged. And a guide body 8 slidably engaged,
A pitch conversion device in which the pitch between the plurality of support plates 6 is changed at a time by moving the plurality of support plates 6 along the guide body 8 by moving the cam plates 4 and 4 forward and backward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pitch converter, and more particularly, to a pitch converter for converting a pitch between a plurality of support plates at once by moving a guide plate having a plurality of inclined guide grooves formed therein. The present invention relates to a conversion device.

[0002]

2. Description of the Related Art In processes such as surface oxidation of semiconductor wafers and diffusion of impurities, semiconductor wafers are transferred from a wafer carrier on which semiconductor wafers before processing are arranged to a wafer boat, and after processing is completed, the semiconductor wafers are transferred from the wafer boat to a wafer carrier. Put on.

In these processes, transfer from a wafer carrier to a wafer boat and transfer from a wafer boat to a wafer carrier are performed using a wafer transfer apparatus. At the time of transfer, wafer carrier groove pitch of wafer carrier and wafer boat (wafer juxtaposed pitch)
Are the same, a plurality of semiconductor wafers are transferred at once by a plurality of fixed forks provided in the wafer transfer device. However, when the groove pitch between the wafer carrier and the wafer boat is different, the productivity is low because the wafers are transferred one by one by one fork provided in the wafer transfer device.

As an apparatus for solving this problem, Japanese Unexamined Patent Publication No. 6-183512 discloses a wafer transfer apparatus capable of transferring all wafers at once even when the groove pitch between the wafer carrier and the wafer boat is different. It has been disclosed. The wafer transfer device according to the present disclosure is a device that includes a link mechanism having a holding member, and collectively converts an arrangement interval of a plurality of flat samples held by the holding member,
A holding member attached to each of a plurality of movers provided to be linearly movable along a guide formed in a straight line,
A lever pivotally attached to a fulcrum provided on the axis of the guide,
One end is pivotally attached to this lever and the other end is pivotally attached to the mover,
Moreover, it is composed of a plurality of arms arranged in parallel at a predetermined interval.

The problem with this device is that it has a link mechanism, requires a large space for the rotation of the lever, and is large. In addition, since the amount of rotation of the lever is not proportional to the fork pitch, control is complicated. In addition, the movement of the mover is lacking smoothly, and the number of parts is large and the number of operating parts is large, so the structure is complicated and expensive, and the relatively large number of operating parts may cause particle contamination. No.

[0006]

Therefore, there is a need for a pitch converter that can change the pitch between a plurality of support plates at a time, is easy to control, and operates smoothly.

The present invention has been made in view of the above circumstances, and provides a pitch conversion device that can change the pitch between a plurality of support plates at a time, is easy to control, and operates smoothly. With the goal.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, a first aspect of the present invention is directed to a cam having a base and a plurality of inclined cam grooves provided in the base so as to be able to advance and retreat. A plate, a plurality of support plates arranged in parallel with the cam plate via a follower sliding in the cam groove, and a plurality of support plates arranged in parallel, and extended to the base along the arrangement direction of the plurality of support plates, A guide portion formed on the support plate and a guide body slidably engaged with the guide plate, and by moving the cam plate forward and backward to move the plurality of support plates along the guide body, The pitch conversion device is characterized in that the pitch between the support plates is converted at once.

In the invention of claim 2 of the present application, the plurality of cam grooves have different inclination gradients, and the support plate disposed at the center among the plurality of support plates is fixed to a base, and the plurality of cam grooves have the same inclination. The gist of the invention is that the inclination gradient is formed symmetrically with respect to the support plate.

According to a third aspect of the present invention, in the pitch conversion device according to claim 1 or 2, the inclination gradient of the plurality of cam grooves increases as the cam grooves are formed outside. The gist is that

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a pitch converter according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a side view of an embodiment in which a pitch conversion device according to the present invention is applied to a semiconductor wafer transfer device with a cover removed.

The semiconductor wafer transfer device 1 includes a base 2,
A pair of cam plates 4, 4, which are provided on the base 2 so as to be able to move forward and backward and are provided with a plurality of inclined cam grooves 3, and a cam plate 4, 4 via a follower 5 sliding in the cam grooves 3. A plurality of supporting plates 6 arranged in parallel with each other, and a guide portion 7 formed on the supporting plate 6 and extending on the base 2 along the arrangement (vertical) direction of the plurality of supporting plates 6.
And a driving means 9 for moving the cam plates 4 and 4 in the horizontal direction.

The base 2 includes a bottom plate 10, four pillars 11 erected on the bottom plate 10, and a top plate 12 attached to the pillar 11. A pair of cam rates 4, 4 are provided on both side surfaces of the base 2, and four cam grooves 3 (3a, 3b, 3d,
3e) is perforated. An outer cam groove 3a,
3e has the same inclination but different directions. The cam grooves 3b and 3d located inside have different inclinations but different directions, have a smaller inclination than the cam grooves 3a and 3e, and further have the cam grooves 3a, 3b, 3d and 3d.
"e" is provided on the cam plates 4 and 4 in a symmetrical relationship with a fixed support plate 6c located at the center as described later.

Further, in the base 2, five support plates 6 (6a, 6b, 6c, 6d, 6e) are arranged separately from each other in the vertical direction (the direction in which the guide body 8 extends). Of the five support plates 6, four support plates 6
a, 6b, 6d, and 6e are the followers 5 (5a, 5b, 5
d, 5e) and via the cam grooves 3a, 3b, 3d, 3e, are supported by the cam plates 4, 4, and move in the vertical direction in conjunction with the cam plates 4, 4. The remaining center support plate 6c is fixed to the base 2 and is always at a fixed position.

Further, as shown in FIGS. 1 and 2, each of the support plates 6 has a notch 13 for reducing its weight.
Are formed in a substantially U-shape, and through-holes 14 and 15 through which the guide body 8 penetrates are formed in both legs of the U-shape, and the support plates 6a, 6b, 6d and 6e are formed in the legs. Are provided with guide portions 7 (7a, 7b, 7d, 7e). The guide portions 7 are slidably engaged with the guide members 8 to move the support plates 6a, 6b, 6d, 6e forward and backward. The support plates 6a, 6b along the guide body 8,
It functions to move 6d and 6e in the vertical direction. The guide portion may be formed separately and fixed as in the present embodiment, or may be formed directly on the support plate.

Further, support plates 6a, 6b, 6c,
A fork 16 made of a material that does not contaminate the semiconductor wafer even when it comes into contact with the semiconductor wafer is attached to 6d and 6e.

The driving means 9 is provided on the top plate 12 of the base 2.
The driving means 9 includes a stepping motor 17, a screw shaft 18 rotated by the stepping motor 17 and formed by a ball screw, and a moving member 19 which is screw-coupled to the screw shaft 18 to advance and retreat. The rotation of the stepping motor 17 causes the cam plates 4, 4 to be moved via the screw shaft 18 and the moving member 19 to the slider 20 provided below the cam plates 4, 4. It is slidably engaged and reciprocates in a horizontal direction along a slide guide 21 provided on the base 2.

Incidentally, 22a, 22b, 22d, 22e
The follower 5a, 5b, 5d, 5e
a, 6b, 6d, and 6e. The semiconductor wafer transfer device 1 is covered with a cover 23 as shown in FIG.

Next, a method for transferring a semiconductor wafer using the semiconductor wafer transfer apparatus according to the embodiment of the present invention will be described.

As shown in FIG. 3, the semiconductor wafer W mounted on the transport cassette C is transferred to the wafer boat B using the semiconductor wafer transfer device 1.

For example, the fork 16 of the semiconductor wafer transfer apparatus 1 faces the cassette C on which the semiconductor wafers W are mounted at the pitch p1. Thereafter, the rotary table RT is moved forward to place the semiconductor wafer W on the fork 1.
After inserting the space between the cassette C and the cassette C
The semiconductor wafer W is supported on the wafer supporting portion provided in the above, and the semiconductor wafer W is mounted on the cassette C.

At this time, as shown in FIG.
The pitch p1 between 6 is set smaller than the pitch p2 of the semiconductor wafer W mounted on the wafer boat B shown in FIGS. 3 and 5, and in this state, the cam plates 4, 4 have receded. , The followers 5a, 5b, 5d, 5e respectively provided on the support plates 6a, 6b, 6d, 6e are provided with cam grooves 3a, 3b, 3d,
3e is located in the front area (inner area).

Next, the rotary table RT is moved backward and further rotated, so that the semiconductor wafer transfer device 1 faces the wafer boat B as shown by a dotted line in FIG. The wafer boat B has a pitch P1 between the semiconductor wafers W mounted on the cassette C so that the semiconductor wafers W mounted on the wafer boat B are uniformly heat-treated.
It is set larger than. Therefore, in order to mount the semiconductor wafer W on the wafer boat B, it is necessary to change the wafer pitch (fork pitch) from p1 to p2.

Then, as shown in FIG. 5, the stepping motor 17 of the driving means 9 is rotated a predetermined number of times, the screw shaft 18 is rotated, and the moving member 19 is advanced by a predetermined distance. With the advance of the moving member 19, the cam plates 4, 4 also advance.
a, 6b, 6d, and 6e move vertically along the guide body 8 by a predetermined distance, and the wafer pitch (fork pitch) can be changed from p1 to p2 in a lump. That is,
The cam plates 4, 4 move forward, but the guide plates 7 and the guide body 8 suppress the advancement (forward force) of the support plates 6a, 6b, 6d, 6e, and followers 5a, 5b, 5
d and 5e are located behind the cam grooves 3a, 3b, 3d and 3e along the cam grooves 3a, 3b, 3d and 3e, and the followers 5a, 5b, 5d and 5e are separated from each other, 7 is raised or lowered along the guide body 8 to increase the distance between the support plates 6a, 6b, 6d, 6e, and collectively set the pitch between the support plates 6a, 6b, 6d, 6e and the fork 16 to p1. To p2. Thereby, the wafer pitch also becomes p2 in a lump. In this state, the rotary table RT is advanced, the semiconductor wafer W is inserted into the wafer boat B, the wafer boat B is slightly raised, and the semiconductor wafer W is supported and mounted in the support groove of the wafer boat B. After a while, the rotary table R
T is retracted, and the fork 16 is retracted. The wafer boat B on which the semiconductor wafer W is mounted is housed in the heat treatment furnace F, and heat treatment is performed.

After the heat treatment, the wafer boat B on which the semiconductor wafer W is mounted is taken out of the furnace, and transferred to the semiconductor wafer W on the fork 16 at the pitch p2 by the reverse method. The wafer W faces the cassette C, and the semiconductor wafer W is transferred to the cassette C.
At this time, it is necessary to change the wafer pitch (fork pitch) from p2 to p1. By rotating the stepping motor 17 of the driving means 9 a predetermined number of times in the cam plates 4 and 4 in the state shown in FIG. 5, the screw shaft 18 is rotated and the moving member 19 is retracted by a predetermined distance. With the retreat of the moving member 19, the cam plates 4, 4 also retreat, whereby the support plates 6a, 6
b, 6d, and 6e move vertically by a predetermined distance along the guide body 8, and the wafer pitch (fork pitch) collectively changes from p2 to p1. In other words, the cam plates 4 and 4 are retracted, but the guide plates 7 and the guide body 8 restrain the support plates 6a, 6b, 6d and 6e from retreating (rearward force), and followers 5a, 5b, 5d and 5e. Are cam grooves 3a, 3b, 3d, 3e along the cam grooves 3a, 3d, 3e.
b, 3d, 3e, and each follower 5
a, 5b, 5d and 5e are close to each other, and the guide portion 7 is moved up or down along the guide body 8 to support the support plates 6a and 6e.
The distance between b, 6d, 6e is reduced, and as shown in FIG.
The pitch between the support plates 6a, 6b, 6c, 6d, 6e and the fork 16 is collectively changed from p2 to p1. Thereby, the wafer pitch also becomes p1 in a lump. In this state, the rotary table RT is advanced, the semiconductor wafer W is inserted into the cassette C, the semiconductor wafer W is supported in the support groove provided in the cassette C, and the rotary table RT is retracted, and the semiconductor wafer W is set in the cassette. Transfer to C.

As described above, the semiconductor wafer transfer device 1
A plurality of support plates 6 arranged in parallel with the cam plates 4, 4 via the follower 5 by moving the cam plates 4, 4 in which the plurality of inclined cam grooves 3 are formed. Can be changed at once.
Further, since the pitch is changed by moving the cam plates 4 and 4, the size is reduced without requiring a large space, and the pitch change is performed by the moving amount of the cam plates 4 and 4, which is proportional and easy to control. In addition, since the movement of the follower 5 is smooth, the support plates 6a, 6b, 6d,
6e can be moved up and down smoothly, and the number of parts can be reduced, so that the structure becomes simple and inexpensive. Further, since there are relatively few operation parts, there is no possibility of particle contamination.

In the above-described embodiments of the present invention, a description has been given of the transport cassette and the pitch converter for transferring the wafers between the wafer boats, each having a uniform pitch. However, the present invention is not limited to this embodiment. In addition, a plurality of inclined cam grooves formed in the cam plate,
The pitch interval can be arbitrarily varied by forming an asymmetric gradient in the vertical direction with respect to the support plate disposed at the center.

[0029]

According to the pitch converter according to the present invention, the pitch between a plurality of support plates can be changed collectively, and further, a pitch converter which is easy to control and can operate smoothly can be provided. .

That is, a cam plate provided with a plurality of inclined cam grooves, a plurality of support plates interlocked with the cam plate via a follower sliding in the cam grooves, and A guide portion slidably engaged with a guide portion formed on the support plate along a direction in which the support plate is disposed, and a guide plate slidably engaged with the base plate. By moving the pitch along the guide, the pitch between multiple support plates is changed at once, making it compact without the need for a large space. Because of the relationship, the control is easy, and the movement of the follower is smooth, so that the support plate can be moved up and down smoothly, and the number of parts can be reduced, so that the structure is simplified and the cost is reduced. In addition, since the operation portion is relatively small, there is little possibility particle contamination occurs.

The inclination of the plurality of cam grooves is different.
The support plate disposed at the center of the plurality of support plates is fixed to the base, and the inclination gradients of the plurality of cam grooves are formed symmetrically with respect to the support plate.
The cam grooves and the plurality of support plates formed on both sides (up and down) of the fixed support plate can be provided symmetrically with respect to the fixed support plate, and the structure is simplified.

Further, since the inclination of the plurality of cam grooves becomes greater as the cam grooves are formed on the outer side, the pitch between the support plates can always be the same.

[Brief description of the drawings]

FIG. 1 is a perspective view of a pitch converter according to the present invention with a cover removed.

FIG. 2 is a sectional view taken along the line AA in FIG. 1;

FIG. 3 is a conceptual diagram showing a method for transferring a semiconductor wafer using the pitch converter according to the present invention.

FIG. 4 is a side view of the pitch conversion device for explaining the operation of the pitch conversion device according to the present invention.

FIG. 5 is a side view of the pitch converter explaining the operation of the pitch converter according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 semiconductor wafer transfer device 2 base 3 (3a, 3b, 3d, 3e) cam groove 4 cam plate 5 (5a, 5b, 5d, 5e) follower 6 (6a, 6b, 6c, 6d, 6e) support plate 7 (7a, 7b, 7c, 7d, 7e) Guide portion 8 Guide body 9 Driving means 10 Bottom plate 11 Support 12 Top plate 13 Notch portion 14, 15 Through hole 16 Fork 17 Stepping motor 18 Screw shaft 19 Moving member 20 Slider 21 Sliding guide body 22 (22a, 22b, 22d, 22e) Mounting member 23 Cover

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Michio Sasaki 1 Minamifuji, Ogakie-cho, Kariya-shi, Aichi F-term (reference) 3F022 AA08 CC02 EE05 KK01 MM02 MM11 5F031 CA02 FA12 FA25 HA61 PA26 5F045 BB10 BB14 EN04

Claims (3)

[Claims] 1. A base, a cam plate provided on the base so as to be able to advance and retreat, and having a plurality of inclined cam grooves, interlocked with the cam plate via a follower sliding in the cam grooves, A plurality of support plates arranged in parallel, and a guide body extending on the base along the direction of arrangement of the plurality of support plates and slidably engaged with a guide portion formed on the support plate. Pitch, wherein the pitch between the plurality of support plates is changed at a time by moving the plurality of support plates along the guide body by moving the cam plate forward and backward. Conversion device. 2. The plurality of cam grooves have different inclination gradients.
The support plate disposed at the center among the plurality of support plates is fixed to a base, and the inclination gradients of the plurality of cam grooves are formed symmetrically with respect to the support plate. 2. The pitch converter according to 1. 3. The pitch conversion device according to claim 1, wherein the inclination of the plurality of cam grooves is such that the inclination of the cam grooves formed on the outer side increases.