JP2002137250A - Granule supply device and electronic component molding device using this device - Google Patents
Granule supply device and electronic component molding device using this deviceInfo
- Publication number
- JP2002137250A JP2002137250A JP2000333310A JP2000333310A JP2002137250A JP 2002137250 A JP2002137250 A JP 2002137250A JP 2000333310 A JP2000333310 A JP 2000333310A JP 2000333310 A JP2000333310 A JP 2000333310A JP 2002137250 A JP2002137250 A JP 2002137250A
- Authority
- JP
- Japan
- Prior art keywords
- granule
- supplied
- sealing resin
- measuring
- supply device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008187 granular material Substances 0.000 title claims abstract description 56
- 238000000465 moulding Methods 0.000 title claims abstract description 17
- 238000005303 weighing Methods 0.000 claims abstract description 16
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 41
- 239000011347 resin Substances 0.000 abstract description 41
- 238000007789 sealing Methods 0.000 abstract description 39
- 238000005192 partition Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】 例えばモールド装置に供給される顆粒状の封
止樹脂部材の供給量を容易に変更できるようにする。
【解決手段】 ホッパ11内に、封止樹脂部材(顆粒
物)2が供給され、その供給された顆粒物2は、排出口
11bから計量部12に供給される。計量部12は、筐
体121と、この筐体121に支持されつつ摺動し、底
部が開閉自在に構成された計量孔122aを有する計量
箱122とで構成されるとともに、棒状の調整部材12
4が、計量孔122a内に向けて、押し込み自在となる
ように組込み構成されている。従って、顆粒物供給装置
1による、顆粒物2のローダ3を介した金型ポット41
a等への供給に際し、計量孔122a内への調整部材1
24の押し込み量(長さL)の制御により、顆粒物2の
供給量を容易かつ高精度に調整することができる。
(57) Abstract: For example, the supply amount of a granular sealing resin member supplied to a molding apparatus can be easily changed. SOLUTION: A sealing resin member (granules) 2 is supplied into a hopper 11, and the supplied granules 2 are supplied to a measuring section 12 from an outlet 11b. The weighing unit 12 includes a housing 121, a weighing box 122 having a weighing hole 122a that is slid while being supported by the housing 121, and whose bottom is openable and closable.
4 is assembled so that it can be pushed into the measuring hole 122a. Therefore, the mold pot 41 via the loader 3 of the granule 2 by the granule supply device 1
a when the adjusting member 1 is inserted into the measuring hole 122a.
By controlling the pushing amount (length L) of 24, the supply amount of the granules 2 can be adjusted easily and with high precision.
Description
【0001】[0001]
【発明の属する技術分野】この発明は、半導体チップ等
の電子部品を搬送するモールド装置に採用して好適な顆
粒物供給装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a granule supply apparatus suitable for use in a molding apparatus for transporting electronic components such as semiconductor chips.
【0002】[0002]
【従来の技術】半導体チップ等の電子部品のモールド成
形では、金型に供給される封止材としてエポキシ樹脂製
の封止部材が多く使用される。2. Description of the Related Art In molding electronic components such as semiconductor chips, a sealing member made of epoxy resin is often used as a sealing material supplied to a mold.
【0003】金型のポット(pot)に供給された封止
部材は、溶融加熱され、金型のキャビティ内に収納され
た電子部品をモールドする。金型ポットに供給される樹
脂封止部材には、粉末状のものや柱状(塊状)のいわゆ
る樹脂タブレット(tablet)等が採用されるが、
粉末状のものはポットに投下された際に粉塵が発生して
半導体チップに悪影響を及ぼすおそれがある。また樹脂
タブレットのものは塊状であるから単位供給量が特定さ
れてしまうので、製品に応じてポットへの供給量が適宜
変わる場合には適用し難という問題がある。A sealing member supplied to a mold pot is melted and heated to mold an electronic component housed in a cavity of the mold. As the resin sealing member to be supplied to the mold pot, a powdery material, a columnar (lumped) so-called resin tablet, or the like is used.
When the powder is dropped into a pot, dust may be generated to adversely affect the semiconductor chip. In addition, since the unit supply amount is specified because the resin tablet is a lump, there is a problem that it is difficult to apply when the supply amount to the pot is appropriately changed depending on the product.
【0004】その点、顆粒状の封止樹脂部材は、顆粒状
であるが故に、粉末状のものと比較してポットへの投入
の際の粉塵発生が抑えられ、また塊状の封止部材とは異
なって供給量の調整にも容易に対応できるという利点が
ある。[0004] In this respect, since the granular sealing resin member is granular, the generation of dust at the time of being put into a pot is suppressed as compared with a powdery sealing resin member, and the granular sealing resin member has Has the advantage that it can easily cope with the adjustment of the supply amount.
【0005】電子部品のモールド成形等では、製品が特
定されれば、金型ポットへの封止樹脂部材の供給量も自
ずから特定される。封止樹脂部材の金型ポットへの搬送
投下はローダによって行われ、ポットピッチに合わせて
ローダに設けられた複数個の各供給口に、金型ポットに
投下される量の封止樹脂部材が収納されて搬送される。In the molding of electronic parts and the like, when a product is specified, the supply amount of the sealing resin member to the mold pot is also specified automatically. The transfer of the sealing resin member to the mold pot is performed by a loader, and the amount of the sealing resin member dropped into the mold pot is supplied to a plurality of supply ports provided in the loader in accordance with the pot pitch. It is stored and transported.
【0006】図3は、従来の顆粒物供給装置を採用した
電子部品モールド装置の概略構成を示したもので、顆粒
物供給装置1は、顆粒物である封止樹脂部材2を収納す
るホッパ(hopper)11と、不図示の基台上に固
定された計量部12とで構成され、ホッパ11はビス1
1aにより計量部12に取付け固定されている。FIG. 3 shows a schematic configuration of an electronic component molding apparatus employing a conventional granule supply apparatus. A granule supply apparatus 1 includes a hopper 11 for accommodating a sealing resin member 2 which is a granule. And a weighing unit 12 fixed on a base (not shown).
It is attached and fixed to the measuring section 12 by 1a.
【0007】計量部12は、図4にも拡大して示したよ
うに、断面コ字状の筐体121とその筐体121に案内
されつつ図示前後方向に移動可能な計量箱122とで構
成され、ホッパ11から供給された封止樹脂部材2の量
を計量しつつ、ローダ3に供給するように構成されてい
る。As shown in FIG. 4, the weighing section 12 includes a housing 121 having a U-shaped cross section and a weighing box 122 which is guided by the housing 121 and is movable in the front-rear direction in the figure. Then, the amount of the sealing resin member 2 supplied from the hopper 11 is measured and supplied to the loader 3.
【0008】すなわち、ホッパ11を載置した断面コ字
状の筐体121の上片部には、ホッパ11の排出口11
bにつらなる連接口121aが設けられており、また計
量箱122には上下に貫通する計量孔122aが形成さ
れていて、その計量孔122aの下方部は、その計量孔
122aを横断して開閉自在となるようにシャッタ12
2bが設けられている。More specifically, the upper portion of the housing 121 having a U-shaped cross section on which the hopper 11 is placed is provided with the discharge port 11 of the hopper 11.
b is provided with a connecting port 121a, and a measuring box 122 is formed with a measuring hole 122a penetrating vertically, and a lower portion of the measuring hole 122a can be opened and closed across the measuring hole 122a. Shutter 12 so that
2b is provided.
【0009】シャッタ122bが閉じて、計量孔122
aの下方を遮断したとき計量孔122aは有底筒体とな
るので、その状態で、顆粒状の封止樹脂部材2は、ホッ
パ11の排出口11bから連接口121aを介して計量
孔122a内に落下し供給充填される。When the shutter 122b is closed, the measuring hole 122 is closed.
When the lower part of the measuring hole 122a is shut off, the measuring hole 122a becomes a bottomed cylindrical body. In this state, the granular sealing resin member 2 is inserted into the measuring hole 122a from the discharge port 11b of the hopper 11 through the connecting port 121a. And is supplied and filled.
【0010】顆粒状の封止樹脂部材2を計量孔122a
内に充填した計量箱122は、筐体121に案内されつ
つ図3及び図4の図示手前方向に押し出されるように摺
動して、手前側に位置するローダ3上に移動する。The granular sealing resin member 2 is inserted into the measuring hole 122a.
The weighing box 122 filled therein slides so as to be pushed out toward the front side in FIGS. 3 and 4 while being guided by the housing 121, and moves onto the loader 3 located on the front side.
【0011】ローダ3には、封止樹脂部材2の供給先で
ある金型4のポットピッチ位置に対応して、上下に貫通
する供給口3aが複数個配列して設けられていて、各供
給口3a内の下方には、そのポットピッチの対応位置に
貫通孔を配置した仕切り板3bがスライド自在に組み込
まれている。従って、仕切り板3bのスライド移動によ
り各供給口3aの底部は同時遮断ないしは同時開放が可
能に構成されている。The loader 3 is provided with a plurality of vertically arranged supply ports 3a corresponding to the pot pitch position of the mold 4 to which the sealing resin member 2 is supplied. Below the opening 3a, a partition plate 3b having a through hole disposed at a position corresponding to the pot pitch is slidably incorporated. Therefore, the bottom of each supply port 3a can be simultaneously cut off or simultaneously opened by sliding movement of the partition plate 3b.
【0012】一方、金型4は、その概略構成を図3に示
したように、可動型の下金型41と固定型の上金型42
とで構成され、下金型41には複数個のプランジャ41
1がそれぞれ各ポット41a内に組み込まれている。従
って、金型4のポット41aに供給投下された封止樹脂
部材2は、下金型41の矢印Z方向への上昇による上金
型42との間の型締め状態のもとで、プランジャ411
操作に伴う加熱圧入を受けて、不図示の電子部品をモー
ルド成形する。On the other hand, the mold 4 has a movable lower mold 41 and a fixed upper mold 42 as shown in FIG.
The lower die 41 has a plurality of plungers 41.
1 are incorporated in each pot 41a. Accordingly, the sealing resin member 2 supplied and dropped into the pot 41a of the mold 4 is pressed against the upper mold 42 by the upward movement of the lower mold 41 in the arrow Z direction, and the plunger 411 is closed.
An electronic component (not shown) is molded by receiving press-fitting accompanying the operation.
【0013】ローダ3は、この金型4と顆粒物供給装置
1との間を往復移動して、顆粒物供給装置1で計量され
た封止樹脂部材2を受入れ、下金型41の各ポット41
aに搬送投下するが、封止樹脂部材2の各供給口3a内
への受入れは、仕切り板3bが各供給口3aの下方を遮
断した状態で、矢印X方向にステップ状に移動しつつ、
順次行われる。The loader 3 reciprocates between the mold 4 and the granule supply device 1 to receive the sealing resin member 2 measured by the granule supply device 1, and receives each pot 41 of the lower mold 41.
a, and the sealing resin member 2 is received into each of the supply ports 3a while moving in a stepwise manner in the direction of arrow X while the partition plate 3b blocks below the supply ports 3a.
It is performed sequentially.
【0014】すなわち、顆粒物供給装置1が、計量箱1
2で計量された封止樹脂部材2を、ローダ3の各供給口
3a内に供給する動作手順を図5から図7を参照して以
下説明する。図5から図7は、いずれも図3のA−A矢
視断面拡大図を示したもので、まず図5に示すように、
計量孔122aの下方部がシャッタ122bで閉じられ
た状態で、封止樹脂部材2がホッパ11から連接口12
1aを介して計量孔122aに供給充填される。That is, the granule supply device 1 is a measuring box 1
An operation procedure for supplying the sealing resin member 2 measured at 2 into each supply port 3a of the loader 3 will be described below with reference to FIGS. 5 to 7 show enlarged cross-sectional views taken along the line AA of FIG. 3, and first, as shown in FIG.
With the lower portion of the measuring hole 122a closed by the shutter 122b, the sealing resin member 2 is moved from the hopper 11 to the connecting port 12a.
It is supplied and filled into the metering hole 122a through 1a.
【0015】計量部12の計量箱122にはシリンダ1
23のプランジャ123aに連結されていて、シリンダ
123の操作により、計量箱122が筐体121に案内
されつつ矢印Y方向に押し出され、シャッタ122bで
閉じられた計量孔122aの容積分の封止樹脂部材2が
取り出される。The measuring box 122 of the measuring section 12 has a cylinder 1
23, the measuring box 122 is pushed out in the direction of the arrow Y while being guided by the housing 121 by the operation of the cylinder 123, and the sealing resin for the volume of the measuring hole 122a closed by the shutter 122b. The member 2 is taken out.
【0016】シリンダ123の操作により、矢印Y(ロ
ーダ3)方向に押し出された計量箱122は、図6に示
すように、計量孔122aがローダ3の供給口3a上に
一致するように位置決めされ、その状態で、計量孔12
2aをそれまで下方部で遮断していたシャッタ122b
が図示後方に移動して開かれるので、図7に示すよう
に、計量孔122a内に収納されていた顆粒状の封止樹
脂部材2は、ローダ3の仕切り板3bで仕切られた供給
口3a内に落下し格納される。The measuring box 122 pushed out in the direction of the arrow Y (loader 3) by the operation of the cylinder 123 is positioned so that the measuring hole 122a coincides with the supply port 3a of the loader 3, as shown in FIG. In that state, the measuring hole 12
Shutter 122b, which previously blocked 2a at the lower part
Is moved rearward in the figure and opened, as shown in FIG. 7, the granular sealing resin member 2 housed in the measuring hole 122a is supplied to the supply port 3a partitioned by the partition plate 3b of the loader 3. It falls inside and is stored.
【0017】その後、シャッタ122bは、図示手前方
向に移動して計量孔122aを閉じ、シリンダ123の
操作により、図5に示した位置に戻り、再びホッパ11
から顆粒状の封止樹脂部材2の供給充填が行われる。そ
の間において、ローダ3は不図示の駆動機構により1ス
テップ(すなわち1ポットピッチ分)、図3で示したX
方向への移動により、次の供給口3aの位置決めが行わ
れる。Thereafter, the shutter 122b moves forward in the figure to close the measuring hole 122a, and returns to the position shown in FIG.
Then, the supply and filling of the granular sealing resin member 2 are performed. In the meantime, the loader 3 is driven by a driving mechanism (not shown) for one step (that is, for one pot pitch), X
By the movement in the direction, the next supply port 3a is positioned.
【0018】このようにして、シリンダ123による計
量箱122の往復移動、及びその往復移動に同期したロ
ーダ3におけるステップ状の移動、並びにシャッタ12
2bの開閉操作により、ローダ3の各供給口3aには、
計量箱12で計量された量の封止樹脂部材2が順次供給
される。Thus, the reciprocating movement of the measuring box 122 by the cylinder 123, the step-like movement of the loader 3 synchronized with the reciprocating movement, and the shutter 12
By the opening and closing operation of 2b, each supply port 3a of the loader 3 is
The amount of the sealing resin member 2 measured in the measuring box 12 is sequentially supplied.
【0019】なお、図3から図7では、シャッタ122
b及び仕切り板3bの駆動機構は省略して示していない
が、モータ駆動によるボールねじの回転機構、あるいは
シリンダ等の採用により、往復動作を行うように構成さ
れている。3 to 7, the shutter 122
Although a drive mechanism for b and the partition plate 3b is not shown, it is configured to perform a reciprocating operation by using a ball screw rotation mechanism driven by a motor or a cylinder.
【0020】従来の顆粒物供給装置1は上記のように構
成されているので、もしもモールド製品の種類等に対応
して、ポット41aに投下される封止樹脂部材2の量を
変える必要がある場合は、それに見合う容積(大きさ)
の計量孔122aを有する顆粒物供給装置1に交換され
ていた。Since the conventional granule supply device 1 is configured as described above, if the amount of the sealing resin member 2 dropped into the pot 41a needs to be changed according to the type of the molded product, etc. Is the volume (size) corresponding to it
Has been replaced with the granule supply device 1 having the measuring hole 122a.
【0021】[0021]
【発明が解決しようとする課題】上記説明のように、モ
ールド製品の種類によっては、しばしばポット41aに
供給される顆粒状の封止樹脂部材2の量の変更が必要と
なるが、そのために従来は計量孔122a内の容積の異
なる顆粒物供給装置1に交換する作業が行なわれた。As described above, the amount of the granular sealing resin member 2 supplied to the pot 41a often needs to be changed depending on the type of the molded product. The operation of replacing the granule supply device 1 with a different volume in the measuring hole 122a was performed.
【0022】しかしながら、モールド製品の多様化が進
む昨今、金型4のポット41a等の形状や大きさ等も製
品の種類に対応して多様化の傾向を示すようになってき
ており、その金型4の種類に対応して、逐一計量孔12
2の容積の異なる顆粒物供給装置1を用意するのは容易
でなく、また交換作業自体が作業員にとって大きな負担
となった。However, in recent years, the diversification of mold products has been progressing, and the shape and size of the pot 41a of the mold 4 and the like have been showing a diversification tendency in accordance with the type of the product. According to the type of the mold 4, the measuring holes 12
It was not easy to prepare the granule supply devices 1 having different capacities 2 and the replacement operation itself became a heavy burden on the operator.
【0023】また、電子部品等の高微細化が進む中、モ
ールド成形される封止樹脂部材2の量をより厳密に調整
することが要求されつつあり、製造上、生産ロッド等に
よって顆粒樹脂の粒の大きさに微妙なバラツキが生じる
のは避けられず、その顆粒樹脂の粒のバラツキ等に対応
して、その供給量を微妙に調整可能な顆粒物供給装置の
提供が要望されていた。In addition, as electronic components and the like are further miniaturized, it is required to more strictly adjust the amount of the sealing resin member 2 to be molded. It is inevitable that fine variations occur in the size of the granules, and there has been a demand for a granule supply device capable of finely adjusting the amount of the granules to be supplied in accordance with the fluctuation of the granules of the granular resin.
【0024】そこで、本発明は、簡単な構成により、顆
粒物の供給量を可変とし、かつ高精度に調整してローダ
に供給することができる顆粒物供給装置、及びその装置
を用いた電子部品モールド装置を提供することを目的と
する。Accordingly, the present invention provides a granule supply apparatus capable of changing the supply amount of granules with a simple structure, adjusting the supply amount with high precision, and supplying the granules to a loader, and an electronic component molding apparatus using the apparatus. The purpose is to provide.
【0025】[0025]
【課題を解決するための手段】第1の発明は、顆粒物供
給装置において、顆粒物が供給され、その供給された顆
粒物を排出する排出口を有するホッパと、このホッパの
前記排出口につらなる貫通した連接口を有する筐体と、
この筐体に支持されつつ摺動し、開口部が前記連接口に
連通可能に形成されるとともに底部が開閉自在に構成さ
れた計量箱と、この計量箱内に向け挿入自在に形成され
た調整部材とを具備することを特徴とする。According to a first aspect of the present invention, there is provided a granule supply device, wherein a granule is supplied, and a hopper having a discharge port for discharging the supplied granule, and a hopper penetrating the discharge port of the hopper. A housing having a connection port,
A weighing box which is slid while being supported by the housing and whose opening is formed to be able to communicate with the connection port and whose bottom is openable and closable, and an adjustment formed so as to be freely inserted into the weighing box. And a member.
【0026】このように、調整部材を設け、計量箱内に
向け挿入自在となるように構成したので、計量箱内の実
質上の容積を調整部材の挿入量の調整のみで簡単かつ高
精度で変化させることができる。As described above, since the adjusting member is provided so as to be freely inserted into the measuring box, the substantial volume in the measuring box can be easily and accurately adjusted only by adjusting the insertion amount of the adjusting member. Can be changed.
【0027】第2の発明は、上記第1の発明の顆粒物供
給装置を用いた電子部品モールド装置であって、顆粒物
は、合成樹脂製からなり、計量箱は、底部の開放により
顆粒物をローダに供給し、ローダは、供給された顆粒物
を搬送して金型のポットに投下するように構成されたこ
とを特徴とする。According to a second aspect of the present invention, there is provided an electronic component molding apparatus using the granule supply device according to the first aspect, wherein the granules are made of synthetic resin, and the measuring box is provided with the granules to the loader by opening the bottom. The supply and loader is configured to convey the supplied granules and drop them into a mold pot.
【0028】このように、第2の発明によれば、調整部
材の計量箱内への挿入長さの調整により、ポットに投下
されるモールド用合成樹脂部材の供給量を高精度に設定
できるので、多種多様に電子部品のモールドに容易に対
応することができる。As described above, according to the second aspect of the present invention, by adjusting the length of insertion of the adjusting member into the measuring box, the supply amount of the synthetic resin member for molding dropped into the pot can be set with high accuracy. In addition, it is possible to easily cope with a variety of electronic component molds.
【0029】[0029]
【発明の実施の形態】以下、本発明による顆粒物供給装
置、及びその装置を用いた電子部品モールド装置の一実
施の形態を図1及び図2を参照して詳細に説明する。な
お、図3から図7に示した従来の構成と同一構成には同
一符号を付して詳細な説明は省略する。また、本発明
は、特に顆粒物供給装置に特徴を有し、モールド金型等
の構成は図3に示した従来の構成と同様であるので、顆
粒物供給装置及びそれにつらなるローダ部分を図1及び
図2に示して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a granule supply apparatus according to the present invention and an electronic component molding apparatus using the apparatus will be described below in detail with reference to FIGS. The same components as those of the conventional configuration shown in FIGS. 3 to 7 are denoted by the same reference numerals, and detailed description is omitted. In addition, the present invention is particularly characterized in the granule supply device, and since the configuration of the mold and the like is the same as the conventional configuration shown in FIG. 3, the granule supply device and the loader portion connected thereto are shown in FIGS. 2 will be described.
【0030】すなわち、図1は、発明による顆粒物供給
装置の一実施の形態を電子部品モールド装置に適用した
状態を示す要部断面図で、図2は図1のB−B線から矢
印方向を見た断面図である。FIG. 1 is a cross-sectional view of a main part showing a state in which an embodiment of a granule supply apparatus according to the present invention is applied to an electronic component molding apparatus. FIG. 2 is a sectional view taken along line BB in FIG. It is sectional drawing seen.
【0031】図1に示したように、顆粒物供給装置1
は、ホッパ11がビス11aにより計量部12に固定さ
れ、ホッパ11には顆粒物である顆粒状の封止樹脂部材
2が供給収納される。As shown in FIG. 1, the granule supply device 1
The hopper 11 is fixed to the measuring section 12 with a screw 11a, and the hopper 11 is supplied with and accommodates the granular sealing resin member 2 which is a granule.
【0032】計量部12は、断面コ字状の筐体121と
その筐体121に案内されつつ図示前後方向に移動可能
な計量部122とで構成され、ホッパ11から供給され
た封止樹脂部材2を計量しつつ、ローダ3に供給するよ
うに構成されている。筐体121の上片部121aに
は、ホッパ11の排出口11aにつらなる連接口121
aが設けられており、また計量箱122には上下に貫通
する計量孔122aが形成されている。そして、その計
量孔122aの下方部には、その計量孔122aを開閉
自在に遮断可能にシャッタ122bが設けられている。The measuring section 12 is composed of a casing 121 having a U-shaped cross section and a measuring section 122 which is guided by the casing 121 and is movable in the front-rear direction in the figure, and a sealing resin member supplied from the hopper 11. 2 is supplied to the loader 3 while being weighed. A connection port 121 connected to the discharge port 11a of the hopper 11 is provided in an upper piece 121a of the housing 121.
a is provided, and the measuring box 122 is formed with a measuring hole 122a penetrating vertically. A shutter 122b is provided below the measuring hole 122a so that the measuring hole 122a can be opened and closed freely.
【0033】シャッタ122bが計量孔122aを遮断
したとき計量孔122aは有底筒体となり、その状態
で、ホッパ11から計量箱122へ封止樹脂部材2は供
給充填される。When the shutter 122b shuts off the measuring hole 122a, the measuring hole 122a becomes a bottomed cylindrical body. In this state, the sealing resin member 2 is supplied and filled from the hopper 11 to the measuring box 122.
【0034】また、計量箱122には、図1及び図2に
示したように、断面四角形の棒状体からなる調整部材1
24が、箱壁を貫通して計量箱122内に向け、図2に
矢印C方向に挿入自在に設けられ、計量箱122内に突
出する長さLを調整可能に構成されている。As shown in FIGS. 1 and 2, the weighing box 122 has an adjusting member 1 formed of a rod having a square cross section.
24 is provided so as to penetrate the box wall and into the weighing box 122 so as to be insertable in the direction of arrow C in FIG. 2, and the length L protruding into the weighing box 122 is adjustable.
【0035】また、計量箱122の箱壁には、調整部材
124の長手方向に交差する方向から、ボルト125が
ねじ込み自在に組み込まれ、その先端部が調整部材12
4に当接して、長さLが調整設定された調整部材124
を固定可能に構成されている。 従って、顆粒状の封止
樹脂部材2が供給される計量孔122a内の容積は、差
し込まれた調整部材124の計量孔122a内の長さに
よって変化する。A bolt 125 is screwed into the box wall of the measuring box 122 in a direction intersecting the longitudinal direction of the adjusting member 124, and a tip end of the bolt 125 is attached to the adjusting member 12.
4, the adjustment member 124 whose length L is adjusted and set.
Is configured to be fixable. Therefore, the volume in the measuring hole 122a to which the granular sealing resin member 2 is supplied changes depending on the length of the inserted adjusting member 124 in the measuring hole 122a.
【0036】すなわち、調整部材124の計量孔122
a内への突出長さLを調整することによって、シャッタ
122bが閉じられた状態で、計量孔122a内に収納
される封止樹脂部材2の量を任意に調整することができ
る。That is, the measuring hole 122 of the adjusting member 124
By adjusting the protruding length L into a, the amount of the sealing resin member 2 housed in the measuring hole 122a can be arbitrarily adjusted with the shutter 122b closed.
【0037】このようにして、調整部材124の計量孔
124内への差し込み長さLの調整によって、計量箱1
2内に任意に計量されて収納された顆粒状の合成樹脂部
材2は、従来と同様に、シリンダ123による計量箱1
22の往復動、及びその往復動に同期したローダ3のス
テップ移動、並びにシャッタ122bの開閉操作等によ
り、ローダ3の各供給口3aには、計量箱12で計量さ
れた量の封止樹脂部材2が順次供給される。In this manner, by adjusting the insertion length L of the adjusting member 124 into the measuring hole 124, the measuring box 1 is adjusted.
The granular synthetic resin member 2 arbitrarily weighed and stored in the container 2 is weighed by the cylinder 123 in the same manner as in the prior art.
Due to the reciprocation of the load 22, the step movement of the loader 3 synchronized with the reciprocation, and the opening and closing operation of the shutter 122b, the amount of the sealing resin member measured by the measuring box 12 is supplied to each supply port 3a of the loader 3. 2 are sequentially supplied.
【0038】なお、この実施の形態では、調整部材12
4を断面が四角形状とし、その頂部が上下左右方向、す
なわち◇状となる向きに組み込んだので、上方から供給
される顆粒状の封止樹脂部材2は、計量孔122a内に
隙間(空間)を形成することなく円滑に充填され、正確
な計量が行われる。In this embodiment, the adjusting member 12
4 has a quadrangular cross section, and its top is assembled in the up, down, left, and right directions, that is, in the direction of the triangle, so that the granular sealing resin member 2 supplied from above is provided with a gap (space) in the measuring hole 122a. Is filled smoothly without forming and accurate weighing is performed.
【0039】また、この実施の形態において、計量孔1
22aや供給口3a等はその横断面の形状が四角形状で
あるとして図示説明してあるが、一般的に断面が円形形
状からなる金型ポット41aに合わせて、断面が円形す
なわち円筒状となるように構成しても良いことは言うま
でもない。In this embodiment, the measuring hole 1
Although the cross section of the supply port 22a, the supply port 3a, and the like is illustrated and described as being square, the cross section is generally circular, that is, cylindrical, in accordance with the mold pot 41a having a generally circular cross section. Needless to say, such a configuration may be adopted.
【0040】また、調整部材124をモータ駆動機構に
より微動できるようにすればより正確な計量調整ができ
る。また、調整部材124をモータ駆動で微動できるよ
うにすることにより、計量後、シャッタ122bが開く
前に、調整部材124を計量孔122aより退避するこ
とにより、上方から供給される顆粒状樹脂が調整部材1
24の上に残ることなく円滑に充填される。Further, if the adjusting member 124 can be finely moved by the motor driving mechanism, more accurate weighing adjustment can be performed. Further, by allowing the adjusting member 124 to be finely moved by the motor drive, after the metering and before the shutter 122b is opened, the adjusting member 124 is retracted from the measuring hole 122a to adjust the granular resin supplied from above. Member 1
It fills smoothly without remaining on 24.
【0041】以上説明のように、本発明の顆粒物供給装
置は、上記のように棒状等の調整部材124を計量箱1
22の計量孔122a内に挿入自在に構成したので、モ
ールド製品の種類等に対応して、ポット41aに投下さ
れる顆粒状の封止樹脂部材2の量を容易に変えることが
できるとともに、その封止樹脂部材2を高精度に計量設
定できるので、多種多様な大きさの電子部品のモールド
成形に容易に対応することができる。As described above, in the granule supply device of the present invention, as described above, the rod-shaped adjustment member 124 is connected to the measuring box 1.
22 so that the amount of the granular sealing resin member 2 dropped into the pot 41a can be easily changed in accordance with the type of the molded product and the like. Since the sealing resin member 2 can be measured and set with high accuracy, it is possible to easily cope with the molding of electronic components of various sizes.
【0042】[0042]
【発明の効果】本発明の顆粒物供給装置は、簡単な構成
により、顆粒物の計量値を高精度に変更調整できるの
で、例えば電子部品モールド装置における封止樹脂部材
の計量供給に採用して顕著な効果を発揮することができ
る。The granule supply apparatus of the present invention can change and adjust the measured value of granules with high accuracy with a simple structure, and is therefore remarkably employed for, for example, measuring and supplying a sealing resin member in an electronic component molding apparatus. The effect can be exhibited.
【図1】この発明による顆粒物供給装置の一実施の形態
を示す要部断面図である。FIG. 1 is a cross-sectional view of a main part showing an embodiment of a granule supply device according to the present invention.
【図2】図1に示す装置のB−B線から矢印方向を見た
断面図である。FIG. 2 is a sectional view of the device shown in FIG.
【図3】従来の顆粒物供給装置を採用した電子部品モー
ルド装置の概略構成図である。FIG. 3 is a schematic configuration diagram of an electronic component molding device employing a conventional granule supply device.
【図4】図3に示す顆粒物供給装置の拡大正面図であ
る。FIG. 4 is an enlarged front view of the granule supply device shown in FIG.
【図5】図3に示す顆粒物供給装置のA−A矢視断面拡
大図である。FIG. 5 is an enlarged cross-sectional view of the granule supply device shown in FIG.
【図6】図5に示す顆粒物供給装置の動作状態を示した
断面図である。FIG. 6 is a sectional view showing an operation state of the granule supply device shown in FIG.
【図7】図5に示した顆粒物供給装置の図6に続く動作
状態を示した断面図である。FIG. 7 is a cross-sectional view showing an operation state of the granule supply device shown in FIG. 5 following FIG. 6;
1 顆粒物供給装置 11 ポッパ 11b 排出口 12 計量部 121 筐体 121a 連接口 122 計量箱 122a 計量孔 122b シャッタ 123 シリンダ 124 調整部材 125 ボルト 2 封止樹脂部材(顆粒物) 3 ローダ 3a 供給口 3b 仕切り板 4 金型 41 下金型 41a ポット 42 上金型 DESCRIPTION OF SYMBOLS 1 Granule supply apparatus 11 Popper 11b Discharge port 12 Measuring part 121 Housing 121a Connecting port 122 Measuring box 122a Measuring hole 122b Shutter 123 Cylinder 124 Adjusting member 125 Bolt 2 Sealing resin member (granule) 3 Loader 3a Supply port 3b Partition plate 4 Mold 41 Lower mold 41a Pot 42 Upper mold
Claims (3)
物を排出する排出口を有するホッパと、 このホッパの前記排出口につらなる連接口を有する筐体
と、 この筐体に支持されつつ移動して、開口部が前記連接口
に連接可能に形成されるとともに底部が開閉自在に構成
された計量箱と、 この計量箱内に向け挿入自在に形成された調整部材とを
具備することを特徴とする顆粒物供給装置。1. A hopper having a discharge port to which granules are supplied and discharging the supplied granules, a housing having a connecting port extending from the discharge port of the hopper, and moving while being supported by the housing. A weighing box having an opening formed so as to be connected to the connection port and a bottom part configured to be openable and closable, and an adjusting member formed so as to be insertable into the weighing box. Granule supply device.
記計量箱は、前記底部の開放により前記顆粒物をローダ
に供給し、 前記ローダは、供給された前記顆粒物を搬送して金型の
ポットに投下するように構成されたことを特徴とする請
求項1記載の顆粒物供給装置を用いた電子部品モールド
装置。2. The granule is made of synthetic resin, the measuring box supplies the granule to a loader by opening the bottom, and the loader conveys the supplied granule to a mold pot. An electronic component molding apparatus using the granule supply device according to claim 1, wherein the electronic component molding device is configured to be dropped.
た方向から差し込まれたボルトによって固定されるよう
に構成されたことを特徴とする請求項1記載の顆粒物供
給装置または請求項2記載の電子部品モールド装置。3. The granule supply device according to claim 1, wherein the adjustment member is configured to be fixed by a bolt inserted from a direction intersecting with the longitudinal direction. Electronic parts molding equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000333310A JP2002137250A (en) | 2000-10-31 | 2000-10-31 | Granule supply device and electronic component molding device using this device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000333310A JP2002137250A (en) | 2000-10-31 | 2000-10-31 | Granule supply device and electronic component molding device using this device |
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Publication Number | Publication Date |
---|---|
JP2002137250A true JP2002137250A (en) | 2002-05-14 |
Family
ID=18809412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2000333310A Pending JP2002137250A (en) | 2000-10-31 | 2000-10-31 | Granule supply device and electronic component molding device using this device |
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Country | Link |
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JP (1) | JP2002137250A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7638367B2 (en) | 2006-02-17 | 2009-12-29 | Fujitsu Microelectronics Limited | Method of resin sealing electronic part |
-
2000
- 2000-10-31 JP JP2000333310A patent/JP2002137250A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7638367B2 (en) | 2006-02-17 | 2009-12-29 | Fujitsu Microelectronics Limited | Method of resin sealing electronic part |
US7923303B2 (en) | 2006-02-17 | 2011-04-12 | Fujitsu Semiconductor Limited | Method of resin sealing electronic part |
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