JP2002134563A - Semiconductor manufacturing apparatus and semiconductor manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability of junctions in a semiconductor device, reduce a manufacturing cost, and improve productivity. SOLUTION: A semiconductor device 1 is sucked to be held by a loading nozzle 5, and a mounting board 2 is held by a heater table 3. Positions of electrodes of the mounting board 2 are determined so as to align with solder bumps of the semiconductor device 1 by a positioning stage 4, and solder bumps of the semiconductor device 1 are brought into contact with the mounting board 2 by letting down the loading nozzle 5. In this operation, an upper limit of driving current flown in a linear motor 6 is set so as to prevent generation of larger thrust than a predetermined value. The semiconductor device 1 and the mounting board are heated respectively, and when the bonding solder bumps are in a liquid state, the loading nozzle 5 is positioned in the lower direction so as to squash the solder bumps within a prescribed quantity, and then by controlling the position of the loading nozzle 5 so as to expand the bumps in the upper direction, each solder bump is shaped like a pinched-in drum in the middle of the height direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor manufacturing method, and more particularly to a semiconductor manufacturing apparatus and a semiconductor manufacturing method for flip-chip mounting a semiconductor component on a substrate using solder bumps or the like.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor component is flip-chip mounted on a substrate, a distortion occurs in a bonding bump due to a difference in thermal expansion coefficient between the semiconductor component and the substrate, causing a disconnection or the like, which adversely affects bonding reliability. ing. To solve this problem, a method has been adopted in which the collapse of the solder bumps is suppressed and the height of the bumps is increased to reduce the stress on the joint surface between the bumps and the substrate, thereby improving the joint reliability.

As described above, various connection methods for suppressing the collapse of solder bumps have been proposed. For example, in the connection method of solder bumps disclosed in Japanese Patent Application Laid-Open No. H04-299840, a circuit component and a circuit board are not connected. The elastic bumps are interposed therebetween and the circuit components are pushed up by the restoring force, thereby suppressing the collapse of the solder bumps.

The connection method will be described with reference to FIG. In FIG. 2A, a required circuit wiring pattern 12 is provided on one surface of an insulating base material 11 such as polyimide, and a surface protection film such as a polyimide film is formed on the surface of the circuit wiring pattern 12 with an adhesive 14. 15 are adhered, and a surface protective layer 16 is formed by these. The surface protective layer 16 can also be formed by printing and coating varnish-like polyimide, insulating cover coat ink, or the like. Also,
An elastic protrusion 17 made of an elastic member such as Teflon (registered trademark) rubber or silicone rubber is provided on the surface of the insulating base material 11 on the side where the connection solder bump 13 is formed so as to protrude. It is formed so that its height becomes high.

[0005] As shown in FIG. 2 (b), first, a connection solder bump 13 of a circuit wiring board having an elastic protrusion 17 is provided.
The electrodes 19 of the IC chip 18 are positioned so as to face each other. Next, the IC chip 18 is pressed down by applying a pressing force while heating and melting the solder bump 13 for connection, the electrode 19 of the IC chip 18 is wetted with the melted solder, and the elastic protrusion 17 is compressed and deformed. When the pressing force is released here, the IC chip 18
Is pushed up, the molten solder bump 13 for connection is used.
Are stretched to form drum-shaped solder bumps.

Through the above steps, as shown in FIG. 2C, the wiring pattern 12 of the circuit wiring board is electrically connected to the electrodes 19 of the IC chip 18 via the drum-shaped solder bumps 20.

[0007]

However, the above method has the following problems.

The first problem is that a short circuit occurs between adjacent bumps and a disconnection occurs due to a concentration of shear strain stress. The reason is that since the amount of compressive deformation of the elastic protrusion is not constant, the amount of crushing of the solder bump cannot be specified, and the narrow pitch bump comes into contact with an adjacent one. Also, the shape of the formed solder bump is not stable, so that the strain stress cannot be alleviated.

A second problem is that the prior art is costly. The reason for this is that it is necessary to previously install the elastic ridges at all the IC mounting locations, which requires a cost.

[0010] The third problem is that the product quality varies greatly and is not stable. The reason is that the crushing is pushed back by the reaction force of the elastic protrusion, so that the pushing back amount is not constant and the height of the solder bump is not constant.

Accordingly, an object of the present invention is to improve the bonding reliability of semiconductor products, reduce manufacturing costs, and improve productivity.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a semiconductor manufacturing apparatus for flip-chip mounting a semiconductor component on a mounting board via a solder material. A holding unit that holds the semiconductor substrate facing the mounting surface of the mounting board, an actuator that moves the holding unit in a direction in which the semiconductor component is mounted on the mounting board, and a position sensor that detects a position of the holding unit. A control unit that controls the position of the actuator based on a position signal from the position sensor, and a heating unit that heats and melts the solder material, wherein the control unit sets a drive current of the actuator in advance. The holding part is moved to a position where the semiconductor component and the mounting board are in contact with each other via a solder material, and the solder material is melted. The holding portion in a direction to crush the solder material is moved by a predetermined amount, the more the holding portion in a direction to stretch the solder material by moving a predetermined amount, bonding the semiconductor part to the mounting substrate.

That is, according to the present invention, a semiconductor component is controlled to a mounting substrate mounting position by an actuator provided on a semiconductor manufacturing apparatus side, and the amount of crushing of solder bumps at the time of heating and joining is defined and the predetermined amount is raised, thereby achieving a certain height. A drum-shaped solder bump having a thickness is formed. At this time, by providing a limit value to the actuator drive current for controlling the position, the position of the semiconductor component holding unit is controlled without generating a thrust force exceeding a specified pressing force.

[0014]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic configuration of a semiconductor manufacturing apparatus according to the present invention. The mounting nozzle 5 holds the semiconductor device 1 by suction, mounts the semiconductor device 1 on the mounting substrate 2, and then pressurizes and heats the semiconductor device 1. The heater table 3 holds and heats the mounting board 2. The positioning stage 4 is mounted on the mounting board 2 on the heater table 3.
Is moved immediately below the semiconductor device 1 held by the mounting nozzle 3 to align the solder bumps of the semiconductor device 1 with the electrodes of the mounting board 2. After the linear motor (actuator) 6 is positioned by the positioning stage 4, the mounting nozzle 5 is lowered vertically to the mounting substrate 2, and the mounting nozzle 5 is directly moved so that the semiconductor device 1 contacts the mounting substrate 2. Drive. The position sensor 7 detects the position of the mounting nozzle 5 by detecting the position of the linear motor 6, and is configured by a linear encoder or the like.

The controller (control unit) 8 is a digital signal processing device including a CPU, a memory, and the like. The controller 8 controls driving of the linear motor 6 based on a position signal from the position sensor 7 by program control, and controls the heater table 3.
And the positioning stage 4 is controlled. Controller 8
Manages a series of mounting operations while limiting the drive current value of the linear motor 6 so that the thrust does not exceed the set pressure. Also, from an input unit such as a keyboard,
An arbitrary current limit value can be input within an allowable range of the drive current of the linear motor 6.

Next, the operation of the present embodiment will be described with reference to FIG.

First, the semiconductor device 1 is suction-held by the mounting nozzle 5. On the other hand, the mounting board 2 is held by the heater table 3. Next, the position of the electrode on the mounting substrate 2 is positioned on the solder bump of the semiconductor device 1 using the positioning stage 4. Note that the solder bumps are mounted on the mounting substrate 2.
It can be attached in advance to the upper electrode position. After the positioning, the mounting nozzle 5 is lowered to bring the solder bumps of the semiconductor device 1 into contact with the mounting substrate 2. At this time, an upper limit is set for the value of the drive current flowing through the linear motor 6 to prevent generation of a certain thrust or more.

While the position of the mounting nozzle 5 is controlled by the linear motor 6 using the signal from the position sensor 7, the semiconductor device 1 and the mounting substrate 2 are heated to melt the solder bumps at the joint. When the solder bump melts and becomes liquid, the mounting nozzle 5 is positioned downward so that the solder bump is crushed by a specified amount, and then the mounting nozzle 5 is positionally controlled upward so as to stretch the solder bump. By this operation, the solder bump has a drum-shaped low distortion structure in which the vicinity of the center in the height direction is narrowed. Thus, after melting, the solder bumps are prevented from being crushed and become drum-shaped, and solder bumps having the same height are always formed and soldered.

A semiconductor manufacturing apparatus for flip-chip mounting the above semiconductor components on a mounting board uses a CSP as a semiconductor component.
(Chip size package), BGA (ball grid array), WLP (wafer level package), or the like, and can be soldered to the mounting substrate.

[0021]

As described above, the first effect of the present invention is that a short circuit between adjacent bumps and a disconnection due to stress concentration can be eliminated. The reason is that the amount of crushing of the solder bumps during the heat bonding is specified, so that the solder bumps are not crushed too much, and since the predetermined amount is raised, a drum-shaped solder bump having a constant height can be formed. .

A second effect is that costs can be reduced. The reason is that all the ICs in the prior art
It is necessary to previously install the elastic ridge at the mounting location, which requires a cost, but according to the present invention, since the control is performed by the actuator provided on the device side, the cost of installing the elastic ridge is reduced. It is no longer necessary.

The third effect is that the variation in height of the product joint is reduced and the quality is stabilized. The reason is that, in the prior art, the crushing is pushed back by the reaction force of the elastic protrusion, so that the amount of pushing back is not constant and the height of the solder bumps is not constant, but according to the present invention, the solder crushing is performed. This is because the subsequent stretching amount is fixed to the specified value.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of a semiconductor manufacturing apparatus according to the present invention.

FIG. 2 shows a conventional connection method between a semiconductor component and a substrate,
(A) is a main part configuration before connection, (b) is a pressurized state, (c)
FIG. 4 is a cross-sectional view showing a main part after connection is completed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Mounting board 3 Heater table 4 Positioning stage 5 Mounting nozzle 6 Linear motor 7 Position sensor 8 Controller 11 Insulation base material 12 Circuit wiring pattern 13 Solder bump for connection 14 Adhesive 15 Surface protection film 16 Surface protection layer 17 Elastic bump Body 18 IC chip 19 IC chip electrode 20 Drum-shaped solder bump

Claims (6)

[Claims] 1. A semiconductor manufacturing apparatus for flip-chip mounting a semiconductor component on a mounting board via a solder material, wherein the holding section holds the semiconductor component in a state where a bonding surface of the semiconductor component is opposed to a mounting surface of the mounting substrate. An actuator that moves the holding unit in a direction in which the semiconductor component is mounted on the mounting board; a position sensor that detects a position of the holding unit; and position control of the actuator based on a position signal from the position sensor. And a heating unit that heats and melts the solder material, wherein the control unit controls the drive current of the actuator within a preset limit value to set the holding unit to the semiconductor component. And the mounting board is moved to a position where it contacts via a solder material, the solder material is melted, and the semiconductor component is joined to the mounting board. Semiconductor manufacturing equipment. 2. The control section, after melting the solder material, moves the holding section by a predetermined amount in a direction to crush the solder material, and further moves the holding section by a predetermined amount in a direction to stretch the solder material. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the driving of the actuator is controlled as described above. 3. An input unit for inputting a current value to the control unit, wherein the control unit performs drive control using the input current value as a limit value of the actuator drive current. Or the semiconductor manufacturing apparatus according to 2. 4. The semiconductor manufacturing apparatus according to claim 1, wherein said semiconductor component is any one of a chip size package, a ball grid array, and a wafer level package. 5. A semiconductor manufacturing method for flip-chip mounting a semiconductor component on a mounting substrate via a solder material, wherein the semiconductor component is held by a holding portion in a state where a bonding surface of the semiconductor component is opposed to a mounting surface of the mounting substrate. And controlling the actuator drive current for moving the holding unit within a preset limit value, so that the holding unit is at a position where the semiconductor component and the mounting board are in contact via a solder material. A method of manufacturing a semiconductor, comprising: a step of moving; and a step of melting the solder material and joining the semiconductor component to the mounting board. 6. A step of moving the holding portion by a predetermined amount in a direction of crushing the solder material after melting the solder material, and moving the holding portion by a predetermined amount in a direction of stretching the crushed solder material. 6. The method according to claim 5, further comprising the steps of: