JP2002131656A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To additionally downsize the external form of an imaging device. SOLUTION: The imaging device 22 has a first optical system unit 23 formed by fastening an optical member to a solid-state imaging device and a second optical system unit 24 formed by arranging the optical member within a frame member. The side peripheral surface of the optical member of the first optical system unit and the frame member of the second optical system unit are fitted to each other. The solid-state image device comprises a solid-state image sensor 25c of a bare chip and cover glass 25d fastened onto this solid-state image sensor 25c. The optical member 37 of the first optical system unit is fastened to the cover glass 25d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized image pickup device provided with a solid-state image pickup device and arranged at a distal end of an endoscope or the like.

[0002]

2. Description of the Related Art Various small-sized image pickup devices having a solid-state image pickup device have been proposed, and are used by being arranged at the tip of an endoscope or the like.

For example, in Japanese Patent Application Laid-Open No. 9-192093, an image pickup device is a charge coupled device (CCD:
It has a CCD unit provided with a Charge Coupled Device (Charge Coupled Device) element and an objective lens unit constituting an objective optical system.

In the CCD unit, a cover glass is centered and joined to the imaging surface of the solid-state imaging device, and the cover glass is fixed in the holder by an adhesive applied to the outer periphery thereof. . The objective lens unit is configured by fitting and connecting a plurality of lens groups and a plurality of lens frames.

The outer periphery of one lens frame in the objective lens unit and the inner periphery of the holder in the CCD unit are fitted, and the objective lens unit and the CCD unit are positioned in the optical axis direction and focused. In this state, the objective lens unit and the CCD unit are fixed.

[0006]

The problem to be solved by the invention is disclosed in Japanese Patent Application Laid-Open No. 9-192.
In 093, the focusing of the CCD unit and the objective lens unit was performed by fitting and fixing the holder of the CCD unit and the lens frame of the objective lens unit. Accordingly, since the lens frame of the objective lens unit and the holder of the CCD unit are fitted to each other to perform focusing, the outer diameter of the imaging device has been increased by the thickness of the holder.

[0007]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an imaging apparatus capable of further reducing the outer shape of the imaging apparatus.

An image pickup apparatus according to the present invention has a first optical system unit in which an optical member is fixed to a solid-state image pickup device, and a second optical system unit in which the optical member is disposed inside a frame member. A side peripheral surface of an optical member of the first optical system unit;
And the frame member of the optical system unit.

Further, the solid-state image pickup device of the image pickup device of the present invention comprises a bare chip solid-state image pickup device and a cover glass fixed on the solid-state image pickup device. Is fixed.

According to such a configuration, since the outer peripheral surface of the optical member of the first optical system unit and the outer peripheral surface of the frame member of the second optical system unit are fitted, the positioning and focusing can be performed. The imaging device can be extended, and the outer diameter of the imaging device can be reduced, so that the size of the imaging device can be reduced.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

1 to 3 show an embodiment of the present invention. FIG. 1 is an overall schematic diagram of the endoscope system. FIG.
FIG. 2 is a longitudinal sectional view illustrating a configuration of a main part of the imaging apparatus.

FIG. 3 is a diagram showing an external configuration of the CCD.

First, an outline of an endoscope system will be described with reference to FIG.

An endoscope system 1 shown in FIG. 1 includes an electronic endoscope 2 provided with a means for preventing electromagnetic interference, a light source device 3 for supplying illumination light to the electronic endoscope 2, and an electronic endoscope. And a video processor 5 connected to the electronic endoscope 2 via the scope cable 4 and performing signal processing on the solid-state imaging device 25 incorporated in the electronic endoscope 2 and a video signal input from the video processor 5 via the monitor cable 5a. And a color monitor device 6 for displaying

The electronic endoscope 2 has an elongated insertion portion 7 inserted into a body cavity or the like, an operation portion 8 formed on the base end side of the insertion portion 7, and extends from the operation portion 8. It has a universal cord section 9 and a scope connector section 10 provided at an end of the universal cord section 9 and detachably connected to the light source device 3. A contact connector 10a is provided on a side of the scope connector 10. The scope cable 4 is connected to the contact connector section 10a by a detachable electric connector 4a provided at one end of the scope cable 4. The other end of the scope cable 4 is connected to the video processor 5 by an electric connector 4b.
It is detachably connected to.

The insertion section 7 is provided with an imaging device 22 described later.
A tip portion 12 (not shown in FIG. 1),
It comprises a bendable portion 13 formed at the base end side of the distal end portion 12 and a long flexible tube portion 21 extending from the base end side of the bendable portion 13 to the distal end side of the operation section 8.

At the top of the operation unit 8, a switch unit 17 provided with a plurality of switches 17a is provided. Further, on the side surface of the operation unit 8, an air supply / water supply operation button 15 for performing air supply / water supply control and a suction operation button 16 for performing suction control are provided.

The operation section 8 further includes a bending operation knob 14.
Is provided. The bending portion 13 can be bent by operating the bending operation knob 14 while holding the grip portion 18.

An air supply / water supply conduit (not shown) is inserted into the insertion portion 7. This air / water supply line
The air supply / water supply control unit controlled by the operation of the air supply / water supply operation button 15 of the operation unit 8 is connected to the air supply / water supply conduit inserted into the universal cord unit 9. The end of the air supply / water supply conduit in the universal cord section 9 passes through the scope connector section 10 and the light source device 3
It is connected to the air supply / water supply mechanism inside. The suction conduit (not shown) inserted into the insertion section 7 branches into two near the distal end side of the operation section 8, and one of the suction pipes communicates with the forceps port 11b. The other communicates with the suction conduit in the universal cord section 9 via a suction control section controlled by operation of the suction operation button 16, and reaches a suction base (not shown) of the scope connector section 10. The suction conduit communicates with a distal end opening 11a opened at the distal end portion 12.

The tip opening 11a serves as a suction port during a suction operation, and serves as an outlet for a forceps from which a needle is projected when forceps or the like are inserted through the forceps port 11b.

Further, a light guide (light path) (not shown) for transmitting illumination light is inserted into the insertion section 7, the operation section 8, and the universal cord section 9. The proximal end of the light guide is connected to the scope connector 10.
Illumination light supplied from a lamp inside the light source device 3 passes through a light guide and passes through an illumination window 20 fixed to the distal end portion 12.
The light is emitted forward from the distal end surface of the camera to illuminate a subject such as an affected part. The illuminated optical image of the object is captured by an objective optical lens unit attached to an observation window 19 provided adjacent to the illumination window 20 by the solid-state imaging device 2 arranged at the image forming position.
5 (not shown in FIG. 1), is photoelectrically converted by the solid-state imaging device 25, and an electric signal is output.
An electric cable (not shown in FIG. 1) is connected to the solid-state imaging device 25, and this cable is connected to the scope connector unit 10. The electric signal from the solid-state imaging device 25 is input to the video processor 5 via the noise reducer (not shown in FIG. 1) housed in the scope connector unit 10 and the scope cable 4.

Next, an image pickup apparatus according to this embodiment will be described with reference to FIG.

The imaging device 22 includes the solid-state imaging device unit 2
3 and an objective lens unit 24. The solid-state imaging device unit 23 forms a first optical system unit in which an objective optical system component is fixed on a solid-state imaging chip as described later. Hereinafter, the solid-state imaging device of the solid-state imaging device unit 23 is, for example, a CCD (Charge Cou).
A description will be given using an example using a pleated device (charge coupled device) element. Therefore, hereinafter, the solid-state imaging device unit 2
3 is called a CCD unit.

The CCD unit 23 has a solid-state imaging device 25 such as a CCD. The solid-state imaging device 25 has a solid-state imaging device chip 25c and a cover glass 25d. The solid-state imaging device chip 25c is a bare chip of a CCD device. On the surface of the solid-state imaging device chip 25c, an image area 25a having a predetermined area and a connection portion 25b for inputting / outputting a driving control signal and an output signal of the solid-state imaging device 25 and supplying a driving power are formed. ing. The cover glass 25d is bonded to the solid-state imaging device chip 25c with an adhesive 25e. An objective optical system component 37 is joined to the front surface of the cover glass 25d. The cover glass 25d and the objective optical system component 37
It is fixed with an adhesive 45, and the objective optical system component 3 is used for reinforcement.
The outer periphery of 7 is fixed with an adhesive 44. Here, the outer diameter of the objective optical system component 37 is smaller than the outer diameter of the cover glass 25d. The outer peripheral surface of the objective optical system component 37 is subjected to black processing 38 in which black paint or the like is applied or coated. Thereby, the invasion of light from the outer periphery of the lens can be blocked, and the occurrence of flare can be prevented. Further, the objective optical system component 37 may be a parallel plate or a lens having power.

The bump 25f is connected to the solid-state image sensor chip 25.
It is provided on two rows of connecting portions 25b formed around the edge of the chip surface with the image area 25a of FIG. A part of a flexible substrate 25g, which is a TAB tape, is connected to the bump 25f by thermocompression bonding.

On the flexible substrate 25g, a wiring pattern 25i made of copper is formed on one surface of a substrate 25h made of polyimide. Flexible board 25
At both ends of g, the wiring pattern 25i is exposed from the substrate 25h to form inner leads 25j and 25k.

At the connecting portion 25b, the inner lead 2
5j and the bump 25f are connected by thermocompression, and input / output signals of the solid-state imaging device 25 are exchanged between the solid-state imaging device chip 25c and the flexible substrate 25g.

The cover glass 25d is formed to be larger than the outer dimensions of the solid-state image sensor chip 25c when viewed from the direction of the objective lens unit described later. The sealing resin 251 is used to seal a part of the flexible substrate 25g from the lower surface of the cover glass 25d.
It is filled around the adhesive 25e applied to the surface of 5a. The application of the adhesive 25e will be described later.

The inner lead 25k is connected to another substrate 2
5m is electrically connected. An electronic component 26 for removing noise of a pulse signal and an IC 27 for amplifying an output signal of the solid-state imaging device 25 are mounted on the substrate 25m. A lead pin 25n for connecting the cable 28 is provided on the side (base end side) of the substrate 25m opposite to the surface on which the electronic components 26 and the IC 27 are mounted.

A coaxial signal line 29, a simple line 30, and a coaxial shield line 31 constituting the cable 28 are connected to the lead pins 25n by soldering. The coaxial signal line 29, the simple line 30, and the coaxial shield line 31 of the cable 28
In connection with the lead pin 25n, the outer diameter of the CCD unit 23 on the proximal end side is set as shown by an arrow 33 by assembling each wire so as to fit inside the outer diameter 32 of the cable 28. The thickness of the imaging device 22 can be reduced since the substrate 25 can be thinner than the 25 substrates 25m.

In the cable 28, a plurality of coaxial signal lines 2
9 and a plurality of simple lines 30 are provided. A drive control signal to the solid-state imaging device 25 is transmitted via the coaxial signal line 29 under the processing of a control device such as a processor (not shown). The output signal of the solid-state imaging device 25 amplified by the IC 27 is transmitted to the processor via the coaxial signal line 29. The driving power supply of the solid-state imaging device 25 is a simple line 3
0 is supplied from the processor (not shown).

The coaxial shield line 31 is connected to a GND (ground or ground) line of the solid-state imaging device 25. The cable of the simple line 30 has a range (characteristic impedance of 30 Ω or more and 60 Ω or less; conductor resistance of 40 Ω) which is considered necessary for actually driving the solid-state imaging device 25.
00Ω / km or more and 12000Ω / km or less. The capacitance is 100 pF / m or more and 140 pF / m or less. ). By defining such a range, the variation in the electrical characteristics of the cable 28 is suppressed within a range that does not affect the image, so that the drive signal and the output signal of the solid-state imaging device 25 can be reliably transmitted. .

The outer periphery of the solid-state imaging device 25 and the cable 28 are filled with, for example, an epoxy adhesive 34 to fix the solid-state imaging device 25, the cable 28, and other members. Further, a reinforcing frame 35 is provided on the outer periphery, and an adhesive 36 is filled in the reinforcing frame 35. When manufacturing the imaging device 22, the reinforcing frame 35 is passed through the cable 28 in advance.

The reinforcing frame 35 is provided with the loosened portion 3 of the cable 28.
The cable 28 is caulked at a caulking portion 40 of the reinforcing frame. The reinforcing frame 35 and the cable 2
Since the fixing with 8 is performed by caulking the reinforcing frame 35 in a state where the adhesive 36 is filled in the reinforcing frame 35, the flow of the adhesive 36 can be controlled, and the workability is also improved. Further, since the reinforcing frame 35 and the cable 28 are integrated and the fixing strength is increased, the bending resistance is also improved.

The image pickup device 22 includes an objective optical system unit 24 as a second optical system unit. The objective optical system unit 24 includes a lens frame 24a, a first objective optical system component group 24b, a second objective optical system component group 24c, and a spacer 24d.

The first objective optical system component group 24b, the second objective optical system component group 24c, and the spacer 24d are fitted and fixed inside the lens frame 24a.

The outer peripheral surface of the objective optical system component 37 fixed to the front surface of the solid-state imaging device 25 and the inner peripheral surface of the lens frame 24a constituting the objective lens unit 24 are fitted in the CCD unit 23 and the objective lens unit 24. Are combined. In the fitted state, focusing is performed by moving the objective optical system unit, which is the second optical system unit, back and forth. CCD unit 23 and objective lens unit 24
Means that the focus is set in the state where the positioning in the optical axis direction is performed, and is fixed with the adhesive 46 in the focused state. Therefore, it is possible to improve the assemblability of the solid-state imaging device and reduce the size of the device.

At this time, there is a displacement 4 between the optical axis 41 of the solid-state imaging device 25 and the optical axis 42 of the objective lens unit 24.
3 or declination may occur. These are variations in the members and assembly of the CCD unit 23,
This is caused by variations in the members and assembly of the objective lens unit 24, and variations in focusing between the CCD unit 23 and the objective lens unit 24. Therefore,
A circuit (not shown) for correcting the declination is provided in the scope connector section 10 of FIG. 1, and when the declination occurs, the image processing is performed electrically to adjust the declination. Thereby, the deviation angle can be adjusted without improving the processing accuracy of the members and the assembly accuracy of each unit, and the positioning accuracy of the optical axis 41 of the CCD unit 23 and the optical axis 42 of the objective lens unit 24. This can be performed by electrical image processing, and the declination adjustment can be easily performed.

Next, the solid-state imaging device will be described more specifically with reference to FIG.

FIG. 3A is a side sectional view of the solid-state imaging device 25. FIG. 3B is a front view schematically illustrating a part of the solid-state imaging device 25 as viewed from the direction A in FIG. FIG.
FIG. 3C shows the solid-state imaging device 2 viewed from the direction B in FIG.
FIG. 5 is a side view in which part of FIG. 5 is omitted.

An image area 25a and a connecting portion 25b are formed on the surface of the solid-state image sensor chip 25c. A plurality of bumps 25f are provided in two rows around the surface edge of the solid-state imaging device chip 25c across the image area 25a. A part of the flexible substrate 25g is connected to the bump 25f. Solid-state image sensor chip 25
The side surface and the back surface other than the image area 25a of c are coated with a semiconductor grade insulating coating agent 50. The thickness of the coating is, for example, 0.1 mm or less. In recent years, CC mounted bare chip for miniaturization
D is used, but in the assembling process, endoscope sterilization process, etc., there is a possibility that metal ions may enter the CCD, image noise due to the bare chip touching other conductors,
There was a risk of abnormal images and destruction due to static electricity.
The insulating coating agent 50 blocks metal ions that may enter the solid-state imaging device chip 25c during the assembling and sterilizing steps, and also prevents other conductors from directly touching the solid-state imaging device chip 25a.

As a result, the above-described image noise and image abnormality can be prevented, and the solid-state imaging device 25c can be prevented from being damaged by static electricity.

A cover glass 25d is fixed to the front surface of the solid-state image sensor chip 25c.

FIG. 3B shows an image area 2 of the solid-state image sensor chip 25c through a transparent cover glass 51.
It is the front view seen from 5a side. Dotted line is cover glass 2
5d is shown. As shown in FIG. 3B, the solid-state imaging device chip 2 of the solid-state imaging device 25 excluding the image area 25a
An adhesive 25e is applied on 5c, and the solid-state image sensor chip 25c and the cover glass 25d are fixed. Adhesive 2
5e is applied so that the air path portion 53 is provided in a part. By providing the air path section 53, the space 52 (shown by oblique lines) near the image area 25a between the solid-state image sensor chip 25c and the cover glass 25d is not sealed. Thereby, when performing high-pressure steam sterilization of an autoclave or the like, stress caused by a pressure change in the sealed space can be reduced, and failure such as poor connection of the bump connection portion can be reduced.

In some cases, the characteristics of the solid-state imaging device chip 25c are inspected in a wafer state.
In this case, the solid-state imaging device chip 25c is provided with an inspection terminal, and the inspection is performed using the inspection terminal. This inspection terminal is eventually unnecessary. Leaving this inspection terminal so-called open requires EMC
(Electromagnetic Compatible
It is not preferable from the viewpoints such as i. Therefore, this problem is solved by integrating the common terminal and the inspection terminal. As shown in FIG. 3 (c), a plurality of input / output terminals of the solid-state imaging device chip 25c are connected to inner leads 25j of a flexible substrate 25g, and on a substrate 25h made of polyimide, on the way of the inner leads. It is integrated at the position indicated by the lead arrow 53 and is connected to the wiring pattern 25i. If there are a plurality of inspection terminals, they may be similarly integrated. The finally unnecessary inspection terminals are integrated as one wiring pattern 25i, and the wiring pattern 25i in an open state on the circuit wiring is integrated.
, It is difficult to pick up high frequency noise and the like.

As described above, according to the above-described configuration, the focus of the CCD unit 23 and the objective lens unit 24 is adjusted by the objective optics bonded to the tip end surface of the cover glass 25d fixed to the solid-state image sensor chip 25c. Since the outer peripheral surface of the system component 37 and the inner peripheral surface of the lens frame 24a constituting the objective lens unit 24 are fitted to each other, the outer diameter of the fitting portion between the CCD unit 23 and the objective lens unit 24 becomes small, and the imaging device The outer diameter of 22 can also be reduced. Further, since the number of fittings between the lens frame and the lens is reduced, the assemblability is improved, and the deflection angle is reduced. Therefore, it is possible to provide a downsized imaging device 22. It should be noted that the configuration described above is characterized by the configuration shown in the following appendix.

[Supplementary Notes] (1) A first optical system unit in which an optical member is directly fixed to a solid-state image pickup device, and a second optical unit formed by arranging an optical member on a frame member.
An imaging apparatus having an optical system unit,
An image pickup apparatus, wherein a side peripheral surface of an optical member constituting the optical system unit and a frame member constituting the second optical system unit are fitted and focused.

(2) The imaging device according to (1), wherein an air path is provided between the solid-state imaging device chip and a cover glass bonded to a front surface of the solid-state imaging device chip.

(3) In the solid-state imaging device, the side surface and the back surface other than the image area of the solid-state imaging device are covered with a semiconductor-grade insulating coating agent.

(4) In the solid-state imaging device, at least one of a plurality of input / output terminals on the solid-state imaging element chip is integrated on a circuit board.
An imaging device according to claim 1.

(5) The imaging device according to (1), wherein the optical member constituting the first optical system unit has a blackened peripheral surface.

(6) A solid-state imaging device, a circuit board connected to a connection terminal of the solid-state imaging device, a cable connected to a lead pin connected to the circuit board, and a reinforcing frame arranged to cover the solid-state imaging device. In the imaging device, the installation position of the lead pin on the circuit board is set to be inside the bundle outer diameter of the cable.

(7) In the cable, the characteristic impedance of the coaxial signal line of the cable is 30Ω or more and 60Ω or less, and the conductor resistance value of the inner conductor of the coaxial signal line is 4000Ω /
The imaging device according to (6), wherein the distance is from km to 12000 Ω / km and the capacitance of the coaxial signal line is from 100 pF / m to 140 pF7 m.

(8) In the above-mentioned reinforcing frame, at least a part of the reinforcing frame extends to the unraveling portion of the cable,
The imaging device according to (6), wherein the cable is fixed by caulking.

(9) In an endoscope apparatus having a solid-state imaging device and a scope connector for transmitting an output signal from the solid-state imaging device to a processor, a circuit for adjusting a deflection angle of an objective optical system is provided in the scope connector. An endoscope apparatus, wherein the endoscope apparatus is provided.

[0057]

As described above, according to the present invention,
With the configuration described in the claims, a miniaturized imaging device can be provided.

[Brief description of the drawings]

FIG. 1 shows an overall schematic diagram of an endoscope system.

FIG. 2 is a longitudinal sectional view showing a configuration of a main part of the imaging apparatus.

FIG. 3A is a side sectional view of the solid-state imaging device 25; FIG. 3B is a front view schematically illustrating a part of the solid-state imaging device 25 as viewed from the direction A in FIG. FIG. 3 (c)
FIG. 4 is a side view in which a part of the solid-state imaging device 25 is omitted from the direction B in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Endoscope system 2 ... Electronic endoscope 3 ... Light source device 4 ... Scope cable 5 ... Video processor 6 ... Color monitor device 7 ... Insertion part 8 .... -Operation unit 22 ... imaging device 23 ... solid-state imaging device unit (CCD unit) 24 ... objective lens unit 25 ... solid-state imaging device 25 b ... connection unit 25 c ... solid-state imaging device chip 25 d ... Cover glass 25e ... Adhesive 25f ... Bump 25g ... Flexible substrate 25h ... Substrate 25i ... Wiring pattern 25j, 25k ... Inner lead 26 ... Electronic component for noise removal 27 ... Amplification IC

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Noriyuki Fujimori 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Hiroshi Ishii 2-43-2 Hatagaya, Shibuya-ku, Tokyo Within Olympus Optical Co., Ltd. (72) Koichi Yoshimitsu, inventor 2-43-2 Hatagaya, Shibuya-ku, Tokyo Within Olympus Optical Co., Ltd. (72) Jun Hiroya 2-43-2, Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Shigeru Nakajima 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industries Co., Ltd. (72) Inventor Hisao Yabe 2-43-2, Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. F term (reference) 2H040 GA03 4C061 AA00 BB00 CC06 DD00 JJ06 LL01 NN01 PP06 PP11 4M118 AA08 A A10 AB01 BA10 FA06 HA02 HA20 HA24 HA27 HA31 5C022 AA09 AC42 AC51 AC78 CA00

Claims (2)

[Claims] A first solid-state imaging device having an optical member fixed thereto;
An optical system unit, and a second optical system unit in which an optical member is disposed in a frame member, wherein: a side peripheral surface of an optical member of the first optical system unit; An imaging apparatus, wherein the frame member of the second optical system unit is fitted. 2. The solid-state imaging device according to claim 1, comprising a bare-chip solid-state imaging device and a cover glass fixed on the solid-state imaging device, and the optical member of the first optical system unit fixed to the cover glass. The imaging device according to claim 1, wherein: