JP2001250899A - Surface-mount single inline semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mount single inline semiconductor device wherein an SIP-type semiconductor device where a plurality of leads are arrayed in a line is surface mounted, being soldered to a mounting board with no tilting. SOLUTION: An element comprising at least such optical element as light emitting element 3 or light receiving element 4 is mounted on one end of a plurality of leads 1 formed as a frame and arrayed on a line, whose periphery is coated with a resin package 6. The other end 2a of a lead 2 is so formed as to form a solder filet 7 for surface mounting while so formed as to form the solder filet 7 at a root 2b of the lead 2 exposed from the resin package 6. As a result, the solder filet 7 is formed at least in two rows (B row and C row) on a soldering surface A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of encapsulating an element including an optical element such as a light-emitting element and a light-receiving element such as an infrared data communication module used for a personal computer and a mobile phone in a resin package and external leads. And a single in-line (SIP) type semiconductor device derived so as to be arranged in a line. For more information,
The present invention relates to a surface-mount type SIP semiconductor device having a structure in which a tilt or the like does not occur while the surface mount type is a SIP type.

[0002]

2. Description of the Related Art A conventional infrared data communication module, for example, has a structure as shown in FIG. That is, in FIG. 5, the light emitting element chip 3, the light receiving element chip 4, and the IC chip 5 are die-bonded and wire-bonded to some of the tips (die pad portions) of the plurality of leads 2 formed of a lead frame, thereby emitting light. The package 6 is formed by sealing with a translucent resin such as an epoxy resin containing a visible light ray cutting agent so that a dome shape is formed in front of the element chip 3 and the light receiving element chip 4. . For ease of mounting, as shown in FIG. 5, the tip of each lead is placed on a printed circuit board or the like by applying a solder paste and placing it on a surface that can be soldered only by increasing the temperature. Formed into mounting type. (B) is an explanatory plan view of the inside of the resin package.

[0003]

SUMMARY OF THE INVENTION As described above,
In the case where the semiconductor device is irradiated with light in a direction perpendicular to the surface of a printed circuit board or the like to be soldered, FIG.
As shown in the figure, the lead for supporting the die pad portion is derived and formed in addition to the lead required for signal input and the like, so that the soldering portion becomes two-dimensional and can be surface-mounted in a stable state. . However, depending on the application, irradiate light in the direction parallel to the mounting board such as a printed board,
In addition, a structure capable of surface mounting is required.

In order to irradiate such light in the lateral direction and make it a surface mount type, for example, as shown in FIG. It is conceivable to form a bent portion 2c and place it horizontally on a printed circuit board 8 or the like and solder it by solder reflow or the like so that it can be bent vertically and a solder fillet can be formed at the end of each lead. Can be Note that 9
Is a solder paste, and 6c is a leg of the package 6 mounted on the printed circuit board 8. However, with this structure,
As shown in FIG. 4B, the formation portions of the solder fillets 7 are arranged in a line in the respective leads 2 (in the direction perpendicular to the plane of the drawing) and shrink when the solder of the solder fillets 7 is hardened. The device rotates and cures. If the semiconductor device has only a circuit function like a normal IC, it may be slightly tilted.However, in a semiconductor device having an optical element and in which a light irradiation direction and a light receiving direction are determined, even a slight tilt may be used. This inclination is fatal because its performance changes significantly.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an SI in which a plurality of leads are arranged in a line is provided.
It is an object of the present invention to provide a surface-mounted single in-line semiconductor device having a structure in which a P-type semiconductor device can be surface-mounted, and which can be soldered to a mounting substrate without causing tilt.

[0006]

SUMMARY OF THE INVENTION A surface-mounted single in-line semiconductor device according to the present invention comprises a plurality of leads formed in a frame and aligned in a row, and an optical element bonded on one end of the leads. An element including at least, and a resin package covering the periphery of the element, the other end of the lead can be surface-mounted, and the solder fillet by soldering,
Formed so as to form at least two rows on the soldering surface.

Here, the optical element means an element such as a light emitting element or a light receiving element which converts an electric signal into an optical signal or converts an optical signal into an electric signal.

[0008] With this structure, even if the solder shrinks at the solder fillet portion when it is hardened, the portion is not formed in a straight line and is formed in at least two rows. As described above, it does not occur that the semiconductor device rotates and cures with the straight line as the center of rotation. As a result, even if a semiconductor device having an optical element mounted thereon and having an optical element whose inclination is extremely problematic is single-in-line and surface-mounted, no problem occurs, and the semiconductor device is mounted horizontally on the mounting substrate. can do.

The structure in which the at least two rows of solder fillets are formed may be, for example, one of the plurality of leads.
At least two bent portions are formed at the two other end portions, respectively, and the two bent portions are formed so as to form solder fillets, respectively, or the other ends of the plurality of leads are formed. This is realized by forming the solder fillet forming portion on the side at a different length from the resin package.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface-mounted single-in-line semiconductor device according to the present invention will be described below with reference to the drawings. A surface-mounted single in-line semiconductor device according to the present invention is formed in a frame shape as shown in FIG.
At least one optical element such as a light emitting element 3 and a light receiving element 4 and at least an element such as an IC 5 are mounted on one end of the plurality of leads 1 arranged in a line, and wire bonding (not shown) is performed. , Elements 2-5
Is covered with a resin package 6.

The other end 2a of the lead 2 is formed so that a solder fillet 7 can be formed and surface-mounted, and in the example shown in FIG. The height h from the soldering surface A is 0.5 so that the solder fillet 7 can be formed also on the root portion 2b of the lead 2 exposed from the package 6 made of solder.
Forming is performed so that the exposed portion 2b is formed to about 1 mm. That is, unlike the conventional structure, the leg portion is not formed in the resin package 6, the root portion of the lead is exposed, and the exposed portion 2b is formed so as to at least secure a length capable of forming a solder fillet. ing. As a result, the solder fillets 7 are formed in at least two rows (rows B and C in FIG. 1C) on the soldering surface A. FIG. 1C is an explanatory side view of the semiconductor device viewed from the mounting substrate 8 side.

In the example shown in FIG. 1, the semiconductor device is an example of an infrared data communication module used for a personal computer, a mobile phone, or the like, and includes an infrared light emitting element 3 and a light receiving element 4 such as a photodiode. An IC 5 incorporating an amplifier, a drive circuit, and the like is die-bonded and wire-bonded to one end of a lead 2 formed of a lead frame. The resin package 6 is formed by molding the periphery thereof with an epoxy resin mixed with a dye that cuts visible light. In this case, dome-shaped lens portions 6a and 6b are formed on the front surfaces of the light emitting element 3 and the light receiving element 4 so as to easily collect light. After the resin package 6 is formed, the connecting portion of each lead 2 of the lead frame is cut, and the lead 2 is formed by forming.

As described above, when light is emitted or received in a direction parallel to a board 8 (a mounting board such as a printed board, hereinafter referred to as a mounting board) on which a semiconductor device is mounted, the lead frame surface is connected to the mounting board 8. It is necessary to form the leads 2 so as to be vertical, and to further mount the leads 2 on the mounting substrate 8, as shown in FIG.
Further, by bending the tip portion and directly soldering the bent portion to the mounting board, the bent portion of the lead is minimized, and the lead can be soldered in a stable direction.

However, as shown in FIG.
In addition, if the legs of the package 6 are present in the vicinity, no solder fillet is formed on the lead portion exposed from the package 6, and the solder fillet is formed only on the tip 2c of the lead 2 (see FIG. 4). The solder fillet portion of each lead is in a straight line (perpendicular to the plane of FIG. 4) because the lead is SIP, and when the solder hardens, the solder rotates around the straight line and hardens by tilting. There is. In the present invention, in order to prevent such inclination, the leads 2 are formed so that at least two rows of solder fillets are formed.

That is, in the example shown in FIG. 1, the legs of the package 6 are not formed so that the solder fillets 7 can be formed also on the exposed portions 2b of the leads exposed from the resin package 6, so that the exposed portions 2b are not formed. Is formed so that the length is secured to a certain value h or more.
It is bent so that a solder fillet 7 is formed. As a result, as shown in FIG. 1C, a row B of the solder fillet 7 formed at the tip 2a of the lead 2 is formed.
The solder fillet 7 is formed in two rows of the row C of the solder fillet 7 formed at the root 2b of the lead 2. The length D of the lead 2 placed on the mounting board 8 is, for example, about 1.5 to 2 mm.
In the conventional structure, even if the solder paste is applied to this portion, the portion is rotated and fixed without being soldered as described above, but the solder fillets 7 are formed on both sides of the mounting portion as described above. As a result, this portion is also soldered, so that it is more securely soldered.

The lead 2 exposed from the resin package 6
The bending direction is not limited to the example shown in FIG. 1. For example, as shown in FIG. 2, the solder fillets 7 are arranged in at least two rows even in a structure that is bent in the opposite direction.
The leads need only be formed. In FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

The structure in which the solder fillets 7 are formed in two or more rows is shown in FIG. 3 even if the bent portions are not formed in two places of one lead 2 as described above. As described above, the solder fillet 7 may be formed in two or more rows by a plurality of leads 2. That is, in FIG. 3, each lead 2 is formed so that the solder fillet 7 is formed only on the tip 2a side, but the length from the resin package 6 is, for example, L = 2 mm and M = By forming the solder fillet 7 at different lengths so as to be 1 mm, as shown in FIG. 3B, a plurality of leads 2 form two rows of solder fillets 7 of B and C as shown in FIG. Are formed.

In the example shown in FIG. 3, each of the leads 2 exposed from the resin package 6 is bent obliquely so that it can be soldered only at its tip and provided on the resin package 6. With this configuration, the legs 6c can be mounted on the mounting board. However, as shown in FIG. 1 or FIG.
Even in a structure that can be bent in a perpendicular direction, it is possible to form two or more rows of solder fillets by adjusting the soldering position of the tip end in the same manner. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

According to the present invention, when a semiconductor device having an optical element is mounted so that its light emitting surface or light receiving surface is perpendicular to the surface of a mounting substrate, each lead is of a surface mounting type with a SIP structure, Since each lead is formed so that at least two rows of solder fillets are formed on the soldering surface, there are at least two rows of soldering parts, and contraction force acts when the solder hardens. However, the rotational force based on the soldered portion does not work.
As a result, it is possible to mount the semiconductor device having the optical element and having the SIP structure, which greatly affects the performance even with a slight inclination, without mounting the semiconductor device very easily.

In each of the examples described above, the rows of the solder fillets are all two rows. However, the number of rows is not limited to two and may be larger or may be randomly formed. The point is that the soldering portion may be formed at a place other than the straight line so that no rotational force acts on the semiconductor device.

[0021]

As described above, according to the present invention, a surface-mount type SIP structure semiconductor device can be surface-mounted without inclination and mounting on a mounting board becomes very easy.
The number of mounting steps can be reduced, and the mounting can be performed with high reliability. As a result, a personal computer, a mobile phone, or the like can be made inexpensive and have high performance.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of one embodiment of a surface-mount type SIP semiconductor device according to the present invention.

FIG. 2 is an explanatory diagram showing a modification of FIG. 1;

FIG. 3 is an explanatory view showing another embodiment of the surface-mount type SIP semiconductor device according to the present invention.

FIG. 4 is a diagram illustrating a problem when a semiconductor device having a SIP structure is a surface mount type.

FIG. 5 is an explanatory diagram of a conventional infrared data module.

[Explanation of symbols]

 2 lead 3 light emitting element 4 light receiving element 5 IC 6 resin package

Claims (3)

[Claims] 1. A plurality of leads formed in a frame shape and arranged in a line, an element including at least an optical element bonded on one end of the lead, and a resin package covering the periphery of the element. And the other end side of the lead can be surface-mounted, and the solder fillet formed by soldering is formed so as to be formed in at least two rows on the soldering surface. . 2. A method according to claim 1, wherein at least two of said plurality of leads are provided.
At least two bent portions are formed at the other end of the book, and the at least two rows of the solder fillets are formed by forming such that the solder fillets are formed at the two bent portions, respectively. Claim 1 which is formed
13. The semiconductor device according to claim 1. 3. The at least two solder fillet forming portions on the other end side of the plurality of leads are formed at positions different in length from the resin package.
2. The semiconductor device according to claim 1, wherein a row of solder fillets is formed.